The above model is classified as a green product (*1), as indicated by the underlined serial
number. This Service Manual describes replacement parts for the green product. When
repairing this green product, use the part(s) described in this manual and lead-free solder (*2).
For (*1) and (*2), see the next page.
TOSHIBA CORPORATION 2006
Published in Japan, Mar. 2006 GREEN
(*1) GREEN PRODUCT PROCUREMENT
The EC is actively promoting the WEEE & RoHS Directives that define standards for recycling
and reuse of Waste Electr ical and Electronic Equipment and for the Res triction of the use of
certain Hazardous Substances. From July 1, 2006, the RoHS Directive will prohibit any
marketing of new products containing the restricted substances.
Increasing attention is given to issue s related to the global environmental. Toshiba Corporation
recognizes environmental protection as a key management tasks, and is doing its utmost to
enhance and improve the quality and scope of its environmental activities. In line with this,
Toshiba proactively promotes Green Procurement, and seeks to purchase and use products,
parts and materials that have low environmental impacts.
Green procurement of par ts i s not only confined to manufacture. The same green p ar ts u sed in
manufacture must also be used as replacement parts.
(*2) LEAD-FREE SOLDER
This product is manufactured using lead-free solder as a part of a movement within the consumer
products industry at large to be environmentally responsib le . Lead-free solde r m ust be used in the
servicing and repair of this product.
WARNING
This product is manufactured using lead free solder.
DO NOT USE LEAD BASED SOLDER TO REPAIR THIS PRODUCT !
The melting temperature of lead-free solder is higher than that of leaded solder by 86°F to 104°F
(30°C to 40°C). Use of a soldering iron designed for lead-based solders to repair product made
with lead-free solder may result in damage to the component and or BOARD being soldered.
Great care should be made to ensure high-quality soldering when servicing this product —
especially when soldering large components, through- hole pins, and on BOARDs — as the level
of heat required to melt lead-free solder is high.
IMPORTANT SAFETY NOTICE
Proper service and repair is important to the safe, reliable operation of all
TOSHIBA Equipment. The service procedures recommended by TOSHIBA
and described in this service manual are effective methods of performing
service operations. Some of these service special tools should be used
when and as recommended.
It is important to note that this service manual contains various CAUTIONS
and NOTICES which should be carefully read in order to minimize the risk
of personal injury to service personnel. The possibility exists that improper
service methods may damage the equipment. It also is important to
understand that these CAUTIONS and NOTICES ARE NOT EXHAUSTIVE.
TOSHIBA could not possibly know, evaluate and advice the service trade of
all conceivable ways in which service might be done or of the possible
hazardous consequences of each way. Consequently, TOSHIBA has not
undertaken any such broad evaluation. Accordingly, a servicer who uses a
service procedure or tool which is not recommended by TOSHIBA must
first use all precautions thoroughly so that neither his safety nor the safe
operation of the equipment will be jeopardized by the service method
selected.
During audio output : 2V rms (Output impedance:
less than 1 kΩ )
Jacks : RCA jacks
Digital audio output [Output 1 (rear) COAXIAL]
Output level : 500 mVp-p (75 Ω )
Jacks : RCA jack
Note
The specifications and design of this product are subject to
change without notice.
B/CB, PR/CR:
Receivable channels
VHF : 2-13ch
UHF : 14-69ch
CATV : C1-C125ch
1-1-1E7A70SP
LASER BEAM SAFETY PRECAUTIONS
This DVD player uses a pickup that emits a laser beam.
Do not look directly at the laser beam coming
from the pickup or allow it to strike against your
skin.
The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep
your eyes at least 30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser
beam.
CAUTION: Use of controls and adjustments, or doing procedures other than those specified herein, may result in
hazardous radiation exposure.
Drive Mechanism Assembly
Laser Beam Radiation
Laser Pickup
Turntable
Location: Inside Top of DVD mechanism.
1-2-1R3NLSP
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special
safety-related characteri st ic s whic h are of ten not
evident from visual inspection, nor can the protection
they give necessarily be obtained by replacing them
with components rated for higher voltage, wattage,
etc. Parts that have special safety characteristics are
identified by a # on schematics and in parts lists. Use
of a substitute replacement that does not have the
same safety characteristics as the recommended
replacement part might create shock, fire, and/or other
hazards. The Product’s Safety is under review
continuously and new instructions are issued
whenever appropriate. Prior to shipment from the
factory , our products are carefully inspected to confirm
with the recognized product safety and electrical
codes of the countries in which they are to be sold.
However, in order to maintain such compliance, it is
equally important to implement the following
precautions when a set is being serviced.
