Datasheet TEA1532 Datasheet (Philips)

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TEA1532

GreenChipII SMPS control IC

Rev. 01 — 28 May 2004 Preliminary data sheet

1. General description

The GreenChip™II is the second generation of green Switched Mode Power Supply (SMPS) controller ICs. Its high level of integration allows the design of a cost effective power supply with a very low number of external components.

The TEA1532 can also be used in ﬁxed frequency, Continuous Conduction Mode (CCM) converter designs for low voltage, high current applications. At low power (standby)levels, the system operates in cycle skipping mode which minimizes the switching losses during standby.

The special built-in green functions allow the efﬁciency to be optimum at all power levels. This holds for quasi-resonant operation at high power levels, as well as ﬁxed frequency operation with valley switching at medium power levels. At low power (standby) levels,the system operates in cycle skipping mode with valley detection.

2. Features

2.1 Distinctive features

2.2 Green features

2.3 Protection features

The proprietary high voltage BCD800 process makes direct start-up possible from the rectiﬁed universal mains voltage in an effective and green way. A second low voltage BICMOS IC is used for accurate, high speed protection functions and control.

The TEA1532 enables highly efﬁcient and reliable supplies to be designed easily.

■ Universal mains supply operation (70 V to 276 VAC)

■ High level of integration, resulting in a very low external component count

■ Fixed frequency Continuous Conduction Mode (CCM) operation capability

■ Quasi-Resonant (QR) Discontinuous Conduction Mode (DCM) operation capability.

■ Valley or zero voltage switching for minimum switching losses in QR operation

■ Cycle skipping mode at very low loads; input power <300 mW at no-load operation for

a typical adapter application

■ On-chip start-up current source.

■ Safe restart mode for system fault conditions

■ Zero current switch-on in QR mode

■ Undervoltage protection (foldback during overload)

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Philips Semiconductors

■ IC overtemperature protection (latched)

■ Low and adjustable overcurrent protection trip level

■ Soft (re)start

■ Mains voltage-dependent operation-enabling level

■ General purpose input for latched or safe restart protection and timing, e.g. to be used

for overvoltage protection (OVP), output short-circuit protection or system overtemperature protection

■ Brown-out protection.

3. Applications

■ Printer adapters and chargers. The device can also be used in all applications that

demand an efﬁcient and cost-effective solution up to 250 W.

4. Ordering information

Table 1: Ordering information

Type number Package

TEA1532T SO8 plastic small outline package; 8 leads; body

TEA1532P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

TEA1532

GreenChipII SMPS control IC

Name Description Version

SOT96-1

width 3.9 mm

Preliminary data sheet Rev. 01 — 28 May 2004 2 of 27

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Philips Semiconductors

5. Block diagram

TEA1532

GreenChipII SMPS control IC

GND

CTRL

SLOPE

COMPENSATION

slopecomp

0.63 V

OSCILLATOR

−1

5.6 V

control detect

SUPPLY

MANAGEMENT

internal

UVLO start

supply

POWER-ON

RESET

MAXIMUM

ON-TIME

PROTECTION

DETECTION

Osc_Rdy

Duty_Max

UVLO

DCM AND CCM

LOGIC

CURRENT SOURCE

LOGIC

START-UP

VALLEY

DCM and CCM

80 mV

DRIVER

LEB

blank

OCP

BROWN-OUT

PROTECTION

prot(dem)

clamp

soft

start

−50 mV

0.5 V

DRAIN

DEM

DRIVER

SENSE

2.5 V

PROTECT

300 Ω

discharge

charge

5.6 V

3 V

protect detect

OVER-

TEMPERATURE

PROTECTION

TEA1532T TEA1532P

< 4.5 V

coa014

Fig 1. Block diagram.

Preliminary data sheet Rev. 01 — 28 May 2004 3 of 27

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Philips Semiconductors

6. Pinning information

6.1 Pinning

TEA1532

GreenChipII SMPS control IC

GND DRIVER

PROTECT SENSE

CTRL DEM

3 4

TEA1532T

001aaa829

8 7 6 5

DRAIN

GND DRIVER

PROTECT SENSE

CTRL DEM

TEA1532P

3 4

001aaa828

8 7 6 5

DRAIN

Fig 2. Pin conﬁguration: TEA1532T (SOT96-1). Fig 3. Pin conﬁguration: TEA1532P (SOT97-1).

6.2 Pin description

Table 2: Pin description

Symbol Pin Description

GND 2 ground PROTECT 3 protection and timing input CTRL 4 control input DEM 5 input from auxiliary winding for demagnetization timing SENSE 6 programmable current sense input DRIVER 7 MOSFET Gate driver output DRAIN 8 connected to drain of external MOS switch, input for start-up

1 supply voltage

current compensation and valley sensing

7. Functional description

The TEA1532 is the controller of a compact ﬂyback converter, with the IC situated at the primary side. An auxiliary winding of the transformer provides demagnetization detection and powers the IC after start-up; see Figure 4.

