Texas Instruments TMX 320 DM 648 INSTALLATION INSTRUCTIONS

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TMS320DM647/TMS320DM648

1 TMS320DM647/TMS320DM648 Digital Media Processor

1.1 Features

• High-Performance Digital Media Processor • C64x+ L1/L2 Memory Architecture

(DM647/DM648) – 720, 900-MHz C64x+™ Clock Rate [Direct Mapped] – 1.39, 1.11-ns Instruction Cycle Time – 256K-bit (32K-byte) L1D Data Cache – 5760, 7200 MIPS – Eight 32-Bit C64x+ Instructions/Cycle – Fully Software-Compatible With

C64x/Debug

– Commercial Temperature Ranges

• VelociTI.2™ Extensions to VelociTI™

Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core – Eight Highly Independent Functional Units

With VelociTI.2 Extensions:

• Six ALUs (32-/40-Bit), Each Supports

Single 32-bit, Dual 16-bit, or Quad 8-bit Arithmetic per Clock Cycle

• Two Multipliers Support Four 16 x 16-bit

Multiplies (32-bit Results) per Clock Cycle or Eight 8 x 8-bit Multiplies (16-Bit Results) per Clock Cycle

– Load-Store Architecture With Non-Aligned

Support – 64 32-bit General-Purpose Registers – Instruction Packing Reduces Code Size – All Instructions Conditional – Additional C64x+™ Enhancements

• Protected Mode Operation

• Exceptions Support for Error Detection

and Program Redirection

• Hardware Support for Modulo Loop

Auto-Focus Module Operation

• C64x+ Instruction Set Features

– Byte-Addressable (8-/16-/32-/64-bit Data) – 8-bit Overflow Protection – Bit-Field Extract, Set, Clear – Normalization, Saturation, Bit-Counting – VelociTI.2 Increased Orthogonality – C64x+ Extensions • Multichannel Audio Serial Port (McASP)

• Compact 16-bit Instructions – Ten Serializers and SPDIF (DIT) Mode

• Additional Instructions to Support

Complex Multiplies

– 256K-bit (32K-byte) L1P Program Cache

[2-Way Set-Associative]

– 2M-bit/256K-byte (DM647) or

4M-Bit/512K-byte) (DM648) L2 Unified Mapped RAM/Cache [Flexible Allocation]

• Supports Little Endian Mode Only

• Five Configurable Video Ports

– Providing a Glueless I/F to Common Video

Decoder and Encoder Devices

– Supports Multiple Resolutions/Video Stds

• VCXO Interpolated Control Port (VIC)

– Supports Audio/Video Synchronization

• External Memory Interfaces (EMIFs)

– 32-Bit DDR2 SDRAM Memory Controller

With 256M-Byte Address Space (1.8-V I/O)

– Asynchronous 16-Bit Wide EMIF (EMIFA)

With up to 64M-Byte Address Reach

– Glueless Interface to Asynchronous

Memories (SRAM, Flash, and EEPROM)

– Synchronous Memories (SBSRAM and ZBT

SRAM)

– Supports Interface to Standard Sync

Devices and Custom Logic (FPGA, CPLD, ASICs, etc)

• Enhanced Direct-Memory-Access (EDMA)

Controller (64 Independent Channels)

• 3-Port Gigabit Ethernet Switch

• Four 64-Bit General-Purpose Timers (Each

Configurable as Two 32-Bit Timers)

• One UART (With RTS and CTS Flow Control)

• One 4-wire Serial Port Interface (SPI) With Two

Chip-Selects

• Master/Slave Inter-Integrated Circuit (I2C

Bus™)

• 16/32-Bit Host-Port Interface (HPI)

• 32-Bit 33-/66-MHz, 3.3-V Peripheral Component

Interconnect (PCI) Master/Slave Interface Conforms to PCI Specification 2.3

• VLYNQ™ Interface (FPGA Interface)

• On-Chip ROM Bootloader

Digital Media Processor

SPRS372 – MAY 2007

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this document.

PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice.

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TMS320DM647/TMS320DM648 Digital Media Processor

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• Individual Power-Saving Modes – 529-pin nFBGA (ZUT suffix)

• Flexible PLL Clock Generators

• IEEE-1149.1 (JTAG™)

Boundary-Scan-Compatible

• 32 General-Purpose I/O (GPIO) Pins

(Multiplexed With Other Device Functions)

• Package:

1.1.1 Trademarks

TMS320C64x+, C64x, C64x+, VelociTI, VelociTI.2, VLYNQ, TMS320C6000, C6000, TI, and TMS320 are

trademarks of Texas Instruments.

I2C Bus is a registered trademark of Koninklijke Philips Electronics N.V.

Windows is a registered trademark of Microsoft Corporation in the United States and/or other countries.

All trademarks are the property of their respective owners.

1.2 Description

The TMS320C64x+™ DSPs (including the TMS320DM647/TMS320DM648 devices) are the

highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. The

DM647/DM648 devices are based on the third-generation high-performance, advanced VelociTI™

very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making these DSPs

an excellent choice for digital media applications. The C64x+™ devices are upward code-compatible from

previous devices that are part of the C6000™ DSP platform. The C64x™ DSPs support added

functionality and have an expanded instruction set from previous devices.

– 19x19 mm 0.8 mm pitch BGA – 0.09- µ m/6-Level Cu Metal Process (CMOS)

• 3.3-V and 1.8-V I/O, 1.2-V Internal (-720, -900)

• Applications:

– Digital Video Recording

Any reference to the C64x DSP or C64x CPU also applies, unless otherwise noted, to the C64x+ DSP and

C64x+ CPU, respectively.

With performance of up to 7200 million instructions per second (MIPS) at a clock rate of 900 MHz, the

C64x+ core offers solutions to high-performance DSP programming challenges. The DSP core possesses

the operational flexibility of high-speed controllers and the numerical capability of array processors. The

C64x+ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly

independent functional units—two multipliers for a 32-bit result and six arithmetic logic units (ALUs). The

eight functional units include instructions to accelerate the performance in video and imaging applications.

The DSP core can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 2400 million

MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 4800 MMACS. For more details

on the C64x+ DSP, see the TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide

(literature number SPRU732 ).

The DM647/DM648 devices also have application-specific hardware logic, on-chip memory, and additional

on-chip peripherals similar to the other C6000 DSP platform devices. The DM647/DM648 core uses a

two-level cache-based architecture. The Level 1 program cache (L1P) is a 256K-bit direct mapped cache

and the Level 1 data cache (L1D) is a 256K-bit 2-way set-associative cache. The Level 2 memory/cache

(L2) consists of a 4M-bit (DM648) or 2M-bit (DM647) memory space that is shared between program and

data space. L2 memory can be configured as mapped memory, cache, or combinations of the two.

The peripheral set includes: The DM647/DM648 devices have five configurable 16-bit video port

peripherals (VP0, VP1, VP2, VP3, and VP4). These video port peripherals provide a glueless interface to

common video decoder and encoder devices. The DM647/DM648 video port peripherals support multiple

resolutions and video standards (e.g., CCIR601, ITU-BT.656, BT.1120, SMPTE 125M, 260M, 274M, and

296M), a VCXO interpolated control port (VIC); a 1000 Mbps 3-port switch with a management data

input/output (MDIO) module and two SGMII ports (DM648 only); an 1000 Mbps Ethernet media access

controller (EMAC) and a management data input/output (MDIO) module (only DM647); a 4-bit transmit,

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4-bit receive VLYNQ interface; an inter-integrated circuit (I2C) bus interface; a multichannel audio serial

port (McASP) with ten serializers; four 64-bit general-purpose timers each configurable as two

independent 32-bit timers; a user-configurable 16-bit or 32-bit host-port interface (HPI); 32 pins for

general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed

with other peripherals; one UART; and two glueless external memory interfaces: a synchronous and

asynchronous external memory interface (EMIFA) for slower memories/peripherals, and a higher DDR2

SDRAM interface.

The video port peripherals provide a glueless interface to common video decoder and encoder devices.

The video port peripherals support multiple resolutions and video standards (e.g., CCIR601, ITU-BT.656,

BT.1120, SMPTE 125M, 260M, 274M, and 296M).

The video port peripherals are configurable and can support either video capture and/or video display

modes. Each video port consists of two channels (A and B) with a 5120-byte capture/display buffer that is

splittable between the two channels.

For more details on the video port peripherals, see the TMS320C64x DSP Video Port/VCXO Interpolated

Control (VIC) Port Reference Guide (literature number SPRU629).

The management data input/output (MDIO) module continuously polls all 32 MDIO addresses to

enumerate all PHY devices in the system.

The I2C and VLYNQ ports allow the device to easily control peripheral modules and/or communicate with

host processors.

The rich peripheral set provides the ability to control external peripheral devices and communicate with

external processors. For details on each of the peripherals, see the related sections later in this document

and the associated peripheral reference guides.

The DM647/DM648 devices have a complete set of development tools. These include C compilers, a DSP

assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for

visibility into source code execution.

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PRODUCT PREVIEW

Timers

(464-bit

or832-bit)

EDMA 3.0

TC TCTCTC

SwitchedCentralResource

PCI66

UHPI

3-portEthernet

Switch

Subsystem

SGMII (x2,DM648) (x1,DM647)

L1D 32KB

C64x+

Mega

L1P 32KB

L2 RAM

256KB

(DM647)

512KB

(DM648)

L2 ROM

64KB

ImagingCoprocessor

VLYNQ

DDR2

EMIFA 16-bit

VideoPorts(5)

UART

McASP

SPI

I2C

PLL

JTAG

GPIOx32

VIC

DM647/DM648

TMS320DM647/TMS320DM648 Digital Media Processor

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1.3 Functional Block Diagram

Figure 1-1 shows the functional block diagram of the DM647/DM648 device.

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Figure 1-1. TMS320DM647/TMS320DM648 Functional Block Diagram

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TMS320DM647/TMS320DM648

Digital Media Processor

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Contents

1 TMS320DM647/TMS320DM648 Digital Media 6 Peripheral Information and Electrical

Processor .................................................. 1 Specifications ........................................... 56

1.1 Features .............................................. 1 6.1 Parameter Information .............................. 56

1.1.1 Trademarks .......................................... 2

1.2 Description ............................................ 2

1.3 Functional Block Diagram ............................ 4

2 Device Overview ......................................... 6

2.1 Device Characteristics ................................ 6

2.2 CPU (DSP Core) Description ......................... 7

2.3 C64x+ CPU .......................................... 10

2.4 Memory Map Summary ............................. 12

2.5 Pin Assignments .................................... 15

2.6 Terminal Functions .................................. 19

2.7 Device Support ...................................... 33

2.8 Device and Development-Support Tool

Nomenclature ....................................... 35

2.9 Documentation Support ............................. 36

3 Device Configuration .................................. 38

3.1 System Module Registers ........................... 38

3.2 Bootmode Registers ................................ 38

3.3 Debugging Considerations .......................... 47

3.4 Pullup/Pulldown Resistors ........................... 47

4 System Interconnect ................................... 49

4.1 Internal Buses, Bridges, and Switch Fabrics ........ 49

4.2 Data Switch Fabric Connections .................... 49

4.3 Configuration Switch Fabric ......................... 51

5 Device Operating Conditions ........................ 53

5.1 Absolute Maximum Ratings Over Operating

Temperature Range (Unless Otherwise Noted) ..... 53

5.2 Recommended Operating Conditions ............... 54

5.3 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating

Temperature (Unless Otherwise Noted) ............ 55

6.2 Recommended Clock and Control Signal Transition

Behavior ............................................. 58

6.3 Power Supplies ...................................... 58

6.4 PLL1 and PLL1 Controller ........................... 63

6.5 PLL2 and PLL2 Controller ........................... 67

6.6 Enhanced Direct Memory Access (EDMA3)

Controller ............................................ 70

6.7 Reset Controller ..................................... 83

6.8 Interrupts ............................................ 90

6.9 DDR2 Memory Controller ........................... 94

6.10 External Memory Interface A (EMIFA) .............. 96

6.11 Video Port .......................................... 104

6.12 VCXO Interpolated Control (VIC) .................. 112

6.13 Universal Asynchronous Receiver/Transmitter

(UART) ............................................. 114

6.14 Inter-Integrated Circuit (I2C) ....................... 116

6.15 Host-Port Interface (HPI) Peripheral ............... 120

6.16 Peripheral Component Interconnect (PCI) ......... 131

6.17 Multichannel Audio Serial Port (McASP)

Peripheral .......................................... 136

6.18 3-Port Ethernet Switch Subsystem (3PSW) ....... 144

6.19 Management Data Input/Output (MDIO) ........... 153

6.20 Timers .............................................. 155

6.21 VLYNQ Peripheral ................................. 157

6.22 General-Purpose Input/Output (GPIO) ............. 160

6.23 IEEE 1149.1 JTAG ................................. 163

7 Mechanical Data ....................................... 165

7.1 Thermal Data for ZUT .............................. 165

7.1.1 Packaging Information ............................. 165

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2 Device Overview

2.1 Device Characteristics

Table 2-1 , provides an overview of the TMS320DM647/TMS320DM648 DSPs. The tables show significant

features of the DM647/DM648 devices, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type with pin count.

