Page 1
Standard Reconstruction
Faster 3D X-ray imaging
throughput and superior
imaging quality
for advanced package analysis
ZEISS DeepRecon
ZEISS DeepRecon is the first commercially available deep learning reconstruction technology in the 3D X-ray imaging market.
Intended for applications that repeatedly analyze the same or similar sample types, DeepRecon enables faster 3D X-ray scans while
preserving ZEISS’s revolutionary Resolution at a Distance (RaaD) and image quality advantages.
Faster Throughput by up to 4X
Rapid structural and failure analysis (FA) aids
fast product introductions and high customer
satisfaction levels. Shrinking package interconnects, higher packing densities, and
increasing package sizes result in smaller,
more dicult-to-nd defects and longer
analysis times. DeepRecon enables faster
high-resolution, high-quality 3D X-ray image
acquisition for repetitive workows used in
process development and quality control.
Up to 4X faster throughput is possible by
leveraging deep learning networks
customized per package type.
4 hours
The result is faster time to results and
ability to increase sampling rates – all
achieved without increasing the radiation
dose to the sample.
Better Image Quality
High image contrast, high resolution, and
high signal-to-noise ratios (SNR) are needed
to produce the highest quality images for
improved visualization of defects and small
or low-contrast features. To achieve a high
SNR using standard reconstruction techniques,
higher exposure times and/or projections are
generally required, which can signicantly
100 µm
impact throughput. DeepRecon oers a
statistically improved SNR, providing superior
image quality. DeepRecon also reduces
image artifacts that are typically inherent
in faster imaging processes.
Customized, Optimal Performance
DeepRecon is a workstation-based option
oered as a special customer solution for
ZEISS Xradia Versa X-ray microscopes (XRM)
and Context microCT instruments. Network
models are created per sample “class” and
can be tailored to precisely t targeted
repetitive applications, enabling an ideal
balance of image quality and throughput.
Available for new or existing systems,
the DeepRecon option uniquely opens
opportunities in big data generated by 3D
X-ray and provides signicant AI-driven
speed or image quality improvement.
DeepRecon is oered via the unique
Advanced Reconstruction Toolbox for
ZEISS Xradia 3D X-ray systems.
DeepRecon
100 µm
1 hour
DeepRecon for repetitive workows: 4X faster scan speeds for semiconductor packages
Page 2
Standard Reconstruction
DeepRecon
Standard Reconstruction
Standard Reconstruction
5 hours
(3000 projections / 6 seconds)
Smartphone package: DeepRecon enables tuning parameters for speed or image quality depending on the goals of the analysis.
Tremendous speed advantages can be realized for larger features, and even ne features can be analyzed with a good ratio of image quality to speed.
(400 projections / 6 seconds)
DeepRecon
40 minutes
DeepRecon
7 minutes
(400 projections / 1 second)
About ZEISS Xradia X-ray Imaging Solutions
ZEISS provides innovative X-ray hardware and software to meet the following challenges:
• Achieving the right ratio of resolution versus throughput
(application and sample dependent)
• Achieving scan speeds as required for the full workow
(application and sample dependent)
• Visualizing submicron defects in large structures without
the need for sample preparation and with a large FOV
(i.e. to enable visualization of 100 nm diameter cracks
within an intact 100 μm C4 bump)
ZEISS Xradia Versa XRM
with primary workstation
Standard FDK Reconstruction
+
ZEISS Xradia
Context microCT
with primary workstation
Standard FDK Reconstruction
• Visualizing defects and structures as interconnect pitch
drops below 10 µm
• Mitigating beam hardening and other X-ray artifacts
• Minimizing dose (due to device radiation concerns)
ZEISS continuously develops new solutions to solve these
challenges for semiconductor package analysis and FA
applications. ZEISS oers unprecedented system extendibility
with eld conversion options and various upgrades like
DeepRecon to protect your investment.
DeepRecon Module
Software Bundle
High-performance
Oine Workstation
• DeepRecon engine
• Custom-trained
network models
• Manual Reconstruction
• XRM DataExplorer
• XRM 3DViewer
• Dual 10-core processor
• 512GB RAM
• Windows 10, 64-bit O/S
• Dual professional-class
3D GPU
• 30” monitor
ZEISS Process Control Solutions (PCS)
Carl Zeiss SMT, Inc.
4385 Hopyard Road
Pleasanton, CA 94588
USA
www.zeiss.com/pcs
info.pcs@zeiss.com
EN-PCS-012-8-2020-US | Design, scope of delivery and technical progress subject to change without notice. | © Carl Zeiss SMT, Inc.
Loading...