Analog Devices AD7305, AD7304 Datasheet

+3 V/+5 V, Rail-to-Rail
a
FEATURES Four 8-Bit DACs in One Package +3 V, +5 V and 5 V Operation Rail-to-Rail REF-Input to Voltage Output Swing
2.6 MHz Reference Multiplying Bandwidth Compact 1.1 mm Height TSSOP 16-/20-Lead Package Internal Power ON Reset SPI Serial Interface Compatible—AD7304 Fast Parallel Interface—AD7305 40 A Power Shutdown
APPLICATIONS Automotive Output Span Voltage Instrumentation, Digitally Controlled Calibration Pin-Compatible AD7226 Replacement when V
GENERAL DESCRIPTION
The AD7304/AD7305 are quad, 8-bit DACs that operate from a single +3 V to +5 V supply or ±5 V supplies. The AD7304 has a serial interface, while the AD7305 has a parallel interface. Inter­nal precision buffers swing rail-to-rail. The reference input range includes both supply rails allowing for positive or negative full­scale output voltages. Operation is guaranteed over the supply voltage range of +2.7 V to +5.5 V, consuming less than 9 mW from a +3 V supply.
The full-scale voltage output is determined by the external refer­ence input voltage applied. The rail-to-rail V V
allows for a full-scale voltage set equal the positive supply
OUT
V
, the negative supply VSS or any value in between.
DD
input to DAC
REF
The AD7304’s doubled-buffered serial-data interface offers high speed, three-wire, SPI and microcontroller compatible inputs using data in (SDI), clock (CLK) and chip select (CS) pins. Additionally, an internal power-on reset sets the output to zero scale.
The parallel input AD7305 uses a standard address decode along with the WR control line to load data into the input regis­ters. The double buffered architecture allows all four input registers to be preloaded with new values, followed by a LDAC control strobe which copies all the new data into the DAC regis­ters thereby updating the analog output values. When operating from less than +5.5 V, the AD7305 is pin-compatible with the popular industry standard AD7226.
< 5.5 V
DD
Quad, 8-Bit DAC
AD7304/AD7305*
FUNCTIONAL BLOCK DIAGRAMS
V
B V
REF
REF
DAC A
DAC B
DAC C
DAC D
DAC A
DAC B
DAC C
DAC D
V
SS
A
AD7304
D
AD7305
GND
V
A
OUT
V
B
OUT
V
C
OUT
V
D
OUT
V
A
OUT
V
B
OUT
V
C
OUT
V
D
OUT
CS
SDI/SHDN
CLK
DB0 DB1 DB2 DB3 DB4 DB5 DB6
WR
A0/SHDN
A1
V
DD
PWR ON
RESET
SERIAL
REG
V
SS
PWR ON
RESET
DECODE
8 8
INPUT REG A
8
GND
V
DD
8
INPUT REG B
INPUT REG C
INPUT REG D
INPUT
REG A
INPUT REG B
INPUT REG C
INPUT REG D
8 8
8 8
8 8
CLR
8
8
8
8 8
DAC A
REG
DAC B
REG
DAC C
REG
DAC D
REG
LDAC
DAC A
REG
DAC B
REG
DAC C
REG
DAC D
REG
LDAC
REF
V
REFCVREF
V
8
8
8
An internal power ON reset places both parts in the zero-scale state at turn ON. A 40 µA power shutdown (SHDN) feature is activated on both parts by tristating the SDI/SHDN pin on the AD7304, and tristating the A0/SHDN address pin on the AD7305.
The AD7304/AD7305 are specified over the extended industrial (–40°C to +85°C), and the automotive (–40°C to +125°C) temperature ranges. AD7304s are available in 16-lead plastic DIP (N-16), and wide-body SOL-16 (R-16) packages. The parallel input AD7305 is available in the 20-lead plastic DIP (N-20), and the SOL-20 (R-20) surface mount package. For ultracompact applications the thin 1.1 mm TSSOP-16 (RU-16) package will be available for the AD7304, while the TSSOP-20 (RU-20) will house the AD7305.
*Protected under Patent Number 5684481.
REV. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 1998
(@ V
= +3 V or +5 V, VSS = 0 V; or VDD = +5 V and VSS = –5 V, V
DD
V
AD7304/AD7305–SPECIFICATIONS
VDD, –40C < TA < +85C/+125C, unless otherwise noted.)