Table 2-1. Characteristics of the DM647/DM648 Processor

HARDWARE FEATURES DM647 DM648

DDR2 memory controller (32-bit bus width) [1.8 V I/O]

16-bit bus width synchronous/asynchronous EMIF 1 1 [EMIFA]

EDMA3 (64 independent channels, 8 QDMA channels)

Timers (each configurable as 1 64-bit or 2 (each configurable as 1 64-bit or 2

Peripherals Not all peripheral

pins are available at the same time (For more detail, see Section 3 .)

On-Chip Memory

MegaModule Rev ID

CPU ID + CPU Rev ID

JTAG BSDL_ID 0x0B77 A02F 0x0B77 A02F CPU Frequency MHz 720, 900 720, 900

Cycle Time ns 1.39 ns (-720), 1.11 ns (-900) 1.39 ns (-720), 1.11 ns (-900)

Voltage

PLL Options CLKIN1 frequency multiplier x1 (Bypass), x15, x20, x25, x30, x32 x1 (Bypass), x15, x20, x25, x30, x32 BGA Package 529-Pin Flip Chip Plastic BGA (ZUT) 529-Pin Flip Chip Plastic BGA (ZUT)

UART (with RTS and CTS flow control) (with RTS and CTS flow control) I2C 1 (Master/Slave) 1 (Master/Slave) SPI 1 (4-wire, 2 chip select) 1 (4-wire, 2 chip select) McASP 1 (10 serailizers) 1 (10 serailizers) 3-port Ethernet Switch Subsystem

supporting 10/100/1000 Base-T 1 SGMII port available 2 SGMII ports available Management data input/output (MDIO)

VLYNQ 1 1 General-purpose input/output port

(GPIO) HPI (16/32-bit) 1 1 PCI (32 bit) (33 MHz or 66 MHz) 1 (PCI33 or PCI66) 1 (PCI33 or PCI66) VIC 1 1 Configurable video ports 5 5 Size (bytes) 320KB RAM, 64KB ROM 576KB RAM, 64KB ROM

Organization to 32KB) 32KB)

Revision ID Register (MM_REVID[15:0]) 0x0003 0x0003 (address location 0x0181 2000)

Control Status Register (CSR.[31:16]) 0x1000 0x1000 JTAGID register

(address location: 0x0204 9018)

Core (V) 1.2 V (-720, 900) 1.2 V (-720, 900) I/O (V) 1.8 V, 3.3 V 1.8 V, 3.3 V

1 1

4 64-bit General Purpose 4 64-bit General Purpose

32-bit) 32-bit)

Up to 32 pins Up to 32 pins

32KB L1 program (L1P)/cache (Cache 32KB L1 program (L1P)/cache (up to up to 32KB) 32KB) 32KB L1 data (L1D)/cache (Cache up 32KB L1 data (L1D)/cache (up to

256KB unified mapped RAM/Cache 512 KB unified mapped RAM/Cache (L2) (L2) 64KB Boot ROM 64KB Boot ROM

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Table 2-1. Characteristics of the DM647/DM648 Processor (continued)

HARDWARE FEATURES DM647 DM648

Process 0.09- µ m/6-Level Cu Metal Process Technology (CMOS)

Product Preview (PP), Advance

Product Status

(1) PRODUCT PREVIEW information concerns experimental products (designated as TMX) that are in the formative or design phase of

development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice.

(1)

Information (AI), PP PP or Production Data (PD)

2.2 CPU (DSP Core) Description

The C64x+ central processing unit (CPU) consists of eight functional units, two register files, and two data paths as shown in Figure 2-1 . The two general-purpose register files (A and B) each contain 32 32-bit registers for a total of 64 registers. The general-purpose registers can be used for data or can be data address pointers. The data types supported include packed 8-bit data, packed 16-bit data, 32-bit data, 40-bit data, and 64-bit data. Values larger than 32 bits, such as 40-bit-long or 64-bit-long values are stored in register pairs, with the 32 LSBs of data placed in an even register and the remaining 8 or 32 MSBs in the next upper register (which is always an odd-numbered register).

The eight functional units (.M1, .L1, .D1, .S1, .M2, .L2, .D2, and .S2) are each capable of executing one instruction every clock cycle. The .M functional units perform all multiply operations. The .S and .L units perform a general set of arithmetic, logical, and branch functions. The .D units primarily load data from memory to the register file and store results from the register file into memory.

0.09 µ m 0.09 µ m

The C64x+ CPU extends the performance of the C64x core through enhancements and new features. Each C64x+ .M unit can perform one of the following each clock cycle: one 32 x 32 bit multiply, one 16 x

32 bit multiply, two 16 x 16 bit multiplies, two 16 x 32 bit multiplies, two 16 x 16 bit multiplies with add/subtract capabilities, four 8 x 8 bit multiplies, four 8 x 8 bit multiplies with add operations, and four 16 x 16 multiplies with add/subtract capabilities (including a complex multiply). There is also support for Galois field multiplication for 8-bit and 32-bit data. Many communications algorithms such as FFTs and modems require complex multiplication. The complex multiply (CMPY) instruction takes for 16-bit inputs and produces a 32-bit real and a 32-bit imaginary output. There are also complex multiplies with rounding capability that produces one 32-bit packed output that contain 16-bit real and 16-bit imaginary values. The 32 x 32 bit multiply instructions provide the extended precision necessary for audio and other high-precision algorithms on a variety of signed and unsigned 32-bit data types.

The .L or (Arithmetic Logic Unit) now incorporates the ability to do parallel add/subtract operations on a pair of common inputs. Versions of this instruction exist to work on 32-bit data or on pairs of 16-bit data performing dual 16-bit add and subtracts in parallel. There are also saturated forms of these instructions.

The C64x+ core enhances the .S unit in several ways. In the C64x core, dual 16-bit MIN2 and MAX2 comparisons were available only on the .L units. On the C64x+ core they are also available on the .S unit which increases the performance of algorithms that do searching and sorting. Finally, to increase data packing and unpacking throughput, the .S unit allows sustained high performance for the quad 8-bit/16-bit and dual 16-bit instructions. Unpack instructions prepare 8-bit data for parallel 16-bit operations. Pack instructions return parallel results to output precision including saturation support.

Other new features include:

• SPLOOP - A small instruction buffer in the CPU that aids in creation of software pipelining loops where multiple iterations of a loop are executed in parallel. The SPLOOP buffer reduces the code size associated with software pipelining. Furthermore, loops in the SPLOOP buffer are fully interruptible.

• Compact Instructions - The native instruction size for the C6000 devices is 32 bits. Many common instructions such as MPY, AND, OR, ADD, and SUB can be expressed as 16 bits if the C64x+ compiler can restrict the code to use certain registers in the register file. This compression is performed by the code generation tools.

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• Instruction Set Enhancement - As noted above, there are new instructions such as 32-bit multiplications, complex multiplications, packing, sorting, bit manipulation, and 32-bit Galois field multiplication.

• Exceptions Handling - Intended to aid the programmer in isolating bugs. The C64x+ CPU is able to detect and respond to exceptions, both from internally detected sources (such as illegal opcodes) and from system events (such as a watchdog time expiration).

• Privilege - Defines user and supervisor modes of operation, allowing the operating system to give a basic level of protection to sensitive resources. Local memory is divided into multiple pages, each with read, write, and execute permissions.

• Time-Stamp Counter - Primarily targeted for real-time operating system (RTOS) robustness, a free-running time-stamp counter is implemented in the CPU which is not sensitive to system stalls.

For more details on the C64x+ CPU and its enhancements over the C64x architecture, see the following documents:

• TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (literature number SPRU732 )

• TMS320C64x+ DSP Megamodule Reference Guide (literature number SPRU871 )

• TMS320C64x to TMS320C64x+ CPU Migration Guide Application Report (literature number SPRAA84 )

• TMS320C64x+ DSP Cache User's Guide (literature number SPRU862 )

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src2

.D1

.M1

.S1

.L1

long src

odd dst

src2

src1

even dst

odd dst

dst1

dst

src2

long src

DA1

ST1b

LD1b LD1a

ST1a

Data path A

Odd

file A

(A1, A3,

A5...A31)

Odd

file B

(B1, B3,

B5...B31)

.D2

src1

dst

src2

DA2

LD2a LD2b

src2

.M2

src1

dst1

.S2

src1

even dst

long src

odd dst

ST2a ST2b

long src

.L2

even dst

odd dst

src1

Data path B

Control Register

32 MSB 32 LSB

dst2

(A)

32 MSB 32 LSB

32 LSB

32 MSB

32 LSB

32 MSB

dst2

(B)

(B) (A)

(C)

Even

file A

(A0, A2,

A4...A30)

Even

file B

(B0, B2,

B4...B30)

(D)

A. On .M unit, dst2 is 32 MSB. B. On .M unit, dst1 is 32 LSB. C. On C64x CPU .M unit, src2 is 32 bits; on C64x+ CPU .M unit, src2 is 64 bits. D. On .L and .S units, odd dst connects to odd register files and even dst connects to even register files.

TMS320DM647/TMS320DM648

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Figure 2-1. TMS320C64x+™ CPU (DSP Core) Data Paths

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2.3 C64x+ CPU

The C64x+ core uses a two-level cache-based architecture. The Level 1 program memory/cache (L1P) consists of 32-KB memory space that can be configured as mapped memory or direct mapped cache. The Level 1 data memory/cache (L1D) consists of 32 KB that can be configured as mapped memory or 2-way associated cache. The Level 2 memory/cache (L2) consists of a 256 KB (DM647)/512 KB (DM648) memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or a combination of both.

Table 2-2 shows a memory map of the C64x+ CPU cache registers for the device.

HEX ADDRESS RANGE REGISTER ACRONYM DESCRIPTION

0x0184 0000 L2CFG L2 cache configuration register 0x0184 0020 L1PCFG L1P size cache configuration register 0x0184 0024 L1PCC L1P freeze mode cache configuration register 0x0184 0040 L1DCFG L1D size cache configuration register 0x0184 0044 L1DCC L1D freeze mode cache configuration register

0x0184 0048 - 0x0184 0FFC - Reserved

0x0184 1000 EDMAWEIGHT L2 EDMA access control register

0x0184 1004 - 0x0184 1FFC - Reserved

0x0184 2000 L2ALLOC0 L2 allocation register 0 0x0184 2004 L2ALLOC1 L2 allocation register 1 0x0184 2008 L2ALLOC2 L2 allocation register 2 0x0184 200C L2ALLOC3 L2 allocation register 3

0x0184 2010 - 0x0184 3FFF - Reserved

0x0184 4000 L2WBAR L2 writeback base address register 0x0184 4004 L2WWC L2 writeback word count register 0x0184 4010 L2WIBAR L2 writeback invalidate base address register 0x0184 4014 L2WIWC L2 writeback invalidate word count register 0x0184 4018 L2IBAR L2 invalidate base address register 0x0184 401C L2IWC L2 invalidate word count register 0x0184 4020 L1PIBAR L1P invalidate base address register 0x0184 4024 L1PIWC L1P invalidate word count register 0x0184 4030 L1DWIBAR L1D writeback invalidate base address register 0x0184 4034 L1DWIWC L1D writeback invalidate word count register 0x0184 4038 - Reserved 0x0184 4040 L1DWBAR L1D block writeback 0x0184 4044 L1DWWC L1D block writeback 0x0184 4048 L1DIBAR L1D invalidate base address register 0x0184 404C L1DIWC L1D invalidate word count register

0x0184 4050 - 0x0184 4FFF - Reserved

0x0184 5000 L2WB L2 writeback all register 0x0184 5004 L2WBINV L2 writeback invalidate all register 0x0184 5008 L2INV L2 global invalidate without writeback

0x0184 500C - 0x0184 5027 - Reserved

0x0184 5028 L1PINV L1P global invalidate

0x0184 502C - 0x0184 5039 - Reserved

0x0184 5040 L1DWB L1D global writeback 0x0184 5044 L1DWBINV L1D global writeback with invalidate

Table 2-2. C64x+ Cache Registers

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Table 2-2. C64x+ Cache Registers (continued)

HEX ADDRESS RANGE REGISTER ACRONYM DESCRIPTION

0x0184 5048 L1DINV L1D global invalidate without writeback 0x0184 8000 - 0x0184 80FC MAR0 - MAR63 Reserved 0x0000 0000 - 0x3FFF FFFF 0x0184 80C0 - 0x0184 80FC MAR48 - MAR63 Reserved 0x3000 0000 - 0x3FFF FFFF 0x0184 8100 - 0x0184 813C MAR64 - MAR79 Memory attribute registers for PCI Data 0x4000 0000 - 0x4FFF FFFF 0x0184 8140 - 0x0184 827C MAR80 - MAR159 Reserved 0x5000 0000 - 0x9FFF FFFF 0x0184 8280 - 0x0184 82BC MAR160 - MAR175 Memory attribute registers for EMIFA CE2 0xA000 0000- 0xA3FF FFFF 0x0184 8130 - 0x0184 813C MAR76 - MAR79 Memory Attribute Registers for VLYNQ 0x4C00 0000 - 0x4FFF FFFF 0x0184 82C0 - 0x0184 82FC MAR176 - MAR191 Memory attribute registers for EMIFA CE3 0xB000 0000- 0xB3FF FFFF

0x0184 8300- 0x0184 837C MAR192 - MAR223 Reserved 0xC000 0000 - 0xDFFF FFFF 0x0184 8380 - 0x0184 83BC MAR224 - MAR239 Memory attribute registers for DDR2 0xE000 0000 - 0xEFFF FFFF 0x0184 83C0 - 0x0184 83FC MAR240 - MAR255 Reserved 0xF000 0000 - 0xFFFF FFFF

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TMS320DM647/TMS320DM648 Digital Media Processor

SPRS372 – MAY 2007

2.4 Memory Map Summary

Table 2-3 shows the memory map address ranges of the device. The device has multiple on-chip

memories associated with its two processors and various subsystems. To help simplify software development, a unified memory map is used where possible to maintain a consistent view of device resources across all bus masters.

