Datasheet TEA152x Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TEA152x family

TM

STARplug

Product specification
File under Integrated Circuits, IC11

2000 Sep 08

Philips Semiconductors Product specification

STARplug

FEATURES

• Designed for general purpose supplies up to 50 W

• Integrated power switch:

– TEA1520: 48 Ω; 650 V
– TEA1521: 24 Ω; 650 V
– TEA1522: 12 Ω; 650 V
– TEA1523: 6.5 Ω; 650 V
– TEA1524: 3.4 Ω; 650 V.

• Operates from universal AC mains supplies
(80 to 276 V)

• Adjustable frequency for flexible design

• RC oscillator for load insensitive regulation loop

constant

• Valley switching for minimum switch-on loss (not
implemented in TEA152xAJM versions)

• Frequency reduction at low power output makes low
standby power possible (<100 mW)

• Adjustable overcurrent protection

• Under voltage protection

• Temperature protection

• Short circuit winding protection

• Simple application with both primary and secondary

(opto) feedback

• Available in 8-pin DIP, 14-pin SO and 9-pin DBS
packages.

GENERAL DESCRIPTION

The TEA152x family is a Switched Mode Power
Supply (SMPS) controller IC that operates directly from
the rectified universal mains.Itis implemented in the high
voltage EZ-HV SOI process, combined with a low voltage
BICMOS process. The device includes a high voltage
power switch and a circuit for start-up directly from the
rectified mains voltage.

TM

TEA152x family

A dedicated circuit for valley switching is built in (not
implemented in TEA152xAJM versions), which makes a
very efficient slim-line electronic powerplug concept
possible.

Initsmostbasicversionofapplication,theTEA152xfamily
acts as a voltage source. Here, no additional secondary
electronics are required. A combined voltage and current
source can be realized with minimum costs for external
components. Implementation of the TEA152x family
renders an efficient and low cost power supply system.

Table 1 Available type numbers

R

DS(on)

48 Ω TEA1520P TEA1520T −
24 Ω TEA1521P TEA1521T −
12 Ω TEA1522P TEA1522T TEA1522AJM

6.5 Ω TEA1523P TEA1523T TEA1523AJM

3.4 Ω TEA1524P − TEA1524AJM

APPLICATIONS

Typical application areas for the STARplug

• Chargers

• Adapters

• STB (Set Top Box)

• DVD

• CD(R)

• TV/monitor standby supplies

• PC peripherals

• Microcontroller supplies in home applications and small

portable equipment, etc.

DIP8 SO14 DBS9P

TM

are:

2000 Sep 08 2

Philips Semiconductors Product specification

STARplug

TM

TEA152x family

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

drain(max)

maximum voltage at the DRAIN

Tj>0°C −−650 V

pin

R

DS(on)

V

CC(max)

f

osc

I

drain

drain-source on-state resistance
of TEA1520

drain-source on-state resistance
of TEA1521

drain-source on-state resistance
of TEA1522

drain-source on-state resistance
of TEA1523

drain-source on-state resistance
of TEA1524

maximum supply voltage −−40 V
frequency range of oscillator 10 100 200 kHz
supply current drawn from DRAIN

Tj=25°C; I
T

= 100 °C; I

j

T

=25°C; I

j

= 100 °C; I

T

j

T

=25°C; I

j

T

= 100 °C; I

j

=25°C; I

T

j

T

= 100 °C; I

j

T

=25°C; I

j

T

= 100 °C; I

j

= −0.06 A − 48 55.2 Ω

source

= −0.06 A − 68 78.2 Ω

source

= −0.125 A − 24 27.6 Ω

source

= −0.125 A − 34 39.1 Ω

source

= −0.25 A − 12 13.8 Ω

source

= −0.25 A − 17 19.6 Ω

source

= −0.5 A − 6.5 7.5 Ω

source

= −0.5 A − 9.0 10.0 Ω

source

= −1.0 A − 3.4 3.9 Ω

source

= −1.0 A − 4.8 5.5 Ω

source

no auxiliary supply − 1.5 − mA

pin

T

amb

ambient temperature −20 − +85 °C

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TEA152xP DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
TEA152xT SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
TEA152xAJM DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length

