2
UCC3831
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Input Supply Currents
VHUB Supply Current No External Load on V33 1 3 mA
VFIL Supply Current 13mA
Reference
VREF Voltage Over Temperature 2.35 2.5 2.65 V
Line Regulation VHUB = 4.5V to 9V 3 10 mV
3.3V Regulator
V33 Voltage T
J = 25°C, ILOAD = 10mA 3.2 3.3 3.4 V
0mA to 100mA, 0°C to 125°C, VHUB = 4.5V to 9V 3.165 3.3 3.435 V
Short Circuit Current Limit VHUB = 6V, Output shorted to Ground 100 120 150 mA
Pre-Regulator
VREG Voltage 0A to 2A, 0°C to 125°C, VFIL = 6V to 9V 5.25 5.5 5.7 V
5V Regulator
V5A-D Voltage T
J = 25°C, ILOAD = 250mA, VREG = 5.5V 4.85 5 5.15 V
0mA to 500mA, 0°C to 125°C 4.8 5 5.2 V
Short Circuit Current Limit VREG = 5.5V, Output Shorted to Ground 500 600 750 mA
Charge Pump
Quiescent Output Voltage T
J = 25°C, VFIL = 6V, ENA-D = 5V, ENHUB = 5V 11 11.45 12 V
0°C to 125°C, VFIL = 6V 10.5 11.45 12 V
Output Impedance 915kΩ
Enable Inputs
ENA-D Inputs - Guaranteed Low 0.7 V
ENA-D Inputs - Guaranteed High 3 V
Enable Inputs (cont.)
ENHUB Input - Guaranteed Low 0.7 V
ELECTRICAL CHARACTERISTICS Unless otherwise specified, TJ = 0°C to 125°C for the UCC3831. VFIL = 6.5V, VHUB
= 5V. TA =TJ.
ABSOLUTE MAXIMUM RATINGS
VFIL............................................9V
VCON Supply Votage ..............................9V
Logic Inputs (ENA-D, ENHUB)
Maximum Forced Voltage .................–0.3V to 7V
Maximum Forced Current ......................±1mA
V33
Maximum Forced Voltage.........................5V
Maximum Current ...........................200mA
V5A-D
Maximum Voltage...............................9V
Maximum Current ...........................750mA
Storage Temperature ...................−65°C to +150°C
Junction Temperature...................–55°C to +150°C
Lead Temperature (Soldering, 10 sec.).............+300°C
Unless otherwise indicated, voltages are reference to ground.
Pulsed is defined as a less than 10% duty cycle with a maximum
duration of 500
µ
S.Currents are positive into, negative out of the
specified terminal. All voltages are with respect to ground. Consult Packaging Section of Databook for thermal limitations and
considerations of packages.
CONNECTION DIAGRAM
SOIC-28 (Top View)
DWP Package
* DWP package pin 28 serves as signal ground; pins 7, 8, 9,
20, 21, 22 serve as heatsink/ground.