Datasheet TEA1504 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TEA1504

GreenChip; SMPS control IC

Preliminary specification
File under Integrated Circuits, IC11

1998 Mar 17

Philips Semiconductors Preliminary specification

GreenChip; SMPS control IC TEA1504

PRODUCT HIGHLIGHTS
Distinctive features

• High level of integration leads to 20 to 50 fewer
components compared to power supply with discrete
components

• On-chip efficient startup current source giving fast
startup

• ON/OFF function replaces expensive mains switch with
functional switch

• Direct off-line operation (90 to 276 Vac)

• On-chip 5% accurate oscillator.

Green features

• Low power consumption in off-mode (<100 mW)

• Burst mode stand-by (<2 W) for overall improved

system efficiency

• Low power operation mode with lower frequency to
reduce switching losses.

Protection features

• Demagnetization protection

• Cycle by cycle current limitation with programmable

current trip level

• Accurate over voltage protection which tracks the output
voltage

• Over temperature protection

• Safe-restart mode with reduced power for system fault

conditions.

Highly versatile

• Usable in Buck and Flyback topology

• Interfaces both primary and secondary side feedback.

Output

OOB

14

Dem

13

12

NC

11

Gnd

NC

10

Vctrl

9

Iref

8

Vin

NC

NC

Driver

Isense

Vaux

1

2

3

4

5

6

7

DS

Fig.1 Typical Flyback Application.

GENERAL DESCRIPTION

The GreenChip, intended for off-line 90 to 276 Vac
power supply applications, is a monolithic high voltage
family of ICs that combines analog and digital circuits to
implement all necessary control functions for a switched
mode power supply. The functions include integrated high
voltage startup current source, voltage mode PWM
control, 5% accurate trimmed oscillator, bandgap derived
reference voltages, comprehensive fault protection, and
leading edge blanking. High level of integration leads to
cost effective power supplies that are compact, weigh less,
and at the same time give higher efficiency, are more
reliable and simple to design. Efficient green features lead
to very low power operation modes and a novel ON/OFF
function helps replace the expensive mains switch with a
low cost functional switch.

ORDERING INFORMATION

PACKAGE

TYPE NUMBER

NAME DESCRIPTION VERSION

TEA1504 DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1

1998 Mar 17 2

Philips Semiconductors Preliminary specification

GreenChip; SMPS control IC TEA1504

FUNCTIONAL BLOCK DIAGRAM

OOB

14

5.5V

Vctrl

9

Dem

13

On/Off

Iref

-

+

Burst mode
stand-by

Sample &
Hold 1

Demag
Mgmnt

Vaux

8

Vaux management

+

-

Over temp
protection

Sample &
Hold 2

6

Error
Amp.

Oscillator

PWM
Comp.

+

-

Vin

Startup current
source

1

R

S

* Over current
protection
* Leading Edge
blanking

Frequency control

TEA1504

Q

DS

7

Driver

4

Isense

5

Negative
Clamp

Gnd

Fig.2 Functional Block Diagram.

1998 Mar 17 3

11

NC pins: 2, 3, 10 & 12

Philips Semiconductors Preliminary specification

GreenChip; SMPS control IC TEA1504

PINNING

SYMBOL PIN DESCRIPTION

Vin 1 MOSFET Drain connection
HVS 2 High voltage safety spacer
NC 3 Not connected
Driver 4 MOSFET gate driver output
Isense 5 Programmable current

sense resistor
Vaux 6 IC supply capacitor
DS 7 Supply for driver circuit
Iref 8 Reference resistor for

setting internal reference

currents
Vctrl 9 Feedback voltage for duty

cycle control
NC 10 Not connected
Gnd 11 Ground
NC 12 Not connected
Dem 13 Demagnetization input

signal from primary side

auxiliary winding
OOB 14 On/Off/Burst Mode input

signal

Vin

HVS

NC

Driver

Isense

Vaux

DS

1

2

3

TEA1504

4

5

6

7

Fig.3 Pin assignment.

