Analog Devices SSM2167-2RM, SSM2167-1RM Datasheet

Low Voltage Microphone
INPUT – dB
OUTPUT – dB
LIMITING
REGION
LIMITING
THRESHOLD
(ROTATION POINT)
COMPRESSION
REGION
1
r
1
1
DOWNWARD
EXPANSION
THRESHOLD
(NOISE GATE)
DOWNWARD
EXPANSION
REGION
V
DE
V
RP
VCA GAIN
Preamplifier with Variable
a
FEATURES Complete Microphone Conditioner in a 10-Lead Package Single 3 V Operation Low Shutdown Current < 2 ␮A Adjustable Noise Gate Threshold Adjustable Compression Ratio Automatic Limiting Feature Prevents ADC Overload Low Noise and Distortion: 0.2% THD + N 20 kHz Bandwidth
APPLICATIONS Desktop, Portable, or Palmtop Computers Telephone Conferencing Communication Headsets Two-Way Communications Surveillance Systems Karaoke and DJ Mixers
GENERAL DESCRIPTION
The SSM2167 is a complete and flexible solution for conditioning microphone inputs in personal electronics and computer audio systems. It is also excellent for improving vocal clarity in communi­cations and public address systems. A low noise voltage controlled amplifier (VCA) provides a gain that is dynamically adjusted by a control loop to maintain a set compression characteristic. The compression ratio is set by a single resistor and can be varied from 1:1 to over 10:1 relative to the fixed rotation point. Signals above the rotation point are limited to prevent overload and to eliminate “popping.” A downward expander (noise gate) prevents amplifica­tion of background noise or hum. This results in optimized signal levels prior to digitization, thereby eliminating the need for addi­tional gain or attenuation in the digital domain. The flexibility of setting the compression ratio and the time constant of the level detector, coupled with two values of rotation point, make the SSM2167 easy to integrate in a wide variety of microphone conditioning applications.
The SSM2167 is available in two versions, with different amounts of fixed gain. The SSM2167-1 has 18 dB of fixed gain, while the SSM2167-2 features only 8 dB of fixed gain.
The device is available in 10-lead MSOP package, and guaranteed for operation over the extended industrial temperature range of –40°C to +85°C.
Compression and Noise Gating
SSM2167
PIN CONFIGURATION
10-Lead MSOP
(RM Suffix)
1
GND
2
VCA
IN
SSM2167
INPUT
3
4
5
SHUTDOWN
BUF OUT
Figure 1. General Input/Output Characteristics
10
V
DD
9
OUTPUT
8
COMPRESSION RATIO
7
GATE THRS
6
AVG CAP
REV. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2002
SSM2167–SPECIFICATIONS
(@ VS = 3.0 V, f = 1 kHz, RL = 100 k, R R
= 2 k, unless otherwise noted.)
GATE
= 0 , TA = 25C, VIN = 100 mV rms,
COMP
Parameter Symbol Conditions Min Typ Max Unit
AUDIO SIGNAL PATH
Voltage Noise Density e
n
Noise 20 kHz Bandwidth, V Total Harmonic Distortion + Noise THD + N V Input Impedance Z Output Impedance Z
IN
OUT
10:1 Compression 20 nV/√Hz
= GND –70 dBV
= 100 mV rms 0.2 %
IN
IN
100 k 145
Load Drive Minimum Resistive Load 5 k
Maximum Capacitive Load 2 nF Input Voltage Range 0.4% THD 600 mV rms Output Voltage Range 0.4% THD SSM2167-1 700 mV rms SSM2167-2* 700 mV rms Gain Bandwidth Product 1:1 Compression SSM2167-1 VCA G = 18 dB 1 MHz SSM2167-2* VCA G = 8 dB 1 MHz
CONTROL SECTION
VCA Dynamic Gain Range 40 dB VCA Fixed Gain SSM2167-1 18 dB SSM2167-2* 8dB Compression Ratio, Min 1:1 Compression Ratio, Max See Table I for R
COMP
10:1 Rotation Point SSM2167-1 63 mV rms SSM2167-2* 100 mV rms Noise Gate Range Maximum Threshold –40 dBV
POWER SUPPLY
Supply Voltage V Supply Current I
SY
SY
2.5 5.5 V
2.3 5 mA DC Output Voltage 1.4 V Power Supply Rejection Ratio PSRR VSY = 2.5 V to 6 V 4.5 mV
SHUTDOWN
Supply Current I
*Preliminary
Specifications subject to change without notice.
SY
Pin 3 = GND 2 8 ␮A
–2–
REV. A
SSM2167
WARNING!
ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS*

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Operating Temperature Range . . . . . . . . . . . –40°C to +85°C
Junction Temperature Range . . . . . . . . . . . . . . . . . . . . 150°C
Lead Temperature Range (Soldering, 10 sec) . . . . . . . 300°C
Package Type JA*
10-Lead MSOP (RM) 180 35 °C/W
*θJA is specified for worst-case conditions, i.e., θ
in 4-layer circuit board for surface-mount packages.

