Zeiss DeepRecon User Manual

Standard Reconstruction

Faster 3D X-ray imaging
throughput and superior
imaging quality

for advanced package analysis

ZEISS DeepRecon

ZEISS DeepRecon is the first commercially available deep learning reconstruction technology in the 3D X-ray imaging market.
Intended for applications that repeatedly analyze the same or similar sample types, DeepRecon enables faster 3D X-ray scans while
preserving ZEISS’s revolutionary Resolution at a Distance (RaaD) and image quality advantages.

Faster Throughput by up to 4X

Rapid structural and failure analysis (FA) aids
fast product introductions and high customer
satisfaction levels. Shrinking package inter­connects, higher packing densities, and
increasing package sizes result in smaller,

more dicult-to-nd defects and longer

analysis times. DeepRecon enables faster
high-resolution, high-quality 3D X-ray image

acquisition for repetitive workows used in

process development and quality control.
Up to 4X faster throughput is possible by
leveraging deep learning networks
customized per package type.

4 hours

The result is faster time to results and
ability to increase sampling rates – all
achieved without increasing the radiation
dose to the sample.

Better Image Quality

High image contrast, high resolution, and
high signal-to-noise ratios (SNR) are needed
to produce the highest quality images for
improved visualization of defects and small
or low-contrast features. To achieve a high
SNR using standard reconstruction techniques,
higher exposure times and/or projections are

generally required, which can signicantly

100 µm

impact throughput. DeepRecon oers a
statistically improved SNR, providing superior
image quality. DeepRecon also reduces
image artifacts that are typically inherent
in faster imaging processes.

Customized, Optimal Performance

DeepRecon is a workstation-based option

oered as a special customer solution for

ZEISS Xradia Versa X-ray microscopes (XRM)
and Context microCT instruments. Network
models are created per sample “class” and
can be tailored to precisely t targeted
repetitive applications, enabling an ideal
balance of image quality and throughput.
Available for new or existing systems,
the DeepRecon option uniquely opens
opportunities in big data generated by 3D

X-ray and provides signicant AI-driven

speed or image quality improvement.

DeepRecon is oered via the unique

Advanced Reconstruction Toolbox for
ZEISS Xradia 3D X-ray systems.

DeepRecon

100 µm

1 hour

DeepRecon for repetitive workows: 4X faster scan speeds for semiconductor packages

Standard Reconstruction

DeepRecon

Standard Reconstruction

Standard Reconstruction

5 hours

(3000 projections / 6 seconds)

Smartphone package: DeepRecon enables tuning parameters for speed or image quality depending on the goals of the analysis.

Tremendous speed advantages can be realized for larger features, and even ne features can be analyzed with a good ratio of image quality to speed.

(400 projections / 6 seconds)

DeepRecon

40 minutes

DeepRecon

7 minutes

(400 projections / 1 second)

About ZEISS Xradia X-ray Imaging Solutions

ZEISS provides innovative X-ray hardware and software to meet the following challenges:

• Achieving the right ratio of resolution versus throughput

(application and sample dependent)

• Achieving scan speeds as required for the full workow

(application and sample dependent)

• Visualizing submicron defects in large structures without

the need for sample preparation and with a large FOV

(i.e. to enable visualization of 100 nm diameter cracks

within an intact 100 μm C4 bump)

ZEISS Xradia Versa XRM

with primary workstation
Standard FDK Reconstruction

+

ZEISS Xradia
Context microCT

with primary workstation
Standard FDK Reconstruction

• Visualizing defects and structures as interconnect pitch

drops below 10 µm

• Mitigating beam hardening and other X-ray artifacts

• Minimizing dose (due to device radiation concerns)

ZEISS continuously develops new solutions to solve these

challenges for semiconductor package analysis and FA

applications. ZEISS oers unprecedented system extendibility

with eld conversion options and various upgrades like

DeepRecon to protect your investment.

DeepRecon Module

Software Bundle

High-performance

Oine Workstation

• DeepRecon engine

• Custom-trained
network models

• Manual Reconstruction

• XRM DataExplorer

• XRM 3DViewer

• Dual 10-core processor

• 512GB RAM

• Windows 10, 64-bit O/S

• Dual professional-class
3D GPU

• 30” monitor

ZEISS Process Control Solutions (PCS)
Carl Zeiss SMT, Inc.

4385 Hopyard Road
Pleasanton, CA 94588
USA
www.zeiss.com/pcs
[e-mail]

EN-PCS-012-8-2020-US | Design, scope of delivery and technical progress subject to change without notice. | © Carl Zeiss SMT, Inc.