Intel® is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.
Java™ and all other Java-based marks are trademarks or registered trademarks of Oracle America, Inc. in the U.S. and other countries.
Microsoft®, Windows® and Windows Me® are registered trademarks of Microsoft Corporation; and Windows XP™ is a trademark of
Microsoft Corporation.
PICMG®, CompactPCI®, AdvancedTCA™ and the PICMG, CompactPCI and AdvancedTCA logos are registered trademarks of the PCI
Industrial Computer Manufacturers Group.
UNIX® is a registered trademark of The Open Group in the United States and other countries.
Notice
While reasonable efforts have been made to assure the accuracy of this document, Artesyn assumes no liability resulting from any
omissions in this document, or from the use of the information obtained therein. Artesyn reserves the right to revise this document
and to make changes from time to time in the content hereof without obligation of Artesyn to notify any person of such revision or
changes.
Electronic versions of this material may be read online, downloaded for personal use, or referenced in another document as a URL to
an Artesyn website. The text itself may not be published commercially in print or electronic form, edited, translated, or otherwise
altered without the permission of Artesyn.
It is possible that this publication may contain reference to or information about Artesyn products (machines and programs),
programming, or services that are not available in your country. Such references or information must not be construed to mean that
Artesyn intends to announce such Artesyn products, programming, or services in your country.
Limited and Restricted Rights Legend
If the documentation contained herein is supplied, directly or indirectly, to the U.S. Government, the following notice shall apply
unless otherwise agreed to in writing by Artesyn.
Use, duplication, or disclosure by the Government is subject to restrictions as set forth in subparagraph (b)(3) of the Rights in
Technical Data clause at DFARS 252.227-7013 (Nov. 1995) and of the Rights in Noncommercial Computer Software and
Documentation clause at DFARS 252.227-7014 (Jun. 1995).
Contact Address
Artesyn Embedded Technologies Artesyn Embedded Technologies
Marketing Communications
2900 S. Diablo Way, Suite 190
Tempe, Arizona 85282
IDEIntegrated Device Electronics - parallel interface for hard disk drives -
JTAGJoint Test Action Group
LPCLow Pin-Count Interface: a low speed interface used for peripheral
LVDSLow Voltage Differential Signaling - widely used as a physical
About this Manual
allowing communication between integrated circuits, primarily used
to read and load registers values.
also known as PATA
circuits such as Super I/O controllers, which typically combine
legacy-device support into a single IC.
interface for TFT flat panels. LVDS can be used for many high-speed
signaling applications. In this document, it refers only to TFT flatpanel applications.
PCIPeripheral Component Interface
PCI-EPeripheral Component Interface Express - next-generation high
speed Serialized I/O bus
PHYEthernet controller physical layer device
Pin-out TypeA reference to one of five COM ExpressTM definitions for what signals
appear on the COM ExpressTM module connector pins.
SDDSubsystem Device Driver
SPDSerial Presence Detect - refers to serial EEPROM on DRAMs that has
DRAM module configuration information
SATASerial AT Attachment: serial-interface standard for hard disks
SDVOSerialized Digital Video Output - Intel defined format for digital video
output that can
SSDSolid State Drive
USBUniversal Serial Bus
VGAVideo Graphics Adapter
WDTWatch Dog Timer.
14
NITX-315/NITX-315-ET Installation and Use (6806800L71D)
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Conventions
The following table describes the conventions used throughout this manual.
NotationDescription
0x00000000Typical notation for hexadecimal numbers (digits are
0b0000Same for binary numbers (digits are 0 and 1)
boldUsed to emphasize a word
ScreenUsed for on-screen output and code related elements
Courier + BoldUsed to characterize user input and to separate it
ReferenceUsed for references and for table and figure
About this Manual
0 through F), for example used for addresses and
offsets
or commands in body text
from system output
descriptions
File > ExitNotation for selecting a submenu
<text>Notation for variables and keys
[text]Notation for software buttons to click on the screen
...Repeated item for example node 1, node 2, ..., node
.
.
.
..Ranges, for example: 0..4 means one of the integers
|Logical OR
NITX-315/NITX-315-ET Installation and Use (6806800L71D)
and parameter description
12
Omission of information from example/command
that is not necessary at the time being
0,1,2,3, and 4 (used in registers)
15
Page 16
About this Manual
NotationDescription
About this Manual
Indicates a hazardous situation which, if not avoided,
could result in death or serious injury
Indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury
Indicates a property damage message
No danger encountered. Pay attention to important
information
16
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Summary of Changes
This manual has been revised and replaces all prior editions.
Part NumberPublication DateDescription
6806800L71DAugust 2014Re-branded to Artesyn template.
6806800L71CDecember 2012Updated Chapter 1, Standard Compliances, on
6806800L71BOctober 2011Updated Chapter 5, BIOS, on page 71
About this Manual
Added Declaration of Conformity.
page 22.
Updated Figure "NITX-315/NITX-315-ET
Mechanical Data (Top View)" on page 24 and
Figure "NITX-315/NITX-315-ET Mechanical Data
(Side View)" on page 25
Added Table "Environmental Requirements of
NITX-315-ET" on page 30
Updated Table "Environmental Requirements of
NITX-315" on page 29
Updated Table "Critical temperature Spots for
NITX-315 and NITX-315-ET" on page 30
Updated Figure "Board Thermal Management
Diagram" on page 34
Added Figure "eUSB Flash Disk Installation and
Removal" on page 36
Added Chapter 2, SATA HDD and Slim Lite SSD (MO-
297) Connection and Removal, on page 37
Updated Chapter 3, CPU JTAG header (P20) -
Optional, on page 45 and Chapter 3, Audio Header
(P12), on page 47
Added Table "J9 SATA Pin Definition" on page 54
Removed Chapter 4.19 Reset Control Logic
6806800L71AMarch 2011Preliminary Release
NITX-315/NITX-315-ET Installation and Use (6806800L71D)
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About this Manual
About this Manual
18
NITX-315/NITX-315-ET Installation and Use (6806800L71D)
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Introduction
1.1Overview
NITX-315/NITX-315-ET is a highly integrated Small Form Factor Nano-ITX board based on the
Queensbay Platform, including the Tunnel Creek processor and Topcliff IOH. The NITX315/NITX-315-ET incorporates the standard processor, memory, graphics and I/O
functionality, as is common as a small form factor PC motherboard. The NITX-315/NITX-315ET operates with or without a local display. Standard PC expansion ports are also available on
the rear panel along with additional USB ports, SATA and LVDS via headers on the board as well
as a single PCIExpress expansion slot. Because the NITX-315/NITX-315-ET is based on the
latest Intel Queensbay platform, it has a long product life cycle, lower power consumption and
suitable for fanless applications. NITX-315/NITX-315-ET performs well within extended
temperature ranges for more rugged commercial applications. NITX-315-ET is designed to
meet -20 - 70 °C ambient temperature requirement.
