Artesyn COMX-P40x0 ENP2 Installation

COMX-P40x0 ENP2

Installation and Use
P/N: 6806800R95B August 2014
©
Copyright 2014 Artesyn Embedded Technologies, Inc.
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Germany

Contents

Contents
About this Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1.2 Standard Compliances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
1.3 Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
1.3.1 COMX-P4080 ENP2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
1.3.2 COMX-P4040 ENP2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
1.4 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
1.5 Product Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
1.5.1 COMX-P4080 ENP2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
1.5.2 COMX-P4040 ENP2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2 Hardware Preparation and Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.1 Environmental and Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.1.1 Environmental Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.2 Unpacking and Inspecting the Enclosure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
2.3 Installing and Removing the Module on the Carrier Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3 Controls, LEDs, and Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
3.1 Connectors and Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
3.1.1 On-Board Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
3.1.2 ON-BOARD LEDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
3.1.3 COMX AB-CD Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
4.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
4.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
4.3 Processor Core and Cache Memory Complex . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
4.4 Integrated Memory Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
4.5 Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
4.5.1 Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
4.5.2 NOR FLASH. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
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4.5.3 NAND FLASH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
4.6 SERDES Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
4.7 Thermal Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
4.8 Main Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
4.8.1 Memory Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
4.8.2 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
4.9 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
4.10 SDHC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
4.11 SPI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
4.12 LAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
4.12.1 MDIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
4.13 PHY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
4.14 UART Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
4.15 Real Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
4.16 Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
4.17 USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
4.18 I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
4.18.1 I2C Device Thermal Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
4.18.2 I2C Device EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
4.18.3 I2C Device WDT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
4.18.4 I2C Device RTC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
4.18.5 I2C Device Clock Generators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
5 Clock Structure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
5.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
6 Power Domains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
6.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
6.2 Power Controlling Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
7 BSP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
7.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
7.2 Setup Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
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7.3 Basic Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
7.4 BSP Build Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
7.4.1 Install Build Tools of SDK1.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
7.5 BSP Source Code Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
7.5.1 De-Compose Source Code Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
7.6 Basic Environment Variable Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
7.6.1 Setup Build Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
7.6.2 Network Variables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
7.6.3 Filename Variables for BSP Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
7.6.4 Address Variables for BSP Components on NOR Flash. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
7.6.5 Address Variables for the Boot Components in RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
7.6.6 Device Variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
7.6.7 HWCONFIG Variable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
7.6.8 Bootargs Variable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
7.6.9 Bootup Variables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
7.7 Checking the BSP Version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
7.8 CPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
7.9 Address Space . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
7.10 DDR3 SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
7.11 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
7.12 UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
7.13 NOR Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
7.14 NAND Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
7.15 I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
7.15.1 ID EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
7.15.2 Board EEPROM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
7.15.3 Real Time Clock (RTC) and Watchdog Timer (WDT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
7.15.4 DTT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
7.16 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
7.17 MMC/SDHC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
7.18 USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .106
7.19 SerDes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