SOT523-1

12/11 mm); exposed die pad

2000 Sep 08 3

Philips Semiconductors Product specification

STARplug

BLOCK DIAGRAM

handbook, full pagewidth

CC

1

2

V

GND

TM

TEA152x

SUPPLY

LOGIC

VALLEY

TEA152x family

8

7

100 mV

DRAIN

n.c.

RC

REG

3

4

stop

OSCILLATOR

low freq

F

1.8 U

2.5 V
10x

PWM

THERMAL

SHUTDOWN

POWER-UP

RESET

PROTECTION

LOGIC

overcurrent

short circuit winding

blank

0.5 V

0.75 V

MGT419

6

5

SOURCE

AUX

The valley switching circuit is not implemented in the TEA152xAJM versions.
The pinning shown in this diagram is the pinning of the DIP8 package. For the pinning of

the other packages, see the relevant pinning tables and pin configurations.

Fig.1 Block diagram.

2000 Sep 08 4

Philips Semiconductors Product specification

STARplug

TM

PINNING

PIN

SYMBOL

DESCRIPTION

TEA152xP TEA152xT TEA152xAJM

V

CC

GND

1 1 1 supply voltage
2

2, 3, 4, 5,

9 and 10

2

ground

RC 3 6 3 frequency setting
REG 4 7 4 regulation input
SGND

AUX

−−5

586

signal ground; connected to exposed die pad; must be
connected to pin 2

input for voltage from auxiliary winding for timing

(demagnetization)
SOURCE 6 11 7 source of internal MOS switch
n.c. 7 12 and 13 8 not connected
DRAIN

8149

drain of internal MOS switch; input for start-up current

and valley sensing

TEA152x family

handbook, halfpage

Fig.2 Pin configuration of TEA152xP.

handbook, halfpage

V

CC

RC

REG

V

CC

GND
GND
GND
GND

RC

REG

1
2

TEA152xP

3
4

1
2
3
4

TEA152xT

5
6
7

MGT420

MGT421

8
7
6
5

14
13
12
11
10

9

8

DRAIN
n.c.GND
SOURCE
AUX

DRAIN
n.c.
n.c.
SOURCE
GND
GND
AUX

handbook, halfpage

SOURCE

Fig.4 Pin configuration of TEA152xAJM.

V

CC

GND

RC

REG

SGND

AUX

n.c.

DRAIN

1
2
3
4
5

TEA152xAJM

6
7
8
9

MGT422

Fig.3 Pin configuration of TEA152xT.

2000 Sep 08 5

Philips Semiconductors Product specification

STARplug

TM

FUNCTIONAL DESCRIPTION

The TEA152x family is the heart of a compact flyback
converter, with the IC placed at the primary side. The
auxiliary winding of the transformer can be used for
indirect feedback to control the isolated output. This
additional winding also powers the IC. A more accurate
control of the output voltage and/or current can be
implemented with an additional secondary sensing circuit
and optocoupler feedback.

The TEA152x family uses voltage mode control. The
frequency is determined by the maximum transformer
demagnetizing time and the time of the oscillator. In the
first case, the converter operates in the Self Oscillating
Power Supply (SOPS) mode. In the latter case, it operates
at a constant frequency, which can be adjusted with
external components RRC and CRC. This mode is called
Pulse Width Modulation (PWM). Furthermore, a primary
stroke is started only in a valley of the secondary ringing.
This valley switching principle minimizes capacitive
switch-on losses.

