Analog Devices AD671SD-750, AD671SD-500, AD671KD-750, AD671KD-500, AD671JD-750 Datasheet

...
AIN BPO/UPO ENCODE REF IN ACOM DCOM
LATCHES
CORRECTION LOGIC
RANGE
SELECT
X4
4-BIT
FLASH
8-BIT
LADDER
MATRIX
FINE 4-BIT
FLASH
AD671
3
4
4
8
12
20
DAC
OTR MSB BIT1-12 DAV
21
16
19
23 22 24
17
18
3-BIT
FLASH
3
DAC
3-BIT
FLASH
14 13 1512 1
V
CC
V
LOGIC
EE
V
Monolithic 12-Bit
a
FEATURES 12-Bit Resolution 24-Pin “Skinny DIP” Package Conversion Time: 500 ns max—AD671J/K/S-500
Conversion Time: 750 ns max—AD671J/K/S-750
Low Power: 475 mW Unipolar (0 V to +5 V, 0 V to +10 V) and Bipolar Input
Ranges (65 V) Twos Complement or Offset Binary Output Data Out-of-Range Indicator MIL-STD-883 Compliant Versions Available

PRODUCT DESCRIPTION

The AD671 is a high speed monolithic 12-bit A/D converter offering conversion rates of up to 2 MHz (500 ns conversion time). The combination of a merged high speed bipolar/CMOS process and a novel architecture results in a combination of speed and power consumption far superior to previously avail­able hybrid implementations. Additionally, the greater reliability of monolithic construction offers improved system reliability and lower costs than hybrid designs.
The AD671 uses a subranging flash conversion technique, with digital error correction for possible errors introduced in the first part of the conversion cycle. An on-chip timing generator pro­vides strobe pulses for each of the four internal flash cycles and assures adequate settling time for the interflash residue ampli­fier. A single ENCODE pulse is used to control the converter.
The performance of the AD671 is made possible by using high speed, low noise bipolar circuitry in the linear sections and low power CMOS for the logic sections. Analog Devices’ ABCMOS-1 process provides both high speed bipolar and 2-micron CMOS devices on a single chip. Laser trimmed thin-film resistors are used to provide accuracy and temperature stability.
The AD671 is available in two conversion speeds and perfor­mance grades. The AD671J and K grades are specified for op­eration over the 0°C to +70°C temperature range. The AD671S grades are specified for operation over the –55°C to +125°C temperature range. All grades are available in a 0.300 inch wide 24-pin ceramic DIP. The J and K grades are also available in a 24-pin plastic DIP.
REV. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
2 MHz A/D Converter
AD671

FUNCTIONAL BLOCK DIAGRAM

PRODUCT HIGHLIGHTS

1. The AD671 offers a single chip 2 MHz analog-to-digital conversion function in a space saving 24-pin DIP.
2. Input signal ranges are 0 V to +5 V and 0 V to +10 V unipo­lar, and –5 V to +5 V bipolar, selected by pin strapping. In­put resistance is 1.5 k. Power supplies are +5 V and –5 V, and typical power consumption is less than 500 mW.
3. The external +5 V reference can be chosen to suit the dc ac­curacy and temperature drift requirements of the application.
4. Output data is available in unipolar, bipolar offset or bipolar twos complement binary format.
5. An OUT OF RANGE output bit indicates when the input signal is beyond the AD671’s input range.
6. The AD671 is available in versions compliant with the MIL­STD-883. Refer to the Analog Devices Military Products Databook or current AD671/883B data sheet for detailed specifications.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 617/329-4700 Fax: 617/326-8703
AD671–SPECIFICATIONS
(T
to T
with VCC = +5 V 6 5%, V
MAX

