WD Scorpio ML160M, WD3200BEVE, WD2500BEVE, WD1600BEVE, WD1200BEVE Technical Reference Manual

WD Scorpio®ML160M

EIDE Hard Drives

Technical Reference Manual

WD3200BEVE

WD2500BEVE

WD1600BEVE

WD1200BEVE

WD800BEVE

WD CONFIDENTIAL

© 2009 Western Digital Technologies, Inc.

All Rights Reserved

Information furnished by WD is believed to be accurate and reliable. No license is granted by implication or
otherwise under any patent or patent rights of WD. WD reserves the right to change specifications at any
time without notice.

Western Digital, WD, the WD logo, and WD Scorpio are registered trademarks in the U.S. and other
countries; and Data Lifeguard, CacheFlow, and FIT Lab are trademarks of Western Digital Technologies, Inc.
Other marks may be mentioned herein that belong to other companies.

Western Digital
20511 Lake Forest Drive
Lake Forest, California 92630
U.S.A.

2679-701205-A00

Document Control Number Definition:

2679-001xxx- 0xx-Px NRD

Doc Control No. Doc Revision Level

(WD Caviar Drives)
Oxx = Released Version
Px = Review Cycle

Non-Released
Document

WD CONFIDENTIAL

WD Scorpio ML160M

WD800BEVE
WD1200BEVE
WD1600BEVE
WD2500BEVE
WD3200BEVE

Technical Reference Manual

2679-701205-A00 RELEASED 1/16/09 (WD CONFIDENTIAL)

RELEASED 1/16/09 (WD CONFIDENTIAL) 2679-701205-A00

WD Scorpio ML160M Table of Contents

TABLE OF CONTENTS

1. DESCRIPTION AND FEATURES ................................................................................................. 1

1.1 General Description....................................................................................................................................................................... 1

1.2 Product Features ............................................................................................................................................................................ 1

2. SPECIFICATIONS....................................................................................................................... 3

2.1 Performance Specifications ......................................................................................................................................................... 3

2.2 Physical Specifications.................................................................................................................................................................. 4

2.2.1 Physical Dimensions ...................................................................................................................................................... 5

2.3 Mechanical Specifications............................................................................................................................................................ 6

2.4 Electrical Specifications................................................................................................................................................................ 7

2.4.1 Current Requirements and Power Dissipation ........................................................................................................ 7

2.4.2 Input Voltage Requirements......................................................................................................................................... 8

2.4.3 Ripple................................................................................................................................................................................. 8

2.5 Environmental Specifications....................................................................................................................................................... 8

2.5.1 Shock and Vibration ....................................................................................................................................................... 8

2.5.2 Temperature and Humidity ........................................................................................................................................... 9

2.5.3 Thermocouple Location................................................................................................................................................. 9

2.5.4 Cooling............................................................................................................................................................................ 10

2.5.5 Atmospheric Pressure .................................................................................................................................................10

2.5.6 Acoustics ........................................................................................................................................................................10

2.5.7 RoHS (Restriction of Hazardous Substances) ......................................................................................................10

2.6 Reliability Specifications .............................................................................................................................................................10

2.7 Device Plug Connector Pin Definitions ...................................................................................................................................11

2.8 Agency Approvals.........................................................................................................................................................................12

2.9 Full Model Number Specification.............................................................................................................................................. 12

3. PRODUCT FEATURES.............................................................................................................. 13

3.1 Perpendicular Magnetic Recording (PMR).............................................................................................................................14

3.2 Reduced Power Spinup (RPS) ................................................................................................................................................. 15

3.3 System-on-Chip (SOC)..............................................................................................................................................................15

3.4 S.M.A.R.T. Command Transport (SCT)...................................................................................................................................16

3.4.1 Write Same ....................................................................................................................................................................16

3.4.2 Read/Write Long ..........................................................................................................................................................16

3.4.3 Temperature Reporting................................................................................................................................................16

3.5 Reliability Features Set................................................................................................................................................................17

3.5.1 Data Lifeguard™ ............................................................................................................................................................17

3.5.2 Thermal Management ..................................................................................................................................................17

3.5.3 Internal Environmental Protection System ..............................................................................................................18

3.5.4 Recoverable Errors.......................................................................................................................................................18

3.5.5 Unrecoverable Errors ...................................................................................................................................................18

3.5.6 Self Test .......................................................................................................................................................................... 18

3.5.7 ATA Error Logging........................................................................................................................................................18

3.5.8 Defect Management.....................................................................................................................................................18

3.5.9 Automatic Defect Retirement.....................................................................................................................................19

3.5.10 Error Recovery Process...............................................................................................................................................19

