Artesyn COMX-P4080-2G-ENP2 Installation

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COMX-P4080-2G-ENP2

Installation and Use

P/N: 6806800P63B August 2014

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Trademarks

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UNIX® is a registered trademark of The Open Group in the United States and other countries.

Notice

While reasonable efforts have been made to assure the accuracy of this document, Artesyn assumes no liability resulting from any omissions in this document, or from the use of the information obtained therein. Artesyn reserves the right to revise this document and to make changes from time to time in the content hereof without obligation of Artesyn to notify any person of such revision or changes.

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It is possible that this publication may contain reference to or information about Artesyn products (machines and programs), programming, or services that are not available in your country. Such references or information must not be construed to mean that Artesyn intends to announce such Artesyn products, programming, or services in your country.

Limited and Restricted Rights Legend

If the documentation contained herein is supplied, directly or indirectly, to the U.S. Government, the following notice shall apply unless otherwise agreed to in writing by Artesyn.

Use, duplication, or disclosure by the Government is subject to restrictions as set forth in subparagraph (b)(3) of the Rights in Technical Data clause at DFARS 252.227-7013 (Nov. 1995) and of the Rights in Noncommercial Computer Software and Documentation clause at DFARS 252.227-7014 (Jun. 1995).

Contact Address

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Germany

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Contents

About this Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Safety Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

1.2 Standard Compliances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

1.3 Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

1.4 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

1.5 Product Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

2 Hardware Preparation and Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

2.1 Environmental and Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

2.2 Unpacking and Inspecting the Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

2.3 Installing and Removing the Module on the Carrier Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

3 Controls, LEDs, and Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

3.1 Connectors and Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

3.1.1 On-board Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

3.2 On-board LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

4.1 Processor Core and Cache Memory Complex . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

4.2 Integrated Memory Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

4.3 Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

4.4 Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

4.5 NOR FLASH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

4.6 NAND Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

4.7 HSSI or SERDES Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

4.8 Thermal Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

4.9 Main Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

4.9.1 Memory Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

4.10 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

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Contents

4.11 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

4.12 SDHC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

4.13 SPI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

4.14 LAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

4.14.1 MDIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

4.14.2 PHY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

4.15 UART INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

4.16 RTC & WDT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

4.17 USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

4.17.1 Four USB Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

4.18 I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

4.18.1 I2C Device Thermal Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

4.18.2 I2C Device EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

4.18.3 I2C Device WDT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

4.18.4 I2C Device RTC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

4.18.5 I2C Device Clock Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

4.18.6 I2C Device USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

5 Clock Structure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

6 On-Boards Power Domains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

6.1 Power Controlling Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

7 BSP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

7.1 BSP Build Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

7.1.1 Installing Build Tool on SDK1.0. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

7.2 BSP Source Code Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

7.2.1 De-Compose Source Code Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

7.2.2 Setup Build Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

7.3 Build BSP Image . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

7.3.1 Build U-Boot. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

7.3.2 Build Linux Kernal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

7.3.3 Build ROOTFS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

7.3.4 Build Misc Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

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7.4 Deploy BSP Image . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

7.4.1 Pre-deployment Steps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

7.4.2 Deploying BSP Image on NOR FLASH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

7.5 RAMBOOT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

7.6 NORBOOT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

7.7 NFSBOOT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

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List of Tables

Table 1-1 Standard Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Table 1-2 PCB Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Table 2-1 Environmental Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Table 2-2 Critical Temperature Spots . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Table 2-3 Power Requirement (with solder-down memory chips) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Table 3-1 JTAG connector Pin-out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Table 3-2 LED and statements of the system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Table 4-1 NOR FLASH Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Table 4-2 NAND FLASH Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Table 4-3 Options of the SERDES routed to COM Express Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Table 4-4 Memory Capacities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Table 4-5 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Table 4-6 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Table 4-7 SD or Micro SD card on the Carrier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Table 4-8 Real Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Table 4-9 WDT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Table 4-10 USB PHY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Table 4-11 USB HUB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Table 4-12 I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Table 5-1 Configuration of the frequency of SERDES reference clock by GPIO . . . . . . . . . . . . . . . . . . . 56

Table 7-1 BSP Source Code Package Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

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List of Tables

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List of Figures

Figure 1-1 Declaration of Conformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 1-2 COMX-P4080-2G-ENP2 Mechanical Dimensions (Top and side views) . . . . . . . . . . 22

Figure 1-3 Location of Product Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Figure 4-1 COMX-P4080-2G-ENP2 Function Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Figure 4-2 Distribution of Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Figure 4-3 Distribution of SERDES Lanes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Figure 4-4 Board Thermal Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Figure 4-5 Memory Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Figure 4-6 Distribution of GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Figure 4-7 Distribution of SPI Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Figure 4-8 Distribution of I2C buses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Figure 5-1 Clock Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

Figure 6-1 Power Tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

Figure 6-2 Power Sequence of COMX-P4080-2G-ENP2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

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List of Figures

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About this Manual

Overview of Contents

This manual is divided into the following chapters and appendices.

 Chapter 1, Introduction, on page 19 provides an overview of the product's features

 Chapter 2, Hardware Preparation and Installation, on page 25 provides instructions for

installing and removing the module

 Chapter 3, Controls, LEDs, and Connectors, on page 31 provides informations on the pin

assignments on the various connectors on the board

 Chapter 4, Functional Description, on page 33 describes the functions of the various

components on the board

 Chapter 5, Clock Structure, on page 55 describes the clock distribution in the COMX-P4080-

2GENP2. and the setup utility used to configure the product.

 Chapter 6, On-Boards Power Domains, on page 57 describes the power supply system for the

module

 Chapter 7, BSP, on page 59 describe how to build COMX-P4080-2G-ENP2 Basic Support

Package (BSP) and deploy the built images on COMX-P4080-2G-ENP2.

Abbreviations

This document uses the following abbreviations:

Abbreviation Definition

A/D A/D

ANSI American National Standard Institute

ASIC Application Specific Integrated Circuit

ATX Advanced Technology Extended

Aurora Debug protocol for high speed SerDes

BGA Ball Grid Array

BLT Block Transfer

COM Computer on Module

COMX Emerson marketing identifier for COM Express

COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)

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About this Manual

Abbreviation Definition

COP Common On-chip Processor

COTS Commercial-Off-the-Shelf

CPU Central Processing Unit

CRC Cyclic Redundancy Check

DDR Double Data Rate

DLL Delay-Locked Loop

DMA Direct Memory Access

DRAM Dynamic Random Access Memory

DUART Dual Universal Asynchronous Receiver/Transmitter

ECC Error Correction Code

EEPROM Electrically Erasable Programmable Read-Only Memory

EPROM Erasable Programmable Read-Only Memory

About this Manual

FCC Federal Communications Commission

FEC Fast Ethernet Controller

FIFO First In First Out

F/W Firmware

FPBGA Flip Chip Plastic Ball Grid Array

GB GigaBytes

Gbit Gigabit

Gbps Gigabits Per Second

GPI General Purpose Input

GPIO General Purpose Input Output

GPO General Purpose Output

GMII Gigabit Media Independent Interface

GPR General Purpose Register

H/W Hardware

ID Identification

I/O Input/Output

COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)

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About this Manual

Abbreviation Definition

IEEE Institute of Electrical and Electronics Engineers

I2C Inter IC

JTAG Joint Test Access Group

KB KiloBytes

KBAUD Kilo Baud

LBC Local Bus Controller

LED Light Emitting Diode

MB MegaBytes

Mbit Megabit

Mbps Megabits Per Second

MDIO Management Data Input/Output

MHz Megahertz

OS Operating System

PCB Printed Circuit Board

PCI Peripheral Component Interconnect

PCIe Peripheral Component Interconnect Express

PIC Programmable Interrupt Controller

RAM Random Access Memory

RCW Root Configuration Word

ROM Read-Only Memory

RTC Real-Time Clock

RTM Rear Transition Module

SATA Serial Advanced Technology Attachment

SDRAM Synchronous Dynamic Random Access Memory

SGMII Serial Gigabit Media Independent Interface

SMT Surface Mount Technology

SPD Serial Presence Detect

SRAM Static Random Access Memory

COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)

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About this Manual

Abbreviation Definition

SRIO Serial RapidIO

S/W Software

TDP Thermal Design Power

UART Universal Asynchronous Receiver Transmitter

ULPI UTMI+ Low Pin Interface

USB Universal Serial Bus

V_BAT Battery-supplied Voltage

VIO Input/Output Voltage

VPD Vital Product Data

WDT Watchdog Timer

XAUI 4-Lane 10GbE Interface According to IEEE802.3ak

About this Manual

Conventions

The following table describes the conventions used throughout this manual.

