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Cyclone® III Device Family Pin Connection Guidelines
PCG-01003- 1.1 Note (1)
You should create a Quartus® II design, enter your device I/O assignments and compile the design. Quartus II will check your pin connections with respect to I/O assignment and placement rules to ensure proper device operation. These rules are dependent on
device density, package, I/O assignments, voltage assignments, and other factors that are not fully described in this document or the device handbook.
Cyclone III Devices Pin NameCyclone III LS Devices Pin Name
Supply and Reference Pins
VCCINTVCCINTPowerThese are internal logic array voltage supply pins. All VCCINT pins must be connected to 1.2 V supply. Decoupling depends on the
VCCIO[1..8]VCCIO[1..8]PowerThese are I/O supply voltage pins for banks 1 through 8. Each bank can
VREFB[1..8]N[0..2] Note 2VREFB[1..8]N[0..2]I/OInput reference voltage for each I/O bank. If a bank uses a voltage-
VCCA[1..4] Note 3VCCA[1..4]PowerAnalog power for PLLs[1..4]. All VCCA pins must be powered and all VCCA
VCCD_PLL[1..4] Note 3VCCD_PLL[1..4]PowerDigital power for PLLs[1..4]. The designer must power up these pins, even if
Pin Type (1st, 2nd, &
3rd Function)Pin DescriptionConnection Guidelines
design decoupling requirements of the specific board. See Note 5.
Connect these pin to 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V supplies,
support a different voltage level. VCCIO supplies power to the input and
output buffers for all I/O standards. VCCIO powers up the JTAG pins (TCK,
TMS, TDI, and TDO) and the following configuration pins.. nCONFIG, DCLK,
DATA[0..15], nCE, nCEO, nWE, nRESET, nOE, FLASH_nCE, nCSO, and
CLKUSR.
referenced I/O standard for input operation, then these pins are used as the
voltage-reference pins for the bank. If voltage reference I/O standards are
not used in the bank, the VREF pins are available as user I/O pins.
pins must be powered up and powered down at the same time even if not all
the PLLs are used. Designer is advised to keep isolated from other VCC for
better jitter performance.
the PLL is not used.
depending on the I/O standard assigned to the I/O bank. Decoupling depends on
the design decoupling requirements of the specific board. See Note 5.
If VREF pins are not used, the designer should connect them to either the VCCIO
of the I/O bank in which the pin resides or GND. Decoupling depends on the
design decoupling requirements of the specific board. See Note 5. When VREF
pins are used as I/O, they have higher capacitance than regular I/O pins which will
slow the edge rates and affect I/O timing.
The designer must connect these pins to 2.5 V, even if the PLL is not used. These
pins must be powered up and powered down at the same time. Connect
VCCA[1..4] pins together. VCCA supply to the chip should be isolated. See Note 6
for details. See Note 7 for recommended decoupling.
The designer must connect these pins to 1.2 V, even if the PLL is not used.
Connect VCCD_PLL[1..4] pins together. VCCD_PLL supply to the chip should be
isolated. See Note 6 for details. See Note 8 for recommended decoupling.
NAVCCBATPowerBattery back-up power supply for design security volatile key register. The
RUP[1..4]RUP[1..4]I/O, InputReference pins for on-chip termination (OCT) block in I/O banks 2, 4, 5, and
RDN[1..4]RDN[1..4]I/O, InputReference pins for on-chip termination (OCT) block in I/O banks 2, 4, 5, and
GNDGNDGroundDevice ground pins. All GND pins should be connected to the board GND plane.
GNDA[1..4] Note 3GNDA[1..4]Ground Ground for PLLs[1..4] and other analog circuits in the device. The designer can consider connecting the GNDA pins to the GND plane without
NCNCNo ConnectNo Connect.Do not connect these pins to any signal. These pins should be left unconnected,
7. The external precision resistor RUP must be connected to the designated
RUP pin within the same bank when used. If the RUP pin is not used, this pin
can function as a regular I/O pin.
