Texas Instruments TPS2041B, TPS2041B-EP User Manual

1

2

3

5

4

IN

EN

OC

GNDGND

OUT

DBV PACKAGE

(TOP VIEW)

TPS2041B-EP

www.ti.com

CURRENT-LIMITED POWER-DISTRIBUTION SWITCH

Check for Samples: TPS2041B-EP

1

FEATURES

• 70-mΩ High-Side MOSFET • Heavy Capacitive Loads

• 500-mA Continuous Current • Short-Circuit Protection

• Thermal and Short-Circuit Protection

• Current Limit:

0.45 A (Min), 1.55 A (Max)

• Operating Range: 2.7 V to 5.5 V

• 0.6-ms Typical Rise Time

• Undervoltage Lockout

• Deglitched Fault Report (OC)

• No OC Glitch During Power Up

• Maximum Standby Supply Current: 1 μA

• Bidirectional Switch

• ESD Protection Level Per AEC-Q100

Classification

• UL Recognized, File Number E169910

APPLICATIONS

SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS

• Controlled Baseline

• One Assembly/Test Site

• One Fabrication Site

• Available in Military (–55°C/125°C)

Temperature Range

• Extended Product Life Cycle

• Extended Product-Change Notification

• Product Traceability

SLVSAX8 – SEPTEMBER 2011

DESCRIPTION

The TPS2041B power-distribution switch is intended for applications where heavy capacitive loads and short
circuits are likely to be encountered. This device incorporates 70-mΩ N-channel MOSFET power switches for
power-distribution systems that require multiple power switches in a single package. Each switch is controlled by
a logic enable input. Gate drive is provided by an internal charge pump designed to control the power-switch rise
times and fall times to minimize current surges during switching. The charge pump requires no external
components and allows operation from supplies as low as 2.7 V.

When the output load exceeds the current-limit threshold or a short is present, the device limits the output current
to a safe level by switching into a constant-current mode, pulling the overcurrent (OC) logic output low. When
continuous heavy overloads and short circuits increase the power dissipation in the switch, causing the junction
temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal
shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures that the switch remains
off until valid input voltage is present. This power-distribution switch is designed to set current limit at 1 A (typ).

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Copyright © 2011, Texas Instruments Incorporated

80 mΩ, single

TPS2041B-EP

SLVSAX8 – SEPTEMBER 2011

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION

T

J

–55°C to V62/11620-

125°C 01XE

ENABLE PACKAGE

Active low Single SOT-23 – DBV TPS2041BMDBVTEP PXAM

NO. OF ORDERABLE TOP-SIDE

SWITCHES PART NUMBER MARKING

(2)

(1)

VID NUMBER

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

Figure 1. TPS2041B Switch at 500 mA

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted

V

I(IN)

V

O(OUT)

V

I(EN)

V

I(OC)

I

O(OUT)

θ

JC

T

J

T

stg

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages are with respect to GND.

Input voltage range (IN)
Output voltage range (OUT)
Input voltage range (EN) –0.3 V to 6 V
Voltage range (OC) –0.3 V to 6 V
Continuous output current Internally limited
Continuous power dissipation at 125°C 182 mW
Thermal resistance, junction-to-case 55°C/W
Operating virtual-junction temperature range –55°C to 135°C
Storage temperature range –65°C to 150°C
Lead temperature, soldering 1,6 mm (1/16 in) from case for 10 s 260°C

Electrostatic discharge (ESD) protection Machine Model (MM) (M0) 50 V

(1)

(2)

(2)

–0.3 V to 6 V
–0.3 V to 6 V

Human-Body Model (HBM) (H2) 2500 V

Charged-Device Model (CDM) (C5) 1500 V

RECOMMENDED OPERATING CONDITIONS

MIN MAX UNIT

V

I(IN)

V

I(EN)

I

O(OUT)

T

J

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Input voltage (IN) 2.7 5.5 V
Input voltage (EN) 0 5.5 V
Continuous output current (OUT) 0 500 mA
Operating virtual-junction temperature –55 125 °C