14

13

12

11

10

OOB

Dem

NC

Gnd

NC

Vctrl

9

Iref

8

FUNCTIONAL DESCRIPTION

The GreenChip family of ICs are highly integrated, with
most common PWM functions like error amplifier,
oscillator, bias current generator, and band gap based
reference voltage circuits fully integrated in the ICs.
High level of integration leads to easy and cost effective
design of power supplies. The ICs have been fabricated in
a Philips proprietary high voltage BCDMOS process that
enables devices of up to 650 V to be fabricated on the
same chip with low voltage circuitry.

An efficient on-chip startup circuit enables fast startup and
dissipates negligible power after start up. On-chip
accurate oscillator generates a saw tooth waveform which
is used by the voltage mode feedback control circuitry to
generate a pulse width modulated signal for driving the
gate of the power MOSFET. A novel regulation scheme is
used to implement both primary and secondary side
regulation to minimize external component count.
Protection features like over voltage, over current, over
temperature, and demagnetization protection, give
comprehensive safety against system fault conditions.
The GreenChip offers some advanced features that
greatly enhance the efficiency of the overall system.

Off-mode reduces the power consumption of the IC below
100 mW. Burst mode stand-by reduces the power
consumption of the system to below 2 W. Low power
operation mode reduces the operating frequency of the
system, when the system is working under low load
conditions, to reduce the switching losses.

Startup current source and vaux management

A versatile on-chip startup current source makes an
external, highly dissipative, trickle-charge circuit
unnecessary. Refer to Fig.2 for a block diagram of the IC.
The startup current source derives power from the mains
via the Vin (drain) pin. It supplies current (see Istart-low
and Istart-high in Chapter “Characteristics”) to charge the
Vaux (IC supply) capacitor and at the same time provides
current to the control circuitry of the IC. Once the Vaux
capacitor is charged to its startup voltage level (11 V), the
on chip oscillator starts oscillating and the IC starts
switching the power MOSFET. Power is then supplied to
the load via the secondary winding. Figure 1 shows a
typical flyback application diagram. The Vaux capacitor is
also supplied by an auxiliary winding on the primary side.
This winding is coupled to the secondary side winding

1998 Mar 17 4

Philips Semiconductors Preliminary specification

GreenChip; SMPS control IC TEA1504

supplying the output capacitor. As the output capacitor
voltage increases and approaches its nominal value, the
re-supply of the Vaux capacitor is done by the auxiliary
winding. Figure 4 shows relevant waveforms at startup.
For successful take over of supply of Vaux capacitor by the
auxiliary winding, it is important that the re-supply of Vaux
capacitor starts before its voltage drops to its Under
Voltage Lockout (UVLO) level of 8.15 V.

Vaux

11V

8.15V

Istartup charging
Vaux cap

charging of Vaux cap
taken over by Auxiliary
Winding

circuit, the output voltage will rise till it reaches the OVP
level. The IC will detect this state and stop switching.
In absence of switching of the power device, the Vaux
capacitor will not be re-supplied and its voltage will drop till
it reaches UVLO level. Once the Vaux voltage drops to
UVLO level, the startup current source is re-activated and
it charges the Vaux capacitor to its start level and the
system goes through a cycle similar to the startup cycle.
Figure 5 shows the relevant waveforms during safe-restart
mode. The charging current (see Irestart-prot in
Chapter “Characteristics”) from the startup circuit during
the safe-restart mode is lower than the normal startup
current (see Istart-high in Chapter “Characteristics”) in
order to implement a low “hiccup” duty cycle. This helps
insure devices on the output secondary winding do not get
destroyed during output short circuit, violating safety
conditions.

Vaux

Normal operation

Fault condition

Vout

Vgate

Off

Fig.4 Normal startup waveforms.

The startup current source also helps implement the
safe-restart or “hiccup” mode during system fault
conditions like output short circuit, output open circuit, and
Over Voltage Protection (OVP). In all the above fault
situations, the IC reacts by inhibiting the normal operation
of the system and stops delivering power to the output.
In case of output short circuit, the Vaux capacitor is no
longer supplied by the auxiliary winding and its voltage
drops till it reaches the UVLO level. If the output is an open

Switching

Startup current source
charging Vaux capacitor

Vgate

Switching

Off

Fig.5 Safe-restart mode waveforms.

