ANPEC APA2308OI-TU, APA2308OI-TR, APA2308KI-TU, APA2308KI-TR, APA2308JI-TU Datasheet

Class AB Stereo Headphone Driver

Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003

APA2308

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.

Features

Ordering and Marking Information

The APA2308 is an integrated class AB stereo head­phone driver contained in an SO-8, a DIP-8 or a
TSSOP-8 plastic package. The APA2308 is capable
of delivering 280mW of max. Output power to an 8Ω
load or 110mW to a 32Ω load with less than 10%
(THD+N) from a 5V power supply. The device is fab­ricated in a CMOS process and has been primarily
developed for portable digital audio applications .

Applications

• Portable Digital Audio

Gereral Description

••

••

•

Operating Voltage

Single Supply 3V to 6V

Dual Supply ±1.5V to ± 3.0V

••

••

•

High Signal-to-Noise Ratio 100dB

••

••

•

Low Distortion -65dB

••

••

•

Large Output Voltage Swing

••

••

• Excellent Power Supply Ripple Rejection

••

••

• Low Power Consumption

••

••

• Short-circuit Elimination

••

••

• Wide Temperature Range

••

••

• No Switch ON/OFF Clicks

••

••

• Available in 8 pin SOP ,DIP or TSSOP Package

APA2308

Package Code
J : P DIP - 8 K : SOP - 8
O : T SSO P - 8
Temp. Range
I : - 40 to 85 C
Handling Code
TU : Tube TR : Tape & Reel

°

Handling Code

Temp. Range

Package Code

APA2308 J : APA2308

XXXXX

XXXXX - Date Code

APA2308 K :

APA2308
XXXXX

XXXXX - Date Code

APA2308 O :

APA2308
XXXXX

XXXXX - Date Code

Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003

APA2308

www.anpec.com.tw2

Thermal Characteristics

Absolute Maximum Ratings

Electrical Characteristics

VDD=5V , VSS=0V , TA=25°C , fi=1kHz , RL=32Ω ( unless otherwise noted)

Note : *1. Human body model : C=100pF , R=1500Ω , 3 positive pulses plus 3 negative pulses

Symbol Parameter Value Unit

R

THJA

Thermal Resistance from Junction to Ambient in Free Air

DIP-8

SO-8

109

210

K/W

K/W

Symbol Parameter Rating Unit

V

DD

Supply Voltage 7 V

T

SC(O)

Output Short-circuit Duration,at TA=25°C,PTOT=1W 20 S

T

A

Operating Ambient Temperature range -40 to 85 °C

T

J

Maximum Junction Temperature 150 °C

T

STG

Storage Temperature Range -65 to +150 °C

T

S

Soldering Temperature , 10 seconds 260 °C

V

ESD

Electrostatic Discharge -3000 to 3000

*1

V

Block Diagram

APA2308

1

2

3

4

5

6

7

8

Out A

Inverting Input A

Non-inverting Input A

Non-inverting Input B

Out B

Inverting Input B

--+

+

V

SS

V

DD

APA2308

Symbol Parameter Test Condition

Min. Typ. Max

Unit

Supply

Supply Voltage

Single 3.0 5.0 6.0

V

DD

Dual ±1.5 ±2.5 ±3.0

V

V

SS

Negative Supply Voltage -1.5 -2.5 -3.0 V

I

DD

Supply Current No Load 2.5 5 MA

P

TOT

Total Power Dissipation No Load 12.5 25 mW

Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003

APA2308

www.anpec.com.tw3

APA2308

Symbol Parameter Test Condition

Min. Typ. Max

Unit

DC Characteristics

V

I(OS)

Input Offset Voltage 5 MV

I

BIAS

Input Bias Current 10 PA

V

CM

Common Mode Voltage 0 3.5 V

G

V

Open-loop Voltage Gain

R

L

=5k

Ω

75 dB

I

O

Max. Output Current (THD+N)/S<0.1% 140 MA

R

O

Output Resistance 0.25

Ω

AC Characteristics

RL=32Ω

*

1

0.25 4.75V

O

Output Voltage Swing

R

L

=16

Ω*

1

0.5 4.5

V

PSRR Power Supply Rejection Ratio Fi=100Hz

V

RIPPLE(P -P)

=100mV

65 dB

\

CS

Channel Separation

R

L

=32

Ω

95 dB

C

L

Load Capacitance 200 pF

-65 -60 dB(THD+N)/S Total Harmonic Distortion Plus

Noise to Signal Ratio

R

L

=32Ω*

2

0.05 0.1



S/N Signal to Noise Ratio 90 100 dB

F

G

Unity G ain Freque nc y

R

L

=5kΩ

5MHz

P

O

Max. Output Power

(THD+N)/S<0.1%

84

mW

C

I

Input Capacitance 3 pF

B Power Bandwidth Unity Gain Inverting 20 kHz

Notes *1 : Values are proportional to VDD ; (THD+N)/S < 0.1%

*2 : V

DD

=5.0V ; V

O(P-P)

=3.5V (at 0 dB)

Electrical Characteristics Cont.

