Datasheet STTH102A Datasheet (SGS Thomson Microelectronics)

®

HIGH EFFICIENCY ULTRAFAST DIODE

MAIN PRODUCT CHARACTERISTICS

STTH102A

I

F(AV)

V

RRM

1A

200 V

Tj (max) 175 °C

(max) 0.78 V

V

F

trr (max) 20 ns

FEATURES AND BENEFITS

Very low conduction losses

■

Negligible switching losses

■

Low forward and reverse recovery times

■

High junction temperature

■

DESCRIPTION

The STTH102A, which is using ST’s new 200V
planar technology, is specially suited for switching
mode base drive & transistor circuits.

The device is also intended for use as a free
wheeling diode in power supplies and other power
switching applications.

SMA

ABSOLUTE RATINGS (limiting values)

Symbol Parameter Value Unit

V

RRM

I

F(AV)

I

FSM

T

stg

Repetitive peak reverse voltage 200 V
Average forward current Tl = 148°C δ =0.5 1 A
Surge non repetitive forward current tp = 10 ms Sinusoidal 40 A
Storage temperature range + 175 °C

Tj Maximum operating junction temperature 175 °C

THERMAL PARAMETERS

Symbol Parameter Maximum Unit

R

th (j-l)

July 2002 - Ed: 1A

Junction to lead 30 °C/W

1/5

STTH102A

STATIC ELECTRICAL CHARACTERISTICS

Symbol Parameter Tests conditions Min. Typ. Max. Unit

I

* Reverse leakage

R

current

V

* Forward voltage drop Tj = 25°C I

F

Tj = 25°C V

R=VRRM

1 µA

Tj = 125°C 1 25

= 700 mA 0.90

F

I

= 1 A 0.97

F

Tj = 125°C I

Pulse test: * tp = 5ms, δ <2%

** tp = 380µs, δ <2%

= 1 A 0.68 0.78

F

To evaluate the maximum conduction losses use the following equation :
P=0.65xI

F(AV)

+ 0.130 I

F2(RMS)

DYNAMIC ELECTRICAL CHARACTERISTICS

Symbol Parameter Tests conditions Min. Typ. Max. Unit

trr Reverse recovery

time

tfr Forward recovery

time

V

FP

Forward recovery

Tj = 25°C IF= 0.5 A Irr = 0.25 A

IR=1A

Tj = 25°C I

=1A dIF/dt=50A/µs

F

VFR=1.1xVFmax

Tj = 25°C I

=1A dIF/dt=50A/µs 1.8 V

F

12 20 ns

50 ns

voltage

2/7

STTH102A

Fig. 1: Average forward power dissipation versus

average forward current.

P (A)F(AV)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0.0 0.2 0.4 0.6 0.8 1.0 1.2

δ = 0.05

δ = 0.1

I (A)F(AV)

δ = 0.2

δ = 0.5

δ

=tp/T

δ = 1

T

tp

Fig. 3: Relative variation of thermal impedance
junction ambient versus pulse duration (Printed
circuit board epoxy FR4).

Zth(j-a)/Rth(j-a)

1.0

0.9

0.8

0.7

0.6

δ = 0.5

0.5

0.4

δ = 0.2

0.3

δ = 0.1

0.2

0.1

Single pulse

0.0

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

tp(s)

δ

=tp/T

T

tp

Fig. 2: Average forward current versus ambient
temperature (δ = 0.5)

I (A)F(AV)

1.2

R

R

th(j-a)

th(j-a)=Rth(j-l)

=120°C/W

1.0

0.8

0.6

0.4

0.2

T (°C)amb

0.0
0 25 50 75 100 125 150 175

Fig. 4: Forward voltage drop versus forward

current.

I (A)FM

100.0

Tj=125°C

Tj=125°C

(Maximum values)

(Maximum values)

10.0

1.0

Tj=125°C

Tj=125°C

(Typical values)

(Typical values)

V (V)FM

0.1

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4

Tj=25°C

(Maximum values)

Fig. 5: Junction capacitance versus reverse
voltage applied (typical values).

C(pF)

100

10

V (V)R

1

1 10 100 1000

F=1MHz

V

osc

Tj=25°C

=30mV

Fig. 6: Reverse recovery time versus dIF/dt (90%
confidence).

t (ns)RR

70

60

50

40

30

20

10

0

1 10 100 1000

Tj=125°C

Tj=25°C

dI /dt(A/µs)F

IF=1A

=100V

V

R

3/5

STTH102A

Fig. 7: Peak reverse recovery current versus

/dt (90% confidence).

dI

F

I (A)RM

3.5

IF=1A

V

=100V

R

3.0

2.5

2.0

1.5

1.0

0.5

Tj=125°C

Tj=25°C

dI /dt(A/µs)F

0.0
1 10 100 1000

Fig. 9: Relative variations of dynamic parameters

versus junction temperature.

I ; t ; Q [Tj] / I ;t ; Q [Tj = 25°C]RM RR RR RM RR RR

3.5

3.0

2.5

2.0

1.5

1.0

IF=1A

/dt=200A/µs

dI

F

=100V

V

R

Q

RR

t

RR

I

Tj(°C)

25 50 75 100 125 150 175

RM

Fig. 8: Reverse recovery charges versus dIF/dt
(90% confidence).

Q (nC)RR

35.0

IF=1A

32.5

V

=100V

R

30.0

27.5

25.0

22.5

20.0

17.5

15.0

12.5

10.0

7.5

5.0

2.5

0.0
1 10 100 1000

Tj=125°C

Tj=25°C

dI /dt(A/µs)F

Fig. 10: Thermal resistance junction to ambient

versus copper surface under each lead (epoxy
FR4, e = 35µm).

Rth(j-a)(°C/W)

120
110
100

90
80
70
60
50
40
30
20
10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

S(cm²)

4/5

PACKAGE MECHANICAL DATA

SMA

STTH102A

DIMENSIONS

C

FOOTPRINT

E1

REF.

Millimeters Inches

Min. Max. Min. Max.

D

A1 1.90 2.70 0.075 0.106
A2 0.05 0.20 0.002 0.008

b 1.25 1.65 0.049 0.065

E

A1

A2

L

b

c 0.15 0.41 0.006 0.016
E 4.80 5.60 0.189 0.220

E1 3.95 4.60 0.156 0.181

D 2.25 2.95 0.089 0.116

L 0.75 1.60 0.030 0.063

1.65

1.45 1.45

2.40

Ordering code Marking Package Weight Base qty Delivery mode

STTH102A U12 SMA 0.07 g 5000 Tape & reel

■

Epoxy meets UL 94,V0

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