7. The external precision resistor RDN must be connected to the designated
RDN pin within the same bank when used. If the RDN pin is not used, this
pin can function as a regular I/O pin.
Pin Connection GuidelinesPage 2 of 9
Connect this pin to a 3.0 V non-volatile battery power source if using the volatile
key. Its valid operating range is from 1.2 to 3.3-V. When not using the volatile key
tie this to either 1.8-V, 2.5-V or 3.0-V power supply.
When using OCT tie these pins to the required banks VCCIO through either a 25
or 50 resistor, depending on the desired I/O standard. When the device does
not use this dedicated input for the external precision resistor or as an I/O, it is
recommended that the pin be connected to VCCIO of the bank in which the RUP
pin resides or GND.
When using OCT tie these pins to GND through either a 25 or 50 resistor
depending on the desired I/O standard. When the device does not use this
dedicated input for the external precision resistor or as an I/O, it is recommended
that the pin be connected to GND.
isolating the analog ground plane on the board provided the digital GND plane(s)
are stable, quiet, and with no ground bounce effect.
except when device migration requires a different connection to support different
density devices.
Cyclone® III Device Family Pin Connection Guidelines
PCG-01003- 1.1 Note (1)
You should create a Quartus® II design, enter your device I/O assignments and compile the design. Quartus II will check your pin connections with respect to I/O assignment and placement rules to ensure proper device operation. These rules are dependent on
device density, package, I/O assignments, voltage assignments, and other factors that are not fully described in this document or the device handbook.
Cyclone III Devices Pin NameCyclone III LS Devices Pin Name
Dedicated Configuration/JTAG Pins
DCLKDCLKInput (PS, FPP)
Pin Type (1st, 2nd, &
3rd Function)Pin DescriptionConnection Guidelines
Output (AS, AP Note 13)
DCLK is the dedicated configuration clock pin. In PS and FPP configuration,
DCLK is used to clock configuration data from an external source into
Cyclone III device. In AS and AP Note 13 modes, DCLK is an output from
the Cyclone III device that provides timing for the configuration interface.
DCLK should not be left floating. In JTAG configuration and schemes that use an
external host, designer should drive it high or low, whichever is more convenient
on the board. In AS and AP Note 13 mode, the DCLK has an internal pull-up
resistor (typically 25-K) that is always active.
DATA0DATA0Input (PS,FPP,AS)
MSEL[0..3]MSEL[0..3]InputConfiguration input pins that set the Cyclone III device configuration scheme.
nCEnCEInputDedicated active-low chip enable. When nCE is low, the device is enabled.
nCONFIGnCONFIGInputDedicated configuration control input. Pulling this pin low during user-mode
CONF_DONECONF_DONEBidirectional
nSTATUSnSTATUSBidirectional
TCKTCKInputDedicated JTAG input pin. The JTAG circuitry can be disabled by connecting
TMSTMSInputDedicated JTAG input pin. The JTAG circuitry can be disabled by
Bidirectional open-drain
(AP Note 13)
(open-drain)
(open-drain)
Dedicated configuration data input pin. In serial configuration modes, bit-wide
configuration data is received through this pin. In AS mode, DATA0 has an
internal pull-up resistor that is always active. After AS configuration, DATA0
is a dedicated input pin with optional user control. After PS or PP
configuration, DATA0 is available as a user I/O pin and the state of this pin
depends on the Dual-Purpose Pin settings. After AP Note 13 configuration,
DATA0 is a dedicated bidirectional pin with optional user control.
Some of the smaller devices or package options do not support the AP Note
13 flash programming and do not have the MSEL3 pin.
When nCE is high, the device is disabled.
will cause the FPGA to lose its configuration data, enter a reset state and tristate all I/O pins. Returning this pin to a logic high level will initiate
reconfiguration.
