Analog Devices DAC8222 Datasheet

Dual 12-Bit Double-Buffered

a

FEATURES
Two Matched 12-Bit DACs on One Chip
Direct Parallel Load of All 12 Bits for High Data

Throughput
Double-Buffered Digital Inputs
12-Bit Endpoint Linearity (ⴞ1/2 LSB) Over Temperature
+5 V to +15 V Single Supply Operation
DACs Matched to 1% Max
Four-Quadrant Multiplication
Improved ESD Resistance
Packaged in a Narrow 0.3" 24-Lead DIP and 0.3"

24- Lead SOL Package
Available in Die Form

APPLICATIONS
Automatic Test Equipment
Robotics/Process Control/Automation
Digital Gain/Attenuation Control
Ideal for Battery-Operated Equipment

Multiplying CMOS D/A Converter

DAC8222

FUNCTIONAL DIAGRAM

GENERAL DESCRIPTION

The DAC8222 is a dual 12-bit, double-buffered, CMOS digital­to-analog converter. It has a 12-bit wide data port that allows a
12-bit word to be loaded directly. This achieves faster through­put time in stand-alone systems or when interfacing to a 16-bit
processor. A common 12-bit input TTL/CMOS compatible
data port is used to load the 12-bit word into either of the two
DACs. This port, whose data loading is similar to that of a RAM’s
write cycle, interfaces directly with most 12-bit and 16-bit bus
systems. (See DAC8248 for a complete 8-bit data bus interface
product.) A common bus allows the DAC8222 to be packaged
in a narrow 24-lead 0.3" DIP and save PCB space.

The DAC is controlled with two signals, WR and LDAC. With
logic low at these inputs, the DAC registers become transparent.
This allows direct unbuffered data to flow directly to either
DAC output selected by DAC A/DAC B. Also, the DAC’s

double-buffered digital inputs will allow both DACs to be
simultaneously updated.

DAC8222’s monolithic construction offers excellent DAC-to­DAC matching and tracking over the full operating tempera­ture range. The chip consists of two thin-film R-2R resistor
ladder networks, four 12-bit registers, and DAC control logic
circuitry. The device has separate reference-input and feedback
resistors for each DAC and operates on a single supply from
+5 V to +15 V. Maximum power dissipation at +5 V using
zero or V

The DAC8222 is manufactured with highly stable thin-film re­sistors on an advanced oxide-isolated, silicon-gate, CMOS
technology. Improved latch-up resistant design eliminates the
need for external protective Schottky diodes.

logic levels is less than 0.5 mW.

DD

REV. C

Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] World Wide Web Site: http://www.analog.com
Fax: [phone] © Analog Devices, Inc., 2000

DAC8222–SPECIFICATIONS

ELECTRICAL CHARACTERISTICS

(@ VDD = +5 V or +15 V, V

REF A

= V

= +10 V, V

REF B

OUT A

= V

= 0 V; AGND = DGND = 0 V;

OUT B

TA = Full Temperature Range Specified in Absolute Maximum Ratings; unless otherwise noted. Specifications apply for DAC A and DAC B.)

Parameter Symbol Conditions Min Typ Max Units

STATIC ACCURACY

Resolution N 12 Bits
Relative Accuracy INL Endpoint Linearity Error DAC8222A/E/G ±1/2 LSB

Differential Nonlinearity DNL All Grades are Guaranteed Monotonic ±1 LSB
Full-Scale Gain Error

1

G

DAC8222A/E ±1 LSB

FSE

DAC8222G ±2 LSB
DAC8222F/H ±4 LSB

Gain Temperature Coefficient

∆Gain/∆Temperature TCG

Output Leakage Current

(Pin 2), I

I

OUT A

(Pin 24) 0000 0000 0000 TA = Full Temp. Range ±50 nA

I

OUT B

Input Resistance

(V

REF A

, V

)R

REF B

Input Resistance Match

LKG

∆R
R

REF

REF

(Notes 2, 7) ±2 ±5 ppm/°C

FS

All Digital Inputs = TA = +25°C ±5 ±10 nA

(Note 9) 8 11 15 kΩ

REF

DIGITAL INPUTS

Digital Input High V

Digital Input Low V

Input Current I

Input Capacitance

2

INH

INL

IN

C

IN

VDD = +5 V 2.4 V

= +15 V 13.5 V

V

DD

VDD = +5 V 0.8 V

= +15 V 1.5 V

V

DD

VIN = 0 V or V
and V

INL

DB0–DB11 10 pF

or V

DD

INH

WR, LDAC, DAC A/DAC B 15 pF

POWER SUPPLY

Supply Current I

DD

All Digital Inputs V
All Digital Inputs 0 V or V

DC Power Supply
Rejection Ratio PSRR ∆V
(∆Gain/∆VDD)

