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COMX-CORE Series
Installation and Use
P/N: 6806800K11F
August 2014
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©
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Contact Address
Artesyn Embedded Technologies Artesyn Embedded Technologies
Marketing Communications
2900 S. Diablo Way, Suite 190
Tempe, Arizona 85282
Lilienthalstr. 17-19
85579 Neubiberg/Munich
Germany
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Contents
About this Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
1.2 Standard Compliances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
1.3 Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
1.3.1 COMX-CORE Series Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
1.3.2 Heat Spreader Mechanical Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
1.3.3 Cooler Mechanical Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
1.4 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
1.4.1 Supported Board Models. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
1.4.2 Board Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
1.5 Board Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2 Hardware Preparation and Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
2.1 Environmental and Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
2.1.1 Environmental Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
2.1.2 Thermal Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2.1.3 Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
2.2 Board Thermal Management and Placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
2.2.1 Board Thermal Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
2.3 Unpacking and Inspecting the Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
2.4 Preparing the Installation Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
2.5 Memory Module Installation and Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
2.6 eUSB Flash Disk Installation and Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
2.7 Heat Spreader/Cooler Installation and Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
2.8 Module Installation and Removal with Carrier Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
3 Controls, LEDs, and Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
3.1 Board Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
3.2 Connectors and Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
3.2.1 COM Express Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
3.2.2 USB Flash Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
3.2.3 DIP Switch Setting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
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3.3 On-board LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
4.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
4.2 Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
4.3 Chipset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
4.4 Clock Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
4.5 System Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
4.6 SMBus Interface and Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
4.7 Video . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
4.7.1 VGA and LVDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
4.7.2 Digital Display Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
4.7.3 PEG and eDP Compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
4.8 PCI Express Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
4.9 SATA Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
4.10 USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
4.11 USB Flash Solid State Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
4.12 Ethernet Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
4.13 LPC Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
4.14 TPM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
4.15 SPI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
4.16 Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
4.17 Hardware Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
4.17.1 Voltage Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
4.17.2 Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
4.17.3 Fan Monitor and Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
4.18 Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
4.19 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
4.20 Real-time Clock (RTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
5 BIOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
5.1 POST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
5.2 Boot Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
5.3 Initiating Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
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5.4 Setup Utility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
5.4.1 Main Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
5.4.2 Advanced Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
5.4.3 Chipset Menu. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
5.4.4 Boot Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
5.4.4.1 Quiet Boot Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .101
5.4.5 Security Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
5.4.6 Save and Exit Menu. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
5.5 ACPI Wake Up Support Matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
5.6 Default Boot Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
5.7 POST Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
5.7.1 Status Code Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
5.7.2 Standard Status Codes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
5.7.2.1 SEC Status Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105
5.7.2.2 PEI Status Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
5.7.2.3 PEI Beep Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
5.7.2.4 DXE Status Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
5.7.2.5 DXE Beep Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
5.7.2.6 CPU Exception Status Codess . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
5.7.2.7 ASL Status Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
5.7.2.8 OEM-reserved Status Code Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
6 Operating System and Driver Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117
6.1 Supported Operating Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117
6.2 Supported Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
A Related Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .119
A.1 Artesyn Embedded Technologies - Embedded Computing Documentation . . . . . . . . . . . . . . . 119
Safety Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .121
Sicherheitshinweise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
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Table 1-1 COMX-CORE-312/512 (ECC) Features Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 1-2 COMX-CORE-510/710/750 (non-ECC) Features Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 1-3 Standard Compliances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 1-4 Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 1-5 Available Board Variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 1-6 Available Board Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 2-1 Environmental Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 2-2 Critical Temperature Spots for COMX-CORE Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 2-3 COMX-CORE-710 Power Requirement (with 2x 2GB non-ECC memory) . . . . . . . . . . . . . . . 34
Table 2-4 COMX-CORE-510 Power Requirement (with 2x 2GB non-ECC memory) . . . . . . . . . . . . . . . 35
Table 2-5 COMX-CORE-750Power Requirement (with 2x 2GB non-ECC memory) . . . . . . . . . . . . . . . . 35
Table 2-6 COMX-CORE-512 Power Requirement (with 2x 2GB ECC memory) . . . . . . . . . . . . . . . . . . . 35
Table 2-7 COMX-CORE-312 Power Requirement (with 2x 2GB ECC memory) . . . . . . . . . . . . . . . . . . . 36
Table 3-1 COM Express Connector Pin Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Table 3-2 On-board LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Table 4-1 PCH Intel 5 serial Mobiles SKUs QM57 and HM55 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Table 4-2 SMBus Device Address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Table 4-3 Enabling the LVDS Signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Table 4-4 Digital Display Ports Enable and Disable Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Table 4-5 Configuration Pin Mapping for DDI Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 4-6 PEG Strap Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Table 4-7 Embedded Display Port Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Table 4-8 SPI Multiplex Direction Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Table 5-1 BIOS Primary Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Table 5-2 Aptio Navigation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 5-3 Main Menu Field Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Table 5-4 Platform Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Table 5-5 Advanced Menu Field Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Table 5-6 PCI Subsystem Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Table 5-7 ACPI Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Table 5-8 Trusted Computing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Table 5-9 S5 RTC Wake Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Table 5-10 CPU Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Table 5-11 ME Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Table 5-12 Thermal Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Table 5-13 CPU Thermal Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
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List of Tables
Table 5-14 Port 80h . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Table 5-15 USB Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Table 5-16 AMT Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Table 5-17 LM80 Hardware Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Table 5-18 Super IO Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Table 5-19 Serial Port 1/2/3/4/5/6 Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Table 5-20 Parallel Port Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Table 5-21 Watchdog Timer Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Table 5-22 W83627UHG Hardware Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Table 5-23 Serial Port Console Redirection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Table 5-24 COM 1/2 Console Redirection Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Table 5-25 Chipset Menu Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Table 5-26 North Bridge Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Table 5-27 Common Northbridge Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Table 5-28 PEG Port Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Table 5-29 Arrandale_Clarkdale . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Table 5-30 IGD - LCD Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96
Table 5-31 Arrandale_Clarkdale MRC/QPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .97
Table 5-32 South Bridge Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Table 5-33 IbexPeak Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Table 5-34 USB Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Table 5-35 SATA Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Table 5-36 Software Feature Mask Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Table 5-37 Boot Menu Field Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100
Table 5-38 Security Menu Field Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .102
Table 5-39 Save and Exit Menu Field Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103
Table 5-40 104
Table 5-41 Status Code Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105
Table 5-42 SEC Status Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105
Table 5-43 PEI Status Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .106
Table 5-44 PEI Beep Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .110
Table 5-45 DXE Status Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .110
Table 5-46 DXE Beep Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113
Table 5-47 CPU Exception Status Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .114
Table 5-48 ASL Status Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115
Table 5-49 OEM-reserved Status Code Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .116
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List of Tables
Table 6-1 Driver Controller Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Table A-1 Artesyn Embedded Technologies - Embedded Computing Publications . . . . . . . . . . . . . 119
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List of Tables
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List of Figures
Figure 1-1 COMX-CORE Series Declaration of Conformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 1-2 COMX-CORE Series Mechanical Dimensions (Top and Side View) . . . . . . . . . . . . . . 22
Figure 1-3 COMX-CORE Series Mechanical Dimensions (Rear View) . . . . . . . . . . . . . . . . . . . . . 23
Figure 1-4 Heat Spreader Mechanical Dimensions (Side View) . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 1-5 Heat Spreader Mechanical Dimensions (Rear View) . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 1-6 Cooler Mechanical Dimensions (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 1-7 Cooler Mechanical Dimensions (Side View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 1-8 Cooler Mechanical Dimensions (Rear View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 1-9 Serial Number location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 2-1 Cooler (Side View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 2-2 Cooler (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 2-3 Heat spreader (Point M) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 2-4 Air Requirement to Cool Bottom Side Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 2-5 Board Thermal Management Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 2-6 Assembled Heat Spreader and COMX-CORE Series Module . . . . . . . . . . . . . . . . . . . 45
Figure 2-7 Assembled Cooler and COMX-CORE Series Module . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 3-1 COMX-CORE Series Module Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Figure 3-2 COMX-CORE Series Module Components (Rear View) . . . . . . . . . . . . . . . . . . . . . . . . 50
Figure 3-3 eUSB Flash Header Pin Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Figure 3-4 On-board LED Pin-out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Figure 4-1 COMX-CORE Series Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Figure 4-2 SMBus Devices Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Figure 4-3 PCI Express Ports Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Figure 4-4 SATA Ports Diagram for COMX-CORE-510/710/750 (non-ECC) . . . . . . . . . . . . . . . . 70
Figure 4-5 SATA Ports Diagram for COMX-CORE-312/512 (ECC) . . . . . . . . . . . . . . . . . . . . . . . . . 71
Figure 4-6 USB Ports Diagram for COMX-CORE-510/710/750 (non-ECC) . . . . . . . . . . . . . . . . . 72
Figure 4-7 USB Ports Diagram for COMX-CORE-312/512 (ECC) . . . . . . . . . . . . . . . . . . . . . . . . . 73
Figure 4-8 DIP Multiplexed for PCIE direction Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Figure 4-9 PCI-E Multiplexed Direction Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Figure 4-10 WG82577LM Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Figure 4-11 SPI Interface Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Figure 5-1 Main Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Figure 5-2 Advanced Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Figure 5-3 Chipset Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Figure 5-4 Boot Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Figure 5-5 Security Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
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List of Figures
Figure 5-6 Save and Exit Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
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About this Manual
Overview of Contents
This manual is divided into the following chapters and appendices.
Introduction gives an overview of the features of the product, standard compliances,
mechanical data, and ordering information.
Hardware Preparation and Installation outlines the installation requirements, hardware
accessories, switch settings, and installation procedures.
Controls, LEDs, and Connectors describes external interfaces of the board. This include
connectors and LEDs.
Functional Description includes a block diagram and functional description of major
components of the product.
BIOS describes the boot process and the setup utility used to configure the product.
Operating System and Driver Support lists the drivers and operating systems supported by
the product.
Related Documentation provides a listing of related product documentation,
manufacturer’s documents, and industry standard specifications.
Safety Notes summarizes the safety notices in the manual.
Sicherheitshinweise is a German translation of the Safety Notes chapter.
Abbreviations
This document uses the following abbreviations:
Abbreviation Definition
ACPI Advanced Configuration Power Interface
DDI Digital Display Interface
DP Display Port
DVI Digital Video Interface
ECC Error Checking and Correcting
EEPROM Electrically Erasable Programmable Read-Only Memory
COMX-CORE Series Installation and Use (6806800K11F)
13
Page 14
About this Manual
Abbreviation Definition
eDP Embedded Display Port
GPI General Purpose Input
GPIO General Purpose Input Output
GPO General Purpose Output
HDA Intel® High Definition Audio Link
HDMI High-Definition Multimedia Interface
I2C Inter-Integrated Circuit
LPC Low Pin-Count
LVDS Low Voltage Differential Signaling
PCI Peripheral Component Interface
PCIe Peripheral Component Interface Express
PHY Ethernet controller physical layer device
About this Manual
14
SPD Serial Presence Detect - refers to serial EEPROM on DRAMs that has
DRAM module configuration information
S0, S1, S2, S3, S4, S5 System states describing the power and activity level
S0 - Full power
S1 S2 - all devices powered
S3 - Suspend to RAM; System context stored in RAM; RAM is
on standby
S4 - Suspend to Disk; System context stored on disk
S5 - Soft Off; Main power rail is off; only the standby power rail
is present
SATA Serial AT Attachment
SDVO Serialized Digital Video Output
VGA Video Graphics Adapter
WDT Watchdog Timer
COMX-CORE Series Installation and Use (6806800K11F)
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Conventions
The following table describes the conventions used throughout this manual.
Notation Description
0x00000000 Typical notation for hexadecimal numbers (digits are
0b0000 Same for binary numbers (digits are 0 and 1)
bold Used to emphasize a word
Screen Used for on-screen output and code related elements
Courier + Bold Used to characterize user input and to separate it
Reference Used for references and for table and figure
About this Manual
0 through F), for example used for addresses and
offsets
or commands in body text
from system output
descriptions
File > Exit Notation for selecting a submenu
<text> Notation for variables and keys
[text] Notation for software buttons to click on the screen
... Repeated item for example node 1, node 2, ..., node
.
