Intel® is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.
Java™ and all other Java-based marks are trademarks or registered trademarks of Oracle America, Inc. in the U.S. and other countries.
Microsoft®, Windows® and Windows Me® are registered trademarks of Microsoft Corporation; and Windows XP™ is a trademark of
Microsoft Corporation.
PICMG®, CompactPCI®, AdvancedTCA™ and the PICMG, CompactPCI and AdvancedTCA logos are registered trademarks of the PCI
Industrial Computer Manufacturers Group.
UNIX® is a registered trademark of The Open Group in the United States and other countries.
Notice
While reasonable efforts have been made to assure the accuracy of this document, Artesyn assumes no liability resulting from any
omissions in this document, or from the use of the information obtained therein. Artesyn reserves the right to revise this document
and to make changes from time to time in the content hereof without obligation of Artesyn to notify any person of such revision or
changes.
Electronic versions of this material may be read online, downloaded for personal use, or referenced in another document as a URL to
an Artesyn website. The text itself may not be published commercially in print or electronic form, edited, translated, or otherwise
altered without the permission of Artesyn.
It is possible that this publication may contain reference to or information about Artesyn products (machines and programs),
programming, or services that are not available in your country. Such references or information must not be construed to mean that
Artesyn intends to announce such Artesyn products, programming, or services in your country.
Limited and Restricted Rights Legend
If the documentation contained herein is supplied, directly or indirectly, to the U.S. Government, the following notice shall apply
unless otherwise agreed to in writing by Artesyn.
Use, duplication, or disclosure by the Government is subject to restrictions as set forth in subparagraph (b)(3) of the Rights in
Technical Data clause at DFARS 252.227-7013 (Nov. 1995) and of the Rights in Noncommercial Computer Software and
Documentation clause at DFARS 252.227-7014 (Jun. 1995).
COMX-CORE Series Installation and Use (6806800K11F)
13
Page 14
About this Manual
AbbreviationDefinition
eDPEmbedded Display Port
GPIGeneral Purpose Input
GPIOGeneral Purpose Input Output
GPOGeneral Purpose Output
HDAIntel® High Definition Audio Link
HDMIHigh-Definition Multimedia Interface
I2CInter-Integrated Circuit
LPCLow Pin-Count
LVDSLow Voltage Differential Signaling
PCIPeripheral Component Interface
PCIePeripheral Component Interface Express
PHYEthernet controller physical layer device
About this Manual
14
SPDSerial Presence Detect - refers to serial EEPROM on DRAMs that has
DRAM module configuration information
S0, S1, S2, S3, S4, S5System states describing the power and activity level
S0 - Full power
S1 S2 - all devices powered
S3 - Suspend to RAM; System context stored in RAM; RAM is
on standby
S4 - Suspend to Disk; System context stored on disk
S5 - Soft Off; Main power rail is off; only the standby power rail
is present
SATASerial AT Attachment
SDVOSerialized Digital Video Output
VGAVideo Graphics Adapter
WDTWatchdog Timer
COMX-CORE Series Installation and Use (6806800K11F)
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Conventions
The following table describes the conventions used throughout this manual.
NotationDescription
0x00000000Typical notation for hexadecimal numbers (digits are
0b0000Same for binary numbers (digits are 0 and 1)
boldUsed to emphasize a word
ScreenUsed for on-screen output and code related elements
Courier + BoldUsed to characterize user input and to separate it
ReferenceUsed for references and for table and figure
About this Manual
0 through F), for example used for addresses and
offsets
or commands in body text
from system output
descriptions
File > ExitNotation for selecting a submenu
<text>Notation for variables and keys
[text]Notation for software buttons to click on the screen
...Repeated item for example node 1, node 2, ..., node
.
.
.
..Ranges, for example: 0..4 means one of the integers
|Logical OR
COMX-CORE Series Installation and Use (6806800K11F)
and parameter description
12
Omission of information from example/command
that is not necessary at the time being
0,1,2,3, and 4 (used in registers)
15
Page 16
About this Manual
NotationDescription
About this Manual
Indicates a hazardous situation which, if not avoided,
could result in death or serious injury
Indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury
Indicates a property damage message
No danger encountered. Pay attention to important
information
Summary of Changes
This manual has been revised and replaces all prior editions.
Part NumberPublication DateDescription
6806800K11FAugust 2014Re-branded to Artesyn template.
6806800K11EJanuary 2013Updated Standard Compliances on page 20.
6806800K11DJune 2010Updated COM Express Connector Pin Definition on
6806800K11CMarch 2010GA version
6806800K11BFebruary 2010Revised EA version
6806800K11AFebruary 2010EA version
16
Added Declaration of Conformity on page20.
page 51.
COMX-CORE Series Installation and Use (6806800K11F)
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Introduction
1.1Features
COMX-CORE Series is a COM Express module based on the Intel Calpella platform (Arrandale
ECC processor plus Ibex Peak-M). COM Express is an industry-standard embedded computer
module defined by PICMG.
COMX-CORE Series provides the following interfaces: VGA interface, dual-channels LVDS
display interface, 3x Digital Display interfaces, 4x SATA-II, 1x GbE interface, 8 x1 PCI Express,
16x PEG, 8x USB 2.0, 1x HDA interface,; 1x SM bus, and 1x SPI interface. This module also
provides up to 8 GB DDR3 Non-ECC 1066 MHz onboard memory, a 4 GB USB flash that is used
to store the OS, boot applications, and provides two 4Mb SPI flash.
The following tables summarize the features of COMX-CORE-312/512 (ECC) and COMX-CORE510/710/750 (non-ECC)
Table 1-1 COMX-CORE-312/512 (ECC) Features Summary
VideoSupports Low Voltage Differential Signaling (LVDS)
Supports Video Graphics Adapter (VGA)
Supports High-Definition Multimedia Interface
Supports up to two display ports
AudioIbex Peak-M supports HDA. The signals are routed to the
COM-E connector. The audio CODEC should be on the
carrier board.
EthernetOptional 1x 10/100/1000Base-T GbE port based on
WG82577LM routed to the COM Express connector
USBEight USB2.0 ports routed to the COM Express connector
PCI Express Supports up to eight PCI Express ports routed to the
COM Express connector
Serial ATAFour SATA 3.0 Gbps ports routed to the COM Express
connector
LPCLPC bus routed to the COM Express connector
2
SMBusI
COMX-CORE Series Installation and Use (6806800K11F)
C compatible SMBus is routed to the COM Express
connector
(HDMI)
19
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Introduction
Table 1-2 COMX-CORE-510/710/750 (non-ECC) Features Summary (continued)
FunctionFeatures
XDP60-pin XDP header for CPU debug.
