Vitek VT-3485new DATASHEET

TFA9842J

2-channel audio ampliﬁer; SE: 1 W to 7.5 W; BTL: 2 W to 15 W

Rev. 01 — 26 April 2004 Preliminary data

1. General description

The TFA9842J contains two identical audio power ampliﬁers. The TFA9842J can be used as two Single-Ended (SE) channels with a ﬁxed gain of 26 dB or one Bridge-Tied Load (BTL) channel with a ﬁxed gain of 32 dB.

The TFA9842J comes in a 9-pin DIL-bent-SIL (DBS9P) power package. The TFA9842J is pin compatible with the TFA9841J and TFA9843J.

The TFA9842J contains a unique protection circuit that is solely based on multiple temperature measurements inside the chip. This gives maximum output power for all supply voltages and load conditions with no unnecessary audio holes. Almost any supply voltage and load impedance combination can be made as long as thermal boundary conditions (number of channels used, external heatsink and ambient temperature) allow it.

2. Features

3. Applications

■ SE: 1 W to 7.5 W; BTL: 2 W to 15 W operation possibility

■ Soft clipping

■ Standby and mute mode

■ No on/off switching plops

■ Low standby current

■ High supply voltage ripple rejection

■ Outputs short-circuit protected to ground, supply and across the load

■ Thermally protected

■ Pin compatible with the TFA9841J and TFA9843J.

■ Television

■ PC speakers

■ Boom box

■ Mini and micro audio receivers.

Philips Semiconductors

4. Quick reference data

Table 1: Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

V

CC

I

q

I

stb

P

o

THD total harmonic

G

v

SVRR supply voltage ripple

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

supply voltage operating 9 17 26 V

no signal - - 28 V

quiescent supply current

standby supply current - - 10 µA output power VCC=17V; THD=10%

distortion voltage gain SE 25 26 27 dB

rejection

VCC=18V; RL= ∞ - 60 100 mA

=4Ω 7 7.5 - W

SE; R

L

BTL; R SE; P BTL; P

=8Ω 14 15 - W

L

= 1 W - 0.1 0.5 %

o

= 1 W - 0.05 0.5 %

o

BTL 31 32 33 dB f=1kHz

SE - 60 - dB

BTL - 65 - dB

5. Ordering information

Table 2: Ordering information

Type number

TFA9842J DBS9P plastic DIL-bent-SIL power package; 9 leads

Package Name Description Version

SOT523 -1

(lead length 12/11 mm); exposed die pad

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Preliminary data Rev. 01 — 26 April 2004 2 of 21

Philips Semiconductors

6. Block diagram

IN1+

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

V

CC

9

4

60 kΩ

8

OUT1+

Fig 1. Block diagram.

7. Pinning information

7.1 Pinning

IN2+

CIV

MODE

1

60 kΩ

3

V

REF

7

STANDBY

MUTE

ON

TFA9842J

5

GND

SHORT-CIRCUIT

AND

TEMPERATURE

PROTECTION

V

CC

0.5V

CC

MDB801

2

6

OUT2−

SVR

+

1

IN2

2

OUT2−

3

CIV

4

IN1+

GND

5

TFA9842J

6

SVR

7

MODE

8

OUT1+

V

9

CC

MDB802

Fig 2. Pin conﬁguration.

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Preliminary data Rev. 01 — 26 April 2004 3 of 21

Philips Semiconductors

7.2 Pin description

Table 3: Pin description

Symbol Pin Description

IN2+ 1 input 2 OUT2− 2 inverted loudspeaker terminal 2 CIV 3 common input voltage decoupling IN1+ 4 input 1 GND 5 ground SVR 6 half supply voltage decoupling (ripple rejection) MODE 7 mode selection input (standby, mute and operating) OUT1+ 8 non inverted loudspeaker terminal 1 V

CC

TAB - back side tab or heats spreader has to be connected to ground

8. Functional description

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

9 supply voltage

8.1 Input conﬁguration

The input cut-off frequency is:

f

i cut off–()

=

SE application: Ri=60kΩ and Ci= 220 nF:

f

i cut off–()

BTL application: Ri=30kΩ and Ci= 470 nF:

f

i cut off–()

As shown in Equation 2 and Equation 3, large capacitor values for the inputs are not necessary, so the switch-on delay during charging of the input capacitors can be minimized. This results in a good low frequency response and good switch-on behavior.

