Intel® is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.
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Microsoft®, Windows® and Windows Me® are registered trademarks of Microsoft Corporation; and Windows XP™ is a trademark of
Microsoft Corporation.
PICMG®, CompactPCI®, AdvancedTCA™ and the PICMG, CompactPCI and AdvancedTCA logos are registered trademarks of the PCI
Industrial Computer Manufacturers Group.
UNIX® is a registered trademark of The Open Group in the United States and other countries.
Notice
While reasonable efforts have been made to assure the accuracy of this document, Artesyn assumes no liability resulting from any
omissions in this document, or from the use of the information obtained therein. Artesyn reserves the right to revise this document
and to make changes from time to time in the content hereof without obligation of Artesyn to notify any person of such revision or
changes.
Electronic versions of this material may be read online, downloaded for personal use, or referenced in another document as a URL to
an Artesyn website. The text itself may not be published commercially in print or electronic form, edited, translated, or otherwise
altered without the permission of Artesyn.
It is possible that this publication may contain reference to or information about Artesyn products (machines and programs),
programming, or services that are not available in your country. Such references or information must not be construed to mean that
Artesyn intends to announce such Artesyn products, programming, or services in your country.
Limited and Restricted Rights Legend
If the documentation contained herein is supplied, directly or indirectly, to the U.S. Government, the following notice shall apply
unless otherwise agreed to in writing by Artesyn.
Use, duplication, or disclosure by the Government is subject to restrictions as set forth in subparagraph (b)(3) of the Rights in
Technical Data clause at DFARS 252.227-7013 (Nov. 1995) and of the Rights in Noncommercial Computer Software and
Documentation clause at DFARS 252.227-7014 (Jun. 1995).
Contact Address
Artesyn Embedded Technologies Artesyn Embedded Technologies
Marketing Communications
2900 S. Diablo Way, Suite 190
Tempe, Arizona 85282
6806800M10BMay 2011Changed marketing name to MITX-CORE-
6806800M10AMay 2011First edition
MITX-CORE-820 Installation and Use (6806800M10H)
Components" on page 47.
Added information on the board CPU specs.
810/820.
Implemented editorial changes.
21
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About this Manual
About this Manual
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MITX-CORE-820 Installation and Use (6806800M10H)
Page 23
Safety Notes
This section provides warnings that precede potentially dangerous procedures throughout
this manual. Instructions contained in the warnings must be followed during all phases of
operation, service, and repair of this equipment. You should also employ all other safety
precautions necessary for the operation of the equipment in your operating environment.
Failure to comply with these precautions or with specific warnings elsewhere in this manual
could result in personal injury or damage to the equipment.
Artesyn intends to provide all necessary information to install and handle the product in this
manual. Because of the complexity of this product and its various uses, we do not guarantee
that the given information is complete. If you need additional information, ask your Artesyn
representative.
The product has been designed to meet the standard industrial safety requirements. It must
only be used in its specific area of office telecommunication industry, industrial control, and
development. It must not be used in safety critical components, life supporting devices or on
aircraft.
Only personnel trained by Artesyn or persons qualified in electronics or electrical engineering
are authorized to install, remove or maintain the product. The information given in this manual
is meant to complete the knowledge of a specialist and must not be used as replacement for
qualified personnel.
Keep away from live circuits inside the equipment. Operating personnel must not remove
equipment covers. Only factory authorized service personnel or other qualified service
personnel is allowed to remove equipment covers for internal subassembly or component
replacement or any internal adjustment.
Do not install substitute parts or perform any unauthorized modification of the equipment or
the warranty may be voided. Contact your local Artesyn representative for service and repair
to make sure that all safety features are maintained.
Artesyn and our suppliers take significant steps to make sure that there are no bent pins on the
backplane or connector damage to the boards prior to leaving the factory. Bent pins caused by
improper installation or by inserting boards with damaged connectors could void the Artesyn
warranty for the backplane or boards.
This product operates with dangerous voltages that can cause injury or death. Use extreme
caution when handling, testing, and adjusting this equipment and its components.
MITX-CORE-820 Installation and Use (6806800M10H)
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Safety Notes
System Installation
Damage of Circuits
Electrostatic discharge and incorrect installation and removal of the product can damage
circuits or shorten its life.
Before touching the product make sure that you are working in an ESD-safe environment or
wearing an ESD wrist strap or ESD shoes. Hold the product by its edges and do not touch any
components or circuits.
Pin Diagram
Forcing the module into the system may damage connector pins.
If the module hangs during insertion, pull it out and insert it again.
Damage of the Product and Additional Devices and Modules
Incorrect installation or removal of additional devices or modules damages the product or the
additional devices or modules.
Before installing or removing additional devices or modules, read the respective
documentation and use appropriate tools.
Operation
System Damage
During the course of handling, shipping, and assembly, pins, mounting screws, fans and other
items can become loose or damaged.
Do not operate a damaged shelf, this can cause damage to devices that interact with it.
System Overheating
Cooling Vents
24
MITX-CORE-820 Installation and Use (6806800M10H)
Page 25
Improper cooling can lead to blade and system damage and can void the manufacturer’s
warranty.
To ensure proper cooling and undisturbed airflow through the system always operate the
system in a horizontal position. Do not obstruct the ventilation openings at the top, sides and
back of the system. Keep the fresh air intake at the bottom-front side of the chassis completely
clear. Make sure that the fresh air supply is not mixed with hot exhaust from other devices.
Make sure that all slots are populated with either blades, filler blades, or dummy blades.
Product Damage
High humidity and condensation on surfaces cause short circuits.
Do not operate the product outside the specified environmental limits. Make sure the product
is completely dry and there is no moisture on any surface before applying power.
Expansion and FRU Replacement
Safety Notes
Product Damage
Bent pins or loose components can cause damage to the product, the backplane, or other
system components.
Carefully inspect the product and the backplane for both pin and component integrity before
installation.
Personal Injury
During operation, hot surfaces may be present on the heat sinks and components of the
product.
To prevent injury from hot surfaces do not touch any of the exposed components or heatsinks
on the product when handling. Use the handle and face plate when removing the product
from the enclosure.
Battery
Data Loss
If the battery does not provide enough power anymore, the RTC is initialized and the data in
the NVRAM is lost.
Replace the battery before seven years of actual battery use have elapsed.
MITX-CORE-820 Installation and Use (6806800M10H)
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Safety Notes
Data Loss
Replacing the battery always results in data loss of the devices which use the battery as power
backup.
Back up affected data before exchanging the battery.
Data Loss
Installing another battery type than the one that is mounted at product delivery may cause
data loss since other battery types may be specified for other environments or may have a
shorter lifetime.
Only use the same type of lithium battery as is already installed.
PCB and Battery Holder Damage
Removing the battery with a screw driver may damage the PCB or the battery holder.
Do not use a screw driver to remove the battery from its holder.
Environment
Environmental Damage
Improperly disposing of used products may harm the environment.
Always dispose of used products according to your country’s legislation and manufacturer’s
instructions.