7.20 Network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
7.21 Build BSP Images . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
7.21.1 Build U-Boot. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
7.21.2 Build Linux Kernel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
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7.21.3 Build ROOTFS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
7.21.4 Build Misc Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
7.22 Deploy BSP Images . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117
7.22.1 Pre-Deployment Steps. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
7.22.2 Deploying BSP Images on NOR FLASH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
7.23 Boot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
7.23.1 RAMboot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
7.23.2 NORboot. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
7.23.3 NANDboot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
7.23.4 NFSboot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .122
7.23.5 USBFATboot and USBEXT2boot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .122
7.23.6 MMCFATboot and MMCEXT2boot. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
A Related Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .125
A.1 Artesyn Embedded Technologies - Embedded Computing Documentation . . . . . . . . . . . . . . . 125
Safety Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .127
6
COMX-P40x0 ENP2 Installation and Use (6806800R95B)
List of Tables
Table 1-1 Standard Compliances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 1-2 COMX-P4080 ENP2 PCB Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 1-3 COMX-P4040 ENP2 PCB Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 1-4 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 2-1 Environmental Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 2-2 Critical Temperature Spots . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 2-3 Current Drawn . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 2-4 COMX-P4080-4G-E-ENP2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 3-1 P4080 COP Header Pin-out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 3-2 P4040 COP Header Pin-out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 3-3 Module LED Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 3-4 COMX AB-CD Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 4-1 NOR FLASH Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Table 4-2 NAND FLASH Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Table 4-3 Options of the SERDES routed to COM Express Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Table 4-4 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Table 4-5 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Table 4-6 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Table 4-7 SD or Micro SD card on the Carrier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Table 4-8 I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Table 5-1 Configuration of the frequency of SERDES reference clock by carrier . . . . . . . . . . . . . . . . . . 79
Table 5-2 Configuration of the frequency of SERDES reference clock by GPIO . . . . . . . . . . . . . . . . . . . 80
Table 7-1 Basic U-Boot Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Table 7-2 BSP Source Code Package Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Table 7-3 COMX-P4080 Address Space . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Table 7-4 GPIO States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Table 7-5 GPIO Command Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Table 7-6 NOR Flash Command Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Table 7-7 NAND Flash Command Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Table 7-8 U-Boot I2C Utilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100
Table 7-9 Network Ports Naming Rules in U-Boot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
Table 7-10 Valid Network Ports Combination of SerDes/RCW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Table 7-11 UDEV Rules for Network Ports in Linux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113
Table A-1 Artesyn Embedded Technologies - Embedded Computing Publications . . . . . . . . . . . . . . 125
COMX-P40x0 ENP2 Installation and Use (6806800R95B)
7
List of Tables
8
COMX-P40x0 ENP2 Installation and Use (6806800R95B)
List of Figures
Figure 1-1 Declaration of Conformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 1-2 COMX-P40X0-ENP2 Top View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 1-3 COMX-P40X0-ENP2 Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 1-4 COMX-P4080 ENP2 Mechanical Dimensions (Top and side views) . . . . . . . . . . . . . 21
Figure 1-5 COMX-P4040 ENP2 Mechanical Dimensions (Top and side views) . . . . . . . . . . . . . 23
Figure 1-6 COMX-P4080 ENP2 Serial Number Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 1-7 COMX-P4040 ENP2 Serial Number Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 2-1 Mounting Module on Carrier Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 2-2 Heat-sink installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 4-1 COMX-P40x0 ENP2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Figure 4-2 Distribution of Local Bus on P40x0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Figure 4-3 Distribution of SERDES Lanes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Figure 4-4 Module Thermal Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Figure 4-5 Memory Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Figure 4-6 Distribution of GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Figure 4-7 MDIO Routing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Figure 4-8 Distribution of I2C buses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Figure 5-1 Clock Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Figure 6-1 Power Tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Figure 6-2 Power Sequence of COMX-P40x0 ENP2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Figure 7-1 COMX-P4080 CPU Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Figure 7-2 Example of Boot Up Message in U-Boot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
COMX-P40x0 ENP2 Installation and Use (6806800R95B)
9
List of Figures
10
COMX-P40x0 ENP2 Installation and Use (6806800R95B)

