FEATURES
Each of 8 Inputs Can Be Assigned to Either or Both
Outputs
Voltage Inputs and Outputs – No Need For External
Amplifiers
Each Input Provides 63 dB of Attenuation in 1 dB Steps,
Plus Mute
–82 dBu Signal-to-Noise Ratio (0 dBu = 0.775 V
+10 dBu of Headroom
0.007% THD+N (Unity Gain, @ 1 kHz, 0 dBu)
Power-Up/System Mute Feature
Industry-Standard 3-Wire Serial Interface
Data Out Terminal Permits Daisy Chaining of Multiple
SSM2163s
Single or Dual Supply Operation
28-Pin Plastic DIP and SOIC Package
APPLICATIONS
Multimedia System Mixing
Audio Mixing Consoles
Broadcast Equipment
Intercom/Paging Systems
Musical Instruments
rms)
8 3 2 Audio Mixer
SSM2163
SIMPLIFIED BLOCK DIAGRAM
GENERAL DESCRIPTION
The SSM2163 provides eight audio inputs, each of which can
be mixed under digital control to a stereo output. Each input
channel can be attenuated up to 63 dB in 1 dB intervals, plus
fully muted. Additionally, any input can be assigned to either or
both outputs. A standard 3-wire serial interface is employed,
plus a Data Out terminal to facilitate daisy chaining of multiple
mixer ICs. No external components are required for normal
operation.
Excellent audio performance is attained. The SSM2163 has a
signal-to-noise ratio of –82 dBu (0 dBu = 0.775 V rms), with
10 dBu of headroom resulting in total dynamic range of 92 dBu.
The SSM2163 can be operated from single (+5 V to +14 V) or
dual (±4 V to ±7 V) supplies, and is housed in 28-pin plastic
DIP and SOIC packages.
The SSM2163 is an ideal companion product to the Analog
Devices family of stereo codecs in high performance multimedia systems requiring mixing of multiple signals.
Total harmonic distortion plus noise is 0.007% at 1 kHz with all
levels set at unity gain.
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
Logic Input LO0.8V
Logic Input HI2.0V
Logic Input CurrentLogic LO or HI1µA
Logic Out LOI
Logic Out HII
= 0.2 mA0.4V
OUT
= 0.2 mA2.4V
OUT
Timing CharacteristicsSee Timing Diagram
REFERENCE (ACOM)
Output VoltageV
= +10 V (Single Supply)4.75.05.3V
S
Output Impedance10Ω
Load Regulation–0.5 mA ≤ IL ≤ +0.5 mA (Single Supply)0.2%
POWER SUPPLIES
Supply Voltage RangeDual Supply±4±7V
Single Supply+5+14V
Supply CurrentV
= +10 V (Single Supply)815mA
S
Power Supply Rejection RatioDelta Gain0.005dB/V
Specifications subject to change without notice.
–2–
REV. 0
Timing Description
Timing
SymbolDescriptionMinTypMaxUnits
SSM2163
t
t
t
t
t
t
t
t
t
t
t
CL
CH
DS
DH
CW
WC
LW
WL
L
W3
PD
Input Clock Pulse Width50ns
Input Clock Pulse Width50ns
Data Setup Time25ns
Data Hold Time35ns
Positive CLK Edge to End of Write25ns
Write to Clock Setup Time35ns
End of Load Pulse to Next Write20ns
End of Write to Start of Load20ns
Load Pulse Width250ns
Load Pulse Width (3-Wire Mode)250ns
Propagation Delay from Rising1080160ns
Clock to SDO Transition
(RL = 220 kΩ, CL = 20 pF)
NOTES
1. An idle HI (CLK-HI) or idle LO (CLK-LO) clock may be used. Data is latched on the positive
edge.
2. For SPI or microwire three-wire bus operation, tie LD to WRITE and use WRITE pulse to drive
both pins. (This generates an automatic internal LD signal.)
3. If an idle HI clock is used, tCW and tWL are measured from the final negative transition to the idle
state.
4. The first data byte selects an address (MSB HI), and subsequent MSB LO states set gain levels. Refer to the Address/Data Decoding Truth Table.
Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operation section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
2
θJA is specified for worst-case conditions, i.e., θJA is specified for device in socket
for P-DIP and device soldered in circuit board for SOIC package.
PIN CONFIGURATIONS
Epoxy Plastic DIP (P-Suffix)
and SOIC (S-Suffix)
ORDERING GUIDE
TemperaturePackagePackage
ModelRangeDescriptionOption
SSM2163P–40°C to +85°CPlastic DIPN-28
SSM2163S–40 °C to +85°CSOICR-28
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the SSM2163 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
–5–
REV. 0
WARNING!
ESD SENSITIVE DEVICE
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