The startup current source also plays a key role in
implementation of burst mode stand-by (see Irestart-stdby
in Chapter “Characteristics”), which will be explained later.

All reference voltages are derived from a temperature
compensated, on-chip, band-gap. The bandgap reference
voltage is also used, together with an external resistor
connected at the Iref pin, to generate accurate,
temperature independent, bias currents in the chip.

1998 Mar 17 5

Philips Semiconductors Preliminary specification

GreenChip; SMPS control IC TEA1504

Sample and Hold

GreenChip ICs employ voltage mode feedback for
regulating the output voltage. In primary feedback mode,
a novel Sample and Hold circuit is used. The Sample and
Hold circuit works by sampling the current into the demag
pin, which is related to the output voltage via Rdem, during
the time that the secondary current is flowing:
V

out=Iref

× R

dem+Vdem+

This sampled current information is stored on the external
capacitor connected to the Vctrl pin. The pulse width
modulator uses this voltage information to set the duty
cycle of operation for the power MOSFET. In secondary
feedback, the feedback voltage is provided by an
opto-coupler.

Pulse Width Modulator

The pulse width modulator, which is made up of an
inverting error amplifier and a comparator (Fig.2), drives
the power MOSFET with a duty cycle which is inversely
proportional to the voltage at the Vctrl pin. In primary
feedback, this is the voltage on the Sample and Hold
capacitor and in secondary feedback, this voltage is
provided by an opto-coupler. A signal from the oscillator
sets a latch that turns on the power MOSFET. The latch is
reset by the signal from the pulse width modulator or by the
duty cycle limiting circuit. The latching PWM mode of
operation prevents multiple switching of the power switch.
The maximum duty cycle is set internally at 80%. Figure 6
shows the normal switching operation of the IC.

Oscillator

The oscillator is used to set the switching duty cycle by
comparing the oscillator ramp to the output of the error
amplifier in the pulse width modulator circuit. The oscillator
is fully integrated and works by charging and discharging
an internal capacitor between two voltage levels to create
a sawtooth waveform with a rising edge which is 80% of
the oscillator cycle. This ratio is used to set a maximum
switching duty cycle of 80% for the IC. The oscillator is
internally trimmed to 5% accuracy. The oscillator
frequency can be adjusted between 49 to 91 kHz
(see f

osc-h-range

in Chapter “Characteristics”) by changing
the external reference resistor (see Rref in
Chapter “Characteristics”) that sets the chip bias currents.
This gives additional flexibility to the power supply
designer in the choice of his system components.
The frequency is correlated with the value of the Rref

resistor:

f

oscfosc typical–

f

osc-typical

and f

osc-h

is specified in Chapter “Characteristics”, f

. The operating Rref resistor range is specified in

24.900

× Hz[]=

-----------------­Rref

osc-l

Chapter “Characteristics”, Rref.

Multi Frequency Control

The oscillator is also capable of working at a lower
frequency (see f

in Chapter “Characteristics”). A ratio

osc-l

of 1 : 2.5 is maintained between high and low frequency of
the oscillator. Low frequency operation is invoked if the
power supply is working at or below one ninth of its peak
power. By working at a lower frequency, the switching
losses in the power supply are reduced. A novel scheme
is used to ensure that the transfer of high to low frequency
and vice versa has no effect on the regulation of the output
voltage.

Gate Driver

The gate driver has a totem-pole output stage that has
current sourcing capability of 120 mA and a current sink
capability of 500 mA. This is to enable fast turn on and turn
off of the power device for efficient operation. In the DIL14
controller version, the driver supply and driver output pins
are available separately to the power supply designer.
In this way the power supply designer can control the
source and sink currents of the gate driver circuit with a
minimum of external components.

Demagnetization Protection

This feature guarantees discontinuous conduction mode
operation for the power supply which simplifies the design
of feedback control and gives faster transient response.

Demagnetization protection is an additional protection
feature that protects against saturation of the
transformer/inductor. Demagnetization protection also
protects the power supply components against excessive
stresses at startup, when all energy storage components
are completely discharged, and during shorted output
system fault condition.