START END SIZE C64x+

ADDRESS ADDRESS (Bytes) MEMORY MAP

0x0000 0000 0x000F FFFF 1M Reserved 0x0010 0000 0x0011 FFFF 128K VICP 0x0012 0000 0x001F FFFF 1M-128K Reserved 0x0020 0000 0x007F FFFF 6M Reserved 0x0080 0000 0x008B FFFF 768K Internal ROM 0x008C 0000 0x009F 7FFF 2M-768K Reserved 0x00A0 0000 0x00A3 FFFF 256K L2 SRAM (For both DM647 and DM648) 0x00A4 0000 0x00A7 FFFF 256K L2 SRAM (For DM648 only) 0x00B6 0000 0x00DF FFFF 4M-1408K Reserved 0x00E0 0000 0x00E0 7FFF 32K L1P SRAM 0x00E0 8000 0x00EF FFFF 1M – 32K Reserved 0x00F0 0000 0x00F0 7FFF 32K L1D SRAM 0x00F0 8000 0x00FF FFFF 1M – 32K Reserved 0x0100 0000 0x017F FFFF 8M Reserved 0x0180 0000 0x0180 FFFF 64K C64x+ Interrupt Controller 0x0181 0000 0x0181 0FFF 4K C64x+ Power-down Control 0x0181 1000 0x0181 1FFF 4K C64x+ Security ID 0x0181 2000 0x0181 2FFF 4K C64x+ Revision ID 0x0181 3000 0x0181 FFFF 52K Reserved 0x0182 0000 0x0182 040F 1040B C64x+ EMC 0x0182 0410 0x 0182 FFFF 64K – 16 Reserved 0x0183 0000 0x 0183 FFFF 64K Reserved 0x0184 0000 0x 0184 FFFF 64K C64x+ Memory control 0x0185 0000 0x 01BB FFFF 3, 520K Reserved 0x01BC 0000 0x 01BC FFFF 64K Emulation 0x01BD 0000 0x 01BD FFFF 64K Reserved 0x01BE 0000 0x 01BF FFFF 128K Reserved 0x01BE 0000 0x 01FF FFFF 4.125M Reserved 0x0200 0000 0x0200 0007F 128B HPI Control 0x0200 0080 0x0203 FFFF 256K – 128 Reserved 0x0204 0000 0x0204 3FFF 16K McASP Control 0x0204 4000 0x0204 43FF 1K McASP Data 0x0204 4400 0x0204 47FF 1K Timer0 0x0204 4800 0x0204 4BFF 1K Timer1 0x020 44C00 0x0204 4FFF 1K Timer2 0x0204 5000 0x0204 53FF 1K Timer3 0x0204 5400 0x0204 5FFF 3K Reserved 0x0204 6000 0x0204 6FFF 4K PSC 0x0204 7000 0x0204 73FF 1K UART 0x0204 7400 0x0204 77FF 1K VIC Control 0x0204 7800 0x0204 7BFF 1K SPI 0x0204 7C00 0x0204 7FFF 1K I2C Data and Control 0x0204 8000 0x0204 83FF 1K GPIO

Table 2-3. Memory Map Summary

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TMS320DM647/TMS320DM648

Digital Media Processor

Table 2-3. Memory Map Summary (continued)

START END SIZE C64x+

ADDRESS ADDRESS (Bytes) MEMORY MAP

0x0204 8400 0x0204 87FF 1K PCI Control 0x0204 8800 0x0204 8FFF 2K Reserved 0x0204 9000 0x0204 9FFF 4K Chip-Level Registers 0x0204 A000 0x0207 FFFF 216K Reserved 0x0208 0000 0x0209 FFFF 128K VICP Configuration 0x020A 0000 0x020D FFFF 256K Reserved 0x020E 0000 0x020E 01FF 512 PLL Controller 1 0x020E 0200 0x0211 FFFF 256K – 512 Reserved 0x0212 0000 0x0212 01FF 512 PLL Controller 2 0x0212 0200 0x0215 FFFF 256K – 512 Reserved 0x0216 0000 0x029C FFFF 9M-576K Reserved 0x02A0 0000 0x02A0 7FFF 32K EDMA3CC 0x02A0 8000 0x02A1 FFFF 96K Reserved 0x02A2 0000 0x02A2 7FFF 32K EDMA3TC0 0x02A2 8000 0x02A2 FFFF 32K EDMA3TC1 0x02A3 0000 0x02A3 7FFF 32K EDMA3TC2 0x02A3 8000 0x02A3 FFFF 32K EDMA3TC3 0x02A4 0000 0x02A7 FFFF 256K Reserved 0x02A8 0000 0x02A8 04FF 1.25K Reserved 0x02A8 0500 0x02AB FFFF 256K – 1.25K Reserved 0x02AC 0000 0x02AD FFFF 128K Reserved 0x02AE 0000 0x02AF FFFF 128K Reserved 0x02B0 0000 0x02B0 00FF 256 Reserved 0x02B0 0100 0x02B0 3FFF 16K – 256 Reserved 0x02B0 4000 0x02B0 407F 128 Reserved 0x02B0 4080 0x02B3 FFFF 256K – 128 Reserved 0x02B4 0000 0x02B4 01FF 512 Reserved 0x02B4 0200 0x02B7 FFFF 256K – 512 Reserved 0x02B8 0000 0x02B9 FFFF 128K Reserved 0x02BA 0000 0x02BB FFFF 128K Reserved 0x02BC 0000 0x02BF FFFF 256K Reserved 0x02C0 0000 0x02C0 3FFF 16K VP0 Control 0x02C0 4000 0x02C0 7FFF 16K VP1 Control 0x02C0 8000 0x02C0 BFFF 16K VP2 Control 0x02C0 C000 0x02C0 FFFF 16K VP3 Control 0x02C1 0000 0x02C1 3FFF 16K VP4 Control 0x02C1 4000 0x02C3 FFFF 176K Reserved 0x02C4 0000 0x02C7 FFFF 256K Reserved 0x02C8 0000 0x02CB FFFF 256K Reserved 0x02CC 0000 0x02CF FFFF 256K Reserved 0x02D0 0000 0x02D0 1FFF 8K Ethernet Subsystem CPPI RAM 0x02D0 2000 0x02D0 2FFF 4K Ethernet Subsystem Control 0x02D0 3000 0x02D0 3FFF 4K Ethernet Subsystem 3PSW 0x02D0 4000 0x02D0 47FF 2K Ethernet Subsystem MDIO 0x02D0 4800 0x02D0 4BFF 1K Ethernet Subsystem SGMII0 0x02D0 4C00 0x02D0 4FFF 1K Ethernet Subsystem SGMII1 (DM648 only) 0x02D0 5000 0x02D0 57FF 2K Reserved 0x02D0 5800 0x02DB FFFF 746K Reserved 0x02DC 0000 0x02DF FFFF 256K Reserved

(1)

SPRS372 – MAY 2007

(1) The EMIFA CS0 and CS1 are not functionally supported on the DM648 device, and therefore, are not pinned out.

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Table 2-3. Memory Map Summary (continued)

START END SIZE C64x+

ADDRESS ADDRESS (Bytes) MEMORY MAP

0x02E0 0000 0x02E0 3FFF 16K Reserved 0x02E0 4000 0x02FF FFFF 2M – 16K Reserved 0x0300 0000 0x03FF FFFF 16M Reserved 0x0400 0000 0x0FFF FFFF 192M Reserved 0x1000 0000 0x1FFF FFFF 256M Reserved 0x2000 0000 0x2FFF FFFF 256M Reserved 0x3000 0000 0x3000 00FF 256 Reserved 0x3000 0100 0x33FF FFFF 64M – 256 Reserved 0x3400 0000 0x3400 00FF 256 Reserved 0x3400 0100 0x37FF FFFF 64M – 256 Reserved 0x3800 0000 0x3BFF FFFF 64M VLYNQ 0x3C00 0000 0x3CFF FFFF 16M Reserved 0x3D00 0000 0x3DFF FFFF 16M Reserved 0x3E00 0000 0x3FFF FFFF 32M Reserved 0x4000 0000 0x4FFF FFFF 256M PCI Data 0x5000 0000 0x51FF FFFF 32M VP0 ChannelA Data 0x5200 0000 0x53FF FFFF 32M VP0 ChannelB Data 0x5400 0000 0x55FF FFFF 32M VP1 ChannelA Data 0x5600 0000 0x57FF FFFF 32M VP1 ChannelB Data 0x5800 0000 0x59FF FFFF 32M VP2 ChannelA Data 0x5A00 0000 0x5BFF FFFF 32M VP2 ChannelB Data 0x5C00 0000 0x5DFF FFFF 32M Reserved 0x5E00 0000 0x5FFF FFFF 32M Reserved 0x6000 0000 0x61FF FFFF 32M VP3 ChannelA Data 0x6200 0000 0x63FF FFFF 32M VP3 ChannelB Data 0x6400 0000 0x65FF FFFF 32M VP4 ChannelA Data 0x6600 0000 0x67FF FFFF 32M VP4 ChannelB Data 0x6800 0000 0x6FFF FFFF 128M Reserved 0x7000 0000 0x77FF FFFF 128M EMIFA Config 0x7800 0000 0x7FFF FFFF 128M DDR2 EMIF Config 0x8000 0000 0x8FFF FFFF 256M Reserved 0x9000 0000 0x9FFF FFFF 256M Reserved 0xA000 0000 0xA3FF FFFF 64M EMIFA CE2 0xA400 0000 0xAFFF FFFF 256-64M Reserved 0xB000 0000 0xB3FF FFFF 64M EMIFA CE3 0xB400 0000 0xBFFF FFFF 256-64M Reserved 0xC000 0000 0xCFFF FFFF 256M Reserved 0xD000 0000 0xDFFF FFFF 256M Reserved 0xE000 0000 0xEFFF FFFF 256M DDR2 SDRAM 0xF000 0000 0xFFFF FFFF 256M Reserved

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2.5 Pin Assignments

VDD33

AHCLKX AHCLKR ACLKR ACLKX

SGMII1RXN

REFCLKN

VP2CLK0 VP2CTL1

AMUTEIN

AMUTE

AFSR

VDDT

SGMII0RXP

VDDR

REFCLKP

VP2CTL0

VP2D07

AXR7

AXR6

VDAC/

AXR9

AFSX

SGMII1RXP

SGMII0RXN

PREQ/

GP03

VP2CTL2/

VSCRUN

VP2D04

VP2D03

STCLK/

AXR8

AXR4

AXR0

SGMII1TXP

VP2CLK1/

VCLK

VP2D12/

VRXD0

VP2D06

VP2D09 VP2D02

AXR3

SGMII0TXP

SGMII0TXN

VDDA

SGMII1TXN

RSV22

VP2D13 /VRXD1

VP2D14/

VRXD2

VP2D08

AXR5

AXR1

RSV17

VP2D15/

VRXD3

VP2D17/

VTXD1

VP2D16/

VTXD0

VP2D19/

VTXD3

VP2D18/

VTXD2

VP2D05

AXR2

MDIO

MDCLK

VDDD

PINTA/

GP02

PRST/

GP01

VP3CLK0/

AECLKIN

VP3CTL0/

ASDWE

VP3D05/

AED03

VP3D04/

AED02

VP3D03/

AED01

VP3D02/

AED00

VP3CTL1/

ARNW

VP3D12/

AED08

VP3D09/

AED07

VP3D08/

AED06

VP3D07/

AED05

VP3D06/

AED04

VDDESS

VP3CLK1/

AECLK

OUT

VP3CTL2/

AOE

VP3D16/

AED12

VP3D15/

AED11

VP3D14/

AED10

VP3D13/

AED09

PLLV1

VP3D17/

AED13

VP3D19/

AED15

VP3D18/

AED14

CLKIN1

RSV9

SYSCLK4

VP4D03/

ABE01

VP4D04/

AEA10

VP4D05 V

VDD

1 2

5 6

8 9 10

11 12

VDD33

RSV21

VDDA

VDD

VDD33

VDD

VDD33

VDDA

VDD33

VDDESS

VDDT

VDD

Extensive use of pin multiplexing is used to accommodate the largest number of peripheral functions in the smallest possible package. Pin multiplexing is controlled using a combination of hardware configuration at device reset and software programmable register settings. For more information on pin muxing, see Section 3.2.6 , PINMUX Register.

