White Electronic Designs EDI8L24129V15BC, EDI8L24129V12BI, EDI8L24129V12BC, EDI8L24129V10BC, EDI8L24129V15BI Datasheet

White Electronic Designs

EDI8L24129V

128Kx24 SRAM 3.3 Volt

FEATURES

128Kx24 bit CMOS Static Random Access Memory Array

<Fast Access Times: 10, 12, and 15ns

<Master Output Enable and Write Control

<TTL Compatible Inputs and Outputs

<Fully Static, No Clocks

Surface Mount Package

<119 Lead BGA (JEDEC MO-163), No. 391

<Small Footprint, 14mm x 22mm

<Multiple Ground Pins for Maximum Noise Immunity

Single +3.3V (±5%) Supply Operation DSP Memory Solution

<Motorola DSP5630xTM

<Analog Devices SHARCTM

The EDI8L24129VxxBC is a 3.3V, three megabit SRAM constructed with three 128Kx8 die mounted on a multilayer laminate substrate. With 10 to 15ns access times, x24 width and a 3.3V operating voltage, the EDI8L24129V is ideal for creating a single chip memory solution for the Motorola DSP5630x (Figure 3) or a two chip solution for the Analog Devices SHARCTM DSP (Figure 4).

The single or dual chip memory solutions offer improved system performance by reducing the length of board traces and the number of board connections compared to using multiple monolithic devices. For example, the capacitance load on the data lines for the BGA package is 58% less than a monolithic SOJ solution.

The JEDEC Standard 119 lead BGA provides a 44% space savings over using 128Kx8, 300mil wide SOJs and the BGA package has a maximum height of 100 mils compared to 148 mils for the SOJ packages. The BGA package also allows the use of the same manufacturing and inspection techniques as the Motorola DSP, which is also in a BGA package.

PIN CONFIGURATION

Pin Symbols

Pin Names

AØ-A16

Address Inputs

1

2

3

4

5

6

7

E

Chip Enable

A

NC

AO

A1

A2

A3

A4

NC

W

Master Write Enable

G

Master Output Enable

B

NC

A5

A6

E

A7

A8

NC

C

I/012

NC

NC

NC

NC

NC

I/00

DQØ-DQ23

Common Data Input/Output

D

I/013

VCC

GND

GND

GND

VCC

I/01

VCC

Power (3.3V±5%)

E

I/014

GND

VCC

GND

VCC

GND

I/02

GND

Ground

F

I/015

VCC

GND

GND

GND

VCC

I/03

NC

No Connection

G

I/016

GND

VCC

GND

VCC

GND

I/04

H

I/017

VCC

GND

GND

GND

VCC

I/05

I

NC

GND

VCC

GND

VCC

GND

NC

J

I/018

VCC

GND

GND

GND

VCC

I/06

K

I/019

GND

VCC

GND

VCC

GND

I/07

L

I/020

VCC

GND

GND

GND

VCC

I/08

M

I/021

GND

VCC

GND

VCC

GND

I/09

N

I/022

VCC

GND

GND

GND

VCC

I/010

O

I/023

NC

NC

NC

NC

NC

I/011

P

NC

A9

A10

W

A11

A12

NC

Q

NC

A13

A14

G

A15

A16

NC

July 2002 Rev 3	1	White Electronic Designs Corporation • [phone] • www.whiteedc.com
ECO #14690

White Electronic Designs	EDI8L24129V
BLOCK DIAGRAM

A0-A16
				17
	G				128K x 24
	W
					Memory
		E
					Array

DQ0-DQ7

DQ8-DQ15

DQ16-DQ23

ABSOLUTE MAXIMUM RATINGS

	Voltage on any pin relative to VSS	-0.5V to 4.6V
	Operating Temperature TA (Ambient)
	Commercial	0°C to + 70°C
	Industrial	-40°C to +85°C
	Storage Temperature	-55°C to +125°C
	Power Dissipation	1.5 Watts
	Output Current.	50 mA
	Junction Temperature, TJ	175°C

*Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.

TRUTH TABLE

	G	E	W	Mode	Output	Power
	X	H	X	Standby	High Z	ICC2,ICC3
	H	L	H	Output Deselect	High Z	ICC1
	L	L	H	Read	DOUT	ICC1
	X	L	L	Write	DIN	ICC1

RECOMMENDED OPERATING CONDITIONS

Parameter

Sym

Min

Typ

Max

Units

Supply Voltage

VCC

3.135

3.3

3.465

V

Supply Voltage

VSS

0

0

0

V

Input High Voltage

VIH

2.2

–

VCC+0.3

V

Input Low Voltage

VIL

-0.3

–

0.8

V

CAPACITANCE

(f=1.0MHz, VIN=VCC or VSS)

Parameter

Sym

Max

Unit

Address Lines

CA

8

pF

Data Lines

CD/Q

10

pF

Write & Output Enable Lines

8

pF

W,

G

Chip Enable Lines

8

pF

EØ-E2

These parameters are sampled, not 100% tested.

White Electronic Designs Corporation • Westborough MA • [phone]

2

White Electronic Designs

EDI8L24129V

DC ELECTRICAL CHARACTERISTICS

Parameter

Sym

Conditions

Min

Max

Units

10ns 12-15ns

ns

Operating Power Supply Current

ICC1

W= VIL, II/O = 0mA,

420

360

mA

Min Cycle

Standby (TTL) Supply Current

ICC2

E > VIH, VIN < VIL or

90

75

mA

VIN > VIH, f=ØMHz

Full Standby CMOS

ICC3

E > VCC-0.2V

10

10

mA

Supply Current

VIN > VCC-0.2V

or

VIN < 0.2V

Input Leakage Current

ILI

VIN = 0V to VCC

±10

±10

µA

Output Leakage Current

ILO

V I/O = 0V to VCC

±10

±10

µA

Output High Volltage

VOH

IOH = -4.0mA

2.4

V

Output Low Voltage

VOL

IOL = 8.0mA

0.4

0.4

V

AC TEST CIRCUIT

AC TEST CONDITIONS

Input Pulse Levels

VSS to 3.0V

FIG. 1

Input Rise and Fall Times

5ns

Input and Output Timing Levels

1.5V

RL= 50

Output Load

Figure 1

DOUT

Z0= 50

30pf

VL=1.5V

(NOTE: For TEHQZ,TGHQZ and TWLQZ, Figure 2)

FIG. 2

+3.3V

319

DOUT

353 5pf

3White Electronic Designs Corporation • [phone] • www.whiteedc.com