This is a dedicated configuration status pin. As a status output, the
CONF_DONE pin drives low before and during configuration. Once all
configuration data is received without error and the initialization cycle starts,
CONF_DONE is released. As a status input, CONF_DONE goes high after
all data is received. Then the device initializes and enters user mode.
This is a dedicated configuration status pin. The FPGA drives nSTATUS low
immediately after power-up and releases it after POR time. As a status
output, the nSTATUS is pulled low if an error occurs during configuration. As
a status input, the device enters an error state when nSTATUS is driven low
by an external source during configuration or initialization.
TCK to GND.
connecting TMS to VCC.
If you are using a serial configuration device in AS configuration mode, you must
connect a 25- series resistor at the near end of the serial configuration device for
the DATA0. If DATA0 is not used, it should be driven high or low, whichever is
more convenient on the board.
These pins are internally connected to 5-K resistor to GND. Do not leave these
pins floating. When these pins are unused connect them to GND. Depending on
the configuration scheme used, these pins should be tied to VCCA or GND. Refer
to Chapter 9 of Cyclone III Device Family Handbook: Configuration, Design
Security, and Remote System Upgrades in Cyclone III Devices. If only JTAG
configuration is used, then connect these pins to GND.
In multi-device configuration, nCE of the first device is tied directly to GND while
its nCEO pin drives the nCE of the next device in the chain. In single device
configuration, nCE is tied directly to GND. The nCE pin must also be held low for
successful JTAG programming of the device. If you are combining JTAG and AS
configuration schemes, then the nCE should be tied to GND through a 10-K
resistor.
If you are using PS configuration scheme with a download cable, connect this pin
through a 10-K resistor to VCCA. For other configuration schemes, if this pin is
not used, this pin must be connected directly or through a 10-K resistor to
VCCIO.
This pin is not available as a user I/O pin. CONF_DONE should be pulled high by
an external 10-K pull-up resistor.
This pin is not available as a user I/O pin. nSTATUS should be pulled high by an
external 10-K pull-up resistor.
Connect this pin to a 1-K resistor to GND.
When interfacing with 2.5 V/3.0 V/3.3 V configuration voltage standards, connect
this pin through a 10-K resistor to VCCA. For configuration voltage of 1.5 V and
1.8 V, connect this pin through a 10-K resistor to VCCIO supply instead. See
Cyclone® III Device Family Pin Connection Guidelines
PCG-01003- 1.1 Note (1)
You should create a Quartus® II design, enter your device I/O assignments and compile the design. Quartus II will check your pin connections with respect to I/O assignment and placement rules to ensure proper device operation. These rules are dependent on
device density, package, I/O assignments, voltage assignments, and other factors that are not fully described in this document or the device handbook.
Cyclone III Devices Pin NameCyclone III LS Devices Pin Name
TDITDIInputDedicated JTAG input pin. The JTAG circuitry can be disabled by connecting
TDOTDOOutputDedicated JTAG output pin. If the TDO pin is not used, leave this pin unconnected.
Clock and PLL Pins
CLK[0,2,4,6,9,11,13,15], DIFFCLK_[0..7]p
Note 4
CLK[0,2,4,6,9,11,13,15], DIFFCLK_[0..7]p Clock, InputDedicated global clock input pins that can also be used for the positive
Pin Type (1st, 2nd, &
3rd Function)Pin DescriptionConnection Guidelines
TDI to VCC.
terminal inputs for differential global clock input or user input pins. These
dedicated clock pins do not support programmable weak pull-up resistor.
When interfacing with 2.5 V/3.0 V/3.3 V configuration voltage standards, connect
this pin through a 10-K resistor to VCCA. For configuration voltage of 1.5 V and
1.8 V, connect this pin through a 10-K resistor to VCCIO supply instead. See
Note 10.
Connect unused pins to GND. SeeNote 9.
