Independent Thermal and Short-Circuit
Protection With Overcurrent Logic Output
D
Operating Range . . . 2.7 V to 5.5 V
D
CMOS- and TTL-Compatible Enable Inputs
D
2.5-ms Typical Rise Time
D
Undervoltage Lockout
D
10 µA Maximum Standby Supply Current
for Single and Dual (20 µA for Triple and
Quad)
D
Bidirectional Switch
D
Ambient Temperature Range, 0°C to 85°C
D
ESD Protection
D
UL Listed – File No. E169910
description
The TPS2041A through TPS2044A and
TPS2051A through TPS2054A power-distribution
switches are intended for applications where
TPS2041A, TPS2051A
D PACKAGE
(TOP VIEW)
GND
GNDA
GNDB
†
NC – No connect
1
IN
2
3
IN
†
4
EN
TPS2043A, TPS2053A
D PACKAGE
(TOP VIEW)
1
IN1
2
†
EN1
EN2
EN3
All enable inputs are active high for the TPS205xA series.
IN2
NC
3
†
4
5
6
†
7
8
OUT
8
OUT
7
6
OUT
5
OC
OC1
16
OUT1
15
OUT2
14
OC2
13
OC3
12
OUT3
11
10
NC
9
NC
TPS2042A, TPS2052A
D PACKAGE
(TOP VIEW)
GND
EN1
EN2
GNDA
EN1
EN2
GNDB
EN3
EN4
1
IN
2
†
3
†
4
TPS2044A, TPS2054A
D PACKAGE
(TOP VIEW)
1
IN1
2
†
3
†
4
5
IN2
6
†
7
†
8
heavy capacitive loads and short circuits are likely to be encountered. These devices incorporate 80-mΩ
N-channel MOSFET high-side power switches for power-distribution systems that require multiple power
switches in a single package. Each switch is controlled by an independent logic enable input. Gate drive is
provided by an internal charge pump designed to control the power-switch rise times and fall times to minimize
current surges during switching. The charge pump requires no external components and allows operation from
supplies as low as 2.7 V.
16
15
14
13
12
10
OC1
8
OUT1
7
OUT2
6
5
OC2
OC1
OUT1
OUT2
OC2
OC3
OUT3
11
OUT4
9
OC4
When the output load exceeds the current-limit threshold or a short is present, these devices limit the output
current to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx
) logic output low.
When continuous heavy overloads and short circuits increase the power dissipation in the switch, causing the
junction temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from
a thermal shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures the switch
remains off until valid input voltage is present. These power-distribution switches are designed to current limit
at0.9 A.
GENERAL SWITCH CATALOG
33 mΩ, single
80 mΩ, single
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
TPS201xA
TPS202x
TPS203x
TPS2014
TPS2015
TPS2041
TPS2051
TPS2045
TPS2055
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EN4–IEnable input. Logic low turns on power switch.
EN–4IEnable input. Logic high turns on power switch.
GND11IGround
IN2, 32, 3IInput voltage
OC55OOvercurrent. Logic output active low
OUT6, 7, 86, 7, 8OPower-switch output
TPS2042A and TPS2052A
TERMINAL
NO.
TPS2042ATPS2052A
EN13–IEnable input. Logic low turns on power switch, IN-OUT1.
EN24–IEnable input. Logic low turns on power switch, IN-OUT2.
EN1–3IEnable input. Logic high turns on power switch, IN-OUT1.
EN2–4IEnable input. Logic high turns on power switch, IN-OUT2.
GND11IGround
IN22IInput voltage
OC188OOvercurrent. Logic output active low, for power switch, IN-OUT1
OC255OOvercurrent. Logic output active low, for power switch, IN-OUT2
OUT177OPower-switch output
OUT266OPower-switch output
EN13–IEnable input, logic low turns on power switch, IN1-OUT1.
EN24–IEnable input, logic low turns on power switch, IN1-OUT2.
EN37–IEnable input, logic low turns on power switch, IN2-OUT3.
EN1–3IEnable input, logic high turns on power switch, IN1-OUT1.
EN2–4IEnable input, logic high turns on power switch, IN1-OUT2.
EN3–7IEnable input, logic high turns on power switch, IN2-OUT3.
GNDA11Ground for IN1 switch and circuitry.
GNDB55Ground for IN2 switch and circuitry.