About this Manual

Overview of Contents

This manual is divided into the following chapters and appendices.
Introduction provides an overview of the module's features.
Hardware Preparation and Installation provides instructions for installing and removing the
module.
Controls, LEDs, and Connectors provides pin assignments for the various connectors on the
module.
Functional Description describes the functions of the various components on the module.
Clock Structure describes the clock distribution and the setup utility used to configure the
module.
Power Domains describes the power supply system for the module.
BSP describes how to build the Basic Support Package (BSP) and deploy the built images on
the module.
Related Documentation provides a list of related product documentation, manufacturer’s
documents, and industry standard specifications.
Safety Notes summarizes the safety instructions in the manual.

Abbreviations

This document uses the following abbreviations:
TERM MEANING
AAmps
ACPI Advanced Configuration Power Interface - software standard to
implement power saving modes in PC-AT systems
EEPROM Electrically Erasable Programmable Read-Only Memory
GPI General Purpose Input
GPIO General Purpose Input Output
GPO General Purpose Output
COMX-P40x0 ENP2 Installation and Use (6806800R95B)
11
About this Manual
TERM MEANING
I2C Inter Integrated Circuit - 2 wire (clock and data) signaling scheme
IDE Integrated Device Electronics - parallel interface for hard disk drives -
LPC Low Pin-Count Interface: a low speed interface used for peripheral
LVDS Low Voltage Differential Signaling - widely used as a physical
PCI Peripheral Component Interface
PCI-E Peripheral Component Interface Express - next-generation high
About this Manual
allowing communication between integrated circuits, primarily used to read and load registers values.
also known as PATA
circuits such as Super I/O controllers, which typically combine legacy-device support into a single IC.
interface for TFT flat panels. LVDS can be used for many high-speed signaling applications. In this document, it refers only to TFT flat­panel applications.
speed Serialized I/O bus
PHY Ethernet controller physical layer device
Pin-out Type A reference to one of five COM ExpressTM definitions for what signals
appear on the COM ExpressTM module connector pins.
SPD Serial Presence Detect - refers to serial EEPROM on DRAMs that has
DRAM module configuration information
S0, S1, S2, S3, S4, S5 System states describing the power and activity level
S0 Full power, all devices powered S1 S2
S3 Suspend to RAM System context stored in RAM; RAM is in standby
S4 Suspend to Disk System context stored on disk
S5 Soft Off Main power rail off, only standby power rail present
SATA Serial AT Attachment: serial-interface standard for hard disks
SBC Single Board Computer
Super I/O An integrated circuit typically interfaced via the LPC bus that
provides legacy PC I/O functions including PS2 keyboard and mouse ports, serial and parallel port(s) and a floppy interface.
USB Universal Serial Bus
VGA Video Graphics Adapter
WDT Watch Dog Timer.
12
COMX-P40x0 ENP2 Installation and Use (6806800R95B)

Conventions

The following table describes the conventions used throughout this manual.
Notation Description
0x00000000 Typical notation for hexadecimal numbers (digits are
0b0000 Same for binary numbers (digits are 0 and 1)
bold Used to emphasize a word Screen Used for on-screen output and code related elements
Courier + Bold Used to characterize user input and to separate it
Reference Used for references and for table and figure
About this Manual
0 through F), for example used for addresses and offsets
or commands in body text
from system output
descriptions
File > Exit Notation for selecting a submenu
<text> Notation for variables and keys
[text] Notation for software buttons to click on the screen
... Repeated item for example node 1, node 2, ..., node
.
.
.
.. Ranges, for example: 0..4 means one of the integers
| Logical OR
COMX-P40x0 ENP2 Installation and Use (6806800R95B)
and parameter description
12
Omission of information from example/command that is not necessary at the time being
0,1,2,3, and 4 (used in registers)
13
About this Manual
Notation Description
About this Manual
Indicates a hazardous situation which, if not avoided, could result in death or serious injury
Indicates a hazardous situation which, if not avoided, may result in minor or moderate injury
Indicates a property damage message
No danger encountered. Pay attention to important information

Summary of Changes

This manual has been revised and replaces all prior editions.
Part Number Publication Date Description
6806800R95A August, 2013
6806800R95B August, 2014 Re-branded to Artesyn
14
Initial version
COMX-P40x0 ENP2 Installation and Use (6806800R95B)