REF
Parameter Symbol Condition 3 V 10% 5 V 10% 5 V 10% Units
STATIC PERFORMANCE
Resolution Integral Nonlinearity Differential Nonlinearity DNL Monotonic, All Codes 0 to FF Zero-Scale Error V Full-Scale Voltage Error V Full-Scale Tempco
1
2
3
N 8 8 8 Bits INL ±1 ±1 ±1 LSB max
±1 ±1 ±1 LSB max 15 15 ± 15 mV max ±4 ±4 ±4 LSB max 55 5 ppm/°C typ
ZSE
FSE
TCV
Data = 00 Data = FF
FS
H
H
H
REFERENCE INPUT
V
Range V
REFIN
Input Resistance (AD7304) R Input Resistance (AD7305) R Input Capacitance
3
C
REFIN
REFIN
REFIN
REFIN
Code = 55
H
All DACs at Code = 55
H
VSS/V
DDVSS/VDD
VSS/V
DD
V min/max
28 28 28 k typ
7.5 7.5 7.5 k typ 5 5 5 pF typ
ANALOG OUTPUTS
Output Voltage Range V Output Current Drive I Shutdown Resistance R Capacitive Load
3
C
OUT
OUT
OUT
L
Code = 80H, ∆V
< 1 LSB ± 3 ±3 ±3 mA typ
OUT
DAC Outputs Placed in Shutdown State 120 120 120 k typ No Oscillation 200 200 200 pF typ
VSS/V
DDVSS/VDD
VSS/V
DD
V min/max
LOGIC INPUTS
Logic Input Low Voltage V Logic Input High Voltage V Input Leakage Current Input Capacitance
AC CHARACTERISTICS
5
3
3
IL
IH
I
IL
C
IL
Output Slew Rate SR Code = 00H to FFH to 00 Reference Multiplying BW Small Signal, V Total Harmonic Distortion THD V Settling Time Shutdown Recovery Time t Time to Shutdown t
6
t
S
SDR
SDN
= 4 V p-p, VSS = –5 V, f = 1 kHz 0.025 %
REF
To ±0.1% of Full Scale 1.1/2 1.0/2 1.0/2 µs typ/max To ±0.1% of Full Scale 2 2 2 µs max
= –5 V 2.6 MHz typ
SS
H
0.6 0.8 0.8 V min
2.1 2.4 2.4 V max ±10 ±10 ± 10 µA max 8 8 8 pF max
1/2.7 1/3.6 1/3.6 V/µs min/typ
15 15 15 µs typ
DAC Glitch Q 15 15 15 nVs typ Digital Feedthrough Q 2 2 2 nVs typ Feedthrough V
OUT/VREF
Code = 00H, V
=1 V p-p, f = 100 kHz –65 dB
REF
SUPPLY CHARACTERISTICS
Positive Supply Current I Negative Supply Current I Power Dissipation P Power Down I
DD
SS
DISS
DD_SD
V
= 0 V or VDD, No Load 6 6 6 mA max
LOGIC
VSS = –5 V 6 mA max V
= 0 V or VDD, No Load 15 30 60 mW max
LOGIC
SDI/SHDN = Floating 40 40 40 µA typ
Power Supply Sensitivity PSS ∆VDD = ±10% 0.004 0.004 0.004 %/%
NOTES
1
One LSB = V
2
The first three codes (00H, 01H, 10H) are excluded from the integral nonlinearity error measurement in single supply operation +3 V or +5 V.
3
These parameters are guaranteed by design and not subject to production testing.
4
Typicals represent average readings measured at +25°C.
5
SDI/SHDN and A0/SHDN pins have 30 µA maximum IIL input leakage current.
6
The settling time specification does not apply for negative going transitions within the last 3 LSBs of ground in single supply operation.
Specifications subject to change without notice.
REF
/256.
SS
4
5V
V
= 10V p-p
REF
f = 20kHz
5V
0V
V
= 10V p-p
OUT
–5V
(OUT) (IN)
0V
–5V
Figure 1. AD7304/AD7305 Rail-to-Rail Reference Input to Output at 20 kHz
–2–
REV. A
AD7304/AD7305
WARNING!
ESD SENSITIVE DEVICE
TIMING SPECIFICATIONS
(@ VDD = +3 V or +5 V, VSS = 0 V; or VDD = +5 V and VSS = –5 V, V +85C/125C, unless otherwise noted.)
V
VDD, –40C < TA <
SS
REF
Parameter Symbol 3 V  10% 5 V  10% 5 V  10% Units
INTERFACE TIMING SPECIFICATIONS
1, 2
AD7304 Only
Clock Width High t Clock Width Low t Data Setup t Data Hold t Load Pulsewidth t Load Setup t Load Hold t Clear Pulsewidth t Select t Deselect t
CH
CL
DS
DH
LDW
LD1
LD2
CLWR
CSS
CSH
70 55 55 ns min 70 55 55 ns min 50 40 40 ns min 30 20 20 ns min 70 60 60 ns min 40 30 30 ns min 40 30 30 ns min 60 60 60 ns min 30 20 20 ns min 60 40 40 ns min
AD7305 Only
Data Setup t Data Hold t Address Setup t Address Hold t Write Width t Load Pulsewidth t Load Setup t Load Hold t
NOTES
1
These parameters are guaranteed by design and not subject to production testing.
2
All input control signals are specified with tR = tF = 2 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V.
