–3–
REV. 0
nV/√Hz
Parameter Symbol Conditions Min Typ1Max Unit
DYNAMIC CHARACTERISTICS
5, 9
Bandwidth –3 dB, BW_10 kΩ, R = 10 kΩ 500 kHz
Total Harmonic Distortion THD
W
VA = 1 V rms, VB = 0 V, f = 1 kHz,
R
AB
= 10 kΩ 0.022 %
THD
W
VA =1 V rms, VB = 0 V, f = 1 kHz,
R
AB
= 50 kΩ, 100 kΩ 0.045 %
V
W
Settling Time t
S
VDD=5V,VSS=0V,VA = VDD, VB = 0 V,
V
W
= 0.50% Error Band, Code 00H to 80
H
For RAB = 10 kΩ/50 kΩ/100 kΩ 0.65/3/6 µs
Resistor Noise Voltage e
N_WB
RWB = 5 kΩ, f = 1 kHz 9
Crosstalk (C
W1/CW2
)C
T
VA = VDD, VB = 0 V, Measure VW with
Adjacent VR Making Full-Scale Code Change
–5 nV-s
Analog Crosstalk (C
W1/CW2
)CTAV
A1
= VDD, V
B1
= 0 V, Measure V
W1
with VW2 = 5 V p-p @ f = 10 kHz,
Code1 = 80H; Code2 = FF
H
–70 dB
INTERFACE TIMING CHARACTERISTICS – Applies to All Parts
5, 10
Clock Cycle Time (t
CYC
)t
1
20 ns
CS Setup Time t
2
10 ns
CLK Shutdown Time to CS Rise t
3
1t
CYC
Input Clock Pulsewidth t 4 , t
5
Clock Level High or Low 10 ns
Data Setup Time t
6
From Positive CLK Transition 5 ns
Data Hold Time t
7
From Positive CLK Transition 5 ns
CS to SDO-SPI Line Acquire t
8
40 ns
CS to SDO-SPI Line Release t
9
50 ns
CLK to SDO Propagation Delay
11
t
10
RP = 2.2 kΩ, CL < 20 pF 50 ns
CLK to SDO Data Hold Time t
11
RP = 2.2 kΩ, CL < 20 pF 0 ns
CS High Pulsewidth
12
t
12
10 ns
CS High to CS High
12
t
13
4t
CYC
RDY Rise to CS Fall t
14
0ns
CS Rise to RDY Fall Time t
15
0.1 0.15 ms
Read/Store to Nonvolatile EEMEM
13
t
16
Applies to Command 2H, 3H, 9
H
25 ms
CS Rise to Clock Rise/Fall Setup t
17
10 ns
Preset Pulsewidth (Asynchronous) t
PRW
Not Shown in Timing Diagram 50 ns
Preset Response Time to RDY High t
PRESP
PR Pulsed Low to Refreshed
Wiper Positions 70 µs
FLASH/EE MEMORY RELIABILITY CHARACTERISTICS
Endurance
14
100 K Cycles
Data Retention
15
100 Years
NOTES
1
Typical parameters represent average readings at 25°C and VDD = 5 V.
2
Resistor position nonlinearity error R-INL is the deviation from an ideal value measured between the maximum resistance and the minimum resistance wiper
postions. R-DNL measures the relative step change from ideal between successive tap positions. Parts are guaranteed monotonic. IW ~ 50 µA @ V
DD
= 2.7 V and
IW ~ 400 µA @ V
DD
= 5 V for the R
AB
= 10 kΩ version, IW ~ 50 µA for the R
AB
= 50 kΩ and IW ~ 25 µA for the R
AB
= 100 kΩ version. See Figure 13.
3
INL and DNL are measured at VW with the RDAC configured as a potentiometer divider similar to a voltage output D/A converter. VA = VDD and VB = VSS. DNL
specification limits of ±1 LSB maximum are Guaranteed Monotonic operating conditions. See Figure 14.
4
Resistor terminals A, B, W have no limitations on polarity with respect to each other. Dual Supply Operation enables ground-referenced bipolar signal adjustment.
5
Guaranteed by design and not subject to production test.
6
Common-mode leakage current is a measure of the dc leakage from any terminal A, B, W to a common-mode bias level of VDD/2.
7
Transfer (XFR) Mode current is not continuous. Current consumed while EEMEM locations are read and transferred to the RDAC register. See TPC 9.
8
P
DISS
is calculated from (IDD VDD) + (ISS VSS).
9
All dynamic characteristics use VDD = +2.5 V and VSS= –2.5 V unless otherwise noted.
10
See timing diagram for location of measured values. All input control voltages are specified with tR = tF = 2.5 ns (10% to 90% of 3 V) and timed from a voltage level
of 1.5 V. Switching characteristics are measured using both VDD = 3 V or 5 V.
11
Propagation delay depends on value of VDD, R
PULL_UP
, and CL. See applications text.
12
Valid for commands that do not activate the RDY pin.
13
RDY pin low only for instruction commands 8, 9, 10, 2, 3, and the PR hardware pulse: CMD_8 ~ 1 ms; CMD_9,10 ~ 0.12 ms; CMD_2,3 ~ 20 ms. Device operation
at TA = –40°C and V
DD
< 3 V extends the save time to 35 ms.
14
Endurance is qualified to 100,000 cycles as per JEDEC Std. 22 method A117 and measured at VDD = 2.7 V, TA = –40°C to +85°C, typical endurance at 25°C is
700,000 cycles.
15
Retention lifetime equivalent at junction temperature (TJ) = 55°C as per JEDEC Std. 22, Method A117. Retention lifetime based on an activation energy of 0.6eV
will derate with junction temperature as shown in Figure 23 in the Flash/EE Memory description section of this data sheet. The AD5232 contains 9,646
transistors. Die size: 69 mil 115 mil, 7,993 sq. mil.
Specifications subject to change without notice
AD5232