Preliminary data sheet Rev. 01 — 28 May 2004 4 of 27

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Philips Semiconductors

TEA1532

GreenChipII SMPS control IC

VCC

TEA1532T TEA1532P

coa015

Fig 4. Typical conﬁguration

The TEA1532 can operate in multi modes; see Figure 5.

(kHz)

Cycle

skip

fixed

coa017

FF-CCM

P (W)

Fig 5. Multi mode and FF-CCM operation.

In QR mode, the next converter stroke is started only after demagnetization of the transformer current (zero current switching), while the drain voltage has reached the lowest voltage to minimize switching losses (green function). The primary resonant circuit of primary inductance and drain capacitor ensures this quasi-resonant operation. The design can be optimizedinsuchaway that zero voltageswitchingcan extend over most of the universal mains range.

To prevent very high frequency operation at lower loads, the quasi-resonant operation changes smoothly in ﬁxed frequency Pulse Width Modulation (PWM) control.

Preliminary data sheet Rev. 01 — 28 May 2004 5 of 27

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Philips Semiconductors

In ﬁxed frequency continuous conduction mode, the internal oscillator determines the start of the next converter stroke.

In both operating modes, a cycle skipping mode is activated at very low power (standby) levels.

7.1 Start-up, mains enabling operation level and undervoltage lock out

Refer to Figure 10 and Figure 11. Initially, the IC is self supplying from the rectiﬁed mains voltage via pin DRAIN. Supply capacitor C current source to a level of about 4 V or higher, depending on the drain voltage. Once the drain voltage exceeds the Vm (mains-dependent operation-enabling level), the start-up current source will continue charging capacitor C

Figure 1. The IC will activate the power converter as soon as the voltage on pin V

passes the V output voltage reaches its intended level and the IC supply from the mains voltage is subsequently stopped for high efﬁciency operation (green function).

TEA1532

GreenChipII SMPS control IC

(at pin 1) is charged by the internal start-up

VCC

(switch S1 will be opened); see

VCC

level.The IC supply is taken over by the auxiliary winding as soon as the

start

The moment the voltage on pin VCC drops below V

(undervoltage lock out), the IC

UVLO

stops switching and enters a safe restart from the rectiﬁed mains voltage. Inhibiting the auxiliary supply by external means causes the converter to operate in a stable, well-deﬁned burst mode.

7.2 Supply management

All (internal) reference voltages are derived from a temperature compensated, on-chip band gap circuit.

7.3 Current control mode

Current control mode is used for its good line regulation behavior. The on-time is controlled by the internally inverted pin CTRL voltage, which is compared

with the primary current information. The primary current is sensed across an external resistor. The driver output is latched in the logic, preventing multiple switch-on.

The internal control voltage is inversely proportional to the external pin CTRL voltage, with an offset of 1.5 V. This means that a voltage range from 1 V to approximately 1.5 V on pin CTRL will result in an internal control voltage range from 0.5 V to 0 V (a high external control voltage results in a low duty cycle).

sense(max)

coa016

0.52 V Cycle

skip active

25 mV

1 V

(typ)

Fig 6. The V

Preliminary data sheet Rev. 01 — 28 May 2004 6 of 27

sense(max)

voltage as a function of V

1.5 V

CTRL

(typ)

CTRL

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Philips Semiconductors

7.4 Oscillator

The ﬁxed frequency of the oscillator is set by an internal current source and capacitor.

7.5 Cycle skipping

At very low power levels, a cycle skipping mode activates. An internal control voltage (V

sense(max)

this voltage increases to a higher value; see Figure 6.

7.6 Demagnetization (QR operation)

The system will be in Discontinuous Conduction Mode (DCM) (QR operation) when resistor R secondary stroke has ended.

Demagnetization features a cycle-by-cycle output short-circuit protection which immediately reduces the frequency (longer off-time), thereby reducing the power level.

TEA1532

GreenChipII SMPS control IC

) lower than 25 mV will inhibit switch-on of the external power MOSFET until

is applied. The oscillator will not start a new primary stroke until the

DEM

Demagnetization recognition is suppressed during the ﬁrst t may be necessary in applications where the transformer has a large leakage inductance and at low output voltages or start-up.

time. This suppression

supp

7.7 Continuous Conduction Mode (CCM)

It is also possible to operate the IC in the so-called Fixed Frequency Continuous Conduction Mode (FF CCM). This mode is activated by connecting pin DEM to ground and connecting pin DRAIN to the rectiﬁed constant Vi voltage; see Figure 13.