1

---------------------------- -

2π RiCi×()

---------------------------------------------------------------- -

1

12 Hz==

2π 60 103× 220× 109–×()

---------------------------------------------------------------- -

1

11 Hz==

2π 30 103× 470× 109–×()

(1)

(2)

(3)

8.2 Power ampliﬁer

The power ampliﬁer is a Single-Ended (SE) and/or Bridge-Tied Load (BTL) ampliﬁer with an all-NPN output stage, capable of delivering a peak output current of 3 A.

Using the TFA9842J as a BTL ampliﬁer offers the following advantages:

• Lower peak value of the supply current

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Preliminary data Rev. 01 — 26 April 2004 4 of 21

Philips Semiconductors

• Ripple frequency on the supply voltage is twice the signal frequency

• No expensive DC-blocking capacitor

• Good low frequency performance.

8.2.1 Output power measurement

The output power as a function of the supply voltage is measured on the output pins at THD = 10 %; see Figure 6.

The maximum output powerislimitedbythesupplyvoltage of 26 Vandthemaximum availableoutputcurrentis 3 A (repetitive peak current). A minimum load for SE of 4 Ω and for BTL of 16 Ω is required for VCC> 22 V; see Figure 5.

8.2.2 Headroom

Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom, compared to the average power output, for transferring the loudest parts without distortion. At VCC= 18 V and Po= 5 W (SE with RL=4Ω) or Po= 10 W (BTL with RL=8Ω) at THD = 0.2 % (see Figure 7), the Average Listening Level (ALL) music power without any distortion yields:

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

3

510

P

oALLSE,()

P

o ALL BTL,()

⋅

---------------

15.85

10 103⋅

------------------

15.85

315 mW==

630 mW==

The power dissipation can be derived from Figure 9 (SE and BTL) for a headroom of 0 dB and 12 dB, respectively (see Table 4).

Table 4: Power rating as function of headroom

Headroom Power output Power dissipation

SE BTL

0dB P 12 dB P

=5W Po=10W PD= 8.4 W

o

= 315 mW P

o(ALL)

= 630 mW PD= 4.2 W

o(ALL)

(both channels driven)

For the average listening level a power dissipation of 4.2 W can be used for a heatsink calculation.

8.3 Mode selection

The TFA9842J has three functional modes, which can be selected by applying the proper DC voltage to pin MODE (see Table 5 and Figure 3).

(4)

(5)

Table 5: Mode selection

V

MODE

0 to 0.8 V standby

4.5 V to (V

− 2.0 V) to V

(V

CC

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Preliminary data Rev. 01 — 26 April 2004 5 of 21

− 3.5 V) mute

CC

Ampliﬁers 1 and 2

on

Philips Semiconductors

Standby — The current consumption is very low and the outputs are ﬂoating. The

device is in standby mode when V Mute — The ampliﬁer isDC-biased but not operational (noaudio output). Thisallows

the input coupling capacitors to be charged to avoid pop-noise. The deviceis in mute mode when 4.5V<V

On — The ampliﬁer is operating normally. The operating mode is activated at V

MODE

>(VCC− 2.0 V).

standby all mute 1/2 on

<(VCC− 3.5 V).

MODE

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

< 0.8 V, or when pin MODE is grounded.

MODE

0.8 4.5 VCC−3.5 V

Fig 3. Mode selection.

VCC−2.0

V

MODE

CC

(V)

MCE502

8.4 Supply voltage ripple rejection

The supply voltage ripple rejection (SVRR) is measured with an electrolytic capacitor of 150 µF on pin SVR using a bandwidth of 20 Hz to 22 kHz. Figure 11 illustrates the SVRR as function of the frequency. A larger capacitor valueon pin SVR improves the ripple rejection behavior at the lower frequencies.

8.5 Built-in protection circuits

The TFA9842J contains two types of temperature sensors; one measures local temperatures of the power stages and one measures the global chip temperature.At a local temperature of the power stage of approximately 185oC or a global temperature of approximately 150oC this detection circuit switches off the power stages for 2 ms. High impedance ofthe outputs is the result.After this time period the power stages switch on automatically and the detection will take place again; still a too high temperature switches off the power stages immediately. This protects the TFA9842J against shorts to ground, to the supply voltage, across the load and too high chip temperatures.