.
.
.. Ranges, for example: 0..4 means one of the integers
| Logical OR
COMX-CORE Series Installation and Use (6806800K11F)
and parameter description
12
Omission of information from example/command
that is not necessary at the time being
0,1,2,3, and 4 (used in registers)
15
Page 16
About this Manual
Notation Description
About this Manual
Indicates a hazardous situation which, if not avoided,
could result in death or serious injury
Indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury
Indicates a property damage message
No danger encountered. Pay attention to important
information
Summary of Changes
This manual has been revised and replaces all prior editions.
Part Number Publication Date Description
6806800K11F August 2014 Re-branded to Artesyn template.
6806800K11E January 2013 Updated Standard Compliances on page 20.
6806800K11D June 2010 Updated COM Express Connector Pin Definition on
6806800K11C March 2010 GA version
6806800K11B February 2010 Revised EA version
6806800K11A February 2010 EA version
16
Added Declaration of Conformity on page20.
page 51.
COMX-CORE Series Installation and Use (6806800K11F)
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Introduction
1.1 Features
COMX-CORE Series is a COM Express module based on the Intel Calpella platform (Arrandale
ECC processor plus Ibex Peak-M). COM Express is an industry-standard embedded computer
module defined by PICMG.
COMX-CORE Series provides the following interfaces: VGA interface, dual-channels LVDS
display interface, 3x Digital Display interfaces, 4x SATA-II, 1x GbE interface, 8 x1 PCI Express,
16x PEG, 8x USB 2.0, 1x HDA interface,; 1x SM bus, and 1x SPI interface. This module also
provides up to 8 GB DDR3 Non-ECC 1066 MHz onboard memory, a 4 GB USB flash that is used
to store the OS, boot applications, and provides two 4Mb SPI flash.
The following tables summarize the features of COMX-CORE-312/512 (ECC) and COMX-CORE510/710/750 (non-ECC)
Table 1-1 COMX-CORE-312/512 (ECC) Features Summary
Chapter 1
Function Features
Processor/ Memory Controller Arrandale+ECC Processor
– Multi-chip package
– Integrated Graphics and Memory Controller Hub
(GMCH)
– 2 MB or 3 MB integrated L3 cache
– Core frequency
- COMX-CORE-312 1.86GHz (P4505)
- COMX-CORE-512 2.4GHz (i5-520E)
Ibex Peak-M Platform Controller Hub (PCH)
– Intel Calpella HM55 Platform Controller Hub for
COMX-CORE-312
– Intel Calpella QM57 Platform Controller Hub for
COMX-CORE-512
BIOS Device Two 4 MB SPI flash
Memory Supports two DDR3 800/1066 64-bit SO-DIMM
sockets.
Maximum capacity is 8 GB ECC memory.
eUSB Flash Optional 1 GB low profile eUSB flash
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Introduction
Table 1-1 COMX-CORE-312/512 (ECC) Features Summary (continued)
Function Features
Video Supports Low Voltage Differential Signaling (LVDS)
Audio Ibex Peak-M supports HDA. The signals are routed to the
Ethernet Optional 1x 10/100/1000Base-T GbE port based on
USB Eight USB2.0 ports routed to the COM Express connector
PCI Express Supports up to eight PCI Express ports routed to the
Supports Video Graphics Adapter (VGA)
Supports High-Definition Multimedia Interface
(HDMI)
Supports up to two display ports
COM-E connector. The audio CODEC should be on the
carrier board.
WG82577LM routed to the COM Express connector
COM Express connector
Serial ATA Four SATA 3.0 Gbps ports routed to the COM Express
connector
TPM Supports Infineon TPM1.2 chip on board.
LPC LPC bus routed to the COM Express connector
SMBus I
2
C compatible SMBus is routed to the COM Express
connector
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Table 1-2 COMX-CORE-510/710/750 (non-ECC) Features Summary
Function Features
Processor/ Memory Controller Arrandale+ECC Processor
– Multi-chip package
– Integrated Graphics and Memory Controller Hub
(GMCH)
– 3 MB or 4 MB integrated L3 cache
– Core frequency
- COMX-CORE-510 2.4GHz ( i5-520E )
- COMX-CORE-750 2.0GHz (i7-620LE)
- COMX-CORE-710 1.06GHz (i7-620UE)
Ibex Peak-M Platform Controller Hub (PCH)
– Intel Calpella QM57 Platform Controller Hub
BIOS Device Two 4 MB SPI flash
Memory Two DDR3 800/1066 64-bit SO-DIMM sockets.
Maximum memory capacity is 8GB non ECC memory
Introduction
eUSB Flash Optional 1 GB low profile eUSB flash
Video Supports Low Voltage Differential Signaling (LVDS)
Supports Video Graphics Adapter (VGA)
Supports High-Definition Multimedia Interface
Supports up to two display ports
Audio Ibex Peak-M supports HDA. The signals are routed to the
COM-E connector. The audio CODEC should be on the
carrier board.
Ethernet Optional 1x 10/100/1000Base-T GbE port based on
WG82577LM routed to the COM Express connector
USB Eight USB2.0 ports routed to the COM Express connector
PCI Express Supports up to eight PCI Express ports routed to the
COM Express connector
Serial ATA Four SATA 3.0 Gbps ports routed to the COM Express
connector
LPC LPC bus routed to the COM Express connector
2
SMBus I
COMX-CORE Series Installation and Use (6806800K11F)
C compatible SMBus is routed to the COM Express
connector
(HDMI)
19
Page 20
Introduction
Table 1-2 COMX-CORE-510/710/750 (non-ECC) Features Summary (continued)
Function Features
XDP 60-pin XDP header for CPU debug.
1.2 Standard Compliances
This product meets the following standards:
Table 1-3 Standard Compliances
Standard Description
IPC-1752-1 Class 4 Environmental reporting requirements
EN 300 019-2-2, Class 2.3 equipment ETSI public transportation requirements
EN 300 019-2-1, Class 1.2 equipment ETSI storage requirements
UL/CSA 60950-1
EN 60950-1
IEC 60950-1 CB Scheme
FCC 47 CFR Part 15 Subpart B (US),
Class B
EN55022 Class B (EU)
AS/NZS CISPR 22 Class B
VCCI Class B (Japan)
Legal safety requirements
EMC requirements (legal) on system level (predefined
Artesyn system)
20
COMX-CORE Series Installation and Use (6806800K11F)
Page 21
Figure 1-1 COMX-CORE Series Declaration of Conformity
E
C Declaration of Conformity
According to EN 17050-1:2004
Introduction
Manufacturer’s Name:
Manufacturer’s Address:
Declares that the following product, in accordance with the requirements of 2004/108/EC, 2006/95/EC,
2011/65/EU and their amending directives,
Product:
Model Name/Number:
has been designed and manufactured to the following specifications:
EN55022:2006 (A1: 2007) Class B
EN55024: 1998 (A1: 2001 + A2: 2003)
EN 61000-3-2: 2006
EN 61000-3-3: 2008
IEC 60950-1: 2005 (2nd Edition) + (A1: 2009)
2011/65/EU RoHS Directive
As manufacturer we hereby declare that the product named above has been designed to comply with the rele-
vant sections of the above referenced specifications. This product complies with the essential health and safety
requirements of the above specified directives. We have an internal production control system that ensures
compliance between the manufactured products and the technical documentation.
Artesyn Embedded Technologies
Embedded Computing
Zhongshan General Carton Box Factory Co. Ltd. No 62, Qi
Guan Road West, Shiqi District, 528400 Zhongshan City
Guangdong, PRC
COM Express Form Factor Computer Series
COMX-310, COMX-312, COMX-510, COMX-512, COMX-710,
COMX-750
___________________________________________________ ___
Tom Tuttle, Manager, Product Testing Services Date (MM/DD/YYYY)
COMX-CORE Series Installation and Use (6806800K11F)
09/04/2014
______
21
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Introduction
1.3 Mechanical Data
1.3.1 COMX-CORE Series Mechanical Data
Figure 1-2 COMX-CORE Series Mechanical Dimensions (Top and Side View)
22
COMX-CORE Series Installation and Use (6806800K11F)
Page 23
Figure 1-3 COMX-CORE Series Mechanical Dimensions (Rear View)
Introduction
Table 1-4 Mechanical Data
Feature Value
Dimensions COM Express basic form factor: 95 mm x 125 mm
Weight 97 g
COMX-CORE Series Installation and Use (6806800K11F)
23
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Introduction
1.3.2 Heat Spreader Mechanical Data
Figure 1-4 Heat Spreader Mechanical Dimensions (Side View)
24
Figure 1-5 Heat Spreader Mechanical Dimensions (Rear View)
COMX-CORE Series Installation and Use (6806800K11F)
Page 25
1.3.3 Cooler Mechanical Data
Figure 1-6 Cooler Mechanical Dimensions (Top View)
Introduction
Figure 1-7 Cooler Mechanical Dimensions (Side View)
COMX-CORE Series Installation and Use (6806800K11F)
25
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Introduction
Figure 1-8 Cooler Mechanical Dimensions (Rear View)
1.4 Ordering Information
26
COMX-CORE Series Installation and Use (6806800K11F)
Page 27
1.4.1 Supported Board Models
As of the printing date of this manual, this guide supports the board models listed below.
Table 1-5 Available Board Variants
Order Number Description
COMX-CORE-710 CORE I7-620UE 1.06GHZ 18W ULV COM Module Type 6
COMX-CORE-750 CORE I7-620LE 2.0 GHZ 25W ULV COM Module Type 6
COMX-CORE-510 CORE I5-520E 2.4GHZ COM Module Type 6
COMX-CORE-512 CORE I5-520E 2.4GHZ ECC COM Module Type 6
COMX-CORE-312 Type 6 COM Express module P4505 Celeron with ECC
1.4.2 Board Accessories
Introduction
As of the printing date of this manual, the following board accessories are available.
Table 1-6 Available Board Accessories
Order Number Description
COMX-CORE-HTSNK COMX-CORE active fansink
COMX-CORE-HP COMX-CORE heatspreader
COMX-CORE Series Installation and Use (6806800K11F)
27
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Introduction
1.5 Board Identification
This section shows the serial number and its location on the board.
Figure 1-9 Serial Number location
28
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Hardware Preparation and Installation
2.1 Environmental and Power Requirements
2.1.1 Environmental Requirements
You must make sure that the board, when operated in your particular system configuration,
meets the environmental requirements specified below.
Operating temperatures refer to the temperature of the air circulating around the board and
not to the component temperature.
Chapter 2
Product Damage
High humidity and condensation on surfaces cause short circuits.
Do not operate the system outside the specified environmental limits. Make sure the
product is completely dry and there is no moisture on any surface before applying power.
Table 2-1 Environmental Requirements
Requirement Operating Non-Operating
Cooling Method Forced-Air
Temp Cycle Class -40°C–85°C:500cyc
Temperature 0°C–55°C -40 °C - 85 °C
Humidity 10 -90% Non-condensing -
Vibration 0.01g ^2/Hz at 5-500 Hz
Random Vibration
Shock 20 g 11 ms sine or saw -
Altitude -60–4000 m ASL
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
2.1.2 Thermal Requirements
The maximum cooler inlet air temperature is 55°C for operation at the maximum operating
temperature limit of 55°C. The location for cooler inlet air temperature measurement is
illustrated in the figure below.
Figure 2-1 Cooler (Side View)
30
COMX-CORE Series Installation and Use (6806800K11F)
Page 31
Figure 2-2 Cooler (Top View)
Hardware Preparation and Installation
If a heat spreader solution is used, the temperature at point M on its top surface should be kept
below a certain temperature for reliable operation of CPU and chipset, this temperature is 70°C
for CPU with TDP of 35W, 80°C for CPU with TDP of 25W and 87°C for CPU with TDP of 18W.