Table 1-1 Key Features of the NITX-315
Chapter 1
FunctionFeatures
ProcessorIntel Tunnel Creek processor E640 1.0GHz
As manufacturer we hereby declare that the product named above has been designed to comply with the relevant sections of the above referenced specifications. This product complies with the essential health and safety
requirements of the above specified directives. We have an internal production control system that ensures
compliance between the manufactured products and the technical documentation.
Artesyn Embedded Technologies
Embedded Computing
Zhongshan General Carton Box Factory Co. Ltd. No 62, Qi
Guan Road West, Shiqi District, 528400 Zhongshan City
Guangdong, PRC
Tom Tuttle, Manager, Product Testing Services Date (MM/DD/YYYY)
NITX-315/NITX-315-ET Installation and Use (6806800L71D)
08/26/2014
______
23
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Introduction
1.3Mechanical Data
1.3.1NITX-315/NITX-315-ET Mechanical Data
Figure 1-2NITX-315/NITX-315-ET Mechanical Data (Top View)
3.26
120.00
116.76
THROUGH HOLE
3.20
WITH5.5mm PAD
BOTH SIDE
4 PLACE
113.65
120.00
86.98
24
3.00
0.00
0.00
3.00
2.75
116.76
NITX-315/NITX-315-ET Installation and Use (6806800L71D)
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Figure 1-3NITX-315/NITX-315-ET Mechanical Data (Side View)
5.15
Introduction
30.22
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Introduction
1.4Board Identification
This section shows the serial number and its location on the board.
Figure 1-4Serial Number Location
1.5Ordering Information
Use the order numbers below when ordering board variants or board accessories.
26
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1.5.1Board Variants
The following table lists the product variants that are available upon release of this publication.
Table 1-4 Available Board Variants
Part NumberDescription
NITX-315 NANO ITX 1.0 GHz
NITX-315-ETNANO ITX 1.0 GHz, ET
1.5.2 Board Accessories
The following table lists the board accessories that are available upon release of this
publication.
Table 1-5 Available Board Accessories
Introduction
Order NumberDescription
KR8-PS01DC POWER ADAPTER 60W
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Introduction
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Hardware Preparation and Installation
2.1Environmental and Power Requirements
2.1.1Environmental Requirements
The following tables list the environmental requirements that the NITX-315 and NITX-315-ET
boards must meet when operated in your particular system configuration.
Operating temperatures refer to the temperature of the air circulating around the board and
not to the component temperature.
Chapter 2
Product Damage
High humidity and condensation on surfaces cause short circuits.
Do not operate the system outside the specified environmental limits. Make sure the
product is completely dry and there is no moisture on any surface before applying power.
Table 2-1 Environmental Requirements of NITX-315
RequirementOperatingNon-Operating
Cooling MethodFanless
Temp Cycle Class -40-+85C:500cyc
Temperature0-60C-40-+85C
Humidity10-90% (non-condensing)
Vibration.01 g^2/Hz @ 5-500Hz
Shock 20g 11ms sine or saw
Altitude-60 - 4000 m ASL
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Hardware Preparation and Installation
Table 2-2 Environmental Requirements of NITX-315-ET
RequirementOperatingNon-Operating
Cooling MethodFanless
Temp Cycle Class -40-+85C:500cyc
Temperature-20°C—70°C-40-+85C
Humidity10-90% (non-condensing)
Vibration.01 g^2/Hz @ 5-500Hz
Shock 20g 11ms sine or saw
Altitude-60 - 4000 m ASL
2.1.2Thermal Requirements
30
Table 2-3 Critical temperature Spots for NITX-315 and NITX-315-ET
Maximum Allowable
Component IdentifierHeat Dissipation Power (W)
CPU:
Commercial Temperature:
Atom E640
Extended Temperature:
Atom E640T
IOH: EG20T1.55115.7 (Tj)
Memory SDRAM
1GB
3.6
(both Commercial
Temperature and Extended
Temperature)
185 (Tc of Commercial version)
NITX-315/NITX-315-ET Installation and Use (6806800L71D)
Temperature (°C)
90 (Tj of Commercial
Temperature )
110 (Tj of Extended
Temperature)
95 (Tc of Extended
Temperature version)
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Hardware Preparation and Installation
Contact your Artesyn sales representative for current information on the detailed thermal
information including airflow and resistance of the board.
System Overheating
Cooling Vents
Improper cooling can lead to system damage and can void the manufacturer's warranty.
To ensure proper cooling and undisturbed airflow through the system do not obstruct the
ventilation openings of the system. Make sure that the fresh air supply is not mixed with hot
exhaust from other devices.
Personal Injury
During operation, hot surfaces may be present on the heat sinks and the components of the
product.
To prevent injury from hot surface do not touch any of the exposed components or
heatsinks on the product when handing. Use the handle and face plate, where applicable, or
the board edge when removing the product from the enclosure.
2.1.3Power Requirements
The following table describes the power dissipation of the NITX-315 and NITX-315-ET board.