CLK[1,3,5,7,8,10,12,14], DIFFCLK_[0..7]n
Note 4
PLL[1..4]_CLKOUTp Note 3PLL[1..4]_CLKOUTpI/O, OutputOptional positive terminal for external clock outputs from PLL [1..4]. These
PLL[1..4]_CLKOUTn Note 3PLL[1..4]_CLKOUTn I/O, OutputOptional negative terminal for external clock outputs from PLL[1..4]. These
Optional/Dual-Purpose Configuration Pins
nCEOnCEOI/O, Output (open-drain) Output that drives low when device configuration is complete. During multi-device configuration, this pin feeds a subsequent device’s nCE pin
FLASH_nCE, nCSOnCSOI/O, Output(AS,
DATA1, ASDODATA1, ASDOInput (FPP)
CLK[1,3,5,7,8,10,12,14], DIFFCLK_[0..7]n Clock, InputDedicated global clock input pins that can also be used for the negative
AP Note 13)
Output (AS)
Bidirectional open-drain
(AP Note 13)
terminal inputs for differential global clock input or user input pins. These
dedicated clock pins do not support programmable weak pull-up resistor.
pins can be assigned to single-ended or differential I/O standards if it is being
fed by a PLL output.
pins can be assigned to single-ended or differential I/O standards if it is being
fed by a PLL output.
This pin functions as FLASH_nCE in AP Note13 mode, and nCSO in
AS mode. This pin has an internal pull-up resistor that is
always active.
nCSO: Output control signal from the Cyclone III device to the serial
configuration device in AS mode that enables the configuration device.
FLASH_nCE: Output control signal from the Cyclone III device
to the parallel flash in AP Note 13 mode that enables the flash.
This pin functions as DATA1 in PS and FPP modes, and as ASDO in AS
mode.
DATA1: Data input in non-AS mode. Byte-wide or word-wide configuration
data is presented to the target device on DATA[0..7] or DATA[0..15]
respectively.
In PS configuration scheme, DATA1 functions as user I/O pin during
configuration, which means it is tri-stated. After FPP configuration, DATA1 is
available as a user I/O pin and the state of this pin depends on the DualPurpose Pin settings.
ASDO: Control signal from the Cyclone III device to the serial configuration
device in AS mode used to read out configuration data. In AS mode, this
ASDO pin has an internal pull-up resistor that is always active. After AS
configuration, this pin is a dedicated output pin with optional user control.
Connect unused pins to GND. SeeNote 9.
Connect unused pins to GND. SeeNote 9.
Connect unused pins to GND. See Note 9.
and must be pulled high to VCCIO by an external 10-K pull-up resistor. During
single device configuration and for the last device in multi-device configuration,
this pin can be left floating or used as a user I/O after configuration.
When not programming the device in AS mode, nCSO is not used. Similarly,
FLASH_nCE is not used when not programming the device in AP Note 13mode. If
the pin is not used as an I/O then it is recommended to leave the pin unconnected.
When not programming the device in AS mode, this pin is available as a user I/O
pin. If the pin is not used as an I/O then it is recommended to leave the pin
Cyclone® III Device Family Pin Connection Guidelines
PCG-01003- 1.1 Note (1)
You should create a Quartus® II design, enter your device I/O assignments and compile the design. Quartus II will check your pin connections with respect to I/O assignment and placement rules to ensure proper device operation. These rules are dependent on
device density, package, I/O assignments, voltage assignments, and other factors that are not fully described in this document or the device handbook.