DS
DH
AS
AH
WR
LDW
LS
LH
ABSOLUTE MAXIMUM RATINGS*
60 40 40 ns min 30 20 20 ns min 60 40 40 ns min 30 20 20 ns min 60 50 50 ns min 60 50 50 ns min 60 40 40 ns min 30 20 20 ns min
ORDERING GUIDE
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +8 V
V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V, –8 V
SS
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, V
V
REFX
Logic Inputs to GND . . . . . . . . . . . . . . . –0.3 V, V
V
to GND . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
OUTX
Short Circuit to GND . . . . . . . . . . . . . . . . . . . . . 50 mA
I
OUT
Package Power Dissipation . . . . . . . . . . . . . . (T
Thermal Resistance θ
JA
+ 0.3 V
DD
J MAX–TA
16-Lead Plastic DIP Package (N-16) . . . . . . . . . . 103°C/W
16-Lead SOIC Package (R-16) . . . . . . . . . . . . . . . 73°C/W
TSSOP-16 Package (RU-16) . . . . . . . . . . . . . . . . 180°C/W
20-Lead Plastic DIP Package (N-20) . . . . . . . . . . 120°C/W
20-Lead SOIC Package (R-20) . . . . . . . . . . . . . . . 74°C/W
TSSOP-20 Package (RU-20) . . . . . . . . . . . . . . . . 155°C/W
Maximum Junction Temperature (T
) . . . . . . . . .+150°C
J MAX
)/θ
DD
Model Range Description Options
AD7304BN –40°C/+85°C 16-Lead P-DIP N-16 AD7304BR –40°C/+85°C 16-Lead SOIC R-16 AD7304YR –40°C/+125°C 16-Lead SOIC R-16
JA
AD7304BRU –40°C/+85°C TSSOP-16 RU-16 AD7305BN –40°C/+85°C 20-Lead P-DIP N-20
AD7305BR –40°C/+85°C 20-Lead SOIC R-20 AD7305YR –40°C/+125°C 20-Lead SOIC R-20 AD7305BRU –40°C/+85°C TSSOP-20 RU-20
The AD7304/AD7305 contains 2759 transistors. Die size: 103 mil × 102 mil, 10,506 sq mil.
Temperature Package Package
Operating Temperature Range . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature
N-16 and N-20 (Soldering, 10 secs) . . . . . . . . . . . .+300°C
R-16, R-20, RU-16, RU-20 (Vapor Phase, 60 secs) . . +215°C
R-16, R-20, RU-16, RU-20 (Infrared, 15 secs) . . . .+220°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7304/AD7305 features proprietary ESD protection circuitry, permanent dam­age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
REV. A
–3–
AD7304/AD7305
V
LDAC
LDAC
OUT
SDI
CLK
CS
SDI
CLK
CLR
SA SI A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
t
CSS
t
LD1
tDSt
t
CL
FS
ZS
DH
t
CH
t
LDW
t
S
t
CSH
1 LSB
ERROR BAND
t
LD2
t
CLRW
t
S
Figure 2. AD7304 Timing Diagram
t
SDN
SDI/SHDN
t
SDR
I
DD
Figure 3. AD7304 Timing Diagram
Table I. AD7304 Control Logic Truth Table
CS CLK LDAC CLR Serial Shift Register Function Input REG Function DAC Register Function
H X H H No Effect No Effect No Effect L + H H Data Advanced 1 Bit No Effect No Effect + L H H No Effect Updated with SR Contents H X L H No Effect Latched with SR Contents HXH No Effect Loaded with 00 HXH + No Effect Latched with 00
NOTES
1
+ positive logic transition; – negative logic transition; X Don’t Care.
2
One Input Register receives the data bits D7–D0 decoded from the SR address bits (A1, A0); where REG A = (0, 0); B = (0, 1); C = (1, 0); D = (1, 1).
3
LDAC is a level-sensitive input.
H
H
2
No Effect
2
All Input Register Contents Transferred Loaded with 00 Latched with 00
H
H
Table II. AD7304 Serial Input Register Data Format, Data Is Loaded in the MSB-First Format
MSB LSB B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
AD7304 SAC SDC A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
If B11 (SAC), Shutdown All Channels, is set to logic LOW, all DACs are placed in a power shutdown mode, all output voltages become high resistance. If B10 (SDC), Shutdown Decoded Channel, is set to logic LOW, only the DAC decoded by address bits A1 and A0 is placed in the shutdown mode.
3
–4–
REV. A
AD7304/AD7305
Table III. AD7305 Control Logic Truth Table
WR A1 A0 LDAC Input Register Function DAC Register Function
LLLH REG A Loaded with DB0–DB7 Latched with Previous Contents, No Change + L L H REG A Latched with DB0–DB7 Latched with Previous Contents, No Change L L H H REG B Loaded with DB0–DB7 Latched with Previous Contents, No Change + L H H REG B Latched with DB0–DB7 Latched with Previous Contents, No Change L H L H REG C Loaded with DB0–DB7 Latched with Previous Contents, No Change + H L H REG C Latched with DB0–DB7 Latched with Previous Contents, No Change L H H H REG D Loaded with DB0–DB7 Latched with Previous Contents, No Change + H H H REG D Latched with DB0–DB7 Latched with Previous Contents, No Change H X X L No Effect All Input Register Contents Loaded, Register Transparent L X X L Input REG x Transparent to DB0–DB7 Register Transparent HXX+ No Effect All Input Register Contents Latched H X X H No Effect, Device Not Selected No Effect, Device Not Selected
NOTES
1
+ positive logic transition; – negative logic transition; X Don’t Care.
2
LDAC is a level sensitive input.
