Datasheet STP9NK60ZD, STF9NK60ZD, STB9NK60ZD Datasheet (ST)

Page 1
查询STB9NK60ZD供应商
N-CHANNEL 600V - 0.85Ω - 7A TO-220/TO-220FP/D2PAK
STP9NK60ZD - STF9NK60ZD
STB9NK60ZD
ADVANCED DATA
TYPE V
STP9NK60ZD STF9NK60ZD STB9NK60ZD
TYPICAL R
VERY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
GATE CHARGE MINIMIZED
LOW INTRINSICCAPACITANCES
FAST INTERNAL RECOVERY DIODE
600 V 600 V 600 V
(on) = 0.85
DS
DSS
R
DS(on)
<0.95 <0.95 <0.95
I
D
7A 7A 7A
Pw
125 W
30 W
125 W
DESCRIPTION
The SuperFRED Mesh™ se ries associates all ad­vantages of reduced on-resistance, zener gate pro­tection and very high d v/dt capability with a Fast body-drain reco ve ry diode. Such series com ple­ments the “FDmesh™” Advanced Technology.
APPLICATIONS
HID BALLAST
ZVS PHASE-SHIFT FULL BRIDGE
CONVERTERS
TO-220 TO-220FP
3
1
D2PAK
INTERNAL SCHEMATIC DIAGRAM
3
2
1
ORDERING INFORMATION
SALES TYPE MARKING PACKAGE PACKAGING
STP9NK60ZD P9NK60ZD TO-220 TUBE STF9NK60ZD F9NK60ZD TO-220FP TUBE
STB9NK60ZDT4 B9NK60ZD
January 2004
2
PAK
D
TAPE & REEL
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STP9NK60ZD - STF9NK60ZD - STB9NK60ZD
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
TO-220 / D
Drain-source Voltage (VGS=0) Drain-gate Voltage (RGS=20kΩ)600V Gate- source Voltage ± 30 V Drain Current (continuos) at TC=25°C77(*)A Drain Current (continuos) at TC=100°C4.34.3(*)A
()
Drain Current (pulsed) 28 28 (*) A Total Dissipation at TC=25°C
I
V
DM
P
V
DGR
V
I I
TOT
DS
GS
D D
Derating Factor 1 0.24 W/°C
V
ESD(G-S)
Gate source ESD (HBM-C=100pF, R=1.5KΩ)
dv/dt (1) Peak Diode Recovery voltage slope 15 V/ns
V
ISO
T
j
T
stg
() Pulse width limited by safe operating area
7A, di/dt 500A/µs, VDD≤ V
(1) I
SD
(*) Limited only by maximum temperature allowed
Insulation Withstand Voltage (DC) Operating Junction Temperature
Storage Temperature
(BR)DSS,Tj
=25°C
2
PAK TO-220FP
600 V
125 30 W
4000 V
- 2500 V
-55 to 150 °C
THERMAL DATA
TO-220
2
D
PAK
Rthj-pcb Thermal Resistance Junction-pcb Max
(Whenmounted on minimum Footprint)
30 °C/W
Rthj-case Thermal Resistance Junction-case Max 1 4.16 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
T
l
Maximum Lead Temperature For Soldering
300 °C
Purpose
TO-220FP Unit
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
AS
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
max)
j
Single Pulse Avalanche Energy (starting T
=25°C, ID=IAR,VDD=50V)
j
7A
235 mJ
GATE-SOURCE ZENER DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
BV
GSO
Gate-Source Breakdown
Igs=± 1mA (Open Drain) 30 V
Voltage
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have spec ifically been designed to enhance not only the device’s ESD capability, but also to make them s afely absorb possibl e voltage transients that may occasionally be applied from gate tosouce. In this respect the Zener voltageis appropriate to achieve an efficient andcost­effective intervention to protect the devices integrity. These integrated Zener diodes thus avoid the usage of external components.
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STP9NK60ZD - STF9NK60ZD - STB9NK60ZD
ELECTRICAL CHARACTERISTICS (T
=25°C UNLESS OTHERWISE SPECIFIED)
CASE
ON/OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
ID=1mA,VGS=0 600 V
Breakdown Voltage
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Zero Gate Voltage Drain Current (V
GS
=0)
Gate-body Leakage Current (V
DS
=0) Gate Threshold Voltage Static Drain-source On
V
=MaxRating
DS
= Max Rating, TC=125°C
V
DS
V
= ± 20V ±10 µA
GS
V
DS=VGS,ID
= 100µA
2.5 3.5 4.5 V
1
50
VGS= 10V, ID= 3.5 A 0.85 0.95
Resistance
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
(1) Forward Transconductance VDS=15V,ID=3.5A 5.3 S
fs
C
oss eq.
