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TEA1506T
Datasheet (Philips)
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Datasheet TEA1506P, TEA1506AP, TEA1506T, TEA1506AT Datasheet (Philips)

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Page 1
查询TEA1506供应商
INTEGRATED CIRCUITS
DATA SH EET
TEA1506P; TEA1506AP; TEA1506T; TEA1506AT
GreenChipII SMPS control IC
Product specification 2003 Sep 09
Page 2
GreenChipII SMPS control IC
FEATURES Distinctive features
• Universal mains supply operation (70 to 276 V AC)
• High level of integration; giving a low external
component count.
Green features
• Valley or zero voltage switching for minimum switching losses
• Efficient quasi-resonant operation at high power levels
• Frequency reductionat low power standby for improved system efficiency (≤3W)
• Cycle skipping mode at very low loads.
Protection features
• Safe restart mode for system fault conditions
• Continuous mode protection by means of
demagnetization detection (zero switch-on current)
• Accurateand adjustable overvoltage protection(latched in TEA1506; safe restart in TEA1506A)
• Short winding protection
• Undervoltage protection (foldback during overload)
• Overtemperature protection
• Low and adjustable overcurrent protection trip level
• Soft (re)start.
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
APPLICATIONS
Besides typical application areas, i.e. TV and monitor supplies, the devicecan be usedin adapters andchargers and all applications that demand an efficient and cost-effective solution up to 150 W. Unlike the other GreenChipII control ICs, the TEA1506 has no internal high voltage start-up source and needs to be started by means of an external bleeder resistor.
1
2
TEA1506P
TEA1506AP
3
4
8
7
6
5
2003 Sep 09 2
MDB504
Fig.1 Basic application diagram.
Page 3
GreenChipII SMPS control IC
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GENERAL DESCRIPTION
The GreenChip Switched Mode Power Supply (SMPS) control ICs. A high level of integration leads to a cost effective power supply with a low number of external components.
(1) GreenChip is a trademark of Koninklijke Philips
Electronics N.V.
ORDERING INFORMATION
TYPE NUMBER
TEA1506P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 TEA1506AP TEA1506T SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 TEA1506AT
(1)
II is the second generation of green
NAME DESCRIPTION VERSION
The special built-in green functions allow the efficiency to be optimum at all power levels. This holds for quasi-resonant operation at high power levels, as well as fixed frequency operation with valley switching at medium power levels. At low power (standby) levels, the system operates at a reduced frequency and with valley detection.
Highly efficient and reliable supplies can easily be designed using the GreenChipII control IC.
PACKAGE
2003 Sep 09 3
Page 4
GreenChipII SMPS control IC
BLOCK DIAGRAM
4
DEM
(7)
OVER-
VOLTAGE
DRAIN
8
(14)
prot(DEM)
I
clamp
DRIVER
6
(11)
DRIVER
PROTECTION
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
sense
I
5
(9)
0.5 V
ss
I
S2
soft
start
OVERPOWER
0.88 V
LEB
blank
OCP
short
winding
MDB505
PROTECTION
, full pagewidth
SUPPLY
MANAGEMENT
VALLEY
UVLO start
supply
internal
100
LOGIC
VOLTAGE
OSCILLATOR
CONTROLLED
mV
UP/DOWN
COUNTER
CONTROL
FREQUENCY
LOGIC
SQ
RESET
POWER-ON
−1
3.8 V
Q R
UVLO
SQ
< 4.5 V
CC
V
OVER-
TEMPERATURE
Q R
or UVLO
(TEA1506AT)
PROTECTION
ON-TIME
MAXIMUM
PROTECTION
Fig.2 Block diagram.
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2003 Sep 09 4
prot(CTRL)
I
3
1
(2)
CC
V
2
(3)
GND
(6)
CTRL
TEA1506P;
(TEA1506T;
TEA1506AP
TEA1506 AT)
Pin numbers in parenthesis represent the SO version.
