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COMX-P4080-2G-ENP2
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Artesyn COMX-P4080-2G-ENP2 Installation

COMX-P4080-2G-ENP2

Installation and Use
P/N: 6806800P63B August 2014
©
Copyright 2014 Artesyn Embedded Technologies, Inc.
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Notice
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Germany

Contents

Contents
About this Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Safety Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
1.2 Standard Compliances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
1.3 Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
1.4 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
1.5 Product Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
2 Hardware Preparation and Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2.1 Environmental and Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2.2 Unpacking and Inspecting the Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.3 Installing and Removing the Module on the Carrier Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3 Controls, LEDs, and Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.1 Connectors and Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.1.1 On-board Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.2 On-board LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.1 Processor Core and Cache Memory Complex . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
4.2 Integrated Memory Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
4.3 Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
4.4 Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
4.5 NOR FLASH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
4.6 NAND Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
4.7 HSSI or SERDES Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
4.8 Thermal Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
4.9 Main Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
4.9.1 Memory Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
4.10 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
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4.11 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
4.12 SDHC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
4.13 SPI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
4.14 LAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
4.14.1 MDIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
4.14.2 PHY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
4.15 UART INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
4.16 RTC & WDT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
4.17 USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
4.17.1 Four USB Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
4.18 I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
4.18.1 I2C Device Thermal Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
4.18.2 I2C Device EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
4.18.3 I2C Device WDT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
4.18.4 I2C Device RTC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
4.18.5 I2C Device Clock Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
4.18.6 I2C Device USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
5 Clock Structure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
6 On-Boards Power Domains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
6.1 Power Controlling Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
7 BSP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
7.1 BSP Build Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
7.1.1 Installing Build Tool on SDK1.0. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
7.2 BSP Source Code Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
7.2.1 De-Compose Source Code Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
7.2.2 Setup Build Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
7.3 Build BSP Image . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
7.3.1 Build U-Boot. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
7.3.2 Build Linux Kernal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
7.3.3 Build ROOTFS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
7.3.4 Build Misc Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
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7.4 Deploy BSP Image . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
7.4.1 Pre-deployment Steps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
7.4.2 Deploying BSP Image on NOR FLASH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
7.5 RAMBOOT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
7.6 NORBOOT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
7.7 NFSBOOT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
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Table 1-1 Standard Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 1-2 PCB Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 2-1 Environmental Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 2-2 Critical Temperature Spots . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 2-3 Power Requirement (with solder-down memory chips) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 3-1 JTAG connector Pin-out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 3-2 LED and statements of the system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 4-1 NOR FLASH Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 4-2 NAND FLASH Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 4-3 Options of the SERDES routed to COM Express Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 4-4 Memory Capacities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Table 4-5 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Table 4-6 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table 4-7 SD or Micro SD card on the Carrier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 4-8 Real Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 4-9 WDT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 4-10 USB PHY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 4-11 USB HUB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 4-12 I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Table 5-1 Configuration of the frequency of SERDES reference clock by GPIO . . . . . . . . . . . . . . . . . . . 56
Table 7-1 BSP Source Code Package Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
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Figure 1-1 Declaration of Conformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 1-2 COMX-P4080-2G-ENP2 Mechanical Dimensions (Top and side views) . . . . . . . . . . 22
Figure 1-3 Location of Product Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 4-1 COMX-P4080-2G-ENP2 Function Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 4-2 Distribution of Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 4-3 Distribution of SERDES Lanes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 4-4 Board Thermal Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 4-5 Memory Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 4-6 Distribution of GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Figure 4-7 Distribution of SPI Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 4-8 Distribution of I2C buses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Figure 5-1 Clock Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Figure 6-1 Power Tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Figure 6-2 Power Sequence of COMX-P4080-2G-ENP2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
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COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)

About this Manual

Overview of Contents

This manual is divided into the following chapters and appendices.
Chapter 1, Introduction, on page 19 provides an overview of the product's features
Chapter 2, Hardware Preparation and Installation, on page 25 provides instructions for
installing and removing the module
Chapter 3, Controls, LEDs, and Connectors, on page 31 provides informations on the pin
assignments on the various connectors on the board
Chapter 4, Functional Description, on page 33 describes the functions of the various
components on the board
Chapter 5, Clock Structure, on page 55 describes the clock distribution in the COMX-P4080-
2GENP2. and the setup utility used to configure the product.
Chapter 6, On-Boards Power Domains, on page 57 describes the power supply system for the
module
Chapter 7, BSP, on page 59 describe how to build COMX-P4080-2G-ENP2 Basic Support
Package (BSP) and deploy the built images on COMX-P4080-2G-ENP2.