Table 2-4 NITX-315 Power Dissipation
State+12 VVCC_RTCPower consumption (w)
G3 (AC off)026.8μA
Idle (CMOS Setup)0.8A09.6w
Idle (Window XP SP3 X32)0.78~8.87A09.36w~10.44w
FullLoading (PTU+Burn In
Tes t )
0.9~0.96A010.8w~11.52w
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Hardware Preparation and Installation
Table 2-4 NITX-315 Power Dissipation (continued)
State+12 VVCC_RTCPower consumption (w)
s50.038A (unplug ethernet)
0.155 A (plug ethernet)
00.456w (unplug
ethernet) 1.86w (plug
ethernet)
2.2Unpacking and Inspecting the Board
Read all notices and cautions prior to unpacking the product.
Damage of Circuits
Electrostatic discharge and incorrect installation and removal can damage circuits or
shorten their life.
Before touching the board or electronic components, make sure that you are working in an
ESD-safe environment.
32
Shipment Inspection
1. Verify that you have received all items of your shipment.
2. Check for damage and report any damage or differences to customer service.
3. Remove the desiccant bag shipped together with the board and dispose of it
according to your country’s legislation.
Environmental Damage
Improperly disposing of used products may harm the environment.
Always dispose of used products according to your country’s legislation and manufacturer’s
instructions.
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Hardware Preparation and Installation
The product is thoroughly inspected before shipment. If any damage occurred during
transportation or any items are missing, contact customer service immediately.
2.3Preparing the Installation Environment
Before you install or replace components, pay attention to the following:
Wear an ESD-preventive wrist strap to prevent the static electricity from damaging the
device.
Keep the area where the components reside clean and keep the components away from
heat-generating devices, such as radiator.
Ensure that your sleeves are tightened or rolled up above the elbow. For safety purposes, it
is not recommended to wear jewelry, watch, glasses with metal frame, or clothes with
metal buttons.
Do not exert too much force, or insert or remove the components forcibly. Avoid damage
to the components or plug-ins.
Confirm the feasibility of the operation
There are available spare parts of the components to be installed or replaced in the
equipment warehouse. When the available spare parts are lacking, contact Artesyn
Embedded Technologies for help in time. For details on how to get help from Artesyn
Embedded Technologies, visit http://www.artesyn.com/computing/.
Make sure that the new components are in good condition, without defects such as
oxidation, chemical corrosion, missing components, or transportation damage.
By reading this document, you are familiar with how to install and replace the component
and master the skills required by the operation.
Check the environment
Make sure that the power supply, temperature, and humidity meet the operating
requirements for the board and its components. For details, refer to the respective system
documentation.
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Hardware Preparation and Installation
Prepare the parts and the tools
Prepare the components to be installed or replaced.
When you hold or transport the components, use the special antistatic package. Prepare
the cross screwdriver, screws, plastic supports, cooling gel, and ESD-preventive wrist
strap.
Confirm installation or changing position
Confirm the position where NITX-315/NITX-315-ET will be installed.
If a serious problem occurs and cannot be solved when you install or replace the
component, contact Artesyn Embedded Technologies for technical support.
2.4Board Thermal Management and Placement
NITX-315/NITX-315-ET provides a thermal management strategy. This includes CPU junction
temperature monitoring, one on-board fan connector, and can take the corresponding action
to protect the system during catastrophic overheating.
34
The following diagram shows thermal management strategy:
Figure 2-1Board Thermal Management Diagram
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Hardware Preparation and Installation
A PNP thermal transistor is integrated in Tunnel Creek; it is used as a diode and it connects to
an external digital thermal sensor (EMC2103). The CPU can get the data of junction
temperature through the SM bus. Note that this is an inaccurate value and the temperature
offset must be taken into account through the reading of the CPU’s MSR.
Intel Thermal Monitor: Intel thermal monitor controls processor temperature by modulating
(starting and stopping) the processor core clocks when the processor silicon reaches its
maximum operating temperature. Signal "PROCHOT #" is used in this mode, when the
processor temperature goes up to 110C, the PROCHOT# is output and active, it indicates that
the processor thermal control circuit is activated. A red LED D2 can show the "processor hot"
status.
When the CPU junction temperature is more than 125°C, CPU will assert the THERMTRIP#, and
the onboard logic will shut down the system power, the LED D8 shows this status.
Table 2-5 Onboard LED Definition
LEDDefinitionStatusDescription
D2'PROCHOT' signal is activeONThe CPU temperature goes up to 110°C
OFFNormal status
D8'THERMTRIP#' signal is activeONThe CPU temperature goes up to 125°C
OFFNormal status
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Hardware Preparation and Installation
2.5eUSB Flash Disk Installation and Removal
Installing the eUSB Flash Disk
1. Align and insert the connector of the eUSB Flash to the connector on the NITX315/NITX-315-ET module.
Figure 2-2eUSB Flash Disk Installation and Removal
36
2. Use a M2.5x4 mm screw (0.4 N·m of torque is recommended) to fasten the eUSB
Flash module to the standoff.
Removing the eUSB Flash Disk from the Module
1. Loosen and remove the screws of the eUSB Flash disk from the standoff.
2. While holding the edges, pull the eUSB Flash disk from the board.
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Hardware Preparation and Installation
2.6SATA HDD and Slim Lite SSD (MO-297)
Connection and Removal
Two SATA ports are routed to the connector from the Topcliff. One port is a 7-pin SATA
connector, another is a 15-power+7signals connector which is used for "Slim Lite SSD". To
connect the SATA HDD and SSD, follow the steps below:
Damage of Circuits Electrostatic discharge and incorrect module installation and removal
can damage circuits or shorten their life. Before touching the module or electronic
components, make sure that you are working in an ESD-safe environment.
NITX-315/NITX-315-ET Installation and Use (6806800L71D)
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Hardware Preparation and Installation
1. Locate the J9 22-pin SATA connector on the underside of the NITX-315/NITX-315-
ET board.
Figure 2-3J9 22-pin SATA connector
38
2. Connect one end of the SATA cable to the J9 22-pin SATA connector and the other
end to the SATA HDD or SSD device.