3.6 Hot Plug Support..........................................................................................................................................................................20

3.6.1 Hot Plug Technical Issues .......................................................................................................................................... 20

3.7 Active LED Status ........................................................................................................................................................................22

3.8 Fluid Dynamic Bearings (FDB)..................................................................................................................................................23

3.9 CacheFlow™ ..................................................................................................................................................................................23

3.9.1 Write Cache...................................................................................................................................................................24

3.9.2 Read Cache ...................................................................................................................................................................24

3.9.3 48-bit Logical Block Addressing (LBA) ..................................................................................................................24

3.10 Power Management .....................................................................................................................................................................24

3.11 Self-Monitoring, Analysis, and Reporting Technology (S.M.A.R.T.)..................................................................................24

3.12 Security Mode ...............................................................................................................................................................................25

3.12.1 Master and User Passwords ......................................................................................................................................25

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Table of Contents WD Scorpio ML160M

3.12.2 Security Levels ..............................................................................................................................................................25

3.13 Automatic Acoustic Management (AAM)................................................................................................................................25

4. AT COMMAND SET ................................................................................................................26

4.1 Host Interface Commands .........................................................................................................................................................26

4.1.1 ATA-7/ATA-8 Commands ..........................................................................................................................................26

4.1.2 Obsolete Commands...................................................................................................................................................27

4.2 S.M.A.R.T. (B0h)........................................................................................................................................................................... 28

4.2.1 Read Attribute Values Sub-Command ....................................................................................................................28

4.2.2 Supported Attributes ...................................................................................................................................................30

4.2.3 Read Log Sector...........................................................................................................................................................31

4.2.4 Offline Data Collection ................................................................................................................................................31

4.3 Identify Device (ECh)...................................................................................................................................................................32

4.4 Set Features (EFh) ......................................................................................................................................................................38

5. INSTALLATION AND SETUP PROCEDURES............................................................................. 39

5.1 Unpacking ......................................................................................................................................................................................39

5.1.1 Handling Precautions...................................................................................................................................................39

5.1.2 Inspection of Shipping Container .............................................................................................................................39

5.1.3 Removal From Shipping Container...........................................................................................................................39

5.1.4 Removal From Static Shielding Bag.........................................................................................................................40

5.1.5 Moving Precautions......................................................................................................................................................40

5.2 Mounting Restrictions..................................................................................................................................................................40

5.2.1 Orientation......................................................................................................................................................................40

5.2.2 Screw Size Limitations ................................................................................................................................................40

5.2.3 Grounding.......................................................................................................................................................................41

5.3 Jumper Settings ............................................................................................................................................................................42

6. MAINTENANCE ........................................................................................................................ 43

7. TECHNICAL SUPPORT............................................................................................................. 44

7.1 WD Online Services ....................................................................................................................................................................44

8. GLOSSARY .............................................................................................................................. 45

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WD Scorpio ML160M List of Figures

LIST OF FIGURES

Figure 2-1 Mounting Dimensions...........................................................................................................................................6

Figure 2-2 Typical +5V Current Draw During Spinup .....................................................................................................7

Figure 2-3 Drive Base Casting Thermocouple Location ..................................................................................................9

Figure 2-4 Forced Airflow Direction ................................................................................................................................... 10

Figure 2-5 Standard Factory Connectors ......................................................................................................................... 11

Figure 3-1 RPS Spinup Profile ............................................................................................................................................ 15

Figure 5-1 Drive Handling Precautions.............................................................................................................................. 39

Figure 5-2 Hard Drive Removal From Static Shielding Bag ......................................................................................... 40

Figure 5-3 Grounding Diagram ........................................................................................................................................... 41

Figure 5-4 Jumper Settings for WD Scorpio Hard Drives ............................................................................................ 42

2679-701205-A00 RELEASED 1/16/09 (WD CONFIDENTIAL) iii

List of Tables WD Scorpio ML160M

LIST OF TABLES

Table 2-1 Shock and Vibration ............................................................................................................................................... 8

Table 2-2 Device Pin Connector Pin Definitions............................................................................................................. 11

Table 2-3 Full Model Number Description........................................................................................................................ 12

Table 4-1 ATA-7/ATA-8 Command Opcodes................................................................................................................. 26

Table 4-2 Obsolete Command Opcodes .......................................................................................................................... 27

Table 4-3 Definitions for the 512 Bytes. ........................................................................................................................... 28

Table 4-4 Defined Error Logging Sectors......................................................................................................................... 31

Table 4-5 Identify Device Command.................................................................................................................................. 32

iv RELEASED 1/16/09 (WD CONFIDENTIAL) 2679-701205-A00

WD Scorpio ML160M Description and Features

1.0 DESCRIPTION AND FEATURES

1.1 General Description

WD Scorpio 2.5-inch drives offer fast performance and low power consumption, making them
ideal for notebooks and other portable devices.