Notation Description

0x00000000 Typical notation for hexadecimal numbers (digits are

0b0000 Same for binary numbers (digits are 0 and 1)

bold Used to emphasize a word Screen Used for on-screen output and code related elements

Courier + Bold Used to characterize user input and to separate it

Reference Used for references and for table and figure

File > Exit Notation for selecting a submenu

<text> Notation for variables and keys

0 through F), for example used for addresses and offsets

or commands in body text

from system output

descriptions

COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)

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About this Manual

Notation Description

[text] Notation for software buttons to click on the screen

and parameter description

... Repeated item for example node 1, node 2, ..., node

.. Ranges, for example: 0..4 means one of the integers

| Logical OR.

Omission of information from example/command that is not necessary at the time being.

0,1,2,3, and 4 (used in registers).

Indicates a hazardous situation which, if not avoided, could result in death or serious injury.

Indicates a hazardous situation which, if not avoided, may result in minor or moderate injury

Indicates a property damage message.

No danger encountered. Pay attention to important information.

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About this Manual

Summary of Changes

This manual has been revised and replaces all prior editions.

Part Number Publication Date Description

6806800P63A August 2012 Initial Version

6806800P63B August 2014 Re-branded to Artesyn template.

About this Manual

COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)

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Safety Notes

This section provides warnings that precede potentially dangerous procedures throughout this manual. Instructions contained in the warnings must be followed during all phases of operation, service, and repair of this equipment.You should also employ all other safety precautions necessary for the operation of the equipment in your operating environment. Failure to comply with these precautions or with specific warnings elsewhere in this manual could result in personal injury or damage to the equipment.

Artesyn intends to provide all necessary information to install and handle the product in this manual. Because of the complexity of this product and its various uses, we do not guarantee that the given information is complete. If you need additional information, ask your Artesyn representative.

The product has been designed to meet the standard industrial safety requirements. It must only be used in its specific area of office telecommunication industry and industrial control. Only personnel trained by Artesyn or persons qualified in electronics or electrical engineering are authorized to install, remove or maintain the product.

The information given in this manual is meant to complete the knowledge of a specialist and must not be used as replacement for qualified personnel. Keep away from live circuits inside the equipment. Operating personnel must not remove equipment covers. Only factory authorized service personnel or other qualified service personnel is allowed to remove equipment covers for internal subassembly or component replacement or any internal adjustment.

Do not install substitute parts or perform any unauthorized modification of the equipment or the warranty may be voided. Contact your local Artesyn representative for service and repair to make sure that all safety features are maintained.

COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)

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Safety Notes

COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)

Page 19

Introduction

The COMX-P4080-2G-ENP2 is a COM Express module based on the Freescale Power PC P4080 platform.This board provides some of the universal interfaces such as Gigabit Ethernet, USB, PCIE, and so on.

1.1 Features

Following are the features of the COMX-P4080-2G-ENP2:

 Form Factor: Basic (95mm x 125mm) Bullet list 2

 P4080 CPU supported

 Boot Options:

– 16 bits width NOR flash from local bus (standard product default)

– NAND flash from local bus

Chapter 1

– I2C EEPROM

Selectable via carrier.

 Operating System:

– Linux

– VxWorks

VxWorks is only a plan rather than requirement Supported CPU: P4080.

 (P4080) dual channel laid down DDR3, 1GB per channel, ECC (with option to populate only

one channel (top) at 2GB)

 (P4080) 16 lanes of SERDES routed to COME connectors, which can be configured as PCIE,

XAUI, SRIO, SGMII

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Introduction

 4 UARTs or 2 DUARTs

 (P4080) 0/1/2 GE ports (option available to use this port as USB)

 (P4080) 5/4/0 USB ports

 1588 signals output to the COME connectors

 Total 3 I2C buses

 1 SPI bus with 3 chip select signals

 Connected from the SDHC pins to COME connectors

 Connected from the tamper detect pins to COME connectors

 8 GPI and 8 GPO to COME connectors

 On-board RTC and WDT device

 Provide both remote and local thermal sensor

 JTAG connector on module

 Aurora testing points on module

 On-board regulators supply required voltages to devices on the module

 12V and 5V standby power supplied to module from ATX-type (or other type) power

supply through COME connectors

1.2 Standard Compliances

This product meets the following standards:

Table 1-1 Standard Compliance

Standard Description

UL60950-1 EN 60950-1 IEC 60950-1 CAN/CSA C22.2 No 60950-1

CISPR 22 CISPR 24 EN55022 EN 55024

ENTSI EN 300 019 Series Environmental Requirement

Safety Requirements

EMC Requirements on system level

COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)

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Table 1-1 Standard Compliance (continued)

Standard Description

Directive 2011/65/EU Directive on the restriction of the use of certain

hazardous substances in electrical and electronic equipment (ROHS)

Figure 1-1 Declaration of Conformity

C Declaration of Conformity

According to EN 17050-1:2004

Manufacturer’s Name:

Manufacturer’s Address:

Declares that the following product, in accordance with the requirements of 2004/108/EC, 2006/95/EC, 2011/65/EU and their amending directives,

Product:

Model Name/Number:

Artesyn Embedded Technologies Embedded Computing

Zhongshan General Carton Box Factory Co. Ltd. No 62, Qi Guan Road West, Shiqi District, 528400 Zhongshan City Guangdong, PRC

Ruggedized and extended temperature COM Express modules with Freescale QorIQ™ processing power

SCP-P4040-4G-ENP2, COMX-P4080-2G-ENP2

Introduction

has been designed and manufactured to the following specifications:

EN55022: 2010 Class B

EN55024: 2010

IEC 60950-1: 2005 (2nd Edition) + A1:2009

2011/65/EU RoHS Directive

As manufacturer we hereby declare that the product named above has been designed to comply with the relevant sections of the above referenced specifications. This product complies with the essential health and safety requirements of the above specified directives. We have an internal production control system that ensures compliance between the manufactured products and the technical documentation.

___________________________________________________ ___

Tom Tuttle, Manager, Product Testing Services Date (MM/DD/YYYY)

COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)

08/12/2014

______

Page 22

Introduction

1.3 Mechanical Data

The following figures are the top and bottom view of the board:

Figure 1-2 COMX-P4080-2G-ENP2 Mechanical Dimensions (Top and side views)

Table 1-2 PCB Dimensions

Characteristics Value

Height 95 mm

Length 125 mm

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Table 1-2 PCB Dimensions

Characteristics Value

Thickness 2 mm

Mounting height top side (component side 1)

Mounting height bottom side (component side 2)

1.4 Ordering Information

Supported Board Models

As of the printing date of this manual, this guide supports the board models listed in the following table:

Order Number Description

Introduction

COMX-P4080-2G-ENP2 QorIQ P4080 with 2GB memory, ENP2. COM Express Basic size

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Introduction

1.5 Product Identification

The following figure shows the location of the board's serial number:

Figure 1-3 Location of Product Serial Number

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Hardware Preparation and Installation

2.1 Environmental and Power Requirements

You must make sure that following environmental requirements meet when board is operated in your system configuration.