7.8 Overcurrent Protection (OCP)

The current in the transformer primary is measured accurately by the internal cycle-by-cycle source current limit circuit using the external sense resistor R The accuracy of the current limit circuit allows the transformer core to have a minimum speciﬁcation forthe output power required. The OCP circuit limits the ‘sense’ voltage to an internal level, and is activated after the leading edge blanking period, t Leading Edge Blanking (LEB) circuit.

generated by the

leb

7.9 Control pin protection

If pin CTRL becomes open-circuit or is disconnected, a fault condition is assumed and the converter will stop operating immediately. Operation recommences when the fault condition is removed.

sense

7.10 Adjustable slope compensation

A slope compensation function has been added at pin CTRL; see Figure 7. The slope compensation function prevents sub-harmonic oscillation in CCM at duty cycles over 50 %. The CTRL voltage is modulated by sourcing a (non-constant) current out of pin CTRL and adding a series resistor R proportionally with the on-time, which therefore limits the OCP level. Thus, a longer on-time results in a higher CTRL voltage, however, this increase in CTRL voltage will actually decrease the on-time. Slope compensation can be adjusted by changing the

Preliminary data sheet Rev. 01 — 28 May 2004 7 of 27

slopecomp

. This increases the CTRL voltage

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Philips Semiconductors

TEA1532

GreenChipII SMPS control IC

value of R

slopecomp

. Slope compensation prevents modulation of the on-time (duty cycle) while operating in FF CCM. A possible drawback of sub-harmonic oscillation can be output voltage ripple.

TEA1532

Slope compensation current

CTRL

Fig 7. Slope compensation.

slopecomp

CTRL

−1

5.6 V

control detect

0.63 V

001aaa830

7.11 Minimum and maximum on-time

The minimum on-time of the SMPS is determined by the LEB time. The IC limits the on-time to a maximum time which is dependent on the mode of operation:

QR mode: When the system requires an ‘on-time’ of more than 25 µs, a fault condition is assumed (e.g. C

removed), the IC stops switching and enters the safe restart mode.

VCC

CCM: The driver duty cycle is limited to 70 %. So the maximum on-time is correlated to the oscillator time which results in an accurate limit of the minimum input voltage of the ﬂyback converter.

7.12 PROTECT and timing input

The PROTECT input (pin 3) is a multi-purpose (high-impedance) input, which can be used to switch off the IC and create a relatively long timing function. As soon as the voltage on this pin rises above 2.5 V, switching stops immediately. For the timing function, a current of typically 50 µA ﬂows out of pin PROTECT and charges an external capacitor until the activation level of 2.5 V is reached. This current source however, is only activated when the converter is not in regulation, which is detected by the voltage on pin CTRL (V capacitor is not charged, for example, by spikes, and a MOSFET switch is added to ensure a deﬁned start situation. The voltage on pin CTRL determines whether the IC enters latched protection mode, or safe restart protection mode:

< 0.63 V). A (small) discharge current is also implemented to ensure that the

CTRL

Preliminary data sheet Rev. 01 — 28 May 2004 8 of 27

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Philips Semiconductors

• When the voltage on pin CTRL is below 0.63 V, the IC is assumed to be out of

regulation (e.g. the control loop is open). In this case activating pin PROTECT (V V

UVLO

repeated until the fault condition is removed (safe restart mode)

• Whenthe voltage on pin CTRL is above 0.63 V, the IC is assumed to be in regulation.

In this case activating pin PROTECT(V the IC: The voltage on pin VCC will cycle between V start switching again until the latch function is reset. The latch is reset as soon as V drops below 4.5 V (typical value). The internal overtemperature protection will also trigger this latch; see also Figure 1.

A voltagehigher than 3 V on pin PROTECTwill always latch the IC. This is independent of the state of the IC.

7.13 Valley switching

Refer to Figure 8. A new cycle starts when the power switch is activated. After the on-time (determined by the sense voltage and the internal control voltage), the switch is opened and the secondary stroke starts. After the secondary stroke, the drain voltage shows an

oscillation with a frequency of approximately

PROTECT

, capacitor C

TEA1532

GreenChipII SMPS control IC

> 2.5 V) will cause the converter to stop switching. Once VCC drops below

will be recharged and the supply will restart. This cycle will be

VCC

PROTECT

> 2.5 V), by external means, will latch

and V

start

-----------------------------------------------

2 π× L

Cd×()×(

, but the IC will not

UVLO

where Lp is the primary self inductance of the transformer and Cd is the capacitance on the drain node.

As soon as the oscillator voltage is high again and the secondary stroke has ended, the circuit waits for the lowest drain voltage before starting a new primary stroke. This method is called valley detection. Figure 8 shows the drain voltage, valley signal, secondary stroke signal and the oscillator signal.