The protection will only be activated when necessary, so even during a short-circuit condition, a certain amount of (pulsed) current will still be ﬂowing through the short, just as much as the power stage can handle without exceeding the critical temperature level.

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Preliminary data Rev. 01 — 26 April 2004 6 of 21

Philips Semiconductors

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

9. Limiting values

Table 6: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

V

CC

supply voltage operating −0.3 +26 V

no signal −0.3 +28 V

V

I

ORM

T

stg

T

amb

P

tot

V

CC(sc)

input voltage −0.3 VCC+ 0.3 V repetitive peak output current - 3 A storage temperature non-operating −55 +150 °C ambient temperature operating −40 +85 °C total power dissipation - 35 W supply voltage to guarantee short-circuit

-24V

protection

10. Thermal characteristics

Table 7: Thermal characteristics

Symbol Parameter Conditions Value Unit

R R

th(j-a) th(j-c)

thermal resistance from junction to ambient in free air 40 K/W thermal resistance from junction to case both channels driven 2.0 K/W

11. Static characteristics

Table 8: Static characteristics

VCC=17V; T

Symbol Parameter Conditions Min Typ Max Unit

V

CC

I

q

I

stb

V

O

∆V

OUT

V

MODE

I

MODE

[1] A minimum load for BTL of 16 Ω is required at VCC>22V. [2] With a load connected at the outputs the quiescent supply current will increase. [3] The DC output voltage with respect to ground is approximately 0.5VCC. [4] ∆V

OUT

=25°C; RL=8Ω; V

amb

MODE=VCC

supply voltage operating quiescent supply current RL= ∞ standby supply current V DC output voltage differential output voltage offset BTL mode

; Vi= 0 V; measured in test circuit Figure 13; unless otherwise speciﬁed.

[1]

9 1726V

[2]

- 60 100 mA

=0 --10µA

MODE

[3]

-9-V

[4]

- - 200 mV

mode selection input voltage on mode VCC− 2.0 - V

mute mode 4.5 - V standby mode 0 - 0.8 V

input current on pin MODE 0 < V

= V

OUT1+

− V

OUT2−



MODE<VCC

− 3.5 - - 20 µA

CC

− 3.5 V

CC

V

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Preliminary data Rev. 01 — 26 April 2004 7 of 21

Philips Semiconductors

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

12. Dynamic characteristics

Table 9: Dynamic characteristics SE

VCC=17V; T

Symbol Parameter Conditions Min Typ Max Unit

P

o

THD total harmonic distortion P G

v

Z

i

V

n(o)

SVRR supply voltage ripple

V

o(mute)

α

cs

| channel unbalance - - 1 dB

|G

v

=25°C; RL=4Ω; f = 1 kHz; V

amb

MODE=VCC

; measured in test circuit Figure 12; unless otherwise speciﬁed.

output power THD = 10 %; RL=4Ω 7 7.5 - W

THD = 0.5 % R

= 1 W - 0.1 0.5 %

o

=4Ω - 6.1 - W

L

SE voltage gain 25 26 27 dB input impedance 40 60 - kΩ noise output voltage

rejection output voltage in mute mode

channel separation R

= 1 kHz

f

ripple

= 100 Hz to 20 kHz

f

ripple

=0Ω 50 60 - dB

source

[1]

- 150 - µV

[2]

-60-dB

[2]

-60-dB

[3]

- - 150 µV

[1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance

R

=0Ω at the input.

source

[2] Supply voltage ripple rejection is measured at the output, with a source impedance R

from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency f is applied to the positive supply rail.

[3] Output voltage in mute mode (V

including noise.