VDD=5V, VSS=0V, TA=25°C, fi=1kHz, RL=32Ω ( unless otherwise noted)

Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003

APA2308

www.anpec.com.tw4

Test And Application Circuits

220pF

1

2

3

4

6

7

8

­+

-

+

15k

Ω

15k

Ω

15k

Ω

15k

Ω

V

INA

V

INB

R

L

R

L

220µF

100

µ

F

V

DD

V

OUTA

V

OUTB

220µF

2.2

µ

F

220pF

5

2.2µF

APA2308

V

REF

typ.1/2V

DD

Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003

APA2308

www.anpec.com.tw5

Typical Characteristics

Total Harmonic Distortion Plus Noise-to­Signal Ratio as a Function of Input Fre­quency

Output Power as a Function of Supply

Voltage

Crosstalk as a Function of Input

Frequency

Open Loop Gain as a Function of Input

Frequency

-120

-100

-80

100 1k

RL=5k

Ω

RL=32

Ω

RL=16

Ω

RL=8

Ω

10k

No load

+60

+20

+40

+80

1k 10k

100k 1M

RL=32

Ω

Frequency (Hz)

(THD+N) / S (dB)

VDD (Vrms)

P

O

(mW)

Frequency (Hz)

Xtalk

Frequency (Hz)

Gv (dB)

2

5

10

20

100

200

5.52.5 3.5

4.5

RL=8

Ω

RL=16

Ω

RL=32

Ω

-100

-80

-60

100 1k 10k

RL=8

Ω

RL=16

Ω

RL=32

Ω

RL=5k

Ω

po=50mW

po=50mW

po=50mW

V

o(PP)

=3.5V

Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003

APA2308

www.anpec.com.tw6

Typical Characteristics Cont.

Total Harmonic Distortion Plus Noise-to-

Signal Ratio as a Function of output

Voltage

-90

-80

-70

-60

-50

-40

2100m 500m 1

RL=8

Ω

RL=16

Ω

RL=32

Ω

RL=5K

Ω

Vo (Vrms)

(THD+N) / S (dB)

Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003

APA2308

www.anpec.com.tw7

Packaging Information

1

D

E1

A2

A1

A

L

e2

e 3

e 1

E

E3

1

PDIP-8 pin ( Reference JEDEC Registration MS-001)

Millimeters InchesDim

Min. Max. Min. Max.

A

5.33 0.210

A1

0.38 0.015

A2

2.92 3.68 0.115 0.145

D

9.02 10.16 0.355 0.400

e1

2.54BSC 0.100BSC

e2

0.36 0.56 0.014 0.022

e3

1.14 1.78 0.045 0.070

E

7.62 BSC 0.300 BSC

E1

6.10 7.11 0.240 0.280

E3

10.92 0.430

L

2.92 3.81 0.115 0.150

φ

115

°

15

°

Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003

APA2308

www.anpec.com.tw8

Packaging Information

Millimeters Inches

Dim

Min. Max. Min. Max.

A 1.35 1.75 0.053 0.069

A1 0.10 0.25 0.004 0.010

D 4.80 5.00 0.189 0.197

E 3.80 4.00 0.150 0.157

H 5.80 6.20 0.228 0.244

L 0.40 1.27 0.016 0.050

e1 0.33 0.51 0.013 0.020

e2 1.27BSC 0.50BSC

φ

18

°

8

°

HE

e1 e2

0.015X45

D

A

A1

0.004max.

1

L

SOP-8 pin ( Reference JEDEC Registration MS-012)

Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003

APA2308

www.anpec.com.tw9

Packaging Information

Millimeters Inches

Dim

Min. Max. Min. Max.