26
MITX-CORE-820 Installation and Use (6806800M10H)
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Sicherheitshinweise
Dieses Kapitel enthält Hinweise, die potentiell gefährlichen Prozeduren innerhalb dieses
Handbuchs vorrangestellt sind. Beachten Sie unbedingt in allen Phasen des Betriebs, der
Wartung und der Reparatur des Systems die Anweisungen, die diesen Hinweisen enthalten
sind. Sie sollten außerdem alle anderen Vorsichtsmaßnahmen treffen, die für den Betrieb des
Systems innerhalb Ihrer Betriebsumgebung notwendig sind. Wenn Sie diese
Vorsichtsmaßnahmen oder Sicherheitshinweise, die an anderer Stelle diese Handbuchs
enthalten sind, nicht beachten, kann das Verletzungen oder Schäden am System zur Folge
haben.
Artesyn ist darauf bedacht, alle notwendigen Informationen zum Einbau und zum Umgang mit
dem System in diesem Handbuch bereit zu stellen. Da es sich jedoch bei dem System um ein
komplexes Produkt mit vielfältigen Einsatzmöglichkeiten handelt, können wir die
Vollständigkeit der im Handbuch enthaltenen Informationen nicht garantieren. Falls Sie
weitere Informationen benötigen sollten, wenden Sie sich bitte an die für Sie zuständige
Geschäftsstelle von Artesyn.
Das Produkt erfüllt die für die Industrie geforderten Sicherheitsvorschriften und darf
ausschließlich für Anwendungen in der Telekommunikationsindustrie, im Zusammenhang mit
Industriesteuerungen und in der Entwicklung verwendet werden. Es darf nicht in
sicherheitskritischen Anwendungen, lebenserhaltenden Geräten oder in Flugzeugen
verwendet werden.
Einbau, Wartung und Betrieb dürfen nur von durch Artesyn ausgebildetem oder im Bereich
Elektronik oder Elektrotechnik qualifiziertem Personal durchgeführt werden. Die in diesem
Handbuch enthaltenen Informationen dienen ausschließlich dazu, das Wissen von
Fachpersonal zu ergänzen, können dieses jedoch nicht ersetzen.
Halten Sie sich von stromführenden Leitungen innerhalb des Systems fern. Entfernen Sie auf
keinen Fall die Systemabdeckung. Nur werksseitig zugelassenes Wartungspersonal oder
anderweitig qualifiziertes Wartungspersonal darf die Systemabdeckung entfernen, um
Systemkomponenten zu ersetzen oder andere Anpassungen vorzunehmen.
Installieren Sie keine Ersatzteile oder führen Sie keine unerlaubten Veränderungen am System
durch, sonst verfällt die Garantie. Wenden Sie sich für Wartung oder Reparatur bitte an die für
Sie zuständige Geschäftsstelle von Artesyn. So stellen Sie sicher, dass alle
sicherheitsrelevanten Aspekte beachtet werden.
MITX-CORE-820 Installation and Use (6806800M10H)
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Sicherheitshinweise
System Installation
Beschädigung von Schaltkreisen
Elektrostatische Entladung und unsachgemäßer Ein- und Ausbau des Produktes kann
Schaltkreise beschädigen oder ihre Lebensdauer verkürzen.
Bevor Sie das Produkt oder elektronische Komponenten berühren, vergewissern Sie sich, daß
Sie in einem ESD-geschützten Bereich arbeiten.
Schäden an Steckern
Wenn Sie das Modul mit Gewalt installieren, können die Anschlussstifte in den Steckern
beschädigt werden.
Falls sich das Modul während der Installation verkantet, ziehen Sie es wieder heraus und führen
Sie sie erneut ein.
Beschädigung des Produktes und der Zusatzmodule
Fehlerhafter Ein- oder Ausbau von Zusatzmodulen führt zu Beschädigung des Produktes oder
der Zusatzmodule.
Lesen Sie deshalb vor dem Ein- oder Ausbau von Zusatzmodulen die Dokumentation und
benutzen Sie angemessenes Werkzeug.
Betrieb
Beschädigung des Systems
Während des Transportes, Zusammenbaus und dem Umgang mit dem System können sich
Schrauben, Lüfter oder andere Teile lösen oder beschädigt werden.
Nehmen Sie ein beschädigtes System nicht in Betrieb. Sonst können andere Einrichtungen, die
mit dem System kommunizieren, beschädigt werden.
Überhitzung des Systems
Lüftungsöffnungen
28
MITX-CORE-820 Installation and Use (6806800M10H)
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Unzureichende Lüftung kann Schäden an Blades und am System verursachen und die
Herstellergarantie ungültig werden lassen.
Um eine ausreichende Lüftung zu gewährleisten, stellen Sie sicher, dass das System während
des Betriebs waagerecht steht. Halten Sie die Lüftungsschlitze an der Oberseite, der Rückseite
und den Seiten des Systems frei. Halten Sie die Frischluftzufuhröffnung an der unteren
Vorderseite des Systems völlig frei und stellen Sie sicher, dass sich die Frischluft nicht mit der
Abluft von anderen Systemen mischt.
Beschädigung des Systems
Hohe Luftfeuchtigkeit und Kondensat auf den Oberflächen der Produkte kann zu
Kurzschlüssen führen.
Betreiben Sie die Produkte nur innerhalb der angegebenen Grenzwerte für die relative
Luftfeuchtigkeit und Temperatur und stellen Sie vor dem Einschalten des Stroms sicher, dass
sich auf den Produkten kein Kondensat befindet.
Sicherheitshinweise
Erweiterung und FRU Austausch
Beschädigung des Produktes
Verbogene Stecker oder lose Teile können das Produkt, die Backplane oder andere
Systemkomponenten beschädigen.
Prüfen Sie das Produkt und die Backplane vor dem Einabau sorgfältig auf verbogene Stecker
und lose Teile.
Verletzungsgefahr
Während des Betriebs können Oberflächen an den Kühlkörpern oder anderen Komponenten
sehr heiß werden.
Um Verletzungen durch Verbrennung zu vermeiden, berühren Sie während der Arbeit keine
Komponenten oder Kühlkörper auf dem Produkt. Fassen Sie das Produkt an den Handles und
der Frontblende an, wenn Sie es aus dem System herausnehmen.
MITX-CORE-820 Installation and Use (6806800M10H)
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Sicherheitshinweise
Batterie
Datenverlust
Wenn die Batterie nur noch ungenügend geladen ist, wird der RTC zurückgesetzt und Daten im
NVRAM gehen verloren.
Tauschen Sie daher die Batterie nach spätestens einem Jahr aus.
Datenverlust
Der Austausch der Batterie führt unweigerlich zu Datenverlust bei Bauteilen, die die Batterie als
Backup verwenden.
Sichern Sie daher alle Daten, die bei Austausch der Batterie verloren gehen.
Datenverlust
Wenn Sie einen anderen Batterietyp installieren als der, der bei Auslieferung des Produktes
installiert war, kann Datenverlust die Folge sein, da die neu installierte Batterie für andere
Umgebungsbedingungen oder eine andere Lebenszeit ausgelegt sein könnte.
Verwenden Sie daher den gleichen Batterietyp, der bei Auslieferung des Produktes installiert
war.
Beschädigung des PCBs und der Batteriehalterung
Wenn Sie die Batterie mit einem Schraubendreher ausbauen, können das PCB und die
Batteriehalterung beschädigt werden.
Benutzen Sie keinesfalls einen Schraubendreher um die Batterie aus der Halterung zu nehmen.
Environment
Umweltverschmutzung
Falsche Entsorgung der Produkte schadet der Umwelt.
Entsorgen Sie alte Produkte gemäß der in Ihrem Land gültigen Gesetzgebung und den
Empfehlungen des Herstellers.
