2
UCC3588
DIP-16, SOIC-16, TSSOP-16 (TOP VIEW)
N, J, D and PW Packages
ABSOLUTE MAXIMUM RATINGS
Supply Voltage VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15V
Gate Drive Current, 50% Duty Cycle. . . . . . . . . . . . . . . . . . 1A
Input Voltage, V
SENSE,VFB
, SS, COMMAND, COMP. . . . . 5V
Input Voltage, D0, D1, D2, D3, D4 . . . . . . . . . . . . . . . . . . . 6V
Input Current, RT, COMP . . . . . . . . . . . . . . . . . . . . . . . . . 5mA
Currents are positive into, negative out of the specified termi
-
nal. Consult Packaging Section of Databook for thermal limita
tions and considerations of packages. All voltages are
referenced to GND.
THERMAL DATA
Plastic DIP Package
Thermal Resistance Junction to Leads, θjc . . . . . . . . 45°C/W
Thermal Resistance Junction to Ambient, θja . . . . . . 90°C/W
Ceramic DIP Package
Thermal Resistance Junction to Leads, θjc . . . . . . . . 28°C/W
Thermal Resistance Junction to Ambient, θja . . . . . 120°C/W
Standard Surface Mount Package
Thermal Resistance Junction to Leads, θjc . . . . . . . . 35°C/W
Thermal Resistance Junction to Ambient, θja . . . . . 120°C/W
Note: The above numbers for ja and jc are maximums for
the limiting thermal resistance of the package in a standard
mounting configuration. The
ja numbers are meant to be
guidelines for the thermal performance of the device and
PC-board system. All of the above numbers assume no ambient airflow, see the packaging section of Unitrode Product Data
Handbook for more details.
RT16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
VCC
DRVLO
DRVHI
GND
PWRGOOD
VFB
COMP
VSENSE
ISNS
SS/ENBL
D0
D1
D2
D3
D4
CONNECTION DIAGRAMS
ELECTRICAL CHARACTERISTICS:
Unless otherwise stated, these specifications hold for TA= 0°C to 70°C. TA=TJ.
V
CC
= 12V, RT = 49k.
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Supply Current Section
Supply Current, On V
CC
= 12V, VRT= 2V 4.5 5.5 mA
UVLO Section
VCC UVLO Turn-On Threshold 10.05 10.50 10.85 V
UVLO Threshold Hysteresis 350 450 550 mV
Voltage Error Amplifier Section
Input Bias Current V
CM
= 2.0V –0.025 –0.050 µA
Open Loop Gain (Note 5) 77 dB
Output Voltage High I
COMP
= –500µA 3.5 3.6 V
Output Voltage Low I
COMP
= +500µA 0.2 0.5 V
Output Source Current V
VFB
= 2V, V
COMMAND=VCOMP
= 2.5V –400 –500 µA
Output Sink Current V
VFB
= 3V, V
COMMAND=VCOMP
= 2.5V 5 10 mA
This device is available in 16- pin surface mount, plastic
and ceramic DIP, TSSOP packages, and 20 pin surface
mount. The UCC3588 is specified for operation from 0°C
to +70°C.
DESCRIPTION (cont.)
PVCC
VCC
RT
DRVLO
DRVHI
GND
PGND
PWRGOOD
ISNS
VSENSE
N/C
D1
D2
SS/ENBL
N/C
D0
D4
D3 VFB
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
8
9
10 COMP
SOIC-20 (TOP VIEW)
DW Package