Page 5
GreenChipII SMPS control IC
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
PINNING
SYMBOL
V
CC
GND 2 3 ground CTRL 3 6 control input DEM 4 7 input from auxiliary winding for demagnetization timing; overvoltage and
I
sense
DRIVER 6 11 gate driver output HVS 7 12, 13 high voltage safety spacer; not connected DRAIN 8 14 drain of external MOS switch; input for valley sensing and initial internal
n.c. − 1, 4, 5, 8,10not connected
PIN
DESCRIPTION
DIP8 SO14
1 2 supply voltage
overpower protection
5 9 programmable current sense input
supply
handbook, halfpage
V
CC
GND
CTRL
DEM
1 2
TEA1506P
TEA1506AP
3 4
MDB506
8 7 6 5
DRAIN HVS DRIVER I
sense
Fig.3 Pin configuration DIP8.
handbook, halfpage
n.c.
V
CC
GND
n.c. n.c.
CTRL
DEM
1 2 3 4
TEA1506AT
5 6 7
TEA1506T
MDB507
14 13 12 11 10
9 8
DRAIN HVS HVS DRIVER n.c. I
sense
n.c.
Fig.4 Pin configuration SO14.
2003 Sep 09 5
Page 6
GreenChipII SMPS control IC
FUNCTIONAL DESCRIPTION
The TEA1506 is the controller of a compact flyback converter, and is situated at the primary side. An auxiliary winding of the transformer provides demagnetization detection and powers the IC after start-up.
The TEA1506 can operate in multi modes (see Fig.5).
handbook, halfpage
(kHz)
f
VCO fixed quasi resonant
175
25
Fig.5 Multi modes operation.
MGU508
P (W)
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
V
handbook, halfpage
sense(max)
0.52 V
Fig.6 V
sense(max)
1 V
(typ)
1.5 V (typ)
voltage as function of V
The moment the voltage on pin VCC drops below the undervoltage lock-out level, the IC stops switching and re-enters the safe restart mode.
Supply management
MGU233
V
CTRL
CTRL
.
The next converter stroke is started only after demagnetization of the transformer current (zero current switching), while the drain voltage has reached the lowest voltage to prevent switching losses (green function). The primary resonant circuit of the primary inductance and draincapacitorensuresthis quasi-resonant operation. The design can be optimized in such a way that zero voltage switching can be reached over almostthe universal mains range.
To prevent very high frequency operation at lower loads, the quasi-resonant operation changes smoothly in fixed frequency PWM control.
At very low power (standby) levels, the frequency is controlled down, via the VCO, to a minimum frequency of approximately 25 kHz.
Start-up and undervoltage lock-out
Initially the IC is in the save restart mode. As long as V is below the V
level, the supply current is nearly
CC(start)
CC
zero. TheIC will activate theconverteras soon as the voltageon
pin VCC passes the V
CC(start)
level.
The IC supply is taken over by the auxiliary winding as soon as the output voltage reaches its intended level.
All (internal) reference voltages are derived from a temperature compensated, on-chip band gap circuit.
Current mode control
Current mode control is used for its good line regulation behaviour.
The ‘on-time’ iscontrolled by theinternally inverted control voltage, which is compared with the primary current information. The primary current is sensed across an external resistor. The driver output is latched in the logic, preventing multiple switch-on.
The internal control voltage is inverselyproportional to the external control pin voltage, with an offset of 1.5 V. This means that a voltage range from 1 to 1.5 V on pin CTRL will result in an internal control voltage range from
0.5 to 0 V (a high external control voltage results in a low duty cycle).
Oscillator
The maximum fixed frequency of the oscillator isset by an internal current source and capacitor. The maximum frequency is reduced once the control voltage enters the VCO control window. Then, the maximum frequency changeslinearly with thecontrol voltage untilthe minimum frequency is reached (see Figs 6 and 7).