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Introduction
1.1Overview
MITX-CORE-820 is an Artesyn designed Mini-ITX motherboard based on Intel® 6 Series Chipset
supporting Intel® Sandy Bridge Mobile rPGA Quad/Dual core processors.
1.2Features
The following table lists the features of the MITX-CORE-820 motherboard.
Table 1-1 MITX-CORE-820 Features Summary
FunctionFeatures
CPU (rPGA988B Socket)Supports one 45 W 4-core Core i7 Intel Sandy Bridge-Mobile
Chapter 1
rPGA 988B embedded processor.
Intel AMT 7.0, Turbo Boost
Also provides the option to support one 35 W 2-core Core i5
Serial ATA specification revision 3.0
Serial ATA II: extensions to SATA1.0 revision1.0
Serial ATA 6G specification
VESA Specification
SMBIOS 2.3
ACPI Wake-up event:
This product is designed to meet the following standards.
Table 1-2 Board Standard Compliances
StandardDescription
IEC 60950-1General requirements of Safety-Part 1 of
EN55024 (EU)Limits and methods of measurements of immunity
MITX-CORE-820 Installation and Use (6806800M10H)
Information Technology Equipment.
characteristics of Information Technology
Equipment.
33
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Introduction
Table 1-2 Board Standard Compliances
StandardDescription
FCC 47 CFR Part 15 Subpart B (US), Class BFederal Communications Commission Radio
EN55022 Class B (EU)Limits and methods of measurements of radio
Frequency Devices class B level requirements.
disturbance characteristics of Information
Technology Equipment.
AS/NZS CISPR 22 Class B (Australia/New
Zealand)
VCCI Class B (Japan)Voluntary Control Council for Interference by
Limits and methods of measurement of radio
disturbance characteristics of Information
Technology Equipment.
Information Technology Equipment.
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Introduction
The following figure is the copy of Declaration of Conformity for MITX-CORE-820:
Figure 1-1Declaration of Conformity
EC Declaration of Conformity
According to EN 17050-1:2004
Manufacturer’s Name:
Manufacturer’s Address:
Declares that the following product, in accordance with the requirements of 2004/108/EC, 2006/95/EC, 2011/65/EU and their amending directives,
Product:
Model Name/Number:
has been designed and manufactured to the following specifications:
EN55022:2006 (A1: 2007) Class B
EN55024: 1998 (A1: 2001 + A2: 2003)
IEC 60950-1 (2nd Edition) +A1:2009
2011/65/EU RoHS Directive
As manufacturer wehereby declare that the product named above has been designed to complywith the rele-vant sections of the above referenced specifications. This product complieswith the essential health and safetyrequirements of the above specified directives. We have an internal production control system that ensures compliance between the manufactured products and the technical documentation.
Artesyn Embedded TechnologiesEmbedded Computing
Zhongshan General Carton Box Factory Co. Ltd. No 62, QiGuan Road West, Shiqi District, 528400 Zhongshan CityGuangdong, PRC
MCASE-820MCASE-820 Mini ITX Motherboard with chassis
MITX-CORE-HTSNKMITX-CORE Heatsink
38
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Hardware Preparation and Installation
2.1Environmental and Power Requirements
The following environmental and power requirements are applicable to the MITX-CORE-820.
2.1.1Environmental Requirements
The following table lists the environmental requirements that the board must meet when
operated in your particular system configuration.
Operating temperatures refer to the temperature of the air circulating around the
motherboard and not to the component temperature.
Chapter 2
Product Damage
High humidity and condensation on surfaces cause short circuits.
Do not operate the product outside the specified environmental limits. Make sure the
product is completely dry and there is no moisture on any surface before applying
power.
Overheating and Damage of the Product
Operating the product without forced air cooling can lead to overheating and thus
damage of the product.
When operating the product, make sure that forced air cooling is available in the shelf.
Table 2-1 Environmental Requirements
ParameterOperatingNon-Operating
Cooling MethodForced air
Temp Cycle ClassNA-40°C to 85°C:500 cyc
MITX-CORE-820 Installation and Use (6806800M10H)
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Hardware Preparation and Installation
Table 2-1 Environmental Requirements (continued)
ParameterOperatingNon-Operating
Temperature0°C to 55 °C-40°C to 85°C
Humidity10 to 90% Non-condensing NA
Vibration0.01g^2/Hz at 5-500 Hz
Random vibration
Shock20 g 11 ms sine or sawNA
Altitude-60 to 4000 m ASLNA
2.1.2Power Requirements
The MITX-CORE-820 is designed to receive power from an input power connector that accepts
+12V or +14.4V~+19.5V in the back-panel IO region, or from a 4-pin +12V ATX power
connector. When a charger board is used, the power can be supplied using a 4-pin +12 V ATX
power connector from the adapter or battery connected to charger board. The TDP of the
board is 70W (no peripheral). The maximum power consumption of the board is 180W (with
the following assumptions: 75W PCI Express Graphics card, all of the USB ports are active or
powered, all components and peripherals on the boards are running at full loading). The power
supply used for MITX-CORE-820 should have margin to meet the power consumption in
different circumstance.
When the back-panel IO power connector is used to power the board, the 4-pin +12V ATX
power connector can also be used as an output DC source, but assuming this wouldn't affect
the power of the board.
NA
2.1.3Power Dissipation
The following table shows the power dissipation of the board’s critical components.
Table 2-2 Power Dissipation of Critical Components
PartTDP (W)Operation Limit (C)
CPUMaximum: 45Tj=100
Chipset3.9Tj=108
40
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Hardware Preparation and Installation
Table 2-2 Power Dissipation of Critical Components
PartTDP (W)Operation Limit (C)
SODIMM5W (Two SODIMMs)Tc=85
WG82574L0.473WTc=109
WG82579LM0.659WTc=106
2.2Unpacking and Inspecting the Board
Read all notices and cautions prior to unpacking the product.
Damage of Circuits
Electrostatic discharge and incorrect installation and removal of the product can
damage circuits or shorten its life.
Before touching the product make sure that you are working in an ESD-safe
environment or wearing an ESD wrist strap or ESD shoes. Hold the product by its edges
and do not touch any components or circuits.
Shipment Inspection
1. Verify that you have received all items of your shipment.
Quick Start Guide and Safety Notes summary
Motherboard
Two SATA power Cables
Two SATA data cables
Driver CD
I/O Shield
MITX-CORE-820 Installation and Use (6806800M10H)
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Hardware Preparation and Installation
2. Check for damage and report any damage or difference to customer service.
3. Remove the desiccant bag shipped together with the board and dispose of it according to
your country’s legislation.
Environmental Damage
Improper disposal of used products may harm the environment.
Always dispose of used products according to your country’s legislation and
manufacturer’s instructions.
This product has been thoroughly inspected before shipment. If any damage occurred during
transportation or any items are missing, contact customer service immediately.
2.3Preparing the Installation Environment
Before you install or replace components, pay attention to the following:
Wear an ESD-preventive wrist strap to prevent the static electricity from damaging the
device.
Keep the area where the components reside clean and keep the components away from
heat-generating devices, such as radiator.
Ensure that your sleeves are tightened or rolled up above the elbow. For safety purposes,
it is not recommended to wear jewelry, watch, glasses with metal frame, or clothes with
metal buttons.
