TEXAS INSTRUMENTS XTR115, XTR116 Technical data

XTR115

XTR115

XTR116

XTR116

SBOS124A – JANUARY 2000 – REVISED NOVEMBER 2003

4-20mA CURRENT LOOP TRANSMITTERS

FEATURES

● LOW QUIESCENT CURRENT: 200µA

● 5V REGULATOR FOR EXTERNAL CIRCUITS

● V

FOR SENSOR EXCITATION:

REF

XTR115: 2.5V
XTR116: 4.096V

● LOW SPAN ERROR: 0.05%

● LOW NONLINEARITY ERROR: 0.003%

● WIDE LOOP SUPPLY RANGE: 7.5V to 36V

● SO-8 PACKAGE

DESCRIPTION

The XTR115 and XTR116 are precision current out­put converters designed to transmit analog 4-to-20mA
signals over an industry standard current loop. They
provide accurate current scaling and output current
limit functions.

The on-chip voltage regulator (5V) can be used to
power external circuitry. A precision on-chip V
(2.5V for XTR115 and 4.096V for XTR116) can be

REF

APPLICATIONS

● 2-WIRE, 4-20mA CURRENT LOOP

TRANSMITTER

● SMART TRANSMITTER

● INDUSTRIAL PROCESS CONTROL

● TEST SYSTEMS

● COMPATIBLE WITH HART MODEM

● CURRENT AMPLIFIER

● VOLTAGE-TO-CURRENT AMPLIFIER

used for offsetting or to excite transducers. A current
return pin (I
circuitry to assure an accurate control of the output
current.

The XTR115 is a fundamental building block of
smart sensors using 4-to-20mA current transmission.

The XTR115 and XTR116 are specified for opera­tion over the extended industrial temperature range,
–40°C to +85°C.

) senses any current used in external

RET

XTR115
XTR116

V

+5V

XTR115: 2.5V

XTR116: 4.096V

+

V

IN

–

REG

8

V

REF

1

R

IN

I

IN

2

3

I

RET

R

1

2.475kΩ

Voltage

Reference

A1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.

+5V

Regulator

R

LIM

R

2

25Ω

www.ti.com

V+
7

V
B
6

E
5

100 V

IN

I

=

O

R

IN

4

I = 100 • I

IN

Copyright © 2000-2003, Texas Instruments Incorporated

LOOP

R

L

SPECIFICATIONS

At TA = +25°C, V+ = 24V, R

PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS
OUTPUT

Output Current Equation I
Output Current, Linear Range 0.25 25 ✻✻mA
Over-Scale Limit I
Under-Scale Limit I

SPAN

Span (Current Gain) S 100 ✻ A/A

(1)

Error

vs Temperature T

Nonlinearity I

INPUT

Offset Voltage (Op Amp) V

vs Temperature T
vs Supply Voltage, V+ V+ = 7.5V to 36V ±0.1 ±2 ✻✻ µV/V

Bias Current I

vs Temperature 150 ✻ pA/°C

Noise: 0.1Hz to 10Hz e

DYNAMIC RESPONSE

Small Signal Bandwidth C
Slew Rate 3.2 ✻ mA/µs

(2)

V

REF

XTR115 2.5 ✻ V
XTR116 4.096 ✻ V

Voltage Accuracy I

vs Temperature T
vs Supply Voltage, V+ V+ = 7.5V to 36V ±1 ±10 ✻✻ ppm/V

vs Load I
Noise: 0.1Hz to 10Hz 10 ✻ µVp-p
Short-Circuit Current 16 ✻ mA

(2)

V

REG

Voltage 5 ✻ V
Voltage Accuracy I

vs Temperature T

vs Supply Voltage, V+ V+ = 7.5V to 36V 1 ✻ mV/V

vs Output Current See Typical Curves
Short-Circuit Current 12 ✻ mA

POWER SUPPLY V+
Specified +24 ✻ V
Voltage Range +7.5 +36 ✻✻V
Quiescent Current 200 250 ✻✻ µA

Over Temperature, –40°C to +85°C 240 300 ✻✻ µA

TEMPERATURE RANGE

Specification –40 +85 ✻✻°C
Operating –55 +125 ✻✻°C
Storage –55 +125 ✻✻°C
Thermal Resistance

✻ Specifications the same as XTR115U and XTR116U.
NOTES: (1) Does not include initial error or TCR of R

= 20kΩ, and TIP29C external transistor, unless otherwise noted.