Cyclone III Devices Pin NameCyclone III LS Devices Pin Name
DATA[2..7] DATA[2..7] Inputs (FPP)
DATA[8..15]NABidirectional (AP Note
PADD[0..23]NAOutput (AP Note 13)24-bit address bus from the Cyclone III device to the parallel flash in AP Note
nRESETNAOutput (AP Note13)Active-low reset output. Driving the nRESET pin low resets the parallel flash. When not programming the device in AP Note 13 mode, nRESET is not used and
nAVDNAOutput (AP Note 13)Active-low address valid output. Driving the nAVD pin low during read or
nOENAOutput (AP Note 13 )Active-low output enable to the parallel flash. Driving the nOE pin low during
nWENAOutput (APNote 13)Active-low write enable to the parallel flash. Driving the nWE pin low during
RDYNAOutput (AP Note13)Control signal (WAIT) from the parallel flash is connected to this pin in the
CRC_ERRORCRC_ERRORI/O, OutputActive high signal that indicates that the error detection circuit has detected
DEV_CLRnDEV_CLRnI/O (when option off),
DEV_OEDEV_OEI/O (when option off),
Pin Type (1st, 2nd, &
3rd Function)Pin DescriptionConnection Guidelines
Bidirectional (AP Note
13)
13)
Input (when option on)
Input (when option on)
Data inputs. Byte-wide or word-wide configuration data is presented to the
target device on DATA [0..7] or DATA [0..15] respectively.
In AS or PS configuration scheme, they function as user I/O pins during
configuration, which means they are tri-stated.
After FPP configuration, DATA [2..7] are available as user I/O pins and the
state of these pins depends on the Dual-Purpose Pin settings.
In the PS, FPP, or AS configuration scheme, they function as user I/O pins
during configuration, which means they are tri-stated.
After AP Note 13 configuration, DATA[8..15] are dedicated bidirectional pins
with optional user control.
13 mode.
write operation indicates to the parallel flash that valid address is present on
the PADD[0..23] address bus.
read operation enables the parallel flash outputs (DATA[0..15] and RDY).
write operation indicates to the parallel flash that data on the DATA[0..15]
bus is valid.
Cyclone III device to indicate when synchronous data is ready on the data
bus.
errors in the configuration SRAM bits. This pin is optional and is used when
the CRC error detection circuit is enabled.
Optional chip-wide reset pin that allows you to override all clears on all
device registers. When this pin is driven low, all registers are cleared; when
this pin is driven high, all registers behave as programmed. The DEV_CLRn
pin does not affect JTAG boundary-scan or programming operations. This
pin is enabled by turning on the Enable device-wide reset (DEV_CLRn)
option in the Quartus II software.
Optional pin that allows you to override all tri-states on the device. When this
pin is driven low, all I/O pins are tri-stated; when this pin is driven high, all I/O
pins behave as defined in the design. This pin is enabled by turning on the
Enable device-wide output enable (DEV_OE) option in the Quartus II
software.
When not programming the device in AS mode, this pin is available as a user I/O
pin. If the pin is not used as an I/O then it is recommended to tie this pin to
VCCIO, GND, or leave the pin unconnected.
When not programming the device in AP Note 13 mode, these pins are available
as user I/O pins. If these pins are not used as I/Os, then it is recommended to tie
this pin to VCCIO, GND, or leave the pin unconnected.
When not programming the device in AP Note 13 mode, these pins are available
as user I/O pins. If these pins are not used as I/Os, then it is recommended to tie
this pin to VCCIO, GND or leave the pin unconnected.
is available as a user I/O pin. If the pin is not used as an I/O then it is
recommended to tie this pin to VCCIO, GND or leave the pin unconnected.
When not programming the device in AP Note 13 mode, nAVD is not used and is
available as a user I/O pin. If the pin is not used as an I/O then it is recommended
to tie this pin to VCCIO, GND or leave the pin unconnected.
When not programming the device in AP Note 13 mode, nOE is not used and is
available as a user I/O pin. If the pin is not used as an I/O then it is recommended
to tie this pin to VCCIO, GND or leave the pin unconnected.
When not programming the device in AP Note 13 mode, nWE is not used and is
available as a user I/O pin. If the pin is not used as an I/O then it is recommended
to tie this pin to VCCIO, GND, or leave the pin unconnected.
The current implementation for AP Note 13 configuration ignores the RDY pin.
However it is highly recommended to connect this pin to the AP Note 13 flash.