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance Reverse Transfer Capacitance
(3)
Equivalent Output Capacitance
VDS=25V,f=1MHz,VGS=0 1110
135
30
VGS=0V,VDS= 0V to 480V 72 pF
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
Q Q Q
t
r
g gs gd
Turn-on Delay Time Rise Time
Total Gate Charge Gate-Source Charge Gate-Drain Charge
VDD= 300 V, ID=3.5A RG=4.7Ω VGS=10V (Resistive Load see, Figure 3)
= 480V, ID=7A,
V
DD
V
= 10V
GS
22 17
41
8.7 21
53
µA µA
pF pF pF
ns ns
nC nC nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
Turn-off Delay Time
t
f
FallTime
VDD= 300 V, ID=3.5A R
=4.7Ω VGS=10V
G
42 15
(Resistive Load see, Figure 3)
t
r(Voff)
t t
Off-voltage Rise Time
f
c
FallTime Cross-over Time
= 480V, ID=7A,
V
DD
R
=4.7Ω, VGS= 10V
G
(Inductive Load see, Figure 5)
11
8
20
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
rr
Q
rr
I
RRM
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe o perating area.
3. C
Source-drain Current
(2)
Source-drain Current (pulsed)
(1)
ForwardOnVoltage Reverse Recovery Time
Reverse Recovery Charge Reverse Recovery Current
Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current
is defined as a constant equivalent capacitance giving the same charging time as C
oss eq.
.
V
DSS
ISD=7A,VGS=0
= 7 A, di/dt = 100A/µs
I
SD
V
= 30V, Tj=25°C
DD
(see test circuit, Figure 5)
= 7 A, di/dt = 100A/µs
I
SD
VDD= 30V, Tj=150°C (see test circuit, Figure 5)
150 663
8.5
194 935
9.6
when VDSincreases from 0 to 80%
oss
7
28
1.6 V
ns ns
ns ns ns
A A
ns
nC
A
ns
nC
A
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STP9NK60ZD - STF9NK60ZD - STB9NK60ZD
Safe Operating Area For TO-220FPSafe Operating Area For TO-220/D²PAK
Thermal Impedance For TO-220/D²P A K Thermal Impedance Fo r TO-220FP
Output Characteristics
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Transfer Characteristics
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STP9NK60ZD - STF9NK60ZD - STB9NK60ZD
Static Drain-source On ResistanceTransconductance
Capacitance VariationsGate Charge vs Gate-source Voltage
Normalized Gate Threshold Voltage vs Temp.
Normalized On Resistance vs Temperature
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STP9NK60ZD - STF9NK60ZD - STB9NK60ZD
Maximum Avalanche Energy vs Temperature
Normalized BVDSS vs TemperatureSource-drain Diode Forward Characteristics
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STP9NK60ZD - STF9NK60ZD - STB9NK60ZD
Fig. 2: Unclamped Inductive Wav efo rmFig. 1: Unclamped Inductive Load Test Circuit
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times
Fig. 4: Gate Charge test Circuit
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STP9NK60ZD - STF9NK60ZD - STB9NK60ZD
TO-220 MECHANICAL DATA
DIM.
A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034
b1 1.15 1.70 0.045 0.066
c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154
L20 16.40 0.645 L30 28.90 1.137
øP 3.75 3.85 0.147 0.151
Q 2.65 2.95 0.104 0.116
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
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STP9NK60ZD - STF9NK60ZD - STB9NK60ZD
TO-220FP MECHANICAL DATA
DIM.
A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039 F1 1.15 1.5 0.045 0.067 F2 1.15 1.5 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 .0385 0.417 L5 2.9 3.6 0.114 0.141 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
E
A
D
B
L3
L6
L7
F1
F
G1
H
G
F2
123
L2
L5
L4
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STP9NK60ZD - STF9NK60ZD - STB9NK60ZD
D2PAK MECHANICAL DATA
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009
B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
D1 8 0.315
E 10 10.4 0.393 E1 8.5 0.334
G 4.88 5.28 0.192 0.208
L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068
mm. inch
M 2.4 3.2 0.094 0.126
R 0.4 0.015 V2 0º
3
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STP9NK60ZD - STF9NK60ZD - STB9NK60ZD
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT (suffix T4)*
TUBE SHIPMENT (no suffix)*
REEL MECHANICAL DATA
DIM.
A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0795 G 24.4 26.4 0.960 1.039 N 100 3.937 T 30.4 1.197
mm inch
MIN. MAX. MIN. MAX.
TAPE MECHANICAL DATA
DIM.
A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626
D 1.5 1.6 0.059 0.063
D1 1.59 1.61 0.062 0.063
E 1.65 1. 85 0.065 0.073
F 11.4 11.6 0.449 0. 456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082
R 50 1.574
T 0.25 0.35 0.0098 0.0137
W 23.7 24.3 0.933 0.956
* on sales type
mm inch
MIN. MAX. MIN. MAX.
BASE QTY BULK QTY
1000 1000
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STP9NK60ZD - STF9NK60ZD - STB9NK60ZD
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of u se of suc h informat ion n or for any in fring ement of paten ts or oth er ri ghts of th ird part ies whic h may resul t from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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