Figure 2-4Serial ATA HDD
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Hardware Preparation and Installation
Figure 2-5Slim Lite SSD (MO-297)
HDD or SDD device should be fastened to a chassis or an enclosure.
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Hardware Preparation and Installation
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Controls, LEDs, and Connectors
3.1Board Layout
Figure 3-1NITX-315/NITX-315-ET Module Components
Chapter 3
NITX-315/NITX-315-ET Installation and Use (6806800L71D)
NITX-315/NITX-315-ET Installation and Use (6806800L71D)
Page 53
3.2.20ATX 4-Pin Power Header (J4)
Table 3-21 ATX 4-Pin Power Header Pin Definition
PinSignal
1GND
2GND
3+12V
4+12V
3.2.21SATA Power Header (P16)
Controls, LEDs, and Connectors
Table 3-22 SATA Power Header Pin Definition
PinSignal
1+12V
2GND
3+5V
4GND
5+3.3V
3.2.22I2C Header (P9)
Table 3-23 I2C Header Pin Definition
PinSignal
1+3.3V
2I2C_CLK
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Controls, LEDs, and Connectors
Table 3-23 I2C Header Pin Definition (continued)
PinSignal
3I2C_DAT
4GND
3.2.23J9 SATA Connector
Table 3-24 J9 SATA Pin Definition
PinSignal
S1GND
S2 SATA_TXP
S3 SATA_TXN
S4 GND
S5 SATA_RXN
S6 SATA_RXP
S7 GND
P1 +3.3V
P2 +3.3V
P3 +3.3V
P4 GND
P5 GND
P6 GND
P7 +5V
P8 +5V
P9 +5V
P10 GND
P11 RESERVED
P12 GND
54
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Table 3-24 J9 SATA Pin Definition (continued)
PinSignal
P13 +12V
P14 +12V
P15 +12V
3.3Onboard LEDs
Table 3-25 Onboard LEDs
LocationColor Description
D2RED Processor Hot Alert
Controls, LEDs, and Connectors
D8RED Thermal Trip Alert
D12Green Power OK indicator
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Controls, LEDs, and Connectors
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Functional Description
4.1Block Diagram
Figure 4-1Block Diagram for NITX-315/NITX-315-ET
Chapter 4
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Functional Description
4.2Processor
NITX-315/NITX-315-ET is designed to support the Tunnel Creek processor. The features are
detailed in the table below:
Table 4-1 Tunnel Creek Processor Features
FeatureDescription
Low-Power Intel Architecture Core 600 MHz (Ultra Low Power SKU), 1.0 GHz (Mainstream SKU) and 1.3
GHz(Premium SKU) with related TDP 2.7, 3.1, 3.3 W
System Memory ControllerSingle-channel DDR2 memory controller 32-bit data bus Supports
DDR2 800 MT/s data rates.
Supports only soldered-down DRAM configurations.
The memory controller does not support SODIMM or any type of
DIMMs currently.
Video Decodesupports MPEG2, MPEG4, VC1, WMV9, H.264 (main, baseline@L3
and high-profile level 4.0/4.1), and DivX.
Video Encodesupports MPEG4, H.263, H.264 (baseline@L3), and VGA/QGA.
Display Interfacessupports LVDS and Serial DVO display ports permitting simultaneous
independent operation of two displays
The LVDS interface supports pixel color depths of 18 and 24 bits with
maximum resolution up to 1280x768 @ 60Hz.
The Serial DVO (SDVO) Display Interface can provide maximum
resolution up to 1280x1024 @ 85Hz.
PCI Expresshas four x1 lane PCI Express root ports supporting the PCI Express
Base Specification, Revision 1.0a.
LPC InterfaceThe Tunnel Creek Processor implements an LPC interface as
described in the LPC1.1 Specification.
Intel High Definition Audio (Intel HD
Audio) Controller
SMBus Host ControllerThe Tunnel Creek Processor contains an SMBus host interface that
The Intel HD Audio controller supports up to four audio streams, two
in and two out. With the support of multi-channel audio stream, 32bit sample depth, and sample rate up to 192 kHz.
allows the processor to communicate with SMBus slaves. This
interface is compatible with most I2C devices. The SMBus host
controller provides a mechanism for the processor to initiate
communications with SMBus peripherals (slaves).
See the System Management Bus (SMBus) Specification, Version 1.0.
58
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Functional Description
Table 4-1 Tunnel Creek Processor Features (continued)
FeatureDescription
General Purpose I/O (GPIO)The Tunnel Creek Processor contains a total of 14 GPIO pins. Five of
these GPIOs are powered by core power rail and are turned off during
sleep mode (S3 and higher). Nine of these GPIOs are powered by the
suspend power well and remained active during S3. Four of the GPIOs
in suspend power well can be used to wake the system from the
Suspend-to-RAM state. The GPIOs are not 5V tolerant.
Serial Peripheral Interface (SPI)The Tunnel Creek Processor contains a SPI interface that supports
boot from SPI flash. This interface only supports BIOS boot.
Power ManagementThe processor contains full support for the Advanced Configuration
and Power Interface (ACPI) Specification, Revision 3.0.
Watchdog Timer (WDT)The Tunnel Creek Processor supports a user configurable watchdog
timer. It contains selectable prescaler approximately 1 microsecond
to 10 min. When the WDT triggers, GPIO [4] will be asserted.
PackageThe Tunnel Creek Processor is a 676 solder balls with 0.8mm ball
pitch FCBGA. The package dimensions are 22mm x 22mm, Z-height
is 2.097mm -2.35mm.
4.3System Memory
The Tunnel Creek integrated a single channel 32-bit non ECC DDR2 controller, it supports up to
1GB DDR2 memory at 800MHz.
There are 8 1Gb X 8 data width DRAM chips which forms a two Rank total 1GB memory
capacity topology. And for some low-end configuration, the DRAM chips can be configured as
one Rank topology which is a 512MB solution.