Negative Clamp

The negative clamp circuit does not let the voltage at the
demag pin go below −0.4 V, when the auxiliary winding
voltage goes negative during the time that the power
device is turned on, to ensure correct operation of the IC.

1998 Mar 17 6

Philips Semiconductors Preliminary specification

GreenChip; SMPS control IC TEA1504

Over Voltage Protection

An OVP mode has been implemented in the GreenChip
series. This circuit works by sensing the Vaux voltage.

If the output voltage exceeds the preset voltage limit, the
OVP circuit turns off the power MOSFET. With no
switching of the power device, the Vaux capacitor is not
re-supplied and discharges to UVLO level and the system
goes into the low dissipation safe-restart mode described
earlier. The system recovers from the safe-restart mode
only if the OVP condition is removed.

Over Current Protection

Cycle by cycle Over Current Protection (OCP) is provided
by sensing the voltage on an external resistor which is
connected to the source of the power MOSFET.
The voltage on the current sense resistor, which reflects
the amplitude of the primary current, is compared
internally with a reference voltage using a high speed
comparator. If the power MOSFET current exceeds the
current limit, the comparator trips and turns off the power
MOSFET. The power MOSFET is typically turned off in
210 nsec (see t

in Chapter “Characteristics”).

D

The availability of the current sense resistor off-chip for
programming the OCP trip level increases design flexibility
for the power supply designer. An off-chip current sense
resistor also reduces the risk of an OCP condition being
sensed incorrectly. At power MOSFET turn-on the dv/dt
limiters capacitance discharge current doesn’t have to flow
through the sense resistor, because this capacitor can be
connected between drain and source of the power
MOSFET directly.

The leading edge blanking (LEB) circuit works together
with the OCP circuit and inhibits the operation of the OCP
comparator for a short duration (see t

LEB

in
Chapter “Characteristics”) when the power device is
turned on. This ensures that the power device is not turned
off prematurely due to false sensing of an OCP condition
because of current spikes caused by discharge of
primary-side snubber and parasitic capacitances.
LEB time is not fixed and it tracks the oscillator frequency.

Over Temperature Protection

Protection against excessive temperature is provided by
an analog temperature sensing circuit that turns off the
power device when the temperature exceeds typically
130 °C.

ON/OFF Mode

The expensive mains switch can be replaced by an
in-expensive functional switch by using the ON/OFF
mode. Figure 7 shows a Flyback converter configured to
use the ON/OFF mode. Depending upon the position of
the switch S1, either voltage close to ground or a voltage
of greater than typical 2.5 V exists at the OOB pin.
The difference between these voltages is detected
internally by the IC. The IC goes into an “off-mode” if the
voltage is low, where it consumes a current of typical
400 µA (see Iin-off in Chapter “Characteristics”). If the
voltage at the OOB is typically 2.5 V (see Von/off in
Chapter “Characteristics”), the IC goes through the startup
sequence and commences normal operation. In Fig.8, a
“Mains Under Voltage Lock Out” (MUVLO) function has
been created using 3 resistors. Assuming that R3 is
choosen very high ohmic, the GreenChip™ starts

operating if:

V

MAINS

R1

------- ­R2

V

OOB

R1 R2»()×≈

In this way it is assured that the power supply only starts
working above a Vmains of e.g. 80 V. The bleeder current
through R1 should be low (e.g. 30 µA at 300 V).

Burst Mode Stand-by

The OOB pin is also used to implement the burst mode
stand-by. In Burst mode stand-by, the power supply goes
into a special low dissipation state where it typically
consumes less than 2 W of power. Figure 8 shows a
Flyback converter using the burst mode stand-by feature.
The system enters burst mode when the microprocessor
(µP) closes switches S2 and S3 on the secondary side.
Switch S2 shorts the output capacitor to the voltage level
of the µP capacitor. The output secondary winding now
supplies the µP capacitor. When the voltage on the µP
capacitor exceeds the zener voltage, Vz, the opto-coupler
is activated which sends a signal to the OOB pin.
In response to this signal, the IC stops switching and goes
into a “hiccup” mode. Figure 6 shows the burst-mode
operation graphically. The hiccup mode during burst mode
operation differs from the hiccup in safe-restart mode
during system fault. For safe restart mode, the power has
to be reduced. For burst mode, sufficient power to supply
the µP has to be delivered. To prevent transformer rattle,
the transformer peak current is reduced by a factor of 3.
Burst mode stand-by operation continues till the µP opens
switches S2 and S3. The system then goes through the
startup sequence and commences normal switching
behaviour.