Do not exert too much force, or insert or remove the components forcibly. Avoid damage
to the components or plug-ins.
Confirm the feasibility of the of operation
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Hardware Preparation and Installation
There are available spare parts of the components to be installed or replaced in the
equipment warehouse. When the available spare parts are lacking, contact Artesyn
Embedded Technologies for help in time. For details on how to get help from Artesyn
Embedded Technologies, visit http://www.artesyn.com/computing/
Make sure that the new components are in good condition, without defects such as
oxidation, chemical corrosion, missing components, or transportation damage. Read this
document to familiarize yourself with the proper installtion and replacement procedures
of the component, as well as to master the skills required by the operation.
Check the environment
Make sure that the power supply, temperature, and humidity meet the operating
requirements for the board and its components. For details, refer to the respective system
documentation.
Prepare the parts and the tools
Prepare the components to be installed or replaced. When you hold or transport the
components, use the special antistatic package. Prepare the cross screwdriver, screws,
plastic supports, cooling gel, and ESD-preventive wrist strap.
Confirm installation or changing position
Confirm the position where MITX-CORE-820 will be installed.
If a serious problem occurs and cannot be solved when you install or replace the
component, contact Artesyn Embedded Technologies for technical support.
MITX-CORE-820 Installation and Use (6806800M10H)
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Hardware Preparation and Installation
2.4Memory Module Installation
When installing or replacing the module, pay attention to the following:
The MITX-CORE-820 supports up to 16GB dual-channel, non-ECC, unbuffered DDR3 SO-
DIMM.
The SO-DIMMs must have the same sizes, frequencies, types and technologies, physical
designs, and manufacturers.
SO-DIMMs must be of single or dual rank type. Quad rank type modules are not
supported.
Pin Damage
Forcing the module into the system may damage connector pins. If the module freezes
during insertion, pull it out and try again.
44
Installing Memory Module
1. Wear the ESD-preventive wrist strap.
2. Lay the MITX-CORE-820, where the SO-DIMM is to be installed, on the antistatic desktop.
3. Take the SO-DIMM out of the antistatic package, holding it by the edges.
4. Line up the notch located on the row of the metal pins at the bottom of the module with
the key in the SO-DIMM slot on the motherboard.
5. Insert the SO-DIMM in a slantwise position or at a 45° angle to slide the module into place.
6. Press the module down against the motherboard until you hear it snap into place. The
modules must be properly aligned before you press it down into its final position. Remove
the module from the socket and reinstall it if you cannot press it down into its final position.
MITX-CORE-820 Installation and Use (6806800M10H)
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Hardware Preparation and Installation
Removing Memory Module
1. Wear the ESD-preventive wrist strap.
2. Release the module from the slot by pushing the spring latches on either side of the module
outward.
3. Lift the module from the motherboard.
Damage of the Product and Additional Devices and Modules
Incorrect installation or removal of additional devices or modules damages the product
or the additional devices or modules.
Before installing or removing additional devices or modules, read the respective
documentation and use appropriate tools.
2.5Processor Cooler Installation
Installing the Processor Cooler
1. Wear the ESD-preventive wrist strap.
2. Take the processor cooler and the backplate out of the anti-static package.
3. Prepare the backplate by taking off the protective film to reveal the glue layer.
4. Align the backplate to the motherboard. The screw holes on backplate should fit exactly
over the holes on the motherboard. Make sure the glue layer of the backplate does not
touch any other part of the motherboard.
5. Place the cooler on the backplate and secure it with the provided screws.
6. Plug the fan header into the fan connector on the motherboard.
MITX-CORE-820 Installation and Use (6806800M10H)
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Hardware Preparation and Installation
Removing the Processor Cooler
1. Wear the ESD-preventive wrist strap.
2. Disconnect the fan header from the fan connector on the motherboard.
3. Loosen the screws to remove the processor cooler from the backplate.
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Controls, LEDs and Connectors
3.1Board Layout
The module components of the MITX-CORE-820 are shown in detail in Figure 3-1and Figure
3-2.
Figure 3-1MITX-CORE-820 Module Components
Chapter 3
MITX-CORE-820 Installation and Use (6806800M10H)
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Controls, LEDs and Connectors
Figure 3-2MITX-CORE-820 Module Components - Continued
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3.2Connector Definitions
The following table lists the connectors and headers located on the MITX-CORE-820
motherboard along with a link to each connector's associated pin out definition document.
Connectors or headers are defined in the following sections.
Table 3-1 MITX-CORE-820 Connectors
Reference
DesignatorFunctionPinout Definition
P6LVDS ConnectorSee LVDS, on page 56
P29LVDS Panel VDD SelectorSee LVDS, on page 56
P8LVDS Inverter ConnectorSee LVDS, on page 56
P9Front Panel Audio HeaderSee Audio, on page 69
P30S/PDIF Out HeaderSee Audio, on page 69
Controls, LEDs and Connectors
P3TPM/Port80 HeaderSee TPM/Port 80 Interface, on page 73
P24USB Internal HeaderSee USB 2.0, on page 62
P25USB/eUSB HeaderSee USB 2.0, on page 62
P26USB HeaderSee USB 2.0, on page 62
P14EC Debug HeaderSee Debug Header, on page 67
P17SATA HDD Power HeaderSee Storage, on page 61
P5PS/2 HeaderSee PS/2, on page 66
P2System Fan HeaderSee Fan Header, on page 66
P18Wake UP HeaderSee Wake Events, on page 76
P4Clear CMOS HeaderSee RTC Circuit, on page 71
P31Charge LED 1See On Board LED Interface, on page 74
P34Charge LED 2See On Board LED Interface, on page 74
P27Case Open HeaderSee Case Open Header, on page 74
P33Internal Graphics DisableSee Internal Graphics Disable, on page 75
P1Front Panel HeaderSee User GPIO Header, on page 75
P28User GPIO HeaderSee User GPIO Header, on page 75
P22Charge Board InterfaceSee Charge Board Interface, on page 67
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Controls, LEDs and Connectors
Table 3-1 MITX-CORE-820 Connectors (continued)
Reference
DesignatorFunctionPinout Definition
P23CPU Fan HeaderSee Fan Header, on page 66
J15eDP ConnectorSee Embedded Display Port (eDP), on page 58
J11Audio JackSee Audio, on page 69
J13DC-IN JackSee Power Supplies, on page 63
J12ATX Power Supply ConnectorSee Power Supplies, on page 63
With the exception of the Mini-DIN DC-IN connector , LVDS, LVDS inverter connector and eDP
connector, all connectors used for the MITX-CORE-820 are standard connectors available in
the market. SATA power cables are provided with the MITX-CORE-820. Please contact your
local Artesyn representatives for information on the Mini-DIN DC-IN connector, LVDS, LVDS
inverter connector and eDP connectors.
3.3LED Controls
The MITX-CORE-820 has one green LED and one red LED to indicate the charging and
discharging status. Only a charging board is needed for battery management as the LED is fully
controlled by the EC.
Table 3-2 LED Control Indicator
Battery StatusGreen LED StatusRed LED Status
ChargingInactiveActive
Fully ChargedActiveInactive
DischargingInactiveInactive
Battery LowInactiveBlinking
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3.4Rear I/O Connectors
Figure 3-3Rear I/O Connectors
Controls, LEDs and Connectors
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Controls, LEDs and Connectors
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Functional Description
4.1Block Diagram
This engineering specification defines a standard Mini-ITX motherboard. The board supports a
single DC-Jack or ATX 4-pin power input and smart battery power input. The board
communicates with a charger board with the smart battery input through a header on the
motherboard.