In an optimum design, the reﬂected secondary voltage on the primary side will force the drain voltage to zero. Thus, zero voltage switching is possible, preventing large capacitive

switching losses , and allowing high frequency operation, which



-- -



× f××=

results in small and cost effective magnetics.

Preliminary data sheet Rev. 01 — 28 May 2004 9 of 27

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Philips Semiconductors

TEA1532

GreenChipII SMPS control IC

drain

valley

secondary

stroke

oscillator

primary

stroke

secondary

stroke

secondary

ringing

(2) (1)

mgu235

(1) Start of new cycle at lowest drain voltage. (2) Start of new cycle in a classical PWM system at high drain voltage.

Fig 8. Signals for valley switching.

7.14 Brown-out protection

During the so called brown-out test, the input voltage is slowly decreased. Since the on-time depends on Vi, overlong on-times at low Vi can damage the (external) power device. This is prevented by stopping the converter when the input voltage drops too low.

When the voltage on pin DEM drops below −50 mV during the on-time (QR mode), the maximum on-time is set to 25 µs. The maximum on-time will be reached while Vi is low. Subsequently, the IC stops switching and VCC drops below V only be recharged and the supply will restart only when voltage Vi is high enough (Vm, also see Section 7.1). In addition to this, a Vi level at which the converter has to enter a safe restart can be set with a demag resistor. During the primary stroke, the rectiﬁed mains input voltage is measured by sensing the current drawn from pin DEM. This current depends on the mains voltage, according to the following formula:

DEM()

Where:

≈≈

-------------- -

DEM

aux

------------

--------------------------

aux

mains

DEM

. Capacitor C

UVLO

VCC

will

The latter function requires an on-time of at least 2 µs. This on-time ensures that a reliable demag current can be measured.

Preliminary data sheet Rev. 01 — 28 May 2004 10 of 27

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Philips Semiconductors

When pin DEM is grounded (CCM), the brown-out protection is disabled. In this case the duty cycle is limited to 0.7, so at low mains voltage the on-time is limited and therefore the dissipation in the FET is limited.

7.15 OverTemperature Protection (OTP)

The IC provides accurate temperature protection. The IC will stop switching when the junction temperature exceeds the thermal shutdown temperature. When VCC drops to V

, capacitor C

UVLO

restart. Subsequently, VCC will drop again to V Operation only recommences when VCC drops below a level of about 4.5 V (typically,

when V

7.16 Soft start-up (pin SENSE)

To prevent transformer rattle at start-up or during hiccup, the transformer peak current is slowly increased by the soft start function. This can be achieved by inserting a resistor and a capacitor between pin SENSE (pin 6) and sense resistor R source charges the capacitor to V

will be recharged to the V

VCC

is disconnected for a short period).

mains

sense=Iss

TEA1532

GreenChipII SMPS control IC

level, however switching will not

start

, etc..

UVLO

. An internal current

sense

× Rss (about 0.5 V maximum).

The start level and the time constant of the increasing primary current level can be adjusted externally by changing the values of Rss and Css.

primary(max)

ocpIssRss

------------------------------------------

×()–

sense

τ RssCss×=

The charging current ISS will ﬂow as long as the voltage on pin SENSE is below approximately 0.5 V. If the voltage on pin SENSE exceeds 0.5 V, the soft start current source will start limiting current Iss. At V

, the Iss current source is completely

start

switched off; see Figure 9. Since the soft start current Issis supplied from pin DRAIN, the Rssvalue will not affect V

current during start-up.

0.5 V

start-up

SENSE

ocp

sense

mgu237

Fig 9. Soft start-up.

Preliminary data sheet Rev. 01 — 28 May 2004 11 of 27

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Philips Semiconductors

7.17 Driver

The driver circuit to the Gate of the power MOSFET has a current sourcing capability of typically 170 mA and a current sink capability of typically 700 mA. This permits fast turn-on and turn-off of the power MOSFET for efﬁcient operation.

A low driver source current has been chosen to limit the ∆V/∆t at switch-on. This reduces Electro Magnetic Interference (EMI) and also limits the current spikes across R

8. Limiting values

Table 3: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to ground (pin 2); positive currents ﬂow into the chip; pin V The voltage ratings are valid provided other ratings are not violated; current ratings are valid provided the maximum power rating is not violated.