Introduction

1.1 Overview

The COMX-P40x0 ENP2 is a COM Express module based on the Freescale Power PC P4040 and P4080 platforms. This board provides some of the universal interfaces such as Gigabit Ethernet, USB, PCIE, and so on.
Following are the features of the COMX-P40x0 ENP2:
Form Factor: Basic (95mm x 125mm)
P4040 or P4080 CPU supported
Boot Options:
16 bit NOR FLASH from local bus (standard product default)
NAND FLASH from local bus
I2C EEPROM
Chapter 1
Note: Selectable via carrier
Demo, runtime Linux Operating System and filesystem(s), pre-installed in NOR/NAND
Flash.
Dual channel on-board DDR3 with ECC. COMX-P40x0-2G boards have 1GB per channel for
a total of 2GB. COMX-P40x0-4G boards have 2GB per channel for a total of 4GB.
Designed to support up to 8GB of DDR3
16 lanes of SERDES routed to COME connectors, which can be configured as PCIE, XAUI,
SRIO, SGMII
4 UARTs (2-wire interfaces)
0/1/2 GE ports (option available to use this port as USB)
5/4/0 USB ports
IEEE 1588 support signals to the COME connectors
Total 3 I2C buses
1 SPI bus with 3 chip select signals
Secure Digital Host Controller interface to the COME connector for MultiMediaCard
(MMC) and Secure Digital card (SD) support.
COMX-P40x0 ENP2 Installation and Use (6806800R95B)
15
Introduction
Tamper detect pin to the COME connectors
On-board RTC and WDT device
Provide both remote and local thermal sensor
JTAG connector on module
Aurora testing points on module
12V power supplied to module through COME connectors
5V standby power from COME connector not required/used by module
Due to P4080 errata GEN-A009, Aurora ports are disabled by default in RCW and must be re-enabled for debug. For assistance, contact Artesyn representative.

1.2 Standard Compliances

The product is designed to meet the following standards.
Table 1-1 Standard Compliances
Standard Description
UL60950-1 EN 60950-1 IEC 60950-1 CAN/CSA C22.2 No 60950-1
UL/CSA 60950-1
EN 60950-1
IEC 60950-1 CB Scheme
FCC 47 CFR Part 15 Subpart B (US), Class A
EN55022 Class A (EU)
AS/NZS CISPR 22 Class A (Australia/New Zealand)
VCCI Class A (Japan)
16
Safety Requirements
Legal safety requirements
EMC requirements (legal) on system level (predefined Artesyn system)
COMX-P40x0 ENP2 Installation and Use (6806800R95B)
Table 1-1 Standard Compliances (continued)
Standard Description
CISPR 22 CISPR 24 EN55022 EN 55024
ETSI EN 300 019 Series Environmental Requirement
Directive 2011/65/EU Directive on the restriction of the use of certain
EMC Requirements on system level
hazardous substances in electrical and electronic equipment (ROHS)
Introduction
COMX-P40x0 ENP2 Installation and Use (6806800R95B)
17
Introduction
The following figure contains the declaration of conformity for COMX-P40x0.
Figure 1-1 Declaration of Conformity
E
C Declaration of Conformity
According to EN 17050-1:2004
Manufacturer’s Name:
Manufacturer’s Address:
Declares that the following product, in accordance with the requirements of 2004/108/EC, 2006/95/EC, 2011/65/EU and their amending directives,
Product:
Artesyn Embedded Technologies Embedded Computing
Zhongshan General Carton Box Factory Co. Ltd. No 62, Qi Guan Road West, Shiqi District, 528400 Zhongshan City Guangdong, PRC
COMX-P40x0-ENP2—Express Form Factor Processor Pluggable Mez­zanine Module For Extended Temperature and rugged Environments
Model Name/Number:
has been designed and manufactured to the following specifications:
EN55022: 2010 Class B
EN55024: 2010
IEC 60950-1: 2005 (2nd Edition) + A1: 2009
2011/65/EU RoHS Directive
As manufacturer we hereby declare that the product named above has been designed to comply with the rele­vant sections of the above referenced specifications. This product complies with the essential health and safety requirements of the above specified directives. We have an internal production control system that ensures compliance between the manufactured products and the technical documentation.
___________________________________________________ ___
Tom Tuttle, Manager, Product Testing Services Date (MM/DD/YYYY)
COMX-P40x0-ENP2, SCP-P4040-4G-ENP2, COMX-P4040-4G-ENP2, COMX-P4080-2G-ENP2, COMX-P4080-4G-E-ENP2
07/30/2014
______
18
COMX-P40x0 ENP2 Installation and Use (6806800R95B)