2003 Sep 09 6
Page 7
GreenChipII SMPS control IC
handbook, halfpage
f
(kHz)
175
25
VCO
VCO
2
level
level
Fig.7 VCO frequency as function of V
handbook, full pagewidth
1
MGU509
175 kHz
V
sense(max) (V)
sense(max)
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
Cycle skipping
At very low power levels, a cycle skipping mode will be activated. A high control voltage will reduce the switching frequency to a minimum of 25 kHz. If the voltage on the control pin is raised even more, switch-on of the external power MOSFET will be inhibited until the voltage on the control pin has dropped to a lower value again (see Fig.8).
For system accuracy, it is not the absolute voltage on the control pin that will trigger the cycle skipping mode, but a signal derived from the internal VCO will be used.
Remark: If the no-load requirement of the system is such
.
that the output voltage can be regulated to its intended level at a switching frequency of 25 kHz or above, the cycle skipping mode will not be activated.
f
osc
1.5 V − V
CTRL
CTRL
X2
V
x
150 mV
The voltage levels dV1 and dV2 are fixed in the IC to 50 mV (typical) and 18 mV (typical) respectively.
current
comparator
V
I
DRIVER
OSCILLATOR
DRIVER
I
sense
f
max
f
min
cycle
skipping
1
0
Fig.8 The cycle skipping circuitry.
dV
2
dV
1
150
Vx (mV)
MGU510
Vx (mV)
2003 Sep 09 7
Page 8
GreenChipII SMPS control IC
Demagnetization
The system will be in discontinuous conduction mode all the time. The oscillator will not start a new primary stroke until the secondary stroke has ended.
Demagnetization features a cycle-by-cycle output short-circuit protection by immediately lowering the frequency (longer off-time), thereby reducing the power level.
Demagnetizationrecognition is suppressedduringthe first t
time. This suppression may be necessary in
suppr
applications where the transformer has a large leakage inductance, at low output voltages and at start-up.
If pin DEM is open-circuit or not connected, a fault condition is assumed and the converter will stop operating immediately. Operation will recommence as soon as the fault condition is removed.
Minimum and maximum ‘on-time’
The minimum ‘on-time’ of the SMPS is determined by the Leading Edge Blanking (LEB) time. The IC limits the ‘on-time’ to 50 µs. When the system desires an ‘on-time’ longer than 50 µs, a fault condition is assumed (e.g. removed Ciin Fig.12), the IC will stop switching and enter the safe restart mode.
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
Regarding the TEA1506, the IC will not start switching again. Subsequently, VCC will drop again to the UVLO level, etc. Operation only recommenceswhen the VCCvoltage drops below a level of about 4.5 V.
Regardingthe TEA1506A, when theV switching starts again (safe restart mode) when the V level is reached. This process is repeated as long as the OVP condition exists.
Theoutput voltage V
atwhich the OVPfunctiontrips,
o(OVP)
can be set by the demagnetization resistor, R
V
N
----------­N
=
o OVP()
s
I
(OVP)(DEM)RDEM
aux
× V
+{}
clamp(DEM)(pos)
where Nsis the number of secondary turnsand N number of auxiliary turns of the transformer.
Current I
(OVP)(DEM)
The value of R
is internally trimmed.
can be adjusted to the turns ratio of the
DEM
transformer, thus making an accurate OVP possible.
levelis reached,
start
DEM
:
aux
start
is the
OverVoltage Protection (OVP)
An OVP mode is implemented in the GreenChip series. This works for the TEA1506 by sensing the auxiliary voltage via the current flowing into pin DEM during the secondary stroke. The auxiliary winding voltage is a well-defined replica of the output voltage. Any voltage spikes are averaged by an internal filter.
