TPS8269xEVM-207
User's Guide
Literature Number: SLVU802
October 2012
Contents
0.1 Introduction .................................................................................................................. 4
0.1.1 Features ............................................................................................................. 4
0.1.2 Applications ......................................................................................................... 4
0.1.3 EVM Ordering Options ............................................................................................ 4
1 TPS8269xEVM Schematic ..................................................................................................... 5
2 Connector and Test Point Descriptions ................................................................................. 6
2.1 Input / Output Connectors: TPS8269xEVM ............................................................................. 6
2.1.1 J1 V
2.1.2 J2 S+ / S– ........................................................................................................... 6
2.1.3 J3 GND .............................................................................................................. 6
2.1.4 J4 V
2.1.5 J5 S+ / S– ........................................................................................................... 6
2.1.6 J6 GND .............................................................................................................. 6
2.2 Jumpers and Switches ..................................................................................................... 6
2.2.1 JP1 ENABLE ....................................................................................................... 6
2.2.2 JP2 MODE .......................................................................................................... 6
3 Test Configuration .............................................................................................................. 7
3.1 Hardware Setup ............................................................................................................. 7
3.2 Procedure .................................................................................................................... 7
4 TPS8269xEVM Test Data ...................................................................................................... 8
4.1 Thermal Performance ...................................................................................................... 8
4.1.1 Thermal Measurement TPS82693 , I
4.1.2 Thermal Measurement TPS82693 , I
5 TPS8269xEVM Assembly Drawings and Layout ...................................................................... 9
A Appendix .......................................................................................................................... 11
A.1 Bill of Materials ............................................................................................................. 11
A.2 Marking Information ....................................................................................................... 11
................................................................................................................. 6
IN
............................................................................................................... 6
OUT
= 400 mA ............................................................ 8
OUT
= 800 mA ............................................................ 8
OUT
2
Contents SLVU802–October 2012
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1-1. TPS8269xEVM Schematic................................................................................................. 5
3-1. Hardware Board Connection .............................................................................................. 7
4-1. VIN= 3.6 V, V
4-2. VIN= 3.6 V, V
5-1. TPS8269xEVM Component Placement.................................................................................. 9
5-2. TPS8269xEVM Top Layer ................................................................................................. 9
5-3. TPS8269xEVM Internal Layer 1......................................................................................... 10
5-4. TPS8269xEVM Internal Layer 2......................................................................................... 10
5-5. TPS8269xEVM Bottom Layer............................................................................................ 10
0-1. Ordering Information........................................................................................................ 4
A-1. TPS8269xEVM-207 Bill of Materials.................................................................................... 11
A-2. Marking Information ....................................................................................................... 11
= 2.85 V, I
OUT
= 2.85 V, I
OUT
List of Figures
= 400 mA 80-mW Power Dissipation at Room Temperature..................... 8
OUT
= 800 mA 330-mW Power Dissipation at Room Temperature.................... 8
OUT
List of Tables
SLVU802–October 2012 List of Figures
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This user’s guide describes the characteristics, operation, and use of the TPS8269xEVM-207 evaluation
module (EVM). The TPS8269xEVM-207 is a fully assembled and tested platform for evaluating the
performance of the TPS8269xSIP high-frequency, synchronous, step-down DC-DC converters optimized
for battery-powered portable applications. This document includes schematic diagrams, a printed circuit
board (PCB) layout, bill of materials, and test data. Throughout this document, the abbreviations EVM and
TPS8269xEVM and the term evaluation module are synonymous with the TPS8269xEVM-207 unless
otherwise noted.
0.1 Introduction
The TPS8269xSIP device family is a high-frequency, synchronous, step-down DC-DC converters
optimized for battery-powered portable applications. Intended for low-power applications, the
TPS8269xSIP supports up to 500mA or 800mA and all TPS8269xSIP devices allow the use of low-cost
chip inductors and capacitors. With a wide input voltage range of 2.3 V to 4.8 V, the devices support
applications powered by lithium-ion (Li-Ion) batteries with extended voltage ranges. Different fixed voltage
output versions of the TPS8269xSIP are available. These converters operate at a regulated 3-MHz
switching frequency and enter a power-save mode operation under light load currents in order to maintain
high efficiency over the entire load current range. A pulse frequency modulation (PFM) mode extends the
battery life by reducing the quiescent current to 23 μA (typ) during light load operation.