Start-up and under voltage lock-out

Initially, the IC is self supplying from the rectified mains
voltage. The IC starts switching as soon as the voltage on
pin VCC passes the V

level. The supply is taken

CC(start)

over by the auxiliary winding of the transformer as soon as
VCCis high enough and the supply from the line is stopped
for high efficiency operation.

Whenforsomereasontheauxiliarysupplyisnotsufficient,
the high voltage supply also supplies the IC. As soon as
the voltage on pin VCCdrops below the V

CC(stop)

level, the
IC stops switching and restarts from the rectified mains
voltage.

Oscillator

The frequency of the oscillator is set by the external
resistor and capacitor on pin RC. The external capacitor is
charged rapidly to the V
new primary stroke, it discharges to the V

level and, starting from a

RC(max)

RC(min)

level.
Because the discharge is exponential, the relative
sensitivity of the duty factor to the regulationvoltage at low
duty factor is almost equal to the sensitivity at high duty
factors. This results in a more constant gain over the duty
factor range compared to PWM systems with a linear
sawtooth oscillator. Stable operation at low duty factors is
easily realized. For high efficiency, the frequency is
reduced as soon as the duty factor drops below a certain
value. This is accomplished by increasing the oscillator
charge time.

TEA152x family

Duty factor control

The duty factor is controlled by the internal regulation
voltage and the oscillator signal on pin RC. The internal
regulation voltage is equal to the external regulation
voltage (minus 2.5 V) multiplied by the gain of the error
amplifier (typical 20 dB (10 ×)).

Valley switching (not implemented in TEA152xAJM versions)

A new cycle is started when the primary switch is switched
on (see Fig.5). After a certain time (determined by the
oscillator voltage RC and the internal regulation level), the
switch is turned off and the secondary stroke starts. The
internal regulation level is determined by the voltage on
pin REG. After the secondary stroke, the drain voltage
shows an oscillation with a frequency of approximately

---------------------------------------------------­2 π× LpCp×()×()

where L
parasitic capacitance on the drain node.

As soon as the oscillator voltage is high again and the
secondary stroke has ended, the circuit waits for a low
drain voltage before starting a new primary stroke.
Figure 5 shows the drain voltage together with the valley
signal, the signal indicating the secondary stroke and the
RC voltage.

The primary stroke starts some time before the actual
valley at low ringing frequencies, and some time after the
actual valley at high ringing frequencies. Figure 6 shows a
typical curve for a reflected output voltage N × V
This voltage is the output voltage Vo (see Fig.7)
transferred to the primary side of the transformer with the
factor N (determined by the turns ratio of the transformer).
Figure 6 shows that the system switches exactly at
minimum drain voltage for ringing frequencies of 480 kHz,
thus reducing the switch-on losses to a minimum.
At 200 kHz,the next primary stroke is started at 33°before
the valley. The switch-on losses are still reduced
significantly.

Demagnetization

Thesystemoperatesindiscontinuousconductionmodeall
the time. As long as the secondary stroke has not ended,
the oscillator will not start a new primarystroke. During the
first t
suppressed. This suppression may be necessary in
applications where the transformer has a large leakage
inductance and at low output voltages.

1

is the primary self inductance and Cp is the

p

seconds, demagnetization recognition is

suppr

of 80 V.

o

2000 Sep 08 6

Philips Semiconductors Product specification

STARplug

handbook, full pagewidth

TM

drain

valley

secondary

stroke

RC

oscillator

primary

stroke

secondary

stroke

regulation level

secondary

ringing

TEA152x family

A

B

A: Start of new cycle with valley switching.
B: Start of new cycle in a classical PWM system.

40

handbook, halfpage

phase

°)

(

20

−20

MGT423

Fig.5 Signals for valley switching.

MGT424

0

−40
0 200 400 800

Fig.6 Typical phase of drain ringing at switch-on (at N × Vo= 80 V).