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
The location of point M is illustrated in below figure.
Figure 2-3 Heat spreader (Point M)
32
If only one memory is needed, Artesyn recommends to install it on the top side of the COMXCORE Series module, otherwise, please remove the thermal pad for memory cooling from the
cooler (or heat spreader) to avoid shedding during vibration.
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
If a memory is placed at the bottom, the system should provide at least 1.0m/s air flow into the
gap between COMX-CORE Series and the carrier board (illustrated in the figure below) to keep
the surface temperature of the memory within 95 °C, otherwise, the function of this memory
is not guaranteed.
Figure 2-4 Air Requirement to Cool Bottom Side Memory
To keep the optimized cooling capability, it is not recommended to remove a used cooler (or
heat spreader) from one COMX-CORE Series module and install it on another module without
replacing thermal pads with new ones.
The following table summarizes components that exhibit significant temperature rises and
their maximum allowable operating temperature. These components should be monitored in
order to assess thermal performance.
Table 2-2 Critical Temperature Spots for COMX-CORE Series
Heat Dissipation Power
Component Identifier
CPU-P4505/520E/620LE/620UE 35/35/25/18 CPU: 105 (Tj)
PCH-QM57/HM55 3.5/3.5 108 (Tj)
2 X DDR3 SO-DIMM 1GB/2GB/4GB 1.5/3/3.5 95 (Tc)
COMX-CORE Series Installation and Use (6806800K11F)
(W)
Maximum Allowable
Temperature (°C)
GMCH: 100 (Tj)
33
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Hardware Preparation and Installation
Contact your Artesyn sales representative for current information on the detailed thermal
information including airflow and resistance of the COMX-CORE Series.
System Overheating
Cooling Vents
Improper cooling can lead to system damage and can void the manufacturer's warranty.
To ensure proper cooling and undisturbed airflow through the system do not obstruct the
ventilation openings of the system. Make sure that the fresh air supply is not mixed with hot
exhaust from other devices.
Personal Injury
During operation, hot surfaces may be present on the heat sinks and the components of the
product.
To prevent injury from hot surface do not touch any of the exposed components or
heatsinks on the product when handing. Use the handle and face plate, where applicable, or
the board edge when removing the product from the enclosure.
2.1.3 Power Requirements
The COMX-CORE Series COM-E module boards are designed to operate with input voltages
and current as described in the following tables.
Important Note: The test environment is based on the COMX-CORE module cooperating with
COMX-CAR-610 carrier board, so the power distribution for the +12V and 5VSTB includes the
COMX-CORE module and COMX-CAR-610 carrier board.
Table 2-3 COMX-CORE-710 Power Requirement (with 2x 2GB non-ECC memory)
State +12V 5VSTB VCC_RTC
G3 (AC off) 0 0.10 6uA
Idle (CMOS Setup) 1.80 0.97 0
34
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Hardware Preparation and Installation
Table 2-3 COMX-CORE-710 Power Requirement (with 2x 2GB non-ECC memory) (continued)
State +12V 5VSTB VCC_RTC
Idle (Windows XP Pro) 0.75 0.98 0
Full Loading (while
running burn in test)
1.86 0.98 0
Table 2-4 COMX-CORE-510 Power Requirement (with 2x 2GB non-ECC memory)
State +12V 5VSTB VCC_RTC
G3 (AC off) 0 0.10 6uA
Idle (CMOS Setup) 2.23 0.83 0
Idle (Windows XP Pro) 0.75 0.84 0
Full Loading (while
running burn in test)
2.70 0.84 0
Table 2-5 COMX-CORE-750Power Requirement (with 2x 2GB non-ECC memory)
State +12V 5VSTB VCC_RTC
G3 (AC off) 0 0.09 6uA
Idle (CMOS Setup) 2.02 0.90 0
Idle (Windows XP Pro) 0.76 0.89 0
Full Loading (while
running burn in test)
2.38 0.90 0
Table 2-6 COMX-CORE-512 Power Requirement (with 2x 2GB ECC memory)
State +12V 5VSTB VCC_RTC
G3 (AC off) 0 0.08 6uA
Idle (CMOS Setup) 2.51 0.95 0
Idle (Windows XP Pro) 0.75 0.96 0
Full Loading (while
running burn in test)
COMX-CORE Series Installation and Use (6806800K11F)
2.50 0.97 0
35
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Hardware Preparation and Installation
Table 2-7 COMX-CORE-312 Power Requirement (with 2x 2GB ECC memory)
State +12V 5VSTB VCC_RTC
G3 (AC off) 0 0.09 6uA
Idle (CMOS Setup) 1.97 0.95 0
Idle (Windows XP Pro) 0.86 0.95 0
Full Loading (while
running burn in test)
2.15 0.99 0
2.2 Board Thermal Management and Placement
2.2.1 Board Thermal Management
COMX-CORE Series provides the following thermal management strategy. The Arrandale+ECC
processor Platform Environment Control Interface (PECI) can take the corresponding action to
the protect system during catastrophic overheating.
Figure 2-5 Board Thermal Management Diagram
36
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Hardware Preparation and Installation
The PECI is a one-wire interface that provides a communication channel between a PECI client
(the processor) and a PECI master (the PCH).
The processor digital thermal sensor (DTS) provides an improved capability to monitor device
hot spots, which inherently leads to more varying temperature readings over short time
intervals.
Within the processor, the DTS converts an analog signal into a digital value representing the
temperature relative to PROCHOT# circuit activation. Processor digital thermal sensor controls
processor temperature by modulating (starting and stopping) the processor core clocks when
the processor silicon reaches its maximum operating temperature. A pin "PROCHOT#" is used
in this mode, when PROCHOT# is output and active, it indicate that processor thermal control
circuit is activated. When the PROCHOT# is input from ISL62882, it indicate the VRM
temperature is out of specified value, the processor TTC is activated.
When the CPU junction temperature is more than 125C, CPU will assert the THERMTRIP#.
Signal stop all bus activity and the core power must be shut down in the specified time.
2.3 Unpacking and Inspecting the Module
Damage of Circuits
Electrostatic discharge and incorrect installation and removal of the product can damage
circuits or shorten their life.
Before touching the product make sure that your are working in an ESD-safe environment
or wear an ESD wrist strap or ESD shoes. Hold the product by its edges and do not touch any
components or circuits.
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
Shipment Inspection
1. Verify that you have received all items of your shipment:
Printed Quick Start Guide and Safety Notes
COMX-CORE Series COM Express module
Drivers CD
2. Check for damage and report any damage or differences to customer service.
3. Remove the desiccant bag shipped together with the product.
Environmental Damage
Improperly disposing of used products may harm the environment.
Always dispose of used products according to your country’s legislation and manufacturer’s
instructions.
2.4 Preparing the Installation Environment
Before you install or replace components, pay attention to the following:
Wear an ESD-preventive wrist strap to prevent the static electricity from damaging the
device.
Keep the area where the components reside clean and keep the components away from
heat-generating devices, such as radiator.
Ensure that your sleeves are tightened or rolled up above the elbow. For safety purposes,
it is not recommended to wear jewelry, watch, glasses with metal frame, or clothes with
metal buttons.
Do not exert too much force, or insert or remove the components forcibly. Avoid damage
to the components or plug-ins.
38
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
Confirm the feasibility of the operation
There are available spare parts of the components to be installed or replaced in the
equipment warehouse. When the available spare parts are lacking, contact Artesyn
Embedded Technologies for help in time. For details on how to get help from Artesyn
Embedded Technologies, visit http://www.artesyn.com/computing/.
Make sure that the new components are in good condition, without defects such as
oxidation, chemical corrosion, missing components, or transportation damage.
By reading this document, you are familiar with how to install and replace the component
and master the skills required by the operation.
Check the environment
Make sure that the power supply, temperature, and humidity meet the operating
requirements for the board and its components. For details, refer to the respective system
documentation.
Prepare the parts and the tools
Prepare the components to be installed or replaced.
When you hold or transport the components, use the special antistatic package. Prepare
the cross screwdriver, screws, plastic supports, cooling gel, and ESD-preventive wrist
strap.
Confirm installation or changing position
Confirm the position where COMX-CORE Series will be installed.
If a serious problem occurs and cannot be solved when you install or replace the
component, contact Artesyn Embedded Technologies for technical support.
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
2.5 Memory Module Installation and Removal
There are two 204-pin SODIMM slots onthe COMX-CORE Series. One slot is located on the top
of the module with a height of 6.5 mm. Another is located at the bottom of the module with a
height of 4.0 mm. COMX-CORE Series supports up to 8 GB DDR3 SODIMM memory at
800 MHz or 1066 MHz.
Pin Damage
Forcing the module into the system may damage connector pins.
If the module hangs during insertion, pull it out and insert it again.
Installing a Memory Module
1. Wear the ESD-preventive wrist strap.
2. Lay the module where the SODIMM is to be installed on the antistatic desktop.
3. Take the SODIMM out of the antistatic package, holding it by the edges.
4. Line up the notch located on the row of the metal pins at the bottom of the module
with the key in the SODIMM slot on the motherboard.
5. Insert the SODIMM in a slantwise position or at a 45-degree angle to slide the
module into place.
40
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
6. Press down on the module against the motherboard until you hear it snap into
place. The modules must be properly aligned before you press it down into its final
position. You can remove the module from the socket and reinstall it if you cannot
press it down into its final position.
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
Removing a Memory Module
1. Wear the ESD-preventive wrist strap.
2. Release the module from the slot by pushing the spring latches on either side of the
module outward.
3. Lift the module from the motherboard.
Damage of the Product and Additional Devices and Modules
Incorrect installation or removal of additional devices or modules damages the product or
the additional devices or modules.
Before installing or removing additional devices or modules, read the respective
documentation and use appropriate tools.
2.6 eUSB Flash Disk Installation and Removal
COMX-CORE Series supports a low profile USB flash module with up to 4 GB capacity. The
module can store the operating system and application software to allow for starting up
without a hard disk drive.
42
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Hardware Preparation and Installation
Installing the eUSB Flash Disk
1. Align and insert the connector of the eUSB Flash to the connector on the COMXCORE Series module.
2. Use a M3 x 6 mm screw (0.45 N·m of torque is recommended) to fasten the eUSB
Flash module to the standoff.
Removing the eUSB Flash Disk from the Module
1. Un-tighten and remove the screws of the eUSB Flash disk from the standoff.
2. While holding the edges, pull the eUSB Flash disk from the COM Express module.
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
2.7 Heat Spreader/Cooler Installation and Removal
Installing the Heat Spreader/Cooler
1. Check the thermal interface material pads on the heat spreader/cooler. Make sure
the pads are aligned to their corresponding components on the COMX-CORE Series
module.
2. Align the standoffs of the heat spreader/cooler with the screw holes on the COMXCORE Series module.
3. Hold the heat spreader/cooler and the COMX-CORE Series module together and
turn them over.
4. Attach the heat spreader/cooler to the COMX-CORE Series module by using the
standoffs (male/female type).
0.45 N·m of torque is recommended
44
Do not use standoffs A and B if there are no corresponding holes on the carrier board to avoid
interference with the carrier board components. You can use two M2.5 screws which are
provided along with the heat spreader/cooler instead of the A and B standoffs for mounting.
When screwing the standoffs, first screw down all of them until their caps are just in contact
with the COMX-CORE Series module then screw them all the way down.
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
Figure 2-6 Assembled Heat Spreader and COMX-CORE Series Module
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
Figure 2-7 Assembled Cooler and COMX-CORE Series Module
Removing the Heat Spreader/Cooler from the Module
1. Loosen the standoffs of the heat spreader /cooler from the COMX-CORE Series
module.
