Version 1.0
Published June 2022
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
is equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules. ese limits are designed to provide
reasonable protection against harmful interference in a residential insta llation. is
equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment o and on, the
user is encouraged to try to correct the interference by one or more of the following
measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit dierent from that to which the
receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
is device is in compliance with the essential requirements and other relevant provisions
of related UKCA Directives.
is device is in compliance with the essential requirements and other relevant provisions
of related Directives.
DO NOT throw the motherboard in municipal waste. is product has been
designed to enable proper reuse of parts and recycling. is symbol of the
crossed out wheeled bin indicates that the product (electrical and electronic
equipment) should not be placed in municipal waste. Check local regulations
for disposal of electronic products.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/
perchlorate”
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e terms HDMI® and HDMI High-Denition Multimedia Interface, and the HDMI
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Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 5
1.4 Front Panel 6
1.5 Rear Panel 7
Chapter 2 Installation 8
2.1 Installing Memory Modules (SO-DIMM) 9
2.2 Onboard Headers and Connectors 10
2.3 Smart Switch 11
2.4 M.2 WiFi/BT Module Installation Guide 12
2.5 M.2 SSD Module Installation Guide (M2_1 and M2_2) 14
Chapter 3 Auto Driver Installer 16
Chapter 4 UEFI SETUP UTILITY 17
4.1 Introduction 17
4.1.1 UEFI Menu Bar 17
4.1.2 Navigation Keys 18
4.2 Main Screen 19
4.3 Advanced Screen 20
4.3.1 CPU Conguration 21
4.3.2 Chipset Conguration 23
4.3.3 Storage Conguration 25
4.3.4 NVMe Conguration 26
4.3.5 ACPI Conguration 27
4.3.6 USB Conguration 28
4.3.7 Trusted Computing 29
4.4 Hardware Health Event Monitoring Screen 31
4.5 Tools 33
4.6 Boot Screen 34
4.7 Security Screen 36
4.8 Exit Screen 37
Chapter 1 Introduction
ank you for purchasing ADLD4-P1 motherboard. In this documentation,
Chapter 1 and 2 contains the introduction of the motherboard and step-by-step
installation guides. Chapter 3 contains the operation guide of the soware and
utilities. Chapter 4 contains the conguration guide of the BIOS setup.
Becau se the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice.
Becau se the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice.
1.1 Package Contents
ADLD4-P1 Motherboard
•
ADLD4-P1 Quick Installation Guide
•
2 x Screws for M.2 Sockets (M2*2) (Optional)
•
1 x Screw for WiFi Module (M2*2) (Optional)
•
ADLD4-P1
English
1.2 Specications
Platform
CPU
Chipset
Memory
•
•
•
•
•
•
•
•
•
•
7.0-in x 5.7-in, 17.8 cm x 14.5 cm
Supports 12th Gen Intel® CoreTM Processors (Alder Lake-U)
3 Power Phase design
Supports Intel® Hybrid Technolog y
Supports Intel® Turbo Boost Ma x 3.0 Technology
SOC
Dual Channel DDR4 Memory Technology
2 x DDR4 SO-DIMM Slots
Supports DDR4 non-ECC, un-buered memory up to 3200*
Max. capacity of system memory: 64GB
English
Expansion
Slot
Graphics
1 x M.2 Socket (Key E), supports ty pe 2230 WiFi/BT module
•
Intel® UHD Graphics Built-in Visuals and the VGA outputs
•
can be supported only with processors which are GPU
integrated.