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Functional Description
4.4PCI-E Port
There are a total of four x1 PCI-E Gen1 ports in the TNC. The following figure displays the PCIE ports configuration:
Figure 4-2PCI-E Connection Diagram
4.5SATA
Two SATA ports are routed to the connector from the Topcliff, the SATA rate is 3Gbps and
supports AHCI. One port is a 7-pin SATA connector, another is a 15-power+7signals connector
which is used for "Slim Lite SSD".
60
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4.6MicroSD
There are two SDIO links in NITX-315/NITX-315-ET, Link1 is routed to a microSD slot. Link0 is
routed to an inner header, see Table 3-15 on page 49.
Figure 4-3SDIO Link Connection Diagram
Functional Description
4.7Ethernet Interfaces
NITX-315/NITX-315-ET provides a 10/100/1000 Ethernet connecting to the connector RJ45 J1.
The magnetic is integrated into the RJ45 connector. The Ethernet MAC is stored in an onboard
EEPROM.
The connection interface is RGMII between Topcliff and Marvell 88E1111.
The Ethernet supports LAN wake function.
There are 2 types of power supply required by Marvel 88E1111: 2.5 V and 1.2 V.
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Functional Description
4.8USB Interface
The Topcliff can support up to six USB2.0 host interfaces and one USB client interface which
complies with USB2.0 and USB1.1 protocols. For the host ports, two ports are routed to the
back IO panel; two ports are routed to one 2X5 pin inner header; one port is routed to the USB
flash header and the last one is routed to a switch which can lead the port to the USB flash
header or the mini PCIE slot. The function can be selected in the BIOS setup menu. The client
USB port is routed to a header.
The Following figure is the routing diagram. SeeTable 3-8 on page 45 and Table 3-9 on page
46.
Figure 4-4USB ports connections diagram
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4.9USB Flash
The on-board standard profile USB Flash (SSD) header supports the USB flash module which
stores the OS and application software allowing for boot up without a hard disk drive.
USB port 4 is used as the interface. The USB flash uses a 2x5 header with pitch 2.54 mm, the
header signal definition is displayed in the figure below:
Figure 4-5USB Flash Connector Pin Definition
Functional Description
4.10RS-232
There are four UART ports integrated in the Topcliff, one is a full 9-pin RS232 connecting to a
COM header P7. The others are 3-pin RS232 connecting to CH7317A-BF. See Table 3-13 on
page 48 and Table 3-14 on page 49.
4.11CAN bus
A CAN bus integrated in the Topcliff, The features are:
Supports CAN Protocol Version 2.0B Active
Supports bit rate up to 1 Mbit/s
Supports 32 message objects
Each message object has its own mask (identifier/direction/extended/New Data)
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Functional Description
Priority control by each message object
Programmable FIFO mode (concatenation of message objects)
Detection/identification of bit error/stuff error/CRC error/form error/acknowledge error
Programmable loop-back mode for self-test operation
DAR (Disabled Automatic Retransmission) mode for time triggered CAN applications
See Table 3-11 on page 47.
4.12I2C Serial Interface and Devices
There is one I2C compatible SMbus on the TNC. The following devices connect to the SMbus:
TPM
One 1x PCI-E slot
One Mini PCI-E slot
Temperature sensor EMC2103
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PCA9557
LM80CIMT-3
Figure 4-6 Board I2C Device Connection Diagram
Functional Description
Table 4-2 I2C Device Address
DeviceTPMPCIEx1Mini-PCIEEMC2103PCA9557LM80
AddressNote1Note25C3050
The PCI-E x1 slot SMB address depends on the PCI-E x1 card.
The Mini PCI-E card SMB address depends on the Mini PCI-E card
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Functional Description
4.13Video Interface
TNC supports two types of display output: SDVO and LVDS. For SDVO application, NITX315/NITX-315-ET uses a transfer solution CH7317A-BF to provide the SDVO to VGA usage.
The LVDS interface supports pixel color depths of 18 and 24 bits and a maximum resolution of
up to 1280x768 at 60Hz. Minimum pixel clock is 19.75MHz while the maximum pixel clock rate
is up to 80MHz.
The standard BIOS supports SDVO VGA out and LVDS output.
4.14Audio Interface
TNC can support a high definition audio interface. An Audio Codec is applied to the HDA link
for NITX-315/NITX-315-ET and one line-in and line-out port jacks are mounted in the back IO
panel. A header P12 for the front panel audio output is provided. See Table 3-10 on page 47.
4.15TPM Interface
The LPC is routed to a header P8 which is targeted for TPM application.
4.16BIOS Device
The SPI Flash is used as a BIOS device. The SPI BIOS chip capacity is 4 MB.
NITX-315/NITX-315-ET also provides an SF100 onboard SPI flash program function. When this
feature is used, the input power should be cut fully to avoid damage to the chipset. See Table
3-12 on page 48.
4.17GPIO Configuration
There are three parts of GPIO in NITX-315/NITX-315-ET, one is a user define GPIO which is
generated from PCA9557PW. The second part GPIO is coming from the TNC and the 3rd part
GPIO is derived from Topcliff.
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Functional Description
The PCA9557PW provides eight user defined GPIOs, 4 GPI and 4 GPO with 5V referenced on
one internal header P4. See Table 3-18 on page 51.
Table 4-3 TNC GPIO Definition
5 Core-well GPIOs (turned off during sleep mode)
NameFunction
GPIO[4] LPC[0] clock buffer strength control, Also muxed with
WDT_TIMEOUT
GPIO[3:2] Defines CMC base address
GPIO[1] Reserved
GPIO[0] Defines boot flash from SPI or LPC
9 Sus well GPIOs accessible during S3 sleep state (GPIO SUS[0:8])
GPIO_SUS[8] Defines number of ranks enabled
GPIO_SUS[6:5] Defines memory device densities
GPIO_SUS[2] Muxed with LVDS BKLTCTL
GPIO_SUS[1] Muxed with LVDS BKLTEN
GPIO_SUS[0] Defines memory device width (x16 or x8) Also muxed with LVDS
VDDEN
Table 4-4 Topcliff GPIO Configuration
NameFunction
GPIO0USB MUX control.