Symbol Parameter Conditions Min Max Unit

Voltages

PROTECT

CTRL

DEM

SENSE

DRAIN

Currents

CTRL

DEM

SENSE

DRIVER

DRAIN

General

tot

stg

ESD

TEA1532

GreenChipII SMPS control IC

sense

maynot be current driven.

supply voltage continuous −0.4 +20 V voltage on pin PROTECT continuous −0.4 +5 V voltage on pin CTRL −0.4 +5 V voltage on pin DEM current limited - - V voltage on pin SENSE current limited −0.4 - V voltage on pin DRAIN −0.4 +650 V

current on pin CTRL d < 10 % - 50 mA current on pin DEM −1000 +250 µA current on pin SENSE −1 +10 mA current on pin DRIVER d < 10 % −0.8 +2 A current on pin DRAIN - 5 mA

total power dissipation T

storage temperature −55 +150 °C junction temperature −20 +145 °C

electrostatic discharge voltage

human body model pins 1 to 7

machine model

<70°C

amb

SO8 package - 0.5 W DIP8 package - 0.75 W

class 1

[1]

- 2000 V

[1]

pin 8 (DRAIN)

- 1500 V

[2]

- 200 V

[1] Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. [2] Equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω resistor.

Preliminary data sheet Rev. 01 — 28 May 2004 12 of 27

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Philips Semiconductors

TEA1532

GreenChipII SMPS control IC

9. Thermal characteristics

Table 4: Thermal characteristics

Symbol Parameter Conditions Typ Unit

th(j-a)

thermal resistance from junction to ambient

in free air; SO8 package 150 K/W in free air; DIP8 package 95 K/W

10. Characteristics

Table 5: Characteristics

=25°C; VCC= 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when ﬂowing into

amb

the IC; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Start-up current source (pin DRAIN)

DRAIN

supply current drawn from pin DRAIN

breakdown voltage 650 - - V mains-dependent

operation-enabling level

Supply voltage management (pin V

start

UVLO

hys

ch(h)

ch(l)

restart

oper

start-up voltage 10.3 11 11.7 V lock-out undervoltage 8.1 8.7 9.3 V hysteresis voltage V high charging current V low charging current V

restart current V

supply current under normal

)

operation

Demagnetization management (pin DEM)

th(DEM)

demagnetization comparator threshold voltage

th(CCM)

continuous conduction mode detection threshold voltage

prot(dem)

clamp(neg)

clamp(pos)

supp

pin protection current V negative clamp voltage I positive clamp voltage I suppression of transformer

ringing at start of secondary stroke

Pulse width modulator

on(min)

on(max)

max

Preliminary data sheet Rev. 01 — 28 May 2004 13 of 27

minimum on-time - t maximum on-time QR mode 20 25 30 µs maximum duty-cycle 67 70 73 %

> 100 V; 1.0 1.2 1.4 mA

DRAIN

=0V

with auxiliary supply - 100 300 µA

60 - 100 V

− V

start

UVLO

> 100 V; VCC<3V −1.2 −1 −0.8 mA

DRAIN

> 100 V;

DRAIN

3V<V

CC<VUVLO

> 100 V;

DRAIN

UVLO<VCC<Vstart

2.0 2.3 2.6 V

−1.2 −0.75 −0.45 mA

−650 −550 −450 µA

no load on pin DRIVER 1.1 1.3 1.5 mA

50 80 110 mV

−80 −50 −20 mV

=50mV −60 - −10 nA

DEM

= −500 µA −0.5 −0.45 −0.40 V

DEM

= 250 µA 0.5 0.7 0.9 V

DEM

1.1 1.5 1.9 µs

-ns

leb

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Philips Semiconductors

TEA1532

GreenChipII SMPS control IC

Table 5: Characteristics

=25°C; VCC= 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when ﬂowing into

amb

…continued

the IC; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Oscillator

osc

oscillator frequency (ﬁxed

<1V 506375kHz

CTRL

frequency)

Duty cycle control (pin CTRL)

min

minimum voltage for maximum

- 1.0 - V

duty cycle

max

maximum voltage for minimum

- 1.5 - V

duty cycle

∆I

slopecomp

CTRL(detect)

/∆t slope compensation current −1.2 −1 −0.8 µA/µs

Control detect level 0.56 0.63 0.70 V

Protection and timing input (pin PROTECT)

trip

trip(latch)

CC(latch)(reset)

trip level 2.37 2.5 2.63 V trip level for latch 2.85 3 3.15 V voltage level on pin VCC which

CC(latch)

< 2.3 V - 4.5 - V

resets the latch

charge

discharge

charge current V discharge current - 100 - nA

< 0.63 V −57 −50 −43 µA

CTRL

Valley switch (pin DRAIN)

∆V/∆t

valley

valley recognition voltage

−43 - +43 V/µs

change

valley-swon

delay from valley recognition to

[1]

- 150 - ns

switch-on

Overcurrent and winding short-circuit protection (pin SENSE)

sense(max)

maximum source voltage for

∆V/∆t = 0.1 V/µs 0.48 0.52 0.56 V

OCP

propagation delay from detecting V

sense(max)

∆V/∆t = 0.5 V/µs - 140 185 ns

switch-off

leb

blanking time for current and

330 400 470 ns

winding short-circuit protection

soft start current V

< 0.5 V 45 60 75 µA

sense

Brown-out protection (pin DEM)

brown-out

brown-out protection current A constant I

(brown-out)

is drawn

[2]

−68 −60 −52 µA

from pin DEM.

on(min)(brown-out)

minimum on-time for enabling

1.5 2 2.5 µs

the brown-out protection.