PIN CONFIGURATIONS
A0/SHDN
I
t
WR
WR
t
t
AS
AH
A0, A1
t
t
DS
DH
D0–D7
LDAC
V
OUT
t
LS
t
LH
t
S
Figure 4. AD7305 Timing Diagram
t
SDN
DD
Figure 5. AD7305 Timing Diagram
t
LDW
1 LSB
ERROR BAND
t
SDR
V
OUT
V
OUT
V
REF
V
REF
GND
LDAC
V
CLR
SS
1
B
2
A
3
4
A
5
B
6
7
8
AD7304
TOP VIEW
(Not to Scale)
16
V
V
15
14
V
13
V
12
V
11
SDI/SHDN
10
CLK
9
CS
OUT
OUT
DD
REF
REF
1
V
B
OUT
2
V
C
D
C
D
OUT
V
V
REF
GND
LDAC
DB7
DB6
DB5
DB4
A
SS
10
3
4
5
AD7305
TOP VIEW
6
(Not to Scale)
7
8
9
20
19
18
17
16
15
14
13
12
11
V
C
OUT
V
D
OUT
V
DD
A0/SHDN
A1
WR
DB0
DB1
DB2
DB3
REV. A
–5–
AD7304/AD7305
AD7304 PIN FUNCTION DESCRIPTIONS
Pin # Name Function
1V
B Channel B rail-to-rail buffered DAC voltage output. Full scale set by reference voltage applied to V
OUT
is open circuit when SHDN is enabled.
2V
A Channel A rail-to-rail buffered DAC voltage output. Full scale set by reference voltage applied to V
OUT
is open circuit when SHDN is enabled. 3VSSNegative Power Supply Input. Specified range of operation 0 V to –5.5 V. 4V 5V
A Channel A Reference Input. Establishes V
REF
B Channel B Reference Input. Establishes V
REF
A full-scale voltage. Specified range of operation V
OUT
B full-scale voltage. Specified range of operation V
OUT
SS
SS
6 GND Common Analog and Digital Ground. 7 LDAC Load DAC register strobe, active low. Transfers all four Input Register data into their DAC registers. Asynchronous
active low input. DAC Register is transparent when LDAC = 0. See Control Logic Truth Table for operation. 8 CLR Clears all Input and DAC registers to the zero condition. Asynchronous active low input. The serial register is not effected . 9 CS Chip Select, Active Low Input. Disables shift register loading when high. Transfers Serial Input Register Data to the
decoded Input Register when CS returns HIGH. Does not effect LDAC operation. 10 CLK Clock input, positive edge clocks data into shift register. Disabled by chip select CS. 11 SDI/SHDN Serial Data-Input loads directly into the shift register, MSB first. Hardware shutdown (SHDN) control input, active
when pin is left floating by a three-state logic driver. Does not effect DAC register contents as long as power is
DD
.
D full-scale voltage. Specified range of operation V
OUT
C full-scale voltage. Specified range of operation V
OUT
SS
SS
12 V 13 V 14 V 15 V
present on V
D Channel D Reference Input. Establishes V
REF
C Channel C Reference Input. Establishes V
REF
DD
D Channel D rail-to-rail buffered DAC voltage output. Full-scale set by reference voltage applied to V
OUT
Positive power supply input. Specified range of operation +2.7 V to +5.5 V.
is open circuit when SHDN is enabled. 16 V
C Channel C rail-to-rail buffered DAC voltage output. Full-scale set by reference voltage applied to V
OUT
is open circuit when SHDN is enabled.
< V < V
< V
< V
REF
REF
REF
REF
REF
REF
B pin. Output
A pin. Output
A < VDD. B < VDD.
D < VDD.
C < VDD.
D pin. Output
REF
C pin. Output
REF
AD7305 PIN FUNCTION DESCRIPTIONS
Pin # Name Function
1V
B Channel B rail-to-rail buffered DAC voltage output. Full scale set by reference voltage applied to V
OUT
B pin. Output
REF
is open circuit when SHDN is enabled. 2V
A Channel A rail-to-rail buffered DAC voltage output. Full scale set by reference voltage applied to V
OUT
A pin. Output
REF
is open circuit when SHDN is enabled. 3V 4V
SS
REF
Negative Power Supply Input. Specified range of operation 0 V to –5.5 V.
Channel B Reference Input. Establishes V
full-scale voltage. Specified range of operation V
OUT
SS
< V
REF
< VDD.
5 GND Common Analog and Digital Ground. 6 LDAC Load DAC register strobe, active low. Transfers all four Input Register data into their DAC registers. Asynchronous
active low input. DAC Register is transparent when LDAC = 0. See Control Logic Truth Table for operation. 7 DB7 MSB Digital Input Data Bit. 8 DB6 Data Bit 6. 9 DB5 Data Bit 5. 10 DB4 Data Bit 4. 11 DB3 Data Bit 3. 12 DB2 Data Bit 2. 13 DB1 Data Bit 1. 14 DB0 LSB Digital Input Data Bit. 15 WR Write data into Input Register control line, active low. See Control Logic Truth Table for operation. 16 A1 Address Bit 1. 17 A0/SHDN Address Bit 0/Hardware shutdown (SHDN) control input, active when pin is left floating by a three-state logic driver.
DD
.
D pin. Output
REF
18 V 19 V
Does not effect DAC register contents as long as power is present on V
DD
D Channel D rail-to-rail buffered DAC voltage output. Full scale set by reference voltage applied to V
OUT
Positive Power Supply Input. Specified range of operation +2.7 V to +5.5 V.
is open circuit when SHDN is enabled. 20 V
C Channel C rail-to-rail buffered DAC voltage output. Full scale set by reference voltage applied to V
OUT
C pin. Output
REF
is open circuit when SHDN is enabled.