IN

IO = IIN • 100 ✻

MIN

LIM

O

I

= 0, I

REG

= 0 0.2 0.25 ✻✻ mA

REF

IIN = 250µA to 25mA ±0.05 ±0.2 ✻ ±0.4 %

= –40°C to +85°C ±3 ±20 ✻✻ ppm/°C

A

= 250µA to 25mA ±0.003 ±0.01 ✻ ±0.02 %

IN

OS

B

n

θ

JA

IIN = 40µA ±100 ±250 ✻ ±500 µV

= –40°C to +85°C ±0.7 ±3 ✻ ±6 µV/°C

A

= 0, RL = 0 380 ✻ kHz

LOOP

= 0 ±0.05 ±0.25 ✻ ±0.5 %

REF

= –40°C to +85°C ±20 ±35 ✻ ±75 ppm/°C

A

= 0mA to 2.5mA ±100 ✻ ppm/mA

REF

= 0 ±0.05 ±0.1 ✻✻ V

REG

= –40°C to +85°C ±0.1 ✻ mV/°C

A

. (2) Voltage measured with respect to I

IN

XTR115U XTR115UA
XTR116U XTR116UA

32 ✻ mA

–35 ✻ nA

0.6 ✻ µVp-p

150 ✻ °C/W

pin.

RET

2

www.ti.com

XTR115, XTR116

SBOS124A

PIN CONFIGURATION

Top View SO-8

1

V

REF

2

IIN

3

I

RET

4

I

O

8

V

7

V+

6

B (Base)

5

E (Emitter)

REG

ABSOLUTE MAXIMUM RATINGS

Power Supply, V+ (referenced to IO pin).......................................... 40V

Input Voltage (referenced to I

Output Current Limit ............................................................... Continuous

V

, Short-Circuit.................................................................. Continuous

REG

V

, Short-Circuit .................................................................. Continuous

REF

Operating Temperature ................................................ –55°C to +125°C

Storage Temperature Range ....................................... –55°C to +125°C

Lead Temperature (soldering, 10s) .............................................. +300°C

Junction Temperature ................................................................... +165°C

NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability.

pin)........................................0V to V+

RET

(1)

ELECTROSTATIC

PACKAGE/ORDERING INFORMATION

For the most current package and ordering information, see
the Package Option Addendum located at the end of this
data sheet.

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru­ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.

ESD damage can range from subtle performance degrada­tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.

XTR115, XTR116

SBOS124A

www.ti.com

3

TYPICAL PERFORMANCE CURVES

At TA = +25°C, V+ = 24V, R

= 20kΩ, and TIP29C external transistor, unless otherwise noted.

IN

CURRENT GAIN vs FREQUENCY

40

30

Gain (dB)

20

10

10k 100k

0.1

0

–0.1

–0.2

∆ Reference Voltage (%)

REFERENCE VOLTAGE vs TEMPERATURE

C

R

Frequency (Hz)

= 10nF

OUT

= 250Ω

L

C

R

OUT

= 0Ω

L

= 0

1M

260

240

220

200

Quiescent Current (µA)

180

160

QUIESCENT CURRENT vs TEMPERATURE

(V+) = 36V

(V+) = 7.5V

–75 –50 –25 0 25 50 75 100

Temperature (°C)

OVER-SCALE CURRENT vs TEMPERATURE

34

With External Transistor

33

32

V+ = 36V

31

30

Over-Scale Current (mA)

29

V+ = 24V

V+ = 7.5V

(V+) = 24V

125

–0.3

–75 –50 –25 0 25 50 75 100

Temperature (°C)

V

5.5
+125°C

VOLTAGE vs V

REG

CURRENT

REG

–55°C

5.0

+25°C

Voltage (V)

REG

V

Sinking
Current

Sourcing

Current

+25°C

4.5

–10123

Current (mA)

I

REG

–55°C

+125°C

125

28

–75 –50 –250 255075100

125

Temperature (°C)

4

4

www.ti.com

XTR115, XTR116

SBOS124A

APPLICATIONS INFORMATION

The XTR115 and XTR116 are identical devices except for
the reference voltage output, pin 1. This voltage is available
for external circuitry and is not used internally. Further
discussions that apply to both devices will refer to the
“XTR115/6.”

Figure 1 shows basic circuit connections with representative
simplified input circuitry. The XTR115/6 is a two-wire
current transmitter. Its input signal (pin 2) controls the output
current. A portion of this current flows into the V+ power
supply, pin 7. The remaining current flows in Q1. External
input circuitry connected to the XTR115/6 can be powered
from V
must be returned to I
ground” for input circuitry driving the XTR115/6.

The XTR115/6 is a current-input device with a gain of 100.
A current flowing into pin 2 produces IO = 100 • IIN. The
input voltage at the IIN pin is zero (referred to the I
A voltage input is created with an external input resistor, as
shown. Common full-scale input voltages range from 1V

REG

or V

. Current drawn from these terminals

REF

, pin 3. This I

RET

pin is a “local

RET

RET

pin).

and upward. Full-scale inputs greater than 0.5V are recom­mend to minimize the effect of offset voltage and drift of A1.