IN122IInput voltage
IN266IInput voltage
NC8, 9, 108, 9, 10No connection
OC11616OOvercurrent, logic output active low, IN1-OUT1
OC21313OOvercurrent, logic output active low, IN1-OUT2
OC31212OOvercurrent, logic output active low, IN2-OUT3
OUT11515OPower-switch output, IN1-OUT1
OUT21414OPower-switch output, IN1-OUT2
OUT31111OPower-switch output, IN2-OUT3
I/ODESCRIPTION
SLVS247 – SEPTEMBER 2000
TPS2044A and TPS2054A
TERMINAL
NO.
TPS2044ATPS2054A
EN13–IEnable input. logic low turns on power switch, IN1-OUT1.
EN24–IEnable input. Logic low turns on power switch, IN1-OUT2.
EN37–IEnable input. Logic low turns on power switch, IN2-OUT3.
EN48–IEnable input. Logic low turns on power switch, IN2-OUT4.
EN1–3IEnable input. Logic high turns on power switch, IN1-OUT1.
EN2–4IEnable input. Logic high turns on power switch, IN1-OUT2.
EN3–7IEnable input. Logic high turns on power switch, IN2-OUT3.
EN4–8IEnable input. Logic high turns on power switch, IN2-OUT4.
GNDA11Ground for IN1 switch and circuitry.
GNDB55Ground for IN2 switch and circuitry.
IN122IInput voltage
IN266IInput voltage
OC11616OOvercurrent. Logic output active low, IN1-OUT1
OC21313OOvercurrent. Logic output active low, IN1-OUT2
OC31212OOvercurrent. Logic output active low, IN2-OUT3
OC499OOvercurrent. Logic output active low, IN2-OUT4
OUT11515OPower-switch output, IN1-OUT1
OUT21414OPower-switch output, IN1-OUT2
OUT31111OPower-switch output, IN2-OUT3
OUT41010OPower-switch output, IN2-OUT4
The power switch is an N-channel MOSFET with a maximum on-state resistance of 135 mΩ (V
Configured as a high-side switch, the power switch prevents current flow from OUT to IN and IN to OUT when
disabled. The power switch supplies a minimum of 500 mA per switch.
charge pump
An internal charge pump supplies power to the driver circuit and provides the necessary voltage to pull the gate
of the MOSFET above the source. The charge pump operates from input voltages as low as 2.7 V and requires
very little supply current.
driver
The driver controls the gate voltage of the power switch. T o limit large current surges and reduce the associated
electromagnetic interference (EMI) produced, the driver incorporates circuitry that controls the rise times and
fall times of the output voltage. The rise and fall times are typically in the 2-ms to 4-ms range.
enable (ENx
The logic enable disables the power switch and the bias for the charge pump, driver, and other circuitry to reduce
the supply current. The supply current is reduced to less than 10 µA on the single and dual devices (20 µA on
the triple and quad devices) when a logic high is present on ENx
(TPS205xA†). A logic zero input on ENx or a logic high on ENx restores bias to the drive and control circuits
and turns the power on. The enable input is compatible with both TTL and CMOS logic levels.
overcurrent (OCx)
The OCx
encountered. The output will remain asserted until the overcurrent or overtemperature condition is removed.
, ENx)
(TPS204xA†) or a logic low is present on ENx
open-drain output is asserted (active low) when an overcurrent or overtemperature condition is
I(IN)
= 5 V).
current sense
A sense FET monitors the current supplied to the load. The sense FET measures current more efficiently than
conventional resistance methods. When an overload or short circuit is encountered, the current-sense circuitry
sends a control signal to the driver. The driver in turn reduces the gate voltage and drives the power FET into
its saturation region, which switches the output into a constant-current mode and holds the current constant
while varying the voltage on the load.
thermal sense
The TPS204xA and TPS205xA implement a dual-threshold thermal trip to allow fully independent operation of
the power distribution switches. In an overcurrent or short-circuit condition the junction temperature rises. When
the die temperature rises to approximately 140°C, the internal thermal sense circuitry checks to determine which
power switch is in an overcurrent condition and turns off that switch, thus isolating the fault without interrupting
operation of the adjacent power switch. Hysteresis is built into the thermal sense, and after the device has cooled
approximately 20 degrees, the switch turns back on. The switch continues to cycle off and on until the fault is
removed. The (OCx
undervoltage lockout
A voltage sense circuit monitors the input voltage. When the input voltage is below approximately 2 V , a control
signal turns off the power switch.
