Datasheet HMC265LM3 Datasheet (Hittite)

MICROWAVE CORPORATION

v00.0401

HMC265LM3

SUB-HARMONIC SMT

MIXER 20 - 31 GHz

5

Typical Applications

20 and 31 GHz Microwave Radios

Downconverter for Point to Point Radios

LMDS and SATCOM

Functional Diagram

Features

Integrated LO Amplifi er: -4 dBm Input

Sub-Harmonically Pumped (x2) LO

High 2LO/RF Isolation: > 28 dB

LM3 SMT Package

General Description

The HMC265LM3 is a 20 - 31 GHz surface mount
sub-harmonically pumped (x2) MMIC mixer down­converter with integrated LO and IF amplifi ers in
a SMT leadless chip carrier package. The 2LO to
RF and IF isolations are an excellent 35 to 48 dB,
eliminating the need for additional fi ltering. The
LO amplifi er is a single bias (+3V to +4V) two
stage design with only -4 dBm drive requirement.
All data is with the non-hermetic, epoxy sealed
LM3 packaged device mounted in a 50 ohm test
fi xture. Utilizing the HMC265LM3 eliminates the
need for wirebonding, thereby providing a con­sistent connection interface for the customer.

MIXERS - SMT

Guaranteed Performance, As a Function of LO Drive & Vdd, 25 Deg °C

FRotOL2sInoitalo128282530282Bd

otOL2FIsInoitalo937404848374Bd

PI)tupnI(32860128 mBd

*Unless otherwise noted, all measurements performed as downconverter, IF= 2 GHz.

5 - 18

FIzHG2=

retemaraP

.niM.pyT.xaM.niM.pyT.xaM.niM.pyT.xaM

FR,egnaRycneuqerF13-0203-7203-12zHG

OLegnaRycneuqerF5.51-0151-5.3151-5.01zHG

,egnaRycneuqerFFI3-7.03-7.08.2-8.0zHG

FIotFRniaGnoisrevnoC2-3 04 1-3 Bd

)BSS(erugiFesioN313131Bd

(noisserpmoCBd1nI)tup1-2+03+0mBd

)ddV(egatloVylppuS0.40.40.3cdV

(tnerruCylppuSdI)d050504Am

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Visit us at www.hittite.com, or Email at [e-mail]

V4+=ddV&mBd4-=OL

FIzHG2=

V4+=ddV&mBd4-=OL

FIzHG2=

V3+=ddV&mBd4-=OL

stinUretemaraP

stinU

MICROWAVE CORPORATION

v00.0401

HMC265LM3

SUB-HARMONIC SMT

MIXER 20 - 31 GHz

Conversion Gain vs.

GaAs MMIC SUB-HARMONICALLY PUMPED MIXER 17 - 25 GHz

Temperature @ LO = -4 dBm, Vdd= +4V

10

5

0

-5

-10

CONVERSION GAIN (dB)

-15

-20
18 20 22 24 26 28 30 32 34

RF FREQUENCY (GHz)

+25C

-40C
+85C

Conversion Gain
vs. LO Drive @ Vdd = +4V

10

5

0

-5

-10

CONVERSION GAIN (dB)

-15

-20
18 20 22 24 26 28 30 32 34

-8 dBm

-6 dBm

-2 dBm

RF FREQUENCY (GHz)

-4 dBm

0 dBm

Conversion Gain vs.
Temperature @ LO = -4 dBm, Vdd= +3V

10

5

0

-5

-10

CONVERSION GAIN (dB)

-15

-20
18 20 22 24 26 28 30 32 34

RF FREQUENCY (GHz)

+25C

-40C
+85C

Conversion Gain
vs. LO Drive @ Vdd = +3V

10

5

0

-5

-10

CONVERSION GAIN (dB)

-15

-20
18 20 22 24 26 28 30 32 34

-8 dBm

-6 dBm

-2 dBm

RF FREQUENCY (GHz)

5

-4 dBm
0 dBm

MIXERS - SMT

Isolation @ LO = -4 dBm, Vdd = +4V Isolation @ LO = -4 dBm, Vdd = +3V

10

0

-10

-20

-30

-40

ISOLATION (dB)

-50

-60

-70
18 20 22 24 26 28 30 32 34

LO/RF

RF/IF

2LO/RF

2LO/IF

RF FREQUENCY (GHz)