1.2Standard Compliances
This product meets the following standards:
Table 1-3 Standard Compliances
Standard Description
IPC-1752-1 Class 4Environmental reporting requirements
EN 300 019-2-2, Class 2.3 equipmentETSI public transportation requirements
EN 300 019-2-1, Class 1.2 equipmentETSI storage requirements
UL/CSA 60950-1
EN 60950-1
IEC 60950-1 CB Scheme
FCC 47 CFR Part 15 Subpart B (US),
Class B
EN55022 Class B (EU)
AS/NZS CISPR 22 Class B
VCCI Class B (Japan)
Legal safety requirements
EMC requirements (legal) on system level (predefined
Artesyn system)
20
COMX-CORE Series Installation and Use (6806800K11F)
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Figure 1-1COMX-CORE Series Declaration of Conformity
E
C Declaration of Conformity
According to EN 17050-1:2004
Introduction
Manufacturer’s Name:
Manufacturer’s Address:
Declares that the following product, in accordance with the requirements of 2004/108/EC, 2006/95/EC, 2011/65/EU and their amending directives,
Product:
Model Name/Number:
has been designed and manufactured to the following specifications:
EN55022:2006 (A1: 2007) Class B
EN55024: 1998 (A1: 2001 + A2: 2003)
EN 61000-3-2: 2006
EN 61000-3-3: 2008
IEC 60950-1: 2005 (2nd Edition) + (A1: 2009)
2011/65/EU RoHS Directive
As manufacturer wehereby declare that the product named above has been designed to complywith the rele-vant sections of the above referenced specifications. This product complieswith the essential health and safetyrequirements of the above specified directives. We have an internal production control system that ensures compliance between the manufactured products and the technical documentation.
Artesyn Embedded TechnologiesEmbedded Computing
Zhongshan General Carton Box Factory Co. Ltd. No 62, QiGuan Road West, Shiqi District, 528400 Zhongshan CityGuangdong, PRC
COMX-CORE Series Installation and Use (6806800K11F)
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1.4.1Supported Board Models
As of the printing date of this manual, this guide supports the board models listed below.
Table 1-5 Available Board Variants
Order NumberDescription
COMX-CORE-710CORE I7-620UE 1.06GHZ 18W ULV COM Module Type 6
COMX-CORE-750CORE I7-620LE 2.0 GHZ 25W ULV COM Module Type 6
COMX-CORE-510CORE I5-520E 2.4GHZ COM Module Type 6
COMX-CORE-512CORE I5-520E 2.4GHZ ECC COM Module Type 6
COMX-CORE-312Type 6 COM Express module P4505 Celeron with ECC
1.4.2Board Accessories
Introduction
As of the printing date of this manual, the following board accessories are available.
Table 1-6 Available Board Accessories
Order NumberDescription
COMX-CORE-HTSNK COMX-CORE active fansink
COMX-CORE-HPCOMX-CORE heatspreader
COMX-CORE Series Installation and Use (6806800K11F)
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Introduction
1.5Board Identification
This section shows the serial number and its location on the board.
Figure 1-9Serial Number location
28
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Hardware Preparation and Installation
2.1Environmental and Power Requirements
2.1.1Environmental Requirements
You must make sure that the board, when operated in your particular system configuration,
meets the environmental requirements specified below.
Operating temperatures refer to the temperature of the air circulating around the board and
not to the component temperature.
Chapter 2
Product Damage
High humidity and condensation on surfaces cause short circuits.
Do not operate the system outside the specified environmental limits. Make sure the
product is completely dry and there is no moisture on any surface before applying power.
Table 2-1 Environmental Requirements
RequirementOperatingNon-Operating
Cooling MethodForced-Air
Temp Cycle Class-40°C–85°C:500cyc
Temperature0°C–55°C-40 °C - 85 °C
Humidity10 -90% Non-condensing-
Vibration0.01g ^2/Hz at 5-500 Hz
Random Vibration
Shock20 g 11 ms sine or saw-
Altitude-60–4000 m ASL
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
2.1.2Thermal Requirements
The maximum cooler inlet air temperature is 55°C for operation at the maximum operating
temperature limit of 55°C. The location for cooler inlet air temperature measurement is
illustrated in the figure below.
Figure 2-1Cooler (Side View)
30
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Figure 2-2Cooler (Top View)
Hardware Preparation and Installation
If a heat spreader solution is used, the temperature at point M on its top surface should be kept
below a certain temperature for reliable operation of CPU and chipset, this temperature is 70°C
for CPU with TDP of 35W, 80°C for CPU with TDP of 25W and 87°C for CPU with TDP of 18W.
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Hardware Preparation and Installation
The location of point M is illustrated in below figure.
Figure 2-3Heat spreader (Point M)
32
If only one memory is needed, Artesyn recommends to install it on the top side of the COMXCORE Series module, otherwise, please remove the thermal pad for memory cooling from the
cooler (or heat spreader) to avoid shedding during vibration.
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
If a memory is placed at the bottom, the system should provide at least 1.0m/s air flow into the
gap between COMX-CORE Series and the carrier board (illustrated in the figure below) to keep
the surface temperature of the memory within 95 °C, otherwise, the function of this memory
is not guaranteed.
Figure 2-4Air Requirement to Cool Bottom Side Memory
To keep the optimized cooling capability, it is not recommended to remove a used cooler (or
heat spreader) from one COMX-CORE Series module and install it on another module without
replacing thermal pads with new ones.
The following table summarizes components that exhibit significant temperature rises and
their maximum allowable operating temperature. These components should be monitored in
order to assess thermal performance.
Table 2-2 Critical Temperature Spots for COMX-CORE Series
COMX-CORE Series Installation and Use (6806800K11F)
(W)
Maximum Allowable
Temperature (°C)
GMCH: 100 (Tj)
33
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Hardware Preparation and Installation
Contact your Artesyn sales representative for current information on the detailed thermal
information including airflow and resistance of the COMX-CORE Series.
System Overheating
Cooling Vents
Improper cooling can lead to system damage and can void the manufacturer's warranty.
To ensure proper cooling and undisturbed airflow through the system do not obstruct the
ventilation openings of the system. Make sure that the fresh air supply is not mixed with hot
exhaust from other devices.
Personal Injury
During operation, hot surfaces may be present on the heat sinks and the components of the
product.
To prevent injury from hot surface do not touch any of the exposed components or
heatsinks on the product when handing. Use the handle and face plate, where applicable, or
the board edge when removing the product from the enclosure.
2.1.3Power Requirements
The COMX-CORE Series COM-E module boards are designed to operate with input voltages
and current as described in the following tables.
Important Note: The test environment is based on the COMX-CORE module cooperating with
COMX-CAR-610 carrier board, so the power distribution for the +12V and 5VSTB includes the
COMX-CORE module and COMX-CAR-610 carrier board.