–6–
REV. A
CODE – Decimal
0.500
–0.500
0 25632
DNL – LSB
64 96 128 160 192 224
0.375
0.000
0.125
0.250
0.375
0.250
0.125
VDD = +5V V
SS
= –5V
V
REF
= 2.5V
TEMPERATURE – C
4.0
3.6
2.0 –55 125–35
ZERO SCALE VOLTAGE – mV
–155 25456585105
3.2
2.8
2.4
VDD = +5.5V V
SS
= 0V
V
REF
= +5.45V
Typical Performance Characteristics–
AD7304/AD7305
144
120
96
72
SINK CURRENT – mA
48
OUT
I
24
0
0153
Figure 6. I
35
28
21
VDD = +5V V
= –5V
SS
V
= V
REF
DATA = 00
SINK vs. V
OUT
1.0
DD
H
6912
V
– mV
OUT
Rail-to-Rail Performance
OUT
VDD = +5V V
= –5V
SS
V
= V
REF
DD
DATA = FF
H
0.6
DAC D
0.2
INL – LSB
0.2
0.6
1.0
5.0 5.03.0
VDD = +5V V
= –5V
SS
DATA = 80 T
H
= +25C
A
REFERENCE INPUT VOLTAGE – Volts
DAC B
–1.0 1.0 3.0
DAC C
DAC A
Figure 9. INL vs. Reference Input Voltage
–14
SOURCE CURRENT – mA
OUT
I
–7
0
4.0 5.04.2
Figure 7. I
1
0
–1
1
0
–1
1
INL – LSB
0
–1
1
0
–1
Figure 8. INL vs. Code, All DAC Channels
SOURCE vs. V
OUT
025632
4.4 4.6 4.8
V
OUTPUT VOLTAGE – Volts
OUT
Rail-to-Rail Performance
OUT
DAC A
DAC B
DAC C
DAC D
64 96 128 160 192 224
CODE – Decimal
VDD = +5V V
= –5V
SS
V
= +2.5V
REF
T
= +25C
A
Figure 10. DNL vs. Code
Figure 11. Zero Scale Voltage vs. Temperature
REV. A
–7–
AD7304/AD7305
= +5V
V
DD
V
= +4V
V
OUT
CS
REF
DATA = 00
2s/DIV
H
FF
Figure 12. Large-Signal Settling Time
V
REFIN
(5V @
50kHz)
V
OUTA
H
DATA = FF
NO LOAD
RL = 70k
RL = 10k
0V
VDD = +5V C
= 150pF
L
5V
0V
5s/DIV
CS
V
OUT
Figure 15. Time to Shutdown
5V
H
0V
–5V
5V
0V
–5V
V
= +5V
DD
CS
I
DD
1mA/V
V
OUT
2s/DIV
Figure 13. Multiplying Mode Step Response and Output Slew Rate
6
4
0
GAIN – dB
4
6
8
10k 10M
FREQUENCY – Hz
f
–3dB
VDD = +5V V
= –5V
SS
DATA = FF V
= 100mV rms
REF
= 2.6MHz
1M100k
H
Figure 14. Multiplying Mode Gain vs. Frequency
Figure 16. Shutdown Recovery Time (Wakeup)
10
VDD = +5V V
= –5V
1
0.1
THD – %
0.010
0.001 10m 101
23456 789
V
AMPLITUDE – V p-p
REF
SS
Figure 17. THD vs. Reference Input Amplitude
A
–8–
REV. A
AD7304/AD7305
FREQUENCY – Hz
60
0
10 100
PSRR – dB
1k 100k
50
40
30
20
10
10k
DATA = 80
H
TA = +25C
+PSRR, VDD = +5V  10%
–PSRR, VSS = –5V 10%
+PSRR, VDD = +3V  10%
–PSRR, VSS = –3V 10%
1
0.1
THD – %
0.010
0.001 20 100k100
VDD = +5V V
= –5V
SS
1k 10k
FREQUENCY – Hz
A
Figure 18. THD vs. Frequency
3.0
VDD = +5V V
= –5V
SS
V
= 4V
2.4
1.8
1.2
NOISE DENSITY – V/ Hz
0.6
0
1 100k10
100 1k 10k
FREQUENCY – Hz
REF
DATA = FF
H
Figure 19. Output Noise Voltage Density vs. Frequency
VDD = +5V V
SS
V
V
OUT
CS
REF
F = 1MHz DATA = 80
Figure 21. Midscale Transition Glitch
40
VDD = +5V
20
= –5V
V
SS
V
= 50mV rms
REF
0
DAC A DATA = FF DAC B, C, D DATA = 00
20
40
60
80
CROSS TALK dB
100
120
140
160
100 10M1k
H
H
CT = 20 LOG
10k 1M
FREQUENCY – Hz
100k
Figure 22. Crosstalk vs. Frequency
= –5V
= 2.5V
H
7F
V
V
H
OUTB
REF
REV. A
V
OUTB
CLK
Figure 20. Digital Feedthrough
= +5V
V
DD
V
= –5V
SS
V
= 2.5V
REF
DAC A = FF DAC B = OO F = 2MHz
50ns/DIV
H
H
Figure 23. Power Supply Rejection vs. Frequency
–9–
AD7304/AD7305
12
VDD = +5V V
= –5V
10
8
6
4
SUPPLY CURRENT – mA
2
0
051
DIGITAL INPUT VOLTAGE – Volts
234
SS
V
= 2.5V
REF
A0 = 5V ALL OTHER DIGITAL PINS VARYING
I
DD
I
SS
Figure 24. Supply Current vs. Digital Input Voltage
10.0000
1.0000
VDD = +5V V
= –5V
SS
V
= 2.5V
REF
ALL DIGITAL PINS VARY, EXCEPT A0 = 5V
SS
0.1000
0.0100
SUPPLY CURRENT – mA
0.0010
I
DD
I
80
VDD = +5.5V V
= –5.5V
SS
70
V
= 2.5V
REF
PIN A0 FLOATING
60
50
40
SHUTDOWN SUPPLY – A
30
20
55 12535
155 25456585105
TEMPERATURE C
Figure 27. Shutdown Supply Current vs. Temperature
0.08
READING MADE AT TA = +25C SAMPLE SIZE = 924 UNITS
0.04
VDD = 2.7V
0
ERROR DRIFT – LSB
–0.04
NORMALIZED TOTAL UNADJUSTED
VDD = 5.5V
0.0001 051
234
DIGITAL INPUT VOLTAGE – Volts
Figure 25. Shutdown Supply Current vs. Digital Input Voltage (A0 Only)
5.0
VDD = +5V V
= –5V
SS
V
= 2.5V
REF
4.4
3.8
3.2
SUPPLY CURRENT – mA
2.6
2.0 –55 125–35
IDD AND I
SS
–155 25456585105
TEMPERATURE – C