Figure 4-1Block Diagram
Chapter 4
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Functional Description
4.2Processor
The board supports one 45 W 4-core Core i7 Intel Sandy Bridge-Mobile rPGA 988B embedded
processor. The board also provides the option to support one 35 W 2-core Core i5 Celeron Intel
Sandy Bridge-Mobile PGA Embedded processor.
4.3Motherboard Clock Diagram
The MITX-CORE-820 implements full integrated clocking mode as the only platform clock
solution.
Figure 4-2Platform Clocks Distribution
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4.4Chipset
Mobile Intel 6 series PCH is used on the board. The board can support QM67 with Core i3, i5 and
i7 processors. It can also support the low end version HM65 with Celeron SKU.
Table 4-1 PCH SKUs
Functional Description
SKU Name
Feature Set
PCI Express 2.0 Ports88888
PCI InterfaceNoNoNoNoNo
USB 2.0 Ports14141412
Total number of SATA Ports
SATA Ports (6 Gb/s, 3 Gb/s and 1.5 Gb/s
SATA Ports (3 Gb/s and 1.5 Gb/s only)
The MITX-CORE-820 supports one DDR3 1066MT/s/1333MT/s/1600MT/s SODIMM per
channel, for a total of 2 DDR3 SODIMMs. Maximum memory capacity is 16 GB (8 GB per
SODIMM) using 2 GB technology. Minimum capacity is a single 1 GB SODIMM using 1 GB
technology.
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Functional Description
4.6Video
The MITX-CORE-820 supports dual-independent displays using the Mobile Intel® 6 Series
Chipset Integrated Graphics Controller. The primary display shall be LVDS (eDP) or VGA, and
the secondary display shall be Display Port. During boot, the BIOS will detect if a VGA monitor
is attached. If VGA is attached, then the primary display shall be VGA. If VGA is not detected,
then BIOS shall default to LVDS or eDP. eDP and LVDS cannot be used at the same time.
4.6.1LVDS
The MITX-CORE-820 supports dual-channel LVDS on pipe A of the Integrated Graphics
Controller. The Intel 6 Series chipset supports up to 24-bit color per pixel, so the design can
support both 18-bit and 24-bit LCD panels utilizing different cables.
Table 4-2 LVDS Connector (P6)
PinSignalPinSignal
1LVDSA_DATA02LVDSB_DATA0
3LVDSA_DATA0#4LVDSB_DATA0#
7LVDSA_DATA18LVDSB_DATA1
9LVDSA_DATA1#10LVDSB_DATA1#
13LVDSA_DATA214LVDSB_DATA2
15LVDSA_DATA2#16LVDSB_DATA2#
19LVDSA_DATA320LVDSB_DATA3
21LVDSA_DATA3#22LVDSB_DATA3#
25LVDSA_CLK26LVDSB_CLK
27LVDSA_CLK#28LVDSB_CLK#
31LVDS_DDC_CLK32LVDS_DDC_DATA
33,35,3
7,39
5,
11,17,2
3,29
+VDD_LVDS36,38,40+VDD_LVDS
GND6,12,18,
24,30,3
4
GND
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Functional Description
The design implements a separate LVDS and Backlight Inverter connectors located on the
board. The connectors follow the common parts used on Artesyn products.
Table 4-3 LVDS Panel VDD Selector (P29)
Jumper setting
(Jumper:P29)Configuration
P29 (2-4)+3.3 V (Default)
P29 (3-4)+12 V
P29 (6-4)+5 V
A jumper on the board is used to select power supply for LVDS monitor. +3.3 V is the default,
while +5 V or +12 V are other options. +12 V and +5 V can be used to power the inverter, with
+12 V as default.
Table 4-4 LVDS Inverter Connector (P8)
PinSignal
1+V12S
2L_BKLT_EN
3GND
4L_BKLT_CTRL
5+V5S
Figure 4-3LVDS Inverter Connector (P8)
4.6.2VGA
The design implements a VGA connector on the board edge.
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Functional Description
4.6.3Display Port
There are two display ports (DP) on the rear IO. It follows the DP specifications V1.1 and has the
ability to support dual-mode DP. An HDMI monitor can be connected to the DP port using a
DP-to-HDMI adapter. There is also a dedicated DP port to DMC slot.
4.6.4Embedded Display Port (eDP)
The product provides a eDP interface which can connect to a Flat-Panel Display (FPD) with 30pin/40-pin eDP connector for LED backlight with LED Driver on PCB for the Embedded Display
Port Spec v1.1. The interface can support 1, 2 or 4 lanes eDP with up to 2.7 Gb/s per lane.
Table 4-5 eDP Connector (J15)
Pin#Signal NamePin#Signal Name
1VDD_LVDS21DP_TXN0
2VDD_LVDS22DP_TXP0
3VDD_LVDS23GND
4VDD_LVDS24EMB_AUXP
5VDD_LVDS25EMB_AUXN
6GND26GND
7GND27V3.3S
8GND28V12S
9GND29GND
10EMB_HPD30GND
11GND31V5S
12DP_TXN332V5S
13DP_TXP333L_BKLT_CTRL
14GND34L_BKLT_EN
15DP_TXN235V12S
16DP_TXP236V3.3S
17GND37GND
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Table 4-5 eDP Connector (J15) (continued)
Pin#Signal NamePin#Signal Name
18DP_TXN138SMB_THRM_CLK
19DP_TXP139SMB_THRM_DATA
20GND40GND
4.7PCI Express
The MITX-CORE-820 has one x16 5G PCI-Express slot which supports graphics cards up to 75 W
in power. The position of the PCI-Express slot follows the Mini-ITX Addendum Version 1.1 of the
microATX Motherboard Interface Specification Version 1.2.
The Cougar Point-mbl PCH has one x1 PCI-Express port (port 6) to the WG82579LM and one x1
PCI-Express port (port 3) to the WG82574L. Port 7 will be used for a PCI-Express Mini Card
connector for WiFi/WiMAX, port 8 is used for DMC card slot.
Functional Description
4.8LAN on Motherboard
The MITX-CORE-820 provides two GbE ports. One port uses the Intel 6 Series PCH integrated
MAC and the Intel WG82579LM GbE PHY. The Intel WG82579LM is connected to PCH through
the 1x PCI-Express. The other Gbe port uses Intel WG82574L controller (MITX-CORE-820 only).
The design provides two RJ-45 connectors supporting 10/100/1000 Base T. LAN is powered by
suspend well to support AMT and wake-on-LAN while in S5. WG82579LM uses +V3.3 M and
WG82574L uses +V3.3 A.
LAN connector has two integrated LEDs.
A single green LED
–OFF (no light) - LAN link is not established
–ON (steady light) - LAN link is established
–Blinking - indicates LAN link activity
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Functional Description
Dual color green and yellow LED
–OFF (no light) - indicates 10 Mb/s data rate
–Green - indicates 100 Mb/s data rate
–Yellow - indicates 1000 Mb/s data rate.