= 7 V) is measured with an input voltage of 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz,

MODE

=0Ω at the input and with a frequency range

source

and an amplitude of 300 mV (RMS), which

ripple

Table 10: Dynamic characteristics BTL

VCC=17V; T

=25°C; RL=8Ω; f = 1 kHz; V

amb

MODE=VCC

; measured in test circuit Figure 13; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

P

o

THD total harmonic distortion P G

v

Z

i

V

n(o)

SVRR supply voltage ripple

V

o(mute)

α

cs

|G

v|

output power THD = 10 %; RL=8Ω 14 15 - W

THD = 0.5 %; R

= 1 W - 0.05 0.5 %

o

=8Ω -14 W

L

BTL voltage gain 31 32 33 dB input impedance 20 30 - kΩ noise output voltage

rejection output voltage in mute mode

channel separation R

= 1 kHz

f

ripple

= 100 Hz to 20 kHz

f

ripple

=0Ω 50 65 - dB

source

[1]

- 200 - µV

[2]

-65-dB

[2]

-65-dB

[3]

- - 250 µV

channel unbalance - - 1 dB

[1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance

R

=0Ω at the input.

source

[2] Supply voltage ripple rejection is measured at the output, with a source impedance R

from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency f is applied to the positive supply rail.

[3] Output voltage in mute mode (V

including noise.

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Preliminary data Rev. 01 — 26 April 2004 8 of 21

= 7 V) is measured with an input voltage of 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz,

MODE

=0Ω at the input and with a frequency range

source

and an amplitude of 300 mV (RMS), which

ripple

Philips Semiconductors

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

7

10

V

o

(µV)

6

10

5

10

4

10

3

10

2

10

1

04812

BTL; Vi=50mV; VCC=18V.

Fig 4. AC output voltage as function of mode selection voltage.

mdb806

P

(W)

P

(W)

40

o

30

mce486

16

40

o

30

V

MODE

20

(V)

mdb805

4 Ω 6 Ω 8 Ω

20

RL = 1 Ω

10

0

82012 24 28

2 Ω

16

3 Ω

4 Ω

8 Ω

V

CC

(V)

20

RL = 2 Ω

10

0

82012 24 2816

THD=10%. THD=10%.

a. SE. b. BTL.

Fig 5. Output power (one channel) as function of supply voltage for various loads.

16 Ω

VCC (V)

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Preliminary data Rev. 01 — 26 April 2004 9 of 21

Philips Semiconductors

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

15

P

o

(W)

12

9

6

3

0

81410 16 18

12

MDB809

VCC (V)

15

P

o

(W)

12

9

6

3

0

81410 16 18

THD = 10 %; RL=4Ω; f = 1 kHz. THD = 10 %; RL=8Ω; f = 1 kHz.

a. SE. b. BTL.

Fig 6. Output power as function of supply voltage.

10

THD+N

(%)

2

10

MCE488

10

THD+N

(%)

2

10

MDB810

12

VCC (V)

MCE487

1

−1

10

−2

10

−1

10

110

Po (W)

2

10

VCC= 18 V; f = 1 kHz; RL=4Ω.V

1

−1

10

−2

10

−1

10

= 18 V; f = 1 kHz; RL=8Ω.

CC

1

10

Po (W)

2

10

a. SE. b. BTL.

Fig 7. Total harmonic distortion-plus-noise as function of output power.

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Philips Semiconductors

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

MCE489

4

10

f (Hz)

5

10

THD+N

(%)

10

1

−1

−2

10

2

10

3

10

VCC=17V; Po= 1 W; RL=4Ω.V

10

THD+N

(%)

1

−1

10

−2

10

= 17 V; Po= 1 W; RL=8Ω.

CC

2

10

a. SE. b. BTL.

Fig 8. Total harmonic distortion-plus-noise as function of frequency.

MCE507

P (W)

10 D

8

P

(W)

10 D

8

MCE490

3

10

4

10

f (Hz)

MCE508

5

10

6

4

2

0

020

4

81216

Po (W)

VCC=18V; RL=4Ω.V

6

4

2

0

020

= 18 V; RL=8Ω.

CC

4

81216

Po (W)

a. SE. b. BTL.

Fig 9. Total power dissipation as function of channel output power per channel (worst case, both channels

driven).

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Preliminary data Rev. 01 — 26 April 2004 11 of 21

Philips Semiconductors

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

0

α

cs

(dB)

−20

−40

−60

−80

−100

10

2

10

3

10

VCC=17V; RL=4Ω.V

MCE495

4

10

f (Hz)

5

10

0

α

cs

(dB)

−20

−40

−60

−80

−100

10

= 17 V; RL=8Ω.

CC

2

10

3

10

a. SE. b. BTL.