2.5.1 Pin Map (Bottom View)

Figure 2-2 through Figure 2-5 show the bottom view of the ZUT package pin assignments in four

quadrants (A, B, C, and D).

TMS320DM647/TMS320DM648

Digital Media Processor

SPRS372 – MAY 2007

Figure 2-2. ZUT Pin Map [Top Left Quadrant]

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AD26/

HD26

AD22/ HD22

PCLK/

HHWIL

PCBE1

HDS2

PIRDY

HRDY

AD14/

HD14

PCBE0/

GP04

AD02/ HD02

AD04/

HD04

AD27/

HD27

AD23/ HD23

AD17/

HD17

AD12/

HD12

AD08/ HD08

AD05/ HD05

AD01/

HD01

AD28/

HD28

PIDSEL/

GP06

GP05

AD18/

HD18

PFRAME

HINT/

PTRDY/

AD15/

HD15

AD13/

HD13

AD09/ HD09

AD06/ HD06

AD00/

HD00

AD03/

HD03

AD29/

HD29

PCBE3/

GP07

AD19/

HD19

AD16/

HD16

PDEVSEL

/HCNTL1

PSTOP

/HCNTL0

AD11/

HD11

AD10/ HD10

AD07/ HD07

VP0CTL0 VP0CLK0

AD30/

HD30

AD24/ HD24

AD20/

HD20

PPERR

HCS

/ PSERR/

HDS1

PPAR/

HAS

VP0D02 VP0D06

AD31/

HD31

AD25/ HD25

AD21/

HD21

VP0D03

VP0D05 VP0D09

VP0D012/

GP12

VP0CTL1 VP0CLK1

VP0D04 VP0D08 VP0D16 VP0D18 VP0D17

VP0CTL2

VP0D07

VP0D14/

GP14

VP0D15/

GP15

VP0D13/

GP13

VP0D19

VP1D02/

GP16

VP1D07/

GP21

VP1D06/

GP20

VP1D05/

GP19

VP1CTL0

VP1D04/

GP18

VP1D03/

GP17

VP1D14/

GP26

VP1D13/

GP25

VP1CTL1 VP1CLK0

VP1D17/

GP29

VP1D12/

GP24

VP1D09/

GP23

VP1D08/

GP22

VP1CTL2 VP1CLK1

VDD

VDD33

VP1D16/

GP28

VP1D19/

GP31

VP1D15/

GP27

VP1D18/

GP30

13 14 15 16 17 18 19 20 21 22 23

VDD33

PCBE2

HRW

PGNT/

GP00

VDD33

VDD

VDD33

VDD

TMS320DM647/TMS320DM648 Digital Media Processor

SPRS372 – MAY 2007

Figure 2-3. ZUT Pin Map [Top Right Quadrant]

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VP4CLK0/

AARDY

1 2 3

8 9 10 11

VP4D02/

ABE00

VP4D06/

ACE2

VP4D07/

ACE3

VP4D08/

AEA00

VDD33

VP4CLK1

VP4CTL2/

AADS

VP4D09/

AEA01

VP4D12/

AEA02

VP4D14/

AEA04

VP4D13/

AEA03

VP4CTL1/

ABA1

VP4CTL0/

ABA0

VP4D16/

AEA06

VP4D15/

AEA05

VP4D19/

AEA09

VP4D18/

AEA08

VP4D17/

AEA07

VDD

UHPIEN

HPIWIDTH/

AEA16

AEA23

RSV_BOOT/

AEA15

RSV7

VDD1

EMIB

WIDTH/

AEA22

FASTBOOT

/AEA21

PCI66/ AEA18

VDD18

CLKIN2

DEVICE

ENABLE0/

AEA20

BOOT

MODE3/

AEA14

BOOT

MODE0/

AEA11

BOOT

MODE1/

AEA12

AECLKIN

SEL/

AEA17

BOOT

MODE2/

AEA13

RSV18

BBA1

RSV11RSV12

AEA19

VDD18

BED05

BSDDQM0

BED00

BBA0

BEA12

RSV14

RSV4

BSDDQM1

BSDDQ

GATE1

BED06

BSDDQ

GATE0

BSDCAS BSDWE

RSV10

BED11

BED09

BED07

BED03

BED01

REFSSTL

BEA06

BED12

BED15

BED10

BED08

BED04

BED02

RSV15

BSDCKE

BBA2

RSV20

BED13

BED14

BSDDQS1N BSDDQS1P BSDDQS0N BSDDQS0P

VDLL1

BECLKOUTP

BECLKOUTN

BEA08

VDD18

VDD

VDD33

VDD

RSV8

VDD33

PLLV2

VDD18

BCE

BEA13

RSV13

BSDRAS

RSV3

RSV6 RSV5

RSV19

VDD18

DD18MON

VDD18

TMS320DM647/TMS320DM648

Digital Media Processor

SPRS372 – MAY 2007

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Figure 2-4. ZUT Pin Map [Bottom Left Quadrant]

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PRODUCT PREVIEW

CCMON

VDD18

VDD33

13 14 15 16 17 18 19 20 21 22 23

VDD

EMU4

RSV2 TMS

TRST

EMU11

EMU9

EMU3

EMU2 EMU1 EMU0

VDD1

RESET

EMU6

EMU5

TDI

TDO

DD33MON

RESETSTAT

EMU8EMU10

EMU7

TCLK

NMI

POR

SPIDI/

UARTRTS

BEODT1

BEA02

SPICS2/

UARTRX

SPICLK

SPIDO/

UART/

CTS

BEODT0

BEA03

BSDDQM2

BED19

BED23

BSDDQ

GATE2

BED31

SPICS1/ UARTTX

SDA0

BEA04 BEA00 BED18

BED22

BED25

BED28

SCL0

T1INP12/

GP10

T1OUT12/

GP11

BEA05 BEA01

BED17 BED21 BED24 BED27

BED30

T0INP12/

GP08

T0OUT12/

GP09

BEA09

BED16 BED20 BED26

BED29

BSDDQ

GATE3

RSV16

BEA10

BEA11

BEA07

BSDDQS2N

BSDDQS2P

BSDDQS3N BSDDQS3P

BSDDQM3

VDLL2

VDD

RSV1

VDD

VDD33

VDD

VDD33

VDD18

VDD33

VDD18

VDD33

VDD18

TMS320DM647/TMS320DM648 Digital Media Processor

SPRS372 – MAY 2007

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Figure 2-5. ZUT Pin Map [Bottom Right Quadrant]

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2.6 Terminal Functions

TMS320DM647/TMS320DM648

Digital Media Processor

SPRS372 – MAY 2007

The terminal functions tables (Table 2-4 through Table 2-5 ) identify the external signal names, the associated pin (ball) numbers along with the mechanical package designator, the pin type, whether the pin has any internal pullup or pulldown resistors, and a functional pin description. For more detailed information on device configuration, peripheral selection, multiplexed/shared pin, and debugging considerations, see Section 3 .

All device boot and configuration pins are multiplexed with functional pins. These pins function as device boot and configuration pins only during device reset. When both the reset pin ( RESET) and the power-on reset pin ( POR) are deasserted, the input states of these multiplexed device boot and configuration pins are sampled and latched into the BOOTCFG register. For proper device operation, these pins must be pulled up/down to the desired value via an external resistor.

Table 2-4. TERMINAL FUNCTIONS

TERMINAL NAME NO TYPE INTERNAL OPER DESCRIPTION

CLKIN1 M1 I IPD 3.3 V Clock Input for PLL1 CLKIN2 F1 I IPD 3.3 V Clock Input for PLL2 REFCLKN AC11 I Differential Reference Clock input (negative) for SGMII REFCLKP AB11 I Differential Reference Clock input (positive) for SGMII PLLV1 N3 A 1.8 V 1.8-V I/O Supply Voltage for PLL1 PLLV2 G7 A 1.8 V 1.8-V I/O Supply Voltage for PLL2 SYSCLK4 M3 I/O/Z IPD 3.3 V Clock out of device speed/4

TCLK H23 I IPU 3.3 V JTAG Test Port Clock TDI J22 I IPU 3.3 V JTAG Test Port Data In TDO J23 OZ IPU 3.3 V JTAG Test Port Data Out TMS L22 I IPU 3.3 V JTAG Test Port Mode Select TRST L23 I IPD 3.3 V JTAG Test Port Reset EMU0 K23 I/O/Z IPU 3.3 V JTAG Test Port Emulation 0 EMU1 K22 I/O/Z IPU 3.3 V JTAG Test Port Emulation 1 EMU2 K21 I/O/Z IPU 3.3 V JTAG Test Port Emulation 2 EMU3 K20 I/O/Z IPU 3.3 V JTAG Test Port Emulation 3 EMU4 L18 I/O/Z IPU 3.3 V JTAG Test Port Emulation 4 EMU5 J21 I/O/Z IPU 3.3 V JTAG Test Port Emulation 5 EMU6 K19 I/O/Z IPU 3.3 V JTAG Test Port Emulation 6 EMU7 H21 I/O/Z IPU 3.3 V JTAG Test Port Emulation 7 EMU8 J20 I/O/Z IPU 3.3 V JTAG Test Port Emulation 8 EMU9 H20 I/O/Z IPU 3.3 V JTAG Test Port Emulation 9 EMU10 J19 I/O/Z IPU 3.3 V JTAG Test Port Emulation 10 EMU11 K18 I/O/Z IPU 3.3 V JTAG Test Port Emulation 11

NMI J18 I IPD 3.3 V Non maskable Interrupt RESETSTAT H19 O 3.3 V Reset Status Pin RESET G20 I 3.3 V Device Reset POR H18 I 3.3 V Power On Reset

HOST-PORT INTERFACE (HPI) or PERIPHERAL COMPONENT INTERCONNECT (PCI) or GPIO[0:7]

PULLUP/ VOLT

PULLDOWN

Clock/PLL Configuration

JTAG

RESET/INTERRUPTS

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TERMINAL NAME NO TYPE INTERNAL OPER DESCRIPTION

AD00/HD00 AA22 I/O/Z IPD 3.3 V Host Port data [15:00] pin or PCI data-address bus [15:00] AD01/HD01 AB22 I/O/Z IPD 3.3 V AD02/HD02 AC21 I/O/Z IPD 3.3 V AD03/HD03 AA23 I/O/Z IPD 3.3 V AD04/HD04 AC22 I/O/Z IPD 3.3 V AD05/HD05 AB21 I/O/Z IPD 3.3 V AD06/HD06 AA21 I/O/Z IPD 3.3 V AD07/HD07 Y21 I/O/Z IPD 3.3 V AD08/HD08 AB20 I/O/Z IPD 3.3 V AD09/HD09 AA20 I/O/Z IPD 3.3 V AD10/HD10 Y20 I/O/Z IPD 3.3 V AD11/HD11 Y19 I/O/Z IPD 3.3 V AD12/HD12 AB18 I/O/Z IPD 3.3 V AD13/HD13 AA19 I/O/Z IPD 3.3 V AD14/HD14 AC18 I/O/Z IPD 3.3 V AD15/HD15 AA18 I/O/Z IPD 3.3 V AD16/HD16 Y16 I/O/Z IPD 3.3 V Host Port data [31:16] pin or PCI data-address bus [31:16] AD17/HD17 AB15 I/O/Z IPD 3.3 V AD18/HD18 AA15 I/O/Z IPD 3.3 V AD19/HD19 Y15 I/O/Z IPD 3.3 V AD20/HD20 W15 I/O/Z IPD 3.3 V AD21/HD21 V15 I/O/Z IPD 3.3 V AD22/HD22 AC14 I/O/Z IPD 3.3 V AD23/HD23 AB14 I/O/Z IPD 3.3 V AD24/HD24 W14 I/O/Z IPD 3.3 V AD25/HD25 V14 I/O/Z IPD 3.3 V AD26/HD26 AC13 I/O/Z IPD 3.3 V AD27/HD27 AB13 I/O/Z IPD 3.3 V AD28/HD28 AA13 I/O/Z IPD 3.3 V AD29/HD29 Y13 I/O/Z IPD 3.3 V AD30/HD30 W13 I/O/Z IPD 3.3 V AD31/HD31 V13 I/O/Z IPD 3.3 V PPAR/ HAS W19 I/O/Z IPU 3.3 V Host address strobe (I) or PCI parity [default] PSTOP/HCNTL0 Y18 I/O/Z IPD 3.3 V Host Control selects between control, address, or data registers (I)

PDEVSEL/HCNTL1 Y17 I/O/Z IPD 3.3 V Host Control selects between control, address, or data registers (I)