DC SPECIFICATIONS

MIN
unless otherwise noted)
AD671J/S-500 AD671K-500
Parameter Min Typ Max Min Typ Max Units
RESOLUTION 12 12 Bits ACCURACY (+25°C)
Integral Nonlinearity (INL)
T
to T
MIN
MAX
Differential Nonlinearity (DNL)
T
to T
MIN
No Missing Codes 10 Bits Guaranteed 11 Bits Guaranteed Unipolar Offset Bipolar Zero Gain Error
TEMPERATURE COEFFICIENTS
MAX
l
l
2
3
10 11 Bits
0.1 0.25 0.1 0.25 % FSR
Unipolar Offset 610 610 ppm/°C Bipolar Zero 615 615 ppm/°C Gain Error 620 620 ppm/°C
ANALOG INPUT
Input Ranges
Bipolar –5 +5 –5 +5 Volts Unipolar 0+50+5Volts
0 +10 0 +10 Volts
Input Resistance
10 Volt Range 1.0 1.5 2.0 1.0 1.5 2.0 k 5 Volt Range 0.5 0.75 1.0 0.5 0.75 1.0 k
Input Capacitance 10 10 pF Reference Input Resistance 2.4 3.5 4.7 2.4 3.5 4.7 k
= +5 V 610%, VEE = –5 V 6 5%, V
LOGIC
= +5.000 V,
REF
64 62 LSB
64 64 LSB 610 610 LSB
POWER SUPPLIES
Power Supply Rejection
V
(+5 V ± 0.25 V) 61 61 LSB
CC
V
(+5 V ± 0.5 V) 61 61 LSB
LOGIC
V
(–5 V ± 0.25 V) 61 61 LSB
EE
4
Operating Voltages
V V V
CC LOGIC EE
+4.75 +5.25 +4.75 +5.25 Volts +4.5 +5.5 +4.5 +5.5 Volts –5.25 –4.75 –5.25 –4.75 Volts
Operating Current
I
CC
I
LOGIC
I
EE
5
46 56 46 56 mA 3 6 3 6 mA 46 56 46 56 mA
POWER CONSUMPTION 475 621 475 621 mW
TEMPERATURE RANGE
Specified (J/K) 0 +70 0 +70 °C
Specified (S) –55 +125 °C
NOTES
1
Adjustable to zero with external potentiometers. See Offset/Gain Calibration section for additional information.
2
Full-scale range (FSR) is 5 V for the 0 V to 5 V range and 10 V for the 0 V to 10 V and –5 V to +5 V ranges.
3
25°C to T
4
Change in gain error as a function of the dc supply voltage.
5
Tested under static conditions. See Figure 12 for typical curves of I
Specifications subject to change without notice. Specifications shown in boldface are tested on all devices at final electrical test with worst case supply voltages at 0, +25 °C and +70°C. Results from those tests are
used to calculate outgoing quality levels. All min and max specifications are guaranteed, although only those shown in boldface are tested.
and 25°C to T
MIN
MAX
.
vs. Conversion Rate and Output Loading.
LOGIC
–2–
REV. B
AD671
(T
to T
with VCC = +5 V 6 5%, V
MAX
DC SPECIFICATIONS
MIN
unless otherwise noted)
AD671J/S-750 AD671K-750
Parameter Min Typ Max Min Typ Max Units
RESOLUTION 12 12 Bits ACCURACY (+25°C)
Integral Nonlinearity (INL)
T T
MIN MIN
to T to T
(J) 62 61.5 LSB
MAX
(S) 62.5 LSB
MAX
Differential Nonlinearity (DNL)
T
to T
MIN
No Missing Codes 11 Bits Guaranteed 12 Bits Guaranteed Unipolar Offset Bipolar Zero Gain Error
TEMPERATURE COEFFICIENTS
MAX
l
l
2
3
11 12 Bits
0.1 0.25 0.1 0.25 % FSR
Unipolar Offset 610 610 ppm/°C Bipolar Zero 615 615 ppm/°C Gain Error 620 620 ppm/°C
ANALOG INPUT
Input Ranges
Bipolar –5 +5 –5 +5 Volts Unipolar 0+50+5Volts
0 +10 0 +10 Volts
Input Resistance
10 Volt Range 1.0 1.5 2.0 1.0 1.5 2.0 k 5 Volt Range 0.5 0.75 1.0 0.5 0.75 1.0 k
Input Capacitance 10 10 pF Reference Input Resistance 2.4 3.5 4.7 2.4 3.5 4.7 k
= +5 V 6 10%, VEE = –5 V 6 5%, V
LOGIC
= +5.000 V,
REF
64 64 LSB 610 610 LSB
POWER SUPPLIES
Power Supply Rejection
V
(+5 V ± 0.25 V) 61 61 LSB
CC
V
(+5 V ± 0.5 V) 61 61 LSB
LOGIC
V
(–5 V ± 0.25 V) 61 61 LSB
EE
4
Operating Voltages
Vcc +4.75 +5.25 +4.75 +5.25 Volts V
LOGIC
V
EE
+4.5 +5.5 +4.5 +5.5 Volts –5.25 –4.75 –5.25 –4.75 Volts
Operating Current
I
CC
I
LOGIC
I
EE
5
46 56 46 56 mA 3 6 3 6 mA 46 56 46 56 mA
POWER CONSUMPTION 475 621 475 621 mW
TEMPERATURE RANGE
Specified (J/K) 0 +70 0 +70 °C
Specified (S) –55 +125 °C
NOTES
1
Adjustable to zero with external potentiometers. See Offset/Gain Calibration section for additional information.
2
Full-scale range (FSR) is 5 V for the 0 V to 5 V range and 10 V for the 0 V to 10 V and –5 V to +5 V ranges.
3
25°C to T
4
Change in gain error as a function of the dc supply voltage.
5
Tested under static conditions. See Figure 12 for typical curves of I
Specifications subject to change without notice. Specifications shown in boldface are tested on all devices at final electrical test with worst case supply voltages at 0, +25 °C and +70°C. Results from those tests are
used to calculate outgoing quality levels. All min and max specifications are guaranteed, although only those shown in boldface are tested.
and 25°C to T
MIN
MAX
.
vs. Conversion Rate and Output Loading.
LOGIC
REV. B
–3–
AD671–SPECIFICATIONS
(For all grades T

DIGITAL SPECIFICATIONS

6
5%, V
REF
Parameter Symbol Min Typ Max Units
LOGIC INPUT
High Level Input Voltage V Low Level Input Voltage V High Level Input Current (V Low Level Input Current (V
= V
IN
= 0 V) I
IN
)I
LOGIC
Input Capacitance C
LOGIC OUTPUTS
High Level Output Voltage (I Low Level Output Voltage (I
= 0.5 mA) V
OH
= 1.6 mA) V
OL
Output Capacitance C
Specifications shown in boldface are tested on all devices at final electrical test. Results from those tests are used to calculate outgoing quality levels. All min and max specifications are guaranteed, although only those shown in boldface are tested.
Specifications subject to change without notice.
to T
MIN
, with VCC = +5 V 6 5%, V
MAX
= +5.000 V, unless otherwise noted)
IH
IL IH IL
IN
OH
OL
OUT
+2.0 V –10 +10 µA
–10 +10 µA
+2.4 V
= +5 V 6 10%, VEE = –5 V
LOGIC
+0.8 V
5pF
+0.4 V
5pF