2. While holding the edges, pull the heat spreader/cooler from the COMX-CORE
Series module.
2.8 Module Installation and Removal with Carrier Board
The assembled COM Express module with the attached heat spreader is attached to a carrier
board.
46
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
Installing the COM Express Module on the Carrier Board
1. Line up the board-to-board connector of the COMX-CORE Series module with the
board-to-board connector of the carrier board.
2. Make sure that the interconnectors are properly aligned and that the seven
standoffs have contact with the top of the carrier board.
3. Turn over the COMX-CORE Series module and the carrier board.
4. From the backside of the carrier board, locate the screw holes.
5. Use the screws to fasten the COMX-CORE Series module assembly to the carrier
board.
Removing the COM Express Module from the Carrier Board
1. Turn over the COMX-CORE Series module and the carrier board.
2. From the backside of the carrier board, locate the seven screws that connect the
COMX-CORE Series module to the carrier board.
3. Loosen and remove the screws.
4. While holding the edges, pull the COMX-CORE Series module from the carrier
board.
COMX-CORE Series Installation and Use (6806800K11F)
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Hardware Preparation and Installation
48
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Controls, LEDs, and Connectors
3.1 Board Layout
Figure 3-1 COMX-CORE Series Module Components
Chapter 3
COMX-CORE Series Installation and Use (6806800K11F)
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Controls, LEDs, and Connectors
Figure 3-2 COMX-CORE Series Module Components (Rear View)
50
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Controls, LEDs, and Connectors
3.2 Connectors and Switches
3.2.1 COM Express Connector
COMX-CORE Series supports Type 6 COM Express connectors. COM ExpressCOM Express Type
6 adds DDI and USB3.0 interfaces but removes the PCI interface.
Table 3-1 COM Express Connector Pin Definition
Row A Row B Row C Row D
A1 GND(FIXED) B1 GND(FIXED) C1 GND(FIXED) D1 GND(FIXED)
A2 GBE0_MDI3- B2 GBE0_ACT# C2 GND D2 GND
A3 GBE0_MDI3+ B3 LPC_FRAME# C3 USB0_SSRX- / No on
COMX-CORE Series
module
A4 GBE0_LINK100# B4 LPC_AD0 C4 USB0_SSRX+ / No
on COMX-CORE
Series module
A5 GBE0_LINK1000# B5 LPC_AD1 C5 GND D5 GND
A6 GBE0_MDI2- B6 LPC_AD2 C6 USB1_SSRX-/ No on
COMX-CORE Series
module
A7 GBE0_MDI2+ B7 LPC_AD3 C7 USB1_SSRX+/ No on
COMX-CORE Series
module
A8 GBE0_LINK# B8 LPC_DRQ0# C8 GND D8 GND
A9 GBE0_MDI1- B9 LPC_DRQ1# C9 USB2_SSRX-/ No on
COMX-CORE Series
module
A10 GBE0_MDI1+ B10 LPC_CLK C10 USB2_SSRX+/ No on
COMX-CORE Series
module
A11 GND(FIXED) B11 GND(FIXED) C11 GND(FIXED) D11 GND(FIXED)
D3 USB0_SSTX-/ No
on COMX-CORE
Series module
D4 USB0_SSTX+/ No
on COMX-CORE
Series module
D6 USB1_SSTX-/ No
on COMX-CORE
Series moduleNo
on COMX-CORE
Series module
D7 USB1_SSTX+/ No
on COMX-CORE
Series module
D9 USB2_SSTX-/ No
on COMX-CORE
Series module
D10 USB2_SSTX+/ No
on COMX-CORE
Series module
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Controls, LEDs, and Connectors
Table 3-1 COM Express Connector Pin Definition (continued)
Row A Row B Row C Row D
A12 GBE0_MDI0- B12 PWRBTN# C12 USB3_SSRX-/ No on
COMX-CORE Series
module
D12 USB3_SSTX-/ No
on COMX-CORE
Series module
A13 GBE0_MDI0+ B13 SMB_CK C13 USB3_SSRX+/ No on
COMX-CORE Series
module
A14 GBE0_CTREF B14 SMB_DAT C14 GND D14 GND
A15 SUS_S3# B15 SMB_ALERT# C15 DDI1_PAIR6+ D15 DDI1_AUX+
A16 SATA0_TX+ B16 SATA1_TX+ C16 DDI1_PAIR6- D16 DDI1_AUX-
A17 SATA0_TX- B17 SATA1_TX- C17 RSVD D17 RSVD
A18 SUS_S4# B18 SUS_STAT# C18 RSVD D18 RSVD
A19 SATA0_RX+ B19 SATA1_RX+ C19 PCIE_RX6+ D19 PCIE_TX6+
A20 SATA0_RX- B20 SATA1_RX- C20 PCIE_RX6- D20 PCIE_TX6-
A21 GND(FIXED) B21 GND(FIXED) C21 GND(FIXED) D21 GND(FIXED)
A22 SATA2_TX+ B22 SATA3_TX+ C22 PCIE_RX7+ D22 PCIE_TX7+
A23 SATA2_TX- B23 SATA3_TX- C23 PCIE_RX7- D23 PCIE_TX7-
A24 SUS_S5# B24 PWR_OK C24 DDI1_HPD D24 RSVD
A25 SATA2_RX+ B25 SATA3_RX+ C25 DDI1_PAIR4+ D25 RSVD
A26 SATA2_RX- B26 SATA3_RX- C26 DDI1_PAIR4- D26 DDI1_PAIR0+
A27 BATLOW# B27 WDT C27 RSVD D27 DDI1_PAIR0-
A28 (S)ATA_ACT# B28 AC/HDA_SDIN2 C28 RSVD D28 RSVD
D13 USB3_SSTX+/ No
on COMX-CORE
Series module
A29 AC/HDA_SYNC B29 AC/HDA_SDIN1 C29 DDI1_PAIR5+ D29 DDI1_PAIR1+
A30 AC/HDA_RST# B30 AC/HDA_SDIN0 C30 DDI1_PAIR5- D30 DDI1_PAIR1-
A31 GND(FIXED) B31 GND(FIXED) C31 GND(FIXED) D31 GND(FIXED)
A32 AC/HDA_BITCLK B32 SPKR C32 DDI2_AUX+ D32 DDI1_PAIR2+
A33 AC/HDA_SDOUT B33 I2C_CK C33 DDI2_AUX- D33 DDI1_PAIR2-
A34 BIOS_DIS0# B34 I2C_DAT C34 DDI2_CTRLCLK D34 DDI2_CTRLDATA
A35 THRMTRIP# B35 THRM# C35 RSVD D35 RSVD
52
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Controls, LEDs, and Connectors
Table 3-1 COM Express Connector Pin Definition (continued)
Row A Row B Row C Row D
A36 USB6- B36 USB7- C36 DDI3_AUX+ D36 DDI1_PAIR3+
A37 USB6+ B37 USB7+ C37 DDI3_AUX- D37 DDI1_PAIR3-
A38 USB_6_7_OC# B38 USB_4_5_OC# C38 DDI3_CTRLCLK D38 DDI3_CTRLDATA
A39 USB4- B39 USB5- C39 DDI3_PAIR0+ D39 DDI2_PAIR0+
A40 USB4+ B40 USB5+ C40 DDI3_PAIR0- D40 DDI2_PAIR0-
A41 GND(FIXED) B41 GND(FIXED) C41 GND(FIXED) D41 GND(FIXED)
A42 USB2- B42 USB3- C42 DDI3_PAIR1+ D42 DDI2_PAIR1+
A43 USB2+ B43 USB3+ C43 DDI3_PAIR1- D43 DDI2_PAIR1-
A44 USB_2_3_OC# B44 USB_0_1_OC# C44 DDI3_HPD D44 DDI2_HPD
A45 USB0- B45 USB1- C45 RSVD D45 RSVD
A46 USB0+ B46 USB1+ C46 DDI3_PAIR2+ D46 DDI2_PAIR2+
A47 VCC_RTC B47 EXCD1_PERST# C47 DDI3_PAIR2- D47 DDI2_PAIR2-
A48 EXCD0_PERST# B48 EXCD1_CPPE# C48 RSVD D48 RSVD
A49 EXCD0_CPPE# B49 SYS_RESET# C49 DDI3_PAIR3+ D49 DDI2_PAIR3+
A50 LPC_SERIRQ B50 CB_RESET# C50 DDI3_PAIR3- D50 DDI2_PAIR3-
A51 GND(FIXED) B51 GND(FIXED) C51 GND(FIXED) D51 GND(FIXED)
A52 PCIE_TX5+ B52 PCIE_RX5+ C52 PEG_RX0+ D52 PEG_TX0+
A53 PCIE_TX5- B53 PCIE_RX5- C53 PEG_RX0- D53 PEG_TX0-
A54 GPI0 B54 GPO1 C54 TYPE0# D54 PEG_LANE_RV#
A55 PCIE_TX4+ B55 PCIE_RX4+ C55 PEG_RX1+ D55 PEG_TX1+
A56 PCIE_TX4- B56 PCIE_RX4- C56 PEG_RX1- D56 PEG_TX1-
A57 GND B57 GPO2 C57 TYPE1# D57 TYPE2#
A58 PCIE_TX3+ B58 PCIE_RX3+ C58 PEG_RX2+ D58 PEG_TX2+
A59 PCIE_TX3- B59 PCIE_RX3- C59 PEG_RX2- D59 PEG_TX2-
A60 GND(FIXED) B60 GND(FIXED) C60 GND(FIXED) D60 GND(FIXED)
A61 PCIE_TX2+ B61 PCIE_RX2+ C61 PEG_RX3+ D61 PEG_TX3+
A62 PCIE_TX2- B62 PCIE_RX2- C62 PEG_RX3- D62 PEG_TX3-
COMX-CORE Series Installation and Use (6806800K11F)
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Controls, LEDs, and Connectors
Table 3-1 COM Express Connector Pin Definition (continued)
Row A Row B Row C Row D
A63 GPI1 B63 GPO3 C63 RSVD D63 RSVD
A64 PCIE_TX1+ B64 PCIE_RX1+ C64 RSVD D64 RSVD
A65 PCIE_TX1- B65 PCIE_RX1- C65 PEG_RX4+ D65 PEG_TX4+
A66 GND B66 WAKE0# C66 PEG_RX4- D66 PEG_TX4-
A67 GPI2 B67 WAKE1# C67 FAN_PWMOUT/ No
on COMX-CORE
Series module
A68 PCIE_TX0+ B68 PCIE_RX0+ C68 PEG_RX5+ D68 PEG_TX5+
A69 PCIE_TX0- B69 PCIE_RX0- C69 PEG_RX5- D69 PEG_TX5-
A70 GND(FIXED) B70 GND(FIXED) C70 GND(FIXED) D70 GND(FIXED)
A71 LVDS_A0+ B71 LVDS_B0+ C71 PEG_RX6+ D71 PEG_TX6+
A72 LVDS_A0- B72 LVDS_B0- C72 PEG_RX6- D72 PEG_TX6-
A73 LVDS_A1+ B73 LVDS_B1+ C73 DDI1_CTRLDATA D73 DDI1_CTRLCLK
A74 LVDS_A1- B74 LVDS_B1- C74 PEG_RX7+ D74 PEG_TX7+
A75 LVDS_A2+ B75 LVDS_B2+ C75 PEG_RX7- D75 PEG_TX7-
A76 LVDS_A2- B76 LVDS_B2- C76 GND D76 GND
A77 LVDS_VDD_EN B77 LVDS_B3+ C77 FAN_TACHOIN/ No
on COMX-CORE
Series module
A78 LVDS_A3+ B78 LVDS_B3- C78 PEG_RX8+ D78 PEG_TX8+
A79 LVDS_A3- B79 LVDS_BKLT_EN C79 PEG_RX8- D79 PEG_TX8-
A80 GND(FIXED) B80 GND(FIXED) C80 GND(FIXED) D80 GND(FIXED)
A81 LVDS_A_CK+ B81 LVDS_B_CK+ C81 PEG_RX9+ D81 PEG_TX9+
D67 GND
D77 RSVD
A82 LVDS_A_CK- B82 LVDS_B_CK- C82 PEG_RX9- D82 PEG_TX9-
A83 LVDS_I2C_CK B83 LVDS_BKLT_CTRLC83 PP_TPM// No on
COMX-CORE Series
module
A84 LVDS_I2C_DAT B84 VCC_5V_SBY C84 GND D84 GND
A85 GPI3 B85 VCC_5V_SBY C85 PEG_RX10+ D85 PEG_TX10+
54
COMX-CORE Series Installation and Use (6806800K11F)
D83 RSVD
Page 55
Controls, LEDs, and Connectors
Table 3-1 COM Express Connector Pin Definition (continued)
Row A Row B Row C Row D
A86 KBD_RST# B86 VCC_5V_SBY C86 PEG_RX10- D86 PEG_TX10-
A87 KBD_A20GATE B87 VCC_5V_SBY C87 GND D87 GND
A88 PCIE0_CK_REF+ B88 SPI_CS1# C88 PEG_RX11+ D88 PEG_TX11+
A89 PCIE0_CK_REF- B89 VGA_RED C89 PEG_RX11- D89 PEG_TX11-
A90 GND(FIXED) B90 GND(FIXED) C90 GND(FIXED) D90 GND(FIXED)
A91 SPI_CS0# B91 VGA_GRN C91 PEG_RX12+ D91 PEG_TX12+
