ZTE MF206A Users Manual
Version 2.5, 2015-06-18
MF206A
Hardware Development Guide of
Module Product
Hardware Development Guide of Module Product
MF206A
Legal Information
By receiving the document from Shenzhen ZTEWelink Technology Co., Ltd (shortly referred to as
ZTEWelink), you are deemed to have agreed to the following terms. If you don’t agree to the
following terms, please stop using the document.
Copyright © 2013 Shenzhen ZTEWelink Technology Co., Ltd. All rights reserved. The document
contains ZTEWelink’s proprietary information. Without the prior written permission of ZTEWelink,
no entity or individual is allowed to reproduce, transfer, distribute, use and disclose this document or
any image, table, data or other information contained in this document.
is the registered trademark of ZTEWelink. The name and logo of ZTEWelink are
ZTEWelink’s trademark or registered trademark. Meanwhile, ZTEWelink is granted to use ZTE
Corporation’s registered trademark. The other products or company names mentioned in this
document are the trademark or registered trademark of their respective owner. Without the prior
written permission of ZTEWelink or the third-party oblige, no one is allowed to read this document.
The product meets the design requirements of environmental protection and personal security. The
storage, use or disposal of products should abide by the product manual, relevant contract or the laws
and regulations of relevant country.
ZTEWelink reserves the right to make modifications on the product described in this document
without prior notice, and keeps the right to revise or retrieve the document any time.
If you have any question about the manual, please consult the company or its distributors promptly.
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MF206A
Version
Date
Description
1.0
2010-11-18
Initial version
2.0
2011-3-15
Chapter 1:
1. Add the application range and compilation purpose
Chapter 2:
1. Update Table2-1
2. Add the introduction of baseband function and radio frequency;
add the frame structure
Chapter 3:
1. Add the definition of PIN I/O parameter, and provide the
description of PINs
2. Add the feature of interface PWL
Chapter 4:
1. Add the chapter
Chapter 5:
1. Update the RF sourced index and source less index
Chapter 6:
1. Update the testing standard and testing environment
Chapter 7:
1. Add the chapter
Chapter 8:
1. Add the chapter
2.1
2013-03-26
1. Modify the logo of cover and page footer
2. Modify Legal Information
3. Modify some errors in the Table 2-2 of Working Frequency Band
4. Update the Table 1-1 of Supported Document List
5. Modify the chapter of 7.7 of Recommended Upgrade Methods
6. Modify the Figure 7-1 of Main Antenna RF Connector Interface
to erase the IMEI in picture
7. Modify the test result in Table 6-6
8. Modify the name of Table 5-1 to sourceless
2013-05-31
9. Release as Version 2.1
2.2
2013-12-09
1. Modify the Figure 2-2.
2. Add the contact information
Revision History
Hardware Development Guide of Module Product
All Rights reserved, No Spreading abroad without Permission of ZTEWelink II
MF206A
Version
Date
Description
3. Update Document Format
2.3
2013-12-30
1. Add the profile dimensions of RF antenna console
2. Modify part 7.3 of RF Circuit Design
2.4
2014-06-30
1. Update the legal information
2. Add the NOTE in chapter 1.2
3. Update Table 1-1 of Reference Document List
4. Update Table 2-1 of Major Technical Parameters
5. Update Table 3-1 of PIN Parameters
6. Add Table 3–3 of The Mandatory Pins of Module
7. Update Figure 3-3 of SD Typical Application Circuit
8. Modify chapter 3.10 of Power-on/Power-off & Reset Signal
9. Update Figure 3-16 of Reference Circuit of Status Indicator
10. Modify chapter 4.2 of Working Current
11. Move the chapter 4.2 and 4.3 of Power-on/Power-off Flow in the
former document to chapter 3.10
12. Modify Index of RF under UMTS & GPRS/GSM/EDGE Mode
in chapter 5.1 and 5.2
13. Add the NOTE in chapter 6.3
14. Add Figure 9-1 of Recommended PCB Wielding Panel Design
15. Modify Figure 5–1 of Main Antenna RF Connector Interface
16. Modify chapter 10.2 of Furnace Temperature Curve
17. Add chapter 11 of Safety Information
18. Add the chapter 10.3 of Package System
2.5
2015-06-15
1. Add the description of Suspend and Resume of module in
chapter 3.10 &3.7
2. Update the figures of module
Hardware Development Guide of Module Product
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Hardware Development Guide of Module Product
MF206A
Post 9/F, Tower A, Hans Innovation Mansion,
North Ring Rd., No.9018, Hi-Tech Industrial Park,
Nanshan District, Shenzhen. P.R.China
Web www.ztewelink.com
Phone
+86-755-26902600
E-Mail
ztewelink@zte.com.cn
Contact Information
Note: Consult our website for up-to-date product descriptions, documentation, application notes, firmware
upgrades, troubleshooting tips, and press releases
Besides, ZTEWelink provides various technical support ways to the customers, such as support by phone,
website, instant messaging, E-mail and on-site.