EXTERNAL TRANSISTOR

The external transistor, Q1, conducts the majority of the full­scale output current. Power dissipation in this transistor can
approach 0.8W with high loop voltage (40V) and 20mA
output current. The XTR115/6 is designed to use an external
transistor to avoid on-chip thermal-induced errors. Heat
produced by Q1 will still cause ambient temperature changes
that can affect the XTR115/6. To minimize these effects,
locate Q1 away from sensitive analog circuitry, including
XTR115/6. Mount Q1 so that heat is conducted to the
outside of the transducer housing.

The XTR115/6 is designed to use virtually any NPN transis­tor with sufficient voltage, current and power rating. Case
style and thermal mounting considerations often influence
the choice for any given application. Several possible choices
are listed in Figure 1. A MOSFET transistor will not improve
the accuracy of the XTR115/6 and is not recommended.

XTR115: 2.5V

XTR116: 4.096V

For IO = 4mA to 20mA

I

IN

With R

V

Input

Circuitry

= 40µA to 200µA

= 20kΩ

IN

= 0.8V to 4V

IN

I

REG

I

REF

R

20kΩ

V

IN

All return current

from I

REG

NOTE: (1) See also Figure 5.

IN

and I

XTR115
XTR116

V

5V

REF

REG

8

(1)

V

REF

1

I

IN

I

IN

2

3

I

RET

R

1

2.475kΩ

Voltage

Reference

A1

+5V

Regulator

R

25Ω

V+
7

B

Q

1

6

E

R

LIM

2

5

I

O

4

I

O

10nF

I = 100 • I

IN

Possible choices for Q1 (see text).

TYPE

2N4922
TIP29C
TIP31B

PACKAGE

TO-225
TO-220
TO-220

V

LOOP

R

L

FIGURE 1. Basic Circuit Connections.

XTR115, XTR116

SBOS124A

www.ti.com

5

MINIMUM-SCALE CURRENT

The quiescent current of the XTR115/6 (typically 200µA)
is the lower limit of its output current. Zero input current
(IIN = 0) will produce an IO equal to the quiescent current.
Output current will not begin to increase until IIN > IQ/100.
Current drawn from V

REF

or V

will add to this minimum

REG

output current. This means that more than 3.7mA is avail­able to power external circuitry while still allowing the
output current to go below 4mA.

OFFSETTING THE INPUT

A low scale of 4mA is produced by creating a 40µA input
current. This can be created with the proper value resistor
from V

(Figure 2), or by generating offset in the input

REF

drive circuitry.

XTR115

V

REG

V

40µA

R

62.5kΩ

0 to 160µA

2.5V

0

REF

Voltage

Reference

I

IN

A1

MAXIMUM OUTPUT CURRENT

The XTR115/6 provides accurate, linear output up to 25mA.
Internal circuitry limits the output current to approximately
32mA to protect the transmitter and loop power/measure­ment circuitry.

It is possible to extend the output current range of the
XTR115/6 by connecting an external resistor from pin 3 to
pin 5, to change the current limit value. Since all output
current must flow through internal resistors, it is possible to
damage with excessive current. Output currents greater than
45mA may cause permanent damage.

XTR115

V

REG

XTR116

V

REF

R

IN

XTR115

V

REG

XTR116

V

REF

I

IN

I

RET

XTR115

V

REG

XTR116

Digital

Control

Optical

Isolation

≈

V

O

D/A

I

O

D/A

5V

I

RET

R

1

2.475kΩ

Digital

Control

Optical

Isolation

≈

µC

PWM

Filter

Out

FIGURE 2. Creating Low-Scale Offset. FIGURE 3. Digital Control Methods.

R

IN

I

RET

6

www.ti.com

XTR115, XTR116

SBOS124A

REVERSE-VOLTAGE PROTECTION

The XTR115/6 low compliance voltage rating (7.5V) per­mits the use of various voltage protection methods without
compromising operating range. Figure 4 shows a diode
bridge circuit which allows normal operation even when the
voltage connection lines are reversed. The bridge causes a
two diode drop (approximately 1.4V) loss in loop supply
voltage. This results in a compliance voltage of approxi­mately 9V—satisfactory for most applications. A diode can
be inserted in series with the loop supply voltage and the V+
pin to protect against reverse output connection lines with
only a 0.7V loss in loop supply voltage.

OVER-VOLTAGE SURGE PROTECTION

Remote connections to current transmitters can sometimes be
subjected to voltage surges. It is prudent to limit the maximum
surge voltage applied to the XTR115/6 to as low as practical.
Various zener diode and surge clamping diodes are specially
designed for this purpose. Select a clamp diode with as low a
voltage rating as possible for best protection. For example, a
36V protection diode will assure proper transmitter operation
at normal loop voltages, yet will provide an appropriate level
of protection against voltage surges. Characterization tests on
several production lots showed no damage with loop supply
voltages up to 65V.