1.2 Product Features

 Perpendicular Magnetic Recording (PMR) — With PMR technology the

magnetization of each data bit is aligned vertically to the spinning disk, rather than
longitudinally as has been the case in hard drive technology for decades. This enables
more data on a given disk than is possible with conventional longitudinal recording, and
provides a platform for future expansion of hard drive densities.

 Reduced Power Spinup (RPS) — WD’s optimized start up feature specifically

designed for the external hard drive and Consumer Electronics (CE) market. Specific
focus for RPS is to minimize the duration and magnitude of the peak power consumption
from the hard drive.

 Ramp Load/Unload (LUL) — LUL is a proven design that parks the recording head

when the drive is idle and on spin up, maximizing available disk space and minimizing
power usage, which results in lower transient acoustics, lower heat, and long-term drive
reliability.

 System-on-Chip - The System-on-Chip (SOC) is the foundation for WD's next

generation electronics and firmware architecture. The SOC lowers component count by
integrating a hard disk controller, high performance processor, high speed execution
SRAM, and read channel in a 128-pin package.

 S.M.A.R.T. Command Transport (SCT) — The SCT Command Transport feature set

provides a method for a host to send commands and data to a device and for a device to
send data and status to a host using log pages.

 Reliability Features Set-Data Lifeguard™ — Representing WD's ongoing

commitment to data protection, Data Lifeguard includes features that enhance the drive’s
ability to prevent data loss. Data Lifeguard data protection utilities include thermal
management, an environmental protection system, and embedded error detection and
repair features that automatically detect, isolate, and repair problem areas that may
develop over the extended use of the hard drive. With these enhanced data reliability
features, the drive can perform more accurate monitoring, error repair, and deliver
exceptional data security.

 Fluid Dynamic Bearings (FDB) — Bearing design that incorporates a layer of high-

viscosity lubricant instead of ball bearings in the hard drive spindle motor. As an
alternative to conventional ball bearing technology, FDB designs provide increased non­operational shock resistance, speed control, and improved acoustics.

 CacheFlow™ —WD’s unique, multi-generation caching algorithm evaluates the way data

is read from and written to the drive and adapts “on-the-fly” to the optimum read and write
caching methods. CacheFlow minimizes disk seek operations and overheads due to
rotational latency. CacheFlow supports sequential and random write cache. With write
cache and other CacheFlow features, the user can cache both read and write data. The
cache can hold multiple writes and collectively write them to the hard drive.

 Power Management — The drive supports the ATA and SATA power management

command set, allowing the host to reduce the power consumption of the drive by issuing
a variety of power management commands.

2679-701205-A00 RELEASED 1/16/09 (WD CONFIDENTIAL) 1

Description and Features WD Scorpio ML160M

 Dual Drive Operation — These hard drives support ATA dual drive operations. You can

attach another hard drive to the WD hard drive by designating one as the master and the
other as slave.

 High-Speed Data Transfer Support — These hard drives support all data transfer

modes up to Mode 5 Ultra ATA 100. Data transfer modes supported include PIO modes
0-4, Multi-word DMA modes 0-2, and Ultra ATA modes 0-5.

 Self-Monitoring, Analysis, and Reporting Technology (S.M.A.R.T.) — S.M.A.R.T.

enables a drive’s internal status to be monitored through diagnostic commands at the
host level and during offline activities. S.M.A.R.T. devices employ data analysis algorithms
that are used to predict the likelihood of some near-term degradation or fault conditions.
When used with a S.M.A.R.T. application, the drive can alert the host system of a negative
reliability status condition. The host system can then warn the user of the impending risk
of data loss and recommend an appropriate action.

 ATA Security — WD EIDE drives support the ATA Security Mode Feature set. The ATA

Security Mode feature set allows the user to create a device lock password that prevents
unauthorized hard disk access even if the drive is removed from the host computer. The
correct password must be supplied to the hard drive in order to access user data. Both
the User and Master Password features are supported, along with the High and Maximum
security modes. The Master Password Revision code is also supported.

 Automatic Acoustic Management (AAM) — The drive supports the Automatic

Acoustic Management feature. This feature allows the host to select the acoustic level of
the hard drive.