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Visit us at www.hittite.com, or Email at [e-mail]

LO/IF

10

0

-10

-20

-30

-40

ISOLATION (dB)

-50

-60

-70

2LO/RF

18 20 22 24 26 28 30 32 34

RF FREQUENCY (GHz)

LO/RF

RF/IF

2LO/IF

LO/IF

5 - 19

MICROWAVE CORPORATION

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HMC265LM3

SUB-HARMONIC SMT

MIXER 20 - 31 GHz

Input IP3 vs. LO Drive @ Vdd = +4V *

20

16

12

8

INPUT IP3 (dBm)

4

0

18 20 22 24 26 28 30 32 34

5

RF & LO Return Loss
@ LO = -4 dBm, Vdd = +4V

0

-2

-4

-6

-8

-10

-12

-14

RETURN LOSS (dB)

-16

MIXERS - SMT

-18

-20
0 5 10 15 20 25 30 35

-6 dBm

-4 dBm

RF FREQUENCY (GHz)

FREQUENCY (GHz)

-2 dBm

Input P1dB @ LO = -4 dBm, Vdd = +4V

5

4

3

2

1

0

-1

INPUT P1dB (dBm)

-2

-3

-4

-5
18 20 22 24 26 28 30 32 34

RF FREQUENCY (GHz)

IF Return Loss
@ LO = -4 dBm, Vdd = +4V

0

-2

-4

-6

-8

-10

-12

-14

RETURN LOSS (dB)

RF
LO

-16

-18

-20
0123456

IF FREQUENCY (GHz)

5 - 20

IF Bandwidth @ LO = -4 dBm

10

5

0

-5

-10

-15

IF CONVERSION GAIN (dB)

-20
0123456

* Two-tone input power = -10 dBm each tone, 1 MHz spacing.

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Visit us at www.hittite.com, or Email at [e-mail]

Vdd = +3V
Vdd = +4V

IF FREQUENCY (GHz)

MICROWAVE CORPORATION

v00.0401

Absolute Maximum Ratings

)V5+=ddV(tupnIFI/FRmBd31+

)V5+=ddV(evirDOLmBd31+

ddVV5.5

HMC265LM3

SUB-HARMONIC SMT

MIXER 20 - 31 GHz

)C°58=aT(ssidPsuonitnoC

)C°58evobaC°/Wm25.2etared(

erutarepmeTegarotSCged051+ot56-

erutarepmeTgnitarepOCged58+ot04-

Wm722

Pin Locations & Outline Drawing

5

MIXERS - SMT

1. MATERIAL: PLASTIC

2. PLATING: GOLD OVER NICKEL

3. ALL DIMENSIONS IN INCHES (MILLIMETERS)

4. ALL TOLERANCES ARE ±0.005 (±0.13)

5. ALL GROUNDS MUST BE SOLDERED TO
THE PCB RF GROUND

! INDICATES PIN 1

6.

7. GROUND PAD

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Visit us at www.hittite.com, or Email at [e-mail]

5 - 21

MICROWAVE CORPORATION

Pin Description

rebmuNniPnoitcnuFnoitpircseDcitamehcSecafretnI

v00.0401

HMC265LM3

SUB-HARMONIC SMT

MIXER 20 - 31 GHz

2,1C/NtfelrodnuorggnisuohehtotdetcennocebyamnipsihT

3ddVssapybFRlanretxenA.reifilpmAOLehtrofylppusrewoP

5

4FRmorfmho05otdehctamdnadelpuocCAsinipsihT.troPFR

5FImorfmho05otdehctamdnadelpuocCAsinipsihT.troPFI

6OL morfmho05otdehctamdnadelpuocCAsinipsihT.troPOL

MIXERS - SMT

.detcennocnu

siroticapacredrobMIMA.deriuqersiFp033-001foroticapac

aebdluohsroticapacehtothtgneldnobehT.dednemmocer

ebdluohsroticapacehtfoedisdnuorgehT.elbissopsatrohs

.dnuorggnisuohehtotdetcennoc

.zHG03-02

.zHG3-7.0

.zHG51-01

5 - 22

7DNG.dnuorgFRBCPotderedlosebtsuM

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Visit us at www.hittite.com, or Email at [e-mail]

MICROWAVE CORPORATION

v00.0401

HMC265LM3 Evaluation PCB

HMC265LM3

SUB-HARMONIC SMT

MIXER 20 - 31 GHz

5

The grounded Co-Planar Wave Guide (G-CPW) PCB input/output transitions allow use of Ground-Signal­Ground (GSG) probes for testing. Suggested probe pitch is 400mm (16 mils). Alternatively, the board can
be mounted in a metal housing with 2.4 mm coaxial connectors.