SWITCHING SPECIFICATIONS

(For all grades T
6
5%, VIL = 0.8 V, VIH = 2.0 V, VOL = 0.4 V and VOH = 2.4 V)
MIN
to T
with VCC = +5 V 6 5%, V
MAX
= +5 V 6 10%, VEE = –5 V
LOGIC
Parameter Symbol Min Typ Max Units
Conversion Time
(AD671-500) t (AD671-750) t
C C
475 500 ns 725 750 ns
ENCODE Pulse Width High
(AD671-500) t (AD671-750) t
ENCODE Pulse Width Low t
ENC ENC ENCL
20 30 ns 20 50 ns 20 ns
DAV Pulse Width
(AD671-500) t
(AD671-750) t ENCODE Falling Edge Delay t Start New Conversion Delay t Data and OTR Delay from DAV Falling Edge t Data and OTR Valid before DAV Rising Edge t
NOTES
1
tDD is measured from when the falling edge of DAV crosses 0.8 V to when the output crosses 0.4 V or 2.4 V with a 25 pF load capacitor on each output pin.
2
tSS is measured from when the outputs cross 0.4 V or 2.4 V to when the rising edge of DAV crosses 2.4 V with a 25 pF load capacitor on each output pin.
DAV DAV F R DD SS
1
2
75 200 ns 75 300 ns 0ns 0ns 20 75 ns 20 75 ns
a. Encode Pulse HIGH
Figure 1. AD671 Timing Diagrams
–4–
b. Encode Pulse LOW
REV. B
AD671
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS*
With Respect
Parameter to Min Max Units
V
CC
V
EE
V
LOGIC
ACOM –0.5 +6.5 Volts ACOM –6.5 +0.5 Volts
DCOM –0.5 +6.5 Volts ACOM DCOM –1.0 +1.0 Volts V
CC
ENCODE DCOM –0.5 V REF IN ACOM –0.5 V
V
LOGIC
–6.5 +6.5 Volts
+0.5 Volts
LOGIC
+0.5 Volts
CC
AIN, BPO/UPO ACOM –6.5 11.0 Volts Junction Temperature +175 °C Storage Temperature –65 +150 °C
l
Model
AD671JD-500 ±4 LSB 0°C to +70°C D-24A AD671KD-500 ±2 LSB 0°C to +70°C D-24A AD671JD-750 ±2 LSB 0°C to +70°C D-24A AD671KD-750 ±1.5 LSB 0°C to +70°C D-24A AD671SD-500 ±4 LSB –55°C to +125°C D-24A AD671SD-750 ±2.5 LSB –55°C to +125°C D-24A
NOTES
1
For details on grade and package offerings screened in accordance with MIL-STD-883, refer to the Analog Devices Military Products Databook or current AD671/883 data sheet.
2
D = Ceramic DIP.

ORDERING GUIDE

Linearity Range Options
Lead Temperature (10 sec) +300 °C Power Dissipation 1000 mW
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum ratings for extended periods may effect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD671 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Temperature Package
2
REV. B
–5–
AD671

AD671 PIN DESCRIPTION

Symbol Pin Type Name and Function
ACOM 22 P Analog Ground. AIN 20 AI Analog Input Signal. BIT1 (MSB) 12 DO Most Significant Bit. BIT2–BIT11 11–2 DO Data Bits 2–11. BIT12 (LSB) 1 DO Least Significant Bit. BPO/UPO 21 AI Bipolar or Unipolar
Configuration Pin. Connect to
AIN for 0 V to +5 V Span, to
ACOM for 0 V to +10 V Span
and to REF IN for –5 V to
+5 V Span.
DAV 15 DO Data Available Output. The
Rising Edge of DAV Indicates
an End of Conversion and Can
Be Used to Latch Current
Data into an External
Register. The Falling Edge of
DAV Can Be Used to Latch
Previous Data into an External
Register.
DCOM 18 P Digital Ground. ENCODE 16 DI The AD671 Starts a
Conversion on the Rising
Edge of the ENCODE Pulse.
MSB 13 DO Inverted Most Significant Bit.
Provides Twos Complement
Output Data Format.
OTR 14 DO Out of Range Is Active HIGH
when the analog input is
beyond the input range of the
converter.
REF IN 19 AI +5 V Reference Input. V
CC
V
EE
V
LOGIC
TYPE: AI = Analog Input DI = Digital Input DO = Digital Output P = Power
23 P +5 V Analog Power. 24 P –5 V Analog Power. 17 P +5 V Digital Power.
CONNECTION DIAGRAM

PINOUT

BIT12 (LSB)
BIT1 (MSB)
BIT11
BIT10
BIT9 BIT8 BIT7 BIT6 BIT5 BIT4 BIT3 BIT2
1 2 3 4 5 6 7
(Not to Scale)
8
9 10 11 12
AD671
TOP VIEW
24 23 22 21 20 19 18 17 16 15 14 13
V
EE
V
CC
ACOM
BPO/UPO
AIN REF IN DCOM
V
LOGIC
ENCODE DAV OTR MSB
–6–
REV. B
AD671

DEFINITIONS OF SPECIFICATIONS

INTEGRAL NONLINEARITY (INL)

Integral nonlinearity refers to the deviation of each individual code from a line drawn from “zero” through “full scale.” The point used as “zero” occurs 1/2 LSB (1.22 mV for a 10 V span) before the first code transition (all zeros to only the LSB on). “Full scale” is defined as a level 1 1/2 LSB beyond the last code transition (to all ones). The deviation is measured from the low side transition of each particular code to the true straight line.

DIFFERENTIAL NONLINEARITY (DNL, NO MISSING CODES)

An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value. Thus every code must have a finite width. Guaranteed no missing codes to 10-bit resolution indicates that all 1024 codes represented by Bits 1–10 must be present over all operating ranges. Guaranteed no missing codes to 11- or 12-bit resolution indicates that all 2048 and 4096 codes, respectively, must be present over all op­erating ranges.

UNIPOLAR OFFSET

The first transition should occur at a level 1/2 LSB above analog common. Unipolar offset is defined as the deviation of the ac­tual from that point. This offset can be adjusted as discussed later. The unipolar offset temperature coefficient specifies the maximum change of the transition point over temperature, with or without external adjustments.

GAIN ERROR

The last transition (from 1111 1111 1110 to 1111 1111 1111) should occur for an analog value 1 1/2 LSB below the nominal full scale (9.9963 volts for 10.000 volts full scale). The gain er­ror is the deviation of the actual level at the last transition from the ideal level. The gain error can be adjusted to zero as shown in Figures 7, 8 and 9.

TEMPERATURE COEFFICIENTS

The temperature coefficients for unipolar offset, bipolar zero and gain error specify the maximum change from the initial (+25°C) value to the value at T
MIN
or T
MAX
.