2000 Sep 08 7

600

f (kHz)

Philips Semiconductors Product specification

STARplug

Minimum and maximum duty factor

The minimum duty factor of the switched mode power
supply is 0%. The maximum duty factor is set to 75%
(typical value at 100 kHz oscillation frequency).

Overcurrent protection

The cycle-by-cycle peak drain current limit circuit uses the
externalsource resistor to measure the current. The circuit
is activated after the leading edge blanking time t
protection circuit limits the source voltage to V
and thus limits the primary peak current.

Short circuit winding protection

The short circuit winding protection circuit is also activated
after the leading edge blanking time. If the source voltage
exceeds the short circuit winding protection voltage V
the IC stops switching. Only a Power-on reset will restart
normal operation. The short circuit winding protection also
protects in case of a secondary diode short circuit.

Overtemperature protection

TM

. The

leb

SRC(max)

,

swp

TEA152x family

Output characteristics of complete powerplug

OUTPUT POWER
A wide range of output power levels can be handled by

choosing the R
Power levels up to 50 W can be realised.

ACCURACY
The accuracy of the complete converter, functioning as a

voltage source with primary sensing, is approximately 8%
(mainly dependent on the transformer coupling). The
accuracy with secondary sensing is defined by the
accuracy of the external components. For safety
requirements in case of optocoupler feedback loss, the
primary sensing remains active when an overvoltage
circuit is connected.

,

EFFICIENCY
An efficiency of 75% at maximum output power can be

achieved for a complete converter designed for universal
mains.

and package of the TEA152x family.

DS(on)

An accurate temperature protection is provided in the
device. When the junction temperature exceeds the
thermal shutdown temperature, the IC stops switching.
During thermal protection, the IC current is lowered to the
start-up current. The IC continues normal operation as
soon as the overtemperature situation has disappeared.

Overvoltage protection

Overvoltage protection can be achieved in the application
by pulling pin REG above its normal operation level. The
current primary stroke is terminated immediately, and no
new primary stroke is started until the voltage on pin REG
drops to its normal operation level. Pin REG has an
internal clamp. The current feed into this pin must be
limited.

RIPPLE
A minimum ripple is obtained in a system designed for a

maximum duty factor of 50% under normal operating
conditions, and a minimized dead time. The magnitude of
the ripple in the output voltage is determined by the
frequency and duty factor of the converter, the output
current level and the value and ESR of the output
capacitor.

Input characteristics of complete powerplug

INPUT VOLTAGE
TheinputvoltagerangecomprisestheuniversalAC mains

(80 to 276 V).

2000 Sep 08 8

Philips Semiconductors Product specification

STARplug

TM

TEA152x family

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are measured with respect to
ground; positive currents flow into the device; pins VCCand RC are not allowed to be current driven, pins REG and AUX
are not allowed to be voltage driven.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Voltages

V

CC

V

RC

V

source

V

drain

low supply voltage continuous −0.4 +40 V
oscillator input voltage −0.4 +3 V
source of the DMOS power transistor voltage −0.4 +5 V
drain of the DMOS power transistor voltage −0.4 +650 V

Currents

I

REG

I

AUX

I

source

regulation input current − 6mA
auxiliary winding input current −10 +5 mA
source current of

TEA1520 −0.25 +0.25 A
TEA1521 −0.5 +0.5 A
TEA1522 −1+1A
TEA1523 −2+2A
TEA1524 −3+3A

I

drain

drain current of

TEA1520 −0.25 +0.25 A
TEA1521 −0.5 +0.5 A
TEA1522 −1+1A
TEA1523 −2+2A
TEA1524 −3+3A

General

P

tot

T

stg

T

amb

T

j

V

esd

total power dissipation

TEA152xP T
TEA152xT T
TEA152xAJM T

<45°C − 1.0 W

amb

<50°C − 1.0 W

amb

<45°C without heatsink − 1.5 W

amb

storage temperature −55 +150 °C
ambient temperature −20 +85 °C
junction temperature −20 +145 °C
electrostatic discharge voltage human body model; note 1 − 2500 V

machine model; note 2 − 200 V

Notes

1. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. All pins are
2500 V maximum, except pin DRAIN, which is 1000 V maximum.