Evaluation Circuit Board Layout Design Details

euqinhceTtuoyaLWPC-GotpirtSorciM

lairetaMuC,zo2/1htiw3004sregoR

ssenkcihTcirtceleiD)mm02.0("800.0

htdiWeniLpirtsorciM)mm64.0("810.0

htdiWeniLWPC-G)mm14.0("610.0

paGDNGoteniLWPC-G)mm31.0("500.0

remaiDeloHaiVdnuorG)mm31.0("800.0

1C.gkP2040,roticapaCFp001

LM3 package mounted to evaluation PCB

MIXERS - SMT

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Visit us at www.hittite.com, or Email at [e-mail]

5 - 23

MICROWAVE CORPORATION

v00.0401

HMC265LM3

SUB-HARMONIC SMT

MIXER 20 - 31 GHz

HMC265LM3 Recommended SMT Attachment Technique

Preparation & Handling of the LM3 Millimeterwave Package for Surface Mounting

The HMC LM3 package was designed to be compatible with high
volume surface mount PCB assembly processes. The LM3 package
requires a specifi c mounting pattern to allow proper mechanical attach-
ment and to optimize electrical performance at millimeterwave frequen­cies. This PCB layout pattern can be found on each LM3 product data
sheet. It can also be provided as an electronic drawing upon request
from Hittite Sales & Application Engineering.

Follow these precautions to avoid permanent damage:

Cleanliness: Observe proper handling procedures to ensure clean
devices and PCBs. LM3 devices should remain in their original packag­ing until component placement to ensure no contamination or damage

5

MIXERS - SMT

to RF, DC & ground contact areas.

Static Sensitivity: Follow ESD precautions to protect against ESD
strikes ( see catalog page 8 - 2 ).

General Handling: Handle the LM3 package on the top with a vacuum collet or along the edges with a sharp pair of bent tweezers.
Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess pressure to the top of the lid.

Solder Materials & Temperature Profi le: Follow the information contained in the application note. Hand soldering is not recommended.
Conductive epoxy attachment is not recommended.

Solder Paste

Solder paste should be selected based on the user’s experience and be compatible with the metallization systems used. See the LM3
data sheet Outline drawing for pin & ground contact metallization schemes.

Solder Paste Application

Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of solder paste will be
dependent on PCB and component layout and should be controlled to ensure consistent mechanical & electrical performance. Excess
solder may create unwanted electrical parasitics at high frequencies.

Solder Refl ow

The soldering process is usually accomplished in a refl ow oven but may also use a vapor phase process. A solder refl ow profi le is
suggested above.

225

200

175

C)

0

150

125

100

TEMPERATURE (

75

50

25

012345678

TIME (min)

5 - 24

Prior to refl owing product, temperature profi les should be measured using the same mass as the actual assemblies. The thermocouple
should be moved to various positions on the board to account for edge and corner effects and varying component masses. The fi nal
profi le should be determined by mounting the thermocouple to the PCB at the location of the device.

Follow solder paste and oven vendor’s recommendations when developing a solder refl ow profi le. A standard profi le will have a steady
ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. Allow enough time between
reaching pre-heat temperature and refl ow for the solvent in the paste to evaporate and the fl ux to completely activate. Refl ow must
then occur prior to the fl ux being completely driven off. The duration of peak refl ow temperature should not exceed 15 seconds. Pack-
ages have been qualifi ed to withstand a peak temperature of 235°C for 15 seconds. Verify that the profi le will not expose device to
temperatures in excess of 235°C.

Cleaning

A water-based fl ux wash may be used.

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Visit us at www.hittite.com, or Email at [e-mail]

MICROWAVE CORPORATION

Notes:

v00.0401

HMC265LM3

SUB-HARMONIC SMT

MIXER 20 - 31 GHz

5

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Visit us at www.hittite.com, or Email at [e-mail]

MIXERS - SMT

5 - 25