0.1.1 Features
• Input Voltage Range: 2.3 V up to 4.8 V
• Fixed Output Voltages
• Up to 800-mA Output Current
• Sub 1-mm Profile Solution
• 3-MHz Regulated Frequency Operation
• Current Overload and Thermal Shutdown (Optional)
• Total Solution Size: < 6.7 mm
• Low Ripple Light-Load PFM Mode
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2
0.1.2 Applications
• LDO Replacement
• Cell Phones, Smart-Phones
• PoL Applications
0.1.3 EVM Ordering Options
Table 0-1 provides the ordering information for the various EVM options.
Table 0-1. Ordering Information
Orderable EVM Number Device Part Number Output Voltage Maximum Output Current
TPS82693EVM-207 TPS82693 2.85 V 800 mA
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4
List of Tables SLVU802–October 2012
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1
3
2
1
3
1
1 1 1
S-
S+
MODE
PWM
OFF
ENABLE
1
GND
S-
GND
PSM
ON
2
1
S+
VOUT
See BOM for IC usage
Not Installed
VIN
2.3V to 4.8V
Refer to device datasheet
for Output Voltage
1
1
1
1
J3
J1
1
JP2
J6
J4
J2
+
C1
R1
C3
C4
FB2
C7
C6
R2
J5
FB1
A2
VIN
VIN
B1
MODE
B2
EN
C1
GND
C2
GND
C3
GND
A1
VOUT
U1
TPS8269xSIP
1
JP1
C2 C5
C8
J8
VIN
VIN
VIN
VIN
VOUT
VOUT
A3
J7
Figure 1-1 illustrates the TPS8269xEVM-207 schematic.
Chapter 1
SLVU802–October 2012
TPS8269xEVM Schematic
NOTE: For reference only; see Table A-1 for specific values.
SLVU802–October 2012 TPS8269xEVM Schematic
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Figure 1-1. TPS8269xEVM Schematic
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Connector and Test Point Descriptions
2.1 Input / Output Connectors: TPS8269xEVM
Chapter 2
SLVU802–October 2012
2.1.1 J1 V
IN
This header is the positive connection to the input power supply. The power supply must be connected
between J1 and J3 (GND). The leads to the input supply should be twisted and kept as short as possible.
The input voltage must be between 2.3 V and 4.8 V.
2.1.2 J2 S+ / S–
J2 S+ / S– are the sense connection for the input of the converter. Connect a voltmeter, sense connection
of a power supply, or oscilloscope to this header.
2.1.3 J3 GND
This header is the return connection to the input power supply. Connect the power supply between J3 and
J1 (VIN). The leads to the input supply should be twisted and kept as short as possible. The input voltage
must be between 2.3 V and 4.8 V.
Capacitor C1 compensates for parasitic inductance as a result of the wires from the DC power supply to
the EVM. It is not required in an actual application circuit.
2.1.4 J4 V
OUT
This header is the positive output of the step-down converter. The TPS8269x has fixed output voltages;
refer to the specific device data sheet for detailed information on the device output voltage.
2.1.5 J5 S+ / S–
J5 S+ / S– are the sense connection for the output of the converter. Connect a voltmeter, sense
connection of an electronic load, or oscilloscope to this header.
2.1.6 J6 GND
J6 is the return connection of the converter. A load can be connected between J6 and J4 (V
2.2 Jumpers and Switches
2.2.1 JP1 ENABLE
This jumper can enable or disable the converter on the EVM. Placing a shorting bar between ENABLE
and ON turns on the converter. Placing a shorting bar between ENABLE and OFF disables the converter.
2.2.2 JP2 MODE
This jumper can enable or disable the power-saving mode (PSM) under light loads. Placing a shorting bar
between MODE and pulse width modulation (PWM) disables the PSM. If the PSM is disabled, the
converter operates in forced PWM mode over the entire load current range.
Placing a shorting bar between MODE and PSM enables the power-saving mode. The device operates in
power-saving mode under light load conditions. See the specific device data sheet for detailed information.
6
Connector and Test Point Descriptions SLVU802–October 2012
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).
OUT
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J1
J4
J2
J5
J3
J6
JP2
PWM
MODE
PSM
JP1
ONENOFF
GND
VIN
VOUT
GND
S-
+
S+
S+
-
S-
TPS82693EVM-207
DC
Power Supply
Load
Oscilloscope
J7
-
+
3.1 Hardware Setup
Figure 3-1 illustrates a typical hardware test configuration.
Chapter 3
SLVU802–October 2012
Test Configuration
Figure 3-1. Hardware Board Connection
3.2 Procedure
Follow these procedures when configuring the EVM for testing.
CAUTION
Many of the components on the TPS8269xEVM-207 are susceptible to damage
by electrostatic discharge (ESD). Customers are advised to observe proper
ESD handling precautions when unpacking and handling the EVM, including
the use of a grounded wrist strap, bootstraps, or mats at an approved ESD
workstation. An electrostatic smock and safety glasses should also be worn.