AC PERFORMANCE CHARACTERISTICS

Propagation Delay
Current Settling Time
Output Capacitance C

AC Feedthrough at FT

or I

I

OUT A

SWITCHING CHARACTERISTICS

DAC Select to t
Write Set-Up Time
DAC Select to t
Write Hold Time
LDAC to t
Write Set-Up Time
LDAC to t
Write Hold Time
Data Valid to t
Write Set-Up Time
Data Valid to t
Write Hold Time
Write Pulse Width t
LDAC Pulse Width t

NOTES

11

Measured using internal R

12

Guaranteed and not tested.

13

See timing diagram.

14

From 50% of digital input to 90% of final analog output current.

V

= V

REF A

15

WR, LDAC = 0 V; DB0–DB11 = 0 V to VDD or VDD to 0 V.

REF B

4, 5

5, 6

OUT B

and R

FB A

= +10 V; OUT A, OUT B load = 100 Ω, C

t

PD

t

S

O

A

FT

B

2, 3

AS

AH

LS

LH

DS

DH

WR

LWD

. Both DAC digital inputs = 1111 1111 1111.

FB B

= ±5% 0.002 %/%

DD

2

TA = +25°C 350 ns
TA = +25°C1µs
Digital Inputs = All 0s 90 pF

, C

C

OUT A

OUT A

REF A

REF B

EXT

OUT B

, C

OUT B

to I

OUT A

to I

OUT B

= 13 pF.

; V

; V

REF A

REF B

Digital Inputs = All 1s 120 pF
C
V
f = 100 kHz; TA = +25°C –70 dB
V
f = 100 kHz; TA = +25°C –70 dB

DAC8222F/H ±1 LSB

±0.2 ±1%

TA = +25°C ±0.001 ±1 µA
TA = Full Temp. Range ±10 µA

INL

or V

DD

INH

10 100 µA

2mA

90 pF

120 pF

= 20 V p-p; –70 dB

= 20 V p-p; –70 dB

+25°C–40°C to +85°C

VDD = +5 V VDD = +15 V

8

–55°C to +125°C All Temps

10

150 180 210 60 ns min

0 0 0 0 ns min

80 100 120 60 ns min

20 20 20 20 ns min

220 240 260 100 ns min

00 0 10 ns min

130 160 170 90 ns min
100 120 130 60 ns min

16

Settling time is measured from 50% of the digital input change to where the

output voltage settles within 1/2 LSB of full scale.

17

Gain TC is measured from +25°C to T

18

These limits apply for the commercial and industrial grade products.

19

Absolute temperature coefficient is approximately +50 ppm/°C.

10

These limits also apply as typical values for VDD = +12 V with +5 V CMOS
logic levels and T

Specifications subject to change without notice.

= +25°C.

A

–2–

or from +25°C to T

MIN

MAX

.

REV. C

DAC8222

WARNING!

ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS

(TA = +25°C, unless otherwise noted.)

VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, +17 V

to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, +17 V

V

DD

AGND to DGND . . . . . . . . . . . . . . . . . . –0.3 V, V

Digital Input Voltage to DGND . . . . . . . –0.3 V, V

, I

I

OUTA

V

REFA

V

RFBA

to AGND . . . . . . . . . . . . . . –0.3 V, VDD +0.3 V

OUTB

, V

to AGND . . . . . . . . . . . . . . . . . . . . . . . . . ±25 V

REFB

, V

to AGND . . . . . . . . . . . . . . . . . . . . . . . . . ±25 V

RFBB

+0.3 V

DD

+0.3 V

DD

Operating Temperature Range

AW Version . . . . . . . . . . . . . . . . . . . . . . . –55°C to +125°C

EW, FW, FP Versions . . . . . . . . . . . . . . . . –40°C to +85°C

GP, HP, HS Versions . . . . . . . . . . . . . . . . . . . 0°C to +70°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . .+150°C

Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C

Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . .+300°C

Package Type ␪

1

JA

␪

JC

Units

24-Lead Hermetic DIP (W) 69 10 °C/W
24-Lead Plastic DIP (P) 62 32 °C/W
24-Lead SOL (S) 72 24 °C/W

NOTE

1

θJA is specified for worst-case mounting conditions, i.e., qJA is specified for

device in socket for Cerdip, and P-DIP packages; JA is specified for device
soldered to printed circuit board for SO package.