Most surge protection zener diodes have a diode character­istic in the forward direction that will conduct excessive
current, possibly damaging receiving-side circuitry if the
loop connections are reversed. If a surge protection diode is
used, a series diode or diode bridge should be used for
protection against reversed connections.

RADIO FREQUENCY INTERFERENCE

The long wire lengths of current loops invite radio frequency
interference. RF can be rectified by the input circuitry of the
XTR115/6 or preceding circuitry. This generally appears as
an unstable output current that varies with the position of
loop supply or input wiring.

Interference may also enter at the input terminals. For
integrated transmitter assemblies with short connection to
the sensor, the interference more likely comes from the
current loop connections.

8

V

REG

1

V

REF

R

IN

2

V

IN

3

I

I

IN

RET

XTR115
XTR116

V+

7

6

B

E

5

I

O

4

NOTE: (1) Zener Diode 36V: 1N4753A or Motorola
P6KE39A. Use lower voltage zener diodes with loop
power supply voltages less than 30V for increased
protection. See “Over-Voltage Surge Protection.”

0.01µF

Q

1

D

1

FIGURE 4. Reverse Voltage Operation and Over-Voltage Surge Protection.

(1)

1N4148

Diodes

The diode bridge causes
a 1.4V loss in loop supply
voltage.

R

L

must be

PS

V

PS

Maximum V
less than minimum
voltage rating of zener
diode.

XTR115, XTR116

SBOS124A

www.ti.com

7

8

XTR115, XTR116

SBOS124A

PACKAGE OPTION ADDENDUM

www.ti.com

22-Oct-2007

PACKAGING INFORMATION

Orderable Device Status

(1)

Package

Type

Package
Drawing

Pins Package

Qty

Eco Plan

XTR115U ACTIVE SOIC D 8 100 Green (RoHS &

no Sb/Br)

XTR115U/2K5 ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br)

XTR115U/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br)

XTR115UA ACTIVE SOIC D 8 100 Green (RoHS &

no Sb/Br)

XTR115UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br)

XTR115UA/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br)

XTR115UAE4 ACTIVE SOIC D 8 100 Green (RoHS &

no Sb/Br)

XTR115UG4 ACTIVE SOIC D 8 100 Green (RoHS &

no Sb/Br)

XTR116U ACTIVE SOIC D 8 100 Green (RoHS &

no Sb/Br)

XTR116U/2K5 ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br)

XTR116U/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br)

XTR116UA ACTIVE SOIC D 8 100 Green (RoHS &

no Sb/Br)

XTR116UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br)

XTR116UA/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br)

XTR116UAE4 ACTIVE SOIC D 8 100 Green (RoHS &

no Sb/Br)

XTR116UG4 ACTIVE SOIC D 8 100 Green (RoHS &

no Sb/Br)

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-3-260C-168 HR

CU NIPDAU Level-3-260C-168 HR

CU NIPDAU Level-3-260C-168 HR

CU NIPDAU Level-3-260C-168 HR

CU NIPDAU Level-3-260C-168 HR

CU NIPDAU Level-3-260C-168 HR

CU NIPDAU Level-3-260C-168 HR

CU NIPDAU Level-3-260C-168 HR

CU NIPDAU Level-3-260C-168 HR

CU NIPDAU Level-3-260C-168 HR

CU NIPDAU Level-3-260C-168 HR

CU NIPDAU Level-3-260C-168 HR

CU NIPDAU Level-3-260C-168 HR

CU NIPDAU Level-3-260C-168 HR

CU NIPDAU Level-3-260C-168 HR

CU NIPDAU Level-3-260C-168 HR

(3)

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.

22-Oct-2007

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

TAPE AND REEL INFORMATION

11-Mar-2008

*All dimensions are nominal

Device Package

Type

XTR115U/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

XTR115UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

XTR116U/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

XTR116UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

Package
Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

11-Mar-2008

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

XTR115U/2K5 SOIC D 8 2500 346.0 346.0 29.0

XTR115UA/2K5 SOIC D 8 2500 346.0 346.0 29.0

XTR116U/2K5 SOIC D 8 2500 346.0 346.0 29.0

XTR116UA/2K5 SOIC D 8 2500 346.0 346.0 29.0

Pack Materials-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Clocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrol
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
RFID www.ti-rfid.com Telephony www.ti.com/telephony
RF/IF and ZigBee® Solutions www.ti.com/lprf Video & Imaging www.ti.com/video

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2008, Texas Instruments Incorporated

Wireless www.ti.com/wireless