Abbreviations

This document uses the following abbreviations:
Abbreviation Definition
A/D A/D
ANSI American National Standard Institute
ASIC Application Specific Integrated Circuit
ATX Advanced Technology Extended
Aurora Debug protocol for high speed SerDes
BGA Ball Grid Array
BLT Block Transfer
COM Computer on Module
COMX Emerson marketing identifier for COM Express
COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)
11
About this Manual
Abbreviation Definition
COP Common On-chip Processor
COTS Commercial-Off-the-Shelf
CPU Central Processing Unit
CRC Cyclic Redundancy Check
DDR Double Data Rate
DLL Delay-Locked Loop
DMA Direct Memory Access
DRAM Dynamic Random Access Memory
DUART Dual Universal Asynchronous Receiver/Transmitter
ECC Error Correction Code
EEPROM Electrically Erasable Programmable Read-Only Memory
EPROM Erasable Programmable Read-Only Memory
About this Manual
12
FCC Federal Communications Commission
FEC Fast Ethernet Controller
FIFO First In First Out
F/W Firmware
FPBGA Flip Chip Plastic Ball Grid Array
GB GigaBytes
Gbit Gigabit
Gbps Gigabits Per Second
GPI General Purpose Input
GPIO General Purpose Input Output
GPO General Purpose Output
GMII Gigabit Media Independent Interface
GPR General Purpose Register
H/W Hardware
ID Identification
I/O Input/Output
COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)
About this Manual
Abbreviation Definition
IEEE Institute of Electrical and Electronics Engineers
I2C Inter IC
JTAG Joint Test Access Group
KB KiloBytes
KBAUD Kilo Baud
LBC Local Bus Controller
LED Light Emitting Diode
MB MegaBytes
Mbit Megabit
Mbps Megabits Per Second
MDIO Management Data Input/Output
MHz Megahertz
OS Operating System
PCB Printed Circuit Board
PCI Peripheral Component Interconnect
PCIe Peripheral Component Interconnect Express
PIC Programmable Interrupt Controller
RAM Random Access Memory
RCW Root Configuration Word
ROM Read-Only Memory
RTC Real-Time Clock
RTM Rear Transition Module
SATA Serial Advanced Technology Attachment
SDRAM Synchronous Dynamic Random Access Memory
SGMII Serial Gigabit Media Independent Interface
SMT Surface Mount Technology
SPD Serial Presence Detect
SRAM Static Random Access Memory
COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)
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About this Manual
Abbreviation Definition
SRIO Serial RapidIO
S/W Software
TDP Thermal Design Power
UART Universal Asynchronous Receiver Transmitter
ULPI UTMI+ Low Pin Interface
USB Universal Serial Bus
V_BAT Battery-supplied Voltage
VIO Input/Output Voltage
VPD Vital Product Data
WDT Watchdog Timer
XAUI 4-Lane 10GbE Interface According to IEEE802.3ak
About this Manual

Conventions

The following table describes the conventions used throughout this manual.
Notation Description
0x00000000 Typical notation for hexadecimal numbers (digits are
0b0000 Same for binary numbers (digits are 0 and 1)
bold Used to emphasize a word Screen Used for on-screen output and code related elements
Courier + Bold Used to characterize user input and to separate it
Reference Used for references and for table and figure
File > Exit Notation for selecting a submenu
<text> Notation for variables and keys
14
0 through F), for example used for addresses and offsets
or commands in body text
from system output
descriptions
COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)
About this Manual
Notation Description
[text] Notation for software buttons to click on the screen
and parameter description
... Repeated item for example node 1, node 2, ..., node
12
.
.
.
.. Ranges, for example: 0..4 means one of the integers
| Logical OR.
Omission of information from example/command that is not necessary at the time being.
0,1,2,3, and 4 (used in registers).
Indicates a hazardous situation which, if not avoided, could result in death or serious injury.
Indicates a hazardous situation which, if not avoided, may result in minor or moderate injury
Indicates a property damage message.
No danger encountered. Pay attention to important information.
COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)
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About this Manual

Summary of Changes

This manual has been revised and replaces all prior editions.
Part Number Publication Date Description
6806800P63A August 2012 Initial Version
6806800P63B August 2014 Re-branded to Artesyn template.
About this Manual
16
COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)