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Philips Semiconductors Preliminary specification

GreenChip; SMPS control IC TEA1504

Vin

Vin

Drain

Vout

Vaux

Vgate

Iaux

Burst Mode

VµP

all negative currents are currents

out the chip

Startup

sequence

1998 Mar 17 8

Normal
operation

OVP

Fig.6 Typical waveforms.

Output short

circuit

Burst mode stand-by

Philips Semiconductors Preliminary specification

GreenChip; SMPS control IC TEA1504

ABSOLUTE MAXIMUM RATINGS

Unless noted all voltages are referenced to the GND pin.

SYMBOL PARAMETER MIN. MAX. UNIT

(1)

V

in

(2)

V

in, max

V

OOB

I

demag

, V

V

ctrl

lsense

I

ref

V

aux

T

j

T

stg

operating junction temperature −10 +140 °C
storage temperature −40 +150 °C

Notes

1. Repetitive V

voltage.

in

2. Absolute maximum Vin voltage.

− 600 V

− 650 V

−0.3 +14 V

−±1mA

−0.3 +5 V

−−1mA

−0.3 +18 V

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

Rth

j-a

Thermal resistance from junction to ambient 70 °C/W

CHARACTERISTICS

= −10 to +110 °C, Vin= 300 V, I

(T

j

resistor = 24.9 KΩ, 0.1% and Vaux = 8 to 13 V). All currents into the chip are

ref

positive and all currents out of the chip are negative. All voltages are referred to ground.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Startup current source and vaux management (pins 1 and 6)

Vdlow minimum start drain voltage at pin 1 100 −−V
Vstart startup voltage at pin 6 10.4 11 11.6 V
Vuvlo under voltage lockout at pin 6 7.4 8.15 8.6 V
Vaux-hyst. operation voltage hysteresis at pin 6 (Vstart-Vuvlo) 2.60 2.85 3.10 V
Iin Vin current at pin 1 normal operation 20 60 100 µA
Iin-off off mode current at pin 1 V

< 1.95 V 200 400 600 µA

OOB

Istart-low startup current at pin 6 0 V < Vaux < 0.73 V −270 −230 −190 µA
Istart-high startup current at pin 6 0.5V<Vaux<Vstart −5.0 −3.0 −1.0 mA
laux IC operating supply current at pin 6 no load on driver pin 3.5 3.85 4.2 mA
Irestart-prot restart current at pin 6 in protection mode −600 −530 −460 µA
Irestart-stdby restart current at pin 6 in standby mode −2.5 −2.1 −1.7 mA
Vclamp Vaux clamp level at pin 6 laux = 5 mA 14.5 − 18 V

Reference block (pin 8)

Vref reference voltage 2.4 2.5 2.6 V
Rref operating resistor range 16.9 24.9 33.2 kΩ

1998 Mar 17 9

Philips Semiconductors Preliminary specification

GreenChip; SMPS control IC TEA1504

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Oscillator

f

osc-l

f

osc-h

δmax maximum duty cycle f = f
frat ratio f
f

osc-h-rang

Demag (pin 13)

Vdem-th demag comparator threshold Vdemag decreasing 50 65 80 mV
tp-dem-del prop delay to output buffer 200 400 600 ns
Idem input bias current Vdem = 65 mV −0.50
Vcl− negative clamp level Idem=−500µA −0.36 −0.32 0 V
Vdem+ positive clamp level Idem = 100 µA 2.0 2.5 3.2 V

Sample and hold (pin 13)

Idem normal control current lref = 100 µA 90 100 110 µA
sh-th sample current threshold % of Idem 78 83 88 %
tp-shr prop delay current comparator dVdemag/dt positive

tp-shf prop delay current comparator dVdemag/dt negative

low frequency low power mode 27.5 29 30.5 kHz
high frequency normal mode 66 70 74 kHz