Ifthe output voltage exceedstheOVP trip level, aninternal counter starts counting subsequent OVP events. The counter has been added to prevent incorrect OVP detections which might occur during ESD or lightning events. If the output voltage exceeds the OVP trip level a fewtimes and notagain in asubsequent cycle, theinternal counter will count down with twice the speed compared with counting-up. However, when typical 10 cycles of subsequent OVP events are detected, the IC assumes a true OVP and the OVP circuit switches the power MOSFET off. Next, the controller waits until the UVLO level is reached on pin VCC. When VCC drops to UVLO, capacitor C
will be recharged to the V
VCC
start
level.
2003 Sep 09 8
Page 9
GreenChipII SMPS control IC
Valley switching
A new cycle starts when the power MOSFET is switched on (see Fig.9). After the ‘on-time’ (which is determined by the ‘sense’ voltage and the internal control voltage), the switchis opened andthesecondary stroke starts.Afterthe secondary stroke, the drain voltage shows an oscillation
primary
stroke
1
pCd
×()×
secondary
stroke
with a frequency of approximately
----------------------------------------------­2 π× L
where L
is the primary self inductance of the transformer
p
and Cd is the capacitance on the drain node. As soon as the oscillator voltage is high again and the
secondary stroke has ended, the circuit waits for the
handbook, full pagewidth
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
lowest drain voltage before starting a new primary stroke. This method is called valley detection. Figure 9 shows the drain voltage together with the valley signal, the signal indicating the secondary stroke and the oscillator signal.
In an optimum design, the reflected secondary voltage on the primary side will force the drain voltage to zero. Thus, zero voltage switching is very possible, preventing large
1

P
capacitive switching losses
-- -

2
and allowing high frequency operation, which results in small and cost effective inductors.
secondary
ringing
2
CV
× f××=
drain
valley
secondary
stroke
oscillator
BA
MGU235
A: Start of new cycle at lowest drain voltage. B: Start of new cycle in a classical PWM system at high drain voltage.
Fig.9 Signals for valley switching.
2003 Sep 09 9
Page 10
GreenChipII SMPS control IC
MGU236
handbook, halfpage
−100 µA (typ)
I
DEM
−24 µA (typ)
Fig.10 OPP correction curve.
OverCurrent Protection (OCP)
The cycle-by-cycle peak drain current limit circuit uses the externalsource resistor to measurethecurrent accurately. This allows optimum size determination of the transformer core (cost issue). The circuit is activated after the leading edge blanking time, t
. The OCP circuit limits the ‘sense’
leb
voltage to an internal level.
V
sense(max)
0.52 V (typ)
0.3 V (typ)
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
Short winding protection
After the leading edge blanking time, the short winding protection circuit is activated. If the ‘sense’ voltage exceeds the short winding protection voltage V converter will stop switching. Once VCC drops below the UVLO level, capacitor C
will be recharged and the
VCC
supply will restart again. This cycle will be repeated until the short-circuit is removed (safe restart mode).
The short winding protection will also protect in case of a secondary diode short-circuit.
OverTemperature Protection (OTP)
An accurate temperature protection is provided in the circuit. When the junction temperature exceeds the thermal shutdown temperature, the IC will enter the safe restart mode.
When the V
level is reached, switching starts again.
start
This process is repeated as long as the OTP condition exists.
swp
, the
OverPower Protection (OPP)
Duringthe primary stroke,the rectified mainsinput voltage is measured by sensing the current drawn from pin DEM. This current is dependent on the mains voltage, according
to the following formula:
N
where:
N
=
-----------­N
aux
p
I
V
≈≈
-------------- -
DEM
R
DEM
aux
×
NV
mains
-------------------------­R
DEM
The current information is used to adjust the peak drain current, which is measured via pin I
. The internal
sense
compensation is such that an almost mains independent maximum output power can be realized.
The OPP curve is given in Fig.10.
2003 Sep 09 10
Page 11
GreenChipII SMPS control IC
Control pin protection
If pin CTRL is open-circuit or not connected, a fault conditionis assumed and theconverter will stop switching. Operation will recommence as soon as the fault condition is removed.