Product series designations TPS204x and TPS205x refer to devices presented in this data sheet and not necessarily to other TI devices
numbered in this sequence.
) open-drain output is asserted (active low) when overtemperature or overcurrent occurs.
Operating virtual junction temperature range, T
Storage temperature range, T
Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds260°C. . . . . . . . . . . . . . . . . . . . . . .
Electrostatic discharge (ESD) protection: Human body model MIL-STD-883C 2 kV. . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Figure 24. T ypical Application (Example, TPS2041A)
power-supply considerations
A 0.01-µF to 0.1-µF ceramic bypass capacitor between INx and GND, close to the device, is recommended.
Placing a high-value electrolytic capacitor on the output pin(s) is recommended when the output load is heavy .
This precaution reduces power-supply transients that may cause ringing on the input. Additionally , bypassing
the output with a 0.01-µF to 0.1-µF ceramic capacitor improves the immunity of the device to short-circuit
transients.
overcurrent
A sense FET is employed to check for overcurrent conditions. Unlike current-sense resistors, sense FETs do
not increase the series resistance of the current path. When an overcurrent condition is detected, the device
maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs
only if the fault is present long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted before the
device is enabled or before V
has been applied (see Figure 6). The TPS204xA and TPS205xA sense the
I(IN)
short and immediately switch into a constant-current output.
In the second condition, a short or an overload occurs while the device is enabled. At the instant the overload
occurs, very high currents may flow for a short time before the current-limit circuit can react. After the
current-limit circuit has tripped (reached the overcurrent trip threshhold) the device switches into
constant-current mode.
In the third condition, the load has been gradually increased beyond the recommended operating current. The
current is permitted to rise until the current-limit threshold is reached or until the thermal limit of the device is
exceeded (see Figure 7). The TPS204xA and TPS205xA are capable of delivering current up to the current-limit
threshold without damaging the device. Once the threshold has been reached, the device switches into its
constant-current mode.
OC response
The OC open-drain output is asserted (active low) when an overcurrent or overtemperature condition is
encountered. The output will remain asserted until the overcurrent or overtemperature condition is removed.
Connecting a heavy capacitive load to an enabled device can cause momentary false overcurrent reporting from
the inrush current flowing through the device, charging the downstream capacitor. The TPS204xA and
TPS205xA family of devices are designed to reduce false overcurrent reporting. An internal overcurrent
transient filter eliminates the need for external components to remove unwanted pulses. Using low-ESR
electrolytic capacitors on the output lowers the inrush current flow through the device during hot-plug events
by providing a low-impedance energy source, also reducing erroneous overcurrent reporting.
Figure 25. Typical Circuit for OC Pin (Example, TPS2041A)
power dissipation and junction temperature
The low on-resistance on the n-channel MOSFET allows small surface-mount packages, such as SOIC, to pass
large currents. The thermal resistances of these packages are high compared to those of power packages; it
is good design practice to check power dissipation and junction temperature. Begin by determining the r
of the N-channel MOSFET relative to the input voltage and operating temperature. As an initial estimate, use
the highest operating ambient temperature of interest and read r
power dissipation per switch can be calcultaed by:
PD+
r
DS(on)
2
I
V+
R
DS(on)
pullup
from Figure 18. Using this value, the
DS(on)
Depending on which device is being used, multiply this number by the number of switches being used. This step
will render the total power dissipation from the N-channel MOSFETs.
PD = Total power dissipation based on number of switches being used.
Compare the calculated junction temperature with the initial estimate. If they do not agree within a few degrees,
repeat the calculation, using the calculated value as the new estimate. Two or three iterations are generally
sufficient to get a reasonable answer.
thermal protection
Thermal protection prevents damage to the IC when heavy-overload or short-circuit faults are present for
extended periods of time. The faults force the TPS204xA and TPS205xA into constant-current mode, which
causes the voltage across the high-side switch to increase; under short-circuit conditions, the voltage across
the switch is equal to the input voltage. The increased dissipation causes the junction temperature to rise to high
levels. The protection circuit senses the junction temperature of the switch and shuts it off. Hysteresis is built
into the thermal sense circuit, and after the device has cooled approximately 20 degrees, the switch turns back
on. The switch continues to cycle in this manner until the load fault or input power is removed.