POWER SUPPLY REJECTION

The only effect of power supply error on the performance of the device will be a small change in gain. The specifications show the maximum full-scale change from the initial value with the supplies at the various limits.

SIGNAL-TO-NOISE AND DISTORTION (S/N+D) RATIO

S/N+D is the ratio of the rms value of the measured input signal to the rms sum of all other spectral components, including har­monics but excluding dc. The value for S/N+D is expressed in decibels.

EFFECTIVE NUMBER OF BITS (ENOB)

ENOB is calculated from the expression SNR = 6.02N +
1.8 dB, where N is equal to the effective number of bits.

BIPOLAR ZERO

In the bipolar mode the major carry transition (0111 1111 1111 to 1000 0000 0000) should occur for an analog value 1/2 LSB below analog common. The bipolar offset error and temperature coefficient specify the initial deviation and maximum change in the error over temperature.
Theory of Operation
The AD671 uses a successive subranging architecture. The ana­log to digital conversion takes place in four independent steps or flashes. The analog input signal is subranged to an intermediate residue voltage for the final 12-bit result by utilizing multiple flashes with subtraction DACs (see the AD671 functional block diagram).
The AD671 can be configured to operate with unipolar (0 V to +5 V, 0 V to +10 V) or bipolar (±5 V) inputs by connecting AIN (Pin 20), REFIN (Pin 19) and BPO/UPO (Pin 21) as shown in Figure 2.
The AD671 conversion cycle begins by simply providing an ac­tive HIGH pulse on the ENCODE pin (Pin 16). The rising edge of the ENCODE pulse starts the conversion. The falling edge of the ENCODE pulse is specified to operate within a win­dow of time: less than 30 ns after the rising edge of ENCODE

TOTAL HARMONIC DISTORTION (THD)

THD is the ratio of the rms sum of the first six harmonic com­ponents to the rms value of the measured input signal and is ex­pressed as a percentage or in decibels.

PEAK SPURIOUS OR PEAK HARMONIC COMPONENT

The peak spurious or peak harmonic component is the largest spectral component excluding the input signal and dc. This value is expressed in decibels relative to the rms value of a full­scale input signal.
(AD671-500) and less than 50 ns after the falling edge of ENCODE (AD671–750) or after the falling edge of DAV. The time window prevents digitally coupled noise from being intro­duced during the final stages of conversion. An internal timing generator circuit accurately controls all internal timing.
ACOM
22
BPO/UPO
AIN
REF IN
0 TO 5V
21
20
19
+
5V REF
+
BPO/UPO
21
AIN
REF IN
0 TO 10V
20
19
+
5V REF
+
AIN AIN
BPO/UPO
AIN
REF IN
–+
5V TO 5V
21
20
AIN
19
+
5V REF
Figure 2. Input Range Connections
REV. B
–7–
AD671
Upon receipt of an ENCODE command, the first 3-bit flash converts the analog input voltage. The 3-bit result is passed to a correction logic register and a segmented current output DAC. The DAC output is connected through a resistor (within the Range/Span Select Block) to AIN. A residue voltage is created by subtracting the DAC output from AIN, which is less than one eighth of the full-scale analog input. The second flash has an input range that is configured with one bit of overlap with the previous DAC. The overlap allows for errors during the flash conversion. The first residue voltage is connected to the second 3-bit flash and to the noninverting input of a high speed, differ­ential, gain-of-four amplifier. The second flash result is passed to the correction logic register and to the second segmented cur­rent output DAC. The output of the second DAC is connected to the inverting input of the differential amplifier. The differen­tial amplifier output is connected to a two step backend 8-bit flash. This 8-bit flash consists of coarse and fine flash convert­ers. The result of the coarse 4-bit flash converter, also config­ured to overlap one bit of DAC 2, is connected to the correction logic register and selects one of 16 resistors from which the fine 4-bit flash will establish its span voltage. The fine 4-bit flash is connected directly to the output latches.
The AD671 will flag an out-of-range condition when the input voltage exceeds the analog input range. OTR (Pin 14) is active HIGH when an out of range high or low condition exists. Bits 1–12 are HIGH when the analog input voltage is greater than the selected input range and LOW when the analog input is less than the selected input range.

APPLYING THE AD671

DRIVING THE AD671 ANALOG INPUT

The AD671 uses a very high speed current output DAC to sub­tract a known voltage from the analog input. This results in very fast steps of current at the analog input. It is important to recog­nize that the signal source driving the analog input of the AD671 must be capable of maintaining the input voltage under dynamically-changing load conditions. When the AD671 starts its conversion cycle, the subtraction DAC will sink up to 5 mA (see Figure 3) from the source driving the analog input. The source must respond to this current step by settling the input voltage back to a fraction of an LSB before the AD671 makes its final 12-bit decision.
+
IIN
IA/D
AD671
R
A/D DAC
IDAC
Figure 3. Driving the Analog Input
Unlike successive approximation A/Ds, where the input voltage must settle to a fraction of a 12-bit LSB before each successive bit decision is made, the AD671 requires the analog input volt­age settle to within 12 bits before the third flash conversion, approximately 200 ns. This “free” 200 ns is useful in applica­tions requiring a sample-and-hold amplifier (SHA), overlapping the SHA’s hold mode settling time within the 200 ns window will increase total system throughput. See the “Discrete Sample­and-Hold” section for a high speed SHA application.