Figure 26. Supply Current vs. Temperature
–0.08
084
168 252 336 420 504
DEGREES CELCIUS
Figure 28. Normalized TUE Drift Accelerated by Burn-In
°
Hours of Operation @ 150
C
–10–
REV. A
AD7304/AD7305
V
DD
V
SS
V
OUT
X
120k
Q1
Q2
CIRCUIT OPERATION
The AD7304/AD7305 are a set of four-channel, 8-bit, voltage­output, digital-to-analog converters differing primarily in digital logic interface and number of reference inputs. Both parts share the same internal DAC design and true rail-to-rail output buff­ers. The AD7304 contains four independent multiplying refer­ence inputs, while the AD7305 has one common reference input. The AD7304 uses a 3-wire SPI compatible serial data interface, while the AD7305 offers a 8-bit parallel data interface.
D/A Converter Section
Each part contains four voltage-switched R-2R ladder DACs. Figure A shows a typical equivalent DAC. These DACs are designed to operate both single-supply or dual supply, depend­ing on whether the user supplies a negative voltage on the V
SS
pin. In a single-supply application the VSS is tied to ground. In either mode the DAC output voltage is determined by the V
REF
input voltage and the digital data (D) loaded into the corre­sponding DAC register according to Equation 1.
V
= V
OUT
Note that the output full-scale polarity is the same as the V
× D/256 (1)
REF
REF
polarity for dc reference voltages.
V
DD
V
REF
DB7
DB6
DB0
V
2R
R
V
2R
2R
SS
2R
OUT
Figure 29. Typical Equivalent DAC Channel
These DACs are also designed to accommodate ac reference input signals. As long as the ac signals are maintained between
< V
V
SS
<VDD, the user can expect 50 kHz of full-power
REF
multiplying bandwidth performance. In order to use negative input reference voltages, the V
pin must be biased with a nega-
SS
tive voltage of equal or greater magnitude than the reference voltage.
The reference inputs are code-dependent, exhibiting worst case minimum resistance values specified in the parametric specifica­tion table. The DAC outputs V
A, B, C, D are each capable
OUT
of driving 2 k loads in parallel with up to 500 pF loads. Output source and sink current is shown in Figures 6 and 7. The output slew rate is nominally 3.6 V/µs while operating from ± 5 V sup- plies. The low output impedance of the buffers minimizes crosstalk between analog input channels. At 100 kHz, 65 dB of channel-to-channel isolation exists (Figure 22). Output voltage noise is plotted in Figure 19. In order to maintain good analog performance, power supply bypassing of 0.01 µF in parallel with 1 µF is recommended. The true rail-to-rail capability of the AD7304/AD7305 allows the user to connect the reference inputs
directly to the same supply as the V
or VSS pin (Figure 30).
DD
Under these conditions clean power supply voltages (low ripple, avoid switching supplies) appropriate for the application should be used.
Figure 30. Equivalent DAC Amplifier Output Circuit
AD7304 SERIAL DATA INTERFACE
The AD7304 uses a 3-wire (CS, SDI, CLK) SPI compatible serial data interface. New serial data is clocked into the serial input register in a 12-bit data-word format. MSB bits are loaded first. Table II defines the 12 data-word bits. Data is placed on the SDI/SHDN pin and clocked into the register on the positive clock edge of CLK subject to the data setup and data hold time requirements specified in the TIMING SPECIFICATIONS. Data can only be clocked in while the CS chip select pin is active low. Only the last 12-bits clocked into the serial register will be interrogated when the CS pin returns to the logic high state, extra data bits are ignored. Since most microcontrollers output serial data in 8-bit bytes, two right justified data bytes can be written to the AD7304. Keeping the CS line low between the first and second byte transfer will result in a successful serial register update.