Driver (pin DRIVER)

source

sink

o(max)

source current VCC= 9.5 V; V sink current VCC= 9.5 V;

V V

= 2 V - 300 - mA

DRIVER

= 9.5 V 400 700 - mA

DRIVER

maximum output voltage VCC> 12 V - 11.5 12 V

=2V - −170 −88 mA

DRIVER

Preliminary data sheet Rev. 01 — 28 May 2004 14 of 27

Page 15

Philips Semiconductors

TEA1532

GreenChipII SMPS control IC

Table 5: Characteristics

=25°C; VCC= 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when ﬂowing into

amb

…continued

the IC; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Temperature protection

prot(max)

prot(hyst)

[1] Guaranteed by design. [2] Vi detection level. Set by the demagnetization resistor R [3] Valid for VCC>2V.

maximum temperature protection level

hysteresis for the temperature protection level

; see Section 7.14

DEM

130 140 150 °C

[3]

-8-°C

11. Application information

A converter with the TEA1532 consists of an input ﬁlter, a transformer with a third winding (auxiliary), and an output stage with a feedback circuit.

Capacitor C rectiﬁed mains during start-up and via the auxiliary winding during operation.

A sense resistor R value of R

buffers the IC supply voltage, which is powered via the high voltage

VCC

converts the primary current into a voltage at pin SENSE. The

sense

deﬁnes the maximum primary peak current.

sense

Figure 10 shows a ﬂyback conﬁguration using the discontinuous conduction mode.

Pin PROTECT is used in this example for external overvoltage protection and open loop or output short-circuit protection. If this pin is not used, it must be tied to ground. Figure 13 shows a ﬂyback conﬁguration using the continuous conduction mode. Pin PROTECT is used in this example for external overtemperature protection and open loop or output short-circuit protection.

Preliminary data sheet Rev. 01 — 28 May 2004 15 of 27

Page 16

Philips Semiconductors

mains

CTRL

GND

PROTECT

CTRL

TEA1532T TEA1532P

DRAIN

DRIVER

SENSE

DEM

TEA1532

GreenChipII SMPS control IC

power MOSFET

DEM

sense

Fig 10. Flyback conﬁguration using the discontinuous conduction mode.

coa011

Preliminary data sheet Rev. 01 — 28 May 2004 16 of 27

Page 17

Philips Semiconductors

DRAIN

TEA1532

GreenChipII SMPS control IC

start

DRIVER

PROTECT

Start-up

sequence

UVLO

2.5 V

Normal

operation

OVP Normal

operation

Output

short-circuit

(1) In CCM, the brown-out protection is implemented by the maximum duty cycle in combination

with pin PROTECT.

Fig 11. Typical waveforms 1.

Brown-out

001aaa840

(1)

Preliminary data sheet Rev. 01 — 28 May 2004 17 of 27

Page 18

Philips Semiconductors

DRAIN

TEA1532

GreenChipII SMPS control IC

start

DRIVER

(1)

PROTECT

Start-up

sequence

is forced above 3 V,the protection is always latched. So the IC is not started at

(1) WhenV

unless the VCC voltage drops below the V

start

PROTECT

external OTP compensation described in Section 7.15.

Fig 12. Typical waveforms 2.

2.5 V

Normal

operation

UVLO

CC(reset)

External

OTP

001aaa841

level. This is the same action used for

Preliminary data sheet Rev. 01 — 28 May 2004 18 of 27

Page 19

Philips Semiconductors

mains

CTRL

PROTECT

slopecomp

GND

CTRL

(1)

TEA1532T

TEA1532P

DRAIN

DRIVER

SENSE

DEM

TEA1532

GreenChipII SMPS control IC

power MOSFET

sense

(1) Pin PROTECT is used in this example for external OTP and open loop or output short-circuit

Fig 13. Flyback conﬁguration using the continuous conduction mode.

12. Test information

12.1 Quality information

The

General Quality Speciﬁcation for Integrated Circuits, SNW-FQ-611

protection. Slope compensation is determined by the value of R

slopecomp

coa013

is applicable.

Preliminary data sheet Rev. 01 — 28 May 2004 19 of 27

Page 20

Philips Semiconductors

13. Package outline

TEA1532

GreenChipII SMPS control IC

SO8: plastic small outline package; 8 leads; body width 3.9 mm

pin 1 index

w M

SOT96-1

detail X

v M

(A )

0 2.5 5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

OUTLINE VERSION

SOT96-1

A1A2A3b

max.