When the CRC error detection circuitry is disabled and when this pin is not used
as an I/O then it is recommended to tie this pin to VCCIO, GND or leave the pin
unconnected.
When the input DEV_CLRn is not used and this pin is not used as an I/O then it is
recommended to tie this pin to VCCIO, GND, or leave the pin unconnected.
When the input DEV_OE is not used and this pin is not used as an I/O then it is
recommended to tie this pin to VCCIO, GND, or leave the pin unconnected.
Cyclone® III Device Family Pin Connection Guidelines
PCG-01003- 1.1 Note (1)
You should create a Quartus® II design, enter your device I/O assignments and compile the design. Quartus II will check your pin connections with respect to I/O assignment and placement rules to ensure proper device operation. These rules are dependent on
device density, package, I/O assignments, voltage assignments, and other factors that are not fully described in this document or the device handbook.
Cyclone III Devices Pin NameCyclone III LS Devices Pin Name
INIT_DONEINIT_DONEI/O, Output
CLKUSRCLKUSRI/O, InputOptional user-supplied clock input. Synchronizes the initialization of one or
DIFFIO_[L,R,T,B][0..61][n,p] Note 11DIFFIO_[L,R,T,B][0..47][n,p] Note 11I/O, TX/RX channelDual-purpose differential transmitter/receiver channels. These channels can
Pin Type (1st, 2nd, &
3rd Function)Pin DescriptionConnection Guidelines
(open-drain)
This is a dual-purpose status pin and can be used as an I/O pin when not
enabled as INIT_DONE. When enabled, a transition from low to high at the
pin indicates when the device has entered user mode. If the INIT_DONE
output is enabled, the INIT_DONE pin cannot be used as a user I/O pin after
configuration. This pin is enabled by turning on the Enable INIT_DONE
output option in the Quartus II software.
more devices. If this pin is not enabled for use as a user-supplied
configuration clock, it can be used as a user I/O pin. This pin is enabled by
turning on the Enable user-supplied start-up clock (CLKUSR) option in the
Quartus II software.
be used for transmitting/receiving LVDS compatible signals. Pins with a "p"
suffix carry the positive signal for the differential channel. Pins with an "n"
suffix carry the negative signal for the differential channel. If not used for
differential signaling, these pins are available as user I/O pins.
Connect this pin to a 10-K resistor to VCCIO.
If the CLKUSR pin is not used as a configuration clock input and the pin is not
used as an I/O then it is recommended to connect this pin to GND.
When these I/O pins are not used they can be tied to the VCCIO of the bank they
DQ[0..5][L,R,T,B] Note 12DQ[0..5][L,R,T,B][0..35] Note 12I/O, DQOptional data signal for use in external memory interface.When these I/O pins are not used they can be tied to the VCCIO of the bank they
DM[0..5][L,R,B,T][0..1]/BWS#[0..5][L,R,T,B]DM[0..5][L,R,B,T][0..1]/BWS#[0..5][L,R,T,B][0..3]I/O, DM/BWS#The data mask pins are only required when writing to DDR SDRAM and
I/O, DQS/CQ,DPCLKDual-purpose DPCLK/DQS pins can connect to the global clock network for
I/O, DQS/CQ,CDPCLK Dual-purpose CDPCLK/DQS pins can connect to the global clock network for
high fan-out control signals such as clocks, asynchronous clears, presets
and clock enables. It can also be used as optional data strobe signal for use
in external memory interfacing. These pins drive to dedicated DQS phase
shift circuitry, which allows fine tune of the phase shift for input clocks or
strobes to properly align clock edges needed to capture data.
high fan-out control signals such as clocks, asynchronous clears, presets,
and clock enables. Only one of the two CDPCLK in each corner can feed the
clock control block at a time. The other pin can be used as general-purpose
I/O pin. The CDPCLK signals incur more delay to the clock block control
because they are multiplexed before driving into the clock block control. It
can also be used as optional data strobe signal for use in external memory
interfacing. These pins drive to dedicated DQS phase shift circuitry, which
allows fine tune of the phase shift for input clocks or strobes to properly align
clock edges needed to capture data.