The TPS204xA and TPS205xA implement a dual thermal trip to allow fully independent operation of the power
distribution switches. In an overcurrent or short-circuit condition the junction temperature will rise. Once the die
temperature rises to approximately 140°C, the internal thermal sense circuitry checks which power switch is
in an overcurrent condition and turns that power switch off, thus isolating the fault without interrupting operation
of the adjacent power switch. Should the die temperature exceed the first thermal trip point of 140°C and reach
160°C, both switches turn off. The OC open-drain output is asserted (active low) when overtemperature or
overcurrent occurs.
An undervoltage lockout ensures that the power switch is in the off state at power up. Whenever the input voltage
falls below approximately 2 V, the power switch will be quickly turned off. This facilitates the design of
hot-insertion systems where it is not possible to turn off the power switch before input power is removed. The
UVLO will also keep the switch from being turned on until the power supply has reached at least 2 V, even if
the switch is enabled. Upon reinsertion, the power switch will be turned on, with a controlled rise time to reduce
EMI and voltage overshoots.
universal serial bus (USB) applications
The universal serial bus (USB) interface is a 12-Mb/s, or 1.5-Mb/s, multiplexed serial bus designed for
low-to-medium bandwidth PC peripherals (e.g., keyboards, printers, scanners, and mice). The four-wire USB
interface is conceived for dynamic attach-detach (hot plug-unplug) of peripherals. Two lines are provided for
differential data, and two lines are provided for 5-V power distribution.
USB data is a 3.3-V level signal, but power is distributed at 5 V to allow for voltage drops in cases where power
is distributed through more than one hub across long cables. Each function must provide its own regulated 3.3 V
from the 5-V input or its own internal power supply.
The USB specification defines the following five classes of devices, each differentiated by power-consumption
requirements:
D
Hosts/self-powered hubs (SPH)
D
Bus-powered hubs (BPH)
D
Low-power, bus-powered functions
D
High-power, bus-powered functions
D
Self-powered functions
Self-powered and bus-powered hubs distribute data and power to downstream functions. The TPS204xA and
TPS205xA can provide power-distribution solutions for many of these classes of devices.
host/self-powered and bus-powered hubs
Hosts and self-powered hubs have a local power supply that powers the embedded functions and the
downstream ports (see Figures 26 and 27). This power supply must provide from 5.25 V to 4.75 V to the board
side of the downstream connection under full-load and no-load conditions. Hosts and SPHs are required to have
current-limit protection and must report overcurrent conditions to the USB controller. T ypical SPHs are desktop
PCs, monitors, printers, and stand-alone hubs.
Figure 27. T ypical Four-Port USB Host/Self-Powered Hub
Bus-powered hubs obtain all power from upstream ports and often contain an embedded function. The hubs
are required to power up with less than one unit load. The BPH usually has one embedded function, and power
is always available to the controller of the hub. If the embedded function and hub require more than 100 mA
on powerup, the power to the embedded function may need to be kept off until enumeration is completed. This
can be accomplished by removing power or by shutting off the clock to the embedded function. Power switching
the embedded function is not necessary if the aggregate power draw for the function and controller is less than
one unit load. The total current drawn by the bus-powered device is the sum of the current to the controller, the
embedded function, and the downstream ports, and it is limited to 500 mA from an upstream port.
low-power bus-powered functions and high-power bus-powered functions
Both low-power and high-power bus-powered functions obtain all power from upstream ports; low-power
functions always draw less than 100 mA; high-power functions must draw less than 100 mA at power up and
can draw up to 500 mA after enumeration. If the load of the function is more than the parallel combination of
44 Ω and 10 µF at power up, the device must implement inrush current limiting (see Figure 28).
Power Supply
D+
D–
V
BUS
GND
USB
Control
10 µF
3.3 V
0.1 µF
2,3
5
4
TPS2041A
IN
OC
EN
GND
1
OUT
6, 7, 8
0.1 µF10 µF
Internal
Function
Figure 28. High-Power Bus-Powered Function (Example, TPS2041A)
USB power-distribution requirements
USB can be implemented in several ways, and, regardless of the type of USB device being developed, several
power-distribution features must be implemented.
D
Hosts/self-powered hubs must:
–Current-limit downstream ports
–Report overcurrent conditions on USB V
D
Bus-powered hubs must:
–Enable/disable power to downstream ports
–Power up at <100 mA
–Limit inrush current (<44 Ω and 10 µF)
D
Functions must:
–Limit inrush currents
–Power up at <100 mA
The feature set of the TPS204xA and TPS205xA allows them to meet each of these requirements. The
integrated current-limiting and overcurrent reporting is required by hosts and self-powered hubs. The logic-level
enable and controlled rise times meet the need of both input and output ports on bus-power hubs, as well as
the input ports for bus-power functions (see Figures 29 through 32).