PPERR/ HCS W17 I/O/Z IPU 3.3 V Host chip select (I) or PCI parity error [default] PSERR/ HDS1 W18 I/O/Z IPU 3.3 V Host data strobe 1 (I) or PCI system error [default] PCBE0/GP04 AC20 I/O/Z IPU 3.3 V PCI command/byte enable 0 or GP[2] [default PCBE1/ HDS2 AC17 I IPU 3.3 V PCI command/byte enable 1 or host data strobe 2 PCBE2/ HRW W16 I/O/Z IPU 3.3 V PCI command/byte enable 2 or host read or write select (I) PCBE3/GP07 Y14 I/O/Z IPU 3.3 V PCI command/byte enable 3 or GPIO[7] PCLK/HHWIL AC15 I/O/Z IPU 3.3 V PCI clock (I) [default] or host half-word select - first or second

PFRAME/ HINT AA16 I/O/Z IPD 3.3 V PCI frame or host interrupt from DSP to host (O/Z)

Table 2-4. TERMINAL FUNCTIONS (continued)

PULLUP/ VOLT

PULLDOWN

[default]

or PCI Stop [default]

or PCI Device Select [default]

half-word (not necessarily high or low order) [For HPI16 bus width selection only] (I)

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TMS320DM647/TMS320DM648

Digital Media Processor

SPRS372 – MAY 2007

Table 2-4. TERMINAL FUNCTIONS (continued)

TERMINAL NAME NO TYPE INTERNAL OPER DESCRIPTION

PIRDY/ HRDY AB17 I/O/Z IPD 3.3 V PCI initiator ready [default] or host ready from DSP to host (O/Z) PGNT/GP00 U13 I/O/Z IPD 3.3 V PCI bus grant (I) or GPIO[0] PRST/GP01 U12 I/O/Z IPD 3.3 V PCI Reset (I) or GPIO[1] PINTA/GP02 V12 I/O/Z IPD 3.3 V PCI Interrupt A (O/Z) or GPIO[2] PREQ/GP03 AA12 I/O/Z IPD 3.3 V PCI bus request (O/Z) or GPIO[3] PTRDY/GP05 AA17 I/O/Z IPD 3.3 V PCI target ready or GPIO[5] PIDSEL/GP06 AA14 I/O/Z IPD 3.3 V PCI Initialization device select (I) or GPIO[6]

BBA0 C12 I/O/Z 1.8 V DDR2 Memory Controller Bank Address Control BBA1 B12 I/O/Z 1.8 V BBA2 E11 I/O/Z 1.8 V BCE F9 I/O/Z 1.8 V DDR2 Memory Controller Memory Space Enable BEA00 D15 I/O/Z 1.8 V DDR2 Memory Controller External Address BEA01 C15 I/O/Z 1.8 V BEA02 F13 I/O/Z 1.8 V BEA03 E14 I/O/Z 1.8 V BEA04 D14 I/O/Z 1.8 V BEA05 C14 I/O/Z 1.8 V BEA06 F11 I/O/Z 1.8 V BEA07 B14 I/O/Z 1.8 V BEA08 F12 I/O/Z 1.8 V BEA09 D13 I/O/Z 1.8 V BEA10 A13 I/O/Z 1.8 V BEA11 B13 I/O/Z 1.8 V BEA12 E12 I/O/Z 1.8 V BEA13 F10 I/O/Z 1.8 V BECLKOUTN A12 I/O/Z 1.8 V DDR2 Memory Controller Output Clock (CLKIN2 frequency x 10) BECLKOUTP A11 I/O/Z 1.8 V Negative DDR2 Memory Controller Output Clock (CLKIN2

BED00 E9 I/O/Z 1.8 V DDR2 Memory Controller External Data BED01 C9 I/O/Z 1.8 V BED02 B9 I/O/Z 1.8 V BED03 C8 I/O/Z 1.8 V BED04 E8 I/O/Z 1.8 V BED05 D8 I/O/Z 1.8 V BED06 C7 I/O/Z 1.8 V BED07 E7 I/O/Z 1.8 V BED08 C6 I/O/Z 1.8 V BED09 B7 I/O/Z 1.8 V

PULLUP/ VOLT

PULLDOWN

DDR2 MEMORY CONTROLLER

frequency x 10)

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TMS320DM647/TMS320DM648 Digital Media Processor

SPRS372 – MAY 2007

TERMINAL NAME NO TYPE INTERNAL OPER DESCRIPTION

BED10 D6 I/O/Z 1.8 V DDR2 Memory Controller External Data (continued) BED11 A3 I/O/Z 1.8 V BED12 B3 I/O/Z 1.8 V BED13 A4 I/O/Z 1.8 V BED14 B4 I/O/Z 1.8 V BED15 C5 I/O/Z 1.8 V BED16 B16 I/O/Z 1.8 V BED17 C16 I/O/Z 1.8 V BED18 D16 I/O/Z 1.8 V BED19 E16 I/O/Z 1.8 V BED20 B17 I/O/Z 1.8 V BED21 C17 I/O/Z 1.8 V BED22 D17 I/O/Z 1.8 V BED23 E17 I/O/Z 1.8 V BED24 C18 I/O/Z 1.8 V BED25 D18 I/O/Z 1.8 V BED26 B19 I/O/Z 1.8 V BED27 C19 I/O/Z 1.8 V BED28 B20 I/O/Z 1.8 V BED29 D19 I/O/Z 1.8 V BED30 C20 I/O/Z 1.8 V BED31 E19 I/O/Z 1.8 V BEODT0 E13 I/O/Z 1.8 V On-die termination signals to external DDR2 SDRAM. These pins BEODT1 A14 I/O/Z 1.8 V

BSDCAS D10 I/O/Z 1.8 V DDR2 Memory Controller SDRAM column address strobe BSDCKE B11 I/O/Z 1.8 V DDR2 Memory Controller SDRAM clock-enable BSDDQGATE0 D7 I/O/Z 1.8 V DDR2 Memory Controller data strobe Gate BSDDQGATE1 B6 I/O/Z 1.8 V BSDDQGATE2 E18 I/O/Z 1.8 V BSDDQGATE3 A21 I/O/Z 1.8 V BSDDQM0 B8 I/O/Z 1.8 V DDR2 Memory Controller byte-enable controls. Decoded from the BSDDQM1 D5 I/O/Z 1.8 V BSDDQM2 E15 I/O/Z 1.8 V BSDDQM3 B21 I/O/Z 1.8 V BSDDQS0P A9 I/O/Z 1.8 V DDR2 Memory Controller data strobe [3:0] BSDDQS1P A7 I/O/Z 1.8 V BSDDQS2P A17 I/O/Z 1.8 V BSDDQS3P A20 I/O/Z 1.8 V BSDDQS0N A8 I/O/Z 1.8 V DDR2 Memory Controller data strobe [3:0] negative BSDDQS1N A6 I/O/Z 1.8 V BSDDQS2N A16 I/O/Z 1.8 V BSDDQS3N A19 I/O/Z 1.8 V BSDRAS E10 I/O/Z 1.8 V DDR2 Memory Controller SDRAM row address strobe BSDWE D11 I/O/Z 1.8 V DDR2 Memory Controller SDRAM write enable

Table 2-4. TERMINAL FUNCTIONS (continued)

PULLUP/ VOLT

PULLDOWN

are reserved for future use and should not be connected to the DDR2 SDRAM. Note: There are no on-die termination resistors implemented on the DM647/DM648DSP die.

low-order address bits. The number of address bits or byte enables used depends on the width of external memory. Byte-write enables for most types of memory. Can be directly connected to SDRAM read and write mask signal (SDQM).

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TMS320DM647/TMS320DM648

Digital Media Processor

SPRS372 – MAY 2007

Table 2-4. TERMINAL FUNCTIONS (continued)

TERMINAL NAME NO TYPE INTERNAL OPER DESCRIPTION

DEVICEENABLE0/AE F2 I/O/Z IPD 3.3 V EMIFA External Address 20 (word address) (O/Z) For proper A20 device operation, this pin must be externally pulled up with a 1-k Ω

EMIFAWIDTH/AEA22 G3 I/O/Z IPD 3.3 V EMIFA External Address 22 (word address) (O/Z) EMIFA data bus

FASTBOOT/AEA21 G2 I/O/Z IPD 3.3 V EMIFA External Address 22 (word address) (O/Z) Enables FAST

UHPIEN H2 I IPD 3.3 V UHPI enable pin. This pin controls the selection (enable/disable) of

HPIWIDTH/AEA16 H3 I/O/Z IPD 3.3 V EMIFA External Address 16 (word address) (O/Z) HPI peripheral

RSVBOOT/AEA15 H6 I/O/Z IPU 3.3 V EMIFA External Address 15 (word address) (O/Z) For proper

PCI66/AEA18 G5 I/O/Z IPD 3.3 V PCI Frequency Selection (PCI66). The PCI peripheral must be

BOOTMODE0/AEA11 F3 I/O/Z IPD 3.3 V 0000 Master mode - Emulation Boot BOOTMODE1/AEA12 F4 BOOTMODE2/AEA13 F5 BOOTMODE3/AEA14 G6

SCL0 D22 I/O/Z 3.3 V I2C clock. When the I2C module is used, use an external pullup

SDA0 C23 I/O/Z 3.3 V I2C data. When I2C is used, make certain there is an external

PULLUP/ VOLT

PULLDOWN

CONFIGURATION AND EMIFA

resistor at device reset

width selection pin state captured at the rising edge of RESET. 0 sets EMIFA CS2 to 8 bit data bus width 1 sets EMIFA CS2 to 16 bit data bus width. For details. see

Section 3 .

BOOT of the device. For details see Section 3 .

the HPI and GPIO[0:7] muxed with PCI. For details see Section 3 .

bus width (HPI_WIDTH) select [Applies only when HPI is enabled; UHPIEN pin = 1]

device operation, this pin must be externally pulled up with a 1-k Ω resistor at device reset

enabled (UHPIEN = 0) to use this function.PCI66_AEA18 selects the PCI operating frequency of 66 MHz or 33 MHz. PCI operating frequency is selected at reset via the pullup/pulldown resistor on the PCI66 pin:AEA18: 0 - PCI operates at 33 MHz (default) 1 - PCI operates at 66 MHz.

0001 Slave mode - HPI Boot (if UHPIEN = 1)

or PCI Boot (if UHPIEN = 0) without auto-initialization

0010 Slave mode - HPI Boot (if UHPIEN = 1)

or PCI Boot (if UHPIEN = 0) with auto-initialization 0011 Master mode - UART boot without flow control 0100 Master mode - EMIFA CS2 direct/fast boot 0101 Master mode - I2C boot 0110 Master mode - SPI boot 0111 Reserved 1000 Master mode - 3-port Ethernet Subsystem boot through

SGMII0 for DM647 only

Reserved in DM648 1001 Master mode - 3-port Ethernet Subsystem boot through

SGMII0 for DM648 only

Reserved in DM647 1010 Master mode - 3-port Ethernet Subsystem boot through

SGMII1 for DM648 only

Reserved in DM647 1011 Reserved 1100 Reserved 1101 Reserved 1110 Master mode - UART boot with flow control 1111 Reserved

INTER-INTEGRATED CIRCUIT (I2C)

resistor.

pullup resistor.

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TMS320DM647/TMS320DM648 Digital Media Processor

SPRS372 – MAY 2007

TERMINAL NAME NO TYPE INTERNAL OPER DESCRIPTION

SGMII0RXN AA10 I 1.2 V Differential SGMII port 0 RX input (negative) SGMII0RXP AA9 I 1.2 V Differential SGMII port 0 RX input (positive) SGMII0TXN W11 O 1.2 V Differential SGMII port 0 TX output (negative) SGMII0TXP Y11 O 1.2 V Differential SGMII port 0 TX output (positive) SGMII1RXN AC9 I 1.2 V Differential SGMII port 1 RX input (negative) SGMII1RXP AB9 I 1.2 V Differential SGMII port 1 RX input (positive) SGMII1TXN W9 O 1.2 V Differential SGMII port 1 TX output (negative) SGMII1TXP W8 O 1.2 V Differential SGMII port 1 TX output (positive) MDCLK U9 OZ IPD 3.3 V MDIO serial clock (MDCLK) MDIO U8 I/O/Z IPU 3.3 V MDIO serial data (MDIO)

SPICLK F22 I/O/Z IPU 3.3 V SPI clock output SPICS1/UARTTX D23 I/O/Z IPU 3.3 V SPI chip select 1 or UART transmit (O/Z) SPICS2/UARTRX F23 I/O/Z IPU 3.3 V SPI chip select 2 or UART receive SPIDI/UARTRTS G23 I/O/Z IPU 3.3 V SPI data input or UART ready to send (O/Z) SPIDO/UARTCTS F21 I/O/Z IPU 3.3 V SPI data output or UART clear to send

T0INP12/GP08 E20 I/O/Z IPD 3.3 V Timer 0 input pin for lower 32-bit counter (I) or GPIO 8 T0OUT12/GP09 D21 I/O/Z IPD 3.3 V Timer 0 output pin for lower 32-bit counter (O/Z) or GPIO 9 T1INP12/GP10 E21 I/O/Z IPD 3.3 V Timer 1 input pin for lower 32-bit counter (I) or GPIO 10 T1OUT12/GP11 C22 I/O/Z IPD 3.3 V Timer 1 output pin for lower 32-bit counter(O/Z) or GPIO 11

AHCLKR AC4 I/O/Z IPD 3.3 V McASP receive high-frequency master clock AHCLKX AC3 I/O/Z IPD 3.3 V McASP transmit high-frequency master clock ACLKR AC6 I/O/Z IPD 3.3 V McASP receive master clock ACLKX AC7 I/O/Z IPD 3.3 V McASP transmit master clock AFSR W6 I/O/Z IPD 3.3 V McASP receive frame sync or left/right clock (LRCLK) AFSX AA7 I/O/Z IPD 3.3 V McASP transmit frame sync or left/right clock (LRCLK) AXR0 AB6 I/O/Z IPD 3.3 V McASP data pin [0:7] AXR1 Y6 IPD 3.3 V AXR2 AA6 IPD 3.3 V AXR3 AB4 IPD 3.3 V AXR4 Y5 IPD 3.3 V AXR5 V7 IPD 3.3 V AXR6 AA4 IPD 3.3 V AXR7 V6 IPD 3.3 V STCLK/AXR8 Y7 I/O/Z IPD 3.3 V The STCLK signal drives the hardware counter for use by the

VDAC/AXR9 AA5 I/O/Z IPD 3.3 V VCXO Interpolated Control Port (VIC) single-bit digital-to-analog

AMUTEIN AB3 I/O/Z IPD 3.3 V McASP mute input AMUTE U7 I/O/Z IPD 3.3 V McASP mute output (O/Z).