INPUT BUFFER AMPLIFIER

The closed-loop output impedance of an op amp is equal to the open loop output impedance (usually a few hundred ohms) di­vided by the loop gain at the frequency of interest. It is often assumed that loop gain of a follower-connected op amp is suffi­ciently high to reduce the closed-loop output impedance to a negligibly small value, particularly if the input signal is low frequency. At higher frequencies the open-loop gain is lower, increasing the output impedance which decreases the instanta­neous analog input voltage and produces an error.
The recommended wideband, fast settling input amplifiers for use with the AD671 are the AD841, AD843, AD845 or the AD847. The AD841 is unity gain stable and recommended as a follower connected op amp. The AD843 and AD845 FET in­puts make them ideal for high speed sample-and-hold amplifiers and the AD847 can be used as a low power, high speed buffer. Figure 4 shows the AD841 driving the AD671. As shown in the figure the analog input voltage should be produced with respect to the ACOM pin.
EE
ENCODE
V
17
LOGIC
BIT12
MSB
BIT1
DAV
OTR
1
12
16
15
14
+
±
5V
+
5V REF
4
AD841
5
23 24
11
10
6
VCCV
20
AIN
22
ACOM
18
DCOM
19
REF IN
21 13
BPO/UPO
AD671
Figure 4. Input Buffer Amplifier

REFERENCE INPUT

The AD671 uses a standard +5 volt reference. The initial accu­racy and temperature stability of the reference can be selected to meet specific system requirements. Like the analog input, fast switching input-dependent currents are modulated at the refer­ence input pin (REF IN–Pin 19). However, unlike the analog input the reference input is held at a constant +5 volts with the use of capacitor. The recommended reference is the AD586, a +5 V precision reference with an output buffer amplifier. Fig­ure 5 shows the AD671 configured in the ± 5 V input range. The 6.8 µF capacitor maintains a constant +5 volts under the dynamically changing load conditions. An optional 1 µF noise reduction capacitor can be connected to the AD586, further re­ducing broadband output noise. To minimize ground voltage drops the AD586’s ground pin should be tied as close as pos­sible to the AD671’s ACOM pin. See Figures 20, 21 and 22 for PCB layout recommendations.
–8–
REV. B
AD671
AIN
REF IN
BPO/UPO
ACOM
BIT1
BIT12
DCOM
AD671
ENCODE
DAV
OTR
MSB
20
23 24
17
22
18
19
21
13
14
15
16
VCCV
EE
V
LOGIC
1
12
0.1µF
10µF
10µF10µF
0.1µF 0.1µF
+
5V
+
5V
5V
0 TO 10V
+
10µF
0.1µF
10µF
1
14
15
50
1µF
150
13
12 11
8
10
95
7
6
4 3
5k
R2
100k
50
1µF
AD588
0.1µF
150pF
10k
39k
15V
+
2
16
+
15
15
R1
100
1µF
C14
AD586
U4
8
NOISE REDUCTION
GND
23 24
VCCV
20
AIN
±
5V
+
15V
2
+V
IN
V
OUT
6
6.8µF
C15
4
22
ACOM
18
DCOM
19
REF IN
21
BPO/UPO
U3
EE
ENCODE
AD671
V
17
LOGIC
BIT12
DAV
OTR
MSB
BIT1
1
12
16
15
14
13
Figure 5. AD586 as Reference Input for AD671

GROUNDING AND DECOUPLING RULES

Proper grounding and decoupling should be a primary design objective in any high speed, high resolution system. The AD671 separates analog and digital grounds to optimize the manage­ment of analog and digital ground currents in a system. The AD671 is designed to minimize the current flowing from ACOM (Pin 22) by directing the majority of the current from V
(+5 V–Pin 23) to VEE (–5 V–Pin 24). Minimizing analog
CC
ground currents hence reduces the potential for large ground voltage drops. This can be especially true in systems that do not utilize ground planes or wide ground runs. ACOM is also con­figured to be code independent, therefore reducing input depen­dent analog ground voltage drops and errors. The input current supplied by the external reference (REFIN–Pin 19) and the ma­jority of the full-scale input signal (AIN–Pin 20) are also di­rected to V
. Also critical in any high speed digital design are
ÉE
the use of proper digital grounding techniques to avoid potential CMOS “ground bounce.” Figure 6 is provided to assist in the proper layout, grounding and decoupling techniques.
Table I is a list of grounding and decoupling guidelines that should be reviewed before laying out a printed circuit board.
Table I. Grounding and Decoupling Guidelines
Power Supply Decoupling Comment
Capacitor Values 0.1 µF (Ceramic) and 10 µF (Tantalum).
(Surface Mount Chip Capacitors Recom­mended to Reduce Lead Inductance).
Capacitor Locations Directly at Positive and Negative
Supply Pins to Respective Ground Plane.
Grounding
Analog Ground Ground Plane or Wide Ground Return
Connected to the Analog Power Supply.
Digital Ground Ground Plane or Wide Ground Return
Connected to the Digital Power Supply.
Analog and Digital Ground Connected Together Once at the AD671.

UNIPOLAR (0 V TO +10 V) CALIBRATION

The AD671 is factory trimmed to minimize offset, gain and lin­earity errors. In some applications the offset and gain errors of the AD671 need to be externally adjusted to zero. This is ac­complished by trimming the voltage at BPO/UPO (Pin 21) and REFIN (Pin 19). In those applications the AD588, a high preci­sion pin programmable voltage reference, is an ideal choice. The AD588 includes a reference cell and three additional amplifiers which can be configured to provide offset and gain trims for the AD671. The circuit in Figure 7 is recommended for calibrating offset and gain errors of the AD671 when configured in the 0 V to +10 V input range.
REV. B
0.1µF
10µF
+
5V
10µF10µF
0.1µF 0.1µF
5V
+
23 24
EE
ENCODE
BIT12
V
BIT1
DAV
OTR
MSB
LOGIC
VCCV
+
±
V
5V
IN
AGP*
+
5V REF
Figure 6. AD671 Grounding and Decoupling
DGP*
*GROUND PLANE RECOMMENDED
20
22
18
19
21
AIN
ACOM
DCOM
REF IN
BPO/UPO
AD671
5V
17
12
1
16
15
14
13
The AD671 is intended to have a nominal 1/2 LSB offset so that the exact analog input for a given code will be in the middle
Figure 7. Unipolar (0 V to +10 V) Calibration
of that code (halfway between the transitions to the codes above it and below it). Thus, the first transition ( from 0000 0000 0000 to 0000 0000 0001) will occur for an input level of +1/2 LSB (1.22 mV for 10 V range). If the offset trim resistor R2 is used,
–9–
AD671
it should be trimmed as above, although a different offset can be set for a particular system requirement. This circuit will give ap­proximately ±50 mV of offset trim range.
The gain trim is done by applying a signal 1 1/2 LSBs below the nominal full scale (9.9963 for a 10 V range). Trim R1 to give the last transition (1111 1111 1110 to 11111111 1111).