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Hardware Development Guide of Module Product
MF206A
Contents
1 About This Document ...................................................................................... 13
1.1 Application Range ............................................................................................................ 13
1.2 Purpose ............................................................................................................................ 13
1.3 Supported & Reference Document List ............................................................................... 13
1.4 Abbreviations ................................................................................................................... 14
2 Product Overview ............................................................................................ 15
2.1 Mechanic Features ............................................................................................................ 16
2.2 Technical Parameters ........................................................................................................ 17
2.3 Function Overview ........................................................................................................... 20
2.3.1 Baseband Function ........................................................................................................... 20
2.3.2 Radio Frequency Function ................................................................................................. 21
3 Interfaces ......................................................................................................... 23
3.1 Definition of PINs ............................................................................................................ 23
3.1.1 Definition of PIN I/O Parameters ....................................................................................... 23
3.1.2 PIN Configuration Diagram ............................................................................................... 23
3.1.3 PIN Description ................................................................................................................ 25
3.2 Working Condition ........................................................................................................... 29
3.3 Feature of Digital Power Level .......................................................................................... 30
3.4 Power Interface ................................................................................................................ 30
3.4.1 Description of Power PINs ................................................................................................ 30
3.4.2 Requirement of Power Supply ........................................................................................... 30
3.5 (U)SIM Card Interface ...................................................................................................... 31
3.5.1 Description of PINs .......................................................................................................... 31
3.5.2 Electric Feature ................................................................................................................ 31
3.5.3 Application of (U)SIM Card Interface ................................................................................ 32
3.6 SD Card Interface ............................................................................................................. 32
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Hardware Development Guide of Module Product
MF206A
3.6.1 Description of PINs .......................................................................................................... 32
3.6.2 Electric Feature ................................................................................................................ 33
3.6.3 Application of SD Card Interface ....................................................................................... 33
3.7 USB2.0 Interface .............................................................................................................. 34
3.7.1 Description of PINs .......................................................................................................... 34
3.7.2 Electric Feature ................................................................................................................ 34
3.7.3 Application of USB Interface............................................................................................. 34
3.8 SPI (Serial Peripheral Interface) Bus Interface .................................................................... 35
3.8.1 Description of PINs .......................................................................................................... 35
3.8.2 Electric Feature ................................................................................................................ 35
3.9 I2C Bus ........................................................................................................................... 36
3.9.1 Description of PINs .......................................................................................................... 36
3.9.2 Electric Feature ................................................................................................................ 37
3.10 UART Interface ................................................................................................................ 38
3.10.1 Description of PINs .......................................................................................................... 38
3.10.2 Electric Feature ................................................................................................................ 38
3.11 JTAG (Joint Test Action Group) Interface .......................................................................... 39
3.11.1 Description of PINs .......................................................................................................... 39
3.11.2 Application of JTAG Interface ........................................................................................... 40
3.12 Power-on/Power-off & Reset Signal ................................................................................... 40
3.12.1 Description of PINs .......................................................................................................... 40
3.12.2 Power-on/Power-off Flow ................................................................................................. 42
3.12.3 Resetting Flow ................................................................................................................. 43
3.13 Interactive Application Interface ........................................................................................ 44
3.13.1 Description of PINs .......................................................................................................... 44
3.13.2 Interface Application ........................................................................................................ 45
3.14 LED Indicator Interface .................................................................................................... 45
3.14.1 Description of PINs .......................................................................................................... 45
3.14.2 Interface Application ........................................................................................................ 46
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Hardware Development Guide of Module Product
MF206A
4 Power Interface Design Guideline ..................................................................... 47
4.1 General Design Rules........................................................................................................ 47
4.2 Power Supply Requirement ............................................................................................... 47