A92 SPI_MISO B92 VGA_BLU C92 PEG_RX12- D92 PEG_TX12-
A93 GPO0 B93 VGA_HSYNC C93 GND D93 GND
A94 SPI_CLK B94 VGA_VSYNC C94 PEG_RX13+ D94 PEG_TX13+
A95 SPI_MOSI B95 VGA_I2C_CK C95 PEG_RX13- D95 PEG_TX13-
A96 GND B96 VGA_I2C_DAT C96 GND D96 GND
A97 VCC_12V B97 BIOS_DIS1# C97 RSVD D97 PEG_ENABLE#
A98 VCC_12V B98 SER_TX15/ No
on COMX-CORE
Series module
A99 VCC_12V B99 SER_RX15/ No
on COMX-CORE
Series module
A100 GND(FIXED) B100 GND(FIXED) C100 GND(FIXED) D100 GND(FIXED)
A101 VCC_12V B101 VCC_12V C101 PEG_RX15+ D101 PEG_TX15+
A102 VCC_12V B102 VCC_12V C102 PEG_RX15- D102 PEG_TX15-
A103 VCC_12V B103 VCC_12V C103 GND D103 GND
A104 VCC_12V B104 VCC_12V C104 VCC_12V D104 VCC_12V
A105 VCC_12V B105 VCC_12V C105 VCC_12V D105 VCC_12V
A106 VCC_12V B106 VCC_12V C106 VCC_12V D106 VCC_12V
A107 VCC_12V B107 VCC_12V C107 VCC_12V D107 VCC_12V
A108 VCC_12V B108 VCC_12V C108 VCC_12V D108 VCC_12V
A109 VCC_12V B109 VCC_12V C109 VCC_12V D109 VCC_12V
COMX-CORE Series Installation and Use (6806800K11F)
C98 PEG_RX14+ D98 PEG_TX14+
C99 PEG_RX14- D99 PEG_TX14-
55
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Controls, LEDs, and Connectors
Table 3-1 COM Express Connector Pin Definition (continued)
Row A Row B Row C Row D
A110 GND(FIXED) B110 GND(FIXED) C110 GND(FIXED) D110 GND(FIXED)
3.2.2 USB Flash Connector
The COMX-CORE Series supports a low profile USB flash module. The module can store the
operating system and application software to allow for starting up without a hard disk drive.
The USB flash module uses USB port 9 for its interface. The module uses a 2 x 5 header with a
2.0 mm pitch. The header pin definition is as follows:
Figure 3-3 eUSB Flash Header Pin Definition
56
COMX-CORE Series Installation and Use (6806800K11F)
Page 57
3.2.3 DIP Switch Setting
The COMX-CORE Series includes two DIPs on-board:
DIP1 for PEG Bifurcation configuration
– High: PEG works in x16 mode
– Low: PEG works in 2 x8 mode
DIP2 controls the PCIE 4th port direction status (see Ethernet Interfaces on page 74)
3.3 On-board LEDs
The following table describes the LEDs on the COMX-CORE Series:
Table 3-2 On-board LEDs
Controls, LEDs, and Connectors
LED Color Signal
D5 Red CATERR (when the system crash)
D11 Green Platform Reset (chipset is working succesfully)
D12 Red CPU power good (CPU power good is deasserting)
D13 Red Prochot_N(when Prochot_N is asserting)
D14 Red Thrmtrip_N(when Thrmtrip_N is asserting)
D15 Green System Power OK(when system Power OK is asserting)
COMX-CORE Series Installation and Use (6806800K11F)
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Controls, LEDs, and Connectors
Figure 3-4 On-board LED Pin-out
58
COMX-CORE Series Installation and Use (6806800K11F)
Page 59
Functional Description
4.1 Block Diagram
Figure 4-1 COMX-CORE Series Block Diagram
Chapter 4
COMX-CORE Series Installation and Use (6806800K11F)
59
Page 60
Functional Description
4.2 Processor
COMX-CORE Series supports Intel’s Arrandale processor. The processor provides the following
features:
Arrandale+ ECC Dual Core Processor
Dual die (CPU/GMCH): MCP Multi-Chip Package processor with size: 34 mm x 28 mm,
manufactured on 32 nm process
256 KB integrated/dedicated L2 cache for each core
3-4 MB Integrated L3 cache (shared between cores)
Core frequency:
– COMX-CORE-312 1.86 GHz (P4505)
– COMX-CORE-512/510 2.4 GHz (i5-520E)
– COMX-CORE-750 2.0 GHz (i7-620LE)
– COMX-CORE-710 1.06GHz (i7-620UE)
Integrated memory controller (dual 64-bit channels) supports SODIMM DDR3 with the
transfer rates of 800 MT/s or 1066 MT/s, supports for up to 8 GB of memory (dual-channel
mode)
PCI Express Graphic 16x based on 2nd generation, PCIE Link Widths: 1x16, 2x8, 2x4, 2x2,
2x1
DMIx4, 2nd Generation (DMI2)
Flexible display interface
APIC and MSI/MSI-X Message Signaled Interrupt support
Integrated graphics controller
Platform Environment Control Interface (PECI) support
Thermal management support
JTAG support
In-Target Probe (ITP/XDP) support
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COMX-CORE Series Installation and Use (6806800K11F)
Page 61
4.3 Chipset
COMX-CORE Series uses Intel’s Ibex Peak I/O Hub. Ibex Peak provides extensive I/O support.
The table below display the features of QM57 and HM55:
Table 4-1 PCH Intel 5 serial Mobiles SKUs QM57 and HM55
Feature Set QM57 HM55
PCI-E2.0 Ports
USB 2.0 Ports
SATA Ports
HDMI/DVI/VGA/SDVO/DisplayPort Yes Yes
LV DS Ye s Ye s
Graphics Support with PAVP 1.5 Yes Yes
FIS Based Port Multiplier Support Yes No
3
Functional Description
1
2
86
14 12
64
Intel® Rapid Storage
Technology
Intel® AMT 6.0 Yes No
Intel® Remote PC Assist Technology
for Business
1. PCIe* ports 7 and 8 are disabled
2. USB ports 6 and 7 are disabled
3. SATA ports 2 and 3 are disabled
AHCI Yes Yes
Raid
0/1/5/10
Support
4.4 Clock Generator
COMX-CORE Series has a CK505 clock generator (ICS9LPRS365) to provide clocks for various
components.
COMX-CORE Series Installation and Use (6806800K11F)
Yes N o
Yes N o
61
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Functional Description
4.5 System Memory
The Arrandale ECC processor integrates a dual-channel 72-bit ECC DDR3 controller. The pinout
of DDR3 SODIMM ECC is different with DDR3 SODIMM non-ECC memory. COMX-CORE Series
cannot support ECC and non ECC memory modules at the same time.
There are two 204-pin SODIMM slots onCOMX-CORE Series. One slot is located on the top of
the module with a height of 6.5 mm. Another is located at the bottom of the module with a
height of 4.0 mm.
COMX-CORE Series supports the following:
COMX-CORE-510/710/750 (non-ECC) - Two DDR3 800/1066 64-bit SO-DIMM sockets.
Maximum memory capacity is 8GB non-ECC memory
COMX-CORE-312/512 (ECC) - Supports two DDR3 800/1066 64-bit SO-DIMM sockets.
Maximum capacity is 8 GB ECC memory.
4.6 SMBus Interface and Devices
There are three SMBus interfaces on Ibex Peak-M. The following devices connect to the SMBus:
The SPD of two DDR3 non ECC SODIMM
CK505M clock chip
8 KB COM Express serial EEPROM for vendor information
LM96080 voltage measurement device
SMbus interface routes to COM Express connector
PCA9557 for GPIO application
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COMX-CORE Series Installation and Use (6806800K11F)
Page 63
Connect to PHY WG82577LM
Processor XDP interface
Figure 4-2 SMBus Devices Connection Diagram
Functional Description
Table 4-2 SMBus Device Address
Device SPD0 SPD1 CK505MM PCA9557 AT24C02 LM96080
Address 0xA0 0xA2 0xD2 0x30 0xA8 0x50 0xC8
COMX-CORE Series Installation and Use (6806800K11F)
WG8257
7LM
63
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Functional Description
To avoid SMbus address conflicts between SODIMM SPD and AT24C02, pin A2 of AT24C02
should be "1".
4.7 Video
4.7.1 VGA and LVDS
A separate VGA and LVDS route to the COM Express connector from Ibex Peak-M. The VGA
support resolution is 1600 x 1200 or higher. The VGA signals are routed to the COM Express
connector directly.
The Intel Low Voltage Differential Signaling (LVDS) transmitter serializer converts up to 24 bits
of parallel digital RGB data (8 bits per pixel) and dual-channel, along with up to 4 bits for control
(SHFCLK, HSYNC, VSYNC, DE) into two channels (Channel A and Channel B). LVDS signals are
routed to COM Express connector directly.
64
Table 4-3 Enabling the LVDS Signal
Port Enable Strap How to enable Port? COMX-CORE Series Status
LVDS L_DDC_DATA Pull up to 3.3 V with 2.2-k Pull up
COMX-CORE Series Installation and Use (6806800K11F)
Page 65
4.7.2 Digital Display Interfaces
Digital Display Interfaces (DDI) are provided by Ibex Peak-M. All the digital display interfaces on
the PCH platforms have strap signals associated with them. The port strap needs to be set to
configure each digital port irrespective of the digital display technology HDMI/DVI/DP/SDVO.
The table below lists all the digital display straps and guidelines to enable/disable a respective
port on the platform. All the straps are sampled on the rising edge of the PWROK signal. The
signal will be pulled up on the carrier board.
1. The DDI different display configurations should be realized on the carrier board
2. The different configurations of DDI need BIOS support.
Table 4-4 Digital Display Ports Enable and Disable Guidelines
Functional Description
COMX-CORE Series
Port Enable How to Enable Port?