Precautions during Servicing
A. Parts identified by the # symbol are critical for
safety. Replace only with part number specified.
B. In addition to safety, other parts and assemblies
are specified for conformance with regulations
applying to spurious radiation. These must also be
replaced only with specified replacements.
Examples: RF converters, RF cables, noise
blocking capacitors, and noise blocking filters, etc.
C. Use specified internal wiring. Note especially:
1) Wires covered with PVC tubing
2) Double insulated wires
3) High voltage leads
D. Use specified insulating materials for hazardous
live parts. Note especially:
1) Insulation tape
2) PVC tubing
3) Spacers
4) Insulators for transistors
E. When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before
soldering.
F.Observe that the wires do not contact heat
producing parts (heat sinks, oxide metal film
resistors, fusible resistors, etc.).
G. Check that replaced wires do not contact sharp
edges or pointed parts.
H. When a powe r cord has be en repla ced, ch eck that
5 - 6 kg of force in any direction will not loosen it.
I.Also check areas surrounding repaired locations.
J. Be careful that foreign objects (screws, solder
droplets, etc.) do not remain inside the set.
K. Crimp type wire connector
The power transformer uses crimp type
connectors which connect the power cord and the
primary side of the transformer. When replacing
the transformer, follow these steps carefully and
precisely to prevent shock hazards.
Replacement procedure
1) Remove the old connector by cutting the wires
at a point close to the connector.
Important: Do not re-use a connector.
(Discard it.)
2) Strip about 15 mm of the insulation from the
ends of the wires. If the wires are stranded,
twist the strands to avoid frayed conductors.
3) Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
4) Use a crimping tool to crimp the metal sleeve at
its center. Be sure to crimp fully to the complete
closure of the tool.
L. When connecting or disconnecting the internal
connectors, first, disconnect the AC plug from the
AC outlet.
1-3-1DVDN_ISP
Safety Check after Servicing
Examine the area surrounding the repaired location for damage or deterioration. Observe that screws, parts, and
wires have been returned to their original positions. Afterwards, do the following tests and confirm the specified
values to verify compliance with safety standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance distance (d) and (d’) between
soldered terminals, and between terminals and
surrounding metallic parts. (See Fig. 1)
Table 1: Ratings for selected area
Chassis or Secondary Conductor
Primary Circuit
AC Line VoltageClearance Distance (d), (d’)
120 V≥ 3.2 mm (0.126 inches)
Note: This table is unofficial and for reference only . Be
sure to confirm the precise values.
2. Leakage Current Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs) and
externally exposed accessible parts (RF terminals,
antenna terminals, video and audio input and output
terminals, microphone jacks, earphone jacks, etc.) is
lower than or equal to the specified value in the table
below.
Measuring Method (Power ON):
Insert load Z between B (earth ground, power cord plug
prongs) and exposed accessible parts. Use an AC
voltmeter to measure across the terminals of load Z.
See Fig. 2 and the following table.
d'd
Fig. 1
Exposed Accessible Part
Z
AC V oltmeter
(High Impedance)
Earth Ground
B
Power Cord Plug Prongs
Table 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)Earth Ground (B) to:
120 V
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
0.15 µF CAP. & 1.5 kΩ RES.
Connected in parallel
i ≤ 0.5 mA PeakExposed accessible parts
1-3-2DVDN_ISP
Fig. 2
STANDARD NOTES FOR SERVICING
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
Circuit Board Indications
1. The output pin of the 3 pin Regulator ICs is
indicated as shown.
Top View
Out
2. For other ICs, pin 1 and every fifth pin are
indicated as shown.
Pin 1
3. The 1st pin of every male connector is indicated as
shown.
Pin 1
Input
In
Bottom View
5
10
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
1. Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
Instructions for Connectors
1. When you connect or disconnect the FFC (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an
angle.
FFC Cable
Connector
BOARD
* Be careful to avoid a short circuit.
2. Remove the flat pack-IC with tweezers while
applying the hot air .
3. Bottom of the flat pack-IC is fixed with glue to the
BOARD; when removing entire flat pack-IC, first
apply soldering iron to center of the flat pack-IC
and heat up. Then remove (glue will be melted).
(Fig. S-1-6)
4. Release the flat pack-IC from the BOARD using
tweezers. (Fig. S-1-6)
CAUTION:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage
to the chip parts may occur. Put masking tape
around the flat pack-IC to protect other parts from
damage. (Fig. S-1-2)
1-4-1DVDN_SN
3. The flat pack-IC on the BOARD is affixed with
glue, so be careful not to break or damage the foil
of each pin or the solder lands under the IC when
removing it.