Soft start-up
To prevent transformer rattle during hiccup, the transformer peak current is slowly increased by the soft start function. This can be achieved by inserting a resistor and a capacitor between pin I (see Fig.11). An internal current source charges the capacitor to V = ISS× RSS, with a maximum of approximately 0.5 V.
The start level and the time constant of the increasing primary current level can be adjusted externally by changing the values of RSS and CSS.
V
I
primary(max)
τ R
SSCSS
ocpISSRSS
=
---------------------------------------------- -
×=
The charging currentI pin I pin I
is below approximately 0.5 V. If the voltage on
sense
exceeds 0.5 V, the soft start current source will
sense
×()–
R
sense
will flow aslong as the voltage on
SS
start limiting the current ISS. At the V current source is completely switched off.
Since the soft start current ISSis supplied from pin DRAIN, the RSSvalue will not affect the VCCcurrent during start-up.
and the sense resistor
sense
level, the I
CC(start)
SS
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
handbook, halfpage
I
SS
0.5 V
Driver
The driver circuit to the gate of the power MOSFET has a current sourcing capabilityof 135 mA typical and a current sink capability of 560 mA typical. This permits fast turn-on and turn-off of the power MOSFET for efficient operation.
A low driver source current has been chosen to limit the ∆V/∆t at switch-on. This reduces Electro Magnetic Interference (EMI) and also limits the current spikes across R
sense
.
start-up
R
I
sense
5
V
ocp
C
Fig.11 Soft start.
SS
SS
R
sense
MGU237
2003 Sep 09 11
Page 12
GreenChipII SMPS control IC
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); note 1.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Voltages
V
CC
V
CTRL
V
DEM
V
sense
V
DRAIN
Currents
I
CTRL
I
DEM
I
sense
I
DRIVER
I
DRAIN
General
P
tot
T
stg
T
j
V
esd
supply voltage continuous −0.4 +20 V voltage on pin CTRL −0.4 +5 V voltage on pin DEM current limited −0.4 − V voltage on pin I
sense
current limited −0.4 − V
voltage on pin DRAIN −0.4 +650 V
current on pin CTRL − 5mA current on pin DEM −250 +250 µA current on pin I
sense
−1 +10 mA current on pin DRIVER d < 10 % −0.8 +2 A current on pin DRAIN − 5mA
total power dissipation T
<70°C − 0.75 W
amb
storage temperature −55 +150 °C operating junction temperature −20 +145 °C electrostatic discharge voltage
all pins except pins DRAIN and V pins DRAIN and V
CC
HBM class 1; note 2 − 2000 V
CC
HBM class 1; note 2 − 1500 V
any pin MM; note 3 − 400 V
Notes
1. All voltages are measured with respect to ground; positive currents flow into the IC; pin VCC may not be current driven. The voltage ratings are valid provided other ratings are not violated; current ratings are valid provided the maximum power rating is not violated.
2. Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.
3. Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω resistor.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
thermal resistance from junction to
in free air 100 K/W
ambient
QUALITY SPECIFICATION
In accordance with
‘SNW-FQ-611-D’
.