Operating temperatures refer to the temperature of air circulation around the board, but not the component temperature.

Environmental Requirements

The following table provides the environmental requirement details for the board:

Chapter 2

Table 2-1 Environmental Requirements

Environmental Factor Operating Non-operating

Temperature -40

Humidity to 100% RH to 100% RH

Vibration Random (1hr/axis) 0.04g2/Hz, 15 to 2000Hz

Shock 30g/11mS(half sine)

Altitude -60 to 4000 m ASL

Vibration Sine (10mins/axis)

Thermal Requirements

A standard passive heat sink or heat spreader can be provided by Emerson; 12 CFM system airflow volume (at 71oC) is needed for the heat sink to keep sufficient cooling to the COMXP4080-2G-ENP2. Contact your Emerson sales representative for current information on the detailed thermal information of the COMX-P4080-2G-ENP2.

C to +71oC -50oC to +100oC

(7.6GRMS)

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Hardware Preparation and Installation

The following table summarized components that exhibit significant temperature raises and their maximum allowable operating temperature. These components should be monitored in order to assess thermal performance during customized thermal solution development.

Table 2-2 Critical Temperature Spots

Component Identifier Heat Dissipation Power (W)

CPU: P4080 20.5 CPU: 105 (Tj)

Memory SDRAM: 2GB 3 95 (Tc)

System Overheating Colling Vents Improper cooling can lead to system damage and an void the manufacturer's warranty. To ensure proper cooling and undisturbed airflow through the system do into obstruct the ventilation openings of the system. Make sure that the fresh air supply is not mixed with hot exhaust from other devices.

Maximum Allowable Temperature

(oC)

Personal Injury During operation, hot surfaces may be present on the heat sinks and the components of the product. To prevent injury from hot surface, do not touch any of the exposed components or heatsinks on the product when handling. Use the handle and face plate, where applicable, or the board edge when removing the product from the enclosure.

Power Requirements

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Hardware Preparation and Installation

This board is designed to operate with the input voltages and currents as defined in the following tables.

Table 2-3 Power Requirement (with solder-down memory chips)

State 12v VCC_RCT

Idle 2.81A 100 uA

Full Loading (Linux) 2.91A 100 uA

1 Total power dissipation (W) 34.92

2.2 Unpacking and Inspecting the Board

Damage of Circuits

 Electrostatic discharge and incorrect installation and removal of the product can

damage circuits or shorten their life.

 Before touching the product make sure that you are working in an ESD-safe

environment or wear and ESD wrist strap or ESD shoes. Hold the product by its edges and do not touch any components or circuits.

1. Verify that you have received all items of your shipment:

 Printed Quick Sart Guide and Safety Notes

 COMX-P4080-2G-ENP2 Board

 Drivers CD

2. Check for damage and report any damage or differences to customer service.

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Hardware Preparation and Installation

3. Remove the desiccant bag shipped together with the product.

Environmental Damage Improperly disposing of used products may harm the environment Always dispose of used products according to your country's legislation and manufacturer's instructions

2.3 Installing and Removing the Module on the Carrier Board

The heat sink/heat spreader is already assembled with the module before these operations.

Installing the COM module on the carrier board

1. Line up the board-to-board connector of the module assembly with the board-to-board

connector of the carrier board.

2. Make sure that the interconnectors are properly aligned and that the five standoffs on the

module have contact with the top of the carrier board.

3. From the bottom side of the carrier board, locate the screw holes on module and carrier

board.

4. Use the screws to fasten the module to the carrier board.

Removing the COM module from the carrier board

1. From the back side of the carrier, locate the five screws that connect the module assembly

to the carrier board.

2. Loosen and remove the screws.

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Hardware Preparation and Installation

3. While holding the edges, pull the module from the carrier board.

This installation procedure is only for reference. Assemble the heat-sink and the module based on your own thermal solution.

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Hardware Preparation and Installation

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Controls, LEDs, and Connectors

3.1 Connectors and Switches

3.1.1 On-board Connectors

JTAG Header

The following table lists the Pin-out of JTAG connector.

Table 3-1 JTAG connector Pin-out

Pin Number Signal Name

1GND

2 CKSTP OUTPUT

3NC

Chapter 3

4HRST

5NC

6SRST

7NC

8TMS

9 CKSTP INPUT

10 TCK

11 VDDSENSE

12 RUNSTOP

13 TRST

14 TDI

15 NC

16 TDO

3.2 On-board LEDs

There are several LEDs provided on the module to denote the statements of the system.

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Controls, LEDs, and Connectors

The following table lists the LED IDs:

Table 3-2 LED and statements of the system

LED ID Statement of the system

D17 Thermal issue

D18~D19 Debug LED 1~2

D3 System asleep

D7 DDR3 power OK

D4 3.3V power OK

D5 2.5V power OK

D6 1.8V power OK

D13 CORE power OK

D9 PLATFORM power OK

D10 1.5V power OK

D1 USB hub 1 active

D2 USB hub 1 high speed

D15 USB hub 2 active

D16 USB hub 2 high speed

COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)

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Functional Description

The COMX-P4080-2G-ENP2 is a COM Express module based on the Freescale Power PC P40x0 platform.This board provides some of the universal interfaces such as Gigabit Ethernet, USB, PCIE, and so on. This board is designed to support the QorIQ P4080 integrated processor running at the speed of 1.2GHz.

The QorIQ P4080 integrated communication processor combines eight Power Architecture™ processor cores with high performance data path acceleration logic, network and peripheral bus interfaces required for networking, tele communication, data communication, wireless infrastructure, and military/aerospace applications.

Figure 4-1 COMX-P4080-2G-ENP2 Function Block Diagram

Chapter 4

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Functional Description

4.1 Processor Core and Cache Memory Complex

The QorIQ P4080 has eight high-performance 32-bit Power Architecture Book E-compliant e500mc cores. Each e500mc is a superscalar dual issue processor that supports out-of-order execution and in-order completion, thus making it perform better than other RISC and CISC architectures.

Features of e500mc

 36 bit physical addressing

 512-entry 4-Kbyte pages

 3 Integer units (2 simple, 1 complex)

 1.5GHz at 1.0V

 64-Byte cache line size

 L1 caches

 User, Supervisor, and Hypervisor instruction level privileges

 APU, classic double precision floating point unit

 128-Kbyte private L2 cache running at the same frequency of CPU

 2-Mbyte of shared L3 CoreNet platform cache (CPC)

4.2 Integrated Memory Controller

The P4080 consists of two DDR controllers that support DDR2 and DDR3 SDRAM. It can support a maximum of 64GByte of main memory. It is capable of ECC, detects and corrects all single bit errors, double-bit and within a nibble errors. The DDR controller is capable of selfrefresh mode (for compliant DDR SDRAM DIMMs) and an initialization bypass during system power-on after an abnormal shutdown for use by designers in preventing re-initialization.