Table 4-6 LAN1 Connector
PinSignalPinSignal
1LAN1_MDI0P2LAN1_MDI0N
3LAN1_MDI1P4LAN1_MDI1N
5+VCT_LAN_C6+VCT_LAN_C
7LAN1_MDI2P8LAN1_MDI2N
9LAN1_MDI3P10LAN1_MDI3N
L1LAN1_LED_LNK#_ACT12LAN1_LED_LNK#_ACT_R
60
L3LAN1_LED_1000#14LAN1_LED_100#
Table 4-7 LAN2 Connector
PinSignalPinSignal
1LAN2_MDI0P2LAN2_MDI0N
3LAN2_MDI1P4LAN2_MDI1N
5VCC1V8_LAN_C6VCC1V8_LAN_C
7LAN2_MDI2P8LAN2_MDI2N
9LAN2_MDI3P10LAN2_MDI3N
L1LAN2_LED_LNK#_ACT12LAN2_LED_LNK#_ACT_R
L3LAN2_LED_1000#14LAN2_LED_100#
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4.9WiFi/WiMax
The MITX-CORE-820 supports a PCI-Express Mini-Card 1.2 Dual Head to Head Socket designed
to comply with the PCI-Express Mini-Card ElectroMechanical 1.2 Specification. The design
supports a PCI-Express Display Mini-Card in place of the second half mini-card in the head to
head socket design. The PCI-Express Mini-Card port is interoperable with the Intel WiMAX Link
Advanced-N+ 6250 and WiFi Link Advanced-N 6200 Series wireless devices. The MITX-CORE820 supports PCI-Express, USB and SMbus to all PCI-Express full mini-card, half mini-card, and
display mini-card sites. The MITX-CORE-820 supports one display port to the display mini-card
site.
4.10Storage
The MITX-CORE-820 supports two SATA 3G and two SATA 6G ports with standard vertical data
connectors. The SATA power connector provides sufficient +3.3V, +5V, +12V power to
accommodate both SSD and rotating-media drives of 1.8", 2.5" and 3.5" sizes. The MITX-CORE820 supports RAID 0, 1, 5, 10 across all SATA interfaces (MITX-CORE-820 only).
Functional Description
Table 4-8 SATA HDD Power Connector Pinout (P17)
PinSignalPinSignal
1+V12S2GND
3+V3.3S4GND
5GND6+V5S
Figure 4-4SATA HDD Power Connector (P17)
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Functional Description
4.11USB 2.0
The MITX-CORE-820 implements four standard type A connectors located in the backpanel I/O
region of the motherboard. In addition, three standard.100"x.100" 10-pin, dual-row header
supporting dual-ports are located on the motherboard (see Table 4-3 for pinout). The P25 of
the 10-pin headers provides mechanical support for retention standoff to support Intel® ZU130 Value Solid State Drive (standard profile). All USB ports, including the powered USB,
supports low-speed, full-speed, and high-speed using the USB 2.0 Enhanced Host Controller
Interface (EHCI). Figure 4-5 shows the pinout of the connector.
Table 4-9 USB Internal Header (P24, P25, P26) Pinout
PinSignalPinSignal
1+V5A2+V5A
3USB_PN14USB_PN2
5USB_PP26USB_PP2
7GND8GND
9NC10NC
Figure 4-5USB Internal Header (P24, P25, P26)
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4.12Power Supplies
The MITX-CORE-820 receives power from an input power connector that accepts +12 V or
+14.4 V~+19.5 V in the back-panel IO region, or from a 4-pin +12 V ATX power connector.
When a charger board is used, the power can be supplied using a 4-pin +12 V ATX power
connector from the adapter or battery connected to charger board.
Table 4-10 DC-IN Jack Pin Definitions
PinSignalPinSignal
1GND2+VDC_IN
3GND4+VDC_IN
Figure 4-6DC-IN Jack Front View
Functional Description
Table 4-11 ATX Power Supply Connector (J12)
PinSignalPinSignal
1GND2GND
3+VDC_IN4+VDC_IN
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Functional Description
Figure 4-7ATX Power Supply Connector Top View
4.12.1Power Consumption
The following table lists the estimated maximum power consumption of MITX-CORE-820 in
three states:
Table 4-12 Board MAX Power Consumption Estimation
StatePower ConsumptionConfiguration
Idle (CMOS Setup)30WSNB i7-2710QE, 2x 2G SODIMM
Idle (Windows XP Pro)20W
Full Loading (TAT+3DMark)70WSNB i7-2710QE, 2x 4G SODIMM
4.12.2Power Sequencing Requirements
The power sequencing meets the PCH power sequencing requirements.
4.12.3Power Management
The MITX-CORE-820 design is ACPI 4.0a compliant. System power states S0 (Power-on), S3
(Suspend to RAM), S4 (Suspend to Disk), and S5 (Soft Off) is supported. Deep Sleep Sx is also
supported after the option in BIOS setup is enabled. The board provides FET's to power off
appropriate power planes.
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4.12.4Power Measurement
The MITX-CORE-820 design provides the ability to measure power consumption on DC-IN
supply rails.
4.13Embedded Controller
The MITX-CORE-820 design implements a Nuvoton NPCE791C embedded controller. The
following sections list the functionality of the embedded controller, or EC.
4.13.1Voltage Monitor
The MITX-CORE-820 design implements voltage monitoring capability on +V3A, +V5A and
+V1.5S rails. The ADC of EC can be used as voltage monitor.
Functional Description
4.13.2Serial Port
EC implements one RS-232 compatible serial port on the rear IO. It has RXD, TXD, RTS#, CTS#
and RI# signals on the port.
Table 4-13 Serial Port Connectors (J5)
PinSignalPinSignal
1NC2COM_RXD#
3COM_TXD4NC
5GND6NC
7COM_RTS#8COM_CTS#
9COM_RI#
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Functional Description
4.13.3Fan Header
The MITX-CORE-820 design provides one 4-wire fan header on the motherboard planar for the
CPU fan and one 4-wire fan header on the motherboard planar for the system. Fans support fan
tachometer input and PWM fan speed control. The design uses 4-pin locking connector
equivalent to Molex 47053-1000. Table 4-14 shows the pinout.
Table 4-14 CPU and System Fan Headers (P2 and P23) Description
PinSignalPinSignal
1GND2+V12S
3TACH4PWM
Figure 4-8CPU and System Fan Headers (P2 and P23)
4.13.4PS/2
The MITX-CORE-820 design implements two PS/2 ports for keyboard and mouse. The ports
may be implemented as vertical headers on the motherboard planar if there is no space in the
backpanel I/O region. One PS/2 header can support two PS/2 ports for keyboard and mouse.
Table 4-15 and Figure 4-9 shows the pinout for PS/2.
Table 4-15 PS/2 Header (P5) Description
PinSignalPinSignal
1KB_DATA2MOUSE_DATA
3GND4+V5A
5KB_CLK6MOUSE_CLK
7NC8KEY
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Figure 4-9PS/2 Header (P5)
4.13.5Debug Header
This header is used only for debugging.
Table 4-16 EC Debug Header (P14) Description
PinSignalPinSignal
Functional Description
1EC_TCK2EC_TDO
3EC_TMS4GND
5EC_TDI6EC_RDY#
4.13.6Charge Board Interface
The MITX-CORE-820 design supports a charge board interface from the EC. There are two
SMBUS communicating with the Smart Charger and the Smart Battery respectively. EC also
accepts ACAV (AC_Present) and monitors charge/discharge current information from the
charge board.