UNIPOLAR (0 V TO +5 V) CALIBRATION

The connections for the 0 V to +5 V input range calibration is shown in Figure 8. The AD586, a +5 V precision voltage refer­ence, is an excellent choice for this mode of operation because of its performance, stability and optional fine trim. The AD845 (16 MHz, low power, low cost op amp) is used to maintain the +5 volts under the dynamically changing load conditions of the reference input.
+15V
1µF
+
15V
2
+V
IN
NOISE
8
REDUCTION
AD586
0 TO +5V
V
OUT
TRIM
GND
4
6
5
–15V
2
3
0.1µF
AD845
4
2
3
10k
7
1
1k
AD845
–15V
7
4
0.1µF
8
+15V
6
390
0.1µF
6
0.1µF
+15V
20
21
22
18
19
23 24 VCCV AIN
BPO/UPO
ACOM
DCOM
REFIN
AD671
EE
17
V
LOGIC
BIT1
BIT12
ENCODE
DAV
OTR
MSB
12
1
16
15
14
13
Figure 8. Unipolar (0 V to +5 V) Calibration
The AD671 offset error must be trimmed within the analog in­put path, either directly in front of the AD671 or within the sig­nal conditioning chain, eliminating offset errors induced by the signal conditioning circuitry. Figure 8 shows an example of how the offset error can be trimmed in front of the AD671. The AD586 is configured in the optional fine trim mode to provide +6%/–2% (+240 LSBs/–80 LSBs) of gain trim. The procedure for trimming the offset and gain errors is similar to that used for the unipolar 10 V range with the analog input values set to one­half the 10 V range values.

BIPOLAR (65 V) CALIBRATION

The connections for the bipolar input range is shown in Figure
9. The AD588 is configured to provide dual +5 V outputs. Pro­viding a +5 V reference voltage for the AD671 gain trim and the +5 V BPO/UPO input for the bipolar offset trim.
23 24
0.1µF
0.1µF
20
22
18
19
21
VCCV
AIN
ACOM
DCOM
REF IN
BPO/UPO
±
5V
6.2k
+
15V
39k
1µF
6
4 3
7
AD588
12 11810
95
150pF
13
R1
100
50
1
10µF
14
15
2
16
150pF
+
15
R2
100
50
10µF
15
EE
AD671
V
BIT1
BIT12
ENCODE
DAV
OTR
MSB
17
LOGIC
12
1
16
15
14
13
Figure 9. Bipolar (±5 V) Calibration
Bipolar calibration is similar to unipolar calibration. First, a sig­nal 1/2 LSB above negative full scale (–4.9988 V) is applied and R1 is trimmed to give the first transition (0000 0000 0000 to 0000 0000 0001). Then a signal 1 1/2 LSB below positive full scale (+4.9963) is applied, and R2 is trimmed to give the last transition (1111 1111 1110 to 1111 1111 1111).

OUTPUT LATCHES

Figure 10 shows the AD671 connected to the 74HC574 Octal D-type edge triggered latches with 3-state outputs. The latch can drive highly capacitive loads (i.e., bus lines, I/O ports) while maintaining the data signal integrity. The maximum set-up and hold times of the 574 type latch must be less than 20 ns (t
DD
and tSS minimum). To satisfy the requirements of the 574 type latch the recommended logic families are HC, S, AS, ALS, F or BCT. New data from the AD671 is latched on the rising edge of the DAV (Pin 24) output pulse. Previous data can be latched by inverting the DAV output with a 7404 type inverter. See Fig­ures 20, 21 and 22 for PCB layout recommendations.
BIT10
BIT11
BIT12
AD671
BIT1 BIT2 BIT3
BIT4 BIT5 BIT6 BIT7
BIT8 DAV
BIT9
74HC574
1D 2D
3D 4D 5D
U6
6D 7D 8D CLK
74HC574
1D
2D 3D 4D
5D
U5
6D 7D 8D CLK
3Q
OC
5Q 6Q 7Q 8Q OC
1Q 2Q
4Q 5Q 6Q 7Q 8Q
1Q 2Q 3Q 4Q
DATA BUS
3-STATE CONTROL
Figure 10. AD671 to Output Latches

OUT OF RANGE

An Out of Range condition exists when the analog input voltage is beyond the input range (0 V to +5 V, 0 V to +10 V, ±5 V) of the converter. OTR (Pin 14) is set low when the analog input voltage is within the analog input range. OTR is set HIGH and will remain HIGH when the analog input voltage exceeds the input range by typically 1/2 LSB (OTR transition is tested to ±6 LSBs of accuracy) from the center of the ± full-scale output codes. OTR will remain HIGH until the analog input is within the input range and another conversion is completed. By logical ANDing OTR with the MSB and its complement overrange high or underrange low conditions can be detected. Table II is a truth table for the over/under range circuit in Figure 11. Sys­tems requiring programmable gain conditioning prior to the AD671 can immediately detect an out of range condition, thus eliminating gain selection iterations.
Table II. Out of Range Truth Table
OTR MSB Analog Input Is
0 0 In Range 0 1 In Range 1 0 Underrange 1 1 Overrange
–10–
REV. B
AD671
MSB
OTR
MSB
OVER = "1"
UNDER = "1"
Figure 11. Overrange or Underrange Logic