Port B SDVO_CTRLDATA Pull up to 3.3 V with 2.2-k Pull up
Port C DDPC_CTRLDATA Pull up to 3.3 V with 2.2-k Pull up
Port D DDPD_CTRLDATA Pull up to 3.3 V with 2.2-k Pull up
Status
COMX-CORE Series Installation and Use (6806800K11F)
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Functional Description
Table 4-5 Configuration Pin Mapping for DDI Ports
Port DDI PCH Pin Names SDVO Mapping DisplayPort Mapping HDMI/DVI Mapping
DDPB_[0]P SDVO_RED DDPB_[0]P TMDSB_DATA2
DDPB_[0]N SDVO_RED# DDPB_[0]N TMDSB_DATA2#
DDPB_[1]P SDVO_GREEN DDPB_[1]P TMDSB_DATA1
DDPB_[1]N SDVO_GREEN# DDPB_[1]N TMDSB_DATA1#
DDPB_[2]P SDVO_BLUE DDPB_[2]P TMDSB_DATA0
DDPB_[2]N SDVO_BLUE# DDPB_[2]N TMDSB_DATA0#
Port B
DDPB_[3]P SDVO_CLK DDPB_[3]P TMDSB_CLK
DDPB_[3]N SDVO_CLK# DDPB_[3]N TMDSB_CLK#
DDPB_AUXP N/A DDPB_AUXP N/A
DDPB_AUXN N/A DDPB_AUXN N/A
DDPB_HPD N/A DDPB_HPD HDMIB_HPD
Port C
66
SDVO_CTRLCLK S SDVO_CTRLCLK N/A HDMIB_CTRLCLK
SDVO_CTRLDATA SDVO_CTRLDATA N/A HDMIB_CTRLDATA
DDPC_[0]P N/A DDPC_[0]P TMDSC_DATA2
DDPC_[0]N N/A DDPC_[0]N TMDSC_DATA2#
DDPC_[1]P N/A DDPC_[1]P TMDSC_DATA1
DDPC_[1]N N/A DDPC_[1]N TMDSC_DATA1#
DDPC_[2]P N/A DDPC_[2]P TMDSC_DATA0
DDPC_[2]N N/A DDPC_[2]N TMDSC_DATA0#
DDPC_[3]P N/A DDPC_[3]P TMDSC_CLK
DDPC_[3]N N/A DDPC_[3]N TMDSC_CLK#
DDPC_AUXP N/A DDPC_AUXP N/A
DDPC_AUXN N/A DDPC_AUXN N/A
DDPC_HPD N/A DDPC_HPD HDMIC_HPD
DDPC_CTRLCLK N/A N/A HDMIC_CTRLCLK
DDPC_CTRLDATA N/A N/A HDMIC_CTRLDATA
COMX-CORE Series Installation and Use (6806800K11F)
Page 67
Functional Description
Table 4-5 Configuration Pin Mapping for DDI Ports (continued)
Port DDI PCH Pin Names SDVO Mapping DisplayPort Mapping HDMI/DVI Mapping
DDPD_[0]P N/A DDPD_[0]P TMDSD_DATA2
DDPD_[0]N N/A DDPD_[0]N TMDSD_DATA2#
DDPD_[1]P N/A DDPD_[1]P TMDSD_DATA1
DDPD_[1]N N/A DDPD_[1]N TMDSD_DATA1#
DDPD_[2]P N/A DDPD_[2]P TMDSD_DATA0
DDPD_[2]N N/A DDPD_[2]N TMDSD_DATA0#
Port D
DDPD_[3]P N/A DDPD_[3]P TMDSD_CLK
DDPD_[3]N N/A DDPD_[3]N TMDSD_CLK#
DDPD_AUXP N/A DDPD_AUXP N/A
DDPD_AUXN N/A DDPD_AUXN N/A
DDPD_HPD N/A DDPD_HPD HDMID_HPD
DDPD_CTRLCLK N/A N/A HDMID_CTRLCLK
DDPD_CTRLDATA N/A N/A HDMID_CTRLDATA
4.7.3 PEG and eDP Compatibility
The 16x PCI Express Graphics (PEG) is routed to the COM Express connector. The PEG
architecture supports four types of topologies: two for device down and two for add-in card.
The Arrandale ECC processor provides the function that multiplexes the embedded Display
Port (eDP) with the PCIe graphics signal. CFG4, CFG3, CFG0 are the strap signals. PCH GPIO48
is set as the input signal for external PEG x16 to enable configuration.
Table 4-6 PEG Strap Signals
Port Strap How to Strap Port?
COMX-CORE Series
Status
eDP enable CFG[4] Pull down to GND (Internal Pull Up) Optional pull up or Pull
down
PEG Reversal CFG[3] Pull down to GND (Internal Pull Up) Input from COM Express
conn, optional pull up or
Pull down
COMX-CORE Series Installation and Use (6806800K11F)
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Functional Description
Table 4-6 PEG Strap Signals (continued)
Port Strap How to Strap Port?
PEG Bifurcation CFG[0] PEG Bifurcation configuration.
High: PEG for x16 (Internal Pull Up);
Low: PCIE 2x8
COMX-CORE Series
Status
Header control
High: Default
Low: Header control
External PEG Enable GPIO48 External PEG x16 enable configuration
High: Internal PEG enable(Default)
Low: external PEG enable)
GPIO48 strap signal come
from carrier board
Table 4-7 Embedded Display Port Distribution
eDP Signal PEG Signals Lane Reversal Description
eDP_TX[0] PEG_TX[15] PEG_TX[0] eDP Lane 0
eDP_TX#[0] PEG_TX#[15] PEG_TX#[0] eDP Lane 0 Compliment
eDP_TX[1] PEG_TX[14] PEG_TX[1] eDP Lane 1
eDP_TX#[1] PEG_TX#[14] PEG_TX#[1] eDP Lane 1 Compliment
eDP_TX[2] PEG_TX[13] PEG_TX[2] eDP Lane 2
eDP_TX#[2] PEG_TX#[13] PEG_TX#[2] eDP Lane 2 Compliment
eDP_TX[3] PEG_TX[12] PEG_TX[3] eDP Lane 3
eDP_TX#[3] PEG_TX#[12] PEG_TX#[3] eDP Lane 3 Compliment
eDP_AUX PEG_RX[13] PEG_RX[2] eDP Auxiliary Channel
eDP_AUX# PEG_RX#[13] PEG_RX#[2] eDP Auxiliary Channel
Compliment
eDP_HPD# PEG_RX[12] PEG_RX[3] eDP Hot Plug Detect
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COMX-CORE Series Installation and Use (6806800K11F)
Page 69
4.8 PCI Express Port
COMX-CORE Series has eight x1 PCI Express ports. The 4th PCIe port is multiplexed with
WG82577LM and the COM Express connector. The eight PCIe ports are routed to the COM
Express connector. The ports support a transmission rate of 2.5 Gb.
Figure 4-3 PCI Express Ports Connection Diagram
Functional Description
COMX-CORE Series Installation and Use (6806800K11F)
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Functional Description
PCIE 1-3 can be used as PCIE x1 slot on carrier board.
PCIE 4 is muxed with WG82577LM and COM-E connector for Carrier board, DIP define the
PCIE 4 direction status. If the user wants to use PCIE-4 as x1 slot on carrier board, it needs the
software support.
PCIE 5-8 can be used as PCIE x4 slot on carrier board. If user want to use as x1 slot on carrier
board, it needs the software support
4.9 SATA Interface
Four SATA II ports are routed to the COM Express connector from Ibex Peak-M. The PCH SATA
interfaces support data transfer rates of up to 3 Gbps (300 MBps) per port.
Figure 4-4 SATA Ports Diagram for COMX-CORE-510/710/750 (non-ECC)
70
COMX-CORE Series Installation and Use (6806800K11F)
Page 71
Figure 4-5 SATA Ports Diagram for COMX-CORE-312/512 (ECC)
Functional Description
COMX-CORE Series Installation and Use (6806800K11F)
71
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Functional Description
4.10 USB Interface
The Ibex Peak-M supports up to 14 USB 2.0 ports. There are eight USB 2.0 ports routed to the
COM Express connector from the carrier board, and the 9th port is used for the eUSB flash. The
routing diagrams are as follow:
Figure 4-6 USB Ports Diagram for COMX-CORE-510/710/750 (non-ECC)
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COMX-CORE Series Installation and Use (6806800K11F)
Page 73
Figure 4-7 USB Ports Diagram for COMX-CORE-312/512 (ECC)
Functional Description
4.11 USB Flash Solid State Drive
COMX-CORE Series supports a low profile USB flash module with up to 4 GB capacity. The
module can store the operating system and application software to allow for starting up
without a hard disk drive. USB port 9 is used as the interface.
Refer to USB Flash Connector on page 56 for connector and header information.
COMX-CORE Series Installation and Use (6806800K11F)
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Functional Description
4.12 Ethernet Interfaces
The COMX-CORE Series provides a 10/100/1000Base-T GbE port based on WG82577LM that
connects to the COM Express connector. The clock is provided by the Ibex Peak-M's different
clock port CLKOUT_PEG_B. There are two types of power supply requirements for
WG82577LM: 3.3 V and 1.05 V. The fourth PCIe port is multiplexed with Intel WG82577LM
PHY and the COM Express connector. The PCIe multiplex direction is controlled by GPIO36.
Figure 4-8 DIP Multiplexed for PCIE direction Status
Figure 4-9 PCI-E Multiplexed Direction Status
74
COMX-CORE Series Installation and Use (6806800K11F)
Page 75
Figure 4-10 WG82577LM Connection Diagram
Functional Description
4.13 LPC Interface
The Low Pin Count (LPC) interface is routed to the connector and connects to the Super I/O,
Trusted Platform Module (TPM), and the Firmware Hub (FWH) on the carrier board. The LPC
clock with 33 MHz, which routes to the COM Express connector, can be used for Super I/O.
4.14 TPM
COMX-CORE-312/512 (ECC) supports an Infineon TPM1.2 chip on board. The Infineon SLB
9635 TT 1.2 Trusted Platform Module (TPM) provides computer manufacturers with the core
components of a subsystem used to assure authenticity, integrity and confidentiality in ecommerce transactions and Internet communications.
COMX-CORE Series Installation and Use (6806800K11F)
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Functional Description
4.15 SPI Interface
COMX-CORE Series uses SPI flash as a boot device. On COM Express Type 6, the SPI bus routes
to the COM Express connector. There is also a SPI BIOS on the carrier board, so the
BIOS_DISABLE# signal from the carrier board is used. If you want to use the FWH on the carrier
board, you must have a jumper on the carrier board switched to the BIOS source through the
carrier board.
Table 4-8 SPI Multiplex Direction Status
BIOS_DISABLE0/1_N Boot from Module Boot from Carrier Board
1 OK ---
0 --- OK
Figure 4-11 SPI Interface Diagram
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4.16 Watchdog Timer
COMX-CORE Series implements the watchdog timer feature by W83627UHG chip on the
carrier board.
4.17 Hardware Monitor
4.17.1 Voltage Monitor
COMX-CORE Series's power supply is from the COM Express connector, which is different from
the carrier board's power plane. LM96080 will monitor the voltages on COMX-CORE Series:
CPU_VCORE, VCC_GFXCORE, VTT1_05, VCC1_05, DDR1V5, VCC3, VCC5.
4.17.2 Temperature
Functional Description
COMX-CORE Series uses W83627UHG to monitor the system temperature.
4.17.3 Fan Monitor and Control
COMX-CORE Series uses W83627UHG to monitor the system fan speed and the module fan
speed.
4.18 Audio
Ibex Peak-M supports a high definition audio interface. The audio CODEC should be on the
carrier board. The signals of HDA are routed to the COM Express connector directly.
4.19 Power Management
COMX-CORE Series supports ACPI S0, S3, S4 and S5.
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Functional Description
4.20 Real-time Clock (RTC)
COMX-CORE Series supports a battery-backed real-time clock. The chipset Ibex Peak-M
contains a Motorola MC146818A-compatible real-time clock with 256 bytes of batterybacked RAM. The real-time clock performs two key functions: keeping track of the time of day
and storing system data, even when the system is powered down. The RTC operates on a
32.768 KHz crystal and a 3 V battery.
The RTC also supports two lockable memory ranges. By setting bits in the configuration space,
two 8-byte ranges can be locked to read and write accesses. This prevents unauthorized
reading of passwords or other system security information.