4.3 Local Bus

The local bus is connected to a 2 Gb or 256 MB NOR Flash and a 08 G bits or 1 G Bytes

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Functional Description

NAND flash. The NOR flash is used to store the RCW data, U-boot, and Linux kernel. By default, the NAND flash is used to store the file system. There are a totally four chip-select signals included in the local bus from CS0 to CS3. Among the CS0 to CS3, only CS0 is enabled during power on reset. So, the chip-select-signal (CS) of the device connected to local bus from which the system boots must be connected to CS0.

Local bus with 16 bits data bus (DQ0~DQ15) are directly routed to COM Express connectors.

A "low" state is required to enable local bus output and a "high" state or '1' is required to disable.

The following figure illustrates the distribution of local bus on P4080:

Figure 4-2 Distribution of Local Bus

4.4 Clock

The eLBC clock is generated by platform clock. The divisor is configured by CLKDIV in Clock Ratio Register (LCRR). The divisor is 32 when GPCM is selected as RCW source. So the eLBC clock is platform clock / 32 = 800MHz / 32 = 25MHz.

4.5 NOR FLASH

The NOR FLASH is attached to the GPCM on local bus and works at 16-bit mode.

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Functional Description

The NOR FLASH is Numonyx™ JS 28F00 B M29EW H. Its size is 2Gb/ 256MB. It has 2048 uniform blocks, 128K bytes or 64K words each.

The physical address for NOR FLASH is 0xFE0000000 - 0xFEFFFFFFF.

The NOR FLASH should contain RCW data, u-boot image, u-boot environment variables, kernel image, device tree blob, RAMDISK image and FMAN ucode image. The detailed map is described in the following table:

Table 4-1 NOR FLASH Map

Block# Blocks Start End Size Description Static/Variable

0 1 0000 0000 0001 FFFF 128 KB Active RCW Option

Data

1 1 0002 0000 0003 FFFF 128 KB RCW Option Data1 Static

2 1 0004 0000 0005 FFFF 128 KB RCW Option Data2 Static

3 1 0006 0000 0007 FFFF 128 KB RCW Option Data3 Static

4 1 0008 0000 0009 0000 128 KB RCW Option Data4 Static

5 1 000A 0000 000B FFFF 128 KB RCW Option Data5 Static

6 1 000C 0000 000D FFFF 128 KB RCW Option Data6 Static

7 1 000E 0000 000F FFFF 128 KB RCW Option Data7 Static

8 1 0010 0000 0011 FFFF 128 KB RCW Option Data8 Static

9 1 0012 0000 0013 FFFF 128 KB RCW Option Data9 Static

10 1 0014 0000 0015 FFFF 128 KB RCW Option Data10 Static

11 1 0016 0000 0017 FFFF 128 KB RCW Option Data11 Static

12 1 0018 0000 0019 FFFF 128 KB RCW Option Data12 Static

13 3 001A 0000 0020 0000 384KB Not Used Static

16 112 0020 0000 00FF FFFF 14 MB FMAN ucode Image Static

128 1792 0100 0000 0EFF FFFF 224 MB RAMDISK Image Static

1920 120 0F00 0000 0FEF FFFF 15 MB Kernel Image Static

Static

2040 3 0FF0 0000 0FF5 FFFF 384 KB Device Tree Blob Static

2043 1 0FF6 0000 0FF7 FFFF 128 KB U-Boot Env Variable Static

2044 4 0FF8 0000 0FFF FFFF 512 KB U-Boot Image Static

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4.6 NAND Flash

The NAND FLASH is Micron MT29F8G08ADADAH4 whose FLASH size is 08 G bits or 1 G Bytes. The pages are large and each page contains 2112 bytes including 2048 bytes of data and 64 bytes of spare. There are totally 8192 blocks, each block contains 64 pages including 128 KB of data and 4 KB of spare.

The NAND FLASH is only used as NAND FLASH JFFS2 rootfs.The detailed map is described in the following table:

Table 4-2 NAND FLASH Map

Start Address End Address Size Description

0000 0000 00FF FFFF 16 MB Not Used

0100 0000 3FFF FFFF 1GB - 16MB NAND FLASH JFFS2 rootfs

Functional Description

4.7 HSSI or SERDES Block

COMX-P4080-2G-ENP2 contains SERDES 3 banks including a total of 18 lanes. From the 18 lanes of SERDES, 12 are routed to the COM Express connectors, defined as SERDES0~ SERDES7 (SERDES0~7 of bank 1) and SERDES16~SERDES19 (SERDES10~13 of bank 2). SERDES8~SERDES9 of bank 1 are used for Aurora debugger defined as Aurora0~1. The remaining 4 lanes of bank 3 are not used in P4080.

The protocol running at each lane or each group of lanes routed to COM Express connectors are configured by the RCW, available options are shown in the following table:

Table 4-3 Options of the SERDES routed to COM Express Connectors

Bank1 SerDes 0

Option#

1 PEX1 x4

2 PEX1 x4

3 PEX1 x4

COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)

~ 3 (SLOT J6)

(2.5Gbps)

(5Gbps)

Bank1 SerDes 4 ~ 7 (SLOT J14)

PEX2 x4 (2.5Gbps)

PEX2 x4 (5Gbps)

PEX2 x4 (2.5Gbps)

Bank2 SerDes 10 ~ 13 (SLOT J10) RCW [SRDS_PRTCL]

XAUI (3.125Gbps) 0x05 XAUI FM1 10 GEC

Bank 3# SerDes 14~17(slot J2)

Page 38

Functional Description

Table 4-3 Options of the SERDES routed to COM Express Connectors

Bank1 SerDes 0

Option#

4 PEX1 x4

5 PEX1 x4

6 PEX1 x4

7 SRIO2 x4

8 SRIO2 x4

9 SRIO2 x4

10 SRIO2 x4

11 PEX1 x4

12 PEX1 x4

~ 3 (SLOT J6)

(5Gbps)

(2.5Gbps)

(5Gbps)

(3.125Gbps)

(2.5Gbps)

(3.125Gbps)

(2.5Gbps)

(5Gbps)

Bank1 SerDes 4 ~ 7 (SLOT J14)

PEX2 x4 (5Gbps)

SGMII x 4

(1.25Gbps)

SGMII x 4

(1.25Gbps)

SRIO1 x4

(3.125Gbps)

SRIO1 x4 (3.125Gbps)

SRIO1 x4 (2.5Gbps)

SRIO1 x4 (3.125Gbps)

SRIO1 x4 (2.5Gbps)

Bank2 SerDes 10 ~ 13 (SLOT J10) RCW [SRDS_PRTCL]

XAUI (3.125Gbps) 0x05 XAUI FM1 10 GEC

XAUI (3.125Gbps) 0x0F Reserved

PEX3 x4 (2.5Gbps) 0x19 4x SGMII (1.25

PEX3 x4 (5Gbps) 0x19 4x SGMII (1.25

XAUI (3.125Gbps) 0x13 XAUI

SGMII x 4 (1.25Gbps)

XAUI (3.125Gbps) 0x22 XAUI

0x16 4x SGMII (1.25

Bank 3# SerDes 14~17(slot J2)

Gbps)

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Page 39

Functional Description

The following figure illustrates the distribution of SERDES lanes on P4080:

Figure 4-3 Distribution of SERDES Lanes

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Functional Description

4.8 Thermal Management

COMX-P4080-2G-ENP2 provides a thermal management strategy. This includes CPU junction temperature monitoring.The following diagram shows thermal management strategy:

Figure 4-4 Board Thermal Management

A thermal diode is integrated in P40x0, which connects to a thermal sensor ADT7411. The CPU can get the junction temperature via I2C.