0.25

1.75

0.10

0.010

0.069

0.004

1.45

1.25

0.057

0.049

IEC JEDEC JEITA

076E03 MS-012

0.25

0.01

0.49

0.36

0.019

0.014

0.25

0.19

0.0100

0.0075

UNIT

inches

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

(1)E(2)

5.0

4.8

0.20

0.19

REFERENCES

eHELLpQZywv θ

4.0

3.8

0.16

0.15

1.27

0.05

6.2

5.8

0.244

0.228

1.05

1.0

0.4

0.039

0.016

0.7

0.6

0.028

0.024

0.25 0.10.25

0.010.010.041 0.004

EUROPEAN

PROJECTION

(1)

0.7

0.3

0.028

0.012

ISSUE DATE

99-12-27 03-02-18

Fig 14. Package outline.

Preliminary data sheet Rev. 01 — 28 May 2004 20 of 27

Page 21

Philips Semiconductors

TEA1532

GreenChipII SMPS control IC

DIP8: plastic dual in-line package; 8 leads (300 mil)

seating plane

pin 1 index

w M

SOT97-1

(e )

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

min.

max.

050G01 MO-001 SC-504-8

1.73

1.14

0.068

0.021

0.045

0.015

IEC JEDEC JEITA

OUTLINE VERSION

SOT97-1

max.

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

0.53

0.38

0 5 10 mm

scale

0.042

0.035

0.36

1.07

0.23

0.89

0.014

0.009

REFERENCES

(1) (1)

cD E e M

9.8

9.2

0.39

0.36

6.48

6.20

0.26

0.24

3.60

3.05

0.14

0.12

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

10.0

0.39

0.33

8.3

max.

0.2542.54 7.62

0.010.1 0.3

0.0450.17 0.02 0.13

ISSUE DATE

99-12-27 03-02-13

1.154.2 0.51 3.2

(1)

Fig 15. Package outline.

Preliminary data sheet Rev. 01 — 28 May 2004 21 of 27

Page 22

Philips Semiconductors

14. Soldering

14.1 Introduction

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our (document order number 9398 652 90011).

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for ﬁne pitch SMDs. In these situations reﬂow soldering is recommended. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing.

14.2 Through-hole mount packages

14.2.1 Soldering by dipping or by solder wave

Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

TEA1532

GreenChipII SMPS control IC

Data Handbook IC26; Integrated Circuit Packages

The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic

body must not exceed the speciﬁed maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

14.2.2 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm aboveit. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

14.3 Surface mount packages

14.3.1 Reﬂow soldering

Reﬂow soldering requires solder paste (a suspension of ﬁne solder particles, ﬂux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

Several methods exist for reﬂowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.

stg(max)

). If the

Typical reﬂow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept:

• below 225 °C (SnPb process) or below 245 °C (Pb-free process)

– for all the BGA and SSOP-T packages

Preliminary data sheet Rev. 01 — 28 May 2004 22 of 27

Page 23

Philips Semiconductors

– for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called

• below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a

thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

14.3.2 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was speciﬁcally developed.

If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward

pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

The footprint must incorporate solder thieves at the downstream end.

• For packages with leads on four sides, the footprint must be placed at a 45° angle to

the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.

TEA1532

GreenChipII SMPS control IC

thick/large packages.

parallel to the transport direction of the printed-circuit board;

transport direction of the printed-circuit board.

During placement and before soldering, the package must be ﬁxed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated ﬂux will eliminate the need for removal of corrosive residues in most applications.

14.3.3 Manual soldering

Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

Preliminary data sheet Rev. 01 — 28 May 2004 23 of 27

Page 24

Philips Semiconductors

14.4 Package related soldering information

Table 6: Suitability of IC packages for wave, reﬂow and dipping soldering methods

Mounting Package

Through-hole mount

Through-holesurface mount

Surface mount BGA, LBGA, LFBGA,

GreenChipII SMPS control IC

[1]

DBS, DIP, HDIP, RDBS, SDIP, SIL

[4]

PMFP

SQFP, SSOP-T

[5]

, TFBGA,

VFBGA DHVQFN, HBCC, HBGA,

HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS

[7]

PLCC

, SO, SOJ suitable suitable − LQFP, QFP, TQFP not recommended SSOP, TSSOP, VSO,

VSSOP

Soldering method Wave Reﬂow

suitable

[3]

not suitable not

not suitable suitable −

not suitable

[6]

not recommended

TEA1532

− suitable

suitable

suitable −

[7] [8]

suitable −

[9]

suitable −

[2]

Dipping

−

[1] For more detailed information on the BGA packages refer to the

order a copy from your Philips Semiconductors sales ofﬁce.