A 1.2 0.047
A1 0.00 0.15 0.000 0.006
A2 0.80 1.05 0.031 0.041

b 0.19 0.30 0.007 0.012

D 2.9 3.1 0.114 0.122

e 0.65 BSC 0.026 BSC

E 6.40 BSC 0.252 BSC
E1 4.30 4.50 0.169 0.177

L 0.45 0.75 0.018 0.030

L1 1.0 REF 0.039REF

R 0.09 0.004

R1 0.09 0.004

S 0.2 0.008

φ

10

°

8

°

0

°

8

°

φ

212

°

REF 12° REF

φ

312

°

REF 12° REF

L

(L1)

(3)

S

(2)

0.25

GAUGE

PLANE

1

b

D

e

2 x E / 2

8

12

e/2

E1 E

7

A1

A2

A

TSSOP-8

Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003

APA2308

www.anpec.com.tw10

Physical Specifications

Reference JEDEC Standard J-STD-020A APRIL 1999

Reflow Condition (IR/Convection or VPR Reflow)

Pre-heat temperature

183 C

Peak temperature

Time

°

temperature

Classification Reflow Profiles

Convection or IR/

Convection

VPR

Average ramp-up rate(183°C to Peak) 3°C/second max. 10 °C /second max.
Preheat temperature 125 ± 25°C)

120 seconds max

Temperature maintained above 183°C

60 – 150 seconds

Time within 5°C of actual peak temperature

10 –20 seconds 60 seconds

Peak temperature range

220 +5/-0°C or 235 +5/-0°C 215-219°C or 235 +5/-0°C

Ramp-down rate

6 °C /second max. 10 °C /second max.

Time 25°C to peak temperature

6 minutes max.

Package Reflow Conditions

pkg. thickness

≥≥≥≥

2.5mm

and all bgas

pkg. thickness < 2.5mm and
pkg. volume

≥≥≥≥

350 mm³

pkg. thickness < 2.5mm and pkg.
volume < 350mm³

Convection 220 +5/-0 °C Convection 235 +5/-0 °C
VPR 215-219 °C VPR 235 +5/-0 °C
IR/Convection 220 +5/-0 °C IR/Convection 235 +5/-0 °C

Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb)
Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003

APA2308

www.anpec.com.tw11

Test item Method Description

SOLDERABILITY MIL-STD-883D-2003

245

°

C , 5 SEC

HOLT MIL-STD-883D-1005.7

1000 Hrs Bias @ 125

°

C

PCT JESD-22-B, A102

168 Hrs, 100 % RH , 121

°

C

TST MIL-STD-883D-1011.9

-65

°

C ~ 150°C , 200 Cycles

ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V

Latch-Up JESD 78 10ms , Itr > 100mA

Reliability test Program

Carrier Tape & Reel Dimensions

A

J

B

T2

T1

C

t

Ao

E

W

Po

P

Ko

Bo

D1

D

F

P1

Application

A B C

J T1 T2 W P E

330 ± 1 62 +1.5

12.75+

0.15

2 ± 0.5 12.4 ± 0.2 2 ± 0.2 12± 0. 3 8± 0.1 1.75±0.1

F D

D1 Po P1 Ao Bo Ko tSOP- 8

5.5± 1 1.55 +0.1 1.55+ 0.25 4.0 ± 0.1 2.0 ± 0.1 6.4 ± 0.1 5.2± 0. 1 2.1± 0.1 0.3±0.013

Application

A B C

J T1 T2 W P E

330 ± 1 62 +1.5

12.75+

0.15

2 + 0.5 12.4 ± 0.2 2 ± 0.2 12± 0. 3 8± 0.1 1.75±0.1

F D

D1 Po P1 Ao Bo Ko tTSSOP-8

5.5 ± 0. 1 1.5 + 0.1 1.5 + 0.1 4.0 ± 0.1 2.0 ± 0.1 7.0 ± 0.1 3.6 ± 0.3 1.6 ± 0.1 0.3±0.013

(mm)

Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003

APA2308

www.anpec.com.tw12

Cover Tape Dimensions

Application Carrier Width Cover Tape Width Devices Per Reel

SOP- 8

12 9.3 2500

TSSOP- 8

12 9.3 2500

Customer Service

Anpec Electronics Corp.

Head Office :

5F, No. 2 Li-Hsin Road, SBIP,

Hsin-Chu, Taiwan, R.O.C.

Tel : [phone]

Fax : [phone]

Taipei Branch :

7F, No. 137, Lane 235, Pac Chiao Rd.,

Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.

Tel : [phone]

Fax : [phone]