2. Machine model: equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω series resistor.

2000 Sep 08 9

Philips Semiconductors Product specification

STARplug

TM

TEA152x family

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient note 1

TEA152xP in free air 100 K/W
TEA152xT in free air 91 K/W
TEA152xAJM in free air 65 K/W

Note

1. Thermal resistance R

can be lower when the GND pins are connected to sufficient copper area on the

th(j-a)

printed-circuit board. See the TEA152x application notes for details.

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611 part E”

.

CHARACTERISTICS

T

=25°C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing

amb

into the IC; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

I

CC(operate)

I

CC(startup)

I

drain

I

CC(ch)

V

CC(start)

V

CC(stop)

supply current normal operation − 1.3 1.9 mA
start-up supply current start-up − 180 400 µA
supply current drawn from DRAIN

pin
VCCpin charging current V

no auxiliary supply; V
with auxiliary supply; V

>60V −6 −4 −3mA

drain

>60V − 1.5 2 mA

drain

>60V − 30 125 µA

drain

VCC start voltage 9 9.5 10 V
VCC stop voltage (under voltage

7.0 7.5 8.0 V

lock-out)

Pulse width modulator

δ
δ

min
max

minimum duty factor − 0 − %
maximum duty factor f = 100 kHz − 75 − %

SOPS

V

demag

demagnetization recognition

50 100 150 mV

voltage level

t

suppr

suppression of transformer ringing

1.0 1.5 2.0 µs

at start of secondary stroke

RC oscillator

V

RC(min)

minimum voltage of RC oscillator

60 75 90 mV

setting

V

RC(max)

maximum voltage of RC oscillator

2.4 2.5 2.6 V

setting

t

RC(ch)

f

osc

RC charging time − 1 −µs
frequency range of oscillator 10 100 200 kHz

2000 Sep 08 10

Philips Semiconductors Product specification

STARplug

TM

TEA152x family

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Duty factor regulator (pin REG)

V

REG

G

V(erroramp)

V

REG(clamp)

input voltage 2.4 2.5 2.6 V
voltage gain of error amplifier − 20 − dB
clamping voltage at pin REG I

=6mA −−7.5 V

REG

Valley switching (not implemented in TEA152xAJM versions)

dV/dt
f

valley

valley

dV/dt for valley recognition −102 − 102 V/µs
ringing frequency for valley

N × Vo= 100 V 200 550 800 kHz

switching

t

d(valley-swon)

delay from valley recognition to

− 150 − ns

switch-on

Current and short circuit winding protection

V

source(max)

t

d(propagation)

maximum source voltage dV/dt = 0.1 V/µs 0.47 0.50 0.53 V
delay from detecting V

SRC(max)

to

dV/dt = 0.5 V/µs − 160 185 ns

switch-off

V

swp

short circuit winding protection

dV/dt = 0.5 V/µs 0.7 0.75 0.8 V

voltage

t

leb

blanking time for current and short

250 350 450 ns

circuit winding protection

Output stage (FET)

I

L(drain)

V

(BR)drain

R

DS(on)

t

drain(f)