Low: USB port5 is routing to Mini PCI-E slot
High : USB port5 is routing to eUSB slot
GPIO1NC
GPIO2NC
GPIO3NC
GPIO4NC
GPIO5Client USB power detect.
Low: No Client USB power existence
High: Client USB power existence
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Functional Description
Table 4-4 Topcliff GPIO Configuration (continued)
NameFunction
GPIO6NC
GPIO7NC
GPIO8DRAM vendor.
GPIO9MEM capacity.
GPIO10MEM freq.
GPIO11NC
Low: SAMSUNG
High: MICRON
Low: 1GB
High: 512MB
Low: 667MHz
High: 800MHz
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4.18Clock Distribution
The following figure displays the clock source used by NITX-315/NITX-315-ET:
Figure 4-7Clock Distribution of NITX-315/NITX-315-ET
Functional Description
Table 4-5 Clock Assignments
DEVICECLOCK SIGNAL(S)FREQUENCY (MHz)CLOCK TREE SOURCEQTYVIO
TNCBCLK100BU7335MWV1DIFF
TNCHPLL_REFCLK100BU7335MWV1DIFF
TNCSDVO_REFCLK96BU7335MWV1DIFF
TNCCLK_14MHZ14.318BU7335MWV1Single
TNCCPU_PCIE_CLK100BU7335MWV1DIFF
LPC(From TNC)LPC_CLKOUT033TNC1Single
HDACLKHDA_CLK24TNC1Single
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Functional Description
Table 4-5 Clock Assignments (continued)
DEVICECLOCK SIGNAL(S)FREQUENCY (MHz)CLOCK TREE SOURCEQTYVIO
LVDSLVDS_CLK20~80TNC1DIFF
CH7317BSDVO_CLK20~160TNC1DIFF
MemoryDDR_CK400TNC1DIFF
9LPRS436CK505_X125Crystal1Single
TNCTNC_RTC_X132.768KHzCrystal1Single
TopcliffUARTCLK1.8432/12Crystal or BU7335MWV1Single
TopcliffIOH_CLK100BU7335MWV1DIFF
TopcliffSATA0_CLK75BU7335MWV1DIFF
TopcliffIOH_USB_CLK48BU7335MWV1Single
TopcliffIOH_SYS_CLK25BU7335MWV1 Single
PHYCLK_PCIE_LAN25BU7335MWV1DIFF
PCIE slotCLK_PCIE_SLOT100BU7335MWV1DIFF
Mini PCIE slotCLK_PCIE_MINICARD100BU7335MWV1DIFF
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BIOS
5.1POST
After power-up or reset, the BIOS performs a self-test, POST, that attempts to determine if
further operation is possible and that the detected configuration is expected. This process can
complete normally or result in a warning or an error. The boot process does not stop after a
warning but displays a message on the primary display device. If an error is detected, the boot
process is halted. If possible, a message will be displayed but failures early on in the test can
only be indicated in POST codes.
The POST process display depends on the Quiet Boot option.
Viewing all checkpoints generated by Aptio firmware requires a checkpoint card, which is
also named "POST Card" or "POST Diagnostic Card". They are PCI or LPC add-in cards that
show the value of I/O port 80h on a LED display. These cards are available at the electronic
or computer market around the world.
Chapter 5
5.2Boot Process
While performing the functions of the traditional BIOS, Aptio 4.x core follows the firmware
model described by the Intel Platform Innovation Framework for EFI ("the Framework"). The
framework is associated to the following "boot phases", which can be described by various state
code.
Driver Execution Environment (DXE) - main hardware initialization2
Boot Device Selection (BDS) - system setup, pre-OS user interface & selecting a bootable
device (CD/DVD, HDD, USB, Network, Shell, etc.)
5.3Initiating Setup
During the boot, pressing the F2 key on the keyboard requests the Setup utility be launched
once the self-test is complete and before searching for a boot device. See the Setup description
later in this document to describe the operation of this utility. If you exit Setup without saving
any changes, the boot process continues with the search for a boot device. If the changes are
saved, the motherboard loads the new settings and resets - re-starting the entire boot process.
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5.4Setup Utility
The BIOS incorporates a Setup utility that allows the user to alter a variety of system options.
This section describes the operation of the utility by describing the various options available
through a set of hierarchical menus. Not all options are available with all products and some
depend on BIOS customizations.
The current settings are stored in the SPI FLASH NVRAM area and any changes can be copied
back to this area via the Exit menu. The operation of the BIOS defaults is described later in this
document.
To start the utility, you must press the F2 key during the early stages of POST after power-up.
Note that this functionality operates with PS/2 keyboards, USB keyboards when enabled, and
via the console redirection facility when enabled.
The table below briefly describes the primary menus, most of which have sub-menus. The
following sections describe the menus in detail.
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Table 5-1 BIOS Primary Menu
MenuOptions
MainBIOS information and date and time
AdvancedAdvanced features including ACPI, CPU, IDE, USB, HW monitoring
and Serial Port settings
ChipsetFeatures including Host Bridge and Southbridge
BootBoot mode and Boot options
SecurityAdministrator's password
Save & ExitSave with or without changes, Load/save default settings and Boot
Device Selection
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BIOS
The Aptio navigation can be accomplished using a combination of the keys. These keys include
the <FUNCTION> keys, <ENTER>, <ESC>, <ARROW> keys, and so on.
Table 5-2 Aptio Navigation
KeyDescription
ENTERThe Enter key allows the user to select an option to edit its value or
access a sub menu.
Left/RightThe Left and Right <Arrow> keys allow you to select a screen.
Up/DownThe Up and Down <Arrow> keys allow you to select an item or sub-
screen.
+- Plus/MinusThe Plus and Minus <Arrow> keys allow you to change the field value
of a particular setup item.
TabThe <Tab> key allows you to select fields.
ESCThe <Esc> key allows you to discard any changes you have made and
exit the Aptio Setup.
When you are in sub-menu, <Esc> allows you to exit to the upper
menu.
Function keysWhen other function keys become available, they are displayed at
the right of the screen along with their intended function.