4.3 Circuit Requirements of Power Supply Output .................................................................... 48
4.4 Recommended Power Reference Circuit ............................................................................. 49
4.5 PCB Layout Guideline of Power Supply ............................................................................. 51
5 RF Antenna Design Guide ................................................................................ 53
5.1 Antenna Types ................................................................................................................. 53
5.2 Antenna RF Cable and RF Connector ................................................................................. 53
5.2.1 RF Connector ................................................................................................................... 53
5.2.2 RF Cable.......................................................................................................................... 56
5.3 Design of Antenna ............................................................................................................ 57
5.3.1 Preliminary Antenna Evaluation ........................................................................................ 57
5.3.2 Suggested Antenna Location ............................................................................................. 58
5.3.3 Suggested Antenna Occupancy Space ................................................................................ 58
5.3.4 Matching Circuit of Antenna ............................................................................................. 58
5.3.5 Type of Antenna RF Cable & RF Connector ....................................................................... 59
5.4 Recommended Antenna Manufacturers .............................................................................. 60
5.5 PCB line guidelines .......................................................................................................... 60
5.6 Suggestions for EMC & ESD Design ................................................................................. 61
5.6.1 EMC Design Requirements ............................................................................................... 61
5.6.2 ESD Design Requirements ................................................................................................ 62
5.7 Antenna Indexes ............................................................................................................... 62
5.7.1 Passive Indexes ................................................................................................................ 63
5.7.2 Active Indexes ................................................................................................................. 63
5.7.3 Test Methods for Whole-Set Antenna OTA ........................................................................ 64
6 Electric Feature ............................................................................................... 65
6.1 Power Supply ................................................................................................................... 65
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Hardware Development Guide of Module Product
MF206A
6.2 Working Current .............................................................................................................. 65
7 Technical Index of Radio Frequency ................................................................. 68
7.1 Index of RF under UMTS Mode ........................................................................................ 68
7.1.1 UMTS (WCDMA) ............................................................................................................ 68
7.1.2 Acquiring Radio Frequency Index ...................................................................................... 69
7.1.3 Maximum Transmission Power .......................................................................................... 69
7.1.4 Receiving Sensibility ........................................................................................................ 69
7.1.5 Spurious Emission Index ................................................................................................... 70
7.2 Index of RF under GPRS/GSM/EDGE Mode ...................................................................... 70
7.2.1 Output Transmission Power ............................................................................................... 70
7.2.2 Receiving Sensibility ........................................................................................................ 71
7.2.3 Spurious Emission Index ................................................................................................... 71
8 Related Test & Test Standard ........................................................................... 72
8.1 Testing Reference ............................................................................................................. 72
8.2 Description of Testing Environment ................................................................................... 73
8.3 Reliability Testing Environment ........................................................................................ 74
8.4 Reliability Testing Result .................................................................................................. 75
9 Design Guide ................................................................................................... 77
9.1 General Design Rule & Requirement .................................................................................. 77
9.2 Suggestions for PCB Wielding Panel Design ...................................................................... 77
9.3 Suggestions for Heat-dissipation Design ............................................................................. 78
9.4 Recommended Product Upgrading Plan .............................................................................. 79
10 Manufacturing Guide ....................................................................................... 80
10.1 Design of Steel Mesh ........................................................................................................ 80
10.2 Furnace Temperature Curve .............................................................................................. 81
10.3 Package System ................................................................................................................ 83
11 Safety Information ........................................................................................... 85
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Hardware Development Guide of Module Product
MF206A
Figures
Figure 2–1 Product Illustration ............................................................................................ 15
Figure 2–2 Module Dimensions ........................................................................................... 16
Figure 2–3 System Connection Structure .............................................................................. 21
Figure 3–1 PIN Configuration Diagram ................................................................................ 24
Figure 3–2 (U)SIM Card Signal Connection Circuit ............................................................... 32
Figure 3–3 SD Typical Application Circuit ........................................................................... 33
Figure 3–4 USB Typical Circuit Application ................................................................ ......... 35
Figure 3–5 SPI Bus Sequence Chart ..................................................................................... 36
Figure 3–6 I2C Reference Circuit Diagram ........................................................................... 37