Fig 10. Channel separation as function of frequency (no bandpass ﬁlter applied).

MCE497

SVRR

(dB)

−20

0

SVRR

(dB)

−20

0

MCE496

4

10

f (Hz)

10

MCE498

5

−40

−60

−80

10

VCC=17V; R

source

2

10

=0Ω; V

3

10

= 300 mV (RMS);

ripple

4

10

f (Hz)

10

a bandpass ﬁlter of 20 Hz to 22 kHz has been applied; inputs short-circuited.

5

−40

−60

−80

10

VCC= 17 V; R

source

2

10

=0Ω; V

3

10

= 300 mV (RMS);

ripple

4

10

f (Hz)

10

a bandpass ﬁlter of 20 Hz to 22 kHz has been applied;

inputs short-circuited.

5

a. SE. b. BTL.

Fig 11. Supply voltage ripple rejection as function of frequency.

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Preliminary data Rev. 01 — 26 April 2004 12 of 21

Philips Semiconductors

13. Application information

V

i

V

i

V

CC

10kΩ50

100

kΩ

270 Ω

220 nF

22

µF

IN1+

IN2+

CIV

MODE

SVR

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

V

CC

9

4

60 kΩ

1

60 kΩ

3

V

REF

7

6

STANDBY

MUTE

ON

SHORT-CIRCUIT

TEMPERATURE

PROTECTION

V

0.5V

CC

AND

CC

8

2

100 nF

OUT1+

OUT2−

470 µF

+

−

− +

1000 µF

R

L

4 Ω

R

L

4 Ω

CC

7.5 V

micro-

controller

1.5 kΩ

BC547

2.2 µF

Fig 12. Typical SE application diagram.

47

µF

TFA9842J

5

GND

mdb803

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Preliminary data Rev. 01 — 26 April 2004 13 of 21

Philips Semiconductors

IN1+

470 nF

V

i

IN2+

CIV

MODE

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

V

CC

9

4

60 kΩ

1

60 kΩ

3

V

REF

7

STANDBY

MUTE

ON

SHORT-CIRCUIT

AND

TEMPERATURE

PROTECTION

V

CC

8

2

100 nF

OUT1+

+

−

OUT2−

R 8 Ω

L

1000 µF

CC

MICRO-

CONTROLLER

22 µF

Fig 13. BTL application diagram.

Remark: Because of switching inductive loads, the output voltage can rise beyond

the maximum supply voltage of 28 V. At high supply voltages, it is recommended to use (Schottky) diodes to the supply voltage and ground.

13.1 Printed-circuit board

13.1.1 Layout and grounding

To obtain a high-level system performance, certain grounding techniques are essential. The input reference grounds have to be tied with their respective source grounds and must have separate tracks from the power ground tracks; this will prevent the large (output) signal currents from interfering with the small AC input signals. The small-signal ground tracks should be physically located as far as possible from the power ground tracks. Supply and output tracks should be as wide as possible for delivering maximum output power.

TFA9842J

5

GND

0.5V

CC

SVR

6

MDB804

150 µF

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Preliminary data Rev. 01 — 26 April 2004 14 of 21

Philips Semiconductors

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

BTL1/2

1000 µF

−SE2+

CIV

22 µF

CIV

Fig 14. Printed-circuit board layout (single-sided); components view.

13.1.2 Power supply decoupling

Proper supply bypassing is critical for low-noise performance and high supply voltage ripple rejection. The respective capacitor location should be as close as possible to the device and grounded to the power ground. Proper power supply decoupling also prevents oscillations.

AUDIO POWER CS NIJMEGEN

TVA

TFA9843J

1

100 nF

220

nF

SGND

IN2+ IN1+

220 nF

27 Jan. 2003 / FP

1000 µF

+V

P

SVR

1000 µF

150 µF

10 kΩ

−SE1+

SVR

MODE

10 kΩ

SB ON

MUTE

MCE506

For suppressing higher frequency transients (spikes) on the supply line a capacitor with low ESR, typical 100 nF, has to be placed as close as possible to the device. For suppressing lower frequency noise and ripple signals, a large electrolytic capacitor, e.g. 1000 µF or greater, must be placed close to the device.

The bypass capacitor on pin SVR reduces the noise and ripple on the mid rail voltage. For good THD and noise performance a low ESR capacitor is recommended.