ESD RATINGS

883 (Human Body) Model . . . . . . . . . . . . . . . . . . . . . . 500 V
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating condi­tions for extended periods may affect device reliability.

ORDERING GUIDE

Temperature Package Package
Model Range Description Option
SSM2167-1RM-Reel –40°C to +85°C 10-Lead Mini/micro SOIC (MSOP) RM-10 SSM2167-2RM-Reel* –40°C to +85°C 10-Lead Mini/micro SOIC (MSOP) RM-10
*Preliminary

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the SSM2167 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
JC
is specified for device soldered
JA
Unit
REV. A
–3–
SSM2167
– Typical Performance Characteristics
100
10
NOISE GATE – mV rms
1
0 3,500500
1,000 1,500 2,5002,000 3,000
TPC 1. Noise Gate vs. R
1
TA = 25ⴗC V+ = 3V
V
= 24.5mV rms
IN
COMPRESSION RATIO 1:1 ROTATION POINT = 63mV rms NOISE GATE SETTING = 1.4mV rms
0.1
THD + N – %

0.01 20 30k
100
TA = 25ⴗC V+ = 3V R
= 100k
LOAD
COMPRESSION RATIO 2:1 ROTATION POINT = 63mV rms
R
GATE
FREQUENCY – Hz
1k 10k
GATE
TPC 2. THD + N vs. Frequency
20k
1
0.1
THD + N – %
TA = 25ⴗC V+ = 3V
V
FREQUENCY = 1kHz
IN
R
= 100k
LOAD
COMPRESSION RATIO 1:1 ROTATION POINT = 63mV rms NOISE GATE SETTING = 1.4mV rms
0.01 10m 10.1
INPUT VOLTAGE – V rms
TPC 4. THD + N vs. Input
0
COMPRESSION RATIO 10:1
10
20
30
40
50
OUTPUT – dBV
60
70
80
80 70
COMPRESSION RATIO 1:1
60 50 40 30 20 10
INPUT – dBV
COMPRESSION RATIO 5:1
COMPRESSION RATIO 2:1
TA = 25ⴗC V+ = 3V R
= 100k
L
ROTATION POINT = 63mV rms NOISE GATE SETTING = 1.4mV rms
TPC 5. Output vs. Input Characteristics
35
25
15
5
GAIN – dB
V
= 2mV rms
IN
5
15
= 175k
R
COMP
ROTATION POINT = 63mV rms NOISE GATE SETTING = 1.4mV rms
1k 10M10k
FREQUENCY – Hz
100k 1M
TPC 3. GBW Curves vs. VCA Gain
10
V+ = 3V + 0.1 R
20
R
30
40
50
PSRR – dB
60
70
80
10 100k100
= 5k
GATE
= 0V
COMP
1k 10k
FREQUENCY – Hz
TPC 6. PSRR vs. Frequency
–4–
REV. A
SSM2167
0
0
0
0
0
0
VO LTAG E – 50mV/DIV
0
0
0
000
TA = 25ⴗC
= 10␮F
C
SYS
SYSTEM GAIN = 19dB R
= 100k
LOAD
COMPRESSION RATIO 1:1
000000
TIME – 10s/DIV
TPC 7. Small Signal Transient Response
0
0
0
0
0
0
VO LTAG E – 500mV/DIV
0
0
TA = 25ⴗC
= 10␮F
C
SYS
SYSTEM GAIN = 8.6dB
= 100k
R
LOAD
COMPRESSION RATIO 1:1
0
0
0
0
0
0
VO LTAG E – 200mV/DIV
0
0
0
000
TA = 25ⴗC C
= 10␮F
SYS
SYSTEM GAIN = 2.6dB R
= 100k
LOAD
COMPRESSION RATIO 1:1
000000
TIME – 10s/DIV
TPC 10. Large Signal Transient Response
0
0
0
0
0
0
VO LTAG E – 100mV/DIV
0
0
6dBV
66dBV85dBV
0
000
000000
TIME – 10s/DIV
TPC 8. Large Signal Transient Response
0
0
0
0
0
0
VO LTAG E – 50mV/DIV
0
0
0
000
TA = 25ⴗC C
= 10␮F
SYS
SYSTEM GAIN = 8dB
= 100k
R
LOAD
COMPRESSION RATIO 1:1
000000
TIME – 10␮s/DIV
TPC 9. Small Signal Transient Response
0
000
000000
TIME – 1s/DIV
TPC 11. RMS Level Detector Performance with
= 22 µF
C
AVG
0
0
0
0
0
0
VO LTAG E – 100mV/DIV
0
0
0
000
000000
TIME – 500ms/DIV
TPC 12. RMS Level Detector Performance with
= 2.2 µF
C
AVG
6dBV
66dBV
85dBV
REV. A
–5–
SSM2167
0
0
0
0
0
0
VO LTAG E – 100mV/DIV
0
0
0
000
000000
TIME – 500ms/DIV
6dBV
66dBV
85dBV
TPC 13. SSM2167-1 RMS Level Detector Performance with C
= 2.2 µF
AVG