Safety Notes

This section provides warnings that precede potentially dangerous procedures throughout this manual. Instructions contained in the warnings must be followed during all phases of operation, service, and repair of this equipment.You should also employ all other safety precautions necessary for the operation of the equipment in your operating environment. Failure to comply with these precautions or with specific warnings elsewhere in this manual could result in personal injury or damage to the equipment.
Artesyn intends to provide all necessary information to install and handle the product in this manual. Because of the complexity of this product and its various uses, we do not guarantee that the given information is complete. If you need additional information, ask your Artesyn representative.
The product has been designed to meet the standard industrial safety requirements. It must only be used in its specific area of office telecommunication industry and industrial control. Only personnel trained by Artesyn or persons qualified in electronics or electrical engineering are authorized to install, remove or maintain the product.
The information given in this manual is meant to complete the knowledge of a specialist and must not be used as replacement for qualified personnel. Keep away from live circuits inside the equipment. Operating personnel must not remove equipment covers. Only factory authorized service personnel or other qualified service personnel is allowed to remove equipment covers for internal subassembly or component replacement or any internal adjustment.
Do not install substitute parts or perform any unauthorized modification of the equipment or the warranty may be voided. Contact your local Artesyn representative for service and repair to make sure that all safety features are maintained.
COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)
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Safety Notes
18
COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)

Introduction

The COMX-P4080-2G-ENP2 is a COM Express module based on the Freescale Power PC P4080 platform.This board provides some of the universal interfaces such as Gigabit Ethernet, USB, PCIE, and so on.

1.1 Features

Following are the features of the COMX-P4080-2G-ENP2:
Form Factor: Basic (95mm x 125mm) Bullet list 2
P4080 CPU supported
Boot Options:
– 16 bits width NOR flash from local bus (standard product default)
– NAND flash from local bus
Chapter 1
– I2C EEPROM
Selectable via carrier.
Operating System:
– Linux
– VxWorks
VxWorks is only a plan rather than requirement Supported CPU: P4080.
(P4080) dual channel laid down DDR3, 1GB per channel, ECC (with option to populate only
one channel (top) at 2GB)
(P4080) 16 lanes of SERDES routed to COME connectors, which can be configured as PCIE,
XAUI, SRIO, SGMII
COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)
19
Introduction
4 UARTs or 2 DUARTs
(P4080) 0/1/2 GE ports (option available to use this port as USB)
(P4080) 5/4/0 USB ports
1588 signals output to the COME connectors
Total 3 I2C buses
1 SPI bus with 3 chip select signals
Connected from the SDHC pins to COME connectors
Connected from the tamper detect pins to COME connectors
8 GPI and 8 GPO to COME connectors
On-board RTC and WDT device
Provide both remote and local thermal sensor
JTAG connector on module
Aurora testing points on module
On-board regulators supply required voltages to devices on the module
12V and 5V standby power supplied to module from ATX-type (or other type) power
supply through COME connectors

1.2 Standard Compliances

This product meets the following standards:
Table 1-1 Standard Compliance
Standard Description
UL60950-1 EN 60950-1 IEC 60950-1 CAN/CSA C22.2 No 60950-1
CISPR 22 CISPR 24 EN55022 EN 55024
ENTSI EN 300 019 Series Environmental Requirement
20
Safety Requirements
EMC Requirements on system level
COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)
Table 1-1 Standard Compliance (continued)
Standard Description
Directive 2011/65/EU Directive on the restriction of the use of certain
hazardous substances in electrical and electronic equipment (ROHS)
Figure 1-1 Declaration of Conformity
E
C Declaration of Conformity
According to EN 17050-1:2004
Manufacturer’s Name:
Manufacturer’s Address:
Declares that the following product, in accordance with the requirements of 2004/108/EC, 2006/95/EC, 2011/65/EU and their amending directives,
Product:
Model Name/Number:
Artesyn Embedded Technologies Embedded Computing
Zhongshan General Carton Box Factory Co. Ltd. No 62, Qi Guan Road West, Shiqi District, 528400 Zhongshan City Guangdong, PRC
Ruggedized and extended temperature COM Express modules with Freescale QorIQ™ processing power
SCP-P4040-4G-ENP2, COMX-P4080-2G-ENP2
Introduction
has been designed and manufactured to the following specifications:
EN55022: 2010 Class B
EN55024: 2010
IEC 60950-1: 2005 (2nd Edition) + A1:2009
2011/65/EU RoHS Directive
As manufacturer we hereby declare that the product named above has been designed to comply with the rele­vant sections of the above referenced specifications. This product complies with the essential health and safety requirements of the above specified directives. We have an internal production control system that ensures compliance between the manufactured products and the technical documentation.
___________________________________________________ ___
Tom Tuttle, Manager, Product Testing Services Date (MM/DD/YYYY)
COMX-P4080-2G-ENP2 Installation and Use (6806800P63B)
08/12/2014
______
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