OUTPUT DATA FORMAT

The AD671 provides both MSB and MSB outputs, delivering data in positive true straight binary for unipolar input ranges and positive true offset binary or twos complement for bipolar
Table III. Output Data Format
Input Analog Digital Range Coding Input
0 to +5 V Straight Binary –0.00061 V 0000 0000 0000 1
0 V 0000 0000 0000 0 +5 V 1111 1111 1111 0 >+5.00061 V 1111 1111 1111 1
0 to +10 V Straight Binary –0.00122 V 0000 0000 0000 1
0 V 0000 0000 0000 0 +10 V 1111 1111 1111 0 +10.00122 V 1111 1111 1111 1
input ranges. Straight binary coding is used for systems that ac­cept positive-only signals. If straight binary coding is used with bipolar input signals a 0 V input would result in a binary output of 2048. The application software would have to subtract 2048 to determine the true input voltage. Most processors typically perform math on signed integers and assume data is in that for­mat. Twos complement format minimizes software overhead which is especially important in high speed data transfers, such as a DMA operation. The CPU is not bogged down performing data conversion steps, hence increasing the total system throughput.
1
Output OTR
2
–5 V to +5 V Offset Binary –5.00122 V 0000 0000 0000 1
–5 V 0000 0000 0000 0 0 V 1000 0000 0000 0 +4.99756 V 1111 1111 1111 0 +4.99878 V 1111 1111 1111 1
–5 V to +5 V 2s Complement –5.00122 V 1000 0000 0000 1
(Using
MSB) –5 V 1000 0000 0000 0
0 V 0000 0000 0000 0 +4.99756 V 0111 1111 1111 0 +4.99878 V 0111 1111 1111 1
NOTES
1
Voltages listed are with offset and gain errors adjusted to zero.
2
Typical performance.
I
vs. CONVERSION RATE
LOGIC
Figure 12 shows the typical logic supply current vs. conversion rate for various capacitive loads on the digital outputs.
6.5
6.0
5.5
5.0
4.5
4.0
3.5
mA
3.0
2.5
2.0
1.5
1.0
0.5 1k
10k 100k 1M 10M
CONVERSION RATE – Hz
CL = 50pF
CL = 30pF
CL = 0pF
REV. B
Figure 12. I
vs. Conversion Rate for Various
LOGIC
Capacitive Loads on the Digital Outputs
–11–
AD671
AD671
ENCODE
DAV
1/4 7402
1/4 7402
1/4 7402
t
w

HIGH PERFORMANCE SAMPLE-AND-HOLD AMPLIFIER (SHA)

In order to take full advantage of the AD671’s high speed capa­bilities, a sample-and-hold amplifier (SHA) with fast acquisition capabilities and rigid accuracy requirements is essential. One possibility is a hybrid SHA such as the HTC-0300A, but often a cost effective alternative like the one shown in Figure 13 may be a better solution. This discrete SHA requires very few compo­nents and is able to acquire signals to 0.01% accuracy in less than 350 nanoseconds. Combined with the AD671, signals with bandwidths up to 500 kHz can be converted with 12-bit accuracy.
8
9
C29 20pF
VR2 100k
2
3
ADJ
R9
1k
R13
1k
+
U9 AD845
15V
15V
C28 20pF
C26
0.1µF
7
4
C27
0.1µF
C34 5pF
R14 226
V
IN
(5Vp–p)
R7 1k
+
15V
C24 R6 2k
S/H
4
5
S/H
U8 AD841
15V
0.1µF
11
6
0.1µF
C25
R8
250
10
R11
250
15V
R10
10k
2
4
IN1 IN2
5
U10
IN3
13
IN4
12
G1 G2G3G4
3 61411
D1 1N4148
SD5001
OUT1
OUT2
OUT3
OUT4
1
16
PEDESTAL
Figure 13. Discrete High Speed Sample-and-Hold Amplifier

CIRCUIT DESCRIPTION

The discrete SHA shown in Figure 13 is a closed-loop, nonin­verting architecture which accepts 5 V p-p inputs. The overall gain of the SHA is +2 in order to accommodate the 10 V input span of the AD671. The AD841, with a 0.01% settling time of 110 ns, is the suggested input buffer to the SHA. The circuit also employs a SD5001 which contains four ultrahigh speed DMOS switches (Q1–Q4). The high CMRR, low input offset current, and fast settling time of the AD845 op amp are all criti­cal features necessary for optimal performance of the discrete SHA.
In sample mode, Q1 and Q3 of the SD5001 are closed (Q2 and Q4 are open). C28 is charged to the input voltage level at a rate primarily determined by the time constant, R9 • C28. Simulta­neously, C29 is connected to ground through a 250 ohm resis­tor. If C28 is equal to C29, charge injection from Q1 will be approximately equal to charge injection from Q3 based on the symmetry of the circuit and the inherent matching of the switch capacitances. The resultant pedestal errors appear as a common­mode signal to the AD845. VR2, R13, R14, and C34 may be in­cluded if further reduction of pedestal error is required.
In hold mode, Q2 and Q4 are closed (Q1 and Q3 are open) to reduce feedthrough. The input signal is attenuated –78 dB relative to the input signal at frequencies up to 500 kHz. The AD845 buffers the voltage on C28 and also provides the wide­band, low-impedance output necessary to drive the input of the AD671.
Droop, which occurs as a result of leakage currents, will appear on C28 and will similarly appear on C29. Like pedestal errors, droop appears as a common-mode signal to the AD845 and is greatly reduced by the differential nature of the circuit. Voltage droop is typically 5 µV/µs.