Table 2-3 COMX-CORE-710 Power Requirement (with 2x 2GB non-ECC memory)
State+12V5VSTBVCC_RTC
G3 (AC off)00.106uA
Idle (CMOS Setup)1.800.970
34
COMX-CORE Series Installation and Use (6806800K11F)
Table 2-6 COMX-CORE-512 Power Requirement (with 2x 2GB ECC memory)
State+12V5VSTBVCC_RTC
G3 (AC off)00.086uA
Idle (CMOS Setup)2.510.950
Idle (Windows XP Pro)0.750.960
Full Loading (while
running burn in test)
COMX-CORE Series Installation and Use (6806800K11F)
2.500.970
35
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Hardware Preparation and Installation
Table 2-7 COMX-CORE-312 Power Requirement (with 2x 2GB ECC memory)
State+12V5VSTBVCC_RTC
G3 (AC off)00.096uA
Idle (CMOS Setup)1.970.950
Idle (Windows XP Pro)0.860.950
Full Loading (while
running burn in test)
2.150.990
2.2Board Thermal Management and Placement
2.2.1Board Thermal Management
COMX-CORE Series provides the following thermal management strategy. The Arrandale+ECC
processor Platform Environment Control Interface (PECI) can take the corresponding action to
the protect system during catastrophic overheating.
Figure 2-5Board Thermal Management Diagram
36
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Hardware Preparation and Installation
The PECI is a one-wire interface that provides a communication channel between a PECI client
(the processor) and a PECI master (the PCH).
The processor digital thermal sensor (DTS) provides an improved capability to monitor device
hot spots, which inherently leads to more varying temperature readings over short time
intervals.
Within the processor, the DTS converts an analog signal into a digital value representing the
temperature relative to PROCHOT# circuit activation. Processor digital thermal sensor controls
processor temperature by modulating (starting and stopping) the processor core clocks when
the processor silicon reaches its maximum operating temperature. A pin "PROCHOT#" is used
in this mode, when PROCHOT# is output and active, it indicate that processor thermal control
circuit is activated. When the PROCHOT# is input from ISL62882, it indicate the VRM
temperature is out of specified value, the processor TTC is activated.
When the CPU junction temperature is more than 125C, CPU will assert the THERMTRIP#.
Signal stop all bus activity and the core power must be shut down in the specified time.
2.3Unpacking and Inspecting the Module
Damage of Circuits
Electrostatic discharge and incorrect installation and removal of the product can damage
circuits or shorten their life.
Before touching the product make sure that your are working in an ESD-safe environment
or wear an ESD wrist strap or ESD shoes. Hold the product by its edges and do not touch any
components or circuits.
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
Shipment Inspection
1. Verify that you have received all items of your shipment:
Printed Quick Start Guide and Safety Notes
COMX-CORE Series COM Express module
Drivers CD
2. Check for damage and report any damage or differences to customer service.
3. Remove the desiccant bag shipped together with the product.
Environmental Damage
Improperly disposing of used products may harm the environment.
Always dispose of used products according to your country’s legislation and manufacturer’s
instructions.
2.4Preparing the Installation Environment
Before you install or replace components, pay attention to the following:
Wear an ESD-preventive wrist strap to prevent the static electricity from damaging the
device.
Keep the area where the components reside clean and keep the components away from
heat-generating devices, such as radiator.
Ensure that your sleeves are tightened or rolled up above the elbow. For safety purposes,
it is not recommended to wear jewelry, watch, glasses with metal frame, or clothes with
metal buttons.
Do not exert too much force, or insert or remove the components forcibly. Avoid damage
to the components or plug-ins.
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Hardware Preparation and Installation
Confirm the feasibility of the operation
There are available spare parts of the components to be installed or replaced in the
equipment warehouse. When the available spare parts are lacking, contact Artesyn
Embedded Technologies for help in time. For details on how to get help from Artesyn
Embedded Technologies, visit http://www.artesyn.com/computing/.
Make sure that the new components are in good condition, without defects such as
oxidation, chemical corrosion, missing components, or transportation damage.
By reading this document, you are familiar with how to install and replace the component
and master the skills required by the operation.
Check the environment
Make sure that the power supply, temperature, and humidity meet the operating
requirements for the board and its components. For details, refer to the respective system
documentation.
Prepare the parts and the tools
Prepare the components to be installed or replaced.
When you hold or transport the components, use the special antistatic package. Prepare
the cross screwdriver, screws, plastic supports, cooling gel, and ESD-preventive wrist
strap.
Confirm installation or changing position
Confirm the position where COMX-CORE Series will be installed.
If a serious problem occurs and cannot be solved when you install or replace the
component, contact Artesyn Embedded Technologies for technical support.
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
2.5Memory Module Installation and Removal
There are two 204-pin SODIMM slots onthe COMX-CORE Series. One slot is located on the top
of the module with a height of 6.5 mm. Another is located at the bottom of the module with a
height of 4.0 mm. COMX-CORE Series supports up to 8 GB DDR3 SODIMM memory at
800 MHz or 1066 MHz.
Pin Damage
Forcing the module into the system may damage connector pins.
If the module hangs during insertion, pull it out and insert it again.
Installing a Memory Module
1. Wear the ESD-preventive wrist strap.
2. Lay the module where the SODIMM is to be installed on the antistatic desktop.
3. Take the SODIMM out of the antistatic package, holding it by the edges.
4. Line up the notch located on the row of the metal pins at the bottom of the module
with the key in the SODIMM slot on the motherboard.
5. Insert the SODIMM in a slantwise position or at a 45-degree angle to slide the
module into place.
40
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Hardware Preparation and Installation
6. Press down on the module against the motherboard until you hear it snap into
place. The modules must be properly aligned before you press it down into its final
position. You can remove the module from the socket and reinstall it if you cannot
press it down into its final position.
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
Removing a Memory Module
1. Wear the ESD-preventive wrist strap.
2. Release the module from the slot by pushing the spring latches on either side of the
module outward.
3. Lift the module from the motherboard.
Damage of the Product and Additional Devices and Modules
Incorrect installation or removal of additional devices or modules damages the product or
the additional devices or modules.
Before installing or removing additional devices or modules, read the respective
documentation and use appropriate tools.
2.6eUSB Flash Disk Installation and Removal
COMX-CORE Series supports a low profile USB flash module with up to 4 GB capacity. The
module can store the operating system and application software to allow for starting up
without a hard disk drive.
42
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Hardware Preparation and Installation
Installing the eUSB Flash Disk
1. Align and insert the connector of the eUSB Flash to the connector on the COMXCORE Series module.
2. Use a M3 x 6 mm screw (0.45 N·m of torque is recommended) to fasten the eUSB
Flash module to the standoff.
Removing the eUSB Flash Disk from the Module
1. Un-tighten and remove the screws of the eUSB Flash disk from the standoff.
2. While holding the edges, pull the eUSB Flash disk from the COM Express module.
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
2.7Heat Spreader/Cooler Installation and Removal
Installing the Heat Spreader/Cooler
1. Check the thermal interface material pads on the heat spreader/cooler. Make sure
the pads are aligned to their corresponding components on the COMX-CORE Series
module.
2. Align the standoffs of the heat spreader/cooler with the screw holes on the COMXCORE Series module.
3. Hold the heat spreader/cooler and the COMX-CORE Series module together and
turn them over.
4. Attach the heat spreader/cooler to the COMX-CORE Series module by using the
standoffs (male/female type).
0.45 N·m of torque is recommended
44
Do not use standoffs A and B if there are no corresponding holes on the carrier board to avoid
interference with the carrier board components. You can use two M2.5 screws which are
provided along with the heat spreader/cooler instead of the A and B standoffs for mounting.