DDR2 SDRAM devices. QDRII SRAM devices use the BWS signal to select
the byte to be written into memory. A low signal on the DM/BWS# pin
indicates that the write is valid. Driving the DM/BWS# pin high results in the
memory masking the DQ signals.
Pin Connection GuidelinesPage 6 of 9
When these I/O pins are not used they can be tied to the VCCIO of the bank they
reside in or GND. See Note 9.
When these I/O pins are not used they can be tied to the VCCIO of the bank they
reside in or GND. See Note 9.
reside in or GND. See Note 9.
When these I/O pins are not used they can be tied to the VCCIO of the bank they
reside in or GND. See Note 9.
Cyclone® III Device Family Pin Connection Guidelines
PCG-01003- 1.1 Note (1)
You should create a Quartus® II design, enter your device I/O assignments and compile the design. Quartus II will check your pin connections with respect to I/O assignment and placement rules to ensure proper device operation. These rules are dependent on
device density, package, I/O assignments, voltage assignments, and other factors that are not fully described in this document or the device handbook.
Cyclone III Devices Pin NameCyclone III LS Devices Pin Name
Pins Used to Turn On the Security Boundary Between I/O Banks
NAB1 Note 14I/O, Power, GroundPins used for setting up the security boundary for TDI, TDO and DATA0.To guarantee physical I/O separation of the JTAG, B1 labeled I/O pins should be
Pin Type (1st, 2nd, &
3rd Function)Pin DescriptionConnection Guidelines
connected to GND. Other B1 labeled pin such as VCCIO and GND pins should
remain their initial function i.e VCCIO pin should remain connected to the power
supply and GND pin should remain connected to ground.
NAB1_B2, B2_B3, B3_B4, B4_B5, B5_B6, B6_B7,
Legend:
Shaded cells indicate pins that are used in AP configuration mode for Cyclone III Devices and other configuration modes (except AP configuration mode) in Cyclone III LS Devices.
Notes:
(1) This pin connection guideline is created based on the largest device density that is EP3C120F780 for Cyclone III Devices and EP3CLS200F780 for Cyclone III LS Devices.
(2) EP3C5 and EP3C10 only support VREFB[1..8]N0.
(3) EP3C5 and EP3C10 only have PLL(1 & 2). EP3C16 and other larger densities have PLL (1,2,3, and 4).
(4) The number of dedicated global clocks for each device density is different. EP3C5 and EP3C10 support four dedicated clock pins on the left and right sides of the device, that can drive a total of 10 global clock networks. EP3C16 and other larger densities support four dedicated clock
pins on each side of the device that can drive a total of 20 global clock networks.
(5) Capacitance values for the power supply decoupling capacitors should be selected after consideration of the amount of power needed to supply over the frequency of operation of the particular circuit being decoupled. A target impedance for the power plane should be calculated based
on current draw and voltage drop requirements of the device/supply. The power plane should then be decoupled using the appropriate number of capacitors. On-board capacitors do not decouple higher than 100 MHz due to “Equivalent Series Inductance” of the mounting of the packages.
Proper board design techniques such as interplane capacitance with low inductance should be considered for higher frequency decoupling. To assist in decoupling analysis, Altera's "Power Distribution Network (PDN) Design Tool" serves as an excellent decoupling analysis tool. The PDN
design tool can be obtained at
Power Distribution Network Design Tool.
(6) Use seperate power island for VCCA and VCCD_PLL. PLL power supply may originate from another plane on the board but must be isolated using a ferrite bead or other equivalent methods. If using a ferrite bead, choose an 0402 package with low DC resistance, higher current rating
than the maximum steady state current for the supply it is connected to(VCCA or VCCD_PLL) and high impedance at 100 MHz.