Once the data is properly aligned in the shift register the positive edge of the CS initiates either the transfer of new data to the target DAC register, determined by the decoding of address bits A1 and A0, or the shutdown features will be activated based on the SAC or SDC bits. When either SAC or SDC pins are set (Logic = 0) the loading of new data determined by Bits B9 to B0 are still loaded, but the results do not appear on the buffer outputs until the device is brought out of the shutdown state. The selected DAC output voltages become high impedance with a nominal resistance of 120 k to ground, Figure 30. If both SAC and SDC pins are set, all channels are still placed in the shutdown mode. When the AD7304 has been programmed into the power shutdown state, the present DAC register data is maintained as long as V
remains greater than 2.7 volts. The
DD
remaining characteristics of the software serial interface are defined by Tables I, II and Figure 3 timing diagram.
Two additional pins CLR and LDAC on the AD7304 provide hardware control over the clear function and the DAC Register loading. If these functions are not needed the CLR pin can be tied to logic high, and the LDAC pin can be tied to logic low. The asynchronous input CLR pin forces all input and DAC registers to the zero-code state. The asynchronous LDAC pin can be strobed to active low when all DAC Registers need to be updated simultaneously from their respective Input Registers. The LDAC pin places the DAC Register in a transparent mode while in the logic low state.
REV. A
–11–
AD7304/AD7305
CLK
SDI
V
REFAVREFBVREFCVREF
EN
CS
D0 D1 D2 D3
8
D4 D5
DACA
D6 D7
A0
A1
SDC
SAC
640k680k
80k
2:4 DECODE
V
320k280k
GND
B
C
D
DD
INPUT
REGISTER
g
DQ
INPUT
REGISTER
g
DQ
INPUT
REGISTER
g
DQ
INPUT
REGISTER
g
DQ
POWER-
ON
RESET
AD7304
R
R
R
R
LDAC
D
DAC A
REGISTER
DAC B
REGISTER
DAC C
REGISTER
DAC D
REGISTER
V
DD
DAC A
OE
R
DAC B
OE
R
DAC C
OE
R
DAC D
OE
R
V
CLR
A
V
OUT
V
B
OUT
V
C
OUT
V
D
OUT
SS
Figure 31. AD7304 Equivalent Logic Interface
AD7304 Hardware Shutdown SHDN
If a three-state driver is used on the SDI/SHDN pin, the AD7304 can be placed into a power shutdown mode when the SDI/ SHDN pin is placed in a high impedance state. For proper operation no other termination voltages should be present on this pin. An internal window comparator will detect when the logic voltage on the SHDN pin is between 28% and 36% of
. A high impedance internal bias generator provides this
V
DD
voltage on the SHDN pin. The four DAC output voltages be­come high impedance with a nominal resistance of 120 k to ground. See Figure 30 for an equivalent circuit.
AD7304/AD7305 POWER ON RESET
When the VDD power supply is turned on, an internal reset strobe forces all the Input and DAC registers to the zero-code state. The V
power supply should have a monotonically in-
DD
creasing ramp in order to have consistent results, especially in the region of V
= 1.5 V to 2.3 V. The VSS supply has no effect
DD
on the power ON reset performance. The DAC register data will stay at zero until a valid serial register software load takes place. In the case of the double buffered AD7305 the output DAC register can only be changed once the LDAC strobe is initiated.
AD7305 PARALLEL DATA INTERFACE
The AD7305 has an 8-bit parallel interface DB7 = MSB, DB0 = LSB. Two address Bits A1 and A0 are decoded when an active low write strobe is placed on the WR pin, see Table III. The WR is a level-sensitive input pin, therefore the data setup and data hold times defined in the TIMING SPECIFICATIONS need to be adhered to.
The LDAC pin provides the capability of simultaneously updat­ing all DAC registers with new data from the Input Registers at
V
V
REF
DD
DATA
DB0–DB7
WR
A0/SHDN
8
640k
80k
280k
DAC A
2:4 DECODE
680k
320k
GND
B
C
D
V
DD
A1
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
POWER-
ON
RESET
AD7305
R
R
R
R
LDAC
DAC A
REGISTER
DAC B
REGISTER
DAC C
REGISTER
DAC D
REGISTER
DAC A
R
DAC B
R
DAC C
R
DAC D
R
V
A
OUT
OE
V
B
OUT
OE
V
C
OUT
OE
V
D
OUT
OE
V
SS
Figure 32. AD7305 Equivalent Logic Interface
the same time. This will result in the analog outputs all chang­ing to their new values at the same time. The LDAC pin is a level-sensitive input. If the simultaneous update feature is not required the LDAC pin can be tied to logic low. When the LDAC is tied to logic low, the DAC Registers become transpar­ent and the Input Register data determines the DAC output voltage. See Figure 32 for an equivalent interface logic diagram.
AD7226 Pin Compatibility
By tying the LDAC pin to ground, the AD7305 has the same pin out and functionality as the AD7226, with the exception of a lower power supply operating voltage.
AD7305 Hardware Shutdown SHDN
If a three state driver is used on the A0/SHDN pin, the AD7305 can be placed into a power shutdown mode when the A0/SHDN pin is placed in a high impedance state. For proper operation no other termination voltages should be present on this pin. An internal window comparator will detect when the logic voltage on the SHDN pin is between 28% and 36% of V
. A high
DD
impedance internal bias generator provides this voltage on the SHDN pin. The four DAC output voltages become high imped­ance with a nominal resistance of 120 k to ground.