When screwing the standoffs, first screw down all of them until their caps are just in contact
with the COMX-CORE Series module then screw them all the way down.
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
Figure 2-6Assembled Heat Spreader and COMX-CORE Series Module
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
Figure 2-7Assembled Cooler and COMX-CORE Series Module
Removing the Heat Spreader/Cooler from the Module
1. Loosen the standoffs of the heat spreader /cooler from the COMX-CORE Series
module.
2. While holding the edges, pull the heat spreader/cooler from the COMX-CORE
Series module.
2.8Module Installation and Removal with Carrier
Board
The assembled COM Express module with the attached heat spreader is attached to a carrier
board.
46
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Hardware Preparation and Installation
Installing the COM Express Module on the Carrier Board
1. Line up the board-to-board connector of the COMX-CORE Series module with the
board-to-board connector of the carrier board.
2. Make sure that the interconnectors are properly aligned and that the seven
standoffs have contact with the top of the carrier board.
3. Turn over the COMX-CORE Series module and the carrier board.
4. From the backside of the carrier board, locate the screw holes.
5. Use the screws to fasten the COMX-CORE Series module assembly to the carrier
board.
Removing the COM Express Module from the Carrier Board
1. Turn over the COMX-CORE Series module and the carrier board.
2. From the backside of the carrier board, locate the seven screws that connect the
COMX-CORE Series module to the carrier board.
3. Loosen and remove the screws.
4. While holding the edges, pull the COMX-CORE Series module from the carrier
board.
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Hardware Preparation and Installation
48
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Controls, LEDs, and Connectors
3.1Board Layout
Figure 3-1COMX-CORE Series Module Components
Chapter 3
COMX-CORE Series Installation and Use (6806800K11F)
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Controls, LEDs, and Connectors
Figure 3-2COMX-CORE Series Module Components (Rear View)
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Controls, LEDs, and Connectors
3.2Connectors and Switches
3.2.1COM Express Connector
COMX-CORE Series supports Type 6 COM Express connectors. COM ExpressCOM Express Type
6 adds DDI and USB3.0 interfaces but removes the PCI interface.
The COMX-CORE Series supports a low profile USB flash module. The module can store the
operating system and application software to allow for starting up without a hard disk drive.
The USB flash module uses USB port 9 for its interface. The module uses a 2 x 5 header with a
2.0 mm pitch. The header pin definition is as follows:
Figure 3-3eUSB Flash Header Pin Definition
56
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3.2.3DIP Switch Setting
The COMX-CORE Series includes two DIPs on-board:
DIP1 for PEG Bifurcation configuration
–High: PEG works in x16 mode
–Low: PEG works in 2 x8 mode
DIP2 controls the PCIE 4th port direction status (see Ethernet Interfaces on page 74)
3.3On-board LEDs
The following table describes the LEDs on the COMX-CORE Series:
Table 3-2 On-board LEDs
Controls, LEDs, and Connectors
LEDColorSignal
D5RedCATERR (when the system crash)
D11GreenPlatform Reset (chipset is working succesfully)
D12RedCPU power good (CPU power good is deasserting)
D13RedProchot_N(when Prochot_N is asserting)
D14RedThrmtrip_N(when Thrmtrip_N is asserting)
D15GreenSystem Power OK(when system Power OK is asserting)
COMX-CORE Series Installation and Use (6806800K11F)
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Controls, LEDs, and Connectors
Figure 3-4On-board LED Pin-out
58
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Functional Description
4.1Block Diagram
Figure 4-1COMX-CORE Series Block Diagram
Chapter 4
COMX-CORE Series Installation and Use (6806800K11F)
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Functional Description
4.2Processor
COMX-CORE Series supports Intel’s Arrandale processor. The processor provides the following
features:
Arrandale+ ECC Dual Core Processor
Dual die (CPU/GMCH): MCP Multi-Chip Package processor with size: 34 mm x 28 mm,
manufactured on 32 nm process
256 KB integrated/dedicated L2 cache for each core
3-4 MB Integrated L3 cache (shared between cores)
Core frequency:
–COMX-CORE-312 1.86 GHz (P4505)
–COMX-CORE-512/510 2.4 GHz (i5-520E)
–COMX-CORE-750 2.0 GHz (i7-620LE)
–COMX-CORE-710 1.06GHz (i7-620UE)
Integrated memory controller (dual 64-bit channels) supports SODIMM DDR3 with the
transfer rates of 800 MT/s or 1066 MT/s, supports for up to 8 GB of memory (dual-channel
mode)
PCI Express Graphic 16x based on 2nd generation, PCIE Link Widths: 1x16, 2x8, 2x4, 2x2,
2x1
DMIx4, 2nd Generation (DMI2)
Flexible display interface
APIC and MSI/MSI-X Message Signaled Interrupt support
Integrated graphics controller
Platform Environment Control Interface (PECI) support
Thermal management support
JTAG support
In-Target Probe (ITP/XDP) support
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4.3Chipset
COMX-CORE Series uses Intel’s Ibex Peak I/O Hub. Ibex Peak provides extensive I/O support.
The table below display the features of QM57 and HM55:
Table 4-1 PCH Intel 5 serial Mobiles SKUs QM57 and HM55
Feature SetQM57HM55
PCI-E2.0 Ports
USB 2.0 Ports
SATA Ports
HDMI/DVI/VGA/SDVO/DisplayPortYesYes
LV DSYe sYe s
Graphics Support with PAVP 1.5YesYes
FIS Based Port Multiplier SupportYesNo
3
Functional Description
1
2
86
1412
64
Intel® Rapid Storage
Technology
Intel® AMT 6.0YesNo
Intel® Remote PC Assist Technology
for Business
1. PCIe* ports 7 and 8 are disabled
2. USB ports 6 and 7 are disabled
3. SATA ports 2 and 3 are disabled
AHCIYesYes
Raid
0/1/5/10
Support
4.4Clock Generator
COMX-CORE Series has a CK505 clock generator (ICS9LPRS365) to provide clocks for various
components.
COMX-CORE Series Installation and Use (6806800K11F)
YesN o
YesN o
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Functional Description
4.5System Memory
The Arrandale ECC processor integrates a dual-channel 72-bit ECC DDR3 controller. The pinout
of DDR3 SODIMM ECC is different with DDR3 SODIMM non-ECC memory. COMX-CORE Series
cannot support ECC and non ECC memory modules at the same time.
There are two 204-pin SODIMM slots onCOMX-CORE Series. One slot is located on the top of
the module with a height of 6.5 mm. Another is located at the bottom of the module with a
height of 4.0 mm.
COMX-CORE Series supports the following:
COMX-CORE-510/710/750 (non-ECC) - Two DDR3 800/1066 64-bit SO-DIMM sockets.
Maximum memory capacity is 8GB non-ECC memory
COMX-CORE-312/512 (ECC) - Supports two DDR3 800/1066 64-bit SO-DIMM sockets.