The RTC also supports a data alarm that allows for scheduling a wake up event up to 30 days in
advance, rather than just 24 hours in advance.
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5.1 POST
After power-up or reset, the BIOS performs a self-test, POST, that attempts to determine if
further operation is possible and that the detected configuration is expected. This process can
complete normally or result in a warning or an error. The boot process does not stop after a
warning but displays a message on the primary display device. If an error is detected, the boot
process is halted. If possible, a message will be displayed but failures early on in the test can
only be indicated in POST codes.
The POST process display depends on the Quiet Boot option.
Viewing all checkpoints generated by Aptio firmware requires a checkpoint card, which is
also named "POST Card" or "POST Diagnostic Card". They are PCI or LPC add-in cards that
show the value of I/O port 80h on a LED display. These cards are available at the electronic
or computer market around the world.
Chapter 5
5.2 Boot Process
While performing the functions of the traditional BIOS, Aptio 4.x core follows the firmware
model described by the Intel Platform Innovation Framework for EFI ("the Framework"). The
framework is associated to the following "boot phases", which can be described by various state
code.
Security (SEC) - initial low-level initialization
Pre-EFI Initialization (PEI) - memory initialization1
Driver Execution Environment (DXE) - main hardware initialization2
Boot Device Selection (BDS) - system setup, pre-OS user interface & selecting a bootable
device (CD/DVD, HDD, USB, Network, Shell, etc.)
5.3 Initiating Setup
During the boot, pressing the 'F2' key on the keyboard requests the Setup utility be launched
once the self-test is complete and before searching for a boot device. See the Setup description
later in this document to describe the operation of this utility. If you exit Setup without saving
any changes, the boot process continues with the search for a boot device. If the changes are
saved, the motherboard loads the new settings and resets - re-starting the entire boot process.
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5.4 Setup Utility
The BIOS incorporates a Setup utility that allows the user to alter a variety of system options.
This section describes the operation of the utility by describing the various options available
through a set of hierarchical menus. Not all options are available with all products and some
depend on BIOS customizations.
The current settings are stored in the SPI FLASH NVRAM area and any changes can be copied
back to this area via the Exit menu. The operation of the BIOS defaults is described later in this
document.
To start the utility, you must press the F2 key during the early stages of POST after power-up.
Note that this functionality operates with PS/2 keyboards, USB keyboards when enabled, and
via the console redirection facility when enabled.
The table below briefly describes the primary menus, most of which have sub-menus. The
following sections describe the menus in detail.
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Table 5-1 BIOS Primary Menu
Menu Options
Main BIOS information and date and time
Advanced Advanced features including ACPI, CPU, IDE, USB, HW monitoring
and Serial Port settings
Chipset Features including Host Bridge and Southbridge
Boot Boot mode and Boot options
Security Administrator's password
Save & Exit Save with or without changes, Load/save default settings and Boot
Device Selection
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BIOS
The Aptio navigation can be accomplished using a combination of the keys. These keys include
the <FUNCTION> keys, <ENTER>, <ESC>, <ARROW> keys, and so on.
Table 5-2 Aptio Navigation
Key Description
ENTER The Enter key allows the user to select an option to edit its value or
access a sub menu.
Left/Right The Left and Right <Arrow> keys allow you to select a screen.
Up/Down The Up and Down <Arrow> keys allow you to select an item or sub-
screen.
+- Plus/Minus The Plus and Minus <Arrow> keys allow you to change the field value
of a particular setup item.
Tab The <Tab> key allows you to select fields.
ESC The <Esc> key allows you to discard any changes you have made and
exit the Aptio Setup.
When you are in sub-menu, <Esc> allows you to exit to the upper
menu.
Function keys When other function keys become available, they are displayed at
the right of the screen along with their intended function.
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BIOS
5.4.1 Main Menu
Figure 5-1 Main Menu
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Table 5-3 Main Menu Field Description
Field Description
BIOS Vendor BIOS vendor name
Core Version Aptio core version
Project Version Project name and its version
Build Date BIOS build date
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Table 5-3 Main Menu Field Description (continued)
Field Description
System Date Sets the time and date (month/day/year format). To change these values,
System Time
go to each field and enter the desired value. Press the tab key to move
from hour to minute to second, or from month to day to year. There is no
default value.
Table 5-4 Platform Information
Field Description
Processor Type CPU manufacturer brand
EMT64 Extended memory 64 technology
Processor Speed CPU current frequency
Processor Stepping CPU chip version
Processor Core CPU core number
BIOS
Hyper-Threading Hyper-Threading technology
IGD VBIOS Version Integrated Graphic Drive Video BIOS version
QPI Frequency Quick Path Interconnect frequency
Total Memory All memory size
Memory Slot1 Slot1 memory size
Memory Slot2 Slot2 memory size
PCH Version Chipset version
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5.4.2 Advanced Menu
Figure 5-2 Advanced Menu
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Table 5-5 Advanced Menu Field Description
Field Description
PCI Subsystem Settings PCI Configuration Parameters, see PCI Subsystem Settings
ACPI Settings System ACPI Parameters, see ACPI Settings
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Table 5-5 Advanced Menu Field Description (continued)
Field Description
Trusted Computing Trusted Computing Module for security purpose, see Trusted
Computing
S5 RTC Wake Settings Enables system to wake from S5 using RTC alarm, see S5 RTC Wake
Settings
CPU Configuration CPU Configuration Parameters, see CPU Configuration
ME Configuration See ME Configurations
Thermal Configuration See Thermal Configuration
Port 80h Port 80h PEIM, see Port 80h
USB Configuration USB Configuration Parameters, see USB Configuration
AMT Configuration AMT Configuration, see AMT Configuration
LM80 H/W Monitor Monitor hardware, see LM80 Hardware Monitor
BIOS
Super IO Configuration System Super IO chip Parameters, see Super IO Configuration
W83627UHG H/W
Monitor
Serial Port Console
Redirection
Monitor hardware, see W83627UHG Hardware Monitor
Serial Port Console Redirection, see Serial Port Console Redirection
Table 5-6 PCI Subsystem Settings
Field Description
PCI ROM Priority In case of multiple Option ROMs (Legacy and EFI Compatible),
specifies what PCI Option rom to launch.
Default is EFI Compatible ROMs
PCI Latency Timer Value to be programmed into PCI Latency Timer Register.
Default is 32 PCI Bus Clocks
Table 5-7 ACPI Settings
Field Description
Enable ACPI Auto
Configuration
Enables or Disables BIOS ACPI Auto Configuration.
Default is Disabled.
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Table 5-7 ACPI Settings (continued)
Field Description
ACPI Sleep State Select the highest ACPI sleep state the system will enter, when the
SUSPEND button is pressed.
States: Suspend Disabled,S1(CPU Stop Clock) and S3 (Suspend to
RAM).
Default is S3(Suspend to RAM).
S3 Video Repost If enabled, Video Option ROM will be dispatched during S3 resume.
Default is Disabled.
Table 5-8 Trusted Computing
Field Description
TPM SUPPORT Enables or Disables TPM function.
Default is Disabled.
When the item is disabled in BIOS, OS will not show TPM.
TPM State Turns the TPM On/Off.
Changing the TPM state needs a computer restart.
Default is Disabled.
Pending TPM operation Schedule TPM operation
Default is none.
Current TPM Status Information
NO TPM Hardware If no TPM is found
TPM Enabled Status: Shows TPM status: Enabled or Disabled
TPM Active Status: Shows current state of the TPM: Activated or Deactivated
TPM Owner Status: Shows current TPM Ownership state. ie: Owned or UnOwned
Table 5-9 S5 RTC Wake Settings
Field Description
Wake system with Fixed
Time
Wake up hour Select 0-23.
Enable or disable System wake on alarm event
When enabled, system will wake on the hr::min::sec specified.
Default is Disabled
Example: enter 3 for 3am and 15 for 3pm
Default is 0
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Table 5-9 S5 RTC Wake Settings (continued)
Field Description
Wake up minute 0 - 59
Default is 0
Wake up second 0 - 59
Default is 0
BIOS
Wake System with
Dynamic Time
Wake up minute increase Range 1 - 5
Enable or disable System wake on alarm event.
When enabled, the system will wake on current time + Increase
minute(s).
Default is Disabled.
Table 5-10 CPU Configuration
Field Description
Power & Performance Power & Performance options
Hyper-Threading Enabled for Windows XP and Linux (OS optimized for Hyper-
Threading Technology) and Disabled for other OS (OS not optimized
for Hyper-Threading Technology).
Default is Enabled.
Active Processor Cores Number of cores to enable for each processor package
Default is All
Intel Virtualization When enabled, a VMM can utilize the additional hardware capabilities
provided by Vanderpool Technology
Intel Trusted Execution
Technology
Enables utilization of additional hardware capabilities provided by
Intel Trusted Execution Technology. Changes require a full power
cycle to take effect.
Default is Disable
Table 5-11 ME Configurations
Field Description
ME FW Version ME Firmware Version
ME Firmware ME FW SKU
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Table 5-12 Thermal Configuration
Field Description
CPU Thermal Configuration CPU thermal configuration, see CPU Thermal Configuration
Table 5-13 CPU Thermal Configuration
Field Description
TM1 Enable/Disable Thermal Monitor1; Default is Enabled
TM2 Enable/Disable Thermal Monitor2; Default is Enabled
ACPI 3.0 T-States Enable/Disable ACPI 3.0 T-States ;Default is Disabled
Table 5-14 Port 80h
Field Description
Port 80h Redirection Control where the Port 80h cycles are sent: PCI bus, LPC bus
Default is LPC bus
Table 5-15 USB Configuration
Field Description
USB Devices List the USB Devices attached.
Legacy USB Support Enables Legacy USB support. AUTO option disables legacy support if
no USB devices are connected. DISABLE option will keep USB devices
available only for EFI applications.
Default is Enabled.
Device Reset Timeout USB mass storage device Start Unit command timeout
Items: 10 sec,20 sec,30 sec,40 sec
Default is 20 sec.
Table 5-16 AMT Configuration
Field Description
Intel AMT Enable/Disable Intel Active Management Technology BIOS Extension
Default is Enabled.
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Table 5-16 AMT Configuration (continued)
Field Description
Intel AMT Setup Prompt Enable/Disable Intel AMT Setup Prompt to wait for hot-key to enter
setup.
Default is Enabled.
ASF Enable/Disable Alert Standard Format.
Default is Enabled.
Un-Configure ME Un-Configure ME without password.
Default is Disabled.
Hide Un-Configure ME Hide Un-Configure ME without password confirmation prompt.
Default is Disabled.