Figure 3–7 Module Serial Port & AP Application Processor .................................................... 39
Figure 3–9 Turn on the Module Using Driving Circuit ............................................................ 41
Figure 3–10 Resetting the Module Using Driving Circuit ........................................................ 41
Figure 3–11 Power-on Sequence Chart of Module.................................................................. 42
Figure 3–12 Power-off Sequence Chart of Module ................................................................. 43
Figure 3–13 Module Resetting Flow ..................................................................................... 44
Figure 3–14 Timing of Resetting Module .............................................................................. 44
Figure 3–16 Reference Circuit of Status Indicator ................................................................ .. 46
Figure 4–1 Power Supply Current and Voltage Change under EDGE/GPRS .............................. 48
Figure 4–2 Add storage capacitor to Module power supply terminal ......................................... 49
Figure 4–3 DC/DC Switching Power Supply ......................................................................... 50
Figure 4–4 LDO Power Supply ................................ ............................................................ 51
Figure 5–1 Main Antenna RF Connector Interface ................................................................. 54
Figure 5–2 Interface of Main Antenna and GPS Antenna Welding Pad ................................ ..... 54
Figure 5–3 RF Interface Testing Console .............................................................................. 55
Figure 5–4 Profile Dimensions of RF antenna console ............................................................ 55
Figure 5–5 Recommended Receptacles Mode for MF206A ..................................................... 57
Figure 5–6 Transition Circuit ............................................................................................... 59
Figure 5–7 The OTA test system of CTIA ............................................................................. 64
Figure 9–1 Recommended PCB Wielding Panel Design.......................................................... 78
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Hardware Development Guide of Module Product
MF206A
Figure 10–1 Recommended Pattern of Steel Mesh on Wielding panel ....................................... 80
Figure 10–2 Furnace Temperature Curve Reference Diagram .................................................. 82
Figure 10–3 The dimensions of Package tray ......................................................................... 83
Figure 10–4 Package process of modules .............................................................................. 84
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Hardware Development Guide of Module Product
MF206A
Tables
Table 1–1 Reference Document List ..................................................................................... 14
Table 1–2 Abbreviation List ................................................................................................ 14
Table 2–1 Major Technical Parameters ................................................................................. 18
Table 2–2 Working Frequency Band .................................................................................... 21
Table 3–1 PIN Parameters ................................................................................................... 23
Table 3–2 PIN Interface Definition ...................................................................................... 25
Table 3–3 Mandatory Pins of Module ................................................................................... 28
Table 3–4 Working Condition ............................................................................................. 29
Table 3–5 Power Level Range of Digital Signal ..................................................................... 30
Table 3–6 Definition & Description of (U)SIM Card Signal Group .......................................... 31
Table 3–7 Definition of SD Card Signal Interface .................................................................. 32
Table 3–8 Definition of SPI Signal ....................................................................................... 35
Table 3–9 Definition of UART Signal .................................................................................. 38
Table 3–10 Definition of JTAG Signal ................................................................................. 39
Table 3–11 Power-on/Power-off Time .................................................................................. 43
Table 3–12 Interactive Application Interface ......................................................................... 44
Table 3–13 Definition of LED PIN Signal ............................................................................. 45
Table 3–14 Definition of Indicator Status .............................................................................. 46
Table 5–1 The Cable Consumption ...................................................................................... 56
Table 5–2 Passive Indexes of Main Antennas on PAD Products ............................................... 63
Table 5–3 ZTEWelink Indexes for Mobile Terminal Devices .................................................. 63
Table 6–1 Input Voltage ..................................................................................................... 65
Table 6–2 Averaged standby DC power consumption ............................................................. 65
Table 6–3 Averaged idle mode DC power consumption .......................................................... 66
Table 6–4 Averaged DC power consumption in working state ................................................. 66
Table 7–1 Maximum Transmission Power ............................................................................ 69
Table 7–2 Reference Table of Receiving Sensitivity ............................................................... 69
Table 7–3 Spurious Emission Index...................................................................................... 70
Table 7–4 Output Transmission Power of GSM850/900/1800/1900 (GMSK) ............................ 70
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Hardware Development Guide of Module Product
MF206A
Table 7–5 Reference Table of Receiving Sensitivity ............................................................... 71
Table 8–1 Testing Standard ................................................................................................. 72
Table 8–2 Testing Environment ........................................................................................... 73
Table 8–3 Testing Instrument & Device ................................................................................ 74
Table 8–4 Reliability Features ............................................................................................. 74
Table 8–5 Temperature Testing Result Under Windless Environment ....................................... 75
Table 8–6 High/Low-temperature Running & Storage Testing Result ....................................... 75
Table 10–1 Curve Temperature Curve Parameter Setting ........................................................ 81
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Hardware Development Guide of Module Product
MF206A
1 About This Document
1.1 Application Range
This document is applicable as the hardware development guide of MF206A WCDMA module products. The
user can design the product according to the requirement and guidance in this document. It is only applicable for
the hardware application and development of MF206A WCDMA module products.