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BIOS
5.4.1Main Menu
Figure 5-1Main Menu
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Table 5-3 Main Menu Field Description
FieldDescription
BIOS VendorBIOS vendor name.
Core VersionAptio core version.
Project VersionProject name and its version.
Build DateBIOS build date.
Memory Information
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Table 5-3 Main Menu Field Description (continued)
FieldDescription
MRC VersionShow MRC Information
Total MemoryShow Total Memory Information
Platform Information
System DateSets the time and date (month/day/year format). To change these
System Time
Access LevelShow Administrator or User access level
values, go to each field and enter the desired value. Press the tab key
to move from hour to minute to second, or from month to day to
year. There is no default value.
Table 5-4 Platform Information
FieldDescription
Tunnel Creek Version02 (B1 Stepping)
BIOS
PUNIT Build DateMay 24 2011
PUNIT Build Time0:38:19
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BIOS
5.4.2Advanced Menu
Figure 5-2Advanced Menu
Table 5-5 Advanced Menu Field Description
FieldDescription
Launch PXE OpROMEnable or Disable Boot Option for Legacy Network Devices. Default is
"Enabled".
ACPI SettingsSystem ACPI Parameters, see Table 5-6 on page 77
Trusted ComputingTrusted Computing (TPM) settings, see Table 5-7 on page 77
CPU ConfigurationCPU Configuration Parameters, see Table 5-8 on page 78
Watchdog Timer ConfigurationEnable or Disable Watchdog Timer Function (WDT) , see Table 5-9 on
page 79
SDIO ConfigurationSDIO configuration Parameters, see Table 5-10 on page 79
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Table 5-5 Advanced Menu Field Description (continued)
FieldDescription
USB ConfigurationUSB Configuration Parameters, see Table 5-11 on page 79
LM80 H/W MonitorMonitor hardware status, see Table 5-12 on page 80
EMC2103 H/W MonitorMonitor hardware status, see Table 5-13 on page 80
Serial Port Console RedirectionSerial Port Console Redirection, see Table 5-14 on page 80
Table 5-6 ACPI Settings
FieldDescription
ACPI Sleep StateSelect the highest ACPI sleep state the system will enter, when the
SUSPEND button is pressed. States: Suspend Disabled and S3
(Suspend to RAM). Default is "S3(Suspend to RAM)".
BIOS
Table 5-7 Trusted Computing
FieldDescription
TPM Configuration
TPM SUPPORTEnables or Disables TPM support. O.S. will not show TPM. Reset of
platform is required. Items: Disable or Enable. The default value is
"Disable".
TPM StateTurn TPM Enable/Disable. NOTE: Your Computer will reboot during
restart in order to change State of TPM. Items: Disabled, Enabled.
Default is "Disabled".
Pending TPM OperationSchedule TPM operation. NOTE: Your Computer will reboot during
restart in order to change the State of TPM.
Items: None, Enable Take Ownership, Disable Take Ownership, TPM
Clear. Default is "None".
Current TPM Status InformationIf TPM SUPPORT is Disable, the TPM Status information will show as
"TPM Support OFF" or "NO TPM Hardware" based on the TPM
hardware connection status. If TPM SUPPORT is set to "Enable", it will
show the following information
TPM Enable Status:Provides the current TPM Enable/Disable status information. Items:
Disabled, Enabled.
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Table 5-7 Trusted Computing (continued)
FieldDescription
TPM Active Status:Provides the current active state of the TPM. Items: Activated,
Deactivated.
TPM Owner Status:Provides current TPM Ownership state. Items: Owned, UnOwned.
Table 5-8 CPU Configuration
FieldDescription
Processor Type InformationProcessor Type information
EMT64EMT64
Processor SpeedProcessor Speed
System Bus SpeedSystem Bus Speed
Ratio StatusRatio Status
Actual RatioActual Ratio
Processor SteppingProcess Stepping
Microcode RevisionMicrocode Revision
L1 Cache RAML1 Cache RAM
L2 Cache RAML2 Cache RAM
Processor CoreProcessor Core
Hyper-ThreadingHyper-Threading
Intel SpeedStepEnable or Disable Intel® SpeedStep™. Default is Enabled.
Hyper-ThreadingEnabled for Windows XP and Linux (OS optimized for Hyper-
Threading technology) and Disabled for other OS (OS not
optimized for Hyper-Threading Technology). Default is "Enabled".
Execute Disable BitXD can prevent certain classes of malicious buffer overflow attacks
when combined with a supporting OS (Windows Server 2003 SP1,
Windows XP SP2, SuSE Linux 9.2, RedHat Enterprise 3 Update 3.)
Default is "Enabled".
Intel VirtualizationWhen enabled, a VM can utilize the additional hardware
capabilities provided by Vanderpool Technology. Default is
"Disabled".
C-StatesEnable/Disable C2 and above. Default is "Enabled".
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Table 5-8 CPU Configuration (continued) (continued)
FieldDescription
Enhanced C3Enable or Disable Enhanced C3 State. Default is "Disabled".
Table 5-9 Watchdog Timer Configuration
FieldDescription
Watchdog TimerSelect an optimal settings Watchdog Timer (WDT). Items:
Disabled, Enabled. Default value is "Disabled".
WDT Reset TypeSelect the wanted reset type when the watchdog timer is
triggered. Items: Cold Reset, Warm Reset. Default is "Warm Reset".
Time-Out (Minutes)Set timer to wait before system reset. The value range is from 1 to
10 minutes, the step is 1 minute. Default value is "5 minutes".
Table 5-10 SDIO Configuration
FieldDescription
SDIO Access ModeAuto Option: Access SD device in DMA mode if controller supports
it, otherwise in PIO mode. DMA Option: Access SD device in DMA
mode. PIO Option: Access SD device in PIO mode.
Default is Auto.
Table 5-11 USB Configuration
FieldDescription
USB Devices:List the attached USB Devices
USB SupportUSB Support Parameters.
Legacy USB SupportEnables Legacy USB support. AUTO option disables legacy support
if no USB devices are connected. Disable option will keep USB
devices available only for EFI application. Default is "Enabled".