ESD Protection Circuits
All logic input pins contain back-biased ESD protection Zeners connected to ground (GND). The V back-biased ESD protection Zener connected to V
pins also contain a
REF
DD
(see
Figure 33).
DIGITAL INPUTS
GND
V
DD
V
X
REF
Figure 33. Equivalent ESD Protection Circuits
–12–
REV. A
AD7304/AD7305
APPLICATIONS
The AD7304/AD7305 is inherently a 2-quadrant multiplying D/A converter. That is, it can easily be set up for unipolar out­put operation. The full-scale output polarity is the same as the reference input voltage polarity.
In some applications it may be necessary to generate the full 4-quadrant multiplying capability or a bipolar output swing. This is easily accomplished using an external true rail-to-rail op amp, such as the OP295. Connecting the external amplifier with two equal value resistors as shown in Figure 34 results in a full 4-quadrant multiplying circuit. In this circuit the amplifier pro­vides a gain of two, which increases the output span magnitude to 10 volts. The transfer equation of this circuit shows that both negative and positive output voltages are created as the input data (D) is incremented from code zero (V scale (V
= 0 V) to full scale (V
OUT
V
= (D/128 –1) × V
OUT
REF
= +5 V).
OUT
= –5 V) to mid-
OUT
(2)
+5V
10k 10k
REF
AD7304
–5V < V
OUT
< +5V
Figure 34. Four-Quadrant Multiplying Application Circuit
REV. A
–13–
AD7304/AD7305
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
0.0118 (0.30)
0.0040 (0.10)
0.210 (5.33) MAX
0.160 (4.06)
0.115 (2.93)
16-Lead Wide SOIC
(R-16)
0.4133 (10.50)
0.3977 (10.00)
16 9
0.2992 (7.60)
0.2914 (7.40)
81
PIN 1
0.0500 (1.27)
BSC
0.1043 (2.65)
0.0926 (2.35)
0.0192 (0.49)
0.0138 (0.35)
SEATING PLANE
16-Lead Plastic DIP
(N-16)
0.840 (21.33)
0.745 (18.93)
16
18
PIN 1
0.022 (0.558)
0.014 (0.356)
0.100 (2.54)
BSC
9
0.280 (7.11)
0.240 (6.10)
0.060 (1.52)
0.015 (0.38)
0.070 (1.77)
0.045 (1.15)
0.4193 (10.65)
0.3937 (10.00)
0.0125 (0.32)
0.0091 (0.23)
0.130 (3.30) MIN
SEATING PLANE
0.0291 (0.74)
0.0098 (0.25)
0.0500 (1.27)
8
0.0157 (0.40)
0
0.325 (8.25)
0.300 (7.62)
0.015 (0.381)
0.008 (0.204)
x 45
0.195 (4.95)
0.115 (2.93)
0.0118 (0.30)
0.0040 (0.10)
0.210 (5.33) MAX
0.160 (4.06)
0.115 (2.93)
20-Lead SOIC
(R-20)
0.5118 (13.00)
0.4961 (12.60)
20 11
0.2992 (7.60)
0.2914 (7.40)
PIN 1
0.0500 (1.27)
BSC
101
0.1043 (2.65)
0.0926 (2.35)
0.0192 (0.49)
0.0138 (0.35)
SEATING PLANE
0.4193 (10.65)
0.3937 (10.00)
0.0125 (0.32)
0.0091 (0.23)
20-Lead Plastic DIP
(N-20)
1.060 (26.90)
0.925 (23.50)
20
110
PIN 1
0.022 (0.558)
0.014 (0.356)
0.100 (2.54)
BSC
11
0.070 (1.77)
0.045 (1.15)
0.280 (7.11)
0.240 (6.10)
0.060 (1.52)
0.015 (0.38)
0.130 (3.30) MIN
SEATING PLANE
0.0291 (0.74)
0.0098 (0.25)
0.0500 (1.27)
8 0
0.0157 (0.40)
0.325 (8.25)
0.300 (7.62)
0.015 (0.381)
0.008 (0.204)
C3252a-2–2/98
x 45
0.195 (4.95)
0.115 (2.93)
0.177 (4.50)
0.006 (0.15)
0.002 (0.05)
SEATING
PLANE
0.201 (5.10)
0.193 (4.90)
16
0.169 (4.30)
1
PIN 1
0.0256 (0.65)
BSC
16-Lead TSSOP
(RU-16)
9
8
0.0118 (0.30)
0.0075 (0.19)
0.256 (6.50)
0.246 (6.25)
0.0433 (1.10) MAX
0.0079 (0.20)
0.0035 (0.090)
8 0
0.028 (0.70)
0.020 (0.50)
14
0.177 (4.50)
0.006 (0.15)
0.002 (0.05)
SEATING
PLANE
20-Lead Thin Surface Mount (TSSOP)
(RU-20)
0.260 (6.60)
0.252 (6.40)
20 11
0.169 (4.30)
1
PIN 1
0.0256 (0.65) BSC
0.0118 (0.30)
0.0075 (0.19)
10
0.256 (6.50)
0.246 (6.25)
0.0433 (1.10) MAX
0.0079 (0.20)
0.0035 (0.090)
8 0
0.028 (0.70)
0.020 (0.50)
PRINTED IN U.S.A.
REV. A
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