VP0CLK0 Y23 I IPU 3.3 V Video Port 0 Clock 0 (I) VP0CLK1 V23 I/O/Z IPU 3.3 V Video Port 0 Clock 1

Table 2-4. TERMINAL FUNCTIONS (continued)

PULLUP/ VOLT

PULLDOWN

SGMII0/1 and MDIO

SPI or UART

TIMER 0/1 or GPIO[8:11]

MCASP OR VIDEO PORT OR VIC

video ports (I) or McASP data pin 8.

converter(VDAC) output (O) or McASP data pin 9

VIDEO PORT 0 OR GPIO[12:15]

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TMS320DM647/TMS320DM648

Table 2-4. TERMINAL FUNCTIONS (continued)

TERMINAL NAME NO TYPE INTERNAL OPER DESCRIPTION

PULLUP/ VOLT

PULLDOWN

VP0CTL0 Y22 I/O/Z IPU 3.3 V Video Port 0 Control 0 VP0CTL1 V22 I/O/Z IPU 3.3 V Video Port 0 Control 1 VP0CTL2 U23 I/O/Z IPU 3.3 V Video Port 0 Control 2 VP0D02 W20 I/O/Z IPD 3.3 V Video Port 0 Data 2 VP0D03 V18 I/O/Z IPD 3.3 V Video Port 0 Data 3 VP0D04 U18 I/O/Z IPD 3.3 V Video Port 0 Data 4 VP0D05 V19 I/O/Z IPD 3.3 V Video Port 0 Data 5 VP0D06 W21 I/O/Z IPD 3.3 V Video Port 0 Data 6 VP0D07 T18 I/O/Z IPD 3.3 V Video Port 0 Data 7 VP0D08 U19 I/O/Z IPD 3.3 V Video Port 0 Data 8 VP0D09 V20 I/O/Z IPD 3.3 V Video Port 0 Data 9 VP0D12/GP12 V21 I/O/Z IPD 3.3 V Video Port 0 Data 12 or GPIO 12 VP0D13/GP13 T19 I/O/Z IPD 3.3 V Video Port 0 Data 13 or GPIO 13 VP0D14/GP14 T20 I/O/Z IPD 3.3 V Video Port 0 Data 14 or GPIO 14 VP0D15/GP15 T21 I/O/Z IPD 3.3 V Video Port 0 Data 15 or GPIO 15 VP0D16 U20 I/O/Z IPD 3.3 V Video Port 0 Data 16 VP0D17 U22 I/O/Z IPD 3.3 V Video Port 0 Data 17 VP0D18 U21 I/O/Z IPD 3.3 V Video Port 0 Data 18 VP0D19 R18 I/O/Z IPD 3.3 V Video Port 0 Data 19

VIDEO PORT 1 OR GPIO[16:31]

VP1CLK0 P23 I IPU 3.3 V Video Port 1 Clock 0 VP1CLK1 N23 I/O/Z IPU 3.3 V Video Port 1 Clock 1 VP1CTL0 R23 I/O/Z IPU 3.3 V Video Port 1 Control 0 VP1CTL1 P22 I/O/Z IPU 3.3 V Video Port 1 Control 1 VP1CTL2 N22 I/O/Z IPU 3.3 V Video Port 1 Control 2 VP1D02/GP16 R19 I/O/Z IPD 3.3 V Video Port 1 Data 2 or GPIO 16 VP1D03/GP17 P19 I/O/Z IPD 3.3 V Video Port 1 Data 3 or GPIO 17 VP1D04/GP18 P18 I/O/Z IPD 3.3 V Video Port 1 Data 4 or GPIO 18 VP1D05/GP19 R22 I/O/Z IPD 3.3 V Video Port 1 Data 5 or GPIO 19 VP1D06/GP20 R21 I/O/Z IPD 3.3 V Video Port 1 Data 6 or GPIO 20 VP1D07/GP21 R20 I/O/Z IPD 3.3 V Video Port 1 Data 7 or GPIO 21 VP1D08/GP22 N21 I/O/Z IPD 3.3 V Video Port 1 Data 8 or GPIO 22 VP1D09/GP23 N20 I/O/Z IPD 3.3 V Video Port 1 Data 9 or GPIO 23 VP1D12/GP24 N19 I/O/Z IPD 3.3 V Video Port 1 Data 12 or GPIO 24 VP1D13/GP25 P21 I/O/Z IPD 3.3 V Video Port 1 Data 13 or GPIO 25 VP1D14/GP26 P20 I/O/Z IPD 3.3 V Video Port 1 Data 14 or GPIO 26 VP1D15/GP27 M20 I/O/Z IPD 3.3 V Video Port 1 Data 15 or GPIO 27 VP1D16/GP28 M18 I/O/Z IPD 3.3 V Video Port 1 Data 16 or GPIO 28 VP1D17/GP29 N18 I/O/Z IPD 3.3 V Video Port 1 Data 17 or GPIO 29 VP1D18/GP30 M21 I/O/Z IPD 3.3 V Video Port 1 Data 18 or GPIO 30 VP1D19/GP31 M19 I/O/Z IPD 3.3 V Video Port 1 Data 19 or GPIO 31

VIDEO PORT 2 OR VLYNQ

VP2CLK0 AB1 I IPU 3.3 V Video Port 2 Clock 0 (I) VP2CLK1/VCLK W1 I/O/Z IPU 3.3 V Video Port 2 Clock 1 or VLYNQ Clock (I/O) VP2CTL0 AA1 I/O/Z IPU 3.3 V Video Port 2 Control 0 VP2CTL1 AB2 I/O/Z IPU 3.3 V Video Port 2 Control 1

Digital Media Processor

SPRS372 – MAY 2007

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TMS320DM647/TMS320DM648 Digital Media Processor

SPRS372 – MAY 2007

TERMINAL NAME NO TYPE INTERNAL OPER DESCRIPTION

VP2CTL2/ VSCRUN Y1 I/O/Z IPU 3.3 V Video Port 2 Control 2 or VLYNQ serial clock run request (I/O) VP2D02 W5 I/O/Z IPD 3.3 V Video Port 2 Data 2 VP2D03 AA2 I/O/Z IPD 3.3 V Video Port 2 Data 3 VP2D04 Y3 I/O/Z IPD 3.3 V Video Port 2 Data 4 VP2D05 U6 I/O/Z IPD 3.3 V Video Port 2 Data 5 VP2D06 Y2 I/O/Z IPD 3.3 V Video Port 2 Data 6 VP2D07 W3 I/O/Z IPD 3.3 V Video Port 2 Data 7 VP2D08 V5 I/O/Z IPD 3.3 V Video Port 2 Data 8 VP2D09 W4 I/O/Z IPD 3.3 V Video Port 2 Data 9 VP2D12/VRXD0 W2 I/O/Z IPD 3.3 V Video Port 2 Data 12 or VLYNQ receive data pin [0] (I) VP2D13/VRXD1 V3 I/O/Z IPD 3.3 V Video Port 2 Data 13 or VLYNQ receive data pin [1] (I) VP2D14/VRXD2 V4 I/O/Z IPD 3.3 V Video Port 2 Data 14 or VLYNQ receive data pin [2] (I) VP2D15/VRXD3 U1 I/O/Z IPD 3.3 V Video Port 2 Data 15 or VLYNQ receive data pin [3] (I) VP2D16/VTXD0 U3 I/O/Z IPD 3.3 V Video Port 2 Data 16 or VLYNQ transmit data pin [0] (O) VP2D17/VTXD1 U2 I/O/Z IPD 3.3 V Video Port 2 Data 17 or VLYNQ transmit data pin [1] (O) VP2D18/VTXD2 U5 I/O/Z IPD 3.3 V Video Port 2 Data 18 or VLYNQ transmit data pin [2] (O) VP2D19/VTXD3 U4 I/O/Z IPD 3.3 V Video Port 2 Data 19 or VLYNQ transmit data pin [3] (O)

VP3CLK0/AECLKIN T1 I IPD 3.3 V Video Port 3 Clock 0 (I) or EMIFA external input clock (I) VP3CLK1/AECLKOU P1 I/O/Z IPD 3.3 V Video Port 3 Clock 1 or EMIFA output clock (O/Z)

T VP3CTL0/ ASDWE T2 I/O/Z IPU 3.3 V Video Port 3 Control 0 or Asynchronous memory write

VP3CTL1/ARNW R1 I/O/Z IPU 3.3 V Video Port 3 Control 1 or Asynchronous memory read/write (O/Z) VP3CTL2/AOE P2 I/O/Z IPU 3.3 V Video Port 3 Control 2 or Asynchronous/Programmable

VP3D02/AED00 T6 I/O/Z IPU 3.3 V Video Port 3 Data 2 or EMIFA External Data 0 VP3D03/AED01 T5 I/O/Z IPU 3.3 V Video Port 3 Data 3 or EMIFA External Data 1 VP3D04/AED02 T4 I/O/Z IPU 3.3 V Video Port 3 Data 4 or EMIFA External Data 2 VP3D05/AED03 T3 I/O/Z IPU 3.3 V Video Port 3 Data 5 or EMIFA External Data 3 VP3D06/AED04 R6 I/O/Z IPU 3.3 V Video Port 3 Data 6 or EMIFA External Data 4 VP3D07/AED05 R5 I/O/Z IPU 3.3 V Video Port 3 Data 7 or EMIFA External Data 5 VP3D08/AED06 R4 I/O/Z IPU 3.3 V Video Port 3 Data 8 or EMIFA External Data 6 VP3D09/AED07 R3 I/O/Z IPU 3.3 V Video Port 3 Data 9 or EMIFA External Data 7 VP3D12/AED08 R2 I/O/Z IPU 3.3 V Video Port 3 Data 12 or EMIFA External Data 8 VP3D13/AED09 P6 I/O/Z IPU 3.3 V Video Port 3 Data 13 or EMIFA External Data 9 VP3D14/AED10 P5 I/O/Z IPU 3.3 V Video Port 3 Data 14 or EMIFA External Data 10 VP3D15/AED11 P4 I/O/Z IPU 3.3 V Video Port 3 Data 15 or EMIFA External Data 11 VP3D16/AED12 P3 I/O/Z IPU 3.3 V Video Port 3 Data 16 or EMIFA External Data 12 VP3D17/AED13 N4 I/O/Z IPU 3.3 V Video Port 3 Data 17 or EMIFA External Data 13 VP3D18/AED14 N6 I/O/Z IPU 3.3 V Video Port 3 Data 18 or EMIFA External Data 14 VP3D19/AED15 N5 I/O/Z IPU 3.3 V Video Port 3 Data 19 or EMIFA External Data 15

VP4CLK0/AARDY L1 I IPU 3.3 V Video Port 4 Clock 0 (I) or Asynchronous memory ready input (I) VP4CLK1 K1 I/O/Z IPD 3.3 V Video Port 4 Clock 1

Table 2-4. TERMINAL FUNCTIONS (continued)

PULLUP/ VOLT

PULLDOWN

VIDEO PORT 3 OR EMIFA

enable/Programmable synchronous interface write-enable

synchronous memory output-enable (O/Z)

VIDEO PORT 4 OR EMIFA

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TMS320DM647/TMS320DM648

Digital Media Processor

SPRS372 – MAY 2007

Table 2-4. TERMINAL FUNCTIONS (continued)

TERMINAL NAME NO TYPE INTERNAL OPER DESCRIPTION

VP4CTL0/ABA0 J2 I/O/Z IPD 3.3 V Video Port 4 Control 0 or EMIFA bank address control (ABA[1:0])