Maximum capacity is 8 GB ECC memory.
4.6SMBus Interface and Devices
There are three SMBus interfaces on Ibex Peak-M. The following devices connect to the SMBus:
The SPD of two DDR3 non ECC SODIMM
CK505M clock chip
8 KB COM Express serial EEPROM for vendor information
LM96080 voltage measurement device
SMbus interface routes to COM Express connector
PCA9557 for GPIO application
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Connect to PHY WG82577LM
Processor XDP interface
Figure 4-2SMBus Devices Connection Diagram
Functional Description
Table 4-2 SMBus Device Address
DeviceSPD0SPD1CK505MMPCA9557AT24C02LM96080
Address0xA00xA20xD20x300xA80x500xC8
COMX-CORE Series Installation and Use (6806800K11F)
WG8257
7LM
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Functional Description
To avoid SMbus address conflicts between SODIMM SPD and AT24C02, pin A2 of AT24C02
should be "1".
4.7Video
4.7.1VGA and LVDS
A separate VGA and LVDS route to the COM Express connector from Ibex Peak-M. The VGA
support resolution is 1600 x 1200 or higher. The VGA signals are routed to the COM Express
connector directly.
The Intel Low Voltage Differential Signaling (LVDS) transmitter serializer converts up to 24 bits
of parallel digital RGB data (8 bits per pixel) and dual-channel, along with up to 4 bits for control
(SHFCLK, HSYNC, VSYNC, DE) into two channels (Channel A and Channel B). LVDS signals are
routed to COM Express connector directly.
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Table 4-3 Enabling the LVDS Signal
PortEnable StrapHow to enable Port?COMX-CORE Series Status
LVDSL_DDC_DATAPull up to 3.3 V with 2.2-k Pull up
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4.7.2Digital Display Interfaces
Digital Display Interfaces (DDI) are provided by Ibex Peak-M. All the digital display interfaces on
the PCH platforms have strap signals associated with them. The port strap needs to be set to
configure each digital port irrespective of the digital display technology HDMI/DVI/DP/SDVO.
The table below lists all the digital display straps and guidelines to enable/disable a respective
port on the platform. All the straps are sampled on the rising edge of the PWROK signal. The
signal will be pulled up on the carrier board.
1.The DDI different display configurations should be realized on the carrier board
2.The different configurations of DDI need BIOS support.
Table 4-4 Digital Display Ports Enable and Disable Guidelines
Functional Description
COMX-CORE Series
Port EnableHow to Enable Port?
Port BSDVO_CTRLDATAPull up to 3.3 V with 2.2-k Pull up
Port CDDPC_CTRLDATAPull up to 3.3 V with 2.2-k Pull up
Port DDDPD_CTRLDATAPull up to 3.3 V with 2.2-k Pull up
Status
COMX-CORE Series Installation and Use (6806800K11F)
The 16x PCI Express Graphics (PEG) is routed to the COM Express connector. The PEG
architecture supports four types of topologies: two for device down and two for add-in card.
The Arrandale ECC processor provides the function that multiplexes the embedded Display
Port (eDP) with the PCIe graphics signal. CFG4, CFG3, CFG0 are the strap signals. PCH GPIO48
is set as the input signal for external PEG x16 to enable configuration.
Table 4-6 PEG Strap Signals
PortStrapHow to Strap Port?
COMX-CORE Series
Status
eDP enable CFG[4] Pull down to GND (Internal Pull Up)Optional pull up or Pull
down
PEG Reversal CFG[3]Pull down to GND (Internal Pull Up)Input from COM Express
conn, optional pull up or
Pull down
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4.8PCI Express Port
COMX-CORE Series has eight x1 PCI Express ports. The 4th PCIe port is multiplexed with
WG82577LM and the COM Express connector. The eight PCIe ports are routed to the COM
Express connector. The ports support a transmission rate of 2.5 Gb.
Figure 4-3PCI Express Ports Connection Diagram
Functional Description
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Functional Description
PCIE 1-3 can be used as PCIE x1 slot on carrier board.
PCIE 4 is muxed with WG82577LM and COM-E connector for Carrier board, DIP define the
PCIE 4 direction status. If the user wants to use PCIE-4 as x1 slot on carrier board, it needs the
software support.
PCIE 5-8 can be used as PCIE x4 slot on carrier board. If user want to use as x1 slot on carrier
board, it needs the software support
4.9SATA Interface
Four SATA II ports are routed to the COM Express connector from Ibex Peak-M. The PCH SATA
interfaces support data transfer rates of up to 3 Gbps (300 MBps) per port.
Figure 4-4SATA Ports Diagram for COMX-CORE-510/710/750 (non-ECC)
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Figure 4-5SATA Ports Diagram for COMX-CORE-312/512 (ECC)
Functional Description
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Functional Description
4.10USB Interface
The Ibex Peak-M supports up to 14 USB 2.0 ports. There are eight USB 2.0 ports routed to the
COM Express connector from the carrier board, and the 9th port is used for the eUSB flash. The
routing diagrams are as follow:
Figure 4-6USB Ports Diagram for COMX-CORE-510/710/750 (non-ECC)
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Figure 4-7USB Ports Diagram for COMX-CORE-312/512 (ECC)
Functional Description
4.11USB Flash Solid State Drive
COMX-CORE Series supports a low profile USB flash module with up to 4 GB capacity. The
module can store the operating system and application software to allow for starting up
without a hard disk drive. USB port 9 is used as the interface.
Refer to USB Flash Connector on page 56 for connector and header information.
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Functional Description
4.12Ethernet Interfaces
The COMX-CORE Series provides a 10/100/1000Base-T GbE port based on WG82577LM that
connects to the COM Express connector. The clock is provided by the Ibex Peak-M's different
clock port CLKOUT_PEG_B. There are two types of power supply requirements for
WG82577LM: 3.3 V and 1.05 V. The fourth PCIe port is multiplexed with Intel WG82577LM
PHY and the COM Express connector. The PCIe multiplex direction is controlled by GPIO36.
Figure 4-8DIP Multiplexed for PCIE direction Status
Figure 4-9PCI-E Multiplexed Direction Status
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Figure 4-10WG82577LM Connection Diagram
Functional Description
4.13LPC Interface
The Low Pin Count (LPC) interface is routed to the connector and connects to the Super I/O,
Trusted Platform Module (TPM), and the Firmware Hub (FWH) on the carrier board. The LPC
clock with 33 MHz, which routes to the COM Express connector, can be used for Super I/O.
4.14TPM
COMX-CORE-312/512 (ECC) supports an Infineon TPM1.2 chip on board. The Infineon SLB
9635 TT 1.2 Trusted Platform Module (TPM) provides computer manufacturers with the core
components of a subsystem used to assure authenticity, integrity and confidentiality in ecommerce transactions and Internet communications.
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Functional Description
4.15SPI Interface
COMX-CORE Series uses SPI flash as a boot device. On COM Express Type 6, the SPI bus routes
to the COM Express connector. There is also a SPI BIOS on the carrier board, so the
BIOS_DISABLE# signal from the carrier board is used. If you want to use the FWH on the carrier
board, you must have a jumper on the carrier board switched to the BIOS source through the
carrier board.