drain leakage current V

= 650 V −−125 µA

drain

drain breakdown voltage Tj>0°C 650 −−V
drain-source on-state resistance

of TEA1520
drain-source on-state resistance

of TEA1521
drain-source on-state resistance

of TEA1522
drain-source on-state resistance

of TEA1523
drain-source on-state resistance

of TEA1524
drain fall time Vi= 300 V; no external capacitor at

Tj=25°C; I
T

= 100 °C; I

j

T

=25°C; I

j

T

= 100 °C; I

j

T

=25°C; I

j

= 100 °C; I

T

j

T

=25°C; I

j

= 100 °C; I

T

j

T

=25°C; I

j

= 100 °C; I

T

j

= −0.06 A − 48 55.2 Ω

source

= −0.06 A − 68 78.2 Ω

source

= −0.125 A − 24 27.6 Ω

source

= −0.125 A − 34 39.1 Ω

source

= −0.25 A − 12 13.8 Ω

source

= −0.25 A − 17 19.6 Ω

source

= −0.5 A − 6.5 7.5 Ω

source

= −0.5 A − 9.0 10.0 Ω

source

= −1.0 A − 3.4 3.9 Ω

source

= −1.0 A − 4.8 5.5 Ω

source

− 75 − ns

drain

Temperature protection

T

prot(max)

T

prot(hys)

maximum temperature threshold 150 160 170 °C
hysteresis temperature − 2 −°C

2000 Sep 08 11

Philips Semiconductors Product specification

STARplug

TM

APPLICATION INFORMATION

handbook, full pagewidth

mains

R1

CF1

R4

R3

LF

C

VCC

R

C

RC

CF2

RC

V

CC

GND

RC

REG

R2

1

2

TEA152xP

3

4

D2

DRAIN

8

n.c.

7

SOURCE

6

AUX

5

Z1
D1

R

R

AUX

TEA152x family

D5

C5

C6 - Ycap

I

V

o

Fig.7 Primary sensed application; configuration for TEA152xP.

Further application information can be found in the TEA152x application notes.

MGT425

2000 Sep 08 12

Philips Semiconductors Product specification

STARplug

TM

PACKAGE OUTLINES

DIP8: plastic dual in-line package; 8 leads (300 mil)

D

seating plane

A

L

Z

e

b

8

1

w M

b

1

b

2

5

TEA152x family

SOT97-1

M

E

A

2

A

c

(e )

1

M

H

pin 1 index

E

1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

max.

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

SOT97-1

12

min.

max.

050G01 MO-001 SC-504-8

b

1.73

0.53

1.14

0.38

0.068

0.021

0.045

0.015

IEC JEDEC EIAJ

b

1

1.07

0.89

0.042

0.035

4

0 5 10 mm

scale

b

2

0.36

0.23

0.014

0.009

REFERENCES

(1) (1)

cD E e M

9.8

9.2

0.39

0.36

6.48

6.20

0.26

0.24

L

e

1

M

3.60

8.25

3.05

7.80

0.14

0.32

0.12

0.31

EUROPEAN

PROJECTION

E

10.0

0.39

0.33

H

8.3

w

max.

0.2542.54 7.62

1.154.2 0.51 3.2

0.010.10 0.30

0.0450.17 0.020 0.13

ISSUE DATE

95-02-04
99-12-27

(1)

Z

2000 Sep 08 13

Philips Semiconductors Product specification

STARplug

TM

SO14: plastic small outline package; 14 leads; body width 3.9 mm

D

c

y

Z

14

8

TEA152x family

SOT108-1

E

H

E

A

X

v M

A

pin 1 index

1

e

0 2.5 5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

1.75

0.069

A

0.25

0.10

0.010

0.004

1

A2A

1.45

1.25

0.057

0.049

0.25

0.01

b

3

p

0.49

0.25

0.36

0.19

0.019

0.0100

0.014

0.0075

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1)

cD

8.75

8.55

0.35

0.34

7

w M

b

p

scale

eHELLpQZywv θ

4.0

1.27

3.8

0.16

0.050

0.15

6.2

5.8

0.244

0.228

A

2

1.05

0.041

Q

A

1

detail X

1.0

0.7

0.4

0.6

0.028

0.039

0.024

0.016

(A )

L

p

L

0.25

0.01 0.004

A

3

θ

0.25 0.1

0.01

(1)

0.7

0.3

0.028

0.012

o

8

o

0

OUTLINE

VERSION

SOT108-1

IEC JEDEC EIAJ

076E06 MS-012

REFERENCES

2000 Sep 08 14

EUROPEAN

PROJECTION

ISSUE DATE

97-05-22
99-12-27

Philips Semiconductors Product specification

STARplug

TM

TEA152x family

DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad

q

non-concave

x

D

D

D

1

P

k

q

2

view B: mounting base side

A

2

E

h

h

1

SOT523-1

E

19

Z

DIMENSIONS (mm are the original dimensions)

(2)

UNIT b

A

p

2

2.7

mm

Notes

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.