1.2 Purpose
This document provides the hardware solutions and development fundamentals for a product with the
ZTEWelink module. By reading this document, the user can have an overall knowledge of MF206A and a clear
understanding of the technical parameters. With this document, the user can successfully fulfill the application
and development of wireless 3G Internet product or equipment.
Besides the product features and technical parameters, this document also provides the product reliability tests
and related testing standards, service function implementation flow, RF performance indexes and a guide on the
design of user circuits, to provide the user with a complete design reference.
NOTE:
To ensure the module manufacturing and welding quality, do as the chapter 10 of Manufacturing Guide in
this document. The force on the squeegee should be adjusted so as to produce a clean stencil surface on a
single pass and ensure the module soldering quality
1.3 Supported & Reference Document List
Besides the hardware development document, ZTEWelink also provides the board operation guide, software
development guide and upgrading plan guide of MF206A. Table 1–1 is the list of supported documents.
All Rights reserved, No Spreading abroad without Permission of ZTEWelink 13
MF206A
NO.
Document Name
1
ZTEWelink LGA Type Ⅱ Module Dev Board User Guide.pdf
2
ZTEWelink Software Development Guide of Module
Products.pdf
3
AT Commands reference guide for ZTEWelink WCDMA
Modules.pdf
4
ZTEWelink SMT & Baking User Guide of Module Products.pdf
Abbreviations
Full Name
AP
Another name of DTE
BER
Bit Error Rate
DL
Downlink
DPCH
Dedicated Physical Channel
ESD
Electro-Static discharge
ECT
Electric Connector Technology CO.,LTD
GPRS
General Packet Radio Service
GSM
Global Standard for Mobile Communications
I/O
Input/output
LED
Light Emitting Diode
PWL
Power Level
SIM
Subscriber Identification Module
SMT
Surface Mount Technology
SPI
Serial Peripheral Interface
UMTS
Universal Mobile Telecommunication System
WCDMA
Wideband Code Division Multi Access
1.4 Abbreviations
Hardware Development Guide of Module Product
Table 1–1 Reference Document List
Table 1–2 is a list of abbreviations involved in this document, as well as the English full names.
Table 1–2 Abbreviation List
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Hardware Development Guide of Module Product
MF206A
2 Product Overview
MF206A is a wireless Internet module with LGA interface. A rich set of internet protocols and abundant
functions extend the applicability of the module to a wide range of M2M applications such as metering, tracking
systems, security solutions, routers, wireless POS, mobile computing devices, PDAs, tablet PC and so on. The
features of module are described as below.
1. It can support UMTS 850(900)/1900/2100MHz frequency band, and GSM/GPRS/EDGE
850/900/1800/1900MHz frequency band.
2. It can provide high-speed data access service under the mobile environment.
3. It provides the SPI interface, I2C interface, (U)SIM card interface (3.0V/1.8V), USB2.0 interface, UART
interface, SD2.0 interface, power-on/power-off, and resetting.
Figure 2–1 Product Illustration
Note: The figures above are just for reference.
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Hardware Development Guide of Module Product
MF206A
2.1 Mechanic Features
MF206A is a 108-pin LGA encapsulation module. Except for the signal PIN, there are many dedicated
heat-dissipation ground wielding panel to improve the grounding performance, mechanical strength and
heat-dissipation performance. There are altogether 30 heat-dissipation ground wielding panels, evenly
distributed at the bottom of PCB. The dimensions of 108-pin LGA encapsulation are 26*36mm, and the height is
2.5+/-0.2mm. The location of PIN 1 is identified by the ground wielding panel with an inclination at the bottom,
and its angle orientates to the top welding panel of the corresponding module. Figure 2–2 is a figure about the
dimensions of module, and the unit of dimensions is mm.