Table 4-8 SPI Multiplex Direction Status
BIOS_DISABLE0/1_NBoot from ModuleBoot from Carrier Board
1OK---
0---OK
Figure 4-11SPI Interface Diagram
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4.16Watchdog Timer
COMX-CORE Series implements the watchdog timer feature by W83627UHG chip on the
carrier board.
4.17Hardware Monitor
4.17.1Voltage Monitor
COMX-CORE Series's power supply is from the COM Express connector, which is different from
the carrier board's power plane. LM96080 will monitor the voltages on COMX-CORE Series:
CPU_VCORE, VCC_GFXCORE, VTT1_05, VCC1_05, DDR1V5, VCC3, VCC5.
4.17.2Temperature
Functional Description
COMX-CORE Series uses W83627UHG to monitor the system temperature.
4.17.3Fan Monitor and Control
COMX-CORE Series uses W83627UHG to monitor the system fan speed and the module fan
speed.
4.18Audio
Ibex Peak-M supports a high definition audio interface. The audio CODEC should be on the
carrier board. The signals of HDA are routed to the COM Express connector directly.
4.19Power Management
COMX-CORE Series supports ACPI S0, S3, S4 and S5.
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Functional Description
4.20Real-time Clock (RTC)
COMX-CORE Series supports a battery-backed real-time clock. The chipset Ibex Peak-M
contains a Motorola MC146818A-compatible real-time clock with 256 bytes of batterybacked RAM. The real-time clock performs two key functions: keeping track of the time of day
and storing system data, even when the system is powered down. The RTC operates on a
32.768 KHz crystal and a 3 V battery.
The RTC also supports two lockable memory ranges. By setting bits in the configuration space,
two 8-byte ranges can be locked to read and write accesses. This prevents unauthorized
reading of passwords or other system security information.
The RTC also supports a data alarm that allows for scheduling a wake up event up to 30 days in
advance, rather than just 24 hours in advance.
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BIOS
5.1POST
After power-up or reset, the BIOS performs a self-test, POST, that attempts to determine if
further operation is possible and that the detected configuration is expected. This process can
complete normally or result in a warning or an error. The boot process does not stop after a
warning but displays a message on the primary display device. If an error is detected, the boot
process is halted. If possible, a message will be displayed but failures early on in the test can
only be indicated in POST codes.
The POST process display depends on the Quiet Boot option.
Viewing all checkpoints generated by Aptio firmware requires a checkpoint card, which is
also named "POST Card" or "POST Diagnostic Card". They are PCI or LPC add-in cards that
show the value of I/O port 80h on a LED display. These cards are available at the electronic
or computer market around the world.
Chapter 5
5.2Boot Process
While performing the functions of the traditional BIOS, Aptio 4.x core follows the firmware
model described by the Intel Platform Innovation Framework for EFI ("the Framework"). The
framework is associated to the following "boot phases", which can be described by various state
code.
Driver Execution Environment (DXE) - main hardware initialization2
Boot Device Selection (BDS) - system setup, pre-OS user interface & selecting a bootable
device (CD/DVD, HDD, USB, Network, Shell, etc.)
5.3Initiating Setup
During the boot, pressing the 'F2' key on the keyboard requests the Setup utility be launched
once the self-test is complete and before searching for a boot device. See the Setup description
later in this document to describe the operation of this utility. If you exit Setup without saving
any changes, the boot process continues with the search for a boot device. If the changes are
saved, the motherboard loads the new settings and resets - re-starting the entire boot process.
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BIOS
5.4Setup Utility
The BIOS incorporates a Setup utility that allows the user to alter a variety of system options.
This section describes the operation of the utility by describing the various options available
through a set of hierarchical menus. Not all options are available with all products and some
depend on BIOS customizations.
The current settings are stored in the SPI FLASH NVRAM area and any changes can be copied
back to this area via the Exit menu. The operation of the BIOS defaults is described later in this
document.
To start the utility, you must press the F2 key during the early stages of POST after power-up.
Note that this functionality operates with PS/2 keyboards, USB keyboards when enabled, and
via the console redirection facility when enabled.
The table below briefly describes the primary menus, most of which have sub-menus. The
following sections describe the menus in detail.
80
Table 5-1 BIOS Primary Menu
MenuOptions
MainBIOS information and date and time
AdvancedAdvanced features including ACPI, CPU, IDE, USB, HW monitoring
and Serial Port settings
ChipsetFeatures including Host Bridge and Southbridge
BootBoot mode and Boot options
SecurityAdministrator's password
Save & ExitSave with or without changes, Load/save default settings and Boot
Device Selection
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BIOS
The Aptio navigation can be accomplished using a combination of the keys. These keys include
the <FUNCTION> keys, <ENTER>, <ESC>, <ARROW> keys, and so on.
Table 5-2 Aptio Navigation
KeyDescription
ENTERThe Enter key allows the user to select an option to edit its value or
access a sub menu.
Left/RightThe Left and Right <Arrow> keys allow you to select a screen.
Up/DownThe Up and Down <Arrow> keys allow you to select an item or sub-
screen.
+- Plus/MinusThe Plus and Minus <Arrow> keys allow you to change the field value
of a particular setup item.
TabThe <Tab> key allows you to select fields.
ESCThe <Esc> key allows you to discard any changes you have made and
exit the Aptio Setup.
When you are in sub-menu, <Esc> allows you to exit to the upper
menu.
Function keysWhen other function keys become available, they are displayed at
the right of the screen along with their intended function.
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BIOS
5.4.1Main Menu
Figure 5-1Main Menu
82
Table 5-3 Main Menu Field Description
FieldDescription
BIOS VendorBIOS vendor name
Core VersionAptio core version
Project VersionProject name and its version
Build DateBIOS build date
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Table 5-3 Main Menu Field Description (continued)
FieldDescription
System DateSets the time and date (month/day/year format). To change these values,
System Time
go to each field and enter the desired value. Press the tab key to move
from hour to minute to second, or from month to day to year. There is no
default value.