0.80

2.3

0.65

OUTLINE

VERSION

SOT523-1

cD

0.58

0.48

(1)

(2)

D

1

13.2

6.2

12.8

5.8

IEC JEDEC EIAJ

e

1

E

3.5

b

e

h

2.54

e

(1)

D

h

14.7

3.5

14.3

w M

p

0 10 mm5

scale

e

e

1

2

3.0

1.27

5.08 4.85

REFERENCES

2.0

12.4

11.0

B

q

L

3

L

2

L

L

Qc

m

L

Lq

11.4

10.0

L

L

m

2.8

Pk

3.4

3.1

1

2

3

6.7

4.5

5.5

3.7

e

2

QE

q

q

1

1.15

17.5

0.85

16.3

EUROPEAN

PROJECTION

1

v M

(1)

v

2

3.8

3.6

w

0.8

0.3

ISSUE DATE

98-11-12
00-07-03

x

0.02

Z

1.65

1.10

2000 Sep 08 15

Philips Semiconductors Product specification

STARplug

SOLDERING
Introduction

Thistextgivesaverybriefinsighttoa complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when
through-holeandsurfacemountcomponentsaremixedon
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.

Through-hole mount packages

SOLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.

Surface mount packages

REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
totheprinted-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

TM

stg(max)

). If the

TEA152x family

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

WAVE SOLDERING
Conventional single wave soldering is not recommended

forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

MANUAL SOLDERING
Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

2000 Sep 08 16

Philips Semiconductors Product specification

STARplug

TM

TEA152x family

Suitability of IC packages for wave, reflow and dipping soldering methods

SOLDERING METHOD

MOUNTING PACKAGE

Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable

WAVE REFLOW

(2)

− suitable

(1)

DIPPING

Surface mount BGA, LFBGA, SQFP, TFBGA not suitable suitable −

HBCC, HLQFP, HSQFP, HSOP, HTQFP,

not suitable

(3)

suitable −

HTSSOP, SMS

(4)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

, SO, SOJ suitable suitable −

(4)(5)

suitable −

(6)

suitable −

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2000 Sep 08 17

Philips Semiconductors Product specification

STARplug

DATA SHEET STATUS

DATA SHEET STATUS

Objective specification Development This data sheet contains the design target or goal specifications for

Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be

Product specification Production This data sheet contains final specifications. Philips Semiconductors

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DEFINITIONS
Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseoratany other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythatsuchapplicationswillbe
suitable for the specified use without further testing or
modification.

TM

PRODUCT

STATUS

DEFINITIONS

product development. Specification may change in any manner without
notice.

published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.

reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.

DISCLAIMERS
Life support applications  These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusingorsellingtheseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseofanyoftheseproducts,conveysnolicenceortitle
under any patent, copyright, or mask work right to these
products,andmakes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

TEA152x family

(1)

2000 Sep 08 18

Philips Semiconductors Product specification

STARplug

TM

TEA152x family

NOTES

2000 Sep 08 19

Philips Semiconductors – a w orldwide compan y

Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PTPhilips DevelopmentCorporation,Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS,ViaCasati,23 - 20052 MONZA (MI),
Tel. [phone], Fax [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

2000

Internet: http://www.semiconductors.philips.com

70

Printed in The Netherlands 613502/01/pp20 Date of release: 2000 Sep 08 Document order number: 9397 750 07242