13.2 Thermal behavior and heatsink calculation

The measured maximum thermal resistance of the IC package, R A calculation for the heatsink can be made, with the following parameters:

T

amb(max)

=60°C (example) VCC= 18 V and RL=4Ω (SE) T

= 150 °C (speciﬁcation)

j(max)

R

is the total thermal resistance between the junction and the ambient including

th(tot)

the heatsink. This can be calculated using the maximum temperature increase divided by the power dissipation:

R

=(T

th(tot)

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Preliminary data Rev. 01 — 26 April 2004 15 of 21

j(max)

− T

amb(max)

)/P

D

th(j-mb)

, is 2.0 K/W.

Philips Semiconductors

At VCC=18VandRL=4Ω (2 × SE) the measured worst-case sine-wave dissipation is 8.4 W; see Figure 9.

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

(

150

T

°C)

100

For T

= 150 °C the temperature raise, caused by the power dissipation, is:

j(max)

150 − 60=90°C:

P × R R

th(tot)

R

th(h-a)=Rth(tot)

=90°C

th(tot)

= 90/8.4 = 10.7 K/W

− R

th(j-mb)

= 10.7 − 2.0 = 8.7 K/W.

This calculation is for an application at worst-case (stereo) sine-wave output signals. In practice music signals will be applied, which decreases the maximum power dissipation to approximately half of the sine-wave power dissipation (see

Section 8.2.2). This allows for the use of a smaller heatsink:

P × R R

th(tot)

R

th(h-a)=Rth(tot)

RL = 2 Ω

j

4 Ω

=90°C

th(tot)

= 90/4.2 = 21.4 K/W

− R

th(j-mb)

MDB808

6 Ω

8 Ω

16 Ω

= 21.4 − 2.0 = 19.4 K/W.

150

RL = 1 Ω

j

(

T

°C)

100

2 Ω

MDB807

3 Ω

4 Ω

8 Ω

50

0

8

12 28

External heatsink of 8 K/W; with music signals; T

=25°C.

amb

16 20 24

V

CC

(V)

50

0

8

External heatsink of 8 K/W; with music signals; T

=25°C.

amb

a. SE. b. BTL.

Fig 15. Junction temperature as function of supply voltage for various loads.

14. Test information

14.1 Quality information

The

General Quality Speciﬁcation for Integrated Circuits, SNW-FQ-611

12 28

16 20 24

V

(V)

CC

is applicable.

9397 750 12013

Preliminary data Rev. 01 — 26 April 2004 16 of 21

Philips Semiconductors

15. Package outline

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad

q

non-concave

x

D

1

P

k

q

2

E

view B: mounting base side

A

2

B

E

h

1

q

SOT523-1

19

D

3.5

e

1

e

(1)

E

h

14.7

14.3

3.5

h

2.54

Z

DIMENSIONS (mm are the original dimensions)

(2)

UNIT b

A

p

2

2.7

mm

Notes

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.

0.80

2.3

0.65

OUTLINE

VERSION

SOT523-1

cD

0.58

0.48

(1)

(2)

D

1

13.2

6.2

12.8

5.8

IEC JEDEC JEITA

w M

b

p

0 10 mm5

e

1

1.27

5.08 4.85

REFERENCES

Fig 16. DBS9P package outline.

L

3

L

2

L

2

3.8

3.6

1

v M

v

w

0.8

0.3

ISSUE DATE

00-07-03 03-03-12

x

0.02

Z

1.65

1.10

(1)

L

Qc

m

scale

e

2

3212.4

L

Lq

11.0

11.4

10.0

L

m

2.8

Pk

3.4

3.1

1

2

3

6.7

4.5

5.5

3.7

e

QE

q

1.15

17.5

0.85

16.3

EUROPEAN

PROJECTION

2

q

1

9397 750 12013

Preliminary data Rev. 01 — 26 April 2004 17 of 21

Philips Semiconductors

16. Soldering

16.1 Introduction to soldering through-hole mount packages

This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our

Packages

Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.

16.2 Soldering by dipping or by solder wave

Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

The total contact time of successive solder waves must not exceed 5 seconds.

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

Data Handbook IC26; Integrated Circuit

(document order number 9398 652 90011).