Intel® Xe Graphics Architecture (Gen 12)
•
ree graphics output options: D-Sub, HDMI and Intel®
•
underboltTM 4 ports
Supports Triple Monitor
•
Supports Intel® underboltTM 4 with max. resolution up to
•
8K (7680x4320) @ 60Hz*
* Supports two 4K displays or one 8K display
Supports HDMI 2.1 TMDS Compatible with max. resolution
•
up to 4K x 2K (4096x2160) @ 60Hz
Supports D-Sub with max. resolution up to 1920x1200 @
•
60Hz
Supports HDCP 2.3 with HDMI 2.1 TMDS Compatible Port
•
2 3
Audio
LAN
Front
Panel I/O
Realtek ALC269 Audio Codec
•
1 x Headphone Jack
•
1 x MIC-In
•
Gigabit LAN 10/100/10 00 Mb/s
•
Giga PHY Intel® I219V
•
Supports Wake-On-LAN
•
Supports Lightning/ESD Protection
•
Supports Energy Ecient Ethernet 802.3az
•
Supports UEFI PXE
•
1 x Power Button
•
2 x USB 3.2 Gen2 Type-A Ports (Support ESD Protection)
•
1 x USB 4.0 underboltTM 4 Type-C Port (40 Gb/s for USB 4.0
•
protocol; 40Gb/s for underbolt protocol) (Supports ESD
Protection)
* Supports USB PD 3.0 up to 5V@3A (15W) charging
2 x USB 2.0 Ports (Supports ESD Protection)
•
1 x SD Card Socket
•
ADLD4-P1
Rear Panel
I/O
Storage
1 x DC Jack (Compatible with the 19V power adapter)*
•
1 x D-Sub Port
•
1 x HDMI Port
•
2 x USB 3.2 Gen2 Type-A Ports (Support ESD Protection)
•
1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
•
LED)
1 x Headphone Jack
•
1 x Microphone Input Jack
•
CPU:
1 x Hyper M.2 Socket (M2_1, Key M), supports type
•
2260/2280 PCIe Gen4x4 (64 Gb/s) mode*
Chipset:
1 x Ultra M.2 Socket (M2_2, Key M), supports type
•
2260/2280 SATA3 6.0 Gb/s & PCIe Gen3 x4 (32 Gb/s) modes*
* Supports NVMe SSD as boot disks
English
Connector
BIOS
Feature
Hardware
Monitor
OS
Certications
1 x CPU Fan Connector (4-pin)
•
2 x M.2 Fan Connectors (4-pin)
•
AMI UEFI Legal BIOS with multilingual GUI support
•
ACPI 6.0 Compliant wake up events
•
SMBIOS 2.7 Support
•
CPU Temperature Sensing
•
CPU Fan Tachometer
•
CPU Quiet Fan (Auto adjust chassis fan speed by CPU
•
temperature)
CPU Fan Multi-Speed Control
•
Voltage monitoring: CPU Vcore, VCCM, +5V, +3.3V
•
Microso® Windows® 10 64-bit / 11 64-bit
•
FCC, CE
•
ErP/EuP ready (ErP/EuP ready power supply is required)
•
English
4 5
RJ-45
RoHS
1
Headphone
VGA1
HDMI 1
BIOS
ROM
Mic In
Power
Button
DC Jack
ADLD4-P1
USB 3.2 Gen2
T: USB_2
USB2.0
B: USB_1
USB 3.2 Gen2
T: USB_4
USB2.0
B: USB_3
USB 3.2 Gen2
T: USB_6
B: USB_5
SD Card
TB_1
DDR4_A1
DDR4_B1
4
2
CPU_FAN1
1
M2_FAN1
1
M2_ 3
M2_ 1
M2_ 2
M2_FAN2
1
3
1.3 Motherboard Layout
ADLD4-P1
No. Description
1 2 x 260-pin DDR4 SO-DIMM Slots (DDR4_A1, DDR4_B1)
2 M.2 Fan Connector (M2_FAN2)
3 M.2 Fan Connector (M2_FAN1)
4 CPU Fan Connector (CPU_FAN1)
English
1.4 Front Panel
21 3
4 6
No. Description No. Description
1 SD Card Socket 4 USB 2.0 Port (USB_3)
2 USB 4.0 underboltTM 4 5 USB 3.2 Gen2 Type-A Port (USB_2)
Type-C Port (TB_1) 6 USB 2.0 Port (USB_1)
3 USB 3.2 Gen2 Type-A Port 7 Power Button (S W1)
(USB_ 4)
5
7
English
6 7
1.5 Rear Panel
ADLD4-P1
1 43 5 6 7
2
No. Description No. Description
1 D-Sub Port 4 LAN RJ-45 Port*
2 HDMI Port 5 DC Jack
3 USB 3.2 Gen2 Type-A Port 6 Headphone Jack
(USB_ 5_6) 7 Microphone Input
* ere are two LEDs on each LAN port. Please refer to the table b elow for the LAN port LED indications.
ACT/LINK LED
SPEED LED
LAN Por t
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection
Blinking Data Activity Green 100Mbps connection
On Link Orange 1Gbps connection
English
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