Table 5-4 Platform Information
FieldDescription
Processor TypeCPU manufacturer brand
EMT64Extended memory 64 technology
Processor SpeedCPU current frequency
Processor SteppingCPU chip version
Processor CoreCPU core number
BIOS
Hyper-ThreadingHyper-Threading technology
IGD VBIOS VersionIntegrated Graphic Drive Video BIOS version
QPI FrequencyQuick Path Interconnect frequency
Total MemoryAll memory size
Memory Slot1Slot1 memory size
Memory Slot2Slot2 memory size
PCH VersionChipset version
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BIOS
5.4.2Advanced Menu
Figure 5-2Advanced Menu
84
Table 5-5 Advanced Menu Field Description
FieldDescription
PCI Subsystem SettingsPCI Configuration Parameters, see PCI Subsystem Settings
ACPI SettingsSystem ACPI Parameters, see ACPI Settings
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Table 5-5 Advanced Menu Field Description (continued)
FieldDescription
Trusted ComputingTrusted Computing Module for security purpose, see Trusted
Computing
S5 RTC Wake SettingsEnables system to wake from S5 using RTC alarm, see S5 RTC Wake
Settings
CPU ConfigurationCPU Configuration Parameters, see CPU Configuration
ME ConfigurationSee ME Configurations
Thermal ConfigurationSee Thermal Configuration
Port 80hPort 80h PEIM, see Port 80h
USB ConfigurationUSB Configuration Parameters, see USB Configuration
AMT ConfigurationAMT Configuration, see AMT Configuration
LM80 H/W MonitorMonitor hardware, see LM80 Hardware Monitor
BIOS
Super IO ConfigurationSystem Super IO chip Parameters, see Super IO Configuration
W83627UHG H/W
Monitor
Serial Port Console
Redirection
Monitor hardware, see W83627UHG Hardware Monitor
Serial Port Console Redirection, see Serial Port Console Redirection
Table 5-6 PCI Subsystem Settings
FieldDescription
PCI ROM PriorityIn case of multiple Option ROMs (Legacy and EFI Compatible),
specifies what PCI Option rom to launch.
Default is EFI Compatible ROMs
PCI Latency TimerValue to be programmed into PCI Latency Timer Register.
Default is 32 PCI Bus Clocks
Table 5-7 ACPI Settings
FieldDescription
Enable ACPI Auto
Configuration
Enables or Disables BIOS ACPI Auto Configuration.
Default is Disabled.
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BIOS
Table 5-7 ACPI Settings (continued)
FieldDescription
ACPI Sleep StateSelect the highest ACPI sleep state the system will enter, when the
SUSPEND button is pressed.
States: Suspend Disabled,S1(CPU Stop Clock) and S3 (Suspend to
RAM).
Default is S3(Suspend to RAM).
S3 Video RepostIf enabled, Video Option ROM will be dispatched during S3 resume.
Default is Disabled.
Table 5-8 Trusted Computing
FieldDescription
TPM SUPPORTEnables or Disables TPM function.
Default is Disabled.
When the item is disabled in BIOS, OS will not show TPM.
TPM StateTurns the TPM On/Off.
Changing the TPM state needs a computer restart.
Default is Disabled.
Pending TPM operationSchedule TPM operation
Default is none.
Current TPM Status Information
NO TPM HardwareIf no TPM is found
TPM Enabled Status:Shows TPM status: Enabled or Disabled
TPM Active Status:Shows current state of the TPM: Activated or Deactivated
TPM Owner Status:Shows current TPM Ownership state. ie: Owned or UnOwned
Table 5-9 S5 RTC Wake Settings
FieldDescription
Wake system with Fixed
Time
Wake up hourSelect 0-23.
Enable or disable System wake on alarm event
When enabled, system will wake on the hr::min::sec specified.
Default is Disabled
Example: enter 3 for 3am and 15 for 3pm
Default is 0
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Table 5-9 S5 RTC Wake Settings (continued)
FieldDescription
Wake up minute0 - 59
Default is 0
Wake up second0 - 59
Default is 0
BIOS
Wake System with
Dynamic Time
Wake up minute increaseRange 1 - 5
Enable or disable System wake on alarm event.
When enabled, the system will wake on current time + Increase
minute(s).
Default is Disabled.
Table 5-10 CPU Configuration
FieldDescription
Power & PerformancePower & Performance options
Hyper-ThreadingEnabled for Windows XP and Linux (OS optimized for Hyper-
Threading Technology) and Disabled for other OS (OS not optimized
for Hyper-Threading Technology).
Default is Enabled.
Active Processor CoresNumber of cores to enable for each processor package
Default is All
Intel VirtualizationWhen enabled, a VMM can utilize the additional hardware capabilities
provided by Vanderpool Technology
Intel Trusted Execution
Technology
Enables utilization of additional hardware capabilities provided by
Intel Trusted Execution Technology. Changes require a full power
cycle to take effect.
Default is Disable
Table 5-11 ME Configurations
FieldDescription
ME FW VersionME Firmware Version
ME FirmwareME FW SKU
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BIOS
Table 5-12 Thermal Configuration
FieldDescription
CPU Thermal ConfigurationCPU thermal configuration, see CPU Thermal Configuration
Table 5-13 CPU Thermal Configuration
FieldDescription
TM1Enable/Disable Thermal Monitor1; Default is Enabled
TM2Enable/Disable Thermal Monitor2; Default is Enabled
ACPI 3.0 T-StatesEnable/Disable ACPI 3.0 T-States ;Default is Disabled
Table 5-14 Port 80h
FieldDescription
Port 80h RedirectionControl where the Port 80h cycles are sent: PCI bus, LPC bus
Default is LPC bus
Table 5-15 USB Configuration
FieldDescription
USB DevicesList the USB Devices attached.
Legacy USB SupportEnables Legacy USB support. AUTO option disables legacy support if
no USB devices are connected. DISABLE option will keep USB devices
available only for EFI applications.
Default is Enabled.
Device Reset TimeoutUSB mass storage device Start Unit command timeout
Items: 10 sec,20 sec,30 sec,40 sec
Default is 20 sec.
Table 5-16 AMT Configuration
FieldDescription
Intel AMTEnable/Disable Intel Active Management Technology BIOS Extension
Default is Enabled.
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Table 5-16 AMT Configuration (continued)
FieldDescription
Intel AMT Setup PromptEnable/Disable Intel AMT Setup Prompt to wait for hot-key to enter
setup.
Default is Enabled.
ASFEnable/Disable Alert Standard Format.
Default is Enabled.
Un-Configure MEUn-Configure ME without password.
Default is Disabled.
Hide Un-Configure MEHide Un-Configure ME without password confirmation prompt.
Default is Disabled.