2 RELEASED 1/16/09 (WD CONFIDENTIAL) 2679-701205-A00

WD Scorpio ML160M Specifications

2.0 SPECIFICATIONS

2.1 Performance Specifications

Average Seek

- Read

- Write

Track-to-Track Seek

Full Stroke Seek 21 ms average

Index Pulse Period 11.1 ms (nominal)

Average Latency 5.5 ms

Rotational Speed 5400 RPM

Data Transfer Rate (maximum)

- Buffer to Host

- Max buffer to disk

Interleave 1:1

Buffer Size 8 MB

Error Rate - Unrecoverable <1 in 10

Spindle Start Time

- From Power-on to Drive Ready

- From Power-on to Rotational Speed

Spindle Stop Time 8.0s average

Load/Unload Cycles

1

During continuous Seek, Read, or Write commands, an algorithm in the code will add latency as required to keep

the VCM motor from overheating;s seek performance will be impacted under this condition.

2

Defined as the time from power-on to the setting of Drive Ready and Seek Complete including calibration.

3

Defined as the time from power-on to when the full spindle rotational speed is reached.

4

Controlled unload at ambient condition.

1

12.0 ms average

13.0 ms average

1

2.0 ms average

100 MB/s (Mode 5 Ultra ATA)

66.6 MB/s (Mode 4 Ultra ATA)

33.3 MB/s (Mode 2 Ultra ATA)

16.6 MB/s (Mode 4 PIO)

16.6 MB/s (Mode 2 multi-word DMA)

97 MB/s maximum

14

bits read

3

4

5

4.0s average

2.0s average

600,000

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Specifications WD Scorpio ML160M

2.2 Physical Specifications

Physical
Specifications

Capacity

Interface 44-pin EIDE 44-pin EIDE 44-pin EIDE 44-pin EIDE 44-pin EIDE

Actuator Type Rotary Voice

Number of Disks11122

Data Surfaces12244

Number of Heads12244

Bytes per Sector 512 512 512 512 512

User Sectors per
Drive

Servo Type Embedded Embedded Embedded Embedded Embedded

Recording Method Partial DC

ECC Reed-Solomon Reed-Solomon Reed-Solomon Reed-Solomon Reed-Solomon

1

1

As used for storage capacity, one megabyte (MB) = one million bytes, one gigabyte (GB) = one billion bytes, and one terabyte
(TB) = one trillion bytes. Total accessible capacity varies depending on operating environment. As used for buffer or cache, one
megabyte (MB) = 1,048,576 bytes.

WD800BEVE WD1200BEVE WD1600BEVE WD2500BEVE WD3200BEVE

80,026 MB 120,034 MB 160,041 MB 250,059 MB 320,072 MB

Rotary Voice

Coil

156,301,488 234,441,648 312,581,808 488,397,168 625,142,448

Tar get

Coil

Partial DC

Tar get

Rotary Voice

Coil

Partial DC

Tar get

Rotary Voice

Coil

Partial DC

Tar get

Rotary Voice

Coil

Partial DC

Tar get

4 RELEASED 1/16/09 (WD CONFIDENTIAL) 2679-701205-A00

WD Scorpio ML160M Specifications

2.2.1 Physical Dimensions

English Metric

Dimension Tolerance Dimension Tolerance

Height 0.374 inches ±0.01 inch 9.50 mm ±0.20 mm

Length 3.94 inches ±0.01 inch 100.00 mm ±0.25 mm

Width 2.75 inches ±0.01 inch 69.85 mm ±0.25 mm

Weight (typical) 0.22 pounds — 99 gm —

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Specifications WD Scorpio ML160M

2.3 Mechanical Specifications

Figure 2-1 shows the mounting dimensions and locations of the screw holes for the drive.

Figure 2-1. Mounting Dimensions

6 RELEASED 1/16/09 (WD CONFIDENTIAL) 2679-701205-A00

WD Scorpio ML160M Specifications

2.4 Electrical Specifications

2.4.1 Current Requirements and Power Dissipation

Operating Mode

Mean Current

1

Power, Average

5 VDC

Spinup (max) 1000 mA 5.0W

Spinup 700 mA 3.5W

Read/Write 500 mA 2.5W

Seek 500 mA 2.5W

POWER MANAGEMENT COMMANDS

Operating Mode

Mean Current

1

Power, Average

5 VDC

Idle (E1H)

Performance (mode 1) 400 mA 2.0W

Active (mode 2) 260 mA 1.3W

Low Power (mode 3) 170 mA 0.85W

Standby (E0H) 60 mA 0.3W

Sleep (E6H) 60 mA 0.3W

1

All values are typical (25°C and 5V input) except where specified as maximum.

Note: Current measurements cut off frequency at 1 kHz.

1

1

Figure 2-2. Typical +5V Current Draw During Spinup

Note: Current is 200 mA per 10 mV vertical deflection.

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