Power-On Reset Generator with Fixed
Delay Time of 200 ms, no External
Capacitor Needed
D
Precision Supply Voltage Monitor 2.5 V, 3 V,
3.3 V, and 5 V
D
Pin-For-Pin Compatible with the MAX705
through MAX708 Series
D
Integrated Watchdog Timer (TPS3705 only)
D
Voltage Monitor for Power-Fail or
Low-Battery Warning
D
Maximum Supply Current of 50 µA
D
MSOP-8 and SO-8 Packages
D
T emperature Range...–40°C to 85°C
typical applications
D
Designs Using DSPs, Microcontrollers or
Microprocessors
D
Industrial Equipment
D
Programmable Controls
D
Automotive Systems
D
Portable/Battery Powered Equipment
D
Intelligent Instruments
D
Wireless Communication Systems
D
Notebook/Desktop Computers
TPS3705 ...D PACKAGE
(TOP VIEW)
MR
1
V
GND
V
GND
NC – No internal connection
TPS3705 . . . DGN PACKAGE
RESET
WDO
V
TPS3707 . . . DGN PACKAGE
RESET
RESET
5 V12 V
V
2
DD
3
4
PFI
TPS3707 ...D PACKAGE
(TOP VIEW)
MR
1
2
DD
3
4
PFI
(TOP VIEW)
1
2
MR
3
4
DD
(TOP VIEW)
1
2
MR
3
4
DD
8
7
6
5
8
7
6
5
8
7
6
5
8
7
6
5
WDO
RESET
WDI
PFO
RESET
RESET
NC
PFO
WDI
PFO
PFI
GND
NC
PFO
PFI
GND
V
DD
PFO
910 kΩ
120 kΩ
TPS3705–50
MRRESET
PFI
GND
100 nF
WDO
WDI
Figure 1. Typical MSP430 Application
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
The TPS3705, TPS3707 family of microprocessor supply-voltage supervisors provide circuit initialization and
timing supervision, primarily for DSP and processor-based systems.
During power-on, RESET
supply voltage supervisor monitors V
voltage V
. An internal timer delays the return of the output to the inactive state (high) to ensure proper system
IT+
reset. The delay time, t
voltage drops below the threshold voltage V
is asserted when the supply voltage V
and keeps RESET active as long as VDD remains below the threshold
DD
= 200 ms, starts after V
d typ
IT–
has risen above the threshold voltage V
DD
, the output becomes active (low) again. No external components
are required. All the devices of this family have a fixed-sense threshold voltage V
becomes higher than 1.1 V . Thereafter , the
DD
. When the supply
IT+
set by an internal voltage
IT–
divider.
The TPS3705-xx and TPS3707-xx devices incorporate a manual reset input, MR
RESET
to become active.
. A low level at MR causes
The TPS370x-xx families integrate a power-fail comparator which can be used for low-battery detection,
power-fail warning, or for monitoring a power supply other than the main supply.
The TPS3705-xx devices have a watchdog timer that is periodically triggered by a positive or negative transition
at WDI. When the supervising system fails to retrigger the watchdog circuit within the time-out interval,
t
= 1.6 s, WDO becomes active. This event also reinitializes the watchdog timer. Leaving WDI unconnected
t(out)
disables the watchdog.
The TPS3707-xx devices do not have the Watchdog function, but include a high-level output RESET.
The product spectrum is designed for supply voltages of 2.5 V , 3 V, 3.3 V, and 5 V . The circuits are available in
either 8-pin MSOP or standard SOIC packages. The TPS3705, TPS3707 devices are characterized for
operation over a temperature range of –40°C to 85°C.
These chips, when properly assembled, display characteristics similar to those of the TPS370x. Thermal
compression or ultrasonic bonding may be caused on the doped-aluminum bonding pads. The chips may be
mounted with conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
46
(1)
(2)
(3)
(4)
CHIP THICKNESS: 10 MILS TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJ max = 150°C
TOLERANCES ARE ±10%
ALL DIMENSIONS ARE IN MILS
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values are with respect to GND. For reliable operation the device must not be operated at 7 V for more than t = 1000h
continuously.
PACKAGE
DGN
D
TA <25°C
POWER RATING
2.14 W
725 mW
DISSIPATION RATING TABLE
DERATING FACTOR
ABOVE TA = 25°C
17.1 mW/_C
5.8 mW/_C
TA = 70°C
POWER RATING
1.37 W
464 mW
TA = 85°C
POWER RATING
1.11 W
377 mW
recommended operating conditions at specified temperature range
MINMAXUNIT
Supply voltage, V
Input voltage, V
High-level input voltage, V
Low-level input voltage, V
Input transition rise and fall rate at MR or WDI, ∆t/∆V100ns/V
Operating free-air temperature range, T
DD
I
IH
IL
A
26V
0VDD+0.3V
0.7×V
DD
0.3×V
DD
–4085
V
V
_
C
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
V
V
I
OH
500 µA
DD
VOLLow-level out ut voltage
0.4
T
0°C to 85°C
V
Negativegoinginut
T
40°C to 85°C
V
V
y
WDI
IIHHigh-level input current
A
IILLow-level input current
A
IDDSupply current
TPS3705-30, TPS3705-33, TPS3705-50
TPS3707-25, TPS3707-30, TPS3707-33, TPS3707-50
PROCESSOR SUPERVISORY CIRCUITS WITH POWER-FAIL
SLVS184B – NOVEMBER 1998 – REVISED JANUAR Y 1999
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-012
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions include mold flash or protrusions.
D. The package thermal performance may be enhanced by attaching an external heat sink to the thermal pad. This pad is electrically
and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-187
PowerPAD is a trademark of Texas Instruments Incorporated.
4073271/A 01/98
12
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. T esting and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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