Product Folder Link(s): TPS2041B-EP

TPS2041B-EP

www.ti.com

SLVSAX8 – SEPTEMBER 2011

ELECTRICAL CHARACTERISTICS

over recommended operating junction temperature range, V

PARAMETER TEST CONDITIONS

Power Switch

Static drain-source on-state
resistance, 5-V or 3.3-V V

DS(on)

operation

r

Static drain-source on-state
resistance, 2.7-V operation

t

t

r

f

Rise time, output

Fall time, output

Enable Input (EN)

V
V
I
t
t

High-level input voltage 2.7 V ≤ V

IH

Low-level input voltage 2.7 V ≤ V

IL

Input current V

I

Turn-on time CL= 100 μF, RL= 10 Ω 3 ms

on

Turn-off time CL= 100 μF, RL= 10 Ω 6 ms

off

Current Limit

I

Short-circuit output current A

OS

Supply Current

Supply current, low-level output μA

Supply current, high-level output μA

Leakage current –55°C ≤ TJ≤ 125°C 1 μA
Reverse leakage current V

Undervoltage Lockout

Low-level input voltage, IN 2 2.5 V
Hysteresis, IN TJ= 25°C 75 mV

Overcurrent (OC)

Output low voltage, V

OL(/OC)

Off-state current V
OC deglitch OC assertion or deassertion 3 8 16 ms

Thermal Shutdown

(2)

Thermal shutdown threshold 135 °C
Recovery from thermal shutdown 125 °C
Hysteresis 10 °C

(1) Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be accounted for separately.
(2) The thermal shutdown only reacts under overcurrent conditions.

= 5 V or 3.3 V, IO= 0.5 A –55°C ≤ TJ≤ 125°C 70 135

I(IN)

V

= 2.7 V, IO= 0.5 A –55°C ≤ TJ≤ 125°C 75 150

I(IN)

V

= 5.5 V 0.6

I(IN)

V

= 2.7 V 0.4

I(IN)

V

= 5.5 V 0.2

I(IN)

V

= 2.7 V 0.2

I(IN)

≤ 5.5 V 2 V

I(IN)

≤ 5.5 V 0.8 V

I(IN)

= 0 V or 5.5 V –1 1 μA

I(EN)

V

= 5 V, OUT connected to GND,

I(IN)

device enabled into short-circuit

No load on OUT,
V

= 5.5 V or V

I(EN)

I(EN)

No load on OUT,
V

= 0 V or V

I(EN)

I(EN)

OUT connected to ground,
V

= 5.5 V or V

I(EN)

= 5.5 V, IN = ground TJ= 25°C 0 μA

I(OUT)

I

= 5 mA 0.4 V

O(OC)

= 5 V or 3.3 V 1 μA

O(OC)

I(EN)

= 5.5 V, IO= 0.5 A, V

I(IN)

CL= 1 μF,
RL= 10 Ω

= 0 V

= 5.5 V

= 0 V

= 0 V (unless otherwise noted)

I(EN)

(1)

MIN TYP MAX UNIT

TJ= 25°C ms

TJ= 25°C 0.65 1 1.3
–55°C ≤ TJ≤ 125°C 0.45 1 1.55

TJ= 25°C 0.5 1
–55°C ≤ TJ≤ 125°C 0.5 5
TJ= 25°C 43 60
–55°C ≤ TJ≤ 125°C 43 70

mΩ

Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback 3

Product Folder Link(s): TPS2041B-EP

OUT

OC

IN

EN

GND

Current

Limit

Driver

UVLO

Charge

Pump

CS

Thermal

Sense

Deglitch

(See Note A)

TPS2041B-EP

SLVSAX8 – SEPTEMBER 2011

DEVICE INFORMATION

Terminal Functions

TERMINAL

NAME NO.