APPLICATIONS INFORMATION

The SSM2167 is a complete microphone signal conditioning system on a single integrated circuit. Designed primarily for voice band applications, this integrated circuit provides amplifi­cation, limiting, variable compression, and noise gate. User adjustable compression ratio, noise gate threshold, and two different fixed gains optimize circuit operation for a variety of applications. The SSM2167 also features a low power shutdown mode for battery-powered applications.
V
DD
+
10F
GND
V
DD
SHUTDOWN
INPUT
10F
500k
0.1␮F
SSM2167
+
GND
10F
R
R
+
10F
V
GATE
COMP
OUTPUT
100k
DD
Figure 2. Typical Application Circuit
C2
OUT
LEVEL
DETECTOR
GND
10F
+
VCA
1k 1k
C
AVG
+
C3
10F
IN
VCA
CONTROL
R
GRC
OUTPUT
NOISE GATE AND COMPRESSION SETTINGS
V
DD
INPUT
C1
0.1␮F
V
DD
+1
SHUTDOWN
BUF
BUFFER
Figure 3. Functional Block Diagram
–6–
Theory of Operation
The typical transfer characteristic for the SSM2167 is shown in Figure 1 where the output level in dB is plotted as a function of the input level in dB. The dotted line indicates the transfer characteristic for a unity-gain amplifier. For input signals in the range of V
(Downward Expansion) to VRP (Rotation Point)
DE
an “r” dB change in the input level causes a 1 dB change in the output level. Here, “r” is defined as the “compression ratio.” The compression ratio may be varied from 1:1 (no compression) to 10:1 via a single resistor, R
. Input signals above VRP are
COMP
compressed with a fixed compression ratio of approximately 10:1. This region of operation is the “limiting region.” Varying the compression ratio has no effect on the limiting region. The breakpoint between the compression region and the limiting region is referred to as the “limiting threshold” or the “rotation point.” The term “rotation point” derives from the observation that the straight line in the compression region “rotates” about this point on the input/output characteristic as the compression ratio is changed.
The gain of the system with an input signal level of V
is the
RP
“fixed gain,” 18 dBV for the SSM2167-1 and 8 dBV for the SSM2167-2, regardless of the compression ratio.
Input signals below V
are downward-expanded; that is, a –1 dB
DE
change in the input signal level causes approximately a –3 dB change in the output level. As a result, the gain of the system is small for very small input signal levels, even though it may be quite large for small input signals just above of V resistor at Pin 7, R threshold V
DE
.
is used to set the downward expansion
GATE,
. The external
DE
Finally, the SSM2167 provides an active low, CMOS-compatible digital power-down feature that will reduce device supply current to typically less than 2 ␮A.
SSM2167 Signal Path
Figure 3 illustrates the block diagram of the SSM2167. The audio input signal is processed by the input buffer and then by the VCA. The input buffer presents an input impedance of approximately 100 k
to the source. A dc voltage of approximately 1.5 V is
present at INPUT (Pin 5 of the SSM2167), requiring the use of a blocking capacitor (C1) for ground-referenced sources. A 0.1 µF capacitor is a good choice for most audio applications. The input buffer is a unity-gain stable amplifier that can drive the low imped­ance input of the VCA and an internal rms detector.
The VCA is a low distortion, variable-gain amplifier whose gain is set by the side-chain control circuitry. An external blocking capacitor (C2) must be used between the buffer’s output and the VCA input. The 1 k impedance between amplifiers determines the value of this capacitor, which is typically between 4.7 µF and 10 µF. An aluminum electrolytic capacitor is an economical choice. The VCA amplifies the input signal current flowing through C2 and converts this current to a voltage at the SSM2167’s output pin (Pin 9). The net gain from input to output can be as high as 40 dB for the SSM2167-1 and 30 dB for the SSM2167-2, depending on the gain set by the control circuitry.