Figure 2–2 Module Dimensions
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MF206A
Hardware Development Guide of Module Product
(Top View)
2.2 Technical Parameters
The major features of module can be described from the aspects of mechanic feature, base band, radio frequency,
technical standard and environment feature. Table 2-1 is a list of the major technical parameters and features
supported by module.
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MF206A
Name
Item
Specifications
Mechanical
Feature
Dimensions
36mm * 26mm * (2.5+/-0.2)mm
Weight
About 5.5g
Encapsulation type
LGA package(108 Pin)
Baseband
Processor architecture
ARM 9 architecture
(U)SIM/SIM
Standard 6 PIN SIM card interface
Support 3V SIM card and 1.8V SIM card
Memory
32MByte NAND Flash/128MByte DDR
USB interface
USB 2.0 HIGH SPEED, the data transfer rate can reach up to 480
Mbps.
Can be used for AT command communication, data transmission,
GNSS NMEA output, software debug and firmware upgrade
UART interface
Used for AT command, data transmission or Diag service
And can be switch by the command of +UART
Maximum power
consumption
2.2W
note1
Power Supply
The range of voltage supply is 3. 4V-4.2V, and the typical value
is3.8V
Working current
note2
Peak current
≤2A (3.8V)
Average normal working current
≤500mA (3.8V)
Average normal working current
(without services)
≤75mA
Standby current
≤5mA (3.8V)
RF
GSM band
EDGE/GPRS/GSM Quad-band: GSM850, EGSM900, DCS1800,
PCS1900.
UMTS band
UMTS: 2100/1900/850(900)MHz
RxDiv band
NA
note
3
Max. Transmitter Power
UMTS2100/1900/850(900): Power Class 3 (+24 +1/-3dBm)
GSM/GPRS 850MHz/900MHz: Power Class 4 (+33±2dBm)
GSM/GPRS 1800MHz/1900MHz: Power Class 1 (+30±2dBm)
EDGE 850MHz/900MHz: Power Class E2 (+27±3dBm)
EDGE 1800MHz/1900MHz: Power Class E2 (+26 -4/+3dBm)
Receiving sensitivity
WCDMA2100: ≤-106.7dBm
WCDMA1900/850: ≤-104.7dBm
Hardware Development Guide of Module Product
Table 2–1 Major Technical Parameters
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MF206A
Name
Item
Specifications
WCDMA900: ≤-103.7dBm
GSM850/900/1800/1900: ≤-102dBm
Main antenna interface
Support
Receive diversity (GPS)
antenna interface
Support the GPS wielding panel interface, don’t support the diversity
antenna interface .We don’t provide the antenna, and the antenna is
provided by the third party.
Technical
Standard
Data rate
GSM CS: UL 9.6kbps/DL 9.6kbps
GPRS: Multi-slot Class 10
EDGE: Multi-slot Class 12
WCDMA CS: UL 64kbps/DL 64kbps
WCDMA PS: UL 384kbps/DL 384kbps
HSDPA: DL 3.6Mbps
GPRS type
Class B
3GPP protocol
R99,R5
Other protocols
Support embedded TCP /UDP protocols
Support PPP protocol
Support the protocols PAP (Password Authentication Protocol) and
CHAP (Challenge Handshake Authentication Protocol) usually used
for PPP connections.
Operating system
Windows XP (SP2 and later)
Windows Vista
Windows 7
WinCE5.0/6.0 (X86 and ARM)
Linux
Android 2.x / 4.x
Environment
Feature
note4
Normal Working
Temperature
-30 to 75° C
Storage Temperature
-45 to 90° C
Humidity
5%~ 95%
Application
RAS dialup
Support
GPS/AGPS
Support
SMS
Support Text and PDU mode.
Point to point MO and MT.
SMS Status Report & SMS centre address setting
Hardware Development Guide of Module Product
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Hardware Development Guide of Module Product
MF206A
Name
Item
Specifications
Management of SMS: read, write, send, receive, delete, storage
status, SMS list, new SMS alert
Network locking
Support
SIM READER
Support
AT Commands
Compliant with 3GPP TS 27.007, 27.005 and ZTEWelink AT
commands.
Upgrading
Support, the time of upgrading is less than 12min.
NOTE:
1: Test condition: The maximum power consumption of the module refers to the average value measured
under the maximum transmission power;
2: In the working current, the peak current, average normal working current, average normal working
current (without services) are all the maximum value measured under the maximum power consumption.
The standby current refers to the current under the SLEEP mode
3: NA means unrelated.
4: Using the module beyond these conditions may result in permanent damage to the module.
2.3 Function Overview
2.3.1 Baseband Function
The baseband part of module mainly includes the following signal groups: USB signal, (U)SIM card signal,
wakeup signal, working status indicator signal, UART signal, SD interface signal, I2C interface signal, module
power-on/resetting signal, SPI, main antenna interface, GPS antenna interface and power-supply interface.
Figure 2–3 is a diagram of the system connection structure.
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MF206A
PA and
Switch
RF
Baseband
Memory
108 Pin LGA Connector Interface
USB
USIM
UART
I2C
SD
SPI
LED
POWER
JTAG
RESET
Data Bus
Address Bus
Control
Communication
Tx
SAW
Filter
Main Antenna
Filter
RX
GPS Antenna
Rx
ADC
Working Frequency Band
Uplink Frequency Band
Downlink Frequency Band
UMTS850
824 MHz — 849 MHz
869 MHz — 894 MHz
UMTS900
880 MHz — 915 MHz
925 MHz — 960 MHz
Hardware Development Guide of Module Product
Figure 2–3 System Connection Structure
2.3.2 Radio Frequency Function
The radio frequency function of module can be viewed from the aspect of over-the-air wireless bearer network,
frequency band, whether the receive diversity feature is supported, and the GPS function.
1. Support UMTS 850(900)/1900/2100MHz;
2. Support GSM/EDGE/GPRS 850/900/1800/1900 MHz;
3. Support GPS/AGPS;
The working frequency band of module is as shown in Table 2–2.
Table 2–2 Working Frequency Band
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MF206A
UMTS1900
1850 MHz — 1910 MHz
1930 MHz — 1990 MHz
UMTS2100
1920 MHz — 1980 MHz
2110 MHz — 2170 MHz
GSM850
824 MHz — 849MHz
869 MHz — 894 MHz
GSM900
890 MHz — 915MHz
935 MHz — 960MHz
GSM1800
1710 MHz — 1785MHz
1805 MHz — 1880MHz
GSM1900
1850 MHz — 1910MHz
1930 MHz — 1990MHz
Hardware Development Guide of Module Product
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MF206A
PIN Attribute
Description
DI
Digital Input Pin
DO
Digital Output Pin
AI
Analog Input Pin
AO
Analog Output Pin
B
Two-way digital port, CMOS
input
Z
High-resistance output
P1
PIN group 1, the power supply
voltage is VDD_P1
P2
PIN group 2, the power supply
voltage is VDD_P2
PU
PIN internal pull-up
PD
PIN internal pull-down
3 Interfaces
3.1 Definition of PINs
3.1.1 Definition of PIN I/O Parameters
The definition of module I/O parameter is as shown in Table 3–1.
Table 3–1 PIN Parameters
Hardware Development Guide of Module Product
3.1.2 PIN Configuration Diagram
The PIN sequence of interfaces on module is defined as shown in Figure 3–1.
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MF206A
2 3
4
5 6 7 8 9
10 11 12 14 15 16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41424344454647484950
51
5253545556
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79 80 81 82 83
84 85 86 87 88
89 90 91 92 93
94 95 96 97 98
99 100 101 102 103
104 105 106 107 108
13
1
ANT_MAIN
GND
JTAG_RESOUT_N
PON_RST_N
POWER_ON
AP_READY
I2C_SCL
I2C_SDA
MODULE_READY
AP_WAKEUP_MODULE
MODULE _WAKEUP_AP
GND
NC
GND
NC
NC
NCSPI_CLK
NC
MODULE_POWERON
LED_GREEN
LED_RED
LED_BLUE
VPH_PWR
VPH_PWR
VPH_PWR
VPH_PWR
UART_CTS
UART_RFR
UART_TXD
UART_RXD
GND
NC
NC
NC
NC
GND
ADC
GND
SPI_CS_N
SPI_DATA_MI_SO
SPI_DATA_MO_SI
USB_VBUS
GND
USB_DP
USB_DM
GND
VREG_RUIM
UIM_DATA
UIM_CLK
UIM_RST
UIM_DP
UIM_DM
GND
VREG_SDCC
SDCC_CMD
SDCC_CLK
SDCC_DATA3
SDCC_DATA2
SDCC_DATA1
SDCC_DATA0
SD_DET_N
GND
NC
NC
GND
NC
NC
GND
GPS_ANT
GND
JTAG_TRST_N
JTAG_RTCK
JTAG_TCK
JTAG_TDO
JTAG_TDI
JTAG_TMS
GND
Hardware Development Guide of Module Product
Figure 3–1 PIN Configuration Diagram
(Top View)
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MF206A
PIN
Signal Definition
Voltage
I/O
PIN Attribute
PU/PD
Remark
1
ANT_MAIN
--
AI/
AO
Main antenna feedback
point(50 ohm)
-2
GND
--
--
Ground
--
3
JTAG_RESOUT_N
P1
DI
JTAG reset LGA
module
--
4
PON_RST_N
P1
DI
Reset the module
--
Pull-up to 1.8V internally.
Active low.
5
POWER_ON
P1
DI
Turn on/off the
module.
PU
Pull-up to 1.8V internally.
6
AP_READY
P1
DI
Module queries AP
sleep status
-7
I2C_SCL
P1 B I2C serial clock
-- 8
I2C_SDA
P1 B I2C serial data
--
9
MODULE_READY
P1
DO
AP queries Module
sleep status
--
10
AP_WAKEUP_MOD
ULE
P1
DI
AP wakes up Module
--
Low-power level wakeup.
To make the module
standby, the AP needs to
raise up this low signal.
11
MODULE
_WAKEUP_AP
P1
DO
Module wakes up AP
-12
GND
--
--
--
--
13
NC
--
--
--
--
--
14
GND
--
--
--
-- 15
NC
--
--
--
--
--
16
NC
--
--
--
--
--
17
NC
--
--
--
--
--
18
NC
--
--
--
--
--
19
MODULE_POWER
ON
P1
DO
MODULE power-on
status indicator
--
20
LED_GREEN
P1
AO
Signal indicator
interface
--
high-current driver.
3.1.3 PIN Description
Hardware Development Guide of Module Product
Table 3–2 PIN Interface Definition
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MF206A
PIN
Signal Definition
Voltage
I/O
PIN Attribute
PU/PD
Remark
21
LED_RED
P1
AO
Signal indicator
interface
--
high-current driver.
22
LED_BLUE
P1
AO
Signal indicator
interface
--
high-current driver.
23
VPH_PWR
Vmax =
4.2V
Vmin =
3.4V
Vnorm =
3.8V
AI
Power supply
--
It must be able to provide
sufficient current in a
transmitting burst which
typically rises to 2.0A.
24
VPH_PWR
--
25
VPH_PWR
--
26
VPH_PWR
--
27
UART_CTS
P1
DI(
HV
)
UART clear to send
signal
--
-28
UART_RFR
P1
DO
UART ready for
receive signal
--
--
29
UART_TXD
P1
DO
UART transmit data
output
--
--
30
UART_RXD
P1
DI
UART receive data
input
--
-31
GND
--
--
Ground
--
--
32
NC
--
--
--
--
--
33
NC
--
--
--
--
--
34
NC
--
--
--
--
--
35
NC
--
--
--
--
--
36
GND
--
--
Ground
--
--
37
ADC
--
AI
Analog / Digital
converter input
--
-38
GND
--
--
Ground
--
--
39
SPI_CS_N
P1
DO
SPI interface channel
signal
--
-40
SPI_CLK
P1
DO
SPI clock signal
--
--
41
SPI_DATA_MI_SO
P1 B SPI data IO signal
--
--
42
SPI_DATA_MO_SI
P1 B SPI data IO signal
--
--
43
USB_VBUS
--
AI
Power sense for the
internal USB
--
Pay attention to the
power-on sequence of
Hardware Development Guide of Module Product
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