When the junction temperature goes up to105oC, ADT7411 drives INT# to low, indicates an interrupt to CPU. A red LED D17 can show the interrupt status.

LED Definition Definition Description

D17 INT# signal is active ON The CPU temperature

goes up to 105

OFF Normal status

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4.9 Main Memory

4.9.1 Memory Interface

QorIQ P40x0 supports two individual DDR channels that may be configured for DDR2 and DDR3. Each channel consists of 64-bit data and 8 ECC bits. Both unbuffered and registered memory subsystem schemes are supported.

The module supports 2 GB DDR3 1066MHz ECC memories per channel. 1 GB each channel, one on top assembly and another at bottom of the PCB. Each channel contains 9x SDRAM chips on the module.

Total bottom height limit is specified as xx mm while the SDRAM's height is 1.2mm (max).

The memory interface includes all the necessary termination and IO powers.

The following figure illustrates the DDR memory architecture per controller:

Functional Description

Figure 4-5 Memory Interface

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Functional Description

Table 4-4 Memory Capacities

Characteristic Value

Memory technology DDR3

SDRAM chip MT41J128M8HX-15E IT:D

Memory Size 1Gb 128x8

Supply voltage 1.5V

Oracle Number 5106813C95

4.10 Memory Map

The following table provides the memory map of COMX-P4080-2G-ENP2.

Table 4-5 Memory Map

32-bit Effective

Address#

1 0000 0000 0 0000 0000 8000 0000 - 2GB DDR3 Memory, NOTE1

2 8000 0000 C 0000 0000 2000 0000 - 512MB PCIE1 MEM

3 A000 0000 C 2000 0000 2000 0000 - 512MB PCIE2 MEM, NOTE2

4 A000 0000 C 2000 0000 1000 0000 - 256MB RIO1 MEM, NOTE2

5 B000 0000 C 3000 0000 1000 0000 - 256MB RIO2 MEM, NOTE2

6 C000 0000 C 4000 0000 0800 0000 - 512MB PCIE3 MEM

7 E000 0000 F E000 0000 1000 0000 - 256MB LBC NOR FLASH

8 F000 0000 F F000 0000 0040 0000 - 4MB DCSR

9 F400 0000 F F400 0000 0020 0000 - 2MB BMAN MEM

10 F420 0000 F F420 0000 0020 0000 - 2MB QMAN MEM

11 F800 0000 F F800 0000 0001 0000 - 64KB PCIE1 IO

12 F801 0000 F F801 0000 0001 0000 - 64KB PCIE2 IO

13 F802 0000 F F802 0000 0001 0000 - 64KB PCIE3 IO

14 FFA0 0000 F FFA0 0000 0010 0000 - 1MB NAND FLASH Buffer

15 FE00 0000 F FE00 0000 0100 0000 - 16MB CCSR

Base Address 36-bit Physical Base Address Size Description

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Functional Description

Table 4-5 Memory Map

32-bit Effective

Address#

16 FFFF F000 0 FFFF F000 0000 1000 - 4KB BOOT PAGE

Base Address 36-bit Physical Base Address Size Description

Only upto 2GB memory is mapped in u-boot and the other memory is left unmapped and not used if more than 2GB memory is fitted. More than 2GB can be used in Linux. Up to 4GB has been verified. Address #4 and #5 is used instead of address #3 if RIO is configured.

4.11 GPIO

COMX-P4080-2G-ENP2 consists of totally 21 GPIOs. The following table lists the GPIOs:

Table 4-6 GPIO

GPIO Name Function

CPU_GPIO0 GPI0 of COME connectors

CPU_GPIO1 GPI1 of COME connectors

CPU_GPIO2 GPI3 of COME connectors

CPU_GPIO3 GPI4 of COME connectors

CPU_GPIO4 GPO0 of COME connectors

CPU_GPIO5 GPO1 of COME connectors

CPU_GPIO6 GPO3 of COME connectors

CPU_GPIO7 GPO4 of COME connectors

CPU_GPIO19 Clock generators enable control

CPU_GPIO20 Carried board reset output

CPU_GPIO23 Clock generator of bank 1 frequency

selection

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Table 4-6 GPIO

GPIO Name Function

CPU_GPIO24 Clock generator of bank 2 frequency

CPU_GPIO26 Clock generator of bank 3 frequency

IOEXT_GPI5 GPI5 of COME connectors

IOEXT_GPI6 GPI6 of COME connectors

IOEXT_GPI7 GPI7 of COME connectors

IOEXT_GPI8 GPI8 of COME connectors

IOEXT_GPO5 GPO5 of COME connectors

IOEXT_GPO6 GPO6 of COME connectors

IOEXT_GPO7 GPO7 of COME connectors

selection

IOEXT_GPO8 GPO8 of COME connectors

GPIO18, 19, 20, 23, 24 and 26 are multiplexed with other functional blocks. The pins should be configured as GPIO in RCW data.

GPIO18/19: RCW [DMA1]=1b

GPIO20: RCW [DMA2]=10b

GPIO23/24/26: RCW [IRQ]=1b

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Functional Description

After reset, the direction for all GPIOs are set to input. So all the GPIOs used as output needs to be reconfigured.

Figure 4-6 Distribution of GPIO

4.12 SDHC

COMX-P4080-2G-ENP2 provides an SD/MMC interface to the COM Express connector and there should be a SD card connector provided on the carrier.

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Functional Description

This module not only supports SD card but also Micro SD card in which there is no writeprotect signal. The sixth bit of the switcher S2 is provided to define whether a SD card or Micro SD card is embedded in the carrier board.

Table 4-7 SD or Micro SD card on the Carrier

S2.6 Card on the carrier

ON SD card

OFF (Default) Micro SD card

4.13 SPI Interface

COMX-P4080-2G-ENP2 provides a SPI bus with 3 chip-select signals. All SPI bus signals are routed to COM Express connectors.

The following figure illustrates the distribution of SPI bus:

Figure 4-7 Distribution of SPI Bus

4.14 LAN

This module provides 1 GE port with LED controlling signals routing to the COM Express connectors and the magnetic must be placed on carrier board. The interface used between MAC and PHY BCM5482 is the RGMII bus in P4080, which is multiplexed with USB1 ULPI bus, so RCW [EC1] should be set to 00 as RGMII protocol.

U-boot should provide the driver of dTSEC and TCP/IP protocol stack. The U-boot can use TFTP to download images to memory.

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4.14.1 MDIO

There are totally two groups of MDIO buses in P4080. The first group is called EMI1 which complies with IEEE 802.3 Clause 22. EMI1 has two pins: EMI1_MDC and EMI1_MDIO. It is available externally only on dTSEC0@FMan1. EMI1 is used for the communication between dTSEC, MAC, and PHY. SGMII PHY is also managed by EMI1.

The second group is called EMI2 which complies with IEEE 802.3ae Clause 45. EMI2 has two pins: EMI2_MDC and EMI2_MDIO. It is available externally only on 10GEC of FMan1. EMI2 is used for the communication between 10GEC and PHY.

4.14.2 PHY

dTSEC0@FMan1 is connected to BCM5482 via RGMII. There are totally two ports included in the GE PHY BCM5482 and only first port is used.The MDIO address for the first port is 0x01 and the second is 0x02.

Functional Description

The MDIO addresses for 4 SGMII PHYs are 0x1C, 0x1D, 0x1E and 0x1F when SerDes option #5/#6 or #10 is applied.

4.15 UART INTERFACE

COMX-P4080-2G-ENP2 consists of 4 UARTS (Tx and Rx signals for each UART) or 2 DUARTS (Tx, Rx, CTS, RTS signals for each DUART) that are routed to the COM Express connectors. Several optional resistors are provided to determine whether UARTS or DUARTS are routed.