CAUTION

1. Do not apply voltages higher than VDD or less than GND

potential on any terminal except V

and RFB.

REF

2. The digital control inputs are Zener-protected; however,

permanent damage may occur on unprotected units from
high-energy electrostatic fields. Keep units in conductive
foam at all times until ready to use.

3. Do not insert this device into powered sockets; remove

power before insertion or removal.

4. Use proper antistatic handling procedures.

5. Devices can suffer permanent damage and/or reliability deg-

radation if stressed above the limits listed under Absolute
Maximum Ratings for extended periods.

PIN CONNECTIONS

24-Lead 0.3" Cerdip
24-Lead Plastic DIP

24-Lead SOL

28-Terminal LCC

NC = NO CONNECT

ORDERING GUIDE

INL GFSE Temperature Package Package

Model (LSB) (LSB) Range Description Option

DAC8222EW ±1/2 ±1 –40°C to +85°C Cerdip-24 Q-24
DAC8222GP ±1/2 ±20°C to +70°C P-DIP-24 N-24
DAC8222BTC/883* ±1 ± 4 –55°C to +125°C LCC-28 E-28A
DAC8222FW ±1 ± 4 –40°C to +85°C Cerdip-24 Q-24
DAC8222FP ±1 ± 4 –40°C to +85°C P-DIP-24 N-24
DAC8222FS ± 1 ± 4 –40°C to +85°C SOL-24 R-24

*Consult factory for DAC8222/883 MIL-STD data sheet.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the DAC8222 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.

REV. C

–3–

DAC8222

DICE CHARACTERISTICS

DIE SIZE 0.124 × 0.132 inch, 16,368 sq. mils

×

3.55 mm, 10.56 sq. mm)

(3.15

11. AGND 13. DB4

12. I

13. R

14. V

OUT A

FB A

REF A

14. DB3

15. DB2

16. DB1

15. DGND 17. DB0 (LSB)

16. DB11(MSB) 18. DAC A/DAC B

17. DB10 19.

LDAC

18. DB9 20. WR

19. DB8 21. V

10. DB7 22. V

11. DB6 23. R

12. DB5 24. I

DD

REF B

FB B

OUT B

Substrate (die backside) is internally connected to VDD.

WAFER TEST LIMITS

(@ VDD = +5 V or +15 V, V

REF A

= V

= +10 V, V

REF B

OUT A

= V

= 0 V; AGND = DGND = 0 V; TA = +25ⴗC)

OUT B

DAC8222G

Parameter Symbol Conditions Limit Units

Relative Accuracy INL Endpoint Linearity Error ±1LSB max
Differential Nonlinearity DNL All Grades are Guaranteed Monotonic ± 1LSB max
Full Scale Gain Error

1

G

FSE

Digital Inputs = 1111 1111 1111 ±4LSB max

Output Leakage Digital Inputs = 0000 0000 0000 ±50 nA max

(I

, I

OUT A

)I

OUT B

LKG

Pads 2 and 24

Input Resistance

, V

(V

REF A

Input Resistance Match ∆R

Digital Input High V

Digital Input Low V

Digital Input Current I
Supply Current I

)R

REF B

REF

REF

R

REF

INH

INL

IN

DD

DC Supply Rejection PSR ∆V

Pads 4 and 22 8/15 kΩ max

±1% max

VDD = +5 V 2.4 V min
V

= +15 V 13.5 V min

DD

VDD = +5 V 0.8 V max
V

= +15 V 1.5 V min

DD

VIN = 0 V or VDD; V
All Digital Inputs V
All Digital Inputs 0 V or V

= ±5% 0.002 %/% max

DD

INL

INL

or V

or V

DD

INH

INH

±1 µA max
2

0.1 mA max

(∆Gain/∆VDD)

NOTES

1

Measured using internal R
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.

FB A

and R

FB B

.

–4–

REV. C

TYPICAL PERFORMANCE CHARACTERISTICS

DAC8222

Figure 1. Channel-to-Channel Match­ing (DAC A and B are Superimposed)

Figure 4. Nonlinearity vs. V

REF

Figure 2. Differential Nonlinearity
vs. V

REF

Figure 5. Nonlinearity vs. V

REF

Figure 3. Differential Nonlinearity
vs. V

REF

Figure 6. Nonlinearity vs. V

DD

Figure 7. Nonlinearity vs. Code
(DAC A and B are Superimposed)

REV. C

Figure 8. Nonlinearity vs. Code at T

A

= –55°C, +25°C, +125°C for DAC A and
B (All Superimposed)

–5–

Figure 9. Absolute Gain Error
Changes vs. V

REF