Table 4-17 Charge Board Interface (P22)
PinSignalPinSignal
1SMB_BS_DATA2SMB_BATT_DATA
3GND4CHAR_ACAV
5SMB_BS_CLK6SMB_BATT_CLK
7CHAR_IAC8KEY
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Functional Description
4.14SMBUS Architecture
Figure 4-10SMBUS Architecture
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4.15Audio
The MITX-CORE-820 design supports a minimum 7.1-channel HD Audio CODEC with the
following connectivity:
Rear IO
–Stereo Line In
–Stereo Line Out (Front Speakers)
–Mic In
–Stereo Rear Speakers
–Middle/Sub Speaker
–S/PDIF and Stereo Side Speakers
Internal Audio Header
Functional Description
–Mic In
–Stereo Headphone Out
–S/PDIF
Table 4-18 Audio Jack Board Side Pin Definitions (J11)
PinSignalPinSignalPinSignalPinSignalPinSignal
1AGND2MIC1_L3MIC1_JD4AGND5MIC1_R
22LOUT_L 23LOUT_JD24AGND25LOUT_R
32LIN_L33LIN_JD34AGND35LIN_R
41AGND42CEN_CN43CEN_JD44AGND45LFE_CN
52SURR_L_CN53SURR_JD54AGND55SURR_R_CN
ASPDIF_OUTB+V5SCGND
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Functional Description
Figure 4-11Rear Panel Audio Jack
Table 4-19 Front Panel Audio Header (P9) Description
PinSignalPinSignal
1MIC2_L2GND
3MIC2_R4FP_AUDIO_PSNT#
5LOUT2_R6MIC2_JD
7GND8KEY
9LOUT2_L10LOUT2_JD
Figure 4-12Front Panel Audio Header (P9)
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Table 4-20 S/PDIF Out Header (P30)
PinSignal
1+V5S
2SPDIF_OUT_HDMI
3GND
This function is optional as per user’s request.
4.16Watchdog Timer
The MITX-CORE-820 implements a two-stage watchdog timer (WDT), such as the one
integrated with PCH, with a programmable timeout (one second to ten minutes minimum)
and the ability for software to enable and disable. The BIOS disables the device at boot, and the
software will re-enable when watchdog application loads. Stage-1 timeout event causes an
interrupt and Stage-2 timeout event causes a reset. WDT is disabled before entering S3 state,
and re-enabled upon exiting S3.
Functional Description
4.17RTC Circuit
There is an on-board battery holder for a BR2032 or an equivalent battery. This battery holder
allows for quick and easy replacement of a 3 V button cell lithium battery which provides backup power to the on-board RTC.
Table 4-21 Clear CMOS Header (P4)
PinSignalPinSignal
1NC2RTC_RST#
3GND
4.17.1Boot Block
The SPI flash supports the boot block section which contains the code to boot to a minimum
DOS. Once the board boots to a minimum DOS, the software program to reflash, the SPI flash
can be run from the DOS command prompt. The boot block will be completely protected.
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Functional Description
4.18SPI Flash
The MITX-CORE-820 design does not support a firmware hub. Instead, it has two SPI flash
devices (minimum 8 MB each) that provides flash support for the system BIOS, Intel®
WG82579LM LAN image/MAC address and the manageability engine/AMT firmware. The SPI
flash devices can be socketed during debugging. SPI flash provides an alternative to the
firmware hub for system BIOS.
4.19Front Panel Header
There is a standard front panel header on the board:
Table 4-22 Front Panel Header (P1) Definition
PinSignalPinSignal
1SATA_LED#_R2POWER_LED#_R
3SATA_LED#4POWER_LED#
5GND6EXT_PWRBTN_N
7PM_SYSRST#8GND
9NC10KEY
Figure 4-13Front Panel Header (P1)
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4.20TPM/Port 80 Interface
There is an Intel standard 2x10 100" header for TPM and Port 80 debug on the board. In some
cases, the PCI-Express card and the TPM module can exist together on the board. However, if
the height of the heat sink from the bottom of the PCI-Express 16x card is over the standard
specifications, it may have a mechanical conflict with the TPM module, which is plugged on to
the TPM header. This is not a defect on the motherboard.
Table 4-23 TPM/Port80 Header (P3) Definition
PinSignalPinSignal
1CLK_PCI_TPM2GND
3LPC_FRAME#4KEY
5TPM_RST_N6+V5S
7LPC_AD38LPC_AD2
Functional Description
9+V3.3S10LPC_AD1
11LPC_AD012 GND
13SMB_CLK_S14SMB_DATA_S
15+V3.3A16INT_SERIRQ
17GND18TPM_CLKRUN_N
19PM_SUS_STAT#20PCH_DRQ#0
Figure 4-14TPM/Port80 Header (P3)
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Functional Description
4.21On Board LED Interface
There is only one LED on board (D5) to indicate that the system has experienced a catastrophic
error and cannot continue to operate. There are LED interfaces on the front header to indicate
the power LED and SATA HDD activity. The power LED is driven by the embedded controller.
There are two other LED headers to show charge status indication. One is used to indicate
charging and one is used to indicate insufficient battery.
Table 4-24 Charge LED 1 (P31)
PinSignal
1+V3.3A_KBC
2C_PWM
Table 4-25 Charge LED 2 (P34)
PinSignal
1+V3.3A_KBC
2D_PWM
4.22Case Open Header
Case open header is reserved for customized application.
Table 4-26 Case Open Header (P27)
PinSignal
1SM_INTRUDER#
2GND
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4.23Internal Graphics Disable
Table 4-27 Internal Graphics Disable Header (P33)
Jumper setting
(Jumper:P33)Configuration
P33 (1-2)NC (DEFAULT)
P33 (2-3)I-GRAPHICS DISABLE
4.24User GPIO Header
The MITX-CORE-820 supports a GPIO header with support for 4xGPI and 4xGPO & ground(s).
Functional Description
Table 4-28 User GPIO Header (P28)
PinSignalPinSignal
1PCA9557_GPO02PCA9557_GPI0
3PCA9557_GPO14PCA9557_GPI1
5PCA9557_GPO26PCA9557_GPI2
7PCA9557_GPO38PCA9557_GPI3
9+V5A10GND
4.25Debug Support
The MITX-CORE-820 shall support the following ports for debug:
Extended Debug Port (XDP) tool for processor run control and debug
Port 80 display for BIOS POST codes
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Functional Description
4.26Wake Events
The MITX-CORE-820 supports a wake up signal header, that can cause the platform to move
from S3 sleep state to S0.
Table 4-29 Wake Up Header (P18)
PinSignal
1+V5A
2GND
3WAKEUP_GPI
4.27Manageability
The Gala MITX-CORE-820 supports Intel AMT 7.0. design and provides support for M0, M1 and
M-off manageability states. It also supports serial-over-console, IDE redirect, remote power up,
shutdown and reset. The Gala MITX-CORE-820 reads and receives alerts for voltage monitor,
fan tachometer, CPU temperature and ambient temperature. The AMT firmware used is
written to expect the existence of an embedded ACPI controller that is typically found in Interl
mobile reference designs.
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BIOS
5.1Power Up Self Test (POST)
After power-up or reset, the BIOS performs a self-test, POST, that attempts to determine if
further operation is possible and that the detected configuration is expected. This process can
complete normally or result in a warning or an error. The boot process does not stop after a
warning but displays a message on the primary display device. If an error is detected, the boot
process is halted. If possible, a message will be displayed but failures early on in the test can
only be indicated in POST codes - See the description of these codes later in this document.