78 80 82 %

2.30 2.45 2.60

(1)

−0.10

(1)

µA

osc-h/fosc-l

range of f

osc-h

osc-h

with changing Rref 49 70 91 kHz

170 450 730 ns

(500 V/µsec)

75 90 105 ns

(10 V/µsec)

OVP (pin 6)

Vovp-aux absolute max OVP prot level fixed max level 13.5 14 14.5 V
tovp ovp delay time 150 350 600 ns

Isense and low power (pin 5)

t
t
t

LEB
LEB
LEB

Leading Edge Blanking time Rref = 0.7 × Rref-nom 180 260 340 ns
Leading Edge Blanking time Rref = Rref-nom 240 340 440 ns

Leading Edge Blanking time Rref = 1.3 × Rref-norm 415 470 560 ns
Vth-lmax max current limit 0.46 0.49 0.53 V
t

D

delay to MOSFET off at pins 4 and 5 time to MOSFET off at

150 210 270 ns
dv/dt = 200 mV/µs,
Cgs = 500 pF

V

THLOPOWER

threshold voltage for switch over to

160 170 180 mV

low power

Control (pin 9)

dδ/dV gain f
dδ/dV gain f

osc-h
osc-l

−95 −85 −75 %/V

−60 −50 −40 %/V

Vctrl-min min control voltage 2.00 2.15 2.30 V
Vctrl-max max control voltage 2.90 3.05 3.20 V
Ictrl-leak leakage current in/out of Vctrl pin −1

(1)

− +1 µA

Over temperature protection

Ttrip temperature limit 120 130 140 °C

1998 Mar 17 10

Philips Semiconductors Preliminary specification

GreenChip; SMPS control IC TEA1504

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

ON/OFF/burst mode (pin 4)

Von/off ON/OFF trip level 2.3 2.5 2.8 V
Iburst-active burst mode trip level 0.5 − 1mA
lburst-inactive −−100 µA
I

OOB

Driver

Rdson-h Rdson of transistor when output

Rdson-l Rdson of transistor when output

Isource current capacity of source transistor Vaux = 8.5 V and

Isink current capacity of sink transistor Vaux = 8.5 V and

Isink current capacity of sink transistor Vaux = 8.5 V and

current out of OOB pin −0.1

Vaux = 8.5 V and

going high

going low

Vdriver = 6.5 V
Vaux = 8.5 V and

Vdriver = 2 V

Vdriver = 2 V

Vdriver = 2 V

Vdriver = 8.5 V

(1)

− +2 µA

15 18 45 Ω

3615Ω

−280 −120 −100 mA

200 250 500 mA

400 550 900 mA

Note

1. Guaranteed by design.

GENERAL APPLICATION INFORMATION

A converter using the GreenChip is usually a Flyback or
a Buck converter that is made up of the EMI filter, full
bridge rectifier, filter capacitor, transformer, output
stage(s), and some snubber circuitry. Depending upon
the type of feedback used, either an auxiliary winding
(primary regulation) or an opto-coupler (secondary
regulation) is used. GreenChip, due to its high level of
integration uses very few external components. A sense
resistor converts the primary current into a voltage at the
Isense pin (pin 5). The IC uses this information for setting
the peak current in the converter. A capacitor supplied by
an auxiliary winding buffers the internal supply of the IC
and is connected at the Vaux pin (pin 6). The auxiliary
winding is also used for primary mode output voltage
regulation. A resistor connected at the Iref pin sets the
reference currents in the IC (pin 8). A small capacitor

(0.2 to 2 nF) connected at the Vctrl pin (pin 9) is used by
the internal Sample and Hold circuit for regulation in
primary feedback scheme. The same pin is also used for
secondary sensing and serves as the input for the signal
from the opto-coupler. Pin 11 is the ground connection.
The primary side auxiliary winding is connected via a
resistor to the demag pin (pin 13). Besides being used for
demagnetization protection, demag pin is also used for
primary side regulation. Pin 14 too is a multi use pin and
depending upon connection can be used for
implementation of the ON/OFF/Burst mode functions.
Pin 2 is not connected and serves as a high voltage
spacer pin. Pin 1 is used by the internal startup current
source as a supply for charging up the Vaux capacitor
during startup and safe-restart modes.