Table 5-17 LM80 Hardware Monitor
Field Description
BIOS
CPU_VCORE Monitor the core voltage of CPU
VCC_GFXCORE Monitor the core voltage of GFX
VTT1_05 Monitor VTT 1.05V
VCC1_05 Monitor VCC 1.05V
DDR1V5 Monitor 1.5V for DDR3 RAM
VCC3 Monitor VCC 3.3V on Module board
VCC5 Monitor VCC 5.0V on Module board
Table 5-18 Super IO Configuration
Field Description
Super IO Chip Usually Winbond W83627UHG
Serial Port 1 Configuration Set Parameters of Serial Port 1 (COMA), see Serial Port
1/2/3/4/5/6 Configuration
Serial Port 2 Configuration Set Parameters of Serial Port 2 (COMB), see Serial Port
1/2/3/4/5/6 Configuration
Serial Port 3 Configuration Set Parameters of Serial Port 3 (COMC), see Serial Port
1/2/3/4/5/6 Configuration
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Table 5-18 Super IO Configuration (continued)
Field Description
Serial Port 4 Configuration Set Parameters of Serial Port 4 (COMD), see Serial Port
1/2/3/4/5/6 Configuration
Serial Port 5 Configuration Set Parameters of Serial Port 5 (COME), see Serial Port
1/2/3/4/5/6 Configuration
Serial Port 6 Configuration Set Parameters of Serial Port 6 (COMF), see Serial Port
1/2/3/4/5/6 Configuration
Parallel Port Configuration Set Parameters of Parallel Port (LPT/LPTE), see Serial Port
1/2/3/4/5/6 Configuration
Watchdog Timer Configuration Set parameters of Watchdog Timer (WDT), see Watchdog Timer
Configuration
Intrusion Detect Select state for Intrusion Detect
Default is Disabled
Table 5-19 Serial Port 1/2/3/4/5/6 Configuration
Field Description
Serial Port Enable/Disable Serial Port
Default is Enabled
Device Settings Current settings: IO=3F8; IRQ=4;
Change Settings Select an optimal setting for Super IO Device
Options:
Auto
IO=3F8h; IRQ=4;
IO=3F8h; IRQ=3,4,5,6,7,10,11,12;
IO=2F8h; IRQ=3,4,5,6,7,10,11,12;
IO=3E8h; IRQ=3,4,5,6,7,10,11,12;
IO=2E8h; IRQ=3,4,5,6,7,10,11,12;
Default is Auto.
1. IO address shall be assigned responding to various Serial Ports. For example, IO=2F8; IRQ=3 for COMB, IO=3E8;
IRQ=7 for COMC, IO=2E8; IRQ=7 for COMD, IO=2E0; IRQ=10 for COME, IO=2F0; IRQ=10 for COMF.
1
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Table 5-20 Parallel Port Configuration
Field Description
Parallel Port Enable/Disable Parallel Port (LPT/LPTE)
Default is Enabled
Change Settings Select an optimal setting for Super IO Device
Items:
Auto
IO=378h; IRQ=5;
IO=378h; IRQ=5,6,7,10,11,12;
IO=278h; IRQ=5,6,7,10,11,12;
IO=3BCh; IRQ=5,6,7,10,11,12;
IO=378h;
IO=278h;
IO=3BCh;
Default is Auto.
Device Mode Change the Printer Port mode
Items:
STD Printer Mode
SPP Mode
EPP-1.9 and SPP Mode
EPP-1.7 and SPP Mode
ECP Mode
ECP and EPP 1.9 Mode
ECP and EPP 1.7 Mode
BIOS
Table 5-21 Watchdog Timer Configuration
Field Description
Watchdog Timer Select an optimal Watchdog Timer setting (WDT)
Default is Disabled
Table 5-22 W83627UHG Hardware Monitor
Field Description
Module Temperature Module temperature
Module Fan Speed Module fan speed
System Temperature System temperature
System Fan Speed System fan speed
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Table 5-22 W83627UHG Hardware Monitor (continued)
Field Description
VCC3 Monitor VCC 3.3V on carrier board
VCC5 Monitor VCC 5.0V on carrier board
VCC12 Monitor VCC 12V
Table 5-23 Serial Port Console Redirection
Field Description
COM1: Console Redirection Enable/Disable console redirection
Default is Enabled
COM1: Console Redirection
Settings
COM2: Console Redirection Enable/Disable console redirection
COM2: Console Redirection
Settings
COM4 (Pci Dev22, Func3): Console
Redirection
COM4: Console Redirection
Settings
Serial Port for OBM/EMS: Console
Redirection
Out-of-Band Mgnt Port Default is COM1
See COM 1/2 Console Redirection Settings
Default is Disabled
See COM 1/2 Console Redirection Settings
Enable/Disable console redirection
Default is Disabled
See COM 1/2 Console Redirection Settings
Enable/Disable console redirection for OBM/EMS usage
Default is Disabled
Table 5-24 COM 1/2 Console Redirection Settings
Field Description
Terminal Type Emulation:
ANSI: Extended ASCII char set.
VT100: ASCII char set.
VT100+: Extends VT100 to support color, functional keys, etc.
VT-UTF8: Uses UTF8 encoding to map unicode chars onto 1 or more
bytes.
Default is VT100.
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Table 5-24 COM 1/2 Console Redirection Settings (continued)
Field Description
Bits per second Selects serial port transmission speed
The speed must be matched on the other side. Long or noisy lines may
require lower speeds.
Options: 9600, 19200, 57600, 115200.
Default is 115200.
Data Bits Data Bits
Items: 7,8
Default is 8
Parity A parity bit can be sent with the data bits to detect some transmission
errors.
Even: parity bit is 0 if the num of 1's in the data bits is even.
Odd: parity bit is 0 if num of 1's in the data bits is odd.
Mark: parity bit is always 1.
Space: Parity bit is always 0.
Mark and space parity do not allow for error detection. They can be
used as an additional data bit.
Options: None, Even, Odd, Mark, Space
Default is None
BIOS
Stop Bits Stop bits indicate the end of a serial data packet. (A start bit indicates
the beginning). The standard setting is 1 stop bit. Communication with
slow devices may require more than 1 stop bit. Options: 1, 2.
Default is 1.
Flow Control Flow control can prevent data loss from buffer overflow. When sending
data, if the receiving buffers are full, a 'stop' signal can be sent to stop
the data flow. Once the buffers are empty, a 'start' signal can be sent to
restart the flow. Hardware flow control uses two wires to send
start/stop signals. Software flow control uses start/stop ASCII chars,
which slows down the data flow and can be problematic if binary data
is being sent. Options: None, Hardware RTS/CTS. Default is None.
Resolution 100x31 Enable or disable extended terminal resolution.
Default is Disabled.
Legacy OS Redirection Options: 80x25, 80x24. Default is 80x24.
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5.4.3 Chipset Menu
Figure 5-3 Chipset Menu
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Table 5-25 Chipset Menu Description
Field Description
North Bridge Configuration North Bridge Parameters, see North Bridge Configuration
South Bridge Configuration South Bridge Parameters, see South Bridge Configuration
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Table 5-26 North Bridge Configuration
Field Description
BIOS
Common Northbridge
Control
Arrandale_Clarkdale Arrandale options, See Arrandale_Clarkdale
Arrandale_Clarkdale
MRC/QPI
Primary Display Select which of IGD/PEG graphics device should be primary display
Control various common Northbridge functions, See Common
Northbridge Control
Arrandale MRC options, See Arrandale_Clarkdale MRC/QPI
Options: Auto, IGD, PEG
Default is Auto
Table 5-27 Common Northbridge Control
Field Description
PEG Port Configuration PEG Port options, see PEG Port Configuration
VT-d Check to enable VT-d function on MCH
Default is Disabled
Table 5-28 PEG Port Configuration
Field Description
Always Enable PEG enables the PEG slot
Default is Disabled
Force X1 Force PEG link to retrain to X1 mode
Default is Disabled
Table 5-29 Arrandale_Clarkdale
Field Description
IGD-LCD Control See IGD - LCD Control
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Table 5-30 IGD - LCD Control
Field Description
DVMT Pre-Allocated Select DVMT 5.0 Pre-allocated (fixed) graphics memory size used by
the Internal Graphics Device.
Options: 32M, 64M, 128M.
Default is 32M.
DVMT Total Gfx Mem Select DVMT5.0 total graphic memory size used by the Internal
Graphics Device. Options: 128M, 256M, MAX.
Default is 256M.
IGD - Boot Type Select the video device which will be activated during POST. This has
no effect if external graphics is present.
Options: VBIOS Default, CRT, LVDS, CRT + LVDS, HDMI, CRT + HDMI,
DP1, DP2
Default is CRT + LVDS.
LCD Panel Type Select LCD panel with an appropriate setting. Options:
VBIOS Default, 800x600 LVDS, 1024x768 LVDS, 1280x1024 LVDS ,
1400x1050 LVDS1, 1400x1050 LVDS2,1600x1200 LVDS, 1280x768
LVDS, 1680x1050 LVDS, 1920x1200 LVDS, 1600x900 LVDS, 1280x800
LVDS, 1280x600 LVDS, 2048x1536 LVDS.
Default is CRT+LVDS, 1024x768 LVDS
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Please be aware that selecting an incompatinle setting may cause
problems for the display.
Panel Scaling Select the LCD panel scaling option used by the Internal Graphics
Device.
Options: Auto, Force Scaling, Off, Maintain Aspect Ratio.
Default is Auto.
Backlight Control Backlight control setting.
Options: PWM Inverted, PWM Normal, GMBus Inverted, GMBus
Normal.
Default is PWM Inverted.
Spread Spectrum clock
chip
Panel Color Depth Select the LFP Panel Color Depth
>>Hardware: Spread is controlled by chip
>>Software: Spread is controlled by BIOS
Options: Off, Hardware, Software
Default is Off
Options: 18bit, 24bit
Default is 24bit
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Table 5-31 Arrandale_Clarkdale MRC/QPI
Field Description
QPI Frequency Quick path interface frequency
Options: Auto, 3200 GT, 4800 GT, 5866 GT, 6400 GT, Disabled
Default is Auto
Memory Frequency Maximum memory frequency
Options: Auto, 800, 1066
Default is Auto.
Table 5-32 South Bridge Configuration
Field Description
IbexPeak options See IbexPeak Options
USB Configuration See USB Configuration
SATA Configuration See SATA Configuration
BIOS
Table 5-33 IbexPeak Options
Field Description
PCH LAN Controller Enable/Disable onboard NIC
Default is Enabled
Wake on LAN Enable Enable/Disable integrated LAN to wake the system.
Default is Enabled
PXE ROM Enable/Disable PXE option ROM execution for onboard LAN.
Default is Disabled.
Azalia Control detection of the Azalia device.
Disabled = Azalia will be unconditionally disabled
Enabled = Azalia will be unconditionally Enabled
Auto = Azalia will be enabled if present, disabled otherwise.
Default is Auto.
Azalia internal HDM Enable/Disable internal HDMI codec for Azalia.
Default is Enabled.
Clock Spread Spectrum Enable Clock chip's Spread Spectrum feature.
Default is Disabled.
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Table 5-33 IbexPeak Options (continued)
Field Description
State After G3 Specify what state to go to when power is re-applied after a power
failure (G3 state). Options: S0 State, S5 State.
Default is S5 State.
Table 5-34 USB Configuration
Field Description
EHCI1 Controls the USB EHCI (USB2.0) functions
One EHCI controller must always be enabled. EHCI1 is in charge of six
USB ports (J14, J15, P2).
EHCI2 Controls the USB EHCI (USB2.0) functions
One EHCI controller must always be enabled. EHCI2 is in charge of 3
USB ports (P1, P39, P3).
Table 5-35 SATA Configuration
Field Description
SATA Controller(s) Enable/Disable SATA Device.
Default is Enabled.
COMX-CORE-510/710/750 supports SATA 1,2,3,4
COMX-CORE -312/512 supports SATA 1,2,5,6
SATA Mode Selection Determines how SATA Controller(s) operate.
Default is IDE.
Software Feature Mask Configuration will be shown as well. Refer to
Table 5-36
Serial ATA Port1/2/3/4 SATA Port1/2/3/4 State
Table 5-36 Software Feature Mask Configuration
Field Description
RAID0 Enable/Disable RAID0 feature
RAID1 Enable/Disable RAID1 feature
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Table 5-36 Software Feature Mask Configuration (continued)
Field Description
RAID10 Enable/Disable RAID10 feature
RAID5 Enable/Disable RAID5 feature
BIOS
Intel Rapid Recovery
Technology
Enable/Disable Intel Rapid Recovery Technology
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5.4.4 Boot Menu
Figure 5-4 Boot Menu
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Table 5-37 Boot Menu Field Description
Field Description
Quiet Boot Enables/Disables quiet boot option.
Default is Disabled.
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