When UARTS are routed, R383, R385, R387, and R389 are installed and R382, R384, R386, and R388 are removed, and vice versa.

UART option is the default setting.

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4.16 RTC & WDT

The RTC and WDT functions provided in the module are embedded separated in 2 ICs, U2100 and U2101 respectively. The WDT is accessed through I2C1 bus of the processor, and the RTC is accessed through I2C2 bus, both with an address of 0xD0.The WDT triggers a reset output signal for power-on reset, and the RTC provides a 32 KHz clock output for the RTC clock input of the processor. Battery backup for the RTC is supplied by the VCC_BAT pin on the COME connectors.

Table 4-8 Real Time Clock

Characteristic Value

Vendor ST Micro

Device M41T62LC6F

Function Real-time clock with alarm interrupt, programmable

square wave output

Package LCC8 (1.5 mm x 3.2 mm)

Oracle Number 5106837C55

Table 4-9 WDT

Characteristic Value

Vendor ST Micro

Device M41T65Q6F

Function Watchdog output

Package QFN16 (3 mm x 3 mm)

Oracle Number 5106837C56

4.17 USB

This module consists of one USB PHY (USB3315) and one 4-ports (USB4~USB7) USB hub (USB2514).The interface between the USB controller and USB PHY is ULPI bus, the second group of multiplexing interface RGMII/ULPI. So the RCW should be properly set for the using of the second group of ULPI bus.

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Functional Description

The operating mode of the USB hub is configured by hardware strapping, and it can also be configured by I2C bus by changing the state of the strapping pins. Hardware strapping is the default method. The I2C bus address of the USB hub is 0x58 when configured.

By default configuration, all 4 USB ports of the hub are removable and all indicating signals are active high. Two LED provided on the module to indicate the operating state of the USB hub. One is hub active indicating LED and the other is hub high speed indicating LED.

Table 4-10 USB PHY

Characteristic Value

Vendo r S MSC

Device USB3315C-CP-TR

Function USB Transceiver (PHY)

Package QFN24 (4.0mm x 4.0mm x 1.0mm)

Oracle Number 5106812C21

Table 4-11 USB HUB

Characteristic Value

Vendo r S MSC

Device USB2514Bi-AEZG

Function USB Hub Controller

Package QFN36 (6.0mm x 6.0mm x 1.0mm)

Oracle Number 5106812C33

4.17.1 Four USB Ports

All four USB interfaces are directly connected to the COM Express connector.

All the four USB ports signals with two over current detecting signals, USB_OC_0_1_N and USB_OC_2_3_N are routed to the COM Express connectors. USB_OC_0_1_N is for USB0 and USB1, USB_OC_2_3_N is for USB2 and USB3.

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Functional Description

4.18 I2C Interface

The Freescale Power PC P4080 consists of four I2C buses. Among four I2C buses, the I2C3 bus is multiplexed with SDHC bus and remaining I2C buses are routed to COM Express connectors.

There is only one device attached to the second I2C bus I2C2, and there are 6 devices attached to the first I2C bus I2C1.

The following figure illustrates the distribution of the I2C buses:

Figure 4-8 Distribution of I2C buses

Table 4-12 I2C Interface

Address Bus Component Function Oracle Number

0xD0 I2C1 9FG104DGILFT Clock Generator 51NL9655W46

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Table 4-12 I2C Interface

Address Bus Component Function Oracle Number

0xD0 I2C1 M41T65Q6F Watchdog 5106837C56

0x30 I2C1 PCA9557PW-T IO-Expander 51NL9637V06

0xAC I2C1 MCP98243T-BE/ST SPD Channel A 5106819C29

0xA4 I2C1 MCP98243T-BE/ST SPD Channel B 5106819C29

0x90 I2C1 ADT7411ARQZREEL7 Voltage Monitor/Temp

Sense

0xAE I2C1 AT24C02-SSHM-T

AT24C512CSSHM-T

0xA8 I2C1 AT24C512C-XHMT Processor ID EEPROM 5106813D81

0xD0 I2C2 M41T62LC6F RTC 5106837C55

2kb Boot Config EEPROM 512kb Boot Config EEPROM

227975

5106813C77 5106813D51

4.18.1 I2C Device Thermal Sensor

The ADT7411 thermal sensor is a dual-channel digital thermometer and under/over temperature alarm. It is used in computers and thermal management systems. The ADT7411 thermal sensor is located on I2C1, U2900. The device address is 0x90. It is designed for monitoring P4080 processor temperature.

The ADT7411 can accurately measure the temperature of a remote thermal diode to ±1oC and the ambient temperature to ±3oC. The temperature measurement range defaults to 0oC to +127oC, but can be switched to a wider measurement range of-55oC to +150oC. The ADT7411 communicates over a 2-wire serial interface compatible with system management bus (SMBus) standards. An ALERT output signals when on-chip or remote temperature is out of range.The THERM output is a comparator output that allows on/off control of a cooling fan. The ALERT output can be reconfigured as a second THERM output, if required.

By default, u-boot should mask THERM and ALERT output, set the temperature measurement range from 0oC to +127oC. For setting operation mode and fetching the monitoring temperature, u-boot should provide u-boot commands.

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4.18.2 I2C Device EEPROM

I2C device consists of two I2C EEPROMs, AT24C02C and AT24C512C. These EEPROMs are located on I2C1; one is for ID EEPROM (U30, AT24C02C, storing board serial number, MAC address and so on.) and the other is for Processor EEPROM (U2001, AT24C512C, storing processor ID and so on).The I2C addresses of these EEPROMs are 0xAE and 0xA8.

The EEPROM provides 2048 bits of serial electrically erasable and programmable read-only memory (EEPROM) organized as 256 words of 8 bits each.

AT24C02 support SEQUENTIAL READ and page write.

Sequential reads are initiated by either a current address read or a random address read. After micro-controller receives a data word, it responds with an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the memory address limit is reached, the data word address will roll over and the sequential read will continue.

AT24C02's 32K EEPROM was internally organized with 32 pages of 8 bytes each. A page write is initiated the same as a byte write, but the micro-controller does not send a stop condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the micro-controller can transmit up to seven more data words.

4.18.3 I2C Device WDT

The WDT M41T65Q is located on I2C1, U2101 and the device address is 0xD0.

U-boot has the following considerations:

 By default, u-boot should mask event output and disable WDT.

 U-boot should provide commands for enabling WDT and disabling WDT.

4.18.4 I2C Device RTC

The RTC M41S62L is located on I2C2, U2100 and the device address is 0xD0.

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U-boot has the following considerations:

 U-boot should provide commands for setting RTC date/time and getting RTC date/time.

4.18.5 I2C Device Clock Generator

The clock generator ICS9FG104 is located on I2C1, U17 and the device address is 0xDC.

The ICS9FG104 is a Frequency Timing Generator that provides four differential output pairs that are compliant to the Intel CK410 specification. It also provides support for PCI-Express and SATA. The part synthesizes several output frequencies from either a 14.31818 MHz crystal or a 25 MHz crystal. The device can also be driven by a reference clock input instead of a crystal. It provides outputs with cycle-to-cycle jitter of less than 50 ps and output-to output skew of less than 35 ps. The ICS9FG104 also provides a copy of the reference clock.

Frequency selection can be accomplished via strap pins or SMBus control. By default, strap pins work.

Functional Description

For COMX-P4080-2G-ENP2, the input clock for ICS9FG104 is 25 MHz and three differential output pairs are provided. First pair are connected to SerDes Bank 1, second pair are connected to x2 Aurora Connector, and third pair are connected to COM Express connector.