For additional information also see:

Note AN98011: 200 W SMPS with TEA1504”

“Application

.

1998 Mar 17 11

Philips Semiconductors Preliminary specification

GreenChip; SMPS control IC TEA1504

Output

S1

Vaux

Vin

NC

NC

DS

1

2

3

4

5

6

7

opto­coupler

OOB

14

Dem

13

NC

12

Gnd

11

NC

10

Vctrl

9

Iref

8

Driver

Isense

Vaux

Fig.7 Typical Flyback configuration with secondary sensing and ON/OFF feature.

1998 Mar 17 12

Philips Semiconductors Preliminary specification

GreenChip; SMPS control IC TEA1504

Output

R1

S2

S1

R2

Vaux

R3

µP supply

OOB

14

Dem

13

12

NC

Vin

NC

NC

1

Optocoupler

2

3

Vz
S3

Driver

Isense

Vaux

DS

4

5

from µP

6

7

11

Gnd

NC

10

Vctrl

9

Iref

8

Fig.8 Flyback configuration using the Burst mode Stand-by and ON/OFF feature.

1998 Mar 17 13

Philips Semiconductors Preliminary specification

GreenChip; SMPS control IC TEA1504

Output

Vin

NC

NC

Driver

Isense

Vaux

1

2

3

4

5

6

7

DS

S1

OOB

14

Dem

13

12

NC

11

Gnd

NC

10

Vctrl

9

Iref

8

Fig.9 Typical Buck configuration with secondary sensing.

Output

Vin

NC

NC

Driver

Isense

Vaux

1

2

3

4

5

6

7

DS

S1

OOB

14

Dem

13

12

NC

11

Gnd

NC

10

Vctrl

9

Iref

8

Fig.10 Typical Buck configuration with primary sensing.

1998 Mar 17 14

Philips Semiconductors Preliminary specification

GreenChip; SMPS control IC TEA1504

PACKAGE OUTLINE

DIP14: plastic dual in-line package; 14 leads (300 mil)

D

seating plane

L

Z

14

pin 1 index

e

b

SOT27-1

M

E

A

2

A

A

1

w M

b

1

8

E

c

(e )

1

M

H

1

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

mm

OUTLINE

VERSION

SOT27-1

1 2

min.

max.

1.73

1.13

0.068

0.044

IEC JEDEC EIAJ

050G04 MO-001AA

b

b

1

0.53

0.38

0.021

0.015

0.36

0.23

0.014

0.009

REFERENCES

cD

(1) (1)

19.50

18.55

0.77

0.73

1998 Mar 17 15

7

L

Ee M

6.48

6.20

0.26

0.24

e

1

3.60

3.05

0.14

0.12

M

E

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

H

10.0

8.3

0.39

0.33

w

max.

0.2542.54 7.62

0.010.10 0.30

0.0870.17 0.020 0.13

ISSUE DATE

92-11-17
95-03-11

(1)

Z

2.24.2 0.51 3.2

Philips Semiconductors Preliminary specification

GreenChip; SMPS control IC TEA1504

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Soldering by dipping or by wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

(order code 9398 652 90011).

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

stg max

). If the

1998 Mar 17 16

Philips Semiconductors Preliminary specification

GreenChip; SMPS control IC TEA1504

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1998 Mar 17 17

Philips Semiconductors Preliminary specification

GreenChip; SMPS control IC TEA1504

NOTES

1998 Mar 17 18

Philips Semiconductors Preliminary specification

GreenChip; SMPS control IC TEA1504

NOTES

1998 Mar 17 19

Philips Semiconductors – a worldwide company

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Middle East: see Italy

Netherlands: Postbus 90050, 5600PB EINDHOVEN, Bldg. VB,

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Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
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Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
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United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax.[phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1998 SCA57
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 295102/1200/01/pp20 Date of release: 1998 Mar 17 Document order number: 9397 750 03311