VP4CTL1/ABA1 J1 I/O/Z IPD 3.3 V Video Port 4 Control 1 or EMIFA bank address control (ABA[1:0])

VP4CTL2/AADS K2 I/O/Z IPD 3.3 V Video Port 4 Control 2 or Programmable synchronous address

VP4D02/ ABE00 L2 I/O/Z IPU 3.3 V Video Port 4 Data 2 or EMIFA byte-enable control 0. Decoded

VP4D03/ ABE01 M4 I/O/Z IPU 3.3 V Video Port 4 Data 3 or EMIFA byte-enable control 1. Number of

VP4D04/AEA10 M5 I/O/Z IPU 3.3 V Video Port 4 Data 4 or EMIFA External Address 10 (word address)

VP4D05 M6 I/O/Z IPU 3.3 V Video Port 4 Data 5 VP4D06/ ACE2 L3 I/O/Z IPU 3.3 V Video Port 4 Data 6 or EMIFA memory space enable 2 VP4D07/ ACE3 L4 I/O/Z IPU 3.3 V Video Port 4 Data 7 or EMIFA memory space enable 3 VP4D08/AEA00 L5 I/O/Z IPD 3.3 V Video Port 4 Data 8 or EMIFA External Address 0 (word address)

VP4D09/AEA01 K3 I/O/Z IPD 3.3 V Video Port 4 Data 9 or EMIFA External Address 1 (word address)

VP4D12/AEA02 K4 I/O/Z IPD 3.3 V Video Port 4 Data 12 or EMIFA External Address 2 (word address)

VP4D13/AEA03 L6 I/O/Z IPD 3.3 V Video Port 4 Data 13 or EMIFA External Address 3 (word address)

VP4D14/AEA04 K5 I/O/Z IPD 3.3 V Video Port 4 Data 14 or EMIFA External Address 4 (word address)

VP4D15/AEA05 J3 I/O/Z IPD 3.3 V Video Port 4 Data 15 or EMIFA External Address 5 (word address)

VP4D16/AEA06 J4 I/O/Z IPD 3.3 V Video Port 4 Data 16 or EMIFA External Address 6 (word address)

VP4D17/AEA07 J5 I/O/Z IPD 3.3 V Video Port 4 Data 17 or EMIFA External Address 7 (word address)

VP4D18/AEA08 J6 I/O/Z IPD 3.3 V Video Port 4 Data 18 or EMIFA External Address 8 (word address)

VP4D19/AEA09 K6 I/O/Z IPD 3.3 V Video Port 4 Data 19 or EMIFA External Address 9 (word address)

AEA23 H4 OZ IPD 3.3 V EMIFA External Address 23 (word address) (O/Z) AEA19 H5 I/O/Z IPU 3.3 V EMIFA External Address 19 (word address) (O/Z)

PULLUP/ VOLT

PULLDOWN

(O/Z). Active-low bank selects for the 16-bit EMIFA. When interfacing to 16-bit asynchronous devices, ABA1 carries bit 1 of the byte address. For an 8-bit asynchronous interface, ABA[1:0] are used to carry bits 1 and 0 of the byte address.

(O/Z). Active-low bank selects for the 16-bit EMIFA. WHEN interfacing to 16-bit asynchronous devices, ABA1 carries bit 1 of the byte address. For an 8-bit asynchronous interface, ABA[1:0] are used to carry bits 1 and 0 of the byte address.

strobe or read-enable. For programmable synchronous interface, the r_enable field in the ChipSelect x Configuration Register selects between ASADS and ASRE: – If r_enable = 0, then the ASADS/ASRE signal functions as the ASADS signal. – If r_enable = 1, then the ASADS/ASRE signal functions as the ASRE signal.

from the low-order address bits. The number of address bits or byte enables used depends on the width of external memory. Byte-write enables for most types of memory.

address bits or byte enables used depends on the width of external memory. Byte-write enables for most types of memory.

(O/Z)

EMIFA

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TMS320DM647/TMS320DM648 Digital Media Processor

SPRS372 – MAY 2007

Table 2-4. TERMINAL FUNCTIONS (continued)

TERMINAL NAME NO TYPE INTERNAL OPER DESCRIPTION

AECLKINSEL/AEA17 G4 I/O/Z IPD 3.3 V Select EMIFA external clock (I) (The EMIFA input clock AECLKIN

Table 2-5. TERMINAL FUNCTIONS (GROUND and POWER SUPPLY)

PULLUP/ VOLT

PULLDOWN

or SYSCLK4 is selected at reset via the pullup/pulldown resistor on this pin. Note: AECLKIN is the default for the EMIFA input clock.) or EMIFA external address 17 (word address) (O/Z)

TERMINAL NAME NO TYPE INTERNAL OPER VOLT DESCRIPTION

A1 Ground

A5 Ground A15 Ground A18 Ground A23 Ground

C4 Ground

D9 Ground D12 Ground D20 Ground

E6 Ground

E23 Ground

F7 Ground F15 Ground F17 Ground F19 Ground

G8 Ground G10 Ground G12 Ground G14 Ground G16 Ground G18 Ground G22 Ground

H1 Ground H11 Ground H13 Ground H15 Ground H17 Ground

J8 Ground J10 Ground J12 Ground J14 Ground J16 Ground

K7 Ground

K9 Ground

K11 Ground K13 Ground K15 Ground

PULLUP/PULLD

OWN

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Table 2-5. TERMINAL FUNCTIONS (GROUND and POWER SUPPLY) (continued)

TERMINAL NAME NO TYPE INTERNAL OPER VOLT DESCRIPTION

K17 Ground

L8 Ground L10 Ground L12 Ground L14 Ground L16 Ground

M7 Ground

M9 Ground M11 Ground M13 Ground M15 Ground M17 Ground M22 Ground

N1 Ground

N8 Ground N10 Ground N12 Ground N14 Ground N16 Ground

P7 Ground

P9 Ground P11 Ground P13 Ground P15 Ground P17 Ground R10 Ground R12 Ground R14 Ground R16 Ground

T7 Ground

T9 Ground T11 Ground T13 Ground T15 Ground T17 Ground T22 Ground U14 Ground U16 Ground

V1 Ground

V9 Ground V17 Ground

W7 Ground

W22 Ground

Y9 Ground Y10 Ground AA3 Ground

PULLUP/PULLD

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Table 2-5. TERMINAL FUNCTIONS (GROUND and POWER SUPPLY) (continued)

TERMINAL NAME NO TYPE INTERNAL OPER VOLT DESCRIPTION

VDD

VDDESS

VDLL1

VDLL2

VDD1

VDDA

AA8 Ground

AA11 Ground

AB5 Ground

AB19 Ground AB23 Ground

AC1 Ground

AC8 Ground AC10 Ground AC12 Ground AC16 Ground

J9 1.2-V Core Power Supply J11 1.2-V Core Power Supply J15 1.2-V Core Power Supply

K10 1.2-V Core Power Supply K12 1.2-V Core Power Supply K14 1.2-V Core Power Supply

L9 1.2-V Core Power Supply L11 1.2-V Core Power Supply L13 1.2-V Core Power Supply L15 1.2-V Core Power Supply

M10 1.2-V Core Power Supply M12 1.2-V Core Power Supply M14 1.2-V Core Power Supply

N11 1.2-V Core Power Supply N13 1.2-V Core Power Supply N15 1.2-V Core Power Supply P10 1.2-V Core Power Supply P12 1.2-V Core Power Supply P14 1.2-V Core Power Supply R13 1.2-V Core Power Supply

N9 1.2-V Core Power Supply

T16 1.2-V Core Power Supply

R8 1.2-V Core Power Supply

R15 1.2-V Core Power Supply

V8 1.2-V Core Power Supply

R11 1.2-V Core Power Supply for Ethernet Subsystem

R9 1.2-V Core Power Supply for Ethernet Subsystem B10 1.8-V I/O supply B22 1.8-V I/O supply

H9 1.2-V Power supply for DDR, DDR I/Os, EMIF-DDR

J13 1.2-V Power supply for DDR, DDR I/Os, EMIF-DDR

V11 1.2-V SerDes Analog supply

W10 1.2-V SerDes Analog supply

PULLUP/PULLD

OWN

POWER PINS

Subsystem

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Table 2-5. TERMINAL FUNCTIONS (GROUND and POWER SUPPLY) (continued)

TERMINAL NAME NO TYPE INTERNAL OPER VOLT DESCRIPTION

VDDD

VDDR

VDDT

VDD33

VDD18

T10 1.2-V SerDes Digital Supply U10 1.2-V SerDes Digital Supply

AB10 1.8-V SerDes Analog Supply (Regulator)

AB8 1.2-V SerDes Analog Supply U11 1.2-V SerDes Analog Supply E22 3.3-V I/O supply voltage F20 3.3-V I/O supply voltage G19 3.3-V I/O supply voltage

J7 3.3-V I/O supply voltage H16 3.3-V I/O supply voltage H22 3.3-V I/O supply voltage

J17 3.3-V I/O supply voltage

K8 3.3-V I/O supply voltage K16 3.3-V I/O supply voltage

L7 3.3-V I/O supply voltage

L17 3.3-V I/O supply voltage

M8 3.3-V I/O supply voltage M16 3.3-V I/O supply voltage M23 3.3-V I/O supply voltage

N2 3.3-V I/O supply voltage

N7 3.3-V I/O supply voltage

N17 3.3-V I/O supply voltage

P8 3.3-V I/O supply voltage

P16 3.3-V I/O supply voltage

R7 3.3-V I/O supply voltage

R17 3.3-V I/O supply voltage

T8 3.3-V I/O supply voltage T12 3.3-V I/O supply voltage T14 3.3-V I/O supply voltage

G1 3.3-V I/O supply voltage T23 3.3-V I/O supply voltage AB7 3.3-V I/O supply voltage U15 3.3-V I/O supply voltage U17 3.3-V I/O supply voltage

V2 3.3-V I/O supply voltage

V16 3.3-V I/O supply voltage

W23 3.3-V I/O supply voltage

Y4 3.3-V I/O supply voltage Y8 3.3-V I/O supply voltage

AB16 3.3-V I/O supply voltage

AC2 3.3-V I/O supply voltage

AC5 3.3-V I/O supply voltage AB12 3.3-V I/O supply voltage AC19 3.3-V I/O supply voltage AC23 3.3-V I/O supply voltage

B1 1.8-V I/O supply voltage (DDR2 Memory Controller)

PULLUP/PULLD

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Table 2-5. TERMINAL FUNCTIONS (GROUND and POWER SUPPLY) (continued)

TERMINAL NAME NO TYPE INTERNAL OPER VOLT DESCRIPTION

VDD18

REFSSTL

CCMON

DD18MON

DD33MON

RSV 1 L20 A Reserved. Unconnected RSV 2 L21 A Reserved . Unconnected RSV 3 D2 O Reserved . Unconnected RSV 4 D1 O Reserved . Unconnected RSV 5 D4 O Reserved . Unconnected RSV 6 D3 O Reserved . Unconnected RSV 7 H7 A Reserved. These pins must be connected directly to V

RSV 8 H8 A Reserved. These pins must be connected directly to V

RSV 9 M2 A Reserved . Unconnected RSV 10 A2 A Reserved . Unconnected RSV 11 E2 Reserved This pin must be connected directly to V

RSV 12 E1 Reserved. This pin must be connected directly to 1.8-V

B5 1.8-V I/O supply voltage (DDR2 Memory Controller) B15 1.8-V I/O supply voltage (DDR2 Memory Controller) B18 1.8-V I/O supply voltage (DDR2 Memory Controller) B23 1.8-V I/O supply voltage (DDR2 Memory Controller)

C3 1.8-V I/O supply voltage (DDR2 Memory Controller) C10 1.8-V I/O supply voltage (DDR2 Memory Controller) C13 1.8-V I/O supply voltage (DDR2 Memory Controller) C21 1.8-V I/O supply voltage (DDR2 Memory Controller)

E5 1.8-V I/O supply voltage (DDR2 Memory Controller)

F8 1.8-V I/O supply voltage (DDR2 Memory Controller) F14 1.8-V I/O supply voltage (DDR2 Memory Controller) F16 1.8-V I/O supply voltage (DDR2 Memory Controller) F18 1.8-V I/O supply voltage (DDR2 Memory Controller)

G9 1.8-V I/O supply voltage (DDR2 Memory Controller) G11 1.8-V I/O supply voltage (DDR2 Memory Controller) G13 1.8-V I/O supply voltage (DDR2 Memory Controller) G15 1.8-V I/O supply voltage (DDR2 Memory Controller) G17 1.8-V I/O supply voltage (DDR2 Memory Controller) H10 1.8-V I/O supply voltage (DDR2 Memory Controller) H12 1.8-V I/O supply voltage (DDR2 Memory Controller) H14 1.8-V I/O supply voltage (DDR2 Memory Controller) C11 (DVDD18/2)-V reference for SSTL buffer (DDR2

L19 Die-side 1.2-V core supply voltage monitor pin. The

B2 Die-side 1.8-V I/O supply voltage monitor pin.