CROSS COUPLED LATCH

As noted in the Theory of Operation, the ENCODE pulse is specified to operate within a window of time. The circuit in Fig­ure 14 can be used to generate a valid ENCODE pulse if a clock pulse width of greater than 30 ns is available.
Figure 14. Cross Coupled Latch

TIMING DESCRIPTION

6
Figure 15 shows the timing requirements for the discrete SHA. The complementary S/H inputs are HCMOS-compatible al­though larger gate voltages will improve performance by lower­ing the on resistances of the DMOS switches. It should be noted that a conversion is started before the SHA has settled to 0.01% accuracy. The discrete SHA takes advantage of the fact that the AD671 does not require a 12-bit accurate input until it is 150 ns into its conversion cycle. See Figures 21, 22 and 23 for PCB layout recommendations.
t
= 1µs
SAMPLE
ENCODE
t
DAV
S/H
CONVERSION
= 500ns
t
ACQUIRE
350ns
t
SETTLE
350ns
Figure 15. AD671 to Discrete SHA Timing Diagram

DYNAMIC PERFORMANCE

In most sampling applications the dynamic performance of the system is limited by the performance of the SHA. The SHA’s dynamic performance can be selected to meet the system sam­pling requirements. Figures 16 and 17 are typical FFT plots using the discrete SHA in Figure 13.
Figure 16. Typical FFT Plot of AD671 and Discrete SHA
= 100 kHz
F
IN
–12–
REV. B
Figure 17. Typical FFT Plot of AD671 and Discrete SHA
= 500 kHz
F
IN

MULTICHANNNEL DATA ACQUISITION SYSTEM

The AD684, a quad high speed sample-and-hold amplifier is ideally suited for multichannel data acquisition applications. Figure 18 shows a typical data acquisition circuit using the AD684 (SHA), ADG201HS (Multiplexer), AD588 (Reference) and the AD671. The AD684 is configured to simultaneously sample four analog inputs. Each held analog input voltage can be selected by the multiplexer and buffered by the AD841. The AD671 is connected in the bipolar input range (± 5 V).
AD671

DYNAMIC CHARACTERISTICS

(@ +25°C, tested using the discrete SHA in Figure 15 with VCC = +5 V, V
= +5 V, VEE = –5 V, f
LOGIC
SAMPLE
= 1 MSPS)
Model AD671JD-500
Effective Number of Bits (ENOB)
F
= 100 kHz 11.3 Bits
IN
FIN = 490 kHz 11.2 Bits
Signal-to-Noise and Distortion (S/N+D) Ratio
F
= 100 kHz 70 dB
IN
FIN = 490 kHz 68 dB
Total Harmonic Distortion (THD)
F
= 100 kHz –80 dB
IN
FIN = 490 kHz –75 dB
Peak Spurious (dc to 490 kHz) –79 dB
Peak Harmonic Component (dc to 490 kHz) –76 dB
NOTE
1
fIN amplitude = –0.2 dB @ 100 kHz and –0.9 dB @ 490 kHz, bipolar mode unless otherwise indicated. See Definition of Specifications for additional information.
1
Typ Units
REV. B
Figure 18. Data Acquisition System Using the AD684 and the AD671
–13–
AD671
ADSP-2101
A0:13
D0:15
ADDRESS BUS
DECODE
Q0:7
D0:7
574
OE
Q0:7
D0:7
574
OE
DATA BUS
D0:3
DAV
BIT1:12
SAMPLING
CLOCK
ENCODE
16
8
4
8
8
4
RD
IRQ2
AD671

AD671 TO ADSP-2100A INTERFACE

Figure 19 demonstrates the AD671 to ADSP-2100A interface. The 2100A with a clock frequency of 12.5 MHz can execute an instruction in one 80 ns cycle. The AD671 is configured to per­form continuous time sampling. The DAV output of the AD671 is asserted at the end of each conversion. DAV can be used to latch the conversion result into the two 574 octal D-latches. The falling edge of the sampling clock is used to generate an inter­rupt (IRQ3) for the processor. Upon interrupt, the ADSP­2100A starts a data memory read by providing an address on the DMA bus. The decoded address generates OE for the latches and the processor reads their output over the DMA bus. The conversion result is read within a single processor cycle.

AD671 TO ADSP-2101/ADSP-2102 INTERFACE

Figure 20 is identical to the 2100A interface except the sam­pling clock is used to generate an interrupt (IRQ2) for the pro­cessor. Upon interrupt the ADSP-2101A starts a data memory read by providing an address on the Address (A) bus. The de­code address generates
OE for the D-latches and the processor reads their output over the Data (D) bus. Reading the conver­sion result is thus completed within a single processor cycle.
DMRD
DMA0:13
ADSP-2100A
DMA0:15
DMACK
IRQ3
ADDRESS BUS
DECODE
16
DATA BUS
+
5V
SAMPLING
CLOCK
OE
574
8
Q0:7
OE
574
8
Q0:7
Figure 19. AD671 to ADSP-2100A Interface
D0:7
D0:3
D0:7
DAV
AD671
8
BIT1:12
4
4
ENCODE
Figure 20. AD671 to ADSP-2101/ADSP-2102 Interface
Figure 21. PCB Silkscreen and Component Placement Diagram for Figures 5, 10 and 13
–14–
REV. B
Figure 22. PCB Solder Side Layout for Figures 5, 10 and 13
AD671
REV. B
Figure 23. PCB Component Side Layout for Figures 5, 10 and 13
–15–
AD671
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
24-Pin Plastic DIP (Suffix N)
C1426a–10–9/91
SEATING PLANE
PIN 1
0.175 (4.45)
24-Pin Ceramic DIP (Suffix D)
0.295 6 0.01
1
1.200 6 0.012 (30.48 6 0.31)
0.018 6 0.002 (0.46 6 0.05)
TYP
NOTES
1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH.
2. CERAMIC DIP LEADS WILL BE EITHER GOLD OR TIN PLATED IN ACCORDANCE WITH MIL-M-385 TO REQUIREMENTS.
0.100 6 0.005 (2.54 6 0.13)
1.100 6 0.005 (27.94 6 0.13)
TOLL NON ACCUM
0.05 (1.27) TYP
(7.49 6 0.26)
0.085 6 0.009 (2.16 6 0.23)
0.300 6 0.010 (7.49 6 0.25)
+ 0.002
0.010 –0.001
0.025
–0.03
(
+ 0.05
)
PRINTED IN U.S.A.
–16–
REV. B
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