• Work at an ESD workstation. Make sure that any wrist straps, bootstraps, or mats are connected and
reference the user to earth ground before power is applied to the EVM. Electrostatic smocks and
safety glasses should also be worn.
• Connect a DC power supply between J1 and J3 on the TPS8269xEVM. Note that the input voltage
should range from 2.3 V to 4.8 V. Keep the wires from the input power supply to EVM as short as
possible and twisted.
• Connect a DC voltmeter or oscilloscope to the output sense connection of the EVM.
• A load can be connected between J4 and J6 on the TPS8269xEVM.
• To enable the converter, connect the shorting bar on JP1 between ENABLE and ON on the
TPS8269xEVM.
• The TPS8269xEVM has a feature that allows users to switch between PSM under light loads and
forced PWM mode, with jumper JP2.
SLVU802–October 2012 Test Configuration
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T = 38°C
PWB
T = 53 C
inductor
°
T = 39 C
capacitor
°
T = 41 C
capacitor
°
T = 27°C
PWB
T = 33 C
inductor
°
T = 30 C
capacitor
°
T = 30 C
capacitor
°
This section presents typical performance data for the TPS8269xEVM. Actual performance data can be
affected by measurement techniques and environmental variables; therefore, these results are presented
for reference and may differ from actual results obtained by some users.
4.1 Thermal Performance
Figure 4-1 and Figure 4-2 show the typical thermal performance for the TPS82693 for two load scenarios,
respectively.
Chapter 4
SLVU802–October 2012
TPS8269xEVM Test Data
4.1.1 Thermal Measurement TPS82693 , I
Figure 4-1. VIN= 3.6 V, V
80-mW Power Dissipation at Room Temperature
4.1.2 Thermal Measurement TPS82693 , I
= 400 mA
OUT
= 800 mA
OUT
= 2.85 V, I
OUT
= 400 mA
OUT
8
Figure 4-2. VIN= 3.6 V, V
= 2.85 V, I
OUT
= 800 mA
OUT
330-mW Power Dissipation at Room Temperature
TPS8269xEVM Test Data SLVU802–October 2012
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Chapter 5
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TPS8269xEVM Assembly Drawings and Layout
Figure 5-1 through Figure 5-5 show the design of the show the design of the TPS8269xEVM-207 printed
circuit boards. The EVM was designed using a four-layer, 1-ounce copper-clad PCB with all components
in an active area on the top side of the board. Moving components to both sides of the PCB or using
additional internal layers can offer additional size reduction for space-constrained systems.
NOTE: Board layouts are not to scale. These figures are intended to show how the board is laid out;
they are not intended to be used for manufacturing TPS8269xEVM-207 PCBs.
Figure 5-1. TPS8269xEVM Component Placement
Figure 5-2. TPS8269xEVM Top Layer
SLVU802–October 2012 TPS8269xEVM Assembly Drawings and Layout
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Figure 5-3. TPS8269xEVM Internal Layer 1
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Figure 5-4. TPS8269xEVM Internal Layer 2
Figure 5-5. TPS8269xEVM Bottom Layer
10
TPS8269xEVM Assembly Drawings and Layout SLVU802–October 2012
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A.1 Bill of Materials
Table A-1 lists the bill of materials for the TPS8269xEVM.
EVM Device
Option: Count
-001 -002
0 0 C1 150 μF Capacitor, Tantalum,6.3 V, 25 mΩ, 20% 3528(B) T520B157M006ATE025 Kemet
1 1 C5, C6, C7, Open Capacitor, Ceramic 0603 Std Std
6 6 PEC02SAAN Header, Male 2-pin, 100 mil spacing 0.10 in x 2 PEC02SAAN Sullins
0 0 J7, J8 Open Connector, SMA , Straight, PC mount 901-144-8RFX AMP
2 2 JP1,JP2 PEC03SAAN Header, Male 3-pin, 100 mil spacing 0.10 in x 3 PEC03SAAN Sullins
0 1 U1 TPS82693SIP SIP-8 TPS82693 TI
RefDes Value Description Size Part Number Mfr
C2, C3, C4,
J1, J2, J3,
J4, J5, J6
Appendix A
SLVU802–October 2012
Appendix
Table A-1. TPS8269xEVM-207 Bill of Materials
C8
2
0.210 in
IC, 800-mA, High-Freq μModule
Step-Down Converter
A.2 Marking Information
Table A-2 provides the marking information for this EVM.
Assembly Number Marking Text
PWR207-002 TPS82693EVM-207
Table A-2. Marking Information
SLVU802–October 2012 Appendix
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