EN 4 I Enable input, logic low turns on power switch
GND 2 Ground
IN 5 I Input voltage
OC 3 O Overcurrent, open-drain output, active low
OUT 1 O Power-switch output

I/O DESCRIPTION

Functional Block Diagram

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A. CS = Current sense

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Product Folder Link(s): TPS2041B-EP

R

L

C

L

OUT

t

r

t

f

90%

90%

10%

10%

50%

50%

90%

10%

V

O(OUT)

V

I(EN)

V

O(OUT)

VOLTAGE WAVEFORMS

TEST CIRCUIT

t

on

t

off

50%

50%

90%

10%

V

I(EN)

V

O(OUT)

t

on

t

off

V

I(EN

)

V

I(EN)

5 V/div

V

O(OUT)

2 V/div

RL = 10 W,
CL = 1 mF
TA = 255C

t − Time − 500 ms/div

V

I(EN

)

V

I(EN)

5 V/div

V

O(OUT)

2 V/div

RL = 10 W,
CL = 1 mF
TA = 255C

t − Time − 500 ms/div

TPS2041B-EP

www.ti.com

SLVSAX8 – SEPTEMBER 2011

PARAMETER MEASUREMENT INFORMATION

Figure 2. Test Circuit and Voltage Waveforms

Figure 3. Turn-On Delay and Rise Time With 1-μF Figure 4. Turn-Off Delay and Fall Time With 1-μF

Load Load

Product Folder Link(s): TPS2041B-EP

Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback 5

V

I(EN

)

V

I(EN)

5 V/div

V

O(OUT)

2 V/div

RL = 10 W,
CL = 100 mF
TA = 255C

t − Time − 500 ms/div

V

O(OUT)

2 V/div

V

I(EN

)

V

I(EN)

5 V/div

RL = 10 W,
CL = 100 mF
TA = 255C

t − Time − 500 ms/div

220 mF

470 mF

100 mF

VI = 5 V ,
RL = 10 W,
TA = 255C

V

I(EN

)

V

I(EN)

5 V/div

I

O(OUT)

500 mA/div

t − Time − 500 ms/div

V

I(EN

)

V

I(EN)

5 V/div

I

O(OUT)

500 mA/div

t − Time − 500 ms/div

TPS2041B-EP

SLVSAX8 – SEPTEMBER 2011

PARAMETER MEASUREMENT INFORMATION (continued)

Figure 5. Turn-On Delay and Rise Time With Figure 6. Turn-Off Delay and Fall Time With 100-μF

100-μF Load Load

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Figure 7. Short-Circuit Current, Figure 8. Inrush Current With Different

Device Enabled Into Short Load Capacitance

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Product Folder Link(s): TPS2041B-EP

V

O(OC

)

2 V/div

I

O(OUT)

500 mA/div

t − Time − 2 ms/div

V

O(OC

)

2 V/div

I

O(OUT)

500 mA/div

t − Time − 2 ms/div

TPS2041B-EP

www.ti.com

SLVSAX8 – SEPTEMBER 2011

PARAMETER MEASUREMENT INFORMATION (continued)

Figure 9. 3-Ω Load Connected to Enabled Device Figure 10. 2-Ω Load Connected to Enabled Device

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Product Folder Link(s): TPS2041B-EP

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

2 3 4 5 6

Turnon Time − ms

VI − Input Voltage − V

CL = 100 mF,
RL = 10 W,
TA = 255C

2.8

2.9

3

3.1

3.2

3.3

2 3 4 5 6

Turnoff Time − ms

VI − Input Voltage − V

CL = 100 mF,
RL = 10 W,
TA = 255C

0

0.1

0.2

0.3

0.4

0.5

0.6

2 3 4 5 6

Rise Time − ms

VI − Input Voltage − V

CL = 1 mF,
RL = 10 W,
TA = 255C

0

0.05

0.1

0.15

0.2

0.25

2 3 4 5 6

CL = 1 mF,
RL = 10 W,
TA = 255C

Fall Time − ms

VI − Input Voltage − V

TPS2041B-EP

SLVSAX8 – SEPTEMBER 2011

www.ti.com

TYPICAL CHARACTERISTICS

TURN-ON TIME TURN-OFF TIME

vs vs

INPUT VOLTAGE INPUT VOLTAGE

Figure 11. Figure 12.

RISE TIME FALL TIME

vs vs

INPUT VOLTAGE INPUT VOLTAGE

Figure 13. Figure 14.

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Product Folder Link(s): TPS2041B-EP