The output impedance of the SSM2167 is typically less than 145 Ω, and the external load on Pin 9 should be > 5 k. The nominal output dc voltage of the device is approximately 1.4 V, so a blocking capacitor for grounded loads must be used.
REV. A
The bandwidth of the SSM2167 is quite wide at all gain settings.
INPUT – dB
OUTPUT – dB
V
DE
V
RP
15:1
5:1
2:1
1:1
1
1
VCA GAIN
The upper 3 dB point is over 1 MHz at gains as high as 30 dB. The GBW plots are shown in TPC 3. The lower 3 dB cutoff frequency of the SSM2167 is set by the input impedance of the VCA (1 k) and C2. While the noise of the input buffer is fixed, the input-referred noise of the VCA is a function of gain. The VCA input noise is designed to be a minimum when the gain is at a maximum, thereby maximizing the usable dynamic range of the part.
Level Detector
The SSM2167 incorporates a full-wave rectifier and a patent­pending, true rms level detector circuit whose averaging time constant is set by an external capacitor (C
) connected to
AVG
the AVG CAP pin (Pin 8). For optimal low-frequency operation of the level detector down to 10 Hz, the value of the capacitor should be 2.2 µF. Some experimentation with larger values for C
may be necessary to reduce the effects of excessive
AVG
low-frequency ambient background noise. The value of the aver­aging capacitor affects sound quality: too small a value for this capacitor may cause a “pumping effect” for some signals, while too large a value can result in slow response times to signal dynamics. Electrolytic capacitors are recommended here for lowest cost and should be in the range of 2 µF to 22 µF.
The rms detector filter time constant is approximately given by 10 C
milliseconds where C
AVG
is in µF. This time constant
AVG
controls both the steady state averaging in the rms detector as well as the release time for compression; that is, the time it takes for the system gain to increase due to a decrease in input signal. The attack time, the time it takes for the gain to be reduced because of a sudden increase in input level, is controlled mainly by internal circuitry that speeds up the attack for large level changes. This limits overload time to less than 1 ms in most cases.
The performance of the rms level detector is illustrated in TPC 12 for a C
of 2.2 µF and TPC 11 for a C
AVG
of 22 µF. In each of
AVG
these photographs, the input signal to the SSM2167 (not shown) is a series of tone bursts in six successive 10 dB steps. The tone bursts range from –66 dBV (0.5 mV rms) to –6 dBV (0.5 V rms). As illustrated in the photographs, the attack time of the rms level detector is dependent only on C ramps whose decay times are dependent on both C
, but the release times are linear
AVG
AVG
and the input signal step size. The rate of release is approximately 240 dB/s for a C
of 2.2 µF, and 12 dB/s for a C
AVG
of 22 µF.
AVG
Control Circuitry
The output of the rms level detector is a signal proportional to the log of the true rms value of the buffer output with an added dc offset. The control circuitry subtracts a dc voltage from this signal, scales it, and sends the result to the VCA to control the gain. The VCA’s gain control is logarithmic—a linear change in control signal causes a dB change in gain. It is this control law that allows linear processing of the log rms signal to provide the flat compression characteristic on the input/output characteristic shown in Figure 1.
SSM2167
Figure 4. Effect of Varying the Compression Ratio
Setting the Compression Ratio
Changing the scaling of the control signal fed to the VCA causes a change in the circuit’s compression ratio, “r.” This effect is shown in Figure 4. Connecting a resistor (R sets the compression ratio. Lowering R sion ratios as indicated in Table I. AGC performance is achieved with compression ratios between 2:1 and 10:1, and is dependent on the application. Shorting R
COMP
setting the compression equal to 1:1. If using a compression resis­tor, using a value greater than 5 k is recommend. If lower than 5 k is used, the device may interpret this as a short, 0 Ω.
Table I. Setting Compression Ratio
Compression Ratio Value of R