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the speciﬁed maximum storage temperature (T If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

16.3 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not morethan 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

16.4 Package related soldering information

Table 11: Suitability of through-hole mount IC packages for dipping and wave

soldering methods

Package Soldering method

Dipping Wave

DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable

[2]

PMFP

[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the

printed-circuit board.

[2] For PMFP packages hot bar soldering or manual soldering is suitable.

− not suitable

).

stg(max)

[1]

9397 750 12013

Preliminary data Rev. 01 — 26 April 2004 18 of 21

Philips Semiconductors

17. Revision history

Table 12: Revision history

Rev Date CPCN Description

01 20040426 - Preliminary data (9397 750 12013)

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

9397 750 12013

Preliminary data Rev. 01 — 26 April 2004 19 of 21

Philips Semiconductors

18. Data sheet status

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

Level Data sheet status

I Objective data Development This data sheet contains data from the objective speciﬁcation for product development. Philips

II Preliminary data Qualiﬁcation This data sheet contains data from the preliminary speciﬁcation. Supplementary data will be published

III Product data Production This data sheet contains data from the product speciﬁcation. Philips Semiconductors reserves the

[1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

[1]

Product status

19. Deﬁnitions

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values deﬁnition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the speciﬁed use without further testing or modiﬁcation.

[2][3]

Deﬁnition

Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in order to improve the design and supply the best possible product.

right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

20. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, andmakes no representations or warranties thatthese products are free from patent, copyright, or mask work right infringement, unless otherwise speciﬁed.

Contact information

For additional information, please visit http://www.semiconductors.philips.com. For sales ofﬁce addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com. Fax: +31 40 27 24825

9397 750 12013

Preliminary data Rev. 01 — 26 April 2004 20 of 21

Philips Semiconductors

Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Functional description . . . . . . . . . . . . . . . . . . . 4

8.1 Input conﬁguration . . . . . . . . . . . . . . . . . . . . . . 4

8.2 Power ampliﬁer. . . . . . . . . . . . . . . . . . . . . . . . . 4

8.2.1 Output power measurement . . . . . . . . . . . . . . . 5

8.2.2 Headroom. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

8.3 Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5

8.4 Supply voltage ripple rejection . . . . . . . . . . . . . 6

8.5 Built-in protection circuits . . . . . . . . . . . . . . . . . 6

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7

10 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7

11 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7

12 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8

13 Application information. . . . . . . . . . . . . . . . . . 13

13.1 Printed-circuit board . . . . . . . . . . . . . . . . . . . . 14

13.1.1 Layout and grounding. . . . . . . . . . . . . . . . . . . 14

13.1.2 Power supply decoupling . . . . . . . . . . . . . . . . 15

13.2 Thermal behavior and heatsink calculation . . 15

14 Test information. . . . . . . . . . . . . . . . . . . . . . . . 16

14.1 Quality information . . . . . . . . . . . . . . . . . . . . . 16

15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17

16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

16.1 Introduction to soldering through-hole

mount packages . . . . . . . . . . . . . . . . . . . . . . 18

16.2 Soldering by dipping or by solder wave . . . . . 18

16.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 18

16.4 Package related soldering information . . . . . . 18

17 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19

18 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 20

19 Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

20 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

TFA9842J

2-channel audio ampliﬁer (2 x SE or 1 x BTL)

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Date of release: 26 April 2004 Document order number: 9397 750 12013

Vitek VT-3485new DATASHEET

Specifications and Main Features

Frequently Asked Questions

User Manual

1. General description

2. Features

3. Applications

4. Quick reference data

5. Ordering information

6. Block diagram

7. Pinning information

7.1 Pinning

7.2 Pin description

8. Functional description

8.3 Mode selection

8.4 Supply voltage ripple rejection

8.5 Built-in protection circuits

9. Limiting values

10. Thermal characteristics

11. Static characteristics

12. Dynamic characteristics

13. Application information

13.1 Printed-circuit board

13.2 Thermal behavior and heatsink calculation

14. Test information

14.1 Quality information

15. Package outline

16. Soldering

16.1 Introduction to soldering through-hole mount packages

16.2 Soldering by dipping or by solder wave

16.3 Manual soldering

16.4 Package related soldering information

17. Revision history

18. Data sheet status

20. Disclaimers