The forth output pairs are not connected.

When using strap pins to select output frequency, SEL14M_25M# (FS3) is attached to ground (0) by option resistor. FS2 and FS1 have internal 120K pull down and the option resistors should not be soldered. FS0 is controlled by GPIO23 and S1.2. When FS0 is 0 (low level), 100MHz clock output is selected and When FS0 is 1 (high level), 125MHz clock output is selected.

4.18.6 I2C Device USB

I2C device consists of one USB2514 located on I2C2, U25 and the device address is 0x58.

USB2514 is a USB hub controller IC with four downstream ports for embedded USB solutions. The 4-port hub is fully compliant with the USB 2.0 Specification and will attach to an upstream port as a Full-Speed Hub or as a Full-/High-Speed Hub, and High Speed (if operating as a HighSpeed Hub) downstream devices on all of the enabled downstream ports.

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Functional Description

The SMSC Hub must be configured in order to correctly function when attached to a USB host controller. There are three principal ways to configure the hub: SMBus, EEPROM, or by internal default setting. In all cases, the configuration method will be determined by the CFG_SEL2, CFG_SEL1 and CFG_SEL0 pins immediately after RESET_N negation.

In SMBus case, the CFG_SEL1 and CFG_SEL0 pins must be 01, so that Hub can be configured as an SMBus slave for external download of user-defined descriptors.

U-boot should initialize USB hub during boot-up and provide u-boot commands for reading/ writing the hub's registers.

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Clock Structure

The COMX-P4080-2G-ENP2 needs several kinds of single ended and differential clocks for booting up and normal operating. Following is the clock distribution tree:

Figure 5-1 Clock Distribution

Chapter 5

For ruggedized variant where dip switches are not mounted, the following signals connects to COM Express connector and will be up to carrier to configure them:

SERDES bank 1 reference clock select (pin B97 on COME)

Bank1_SEL_FS0=0, 100MHz

Bank1_SEL_FS0=1, 125MHz

*Default:100MHz *Default:125MHz *Default:125MHz

COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)

SERDES bank 2 reference clock select (pin B98 on COME)

Bank2_SEL_S1=0, 100MHz

Bank2_SEL_S1=1, 125MHz

SERDES bank 2 reference clock select (pin B98 on COME)

Bank2_SEL_S1=0, 100MHz

Bank2_SEL_S1=1, 125MHz

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Clock Structure

For standard commercial variant where dip switches are populated, the frequency of all the three SERDES banks' reference clock is selectable between 100MHz and 125MHz by three bits of switcher S1.

SERDES bank 1 reference clock

Default:100MHz Default:125MHz Default:125MHz

SERDES bank 2 reference clock

SERDES bank 3 reference clock

Table 5-1 Configuration of the frequency of SERDES reference clock by GPIO

SERDES bank 1 reference clock

CPU_GPIO23=0, 100MHz CPU_GPIO24=0, 100MHz CPU_GPIO26=0, 100MHz

CPU_GPIO23=1, 125MHz CPU_GPIO24=1, 125MHz CPU_GPIO26=1, 125MHz

Default:100MHz Default:125MHz Default:125MHz

SERDES bank 2 reference clock

SERDES bank 3 reference clock

The setting of these three bits of S1 or GPIOs depends on the protocols running at the SERDES lanes of each bank. When the SERDES lanes are running at the speed of 3.125 Gbps, then the corresponding bank reference clock should be set as 125 MHz, and at the speed besides 3.125 Gbps, it should be set as 100 MHz. For example, if lanes in bank 1 are configured as PCIE, then the bank 1 reference clock should be set as 100 MHz, and if XAUI, then should be set as 125 MHz.

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On-Boards Power Domains

This subsection describes the power supply system for the module. Power is supplied to module from ATX-type (using Emerson carrier) power supply through COM Express connectors and on-board regulators supply required voltages to devices on the module.

Figure 6-1 Power Tree

Chapter 6

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On-Boards Power Domains

6.1 Power Controlling Sequence

The power sequencing of COMX-P4080-2G-ENP2 differs between secure boot mode and nonsecure boot mode. For secure boot mode, POVDD should be set to 1.5V DC and is powered at least 100 system clock cycles after the rising edge of power on reset signal. For non-secure boot mode, POVDD should be set to GND.

Figure 6-2 Power Sequence of COMX-P4080-2G-ENP2

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BSP

7.1 BSP Build Requirements

Build Host

The Basic Support Package (BSP) is hosted by an x86 computer running Linux. At least 1 GB free space is required where the BSP is hosted.

Build Tools

Emerson is using build tools provided in Freescale SDK1.0 QorIQ-DPAA-SDK-20110609systembuilder.iso to build BSP images for SCP-P4080-2G-ENP2.

You can download the Freescale SDK ISO files from and install it on the build host.

Chapter 7

7.1.1 Installing Build Tool on SDK1.0

Following are the steps to install build tools of SDK1.0 from Freescale SDK on host computer:

1. Login to the Linux host as a non-root user, <user_name>.

2. Copy the QorIQ-DPAA-SDK-20110609-systembuilder.iso file to this Linux host.

3. Runt the ISO file using the following command:

sudo mount -o loop QorIQ-DPAA-SDK-20110609-systembuilder.iso /mnt/

4. Create a /opt/freescale directory and update access privileges using the following

command.

sudo mkdir -p /unixopt/sdk1.0 sudo chmod a+rwx /unixopt/sdk1.0

5. Change directory to mount using the following command:

cd /mnt/

6. Install the Freescale LTIB using the following commands:

./install

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BSP

Do not interrupt the installation process.

7. Execute the cd /unixopt/sdk1.0/QorIQ-DPAA-SDK-20110609-

systembuilder command.

8. Create a PDK project for P4080DS using the following command:

./scripts/create-config.py --config-file=fsl-p4080ds/samplecreate-config.ini

9. Setup cross-compile environment using the source build_p4080ds_release/bitbake.rc

command.

10. Build Freescale P4080DS BSP images for building test using the bitbake devel-image

command.

7.2 BSP Source Code Package

7.2.1 De-Compose Source Code Package

Copy the COMX-P4080-2G-ENP2 released BSP source code package COMX_P4080_SRC_<Version Number>.tar.gz to the build host and un-compress it in current directory: tar xzvf COMX_P4080_SRC_<Version Number>.tar.gz

There will be a newly-created folder named P4080 which contains SCP-P4080-2G-ENP2 source code.

Table 7-1 BSP Source Code Package Layout

File/Directory Name Description

build.sh Top script for building all of BSP images for BSP release. It calls

Makefile to perform the operations.

clean.sh Top script for cleaning all of BSP images and temporary objects

for BSP release. It calls Makefile to perform the operations.

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Table 7-1 BSP Source Code Package Layout (continued)

File/Directory Name Description

linux/ linux/ directory contains Linux kernel, rootfs and rootfs building

scripts.

Makefile Top makefile for building/cleaning all of BSP images for BSP

release. It calls Makefiles and scripts located in sub-directories to perform the operations.

Makefile-p4080ds Top makefile for building/cleaning all of BSP images for P4080DS

BSP release. It calls Makefiles and scripts located in subdirectories to perform the operations.

misc/ misc/ contains FMAN uCode and RCW

u-boot/ U-Boot source code.