2003 Sep 09 12
Page 13
GreenChipII SMPS control IC
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
CHARACTERISTICS
T
=25°C; VCC= 15 V; all voltages are measured with respect to ground; currents are positive when flowing into
amb
the IC; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Start-up current source (pin DRAIN)
I
DRAIN
BV
DSS
Supply voltage management (pin VCC)
V
CC(start)
V
CC(UVLO)
V
CC(hys)
I
CC(oper)
I
CC(start)
I
CC(protection)
Demagnetization management (pin DEM)
V
th(DEM)
I
prot(DEM)
V
clamp(DEM)(neg)
V
clamp(DEM)(pos)
t
suppr
Pulse width modulator
t
on(min)
t
on(max)
Oscillator
f
osc(l)
f
osc(h)
V
vco(start)
V
vco(nom)
Duty cycle control (pin CTRL)
V
CTRL(min)
V
CTRL(max)
I
prot(CTRL)
supply current drawn from pin DRAIN
VCC< V V
CC>Vstart
start
− 500 −µA
− 50 −µA
breakdown voltage 650 −−V
start-up voltage on V
CC
undervoltage lock-out on V hysteresis voltage on V
CC
supply current under normal
CC
V
CC(start)
− V
CC(UVLO)
no load on pin DRIVER 1.1 1.3 1.5 mA
10.3 11 11.7 V
8.1 8.7 9.3 V
2.0 2.3 2.6 V
operation supply current in start-up and safe
VCC<V
start
(1)
0
− 70 µA
restart mode supply current while not switching VCC>V
demagnetization comparator
UVLO
− 0.85 − mA
50 100 150 mV
threshold voltage on pin DEM protection current on pin DEM V negative clamp voltage on pin DEM I positive clamp voltage on pin DEM I suppression of transformer ringing
=50mV −50
DEM
= −150 µA −0.5 −0.25 −0.05 V
DEM
= 250 µA 0.5 0.7 0.9 V
DEM
(2)
−−10 nA
1.1 1.5 1.9 µs
at start of secondary stroke
minimum on-time − t
leb
− ns
maximum on-time latched 40 50 60 µs
oscillator low fixed frequency V oscillator high fixed frequency V peak voltage on pin I
sense
; where
> 1.5 V 20 25 30 kHz
CTRL
< 1 V 145 175 205 kHz
CTRL
see Figs 7 and 8 − VCO
1
− mV
frequency reduction starts peak voltage on pin I
the frequency is equal to f
minimum voltage on pin CTRL for
sense
; where
osc(l)
− VCO1− 50 − mV
− 1.0 − V
maximum duty cycle maximum voltage on pin CTRL for
− 1.5 − V
minimum duty cycle protection current on pin CTRL V
= 1.5 V −1
CTRL
(2)
−0.8 −0.5 µA
2003 Sep 09 13
Page 14
GreenChipII SMPS control IC
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Valley switch (pin DRAIN)
∆V/∆t
valley
t
valley-swon
Overcurrent and short winding protection (pin I
V
sense(max)
t
PD
V
swp
t
leb
I
SS
Overvoltage protection (pin DEM)
I
OVP(DEM)
Overpower protection (pin DEM)
I
OPP(DEM)
I
OPP50%(DEM)
Driver (pin DRIVER)
I
source
I
sink
V
o(max)
Overtemperature protection
T
prot(max)
T
prot(hys)
valley recognition voltage change −85 −+85 V/µs delay from valley recognition to
− 150
(2)
− ns
switch-on
)
sense
maximum source voltage OCP ∆V/∆t = 0.1 V/µs 0.48 0.52 0.56 V propagating delay from detecting
V
sense(max)
to switch-off
∆V/∆t = 0.5 V/µs − 140 185 ns
short winding protection voltage 0.83 0.88 0.96 V blanking time for current and short
300 370 440 ns
winding protection soft start current V
OVP level on pin DEM set by resistor R
< 0.5 V 45 60 75 µA
sense
;
DEM
54 60 66 µA see Section “OverVoltage Protection (OVP)”
OPP current on pin DEM to start OPP correction
set by resistor R see Section
DEM
;
−−24 −µA
“OverPower Protection (OPP)”
OPP current on pin DEM; where
−−100 −µA maximum source voltage is limited to 0.3 V
source current capability of driver VCC= 9.5 V;
V
DRIVER
=2V
sink current capability of driver VCC= 9.5 V;
maximum output voltage of the
V V
V VCC> 12 V − 11.5 12 V
DRIVER
= 9.5 V;
CC DRIVER
=2V
= 9.5 V
−−135 − mA
− 240 − mA
− 560 − mA
driver
maximum temperature protection
130 140 150 °C
level hysteresis for the temperature
− 8
(2)
−°C
protection level
Notes
1. For VCC≥ 2V.
2. Guaranteed by design.
2003 Sep 09 14
Page 15
GreenChipII SMPS control IC
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
APPLICATION INFORMATION
A converterwith the TEA1506consists of aninput filter, atransformer with athird winding (auxiliary), and an output stage with a feedback circuit.