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating.
These are considered hot-plug applications. Such implementations require the control of current surges seen
by the main power supply and the card being inserted. The most effective way to control these surges is to limit
and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply
normally turns on. Due to the controlled rise times and fall times of the TPS204xA and TPS205xA, these devices
can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature
of the TPS204xA and TPS205xA also ensures the switch will be off after the card has been removed, and the
switch will be off during the next insertion. The UVLO feature insures a soft start with a controlled rise time for
every insertion of the card or module.
PC Board
Power
Supply
2.7 V to 5.5 V
1000 µF
Optimum
0.1 µF
TPS2041A
GND
IN
IN
EN
OUT
OUT
OUT
OC
Block of
Circuitry
Overcurrent Response
Figure 33. T ypical Hot-Plug Implementation (Example, TPS2041A)
By placing the TPS204xA and TPS205xA between the VCC input and the rest of the circuitry , the input power
will reach these devices first after insertion. The typical rise time of the switch is approximately 2.5 ms, providing
a slow voltage ramp at the output of the device. This implementation controls system surge currents and
provides a hot-plugging mechanism for any device.
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-012
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.197
(5,00)
0.189
(4,80)
0.344
(8,75)
0.337
(8,55)
0.394
(10,00)
0.386
(9,80)
4040047/D 10/96
29
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable DeviceStatus
TPS2041ADNRNDSOICD875Green (RoHS &
TPS2041ADG4NRNDSOICD875Green (RoHS &
TPS2041ADRNRNDSOICD82500 Green(RoHS &
TPS2041ADRG4NRNDSOICD82500 Green(RoHS &
TPS2042ADNRNDSOICD875Green (RoHS &
TPS2042ADG4NRNDSOICD875Green (RoHS &
TPS2042ADRNRNDSOICD82500 Green(RoHS &
TPS2042ADRG4NRNDSOICD82500 Green(RoHS &
TPS2043ADNRNDSOICD1640Green (RoHS &
TPS2043ADG4NRNDSOICD1640Green (RoHS &
TPS2043ADRNRNDSOICD162500 Green (RoHS &
TPS2043ADRG4NRNDSOICD162500 Green (RoHS &
TPS2044ADNRNDSOICD1640Green (RoHS &
TPS2044ADG4NRNDSOICD1640Green (RoHS &
TPS2044ADRNRNDSOICD162500 Green (RoHS &
TPS2044ADRG4NRNDSOICD162500 Green (RoHS &
TPS2051ADNRNDSOICD875Green (RoHS &
TPS2051ADG4NRNDSOICD875Green (RoHS &
TPS2051ADRNRNDSOICD82500 Green(RoHS &
TPS2051ADRG4NRNDSOICD82500 Green(RoHS &
TPS2052ADNRNDSOICD875Green (RoHS &
TPS2052ADG4NRNDSOICD875Green (RoHS &
TPS2052ADRNRNDSOICD82500 Green(RoHS &
TPS2052ADRG4NRNDSOICD82500 Green(RoHS &
TPS2053ADNRNDSOICD1640Green (RoHS &
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
4-Aug-2008
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable DeviceStatus
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
TPS2053ADG4NRNDSOICD1640Green (RoHS &
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-1-260C-UNLIM
4-Aug-2008
(3)
no Sb/Br)
TPS2053ADRNRNDSOICD162500 Green (RoHS &
CU NIPDAULevel-1-260C-UNLIM
no Sb/Br)
TPS2053ADRG4NRNDSOICD162500 Green (RoHS &
CU NIPDAULevel-1-260C-UNLIM
no Sb/Br)
TPS2054ADNRNDSOICD1640Green (RoHS &
CU NIPDAULevel-1-260C-UNLIM
no Sb/Br)
TPS2054ADG4NRNDSOICD1640Green (RoHS &
CU NIPDAULevel-1-260C-UNLIM
no Sb/Br)
TPS2054ADRNRNDSOICD162500 Green (RoHS &
CU NIPDAULevel-1-260C-UNLIM
no Sb/Br)
TPS2054ADRG4NRNDSOICD162500 Green (RoHS &
CU NIPDAULevel-1-260C-UNLIM
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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