With Soldering Iron:
1. Using desoldering brai d, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
BOARD
Masking
Tape
Tweezers
Hot-air
Flat Pack-IC
Desoldering
Machine
Flat Pack-IC
Fig. S-1-2
Flat Pack-IC
Desoldering Braid
Soldering Iron
Fig. S-1-3
2. Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
3. Bottom of the flat pack-IC is fixed with glue to the
BOARD; when removing entire flat pack-IC, first
apply soldering iron to center of the flat pack-IC
and heat up. Then remove (glue will be melted).
(Fig. S-1-6)
4. Release the flat pack-IC from the BOARD using
tweezers. (Fig. S-1-6)
Fig. S-1-4
1-4-2DVDN_SN
With Iron Wire:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
3. While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the BOARD
contact pads as shown in Fig. S-1-5.
4. Bottom of the flat pack-IC is fixed with glue to the
BOARD; when removing entire flat pack-IC, first
apply soldering iron to center of the flat pack-IC
and heat up. Then remove (glue will be melted).
(Fig. S-1-6)
5. Release the flat pack-IC from the BOARD using
tweezers. (Fig. S-1-6)
Note: When using a soldering iron, care must be
taken to ensure that the flat pack-IC is not
being held by glue. When the flat pack-IC is
removed from the BOARD, handle it gently
because it may be damaged if force is applied.
Hot Air Blower
2. Installation
1. Using desoldering brai d, remove the solder from
the foil of each pin of the flat pack-IC on the
BOARD so you can install a replacement flat packIC more easily.
2. The “●” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the BOARD when positioning for installation.
Then presolder the four corners of the flat pack-IC.
(See Fig. S-1-8.)
3. Solder all pins of the flat pack-IC. Be sure that
none of the pins have solder bridges.
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
To Solid
Mounting Point
BOARD
Tweezers
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Flat Pack-IC
or
Presolder
Flat Pack-IC
BOARD
Fig. S-1-8
Fig. S-1-6
1-4-3DVDN_SN
Instructions for Handling Semiconductors
Electrostatic breakdown of the semi-conductors may
occur due to a potential difference caused by
electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1 MΩ) that is
properly grounded to remove any static electricity that
may be charged on the body.
2. Ground for Workbench
Be sure to place a conductive sheet or copper plate
with proper grounding (1 MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape through the body grounding
band, be careful to avoid contacting semi-conductors
with your clothing.
<Incorrect>
<Correct>
1MΩ
BOARD
Grounding Band
1MΩ
BOARD
Conductive Sheet or
Copper Plate
1-4-4DVDN_SN
CABINET DISASSEMBLY INSTRUCTIONS
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
1. Disassembly Flowchart
This flowchart indicates the disassembly steps to gain
access to item(s) t o be se rviced. Wh en reas se mbling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.
[1] COVER TOP
[2] PANEL FRONT
[3] DVD MECHANISM & DVD MAIN BOARD ASSEMBLY
[4] BOARD SWITCH
[5] BOARD HOLDER
[6] PANEL REAR
[7] BOARD POWER
2. Disassembly Method
ID/
Loc.
No.
Part
Fig.
No.
Removal
Remove/*Unhook/
Unlock/Release/
Unplug/Desolder
Note
Note:
(1) Identification (location) No. of parts in the figures
(2) Name of the part
(3) Figure Number for reference
(4) Identification of parts to be removed, unhooked,
unlocked, released, unplugged, unclamped, or
desoldered.
P = Spring, L = Locking Tab, S = Screw,
CN = Connector
* = Unhook, Unlock, Release, Unplug, or Desolder
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs (L-2)
(5) Refer to “Reference Notes.”
Reference Notes
1. CAUTION 1: Locking Tabs (L-1) and (L-2) are
fragile. Be careful not to break them.
[1] COVER TOP
(S-1)
(S-1)
[1]COVER TOP D1 7(S-1)---
PANEL
[2]
FRONT
DVD
MECHANISM
[3]
& DVD MAIN
BOARD
ASSEMBLY
BOARD
[4]
SWITCH
BOARD
[5]
HOLDER
PANEL
[6]
REAR
BOARD
[7]
POWER
↓
(1)
↓
(2)
D2 *6(L-1), *3(L-2)1
4(S-2), *CN101,
*CN701,
LOCKING CARD
D3
SPACERS,
MAIN SHEET
(S-3), S PLATE
D4
EARTH, Desolder
D4 2(S-4)---
D5 2(S-5), 6(S-6)---
3(S-7), HEAT SINK
D5
EARTH PLATE
↓
(3)
↓
(4)
(5)
(S-1)
---
---
Fig. D1
---
↓
1-5-1E7A70DC
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