Capacitor C via the auxiliary winding during operation.
A sense resistor converts the primary current into a voltage at pin I maximum primary peak current.
handbook, full pagewidth
(at pin VCC) buffers the supply voltage of the IC, which is powered via the resistor RSduring start-up and
VCC
. The value of this sense resistor defines the
sense
V
mains
i
C
i
D
o
V
oV
C
C
R
VCC
CTRL
CTRL
R
S
V
CC
GND
CTRL
DEM
1
2
TEA1506P
TEA1506AP
3
4
R
DEM
DRAIN
8
HVS
7
DRIVER
6
I
5
sense
n.c.
N
N
p
power MOSFET
R
SS
C
SS
R
N
sense
aux
D
micro
C
s
C
o
V
µC
micro
MICRO-
CONTROLLER
R
reg1
R
reg2
MDB508
Fig.12 Flyback configuration with secondary sensing.
2003 Sep 09 15
Page 16
GreenChipII SMPS control IC
handbook, full pagewidth
V
i
V
D
(power
MOSFET)
V
i
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
V
V
gate
V
V
CC
µC
o
start-up
sequence
normal
operation
overvoltage
protection
(TEA1506AP/TEA1506AT)
output
short-circuit
normal
operation
MDB509
Fig.13 Typical waveforms.
2003 Sep 09 16
Page 17
GreenChipII SMPS control IC
PACKAGE OUTLINES
DIP8: plastic dual in-line package; 8 leads (300 mil)
D
seating plane
A
L
Z
e
b
8
1
w M
b
1
b
2
5
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
SOT97-1
M
E
A
2
A
c
(e )
1
M
H
pin 1 index
E
1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
max.
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
SOT97-1
12
min.
max.
050G01 MO-001 SC-504-8
b
1.73
1.14
0.068
0.021
0.045
0.015
IEC JEDEC JEITA
b
1
0.53
0.38
4
0 5 10 mm
scale
b
2
0.36
1.07
0.23
0.89
0.014
0.042
0.009
0.035
REFERENCES
(1) (1)
cD E e M
9.8
6.48
9.2
6.20
0.39
0.26
0.36
0.24
L
e
1
M
3.60
8.25
3.05
7.80
0.14
0.32
0.12
0.31
EUROPEAN
PROJECTION
E
10.0
0.39
0.33
H
8.3
w
max.
0.2542.54 7.62
ISSUE DATE
0.010.1 0.3
99-12-27 03-02-13
1.154.2 0.51 3.2
0.0450.17 0.02 0.13
(1)
Z
2003 Sep 09 17
Page 18
GreenChipII SMPS control IC
SO14: plastic small outline package; 14 leads; body width 3.9 mm
D
c
y
Z
14
8
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
SOT108-1
E
H
E
A
X
v M
A
A
2
pin 1 index
4.0
3.8
0.16
0.15
7
w M
b
p
scale
eHELLpQZywv θ
6.2
1.27
5.8
0.244
0.05
0.228
1
e
0 2.5 5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
mm
inches
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
A
max.
