The SuperFRED Mesh™ se ries associates all advantages of reduced on-resistance, zener gate protection and very high d v/dt capability with a Fast
body-drain reco ve ry diode. Such series com plements the “FDmesh™” Advanced Technology.
Drain-source Voltage (VGS=0)
Drain-gate Voltage (RGS=20kΩ)600V
Gate- source Voltage± 30V
Drain Current (continuos) at TC=25°C77(*)A
Drain Current (continuos) at TC=100°C4.34.3(*)A
()
Drain Current (pulsed)2828 (*)A
Total Dissipation at TC=25°C
I
V
DM
P
V
DGR
V
I
I
TOT
DS
GS
D
D
Derating Factor10.24W/°C
V
ESD(G-S)
Gate source ESD (HBM-C=100pF, R=1.5KΩ)
dv/dt (1)Peak Diode Recovery voltage slope15V/ns
V
ISO
T
j
T
stg
() Pulse width limited by safe operating area
≤7A, di/dt ≤500A/µs, VDD≤ V
(1) I
SD
(*) Limited only by maximum temperature allowed
Insulation Withstand Voltage (DC)
Operating Junction Temperature
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
max)
j
Single Pulse Avalanche Energy
(starting T
=25°C, ID=IAR,VDD=50V)
j
7A
235mJ
GATE-SOURCE ZENER DIODE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
BV
GSO
Gate-Source Breakdown
Igs=± 1mA (Open Drain)30V
Voltage
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have spec ifically been designed to enhance not only the device’s
ESD capability, but also to make them s afely absorb possibl e voltage transients that may occasionally be
applied from gate tosouce. In this respect the Zener voltageis appropriate to achieve an efficient andcosteffective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage
of external components.
2/12
Page 3
STP9NK60ZD - STF9NK60ZD - STB9NK60ZD
ELECTRICAL CHARACTERISTICS (T
=25°C UNLESS OTHERWISE SPECIFIED)
CASE
ON/OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
(BR)DSS
Drain-source
ID=1mA,VGS=0600V
Breakdown Voltage
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Zero Gate Voltage
Drain Current (V
GS
=0)
Gate-body Leakage
Current (V
DS
=0)
Gate Threshold Voltage
Static Drain-source On
V
=MaxRating
DS
= Max Rating, TC=125°C
V
DS
V
= ± 20V±10µA
GS
V
DS=VGS,ID
= 100µA
2.53.54.5V
1
50
VGS= 10V, ID= 3.5 A0.850.95Ω
Resistance
DYNAMIC
SymbolParameterTest ConditionsMin.Typ.Max.Unit
g
(1)Forward TransconductanceVDS=15V,ID=3.5A5.3S
fs
C
oss eq.
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
(3)
Equivalent Output Capacitance
VDS=25V,f=1MHz,VGS=01110
135
30
VGS=0V,VDS= 0V to 480V72pF
SWITCHING ON
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(on)
Q
Q
Q
t
r
g
gs
gd
Turn-on Delay Time
Rise Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
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