1.3 Mechanical Data

This section provides mechanical details of COMX-P4080-ENP2 and COMX-P4040-ENP2 boards.
Figure 1-2 COMX-P40X0-ENP2 Top View
D4:3.3V power ok
D3:system asleep
D6:1.8V power ok
D5:2.5V power ok
D9:Platform Power OK
D13:CORE power ok
Introduction
D7:DDR3 power ok
D10:1.5V power ok
Debug led D19
Debug led D18
D16:USB hub High Speed
D15:USB hub Active
COMX-P40x0 ENP2 Installation and Use (6806800R95B)
Thermal issue D17
Pin 1
COP header
19
Introduction
Figure 1-3 COMX-P40X0-ENP2 Bottom View
20
PIN B1
PIN A1
PIN B1
PIN A1
COME: CD: J3
COME: AB: J2
COMX-P40x0 ENP2 Installation and Use (6806800R95B)

1.3.1 COMX-P4080 ENP2

The following figure illustrates the top and side views of the COMX-P4080 ENP2 board.
Figure 1-4 COMX-P4080 ENP2 Mechanical Dimensions (Top and side views)
Introduction
COMX-P40x0 ENP2 Installation and Use (6806800R95B)
21
Introduction
Table 1-2 COMX-P4080 ENP2 PCB Dimensions
Characteristic Value
Length 125 mm
Width 95 mm
PCB Thickness 2 mm
Mounting height top side (component side 1) 6.1 mm
22
COMX-P40x0 ENP2 Installation and Use (6806800R95B)

1.3.2 COMX-P4040 ENP2

The following figure illustrates the top and side views of the COMX-P4040 ENP2 board.
Figure 1-5 COMX-P4040 ENP2 Mechanical Dimensions (Top and side views)
Introduction
COMX-P40x0 ENP2 Installation and Use (6806800R95B)
23
Introduction
Table 1-3 COMX-P4040 ENP2 PCB Dimensions
Characteristic Value
Length 125 mm
Width 95 mm
PCB Thickness 2 mm
Mounting height top side (component side 1) 9.65 mm

1.4 Ordering Information

Use the order numbers below when ordering product variants.
Table 1-4 Ordering Information
Order Number Description
COMX-P4080-2G-ENP2 QorIQ P4080 with 2GB DDR3, 0 Gigabit Ethernet, 5 USB ports. COM
Express Basic size.
COMX-P4080-4G-E-ENP2 QorIQ P4080 with 4GB DDR3, 1 Gigabit Ethernet, 4 USB ports. COM
Express Basic Size.
COMX-P4040-4G-ENP2 QorIQ P4040 with 4GB DDR3, 1 Gigabit Ethernet, 4 USB ports. COM
Express Basic Size.
SCP-P4040-4G-ENP2 QorIQ P4040 with 4GB DDR3, 1 Gigabit Ethernet, 4 USB ports. COM
Express Basic Size.
COMX-CAR-P1 Artesyn DEVELOPMENT CARRIER FOR QORIQ MODULES.
COMX-P4000-ENP­HTSNK
Heatsink for COMX-P40x0 ENP2 module.

1.5 Product Identification

This section shows the serial number and its location on the COMX-P4080 ENP2 and COMX­P4040 ENP2 boards.
24
COMX-P40x0 ENP2 Installation and Use (6806800R95B)

1.5.1 COMX-P4080 ENP2

The following figure shows the location of serial number on COMX-P4080 ENP2 board.
Figure 1-6 COMX-P4080 ENP2 Serial Number Location
Introduction

1.5.2 COMX-P4040 ENP2

The following figure shows the location of serial number on COMX-P4040 ENP2 board.
Figure 1-7 COMX-P4040 ENP2 Serial Number Location
COMX-P40x0 ENP2 Installation and Use (6806800R95B)
25
Introduction
26
COMX-P40x0 ENP2 Installation and Use (6806800R95B)