7.2.2 Setup Build Environment

BSP

1. If Freescale SDK1.0 is used as build tool, and the host linux is 32 bit, modify the Makefile

and set the environment variant PPC_TOOL_PATH as below:

SDK_INSTALL_PATH ?= /unixopt/sdk1.0/QorIQ-DPAA-SDK-20110609systembuilder PPC_TOOL_PATH ?= $(SDK_INSTALL_PATH)/freescale-

2010.09/bin:$(SDK_INSTALL_PATH)/build_p4080ds_release/sysroots/ i686-linux/usr/bin

The build tool is not verified with SDK1.0 at 64bit Linux host.

7.3 Build BSP Image

Output Directory

By default, the output directory for building BSP images is /local/tmp/.You need to create this directory and provide full privileges for all users to access. Use the following commands to create directory and provide privileges:

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BSP

sudo mkdir -p sudo chmod a+rwx /local/ /local/tmp/

Build a Release

To build a release, run the./build.sh <Version_Number> command.

The version number is formatted as VxxxAxx, VxxxBxx, VxxxTxx or VxxxRxx. For example: V100B00.

BSP Images

SCP-P4080-2G-ENP2 BSP images should be placed in /local/tmp/. It includes the COMX_P4080_<Version_Number>.tar.gz package:

The COMX_P4080_<Version_Number>.tar.gz package contains:

 comx.dtb: Device Tree Blob  fsl_fman_ucode_P3_P4_P5_101_8.bin: FMAN uCode  rcw.bin: RCW  rcw-codewarrior.bin: RCW used for codewarrior to burn image to NOR Flash  rootfs_ext2.img: RAMDISK image  rootfs_nfs.tar.gz: NFS rootfs  u-boot.bin (U-Boot)  uImage: Linux kernel image

7.3.1 Build U-Boot

The U-Boot is based on SDK1.0 whose version is U-Boot 2011.06-rc2.

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Commands

1. Build by default

 make uboot

2. Build Targets supported for UBoot

 uboot: configures and builds u-boot.bin for NOR flash  uboot-clean: cleans the u-boot

Output

The built image is u-boot.bin in the current working directory.

7.3.2 Build Linux Kernal

The Linux kernel is based on SDK1.0 whose version is 2.6.34.6.

BSP

Commands

1. Build by default

 make kernel dtb

2. Build Targets supported for Linux kernel

 config-default: copies the COMX-P4080 default configuration to current

configuration

 kernel-config: configures the kernel based on current configuration  kernel: compiles kernel with current configuration  kernel-clean: cleans the kernel  dtb: compiles device tree binary

Output

The build images are uImage and comx.dtb in the current working directory

7.3.3 Build ROOTFS

The rootfs for SCP-P4080-2G-ENP2 include RAMDISK and NFS.

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BSP

Commands

1. make rootfs: The output image is /local/tmp/<username>/rootfs_ext2.img

2. Build Targets supported for rootfs

 rootfs: builds rootfs  rootfs-ext2: builds rootfs for ram disk  rootfs-nfs: builds rootfs for nfs  rootfs-clean: clean the rootfs

Output

The build images are rootfs_ext2.img and rootfs_nfs.tar.gz in the current working directory.

7.3.4 Build Misc Firmware

Misc Firmware for SCP-P4080-2G-ENP2 includes FMAN uCode and RCW image:

 FMAN uCode is misc/fman_ucode/fsl_fman_ucode_P3_P4_P5_101_8.bin

 RCW image is misc/rcw/rcw.bin

Both images are binary files and need not to re-build. They are copied to release package while building.

7.4 Deploy BSP Image

This section explains how to deploy BSP images. Assuming that you have built a BSP release package COMX_P4080_V100B00.tar.gz by running ./build.sh V100B00 located at /local/ tmp/.

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7.4.1 Pre-deployment Steps

The following steps must be performed before deployment:

1. Connect the board to your network using a network cable to the SGMII Ethernet port.

2. Setup a TFTP server in this network. Assuming that the IP address of this server is

192.168.0.100 and the root directory is /tftpboot/.

3. Create a comx_p4080/ in /tftpboot/ subdirectory.

4. Copy the COMX_P4080_<Version_Number>.tar.gz file into the directory /tftpboot/

comx_p4080/ on TFTP server.

5. Change current directory to /tftpboot/comx_p4080/.

6. Unzip the .tar.gz file to the current directory. The following files are extracted to the

COMX_P4080_V100B00/:

 comx.dtb

BSP

 rcw.bin

 rcw-codewarrior.bin

 rootfs_ext2.img

 rootfs_nfs.tar.gz

 uImage

 fsl_fman_ucode_P3_P4_P5_101_8.bin

 u-boot.bin

7. Unzip the rootfs_nfs.tar.gz file to the /tftpboot/comx_p4080/ location using

the sudo tar xzvf COMX_P4080_V100B00/rootfs_nfs.tar.gz.

8. Add /tftpboot/comx_p4080/rootfs_nfs/ to NFS exports list in /etc/exports:

/tftpboot/comx_p4080/rootfs_nfs *(rw,sync,no_root_squash).

9. Restart NFS service to export /tftpboot/comx_p4080/rootfs_nfs/ using the

sudo /sbin/service nfs restart command.

10. The following commands should be executed in U-boot command line.

11. Setup the U-Boot environment variables for the network settings. Example:

=> setenv ethaddr 00:01:af:12:23:01

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BSP

=> setenv ipaddr 192.168.0.99 => setenv netmask 255.255.255.0 => setenv gatewayip 192.168.0.1 => setenv serverip 192.168.0.100 => setenv ethact FM1@DTSEC1

12. Setup the U-Boot environment variables for upgrade files. Example:

=> setenv rcwfile comx_p4080/COMX_P4080_V100B00/rcw.bin => setenv fmanfile comx_p4080/COMX_P4080_V100B00/fsl_fman_ucode_P3_P4_P5_101_8.bin => setenv bootfile comx_p4080/COMX_P4080_V100B00/uImage => setenv norfsfile comx_p4080/COMX_P4080_V100B00/rootfs_ext2.img => setenv fdtfile comx_p4080/COMX_P4080_V100B00/comx.dtb => setenv ubootfile comx_p4080/COMX_P4080_V100B00/u-boot.bin => setenv rootpath /tftpboot/comx_p4080/rootfs_nfs

13. Test that the network and filename settings can download the files successfully. Example:

=> tftpboot $loadaddr $rcwfile => tftpboot $loadaddr $fmanfile => tftpboot $loadaddr $bootfile => tftpboot $loadaddr $norfsfile => tftpboot $loadaddr $fdtfile => tftpboot $loadaddr $ubootfile

7.4.2 Deploying BSP Image on NOR FLASH

Following are the steps to delpoy BSP images on NOR FLASH:

1. Upgrade RCW, FMAN uCode, kernel, RAMDISK image, U-Boot and DTB on NOR FLASH

individually. Example:

=> run updrcw; run updfman; run updkernel; run updnorfs; run updfdt; run upduboot

2. Erase previous U-Boot environment settings using the => run eraenv command.

3. Reset the board using the => reset command. The board will boot up with new BSP

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7.5 RAMBOOT

Run run ramboot in U-Boot. ramboot will load RAMDISK, Linux kernel and DTB into RAM via network by TFTP and then boot.

7.6 NORBOOT

Run run norboot in U-Boot. norboot will load RAMDISK, Linux kernel and DTB from NOR FLASH into RAM and then boot. For details, please refer to SCP-P4080-2G-ENP2 User Manual.

7.7 NFSBOOT

Run run nfsboot in U-Boot. nfsboot will load Linux kernel and DTB into RAM via network by TFTP and then boot. And then mounting NFS on remote server as rootfs. For details, please refer to SCP-P4080-2G-ENP2 User Manual.

BSP

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