(7) The VCCA power island can be decoupled with a combination of decoupling capacitors. Please refer to the
Power Distribution Network Design Tool
to determine the decoupling capacitors value. Use 0402 package for 0.1 uF and smaller capacitors for lower mounting inductance. Place 0.1 uF and smaller capacitors as close to the device as possible. On-board capacitors do not decouple higher than 100 MHz due to “Equivalent Series
Inductance” of the mounting of the packages. Proper board design techniques such as interplane capacitance with low inductance should be considered for higher frequency decoupling. To minimize impact on jitter, a 20 mV ripple voltage was used in the analysis for VCCA decoupling.
Refer to Figure <1> for decoupling capacitor placement guidelines. Figure <1> depicts symbolic representation of decoupling scheme and not the exact layout.
(8) The VCCD_PLL power island can be decoupled with a combination of decoupling capacitors. Please refer to the “Power Distribution Network Design Tool” at
Power Distribution Network Design Tool
to determine the decoupling capacitors value. Place 0.1 uF and smaller capacitors as close to the device as possible. On-board capacitors do not decouple higher than 100 MHz due to “Equivalent Series Inductance” of the mounting of the packages. Proper board design techniques such as
interplane capacitance with low inductance should be considered for higher frequency decoupling. To minimize impact on jitter, a 20 mV ripple voltage was used in the analysis for VCCD_PLL decoupling. Refer to Figure <1> for decoupling capacitor placement guidelines. Figure <1> depicts
symbolic representation of decoupling scheme and not the exact layout.
(9) The unused pins must be connected as specified in the Quartus II software settings. The default Quartus II setting for unused pins is 'As inputs tri-stated with weak pull-up resistors', unless for specific pins that Quartus II software connects them to GND automatically. To change the
setting, go to 'Assignments', then 'Device'. Click on 'Device & Pin options' dialog box and go to 'Unused Pins' tab. You may choose the desired setting from the 'Reserve all unused pins' drop down list.
(10) You must follow specific requirements when interfacing Cyclone III device with 2.5 V/3.0 V/3.3 V configuration voltage standards. All I/O inputs must maintain a maximum AC voltage of 4.1 V. Refer to Configuration and JTAG Pin I/O Requirements of Chapter 9: Configuration, Design
Security, and Remote System Upgrades in Cyclone III Devices.
(11) The differential TX/RX channels for each device density and package is different. Please refer to the Cyclone III Device Family Handbook Chapter 7. High-Speed Differential Interfaces in Cyclone III Devices.
(12) For details about the DQ and DQS bus modes support in different device densities, refer to the Cyclone III Device Family Handbook Chapter 8. External Memory Interfaces in Cyclone III Devices.
(13) Configuration in AP mode is only supported in Cyclone III Devices and not in Cyclone III LS Devices.
(14) B1 is not the pin name in the Cyclone III LS Device family but rather the labeled named used for the I/O, power and ground pins used to form the security boundary for TDI, TDO, and DATA0 pin. Please refer to Cyclone III LS Devices Pin-out file for more information.
(15) B1_B2, B2_B3, B3_B4, B4_B5, B5_B6, B6_B7, B7_B8, B8_B1 are not the pin name in the Cyclone III LS Device family but rather the labeled name used for I/O, power, or ground pins used to form the security boundary to separate the banks. Please refer to the Cyclone III LS Devices
Pin-out files for more information.
B7_B8, B8_B1 Note 15
I/O, Power, GroundPhysical pins that are used to turn on the security boundary between the I/O
banks that is specified. For example: B1 for Bank 1 and B2 for Bank 2.
When the I/O pins are used to turn on the security boundary between the I/O
banks, the I/O pins must be connected to GND. The VCCIO and GND pins used to
turn on the security boundary between the I/O banks should remain their initial
function i.e VCCIO pin should remain connected to the power supply and GND pin