Hardware Preparation and Installation

2.1 Environmental and Power Requirements

2.1.1 Environmental Requirements

The following module environmental requirements must not be exceeded.
Operating temperature refers to the temperature of the air circulating around the module and not the component temperature.
The following table provides the environmental requirements for the module.
Chapter 2
Table 2-1 Environmental Requirements
Requirement Operating Non-Operating
Temperature
Humidity
Vibration Sine (10mins/axis) 5G, 15 to 2000Hz
Vibration Random (1hr/axis) 0.04g2/Hz, 15 to 2000Hz
Shock 30g/11mS(half sine)
Altitude -60 to 4000 m ASL
Thermal Requirements
A standard passive heat sink can be provided by Artesyn; 12 CFM system airflow volume (at 71oC) is needed for the heat sink to keep sufficient cooling to the module. Contact your Artesyn sales representative for detailed thermal information.
-40°C to +71°C
to 100% RH
(8GRMS)
-50°C to +100°C
to 100% RH
COMX-P40x0 ENP2 Installation and Use (6806800R95B)
27
Hardware Preparation and Installation
The following table summarizes components that exhibited significant temperature rises and their maximum allowable operating temperature. These components should be monitored in order to assess thermal performance during customized thermal solution development.
Table 2-2 Critical Temperature Spots
Component Identifier Heat Dissipation Power (W) Maximum Allowable Temperature (°C)
CPU: P4080 20.5 CPU: 105 (Tj)
CPU: P4040 16.8 CPU: 105 (Tj)
Memory SDRAM 3 95 (Tc)
GbE Transceiver: BCM5482
Row 4, Note: For modules with Gigabit Ethernet port options.
0.86 125 (Tj)
System Overheating Improper cooling can lead to system damage and void the manufacturer's warranty.
Personal Injury During operation, hot surfaces may be present on the heat sinks and the components of the product. To prevent injury, do not touch any of the exposed components or heatsinks on the product when handling.
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COMX-P40x0 ENP2 Installation and Use (6806800R95B)
Hardware Preparation and Installation
Power Requirements
This board is designed to operate with the input voltages and currents as defined in the following tables.
Table 2-3 Current Drawn
State 12v VCC_RTC
Idle 2.81A 100 uA
Full Loading (Linux) 2.91A 100 uA
Table 2-4 COMX-P4080-4G-E-ENP2
Volts Amps Power
12 2.6 31.2
Total Power dissipation (W) 31.2

2.2 Unpacking and Inspecting the Enclosure

Read all notices and cautions prior to unpacking the product.
Damage of Circuits
Electrostatic discharge and incorrect installation/removal of the product can damage
circuits or shorten their life.
Before touching the product make sure that you are working in an ESD-safe
environment with protective equipment such an ESD wrist strap and ESD shoes. Hold the product by its edges and do not touch any components or circuits.
COMX-P40x0 ENP2 Installation and Use (6806800R95B)
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Hardware Preparation and Installation
Shipment Inspection
1. Verify that you have received all items of your shipment.
Printed Quick Start Guide and Safety Notes
COMX-P40x0 ENP2 Module
2. Check for damage and report any damage or differences to customer service.
3. Remove the desiccant bag shipped together with the enclosure and dispose of it according to your country’s legislation.
Improperly disposing of used products may harm the environment. Always dispose of used products according to your country’s legislation and manufacturer’s instructions.
The product is thoroughly inspected before shipment. If any damage occurred during transportation or any items are missing, contact customer service immediately.

2.3 Installing and Removing the Module on the Carrier Board

The heat sink is assembled to the module before the procedure below:
Installing the COM module on the carrier board
1. Line up the board-to-board connector of the module assembly with the board-to-board
connector of the carrier board.
2. Make sure that the inter-connectors are properly aligned and that the five standoffs on the
module have contact with the top of the carrier board.
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COMX-P40x0 ENP2 Installation and Use (6806800R95B)
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