1.75
0.069
A
1
0.25
0.10
0.010
0.004
A
2
1.45
1.25
0.057
0.049
A3b
0.25
0.01
p
0.49
0.36
0.019
0.014
0.25
0.19
0.0100
0.0075
(1)E(1)
cD
8.75
8.55
0.35
0.34
A
1.05
0.041
Q
1
detail X
1.0
0.7
0.4
0.6
0.028
0.039
0.024
0.016
(A )
L
p
L
0.25
0.01 0.004
A
3
θ
0.25 0.1
0.01
(1)
0.7
0.3
0.028
0.012
o
8
o
0
OUTLINE VERSION
SOT108-1
IEC JEDEC JEITA
076E06 MS-012
REFERENCES
2003 Sep 09 18
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27 03-02-19
Page 19
GreenChipII SMPS control IC
SOLDERING Introduction
Thistext gives a very briefinsightto a complex technology. A more in-depth account of soldering ICs can be found in our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011). There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when through-holeandsurfacemountcomponentsare mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing.
Through-hole mount packages
SOLDERING BY DIPPING OR BY SOLDER WAVE
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept:
• below 220 °C (SnPb process) or below 245 °C (Pb-free process)
– for all the BGA and SSOP-T packages – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a
volume ≥ 350 mm3 so called thick/large packages.
• below 235 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.
Thetotalcontact time of successive solderwavesmustnot exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
Surface mount packages
REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied tothe printed-circuit board byscreen printing, stencilling or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and
stg(max)
). If the
WAVE SOLDERING Conventional single wave soldering is not recommended
forsurfacemount devices (SMDs) or printed-circuitboards with a high component density, as solder bridging and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically developed.
If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• Forpackageswith leads on four sides,thefootprintmust be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.
During placement andbefore soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
2003 Sep 09 19
Page 20
GreenChipII SMPS control IC
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Suitability of IC packages for wave, reflow and dipping soldering methods
MOUNTING PACKAGE
(1)
Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable Through-hole-
PMFP
(9)
surface mount Surface mount BGA, LBGA, LFBGA, SQFP, SSOP-T
TFBGA, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSQFP,
HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS
(6)
PLCC
, SO, SOJ suitable suitable − LQFP, QFP, TQFP not recommended SSOP, TSSOP, VSO, VSSOP not recommended
MANUAL SOLDERING Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
not suitable not suitable −
(4)
,
not suitable suitable −
not suitable
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
SOLDERING METHOD
WAVE REFLOW
(3)
(5)
− suitable
suitable −
(6)(7)
suitable −
(8)
suitable −
(2)
DIPPING
Notes
1. Formore detailed information ontheBGA packages refertothe
“(LF)BGAApplication Note
”(AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.
5. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface.
6. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners.
7. Wave soldering is suitable for LQFP,QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
8. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
9. Hot bar soldering or manual soldering is suitable for PMFP packages.
2003 Sep 09 20
Page 21
GreenChipII SMPS control IC
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
DATA SHEET STATUS
LEVEL
I Objective data Development This data sheet contains data from the objective specification for product
II Preliminary data Qualification This data sheet contains data from the preliminary specification.
III Product data Production This data sheet contains data from the product specification. Philips
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
3. For data sheets describing multiple type numbers,the highest-levelproduct statusdetermines thedata sheet status.
DATA SHEET
STATUS
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
(1)
PRODUCT
STATUS
(2)(3)
DEFINITION
development. Philips Semiconductors reserves the right to change the specification in any manner without notice.
Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product.
Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
DEFINITIONS Short-form specification The data in a short-form
specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device atthese or at anyotherconditionsabove those given inthe Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make norepresentationorwarranty that such applications willbe suitable for the specified use without further testing or modification.
DISCLAIMERS Life support applications These products are not
designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result inpersonal injury. Philips Semiconductorscustomersusingor selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes  Philips Semiconductors reserves the right to make changes in the products ­including circuits, standard cells, and/or software ­described or contained herein in order to improve design and/or performance. Whenthe product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2003 Sep 09 21
Page 22
Philips Semiconductors – a w orldwide compan y
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands 613502/01/pp22 Date of release: 2003 Sep 09 Document order number: 9397 750 11434
SCA75
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