1:1 0 (short to V+) 2:1 15 k 3:1 35 k 5:1 75 k 10:1 175 k
r:1
OUTPUT – dB
1
1
V
DE2
V
V
DE1
DE3
INPUT – dB
Figure 5. Effects of Varying the Downward Expansion (Noise Gate) Threshold
) between Pin 8 and V
COMP
gives smaller compres-
COMP
DD
will disable the AGC function,
COMP
VCA GAIN
V
RP
REV. A
–7–
SSM2167
Setting the Noise Gate Threshold (Downward Expansion)
Noise gate threshold is another programmable point using an external resistor (R (NOISE GATE THRS) and V
) that is connected between Pin 7
GATE
. The downward expansion
DD
threshold may be set between –40 dBV and –55 dBV, as shown in Table II. The downward expansion threshold is inversely proportional to the value of this resistance: setting this resistance to 0 sets the threshold at approximately 10 mV rms (–40 dBV), whereas a 5 k resistance sets the threshold at approximately 1 mV rms (–55 dBV). This relationship is illustrated in Figure 5. We do not recommend more than 5 k for the R
GATE
resistor as the noise floor of the SSM2167 prevents the noise gate from being lowered further without causing problems.
Table II. Setting Noise Gate Threshold
Noise Gate (dBV) Value of R
GATE
–40 0 (short to V+) –48 1 k –54 2 k –55 5 k
Rotation Point (Limiting)
Input signals above a particular level, “the rotation point,” are attenuated (limited) by internal circuitry. This feature allows the SSM2167 to limit the maximum output, preventing clipping of the following stage, such as a CODEC or ADC. The rotation point for SSM2167 is set internally to –24 dBV (63 mV rms) for SSM2167-1 and –20 dBV (100 mV rms) for SSM2167-2.
Shutdown Feature
The supply current of the SSM2167 can be reduced to under 10 µA by applying an active LOW, 0 V CMOS compatible input to the SSM2167’s /SHUTDOWN Pin (Pin 3). In this state, the input and output circuitry of the SSM2167 will assume a high imped­ance state; as such, the potentials at the input pin and the output pin will be determined by the external circuitry connected to the SSM2167. The SSM2167 takes approximately 200 ms to settle from a SHUTDOWN to POWER-ON command. For POWER-ON to SHUTDOWN, the SSM2167 requires more time, typically less than 1 s. Cycling the power supply to the SSM2167 can result in quicker settling times: the off-to-on settling time of the SSM2167 is less than 200 ms, while the on-to-off settling time is less than 1 ms. The SSM2167 shutdown current is related to both temperature and voltage.
PC Board Layout Considerations
Since the SSM2167 is capable of wide bandwidth operation and can be configured for as much as 60 dB of gain, special care must be exercised in the layout of the PC board that contains the IC and its associated components. The following applications hints should be considered for the PC board.
The layout should minimize possible capacitive feedback from the output of the SSM2167 back to its input. Do not run input and output traces adjacent to each other.
A single-point (“star”) ground implementation is recommended in addition to maintaining short lead lengths and PC board runs. In applications where an analog ground and a digital ground are available, the SSM2167 and its surrounding circuitry should be connected to the system’s analog ground. As a result of these recommendations, wire-wrap board connections and grounding implementations are to be explicitly avoided.
C02628–0–3/02(A)
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
10-Lead MSOP
(RM-10)
0.124 (3.15)
0.112 (2.84)
0.124 (3.15)
0.112 (2.84)
0.038 (0.97)
0.030 (0.76)
10 6
1
PIN 1
0.0197 (0.50) BSC
0.122 (3.10)
0.110 (2.79)
0.006 (0.15)
0.002 (0.05)
0.199 (5.05)
0.187 (4.75)
5
0.016 (0.41)
0.006 (0.15)
0.043 (1.09)
0.037 (0.94)
SEATING PLANE
0.011 (0.28)
0.003 (0.08)
0.120 (3.05)
0.112 (2.84)
6 0
0.022 (0.56)
0.021 (0.53)

Revision History

Location Page
Data Sheet changed from REV. 0 to REV. A.
Edits to Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Edits to Figures 2 and 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
PRINTED IN U.S.A.
–8–
REV. A
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