[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the

Packages; Section: Packing Methods

[3] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit

board. [4] Hot bar soldering or manual soldering is suitable for PMFP packages. [5] These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must on no

account be processed through more than one soldering cycle or subjected to infrared reﬂow soldering with

peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reﬂow oven. The package

body peak temperature must be kept as low as possible. [6] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface. [7] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners. [8] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8mm; it is

deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65mm. [9] Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm;

it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

(LF)BGA Application Note

Data Handbook IC26; Integrated Circuit

(AN01026);

Preliminary data sheet Rev. 01 — 28 May 2004 24 of 27

Page 25

Philips Semiconductors

GreenChipII SMPS control IC

TEA1532

15. Revision history

Table 7: Revision history

Document ID Release date Data sheet status Change notice Order number Supersedes

TEA1532_1 20040528 Preliminary data - 9397 750 13113 -

Preliminary data sheet Rev. 01 — 28 May 2004 25 of 27

Page 26

Philips Semiconductors

16. Data sheet status

TEA1532

GreenChipII SMPS control IC

Level Data sheet status

I Objective data Development This data sheet contains data from the objective speciﬁcation for product development. Philips

II Preliminary data Qualiﬁcation Thisdatasheetcontains data from the preliminary speciﬁcation. Supplementary data will be published

III Product data Production This data sheet contains data from the product speciﬁcation. Philips Semiconductors reserves the

[1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

[1]

Product status

17. Deﬁnitions

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values deﬁnition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the speciﬁed use without further testing or modiﬁcation.

[2] [3]

Deﬁnition

Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in order to improve the design and supply the best possible product.

right to make changes at any time in order to improve the design, manufacturing and supply.Relevant changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, andmakesno representations or warrantiesthatthese products are free from patent, copyright,ormaskworkright infringement, unless otherwise speciﬁed.

19. Trademarks

18. Disclaimers

GreenChip — is a trademark of Koninklijke Philips Electronics N.V.

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors

20. Contact information

For additional information, please visit: http://www.semiconductors.philips.com For sales ofﬁce addresses, send an email to: [email protected]

Preliminary data sheet Rev. 01 — 28 May 2004 26 of 27

Page 27

Philips Semiconductors

21. Contents

TEA1532

GreenChipII SMPS control IC

1 General description . . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2.1 Distinctive features . . . . . . . . . . . . . . . . . . . . . . 1

2.2 Green features . . . . . . . . . . . . . . . . . . . . . . . . . 1

2.3 Protection features . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

7 Functional description . . . . . . . . . . . . . . . . . . . 4

7.1 Start-up, mains enabling operation level and

undervoltage lock out . . . . . . . . . . . . . . . . . . . . 6

7.2 Supply management. . . . . . . . . . . . . . . . . . . . . 6

7.3 Current control mode . . . . . . . . . . . . . . . . . . . . 6

7.4 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.5 Cycle skipping. . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.6 Demagnetization (QR operation) . . . . . . . . . . . 7

7.7 Continuous Conduction Mode (CCM). . . . . . . . 7

7.8 Overcurrent Protection (OCP) . . . . . . . . . . . . . 7

7.9 Control pin protection . . . . . . . . . . . . . . . . . . . . 7

7.10 Adjustable slope compensation . . . . . . . . . . . . 7

7.11 Minimum and maximum on-time. . . . . . . . . . . . 8

7.12 PROTECT and timing input . . . . . . . . . . . . . . . 8

7.13 Valley switching. . . . . . . . . . . . . . . . . . . . . . . . . 9

7.14 Brown-out protection. . . . . . . . . . . . . . . . . . . . 10

7.15 OverTemperature Protection (OTP) . . . . . . . . 11

7.16 Soft start-up (pin SENSE). . . . . . . . . . . . . . . . 11

7.17 Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12

9 Thermal characteristics. . . . . . . . . . . . . . . . . . 13

10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 13

11 Application information. . . . . . . . . . . . . . . . . . 15

12 Test information. . . . . . . . . . . . . . . . . . . . . . . . 19

12.1 Quality information . . . . . . . . . . . . . . . . . . . . . 19

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20

14 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

14.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 22

14.2 Through-hole mount packages . . . . . . . . . . . 22

14.2.1 Soldering by dipping or by solder wave . . . . . 22

14.2.2 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 22

14.3 Surface mount packages . . . . . . . . . . . . . . . . 22

14.3.1 Reﬂow soldering. . . . . . . . . . . . . . . . . . . . . . . 22

14.3.2 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 23

14.3.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 23

14.4 Package related soldering information. . . . . . 24

15 Revision history . . . . . . . . . . . . . . . . . . . . . . . 25

16 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 26

17 Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

18 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

19 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

20 Contact information . . . . . . . . . . . . . . . . . . . . 26

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Document order number: 9397 750 13113

Published in The Netherlands

Date of release: 28 May 2004