The POST process display depends on the Quiet Boot option.
Viewing all checkpoints generated by Phoenix SCT firmware requires a checkpoint card, which
is also named "POST Card" or "POST Diagnostic Card". They are PCI or LPC add-in cards that
show the value of I/O port 80h on a LED display. These cards are available at the electronic or
computer market around the world.
Chapter 5
5.2Boot Process
While performing the functions of the traditional BIOS, the Phoenix SCT core follows the
firmware model described by the Intel® Platform Innovation Framework for EFI. The
framework is associated with the following boot phases, which can be described by various
state codes.
Driver Execution Environment (DXE) - main hardware initialization2
Boot Device Selection (BDS) - system setup, pre-OS user interface & selecting a bootable
device (CD/DVD, HDD, USB, Network, Shell, etc.)
5.3Initiating Setup
Pressing the "F2" key on the keyboard during the boot brings up the Setup utility once the POST
is complete and before it searches for a boot device. See the setup description later in this
document to describe the operation of the this utility. If you exit setup without saving any
changes, the boot process continues with the search for a boot device. If the changes are saved,
the motherboard loads the new settings and resets, re-starting the entire boot process.
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5.4Setup Utility
The BIOS incorporates a setup utility that allows the user to alter a variety of system options.
This section describes the operation of the utility by describing the various options available
through a set of hierarchical menus. Not all options are available with all products and some
depend on BIOS customizations.
The current settings are stored in the SPI FLASH NVRAM area and any changes can be copied
back to this area using the Exit menu. The operation of the BIOS defaults is described later in
this document.
To start the utility, press the F2 key during the early stages of POST after power-up. Note that
this functionality operates with PS/2 keyboards, USB keyboards when enabled, and through
the console redirection facility when enabled.
The table below briefly describes the primary menus, most of which have sub-menus. The
following sections describe the menus in detail.
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Table 5-1 BIOS Primary Menu
MenuOptions
MainSystem information and date and time
AdvancedAdvanced features including ACPI, CPU, HDD, USB, Network, AMT and
South Bridge setting.
SecurityPassword setting
BootBoot priority order
Save & ExitSaves with or without changes; Loads default settings
The Phoenix SCT navigation can be accomplished using a combination of the keys. These keys
include the <FUNCTION> keys, <ENTER>, <ESC>, <ARROW> keys, and so on.
Table 5-2 Phoenix Navigation
KeyDescription
ENTERThe Enter key allows you to select an option to edit its value or access a
sub menu.
Left/RightThe Left and Right <Arrow> keys allows you to select a screen or menu.
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Table 5-2 Phoenix Navigation
KeyDescription
Up/DownThe Up and Down <Arrow> keys allows you to select an item or sub-
screen.
+ - Plus/MinusThe Plus and Minus <Arrow> keys allows you to change the field value of
a particular setup item.
ESCThe <Esc> key allows you to discard any changes the user has made and
exit the Phoenix SCT Setup.
When you are in sub-menu, <Esc> allows you to exit to the upper menu.
Function keysWhen other function keys become available, they are displayed at the
right of the screen along with their intended function.
BIOS
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5.4.1Main Menu
Figure 5-1Main Menu
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Table 5-3 Main Menu Field Description
FieldDescription
System DateSets the time and date (month/day/year format). To change
System Time
System InformationShows the BIOS version, CPU type, memory type and size, and
these values, go to each field and enter the desired value. Press
the tab key to move from hour to minute to second, or from
month to day to year. There is no default value.
so on. See Table "System Information Field Description" on page
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Table 5-3 Main Menu Field Description (continued)
FieldDescription
Boot FeaturesSelects Power-on state for NumLock. See Table "Boot Features
5.4.1.1System Information
Table 5-4 System Information Field Description
FieldDescription
BIOS VersionShows the BIOS version
Build TimeShows the BIOS build time
Processor TypeShows the CPU manufacturer brand
BIOS
Field Description" on page 81
Processor SpeedShows the CPU current frequency
System Memory SpeedShows the system memory current frequency
L2 Cache RAMShows the CPU L2 cache size
Total MemoryShows all memory size
Memory ModeMemory work mode
Memory Channel A Slot0Channel A slot0 memory size and type
Memory Channel B Slot0Channel B slot0 memory size and type
5.4.1.2Boot Features
Table 5-5 Boot Features Field Description
FieldDescription
NumLockSelects Power-on state for NumLock.
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5.4.2Advanced Menu
Figure 5-2Advanced Menu
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Table 5-6 Advanced Menu Field Description
FieldDescription
Boot ConfigurationSets boot configuration. See Boot Configuration.
Processor ConfigurationSets CPU configuration. See Processor Configuration.
Peripheral ConfigurationSets system peripheral configuration. See Processor Power
Management.
HDD ConfigurationSets hard drive and controller configuration. See HDD
Configuration.
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Table 5-6 Advanced Menu Field Description (continued)
FieldDescription
Memory ConfigurationDisplays and provides options to change the memory settings.
See Memory Configuration.
BIOS
System Agent (SA)
Configuration
South Bridge ConfigurationSet south bridge configuration. South Bridge Configuration
IGD - LCD Panel TypeSelects the video device which will be activated during POST.
IGD - Active LFPSelects the active LFP configuration.
POST. This has no effect if there are external graphics present.
Secondary boot display selection will appear based on your
selection. VGA modes are supported only on the primary
display.
This has no effect if external graphics are present.
Panel Color DepthSelects the LFP panel color depth
5.4.2.8South Bridge Configuration
Table 5-18 South Bridge Configuration Field Description
FieldDescription
DeepSx ModeConfigures the DeepSx Mode configuration
State After G3Specifies what state to switch to when power is re-applied after
a power failure (G3 State).
Watchdog TimerEnables or Disables Watchdog Timer function.
Watchdog Timer SettingsWatchdog time out value.
GPI13 Wake Up FunctionEnables or Disables GPI13 as s wake event.
Table 5-23 Network Configuration Field Description
FieldDescription
PCH Internal LANEnables/Disables PCH Internal LAN
LAN OPROM SelectionThis is used to select LAN OPROM for quick boot minimal
Wake on PCH LANEnables PCH Internal wake on LAN capability.
5.4.2.10 AMT Configuration
Table 5-24 AMT Configuration Field Description
FieldDescription
Intel AMTEnables/Disables Intel(R) Active Management Technology BIOS
Intel AMT Hot KeyEnables or Disables Intel® AMT Hot-Key during POST to enter
Intel AMT Setup PromptEnables/Disables Intel® AMT Setup Prompt to wait for hot-key
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configuration.
Extension. Note: iAMT H/W is always enabled. This option just
controls the BIOS extension execution. If enabled, this requires
additional firmware in the SPI device.
MEBX setup.
to enter setup.
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Table 5-24 AMT Configuration Field Description (continued)
FieldDescription
Activate Remote Assistance
Process
Un-Configure MEUn-Configures ME without a password.
USB-R FeatureEnables/Disables USB-R.
5.4.2.11 ME Configuration
Table 5-25 ME Configuration Field Description
FieldDescription
ME FW VersionIntel® Management Engine firmware version.
BIOS
Triggers CIRA boot
ME FirmwareIntel® Management Engine firmware state.