EHCI Hand-offThis is a workaround for OSes without EHCI hand-off support. The
EHCI ownership change should be claimed by EHCI driver. Default
is "Enabled".
Mass Storage Devices:List the attached Mass Storage Devices.
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Table 5-12 LM80 H/W Monitor
FieldDescription
CPU_VCOREMonitor the CPU VCORE voltage
VCC0_89Monitor the VCC 0.89V
VCC1_05 Monitor the VCC 1.05V
VCC1_2Monitor the VCC 1.2V
VCC1_8Monitor the VCC 1.8V
VCC3_3 Monitor the VCC 3.3V
VCC5Monitor the VCC 5V
Table 5-13 EMC2103 H/W Monitor
FieldDescription
CPU TemperatureCPU Temperature
Board TemperatureBoard Temperature
CPU Fan SpeedCPU Fan Speed
CPU Fan Duty CycleCPU Fan Duty Cycle
Automatic Fan ControlEnable/Disable automatic fan control in the EMC2103. Default is
"Enabled".
Table 5-14 Serial Port Console Redirection
FieldDescription
COM0(Pci Bus2,Dev10,Func1)
Console RedirectionConsole Redirection Enable or Disable. Default is Disabled.
Console Redirection SettingsSee Table 5-14 on page 80
COM1(Pci Bus 2,Dev 10,Func2)
Console RedirectionConsole Redirection Enable or Disable. Default is Disabled.
Console Redirection SettingsSee later description
COM2(Pci Bus 2,Dev 10,Func3)
Console RedirectionConsole Redirection Enable or Disable. Default is Disabled.
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Table 5-14 Serial Port Console Redirection (continued)
FieldDescription
Console Redirection SettingsSee later description
COM3(Pci Bus 2,Dev 10,Func4)
Console RedirectionConsole Redirection Enable or Disable. Default is Disabled.
Console Redirection SettingsSee Table 5-14 on page 80
Serial Port for Out-of-Band Management/Windows Emergency Management Services (EMS)
Console RedirectionConsole Redirection Enable or Disable. Default is Disabled.
Out-of-Band Mgmt PortMicrosoft Windows Emergency Management Serivces (EMS)
allows for remote management of a Windows Server OS through a
serial port. Items: COM0, COM1, COM2, COM3. Default is
COM0(Pci Bus2, Dev10, Func1)
Data Bits8
ParityNone
BIOS
Stop Bits1
Terminal TypeVT-UTF8 is the preferred terminal type for out-of-band
management. The next best choice is VT100+ and then VT100.
See above, in Console Redirection Settings page, for more Help
with Terminal Type/Emulation. Items: VT100, VT100+, VT-UTF8,
ANSI. Default is VT-UTF8.
VT100+: Extends VT100 to support color, function keys, etc. VTUTF8: Uses UTF8 encoding to map Unicode chars onto 1 or more
bytes. Items: VT100, VT100+, VT-UTF8, ANSI. Default is VT100.
Bits per secondSelects serial port transmission speed. The speed must be
matched on the other side. Long or noisy lines may require lower
speeds. Items: 9600, 19200, 57600, 115200. Default is 115200.
Data BitsSelects the data bits. Items: 7, 8. Default is 8.
NITX-315/NITX-315-ET Installation and Use (6806800L71D)
ParityA parity bit can be sent with the data bits to detect some
transmission errors. Even: parity bit is 0 if the num of 1's in the data
bits is even. Odd: parity bit is 0 if num of 1's in the data bits is odd.
Mark: parity bit is always 1. Space: Parity bit is always 0. Mark and
Space Parity do not allow for error detection. They can be used as
an additional data bit. Items: None, Even, Odd, Mark, Space.
Default is None.
Stop BitsStop bits indicate the end of a serial data packet. (A start bit
indicates the beginning). The standard setting is 1 stop bit.
Communication with slow devices may require more than 1 stop
bit. Items: 1, 2. Default is 1.
Flow ControlFlow control can prevent data loss from buffer overflow. When
sending data, if the receiving buffers are full, a 'stop' signal can be
sent to stop the data flow. Once the buffers are empty, a 'start'
signal can be sent to re-start the flow. Hardware flow control uses
two wires to send start/stop signals. Software flow control uses
start/stop ASCII chars, which slows down the data flow and can be
problematic if binary data is being sent. Items: None, Hardware
RTS/CTS. Default is None.
Recorder ModeOn this mode enabled only text will be send. This is to capture
Terminal data. Items: Disabled, Enabled. Default is Disabled.
Resolution 100x31Enables or disables extended terminal resolution. Items: Disabled,
Enabled. Default is Enabled.
Legacy OS RedirectionOn Legacy OS, the Number of Rows and Columns supported
redirection. Items: 80x24, 80x25. Default is 80x24.
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5.4.3Chipset Menu
Figure 5-3Chipset Menu
BIOS
Table 5-16 Chipset Menu Field Descriptions
FieldDescription
North Bridge Chipset ConfigurationNorth Bridge Parameters, see Table 5-17 on page 83
South Bridge Chipset ConfigurationSouth Bridge Parameters, see Table 5-19 on page 84
IOH ConfigurationIOH Configuration Options
Table 5-17 North Bridge Chipset Configuration
FieldDescription
North Bridge Chipset Configuration
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Table 5-17 North Bridge Chipset Configuration (continued)
FieldDescription
vBIOS Version2032
IEGD Driver VersionN/A
MSAC Mode SelectSelect the size of the graphics memory aperture and untrusted
space. Used by the Integrated Graphics Device. Item: Enabled,
512MB; Enabled, 256MB; Enabled, 128MB. Default is "Enabled,
256MB".
IGD - Boot TypeSelect the Video Device which will be activated during POST. This has
no effect if external graphics present. Items: VBIOS Default, CRT,
LVDS, CRT+LVDS. Default is VBIOS Default
Boot Display ConfigurationBoot Display Configuration, see Table 5-18 on page 84
This item only shows with LVDS version BIOS, by default, this item is
not shown.