Table 5-17 LM80 Hardware Monitor
FieldDescription
BIOS
CPU_VCOREMonitor the core voltage of CPU
VCC_GFXCOREMonitor the core voltage of GFX
VTT1_05Monitor VTT 1.05V
VCC1_05Monitor VCC 1.05V
DDR1V5Monitor 1.5V for DDR3 RAM
VCC3Monitor VCC 3.3V on Module board
VCC5Monitor VCC 5.0V on Module board
Table 5-18 Super IO Configuration
FieldDescription
Super IO Chip Usually Winbond W83627UHG
Serial Port 1 ConfigurationSet Parameters of Serial Port 1 (COMA), see Serial Port
1/2/3/4/5/6 Configuration
Serial Port 2 ConfigurationSet Parameters of Serial Port 2 (COMB), see Serial Port
1/2/3/4/5/6 Configuration
Serial Port 3 ConfigurationSet Parameters of Serial Port 3 (COMC), see Serial Port
1/2/3/4/5/6 Configuration
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BIOS
Table 5-18 Super IO Configuration (continued)
FieldDescription
Serial Port 4 ConfigurationSet Parameters of Serial Port 4 (COMD), see Serial Port
1/2/3/4/5/6 Configuration
Serial Port 5 ConfigurationSet Parameters of Serial Port 5 (COME), see Serial Port
1/2/3/4/5/6 Configuration
Serial Port 6 ConfigurationSet Parameters of Serial Port 6 (COMF), see Serial Port
1/2/3/4/5/6 Configuration
Parallel Port ConfigurationSet Parameters of Parallel Port (LPT/LPTE), see Serial Port
1/2/3/4/5/6 Configuration
Watchdog Timer ConfigurationSet parameters of Watchdog Timer (WDT), see Watchdog Timer
Configuration
Intrusion DetectSelect state for Intrusion Detect
Default is Disabled
Table 5-19 Serial Port 1/2/3/4/5/6 Configuration
FieldDescription
Serial Port Enable/Disable Serial Port
Default is Enabled
Device SettingsCurrent settings: IO=3F8; IRQ=4;
Change Settings Select an optimal setting for Super IO Device
Options:
Auto
IO=3F8h; IRQ=4;
IO=3F8h; IRQ=3,4,5,6,7,10,11,12;
IO=2F8h; IRQ=3,4,5,6,7,10,11,12;
IO=3E8h; IRQ=3,4,5,6,7,10,11,12;
IO=2E8h; IRQ=3,4,5,6,7,10,11,12;
Default is Auto.
1. IO address shall be assigned responding to various Serial Ports. For example, IO=2F8; IRQ=3 for COMB, IO=3E8;
IRQ=7 for COMC, IO=2E8; IRQ=7 for COMD, IO=2E0; IRQ=10 for COME, IO=2F0; IRQ=10 for COMF.
1
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Table 5-20 Parallel Port Configuration
FieldDescription
Parallel Port Enable/Disable Parallel Port (LPT/LPTE)
Default is Enabled
Change Settings Select an optimal setting for Super IO Device
Items:
Auto
IO=378h; IRQ=5;
IO=378h; IRQ=5,6,7,10,11,12;
IO=278h; IRQ=5,6,7,10,11,12;
IO=3BCh; IRQ=5,6,7,10,11,12;
IO=378h;
IO=278h;
IO=3BCh;
Default is Auto.
Device ModeChange the Printer Port mode
Items:
STD Printer Mode
SPP Mode
EPP-1.9 and SPP Mode
EPP-1.7 and SPP Mode
ECP Mode
ECP and EPP 1.9 Mode
ECP and EPP 1.7 Mode
BIOS
Table 5-21 Watchdog Timer Configuration
FieldDescription
Watchdog TimerSelect an optimal Watchdog Timer setting (WDT)
Default is Disabled
Table 5-22 W83627UHG Hardware Monitor
FieldDescription
Module TemperatureModule temperature
Module Fan SpeedModule fan speed
System TemperatureSystem temperature
System Fan Speed System fan speed
COMX-CORE Series Installation and Use (6806800K11F)
Enable/Disable console redirection
Default is Disabled
See COM 1/2 Console Redirection Settings
Enable/Disable console redirection for OBM/EMS usage
Default is Disabled
Table 5-24 COM 1/2 Console Redirection Settings
FieldDescription
Terminal TypeEmulation:
ANSI: Extended ASCII char set.
VT100: ASCII char set.
VT100+: Extends VT100 to support color, functional keys, etc.
VT-UTF8: Uses UTF8 encoding to map unicode chars onto 1 or more
bytes.
Default is VT100.
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Table 5-24 COM 1/2 Console Redirection Settings (continued)
FieldDescription
Bits per secondSelects serial port transmission speed
The speed must be matched on the other side. Long or noisy lines may
require lower speeds.
Options: 9600, 19200, 57600, 115200.
Default is 115200.
Data BitsData Bits
Items: 7,8
Default is 8
ParityA parity bit can be sent with the data bits to detect some transmission
errors.
Even: parity bit is 0 if the num of 1's in the data bits is even.
Odd: parity bit is 0 if num of 1's in the data bits is odd.
Mark: parity bit is always 1.
Space: Parity bit is always 0.
Mark and space parity do not allow for error detection. They can be
used as an additional data bit.
Options: None, Even, Odd, Mark, Space
Default is None
BIOS
Stop BitsStop bits indicate the end of a serial data packet. (A start bit indicates
the beginning). The standard setting is 1 stop bit. Communication with
slow devices may require more than 1 stop bit. Options: 1, 2.
Default is 1.
Flow ControlFlow control can prevent data loss from buffer overflow. When sending
data, if the receiving buffers are full, a 'stop' signal can be sent to stop
the data flow. Once the buffers are empty, a 'start' signal can be sent to
restart the flow. Hardware flow control uses two wires to send
start/stop signals. Software flow control uses start/stop ASCII chars,
which slows down the data flow and can be problematic if binary data
is being sent. Options: None, Hardware RTS/CTS. Default is None.
Resolution 100x31Enable or disable extended terminal resolution.
Default is Disabled.
Legacy OS RedirectionOptions: 80x25, 80x24. Default is 80x24.
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5.4.3Chipset Menu
Figure 5-3Chipset Menu
94
Table 5-25 Chipset Menu Description
FieldDescription
North Bridge ConfigurationNorth Bridge Parameters, see North Bridge Configuration
South Bridge ConfigurationSouth Bridge Parameters, see South Bridge Configuration
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Table 5-26 North Bridge Configuration
FieldDescription
BIOS
Common Northbridge
Control
Arrandale_ClarkdaleArrandale options, See Arrandale_Clarkdale
Arrandale_Clarkdale
MRC/QPI
Primary DisplaySelect which of IGD/PEG graphics device should be primary display
Control various common Northbridge functions, See Common
Northbridge Control
Arrandale MRC options, See Arrandale_Clarkdale MRC/QPI
Options: Auto, IGD, PEG
Default is Auto
Table 5-27 Common Northbridge Control
FieldDescription
PEG Port ConfigurationPEG Port options, see PEG Port Configuration
VT-dCheck to enable VT-d function on MCH
Default is Disabled
Table 5-28 PEG Port Configuration
FieldDescription
Always Enable PEGenables the PEG slot
Default is Disabled
Force X1Force PEG link to retrain to X1 mode
Default is Disabled
Table 5-29 Arrandale_Clarkdale
FieldDescription
IGD-LCD ControlSee IGD - LCD Control
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Table 5-30 IGD - LCD Control
FieldDescription
DVMT Pre-AllocatedSelect DVMT 5.0 Pre-allocated (fixed) graphics memory size used by
the Internal Graphics Device.
Options: 32M, 64M, 128M.
Default is 32M.
DVMT Total Gfx MemSelect DVMT5.0 total graphic memory size used by the Internal
Graphics Device. Options: 128M, 256M, MAX.
Default is 256M.
IGD - Boot TypeSelect the video device which will be activated during POST. This has
no effect if external graphics is present.
Options: VBIOS Default, CRT, LVDS, CRT + LVDS, HDMI, CRT + HDMI,
DP1, DP2
Default is CRT + LVDS.
LCD Panel TypeSelect LCD panel with an appropriate setting. Options: