8-Channel, 8-Bit A/D Converter with Track and Hold,
and Unique R-Ladder A
■
Z86C84 has two 8-Bit D/A Converters with
Programmable Gain Stages, 3 µ s Settling Time
(KB)
RAM*
(Bytes)
GND
I/O
Lines
Offset Control
Voltage
Range
Z86C83/C84
®
Z8
MCU M
■
Six Vectored, Prioritized Interrupts from Six Different
Sources
■
Two Analog Comparator Inputs with Programmable
Interrupt Polarity
■
Two Programmable 8-Bit Timers, each with a 6-Bit
Programmable Prescaler
■
Auto Latch Mask Option for P00, P01, and P02
■
Power-On Reset (POR) Timer
■
Permanent Watch-Dog Timer (WDT) Mask Option
■
Software-Programmable Pull-Up Resistors
■
On-Chip Oscillator for Crystal, Resonator or LC
ICROCONTROLLERS
1
GENERAL DESCRIPTION
The Z86C83/C84 Consumer Controller Processors
™
(CCP
) are full-featured members of the CMOS Z8 microcontroller family offering a unique register-to-register architecture that avoids accumulator bottlenecks for higher
code efficiency than RISC processors.
The Z86C83/C84 are designed to be used in a wide variety
of embedded control applications, such as appliances,
process controls, keyboards, security systems, battery
chargers, and automotive modules.
For applications requiring powerful I/O capabilities, the
Z86C83/C84 devices can have up to 21/17 (C83/C84
respectively) pins dedicated to input and output. These
lines are grouped into three ports, and are configured by
software to provide digital/analog I/O timing and status
signals.
An on-chip, half-flash 8-bit ± 1/2 Least Significant Bit (LSB)
A/D converter can multiplex up to eight analog inputs.
DS96DZ802031
Unused analog inputs revert to standard digital I/O use.
Unique, programmable A
resistor ladder compresses the converter's dynamic range
for maximum effective 9-bit A/D resolution.
The Z86C84 has two 8-bit ± 1/2 LSB D/A converters. High
and low reference voltages provide precise control of the
output voltage range. Programmable gain for each D/A
converter provides a maximum effective 10-bit resolution
for many tasks.
On-chip 8-bit counter/timers with many user-selectable
modes simplify real-time tasks, such as counting, timing,
and generation of PWM signals.
The designer can prioritize six different maskable,
vectored, internal or external interrupts for efficient
interrupt handling and multitasking functions.
offset control of the A/D
GND
Z86C83/C84
®
Z8
MCU Microcontrollers
GENERAL DESCRIPTION (Continued)
By means of an expanded register file, the designer has
access to additional control registers for configuring peripheral functions including the A/D and D/A converters,
counter/timers, and I/O port functions (Figure 1).
Notes: All Signals with a preceding front slash, "/", are
active Low, e.g., B//W (WORD is active Low); /B/W (BYTE
is active Low, only).
Ambient Temperature under Bias–40+105C
Storage Temperature–65+150C
Voltage on any Pin with Respect to V
Voltage on V
Pin with Respect to V
CC
Voltage on /RESET Pins with Respect to V
Total Power Dissipation770mW
Maximum Current out of V
Maximum Current into V
SS
CC
Maximum Current into an Input Pin [Note 3]–600+600
Maximum Current into an Open-Drain Pin [Note 4]–600+600
Maximum Output Current Sinked by Any I/O Pin25mA
Maximum Output Current Sourced by Any I/O Pin25mA
Notes:
1. This applies to all pins except XTAL and /RESET pins and where otherwise noted.
2. There is no input protection diode from pin to V
3. This excludes XTAL pins.
4. Device pin is not at an output Low state.
[Note 1]–0.6+7V
SS
SS
[Note 2]–0.6V
SS
–0.3+7V
+1V
CC
140mA
125mA
.
CC
A
A
)
Notice:
Stresses greater than those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. This is a stress rating only; functional operation of
the device at any condition above those indicated in the
operational sections of these specifications is not implied.
Exposure to absolute maximum rating conditions for an
extended period may affect device reliability.
STANDARD TEST CONDITIONS
The characteristics listed below apply for standard test
conditions as noted. All voltages are referenced to
Ground. Positive current flows into the referenced pin
(Figure 6).
Total power dissipation should not exceed 770 mW for the
package. Power dissipation is calculated as follows:
Total Power Dissipation =V
x [ I
CC
– (sum of I
CC
+ sum of [ (V
+ sum of (V
CC
– V
0L
x I
OH
OH
) x I
0L
) ]
OH
]
From Output
Under Test
I
150 pF
Figure 6. Test Load Diagram
V
SPECIFICATION
DD
V
= 3.0V to 5.5V
DD
DS96DZ802035
Z86C83/C84
®
Z8
MCU Microcontrollers
CAPACITANCE
TA = 25°C, VCC = GND = 0V, f = 1.0 MHz, unmeasured pins returned to GND.
ParameterMinMax
Input capacitance020 pF
Output capacitance020pF
I/O capacitance020 pF
6DS96DZ80203
1
DC ELECTRICAL CHARACTERISTICS
Z86C83/C84
Z8® MCU Microcontrollers
Sym Parameter
V
Clock Input High
CH
Voltage
= 0° C
T
V
CC
A
to +70°C
Note 3
3.0V0.7 VCCVCC+0.30.7 VCCVCC+0.31.3VDriven by External Clock
5.5V0.7 V
CCVCC
+0.30.7 VCCVCC+0.32.5VDriven by External Clock
TA = –40°C
to +105°C
Typical
[13]
@ 25°C Units ConditionsNotesMinMaxMinMax
Generator
Generator
V
Clock Input Low
CL
Voltage
3.0V GND-0.3 0.2 VCCGND-0.3 0.2 V
5.5V GND-0.3 0.2 V
GND-0.3 0.2 V
CC
0.7VDriven by External Clock
CC
Generator
1.5VDriven by External Clock
CC
Generator
V
Input High Voltage 3.0V0.7 VCCVCC+0.30.7 VCCVCC+0.31.3V
IH
5.5V0.7 V
Input Low Voltage 3.0V GND-0.3 0.2 VCCGND-0.3 0.2 V
V
IL
CCVCC
5.5V GND-0.3 0.2 V
V
Output High
OH1
Voltage
Output Low
V
OL1
Voltage
Output Low
V
OL2
Voltage
Reset Input High
V
RH
Voltage
V
Reset Input Low
Rl
Voltage
Comparator Input
V
OFFSET
3.0VVCC-0.4VCC-0.43.1VIOH = -2.0 mA8
5.5VV
-0.4VCC-0.44.8VIOH = -2.0 mA8
CC
3.0V0.60.60.2VIOL = +4.0 mA8
5.5V0.40.40.1VI
3.0V1.21.20.3VIOL = +6 mA8
5.5V1.21.20.3VI
3.0V.8 V
5.5V.8 V
CC
CC
3.0V GND-0.3 0.2 VCCGND-0.3 0.2 V
5.5V GND-0.3 0.2 V
3.0V252510mV10
+0.30.7 VCCVCC+0.32.5V
0.7V
CC
CC
V
CC
V
CC
CC
GND-0.3 0.2 V
.8 V
.8 V
CC
CC
V
V
GND-0.3 0.2 V
CC
CC
CC
CC
CC
1.5V
1.5V
2.1V
1.1V
1.7V
= +4.0 mA8
OL
= +12 mA8
OL
Offset
Voltage5.5V252510mV10
I
Input Leakage3.0V-11-12<1µAVIN = OV, V
IL
5.5V-11-12<1µAVIN = OV, V
I
Output Leakage3.0V-11-12<1µAVIN = OV, V
OL
5.5V-11-12<1µAVIN = OV, V
I
Reset Input
IR
Current
I
Supply Current3.0V20207mA @ 16 MHz4, 15
CC
3.0V-130-130-25µA
5.5V-180-180-40µA
CC
CC
CC
CC
5.5V252520mA @ 16 MHz4, 15
5.0V773mA @ 3.58 MHz4, 15
5.0V10105mA @ 8 MHz4, 15
I
Standby Current3.0V4.54.52.0mA HALT Mode VIN = OV, VCC @ 16
8. Maximum frequency for internal system clock is 4 MHz when using XTAL divide-by-one mode.
9. For XTAL and LC oscillator, and for oscillator driven by clock driver.
voltage specification of 3.0V guarantees 3.3V ±0.3V, and the V
CC
for a logic 1 and 0.2 VCC for a logic 0.
CC
A
cc
4 MHz4 MHz
MinMaxMinMax
voltage specification of 5.5V guarantees 5.0V ±0.5V.
CC
Units Notes
11DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
AC ELECTRICAL CHARACTERISTICS
Handshake Timing Diagrams
Data In
/DAV
(Input)
RDY
(Output)
Data Out
Data In Valid
12
3
456
7
Next Data In Valid
Delayed DAV
Delayed RDY
Figure 8. Input Handshake Timing
Data Out Valid
Next Data Out Valid
/DAV
(Output)
RDY
(Input)
89
10
Figure 9. Output Handshake Timing
Delayed DAV
11
Delayed RDY
12DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
AC ELECTRICAL CHARACTERISTICS (Continued)
Handshake Timing Table
T
= 0°C to +70°CTA = –40°C to +105°C
V
CC
NoSymbolParameter
Note1,2
1TsDI(DAV)Data In Setup Time3.0V0000IN
5.5V0000IN
2ThDI(DAV)Data In Hold Time3.0V160160160160IN
5.5V115115115115IN
3TwDAVData Available Width3.0V155155155155IN
5.5V110110110110IN
4TdDAVI(RDY)DAV Fall to RDY Fall Delay3.0V160160160160IN
5.5V115115115115IN
5TdDAVId(RDY) DAV Rise to RDY Rise Delay3.0V120120120120IN
5.5V80808080IN
6TdRDY0(DAV)RDY Rise to DAV Fall Delay3.0V0000IN
5.5V0000IN
7TdD0(DAV)Data Out to DAV Fall Delay3.0V42314231OUT
5.5V42314231OUT
8TdDAV0(RDY)DAV Fall to RDY Fall Delay3.0V0000OUT
5.5V0000OUT
9TdRDY0(DAV)RDY Fall to DAV Rise Delay3.0V160160160160OUT
5.5V115115115115OUT
10 TwRDYRDY Width3.0V110110110110OUT
5.5V80808080OUT
11 TdRDY0d(DAV) RDY Rise to DAV Fall Delay3.0V110110110110OUT
5.5V80808080OUT
Notes:
1. Timing Reference uses 0.7 V
2. The V
voltage specification of 3.0V guarantees 3.3V ±0.3V and the VCC voltage specification of 5.5V guarantees 5.0V ±0.5V.
CC
for a logic 1 and 0.2 VCC for a logic 0.
CC
A
12 MHz16 MHz12 MHz16 MHz
Min Max Min Max Min Max Min Max
Data
Direction
13DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
Table 5. D/A Converter Electrical Characteristics
VCC = 3.3V ± 10%
ParameterMinimumTypicalMaximumUnits
Resolution8Bits
Integral non-linearity0.251LSB
Differential non-linearity0.250.5LSB
Setting time, 1/2 LSB1.53.0µsec
Zero Error at 25°C1020mV
Full Scale error at 25°C0.250.5LSB
Supply Range3.03.33.6Volts
Power dissipation, no load10mW
Ref Input resistance2K4K10KOhms
Output noise voltage50µVp-p
VDHI
range at 3 volts1.51.82.1Volts
VDLO range at 3 volts0.20.50.8Volts
VDHI–VDLO, at 3 volts1.31.61.9Volts
Capacitive output load, CL20pF
Resistive output load, RL50KOhms
Output slew rate1.03.0V/µsec
Notes:
Voltage: 3.0V to 3.6V
Temp: 0–70°C
Table 6. D/A Converter Electrical Characteristics
VCC = 5.0V ±10%
ParameterMinimumTypicalMaximumUnits
Resolution8Bits
Integral non-linearity0.251LSB
Differential non-linearity0.250.5LSB
Setting time, 1/2 LSB1.53.0†µsec
Zero Error at 25°C1020mV
Full Scale error at 25°C12% FSR
Supply Range4.55.05.5Volts
Power dissipation, no load5085mW
Ref Input resistance2K4K10KOhms
Output noise voltage50µVp-p
VDHI range at 5 volts2.63.5Volts
VDLO range at 5V volts0.81.7Volts
VDHI–VDLO, at 5V volts0.92.7Volts
Capacitive output load, CL30pF
Resistive output load, RL20KOhms
Output slew rate1.03.0V/µsec
Notes:
Voltage: 4.5V - 5.5V
Temp: 0-70°C
† The C84 Emulator has maximum setting time of 20 µsec. (10 µsec. typical).
14DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
AC ELECTRICAL CHARACTERISTICS (Continued)
Table 7. A/D Converter Electrical Characteristics
VCC = 3.3V ± 10%
ParameterMinimumTypicalMaximumUnits
Resolution8Bits
Integral non-linearity0.51LSB
Differential non-linearity0.51LSB
Zero Error at 25°C5.0mV
Supply Range3.03.33.6Volts
Power dissipation, no load2040mW
Clock frequency24MHz
Input voltage rangeVA
LO
VA
HI
Conversion time4.335 X SCLKµsec
Input capacitance on ANA2540pF
VAHI rangeVA
rangeAN
VA
LO
VAHI -–VA
Notes:
Voltage: 3.0V to 3.6V
Temp: 0-70°C
SCLK = System Clock on Bus Speed.
LO
+2.5AV
LO
GND
AVCC–2.5Volts
2.5AV
CC
CC
Volts
Volts
Volts
Table 8. A/D Converter Electrical Characteristics
VCC = 5.0V ±10%
ParameterMinimumTypicalMaximumUnits
Resolution8Bits
Integral non-linearity0.51LSB
Differential non-linearity0.51LSB
Zero Error at 25°C45mV
Supply Range4.55.05.5Volts
Power dissipation, no load5085mW
Clock frequency33MHz
Input voltage rangeVA
LO
VA
HI
Volts
Conversion time4.335 X SCLKµsec
Input capacitance on ANA2540pF
VAHI rangeVA
VALO rangeAN
-–VA
VA
HI
Notes:
Voltage: 4.5V –5.5V
Temp: 0-70°C
Conversion time is defined as the time from initiation of A-D conversion to storage of the digital result in the ADR register.
SCLK = System Clock on Bus Speed.
LO
+2.5AV
LO
GND
AVCC–2.5Volts
2.5AV
CC
CC
Volts
Volts
15DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
PIN FUNCTIONS
Application Precaution
The production test-mode environment may be enabled
accidentally during normal operation if
surges above V
occur on the /RESET pin.
cc
Recommendations for dampening voltage surges in both
test and OTP mode include the following:
■Using a clamping diode to /RESET
■Adding a capacitor to the affected pin
XTAL1.
Crystal 1
(time-based input). This pin connects a
parallel-resonant crystal, ceramic resonator, LC network
or an external single-phase clock to the on-chip oscillator
input.
XTAL2.
Crystal 2
(time-based output). This pin connects a
parallel-resonant crystal, ceramic resonator, LC network to
the on-chip oscillator output.
Port 0 P00-P06.
Z86C84).
Port 0 is a 7-bit, bidirectional, CMOS-compatible
(P03-P06 is not available on the
I/O port. These seven I/O lines can be nibble
programmable as P00-P03 input/output and P04-P06
input/output, separately (Figure 10). All input buffers are
Schmitt-triggered and output drivers are push-pull. There
is a ROM mask option to enable 100K (±40%) pull-up
resistors to Port 0, P00 to P02.
excessive noise
Port 2 (P27-P20) Port 2 is an 8-bit, bi-directional, CMOS-
compatible I/O port and an 8-channel muxed input to the
8-bit ADC. When configured as a digital input, by
programming the Port2 Mode register, the Port 2 register
can be evaluated to read digital data applied to Port 2, or
the ADC result register can be read to evaluate the analog
signals applied to Port 2 after configuring the ADC Control
Registers. The direction of each of the eight Port 2 I/O lines
can be configured individually (Figure 11).
In addition, all four versions of the device provide the
capability of connecting 10K (±20%) pull-up resistors to
each of the Port 2 I/O lines individually. The pull-ups are
connected when activated through software control of
P2RES register (Figure 67) when the corresponding Port
2 pin is configured to be an input. The pull-up resistor of a
Port 2 I/O line is automatically disabled when the
corresponding I/O is an output, regardless of the state of
the corresponding P2RES bit value.
Note: The Z86C83/C84 Emulator does not emulate the
P2RES Register. Selection of the pull-ups are done via
jumper settings on the emulator.
Port 0 Auto Latch.
(Auto Latch Mask Option available
only on P00-P02. P03-P06 has the Auto Latches
permanently enabled.)
The Auto Latch provides valid
CMOS Levels when P00-P06 (P00-P02 on C84) are
selected as inputs and not externally driven. It is
impossible to determine if a non-driven input is 1 or 0,
however; the Auto Latch will sense the input condition and
drive a valid CMOS level, thereby eliminating a floating
mode that could cause excessive current. (Auto Latch is a
ROM mask option for the Z86C83, Z86C84).
Port 3 (P37-P30). Port 3 is a 6-bit, CMOS-compatible
port, with three fixed inputs (P33-P31) and three fixed
outputs (P34-P36), configured under software control for
Input/Output, Counter/Timers, interrupt, and port
handshake. P31, P32, and P33 are standard CMOS inputs
(no Auto Latches). Pins P34, P35, and P36 are push-pull
output lines (Figure 11). Low EMI output buffers can be
globally programmed by the software.
Two on-board comparators can process analog signals on
P31 and P32 with reference to the voltage on P33. The
analog function is enabled by programming Port 3 Mode
Register (P3M bit 1). For Interrupt functions, Port 3, pin 3
is falling-edge interrupt input. P31 and P32 are
programmable as rising, falling, or both edge triggered
interrupts (IRQ register bits 6 and bit 7). P33 is the
comparator reference voltage input when in Analog Mode.
Access to Counter/Timers 1 is made through P31 (T
P36 (T
). Handshake lines for Ports 0 and 2 are available
OUT
) and
IN
on P31/P36 and P32/P35 (Table 9).
Port 3 also provides the following control functions:
handshake for Ports 0 and 2 (/DAV and RDY); three
external interrupt request signals (IRQ2-IRQ0); timer input
and output signals (TIN and T
OUT
).
Table 9. Port 3 Pin Assignments
Pin I/OCTC1 AnalogInt.P0 HS P2 HS
P31 INT
AN1IRQ2D/R
IN
P32 INAN2IRQ0 D/R
P33 INREFIRQ1
P34 OUTAN1-OUT
P35 OUTR/D
P36 OUT T
Notes:
HS = Handshake Signals
D = /DAV
R = RDY
OUT
R/D
Auto Latch. The Auto-Latch instruction puts valid CMOS
levels on all CMOS inputs (except P33-P31) that are not
externally driven. Whether this level is 0 or 1, cannot be
determined. A valid CMOS level, rather than a floating
node, reduces excessive supply current flow in the input
buffer.
Notes:
1. Deletion of Port Auto Latches is available as a ROM
mask option. The Auto Latch Delete option is selected
by the customer when the ROM code is submitted.
2. Ports 03, 04, 05, 07 have permanently enabled Auto
Latches.
Comparator Inputs. Port 3, P31 and P32, each have a
comparator front end. The comparator reference voltage,
P33, is common to both comparators. In analog mode, the
P33 input functions as a reference voltage to the
comparators. In Analog Mode, the internal P33 register
and its corresponding IRQ1 is connected to the Stop-Mode
Recovery source selected by the SMR register. In this
mode, any of the Stop-Mode Recovery sources are used
to toggle the P33 bit or generate IRQ1. In Digital Mode,
P33 can be used as a Port 3 register input or IRQ1 source.
P34 outputs the comparator outputs by software
programming the PCON Register bit D0 to 1.
19DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
P36
P35
Z86C83/C84
P31 (AN1)
P32 (AN2)
P33 (REF)
P34
P33
P32
P31
+
-
+
-
Port 3
R247 = P3M
DIG.
AN
D1
Port 3 (I/O)
1 = Analog
0 = Digital
IRQ2, T
, P31 Data Latch
IN
IRQ0, P32 Data Latch
From Stop-Mode Recovery
IRQ1, P33 Data Latch
Source
Figure 12. Port 3 Input Configuration
20DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
PIN FUNCTIONS (Continued)
Port Configuration Register (PCON). The PCON con-
figures the ports individually for comparator output on Port
3. The PCON Register is located in the Expanded Register
File at Bank F, location 00 (Figure 13).
Bit 0 multiplexes comparator AN1 Output at P34. A "1" in
this location brings the comparator output to P34
PCON (F) 00
D7 D6 D5D4 D3D2 D1D0
(Figure 14), and a "0" puts P34 into its standard I/O
configuration.
Note: Only comparator output AN1 is multiplexed to a
Port 3 output. Comparator AN2 output is not connected to
any pins. Note that the PCON Register is reset upon the
occurrence of a WDT RESET (not in Stop Mode), and
Power-On Reset (POR).
Comparator
Output Port 3
0 P34 Standard Output
*
1 P34 Comparator Output
Reserved (Must be 1.)
0 Port 0 Open-Drain
1 Port 0 Push-Pull*
P31
Figure 13. Port Configuration Register (PCON) (Write-Only)
P34 OUT
REF (P33)
Reserved (Must be 1.)
* Default setting from Stop-Mode Recovery,
Power-On Reset, and any WDT Reset.
Normal
0 P34 Standard Output
1 P34 Comparator Output
Reset Condition
*
*
+
-
AN1
PCON
D0
P34
PAD
Figure 14. Port 3 P34 Output Configuration
21DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
FUNCTIONAL DESCRIPTION
RESET.
(Input, Active Low)
. This pin initializes the MCU.
Reset is accomplished either through Power-On Reset
(POR), Watch-Dog Timer (WDT) Reset, or external reset.
During POR, and WDT Reset, the internally generated
reset is driving the reset pin Low for the POR time.
Any
devices driving the reset line must be open-drain to
avoid damage from a possible conflict during reset
conditions.
Pull-up is provided internally.
After the POR time, /RESET is a Schmitt-triggered input.
After the reset is detected, an internal RST signal is
latched and held for an internal register count of 18
external clocks, or for the duration of the external reset,
whichever is longer. Program execution begins at location
000C (hex), 5-10 TpC cycles after the RST is released. For
POR, the reset output time is T
POR
.
Program Memory. C83/C84 can address up to 4 KB of
internal Program Memory (Figure 15). The first 12 bytes of
program memory are reserved for the interrupt vectors.
These locations contain six 16-bit vectors that correspond
to the six available interrupts. Bytes 13 to 4095 consist of
on-chip, mask-programmed ROM.
ROM Protect. The 4 KB of Program Memory is mask
programmable. A ROM protect feature will prevent
dumping of the ROM contents from an external program
outside the ROM.
Expanded Register File. The register file has been
expanded to allow for additional system control registers
and for mapping of additional peripheral devices and
input/output ports into the register address area. The Z8
register address space R0 through R15 is implemented as
16 groups of 16 registers per group (Figure 16). These
register banks are known as the Expanded Register File
(ERF). Bits 3-0 of the Register Pointer (RP) select the
active ERF bank. Bits 7-4 of register RP select the working
register group (Figure 17). Four system configuration
registers reside in the ERF address space in Bank F and
eight registers reside in Bank C. The rest of the ERF
addressing space is not physically implemented, and is
open for future expansion.
Note: When using Zilog's Cross Assembler version 2.1 or
earlier, use the LD RP, #0X instruction rather than the SRP
#0X instruction to access the ERF.
2048/4096
Location of
First Byte of
On-Chip
ROM
Instruction
Executed
After RESET
Interrupt
Vector
(Lower Byte)
Interrupt
Vector
12
11
10
IRQ5
IRQ5
9
8
7
6
5
4
3
IRQ4
IRQ4
IRQ3
IRQ3
IRQ2
IRQ2
IRQ1
(Upper Byte)
2
1
0
IRQ1
IRQ0
IRQ0
Figure 15. Program Memory Map
22DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
FUNCTIONAL DESCRIPTION (Continued)
\
101
UUUU00
RESET CONDITION
U
U
UUU 0 1
00100000
1
1
1
1
1
1
1
1
RESET CONDITION
UUUUUUU
UUUUUU0
U
U
UUU
U
UU
UU
UUU0U
UUU1U
UUUUUU
UUUUUUUUU1U
UUU
UUU
U
UUU
0
0
000
0UUU
UUUU
0
0
0
UUUUUUU
1U0
U
0000
0
000UUU
0
00
0
0
U
U
UUUUUU
UUUUUU
UUUUUU
U
UUU
Reserved
WDTMR
STANDARD CONTROL REGISTERS
®
Z8
(F) 0F
REGISTER**
EXPANDED REG. GROUP (F)
*
(F) 0E
SMR2
Reserved
Reserved
SMR
(F) 0D
(F) 0C
(F) 0A
(F) 0B
†
REGISTER POINTER
6543210
7
Reserved
Reserved
Reserved
Reserved
(F) 09
(F) 08
(F) 07
(F) 06
Group Pointer
Expanded Register
Z8 Register File**
Group Pointer
Working Register
Reserved
(F) 05
FF
FO
Reserved
(F) 04
Reserved
(F) 03
Reserved
(F) 02
Reserved
(F) 01
PCON
(F) 00
*
ADR1
Reserved
Reserved
(C) 0E
(C) 0D
Reserved
Reserved
(C) 0C
(C) 0B
EXPANDED REG. GROUP (C)
REGISTER
Reserved
(C) 0F
Reserved
Reserved
RESET CONDITION
7F
0F
00
EXPANDED REG. GROUP (0)
REGISTER**
ADC1
(C) 09
(C) 0A
*
UU
UUUUUU
U1 1 1U U
UU
P3
P2
(0) 03
(0) 02
*
*
*
U
UUU
UU
UU
(0) 01P1
ADC0
(C) 08
*
UU
UUU
U
U
U
P0
(0) 00
DAC2
(C) 07
*
DAC1
(C) 06
*
DACR1
DACR2
(C) 04
(C) 05
*
*
P2RES
(C) 03
*
Reserved
Reserved
(C) 02
(C) 01
Reserved
(C) 00
T1
TMR
U
UU
U
UU
U
UU
UUUU
UUU
Reserved
F0
0
00
00
000000
U
0
0
0U
U = Unknown
Notes:
* Will not be reset with a Stop--Mode Recovery
** All addresses are in Hexadecimal
† Will not be reset with a Stop-Mode Recovery, except Bit 0.
GPR
SPL
RP
FFFEFDFCFBFAF9
REGISTER**
0
0
0
D0
D3 D2 D1
D5 D4
RESET CONDITION
D7 D6
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
FLAGS
U
U
U
U
U
U
U
U
IMR
IRQ
U0U
U0U
U0U
U0U
0
U
0
U
U0U
0
0
IPR
P01M
P3M
P2M
P0T0P1
F7
1
1
1
0
0
F5F4F3F2F1
F6
*
*
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
0
U
U
U
UU
UUU
U
UUUUU
UU
F8
0
U
U
0
1
U
Figure 16. Expanded Register File Architecture
23DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
RPR253
D7 D6 D5 D4 D3 D2 D1 D0
Note: Default Setting After Reset = 00000000
Expanded Register Group
Working Register Group
r7 r6 r5 r4
The upper nibble of the register file address
provided by the register pointer specifies
the active working-register group.
FF
F0
r3 r2 r1 r0
R253
(Register Pointer)
R15 to R0
Figure 17. Register Pointer Register
Register File. The Register File consists of three I/O port
registers, 237 general-purpose registers, 15 control and
status registers, and four system configuration registers in
the Expanded Register Group (Figure 16). The
instructions can access registers directly or indirectly
through an 8-bit address field. This allows a short 4-bit
register address using the Register Pointer (Figure 18). In
the 4-bit mode, the Register File is divided into 16 working
register groups, each occupying 16 continuous locations.
The Register Pointer addresses the starting location of the
active working-register group.
Note: Register Bank E0-EF is only accessed through
working registers and indirect addressing modes.
CAUTION: D4 of Control Register P01M (R251) must
be 0.
7F
70
6F
60
5F
50
4F
40
3F
30
2F
20
1F
10
0F
00
* Expanded Register File Bank (0) is selected
in this figure by handling bits D3 to D0 as "0"
in Register R253 (RP).
Specified Working
Register Group
Register Group 1
Register Group 0*
I/O Ports*
Figure 18. Register Pointer
The lower nibble
of the register
file address
provided by the
instruction points
to the specified
register.
R15 to R0
R15 to R4*
R3 to R0*
R254. The C83/C84 has one extra general-purpose
register located at FEH (R254). It is set to 00H after any
reset.
Stack. The C83/C84 has an 8-bit Stack Pointer (R255)
used for the internal stack that resides within the 236
general-purpose registers. Register R254 cannot be used
for stack.
General-Purpose Registers (GPR). These registers are
undefined after the device is powered up. The registers
keep their last value after any reset, as long as the reset
occurs in the V
voltage-specified operating range. It will
CC
not keep its last state from a VLV reset if the VCC drops below
RAM Protect. The upper portion of the RAM’s address
spaces %80F to %EF (excluding the control registers) are
protected from reading and writing. The RAM Protect bit
option is mask-programmable and is selected by the
customer when the ROM code is submitted. After the mask
option is selected, the user activates this feature from the
internal ROM code to turn off/on the RAM Protect by
loading either a 0 or 1 into the Interrupt Mask (IMR)
register, bit D6. A 1 in D6 enables RAM Protect.
1.8V. This includes Register R254.
Note: Register Bank E0-EF is only accessed through
working register and indirect addressing modes.
24DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
FUNCTIONAL DESCRIPTION (Continued)
Counter/Timers. There are two 8-bit programmable
counter/timers (T0-T1), each driven by its own 6-bit
programmable prescaler. The T1 prescaler is driven by
internal or external clock sources; however, the T0
prescaler is driven by the internal clock only (Figure 19).
The 6-bit prescalers can divide the input frequency of the
clock source by any integer number from 1 to 64. Each
prescaler drives its counter, which decrements the value
(1 to 256) that has been loaded into the counter. When the
counter reaches the end of the count, a timer interrupt
request, IRQ4 (T0) or IRQ5 (T1), is generated.
The counters can be programmed to start, stop, restart to
continue, or restart from the initial value. The counters can
OSC
D1 (SMR)
WriteWriteRead
÷2
Initial Value
D0 (SMR)
also be programmed to stop upon reaching zero (single
pass mode) or to automatically reload the initial value and
continue counting (modulo-n continuous mode).
The counters,
but not the prescalers
, are read at any
time without disturbing their value or count mode. The
clock source for T1 is user-definable and is either the
internal microprocessor clock divide-by-four, or an
external signal input through Port 3. The Timer Mode
register configures the external timer input (P31) as an
external clock, a trigger input that can be retriggerable or
non-retriggerable, or as a gate input for the internal clock.
The counter/timers can be cascaded by connecting the T0
output to the input of T1. T
Mode is enabled by setting
IN
R243 PRE1 Bit D1 to 0.
Internal Data Bus
PRE0
Register
T0
Initial Value
Register
T0
Current Value
Register
÷16
Clock
Logic
TIN P31
Internal
Clock
External Clock
÷4
Internal Clock
Gated Clock
Triggered Clock
Figure 19. Counter/Timer Block Diagram
÷4
WriteWriteRead
6-Bit
Down
Counter
6-Bit
Down
Counter
PRE1
Initial Value
Register
8-bit
Down
Counter
8-Bit
Down
Counter
T1
Initial Value
Register
Internal Data Bus
÷2
Current Value
Register
IRQ4
TOUT
P36
IRQ5
T1
25DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
Interrupts. The Z8 has six different interrupts from six
different sources. These interrupts are maskable,
prioritized (Figure 20) and the six sources are divided as
follows: four sources are claimed by Port 3 lines P33-P30,
and two in counter/timers (Table 10). The Interrupt Mask
Register globally or individually enables or disables the six
interrupt requests.
IRQ1, 3, 4, 5
When more than one interrupt is pending, priorities are
resolved by a programmable priority encoder that is
controlled by the Interrupt Priority register. An interrupt
machine cycle is activated when an interrupt request is
granted. This action disables all subsequent interrupts,
saves the Program Counter and Status Flags, and then
branches to the program memory vector location reserved
for that interrupt.
IRQ0 IRQ2
Interrupt
Edge
Select
IRQ
IRQ (D6, D7)
IMR
6
Global
Interrupt
Enable
Interrupt
Request
IPR
PRIORITY
LOGIC
Vector Select
Figure 20. Interrupt Block Diagram
Table 10. Interrupt Types, Sources, and Vectors
NameSourceVector LocationComments
IRQ0/DAV0, IRQ00, 1External (P32), Rise/ Fall Edge Triggered
IRQ1,IRQ12, 3External (P33), Fall Edge Triggered
IRQ2/DAV2, IRQ2, T
IN
4, 5External (P31), Rise /Fall Edge Triggered
IRQ3IRQ36, 7By User Software
IRQ4T08, 9Internal
IRQ5T110, 11Internal
26DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
FUNCTIONAL DESCRIPTION (Continued)
All Z8 interrupts are vectored through locations in the
program memory. This memory location and the next byte
contain the 16-bit address of the interrupt service routine
for that particular interrupt request. To accommodate
polled interrupt systems, interrupt inputs are masked and
the Interrupt Request register is polled to determine which
of the interrupt requests need service.
An interrupt resulting from AN1 is mapped into IRQ2, and
an interrupt from AN2 is mapped into IRQ0. Interrupts
IRQ2 and IRQ0 may be rising, falling, or both edge
triggered, and are programmable by the user. The
software may poll to identify the state of the pin.
Programming bits for the Interrupt Edge Select is located
in the IRQ Register (R250), bits D7 and D6. The
configuration is shown in Table 11.
Table 11. IRQ Register
IRQInterrupt Edge
D7D6P31P32
00FF
01FR
10RF
11R/FR/F
Notes:
F = Falling Edge
R = Rising Edge
Clock. The Z8 on-chip oscillator has a high-gain, parallelresonant amplifier for connection to a crystal, LC, RC,
ceramic resonator, or any suitable external clock source
(XTAL1 = Input, XTAL2 = Output). The crystal should be
AT cut, 16 MHz max., with a series resistance (RS) of less
than or equal to 100 Ohms when clocking from 1 MHz to
16 MHz.
The crystal should be connected across XTAL1 and
XTAL2 using the vendor's recommended capacitor values
from each pin directly to the device Ground pin to reduce
Ground noise injection into the oscillator.
Note: For better noise immunity, the capacitors should be
tied directly to the device Ground pin (V
).
SS
XTAL1
C1
VSS* *
XTAL2
C2
VSS* *
Ceramic Resonator or
Crystal
C1, C2 = 47 pF TYP *
f = 8 MHz
* Preliminary value including pin parasitics
* * Device ground pin
VSS* *
VSS* *
C1
C2
LC
C1, C2 = 22 pF
L = 130 uH *
f = 3 MHz *
L
XTAL1
XTAL2
XTAL1
XTAL2
External Clock
Figure 21. Oscillator Configuration
27DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
Analog-to-Digital Converter
The Analog-to-Digital (ADC) is an 8-bit half flash converter
that uses two reference resistor ladders for its upper 4 bits
(MSBs) and lower 4 bits (LSBs) conversion. Two reference
voltage pins, AVCC and A
reference voltage supplies. During the sampling period
from one of the eight channel inputs, the converter is also
being auto-zeroed before starting the conversion. The
conversion time is dependent on the internal clock
frequency. The minimum conversion time is 35 X
SCLK(see Figure 22).
The ADC is controlled by the Z8® and its three registers
(two Control and one Result) are mapped into the
Extended Register File. A conversion can be initiated by
writing to the ADC Control Register 0 after the ADC
Control Register 1 is configured.
The start command is implemented in such a way as to
begin a conversion at any time, if a conversion is in
progress and a new start command is received, then the
conversion in progress will be aborted and a new
conversion will be initiated. This allows the programmed
values to be changed without affecting a conversion-in-
, are provided for external
GND
progress. The new values will take effect only after a new
start command is received.
The ADC can be disabled (for low power) or enabled by a
Control Register bit.
Though the ADC will function for a smaller input voltage
and voltage reference, the noise and offsets remain
constant over the specified electrical range. The errors of
the converter will increase and the conversion time may
also take slightly longer due to smaller input signals.
ADC Calibration Offset
Specially matched resistors are program-enabled to allow
35.0 percent or 50 percent offset from A
selectively enable these resistors to offset the A
percent (2.5V to 5V) or 50 percent (1.75V to 5V) thereby
allowing the 8-bit ADC across a narrower voltage range.
This will allow significant resolution improvement within
the reduced voltage range.
Note: The AV
must be the same value as VCC and A
CC
must be the same value as GND.
. They may
GND
by 35.0
GND
GND
EXT
Start
A/D
Control
88
8
Reg.
ADC0
A/D
Result
Reg.
8
ADR1
A/D
Control
Reg.
ADC1
Converter
Vref +
A/D
Converter
Vref GND
Selected
Channel
Vcc
Sample
and
Hold
4
ADC Register
9
D4, D5
AV
CC
A
GND
Calibration Offset
Figure 22. ADC Architecture
28DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
FUNCTIONAL DESCRIPTION (Continued)
ADC0 (A) Bank C, Register 8
D7 D6 D5 D4 D3 D2 D1 D0
CSEL0
CSEL1
CSEL2
SCAN
0 = No action. *
1 = Convert, then stop.
AIN/Input/Output Control
0 = No action *
1 = Enable selected channel
(D
on associated Port 20-27
Must be D7 = 0
* Default After Reset
D6 = 0
D5 = 1
Figure 23. ADC Control Register 0 (Read/Write)
2,D1,D0
) as analog input
ADE (bit 7). A zero disables any A/D conversions or
accessing any ADC registers except writing to ADE bit. A
one Enables all ADC accesses. ADC result register is
shown in Figure 25.
Figure 27 shows the input circuit of the ADC. When
conversion starts the analog input voltage is connected to
the MSB and LSB flash converter inputs as shown in the
Input Impedance CKT diagram. Effectively, shunting 31
parallel internal resistance of the analog switches and
simultaneously charging 31 parallel 0.5 pF capacitors,
which is equivalent to seeing a 400 Ohms input impedance
CMOS Switch
on Resistance
2 - 5 k Ω
V Ref
R Source
V Ref
C Parasitic
in parallel with a 16 pF capacitor. Other input stray
capacitance adds about 10 pF to the input load. For input
source resistances up to 2 kOhms can be used under
normal operating condition without any degradation of the
input settling time. For larger input source resistance,
longer conversion cycle time may be required to
compensate the input settling time problem.
C .5 pF
31 CMOS Digital
C .5 pF
Comparators
V Ref
Figure 27. Input Impedance of ADC
Typical Z8 A/D Conversion Sequence
1. Set the register pointer to Extended Bank (C),that is,
SRP #%0C instruction.
2. Next, set ADE flag by loading ADC1 Control Register
Bank (C) Register 9, bit 7. Also, load bits 0-4 of this
same register to select a AVCC or A
precision voltage divider connected to the A/D
resistive ladder can offset conversion dynamic range
to specified limits within the AV
loading Bank (C) Register 9, bits 0-4, with the
appropriate value it is possible to select from these
groups:
a. No Offset. The Converter Dynamic range is from
0V to 5.0V for AVCC = 5.0V.
offset value. A
GND
and A
CC
limits. By
GND
C .5 pF
3. Select one of the eight A/D inputs for conversion by
loading Bank (C) Register 8 with the desired attributes:
Bits 0 - 2 select an A/D input, bits 3 and 4 select A/D
conversion (or digital port I/O).
4. Set Bank (C) Register 8, bit 3 to enable A/D
conversion. (This flag can be set concurrently with
step 3.) This flag is automatically reset when the A/D
conversion is completed, so a bit test can be
performed to determine A/D readiness if necessary.
5. Read the A/D result in Bank (C) Register A. Please
note that the A/D result is not valid (indeterminate)
unless ADE flag (Register 9, bit 7) was previously set,
otherwise A/D converter output is tri-stated.
The Z86C84 has two Digital-to-Analog Converters
(DACs). Each DAC is an 8-bit resistor string, with a
programmable 0.25X, 0.5X, or 1X gain output buffer. The
DAC output voltage settles after the internal data is latched
into the DAC Data register. The top and bottom ends of the
resistor ladder are register-selected to be connected to
either the analog supply rails, AVCC and A
externally-provided reference voltages, VDHI and VDLO.
External references are recommended to explicitly set the
DAC output limits. Since the gain stage cannot drive to the
, or two
GND
supply rails, VDHI and VDLO must be within ranges shown
in the specifications. If either reference approaches the
analog supply rails, the output will be unable to span the
reference voltage range. The externally provided
reference voltages should not exceed the supply voltages.
The DAC outputs are latch-up protected and can drive
output loads (Figure 28).
Note: The AVCC must be the same value as VCC and A
must be the same value as GND
VDHI
GND
PAD
Data
Bus
AVCC
8
8
DACn
Data
Register
DACRn
Control
Register
(n = 1 or 2)
8
Figure 28. DAC Block Diagram
High
8-Bit
Resistor
Ladder
Low
Note:
* DACRn Control Register Bits
Analog
+
-
AGND
Programmable
Gain
* Bits 0, 1
DAC1
or
DAC2
PAD
PAD
VDLO
31DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
The D/A conversion for DAC1 is driven by writing 8-bit data
to the DAC1 data register (Bank C, Register 06H). The
D/A conversion for DAC 2 is controlled by the DAC2 data
register (Bank C, Register 07H). Each DAC data register
is initialized to midrange 80H on power-up.
There are two DAC control registers: DACR1 (Bank C,
Register 04H) for DAC1, and DACR2 (Bank C, Register
05H) for DAC2. Control register bits 0 and 1 set the DAC
gain. When DAC data is 80H, the DAC output is constant
for any gain setting (Figure 29 and Figure 31).
DACR1 Bank C, Register 4
D7 D6 D5 D4 D3 D2 D1 D0
DACR2 Bank C, Register 5
D7 D6 D5 D4 D3 D2 D1 D0
DAC2 Gain
0 0 1 X
0 1 1/2 X
1 0 1 Not Used
1 1 1/4 X
DAC2 Enable
0 Disable
1 Enable
Reserved (Must be 0)
Figure 31. D/A 2 Control Register
Figure 29. D/A 1 Control Register
DAC1 Bank C, Register 6
D7 D6 D5 D4 D3 D2 D1 D0
0 = Low Level
1 = High Level
Figure 30. D/A 1 Data Register
DAC1 Gain
0 0 1 X
0 1 1/2 X
1 0 1 Not Used
1 1 1/4 X
DAC1 Enable
0 Disable
1 Enable
Reserved (Must be 0)
AC2 Bank C, Register 7
D7 D6 D5 D4 D3 D2 D1 D0
= Low Level
= High Level
Figure 32. D/A 2 Data Register
32DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
FUNCTIONAL DESCRIPTION (Continued)
DAC Output in Volts
3.5V
VDHI
2% accuracy
2.15
1.7
1.26
.8VDLO
1/4X
1/2X
080H
Notes:
Vcc = 5.0V ±10%
VDHI = 3.5V
VDLO = 0.8V
1X
3.5
3.05
2.6
2.15
FFH
DAC Data Register Value
Figure 33. Gain Control on DAC
Power-On Reset (POR). A timer circuit clocked by a
dedicated on-board RC oscillator or by the XTAL oscillator
is used for the POR timer function. The POR time allows
VCC and the oscillator circuit to stabilize before instruction
execution begins. The POR timer circuit is a one-shot timer
triggered by one of three conditions:
■Power Fail to Power OK Status
■Stop-Mode Recovery (If D5 of SMR Register = 1)
■WDT Time-Out (Including from Stop Mode)
The POR time is T
minimum. Bit 5 of the STOP Mode
POR
Register determines whether the POR timer is bypassed
after Stop-Mode Recovery (typical for external clock, and
RC/LC oscillators with fast start up time).
HALT. Turns off the internal CPU clock but not the XTAL
oscillation. The counter/timers and external interrupts
IRQ0, IRQ1, and IRQ2 remain active. The device is
recovered by interrupts, either externally or internally
generated (a POR or a WDT time-out). An interrupt
request must be executed (enabled) to exit HALT mode.
After the interrupt service routine, the program continues
from the instruction after the HALT. In case of a POR or a
WDT time-out, program execution will restart at address
000CH.
STOP. This instruction turns off the internal clock and
external crystal oscillation and reduces the standby
current to 10 µA (typical) or less. The STOP mode is
terminated by a reset of either WDT time-out, POR, or
Stop-Mode Recovery. This causes the processor to restart
the application program at address 000CH.
33DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
In order to enter STOP (or HALT) mode, it is necessary to
first flush the instruction pipeline to avoid suspending
execution in mid-instruction. To do this, the user must
execute a NOP (opcode = FFH) immediately before the
appropriate sleep instruction, that is,
FFNOP; clear the pipeline
6FSTOP; enter STOP mode
or
FFNOP; clear the pipeline
7FHALT; enter HALT mode
STOP-Mode Recovery (SMR) Register. This register selects the clock divide value and determines the mode of
STOP-Mode Recovery (Figure 34 and Figure 35). All bits
are Write-Only, except bit 7, which is Read-Only. Bit 7 is a
flag bit that is hardware set on the condition of STOP recovery and reset by a power-on cycle. Bit 6 controls whether a low level or a high level is required from the recovery
source. Bit 5 controls the reset delay after recovery. Bits 2,
3, and 4, or the SMR Register, specify the source of the
STOP-Mode Recovery signal. Bits 0 and 1 determine the
timeout period of the WDT. The SMR Register is located in
Bank F of the Expanded Register Group at address 0BH.
When the Stop-Mode Recovery sources are selected in
this register, then SMR2 Register bits D0,D1 must be set
to 0.
Stop-Mode Recovery Source
000 POR Only and/or External Reset*
001 Reserved
010 P31
011 P32
100 P33
101 P27
110 P2 NOR 0-3
111 P2 NOR 0-7
Stop Delay
0 OFF
1 ON
*
Stop Recovery Level
0 Low *
1 High
Stop Flag (Read-Only)
0 POR
Note: Not used in conjunction with SMR2
Source
* Default Setting After RESET
** Default setting after RESET and
Stop-Mode Recovery
*
1 Stop Recovery
SMR2 (0F) DH
D7 D6 D5 D4 D3 D2 D1 D0
Stop-Mode Recovery Source 2
00 POR only*
01 AND P20,P21,P22,P23
10 AND P20,P21,P22,P23,
P24,P25,P26,P27
Reserved (Must be 0)
Note: Not used in conjunction with SMR Source
Figure 35. Stop-Mode Recovery Register 2
([0F] DH: Write-Only)
SCLK/TCLK Divide-by-16 Select (D0). D0 of the SMR
controls a divide-by-16 prescaler of SCLK/TCLK. The
control selectively reduces device power consumption
during normal processor execution (SCLK control) and/or
HALT mode (where TCLK sources counter/timers and
interrupt logic). This bit is reset to D0 = 0 after a Stop-Mode
Recovery, WDT Timeout, and POR.
External Clock Divide-by-Two (D1). This bit can eliminate the oscillator divide-by-two circuitry. When this bit is
0, the System Clock (SCLK) and Timer Clock (TCLK) are
equal to the external clock frequency divided by two. The
SCLK/TCLK is equal to the external clock frequency when
this bit is set (D1=1). Using this bit together with D7 of
PCON further helps lower EMI (that is, D7 (PCON) = 0, D1
(SMR) = 1). The default setting is zero. Maximum external
clock frequency is 4 MHz when SMR Bit D1 = 1 where
SCLK/TCLK = XTAL.
OSC
SMR, D1
2
÷
SCLK
16
÷
SMR, D0
TCLK
Figure 34. STOP-Mode Recovery Register (Write-
Only Except Bit D7, Which Is Read-Only)
Figure 36. SCLK Circuit
34DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
FUNCTIONAL DESCRIPTION (Continued)
STOP-Mode Recovery Source (D2, D3, and D4).
These three bits of the SMR register specify the wake-up
source of the STOP recovery (Figure 37 and Table 12).
When the STOP-Mode Recovery Sources are selected in
this register then SMR2 register bits D0,D1 must be set to
zero. P33-P31 cannot wake up from Stop Mode if the input
lines are configured as analog inputs to the Analog
comparator or Analog-to-Digital Converter since the
Analog Comparator’s are powered down in Stop Mode.
Note: If the Port 2 pin is configured as an output, this
output level will be read by the SMR circuitry.
Table 12. STOP-Mode Recovery Source
SMR:432Operation
D4 D3 D2 Description of Action
000POR and/or external reset recovery
001Reserved
010P31 transition (not in Analog Mode)
011P32 transition (not in Analog Mode)
100P33 transition (not in Analog Mode)
101P27 transition
110Logical NOR of P20 through P23
111Logical NOR of P20 through P27
STOP-Mode Recovery Delay Select (D5). This bit, if
High, enables the T
/RESET delay after Stop-Mode
POR
Recovery. The default configuration of this bit is "1". A
POR or WDT reset will override the selection and cause
the reset delay to occur.
STOP-Mode Recovery Edge Select (D6). A "1" in this bit
position indicates that a high level on the output to the
exclusive Or-Gate input from the selected recovery source
wakes the Z86C83/C84 from STOP mode. A "0" indicates
low-level recovery. The default is 0 on POR. This bit is
used for either SMR or SMR2.
Cold or Warm Start (D7). This bit is set by the device
upon entering STOP mode. A 0 in this bit (cold) indicates
that the device resets by POR/WDT reset. A "1" in this bit
(warm) indicates that the device awakens by a Stop-Mode
Recovery source.
Note: A WDT reset out of Stop Mode will also set this bit
to a "1."
STOP-Mode Recovery Register 2 (SMR2). This register
contains additional Stop-Mode Recovery sources. When
the Stop-Mode Recovery sources are selected in this
register then SMR Register Bits D2, D3, and D4 must be 0.
Table 13. Stop-Mode Recovery Source
SMR:10Operation
D1D0Description of Action
00SMR2 disables source
01Logical AND of P20 through P23
10Logical AND of P20 through P27
35DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
SMR D4 D3 D2
0 0 0
VDD
SMRSMRSMRD4 D3 D2
P31
P32
Stop-Mode Recovery Edge
Select (SMR)
P33 From Pads
0 0 1
0 1 0
0 1 1
P33P27
D4 D3 D2
1 0 0
D4 D3 D2
1 0 1
P20
P23
P20
P23
SMR2SMR2D1 D0
1 1
SMRSMRD4 D3 D2
1 1 0
P20
P27
D1 D0
1 1
P20
P27
D4 D3 D2
1 1 1
To POR
RESET
To P33 Data
Latch and IRQ1
MUX
Digital/Analog Mode
Select (P3M)
Figure 37. STOP-Mode Recovery Source
36DS96DZ80203
Z86C83/C84
Z8® MCU Microcontrollers
FUNCTIONAL DESCRIPTION (Continued)
Watch-Dog Timer Mode Register (WDTMR). The WDT
is a retriggerable one-shot timer that resets the Z8 if it
reaches its terminal count. The WDT is initially enabled by
executing the WDT instruction and refreshed on
subsequent executions of the WDT instruction. The WDT
circuit is driven by an on-board RC oscillator or external
oscillator from the XTAL1 pin. The POR clock source is
selected with bit 4 of the WDT register (Figure 38).
WDT instruction affects the Z (Zero), S (Sign), and V
(Overflow) flags. The WDTMR must be written to within 64
internal system clocks. After that, the WDTMR is write
protected.
Note: WDT time-out while in Stop-Mode will not reset
SMR, PCON, WDTMR, P2M, P3M, Ports 2 and 3 Data
Registers, but will cause the reset delay to occur.
/RESET
Clear
CLK
The Power-On Reset (POR) clock source is selected with
bit 4 of the WDTMR. Bits 0 and 1 control a tap circuit that
determines the time-out period. Bit 2 determines whether
the WDT is active during HALT and bit 3 determines WDT
activity during STOP. If bits 3 and 4 of this register are both
set to "1," the WDT is only driven by the external clock
during STOP mode. This feature makes it possible to wake
up from STOP mode from an internal source. Bits 5
through 7 of the WDTMR are reserved (Figure 39). This
register is accessible only during the first 64 processor
cycles (64 SCLKs) from the execution of the first
instruction after Power-On-Reset, Watch-Dog Reset or a
Stop-Mode Recovery. After this point, the register cannot
be modified by any means, intentional or otherwise. The
WDTMR cannot be read and is located in Bank F of the
Expanded Register group at address location 0FH.
1. If WDT is permanently selected (always ON mode),
the WDT will continue to run even if set not to run in
STOP or HALT Mode.
2. WDT instructions affect the Z (Zero), S (Sign), and V
(Overflow) flags.
On-Board, Power-On-Reset RC or External XTAL1
Oscillator Select (D4). This bit determines which
oscillator source is used to clock the internal POR and
WDT counter chain. If the bit is a "1," the internal RC
oscillator is bypassed and the POR and WDT clock source
is driven from the external pin, XTAL1. The default
*
configuration of this bit is 0, which selects the RC
oscillator. If the XTAL1 pin is selected as the oscillator
source for the WDT, during Stop Mode, the oscillator will
be stopped and the WDT will not run. This is true even if
the WDT is selected to run during Stop Mode.
Voltage Comparator. An on-board Voltage Compara-
V
CC
tor checks that VCC is at the required level to ensure correct
operation of the device. RESET is globally driven if VCC is
below the specified voltage (typically 2.6V).
WDT Time Select (D1, D0). Selects the WDT time-out
period. It is configured as shown in Table 14.
Table 14. WDT Time Select (Min. @ 5.0V)
D1D0
Time-Out of
Internal RC OSC
Time-Out of
SCLK Clock
006.25 ms min256 SCLK
0112.5 ms min512 SCLK*
1025 ms min1024 SCLK
11100 ms min4096 SCLK
Notes:
The default on a WDT initiated reset is 512 SCLK.
The minimum time shown is for V
@ 5.0V.
CC
WDT During HALT (D2). This bit determines whether or
not the WDT is active during HALT mode. A "1" indicates
active during HALT. The default is "1."
Note: If WDT is permanently selected (always ON mode),
the WDT will continue to run even if set not to run in STOP
or HALT Mode.
WDT During STOP (D3). This bit determines whether or
not the WDT is active during STOP mode. Since XTAL
clock is stopped during STOP mode, unless as specified
below, the on-board RC has to be selected as the clock
source to the POR counter. A "1" indicates active during
STOP. The default is "1". If bits D3 and D4 are both set to
"1," the WDT only, is driven by the external clock during
STOP mode.
ROM Protect. ROM Protect is mask-programmable. It is
selected by the customer at the time the ROM code is
submitted.
ROM Mask Selectable Options
There are six ROM mask options that must be selected at
the time the ROM mask is ordered (ROM code submitted).
Table 15. ROM Mask Selectable Options
OptionSelection
Permanent WDTY es/No
Port0 Pull-UpsYes/No
Port0 Auto LatchesYes/No
ROM ProtectYes/No
RAM ProtectYes/No
38DS96DZ80203
1
EXPANDED REGISTER FILE CONTROL REGISTERS (0C)
ADC0 (OC) 8H
D7 D6 D5 D4 D3 D2 D1 D0
Channel Select (bits 2,1,0)
CSEL2
CSEL1
CSEL0
0
0
0
1
1
0
1
1
0
0
0
1
1
0
1
1
* Default setting after reset.
0
0
0
0
1
1
1
1
Scan 0 = No action.*
1 = Convert channel then stop.