G21 Die-side 3.3-V I/O supply voltage monitor pin.

PULLUP/PULLD

OWN

Memory Controller0. This input voltage cn be generated directly from DVDD18 using two 1-K Ω resistors to form a resister divider circuit.

monitor pins indicate the voltage on the die, and, therefore, provide the best probe point for voltage monitoring purposes. If the CVDDMON pin is not used, it should be connected directly to the 1.2-V core supply.

Reserved

for proper device operation.

proper device operation.

for

I/O supply

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Table 2-5. TERMINAL FUNCTIONS (GROUND and POWER SUPPLY) (continued)

TERMINAL NAME NO TYPE INTERNAL OPER VOLT DESCRIPTION

RSV 13 E4 Reserved This pin must be connected directly to V

RSV 14 E3 Reserved.This pin must be connected directly to 1.8-V

RSV 15 A10 A Reserved . Unconnected RSV 16 A22 A Reserved . Unconnected RSV 17 V10 A Reserved . Unconnected RSV 18 F6 I Reserved. These pins must be connected directly to

RSV 19 C2 Reserved. This pin must be connected to the 1.8-V I/O

RSV 20 C1 Reserved. This pin must be connected to ground (V

RSV 21 Y12 Reserved. This pin must be connected via a 20- Ω

RSV 22 W12 Reserved. This pin must be connected via a 40- Ω

PULLUP/PULLD

OWN

proper device operation.

I/O supply

1.8-V I/O supply(DVDD18) for proper device operation.

supply (DVDD18) via a 200- Ω resistor for proper device operation. NOTE: If the DDR2 Memory Controller is not used, the V connected to ground (V connecting these pins directly to ground will prevent boundary scan from functioning on the DDR2 Memory Controller pins. To preserve boundary-scan functionality on the DDR2 Memory Controller pins, see Section 6.3.6 .

via a 200- Ω resistor for proper device operation. NOTE: If the DDR2 Memory Controller is not used, the V connected to ground (V connecting these pins directly to ground will prevent boundary scan from functioning on the DDR2 Memory Controller pins. To preserve boundary-scan functionality on the DDR2 Memory Controller pins, see Section 6.3.6 .

resistor directly to 3.3-V I/O Supply (D device operation. The resistor used should have a minimal rating of 250 mW

resistor directly to ground (V operation. The resistor used should have a minimal rating of 100 mW

, RSV19, and RSV20 pins can be directly

REFSSTL

, RSV19, and RSV20 pins can be directly

REFSSTL

) to save power. However,

) for proper device

) for proper

VDD33

for

)

2.7 Device Support

2.7.1 Development Support

TI offers an extensive line of development tools for the TMS320DM64x DMP platform, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tools support documentation is electronically available within the Code Composer Studio™ Integrated Development Environment (IDE).

The following products support development of TMS320DM64xx DMP-based applications:

Software Development Tools:

Code Composer Studio™ Integrated Development Environment (IDE): including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target

software needed to support any SoC application.

Hardware Development Tools:

Extended Development System (XDS™) Emulator (supports TMS320DM64x DMP multiprocessor system debug) EVM (Evaluation Module)

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For a complete listing of development-support tools for the TMS320DM64x DMP platform, visit the Texas Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL). For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.

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2.8 Device and Development-Support Tool Nomenclature

C64x+tDSP:

DM647 DM648

PREFIX

TMX 320 DM647 ZUT

TMX = Experimental device TMS = Qualified device

DEVICE FAMILY

320 = TMS320t DSP family

PACKAGE TYPE

(A)

ZUT = 520-pin plastic ball grid array (BGA)

DEVICE

DEVICE SPEED RANGE

( )

720 MHz 900 MHz

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX, TMP, or TMS (e.g., TMX320DM647ZUT720). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMX/TMDX) through fully qualified production devices/tools (TMS/TMDS).

Device development evolutionary flow: TMX Experimental device that is not necessarily representative of the final device's electrical

specifications.

TMP Final silicon die that conforms to the device's electrical specifications but has not completed

quality and reliability verification.

TMS Fully-qualified production device. Support tool development evolutionary flow:

TMDX Development-support product that has not yet completed Texas Instruments internal

qualification testing.

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TMDS Fully qualified development-support product. TMX and TMP devices and TMDX development-support tools are shipped against the following

disclaimer: "Developmental product is intended for internal evaluation purposes." TMS devices and TMDS development-support tools have been characterized fully, and the quality and

reliability of the device have been demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard

production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, ZUT), the temperature range (for example, "Blank" is the commercial temperature range), and the device speed range in megahertz (for example, "Blank" is the default [720-MHz]).

Figure 2-6 provides a legend for reading the complete device name for the devices.

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Figure 2-6. Device Nomenclature

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2.9 Documentation Support

2.9.1 Related Documentation From Texas Instruments

The following documents describe the TMS320DM64x Digital Media Processor (DMP). Copies of these documents are available on the Internet at www.ti.com . Tip: Enter the literature number in the search box provided at www.ti.com.

The current documentation that describes the DM64x DMP, related peripherals, and other technical collateral, is available in the C6000 DSP product folder at: www.ti.com/c6000 .

CPU

SPRU732 TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide describes the CPU

architecture, pipeline, instruction set, and interrupts for the TMS320C64x and TMS320C64x+ digital signal processors (DSPs) of the TMS320C6000 DSP family. The C64x/C64x+ DSP generation comprises fixed-point devices in the C6000 DSP platform. The C64x+ DSP is an enhancement of the C64x DSP with added functionality and an expanded instruction set.

Reference Guides

SPRUEK5 TMS320DM647/DM648 DSP DDR2 Memory Controller User's Guide describes the DDR2

memory controller in the TMS320DM647/DM648 Digital Signal Processor (DSP). The DDR2/mDDR memory controller is used to interface with JESD79D-2A standard compliant DDR2 SDRAM devices and standard Mobile DDR SDRAM devices.

SPRUEK6 TMS320DM647/DM648 DSP External Memory Interface (EMIF) User's Guide describes

the operation of the asynchronous external memory interface (EMIF) in the TMS320DM647/DM648 Digital Signal Processor (DSP). The EMIF supports a glueless interface to a variety of external devices.

SPRUEK7 TMS320DM647/DM648 DSP General-Purpose Input/Output (GPIO) User's Guide

describes the general-purpose input/output (GPIO) peripheral in the TMS320DM647/DM648 Digital Signal Processor (DSP). The GPIO peripheral provides dedicated general-purpose pins that can be configured as either inputs or outputs. When configured as an input, you can detect the state of the input by reading the state of an internal register. When configured as an output, you can write to an internal register to control the state driven on the output pin.

SPRUEK8 TMS320DM647/DM648 DSP Inter-Integrated Circuit (I2C) Module User's Guide describes

the inter-integrated circuit (I2C) peripheral in the TMS320DM647/DM648 Digital Signal Processor (DSP). The I2C peripheral provides an interface between the DSP and other devices compliant with the I2C-bus specification and connected by way of an I2C-bus. External components attached to this 2-wire serial bus can transmit and receive up to 8-bit wide data to and from the DSP through the I2C peripheral. This document assumes the reader is familiar with the I2C-bus specification.

SPRUEL0 TMS320DM647/DM648 DSP 64-Bit Timer User's Guide describes the operation of the

64-bit timer in the TMS320DM647/DM648 Digital Signal Processor (DSP). The timer can be

SPRUEL1 TMS320DM647/DM648 DSP Multichannel Audio Serial Port (McASP) User's Guide

configured as a general-purpose 64-bit timer, dual general-purpose 32-bit timers, or a watchdog timer.

describes the multichannel audio serial port (McASP) in the TMS320DM647/DM648 Digital Signal Processor (DSP). The McASP functions as a general-purpose audio serial port optimized for the needs of multichannel audio applications. The McASP is useful for time-division multiplexed (TDM) stream, Inter-Integrated Sound (I2S) protocols, and intercomponent digital audio interface transmission (DIT).

SPRUEL2 TMS320DM647/DM648 DSP Enhanced DMA (EDMA) Controller User's Guide describes

the operation of the enhanced direct memory access (EDMA3) controller in the

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TMS320DM647/DM648 Digital Signal Processor (DSP). The EDMA3 controller’s primary purpose is to service user-programmed data transfers between two memory-mapped slave endpoints on the DSP.

SPRUEL4 TMS320DM647/DM648 Peripheral Component Interconnect (PCI) User's Guide

describes the peripheral component interconnect (PCI) port in the TMS320DM647/DM648 Digital Signal Processor (DSP). The PCI port supports connection of the C642x DSP to a PCI host via the integrated PCI master/slave bus interface. The PCI port interfaces to the DSP via the enhanced DMA (EDMA) controller. This architecture allows for both PCI master and slave transactions, while keeping the EDMA channel resources available for other applications.

SPRUEL5 TMS320DM647/DM648 DSP Host Port Interface (UHPI) User's Guide describes the host

port interface (HPI) in the TMS320DM647/DM648 Digital Signal Processor (DSP). The HPI is a parallel port through which a host processor can directly access the CPU memory space. The host device functions as a master to the interface, which increases ease of access. The host and CPU can exchange information via internal or external memory. The host also has direct access to memory-mapped peripherals. Connectivity to the CPU memory space is provided through the enhanced direct memory access (EDMA) controller.

SPRUEL8 TMS320DM647/DM648 DSP Universal Asynchronous Receiver/Transmitter (UART)

User's Guide describes the universal asynchronous receiver/transmitter (UART) peripheral in the TMS320DM647/DM648 Digital Signal Processor (DSP). The UART peripheral performs serial-to-parallel conversion on data received from a peripheral device, and parallel-to-serial conversion on data received from the CPU.

SPRUEL9 TMS320DM647/DM648 DSP VLYNQ Port User's Guide describes the VLYNQ port in the

TMS320DM647/DM648 Digital Signal Processor (DSP). The VLYNQ port is a high-speed point-to-point serial interface for connecting to host processors and other VLYNQ compatible devices. It is a full-duplex serial bus where transmit and receive operations occur separately and simultaneously without interference.

SPRUEM1 TMS320DM647/DM648 DSP Video Port/VCXO Interpolated Control (VIC) Port User's

Guide discusses the video port and VCXO interpolated control (VIC) port in the TMS320DM647/DM648 Digital Signal Processor (DSP). The video port can operate as a video capture port, video display port, or transport stream interface (TSI) capture port. The VIC port provides single-bit interpolated VCXO control with resolution from 9 bits to up to 16 bits. When the video port is used in TSI mode, the VIC port is used to control the system clock, VCXO, for MPEG transport stream.

SPRUEM2 TMS320DM647/DM648 DSP Serial Port Interface (SPI) User's Guide discusses the Serial

Port Interface (SPI) in the TMS320DM647/DM648 Digital Signal Processor (DSP). This reference guide provides the specifications for a 16-bit configurable, synchronous serial peripheral interface. The SPI is a programmable-length shift register, used for high speed communication between external peripherals or other DSPs.

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3 Device Configuration

3.1 System Module Registers

The system module includes status and control registers required for configuration of the device. Brief descriptions of the various registers are shown in Table 3-1 . System Module registers required for device configuration are described in the following sections.

Table 3-1. System Module Register Memory Map

HEX ADDRESS RANGE REGISTER NAME DESCRIPTION

0x0204 9000 PINMUX Pin multiplexing control 0 0x0204 9004 Reserved 0x0204 9008 DSPBOOTADDR Boot Address of DSP, decoded by bootloader software for host boots 0x0204 900C BOOTCMPLT Boot Complete 0x0204 9010 Reserved 0x0204 9014 BOOTCFG Device boot configuration 0x0204 9018 JTAGID Device ID number. See Section 6.23 for details. 0x0204 901C PRI_ALLOC Bus master priority control See Section 4 for details 0x0204 9020 -0x0204 9053 Reserved Reserved 0x0204 9054 KEY_REG Key Register to protect against accidental writes. 0x0204 9060 - 0x0204 90A7 Reserved Reserved 0x0204 90A8 CFGPLL CFGPLL inputs for SerDes 0x0204 90AC CFGRX0 Configure SGMII0 RX 0x0204 90B0 CFGTX0 Configure SGMII0 TX 0x0204 90B4 CFGRX1 Configure SGMII1 RX 0x0204 90B8 CFGTX1 Configure SGMII1 TX 0x0204 90BC Reserved Reserved 0x0204 90C0 Reserved Reserved 0x0204 90C4 MAC_ADDR_R0 MAC Address Read Only Register 0 0x0204 90C8 MAC_ADDR_R1 MAC Address Read Only Register 1 0x0204 90CC MAC_ADDR_RW0 MAC Address Read/Write Register 0 0x0204 90D0 MAC_ADDR_RW0 MAC Address Read/Write Register 1 0x0204 90D4 ESS_LOCK Ethernet Sub System Lock Register

3.2 Bootmode Registers

The BOOTCFG and DSPBOOTADDR registers are described in the following sections. At reset, the status levels of various pins required for proper boot are stored within these registers.

3.2.1 Boot Configuration (BOOTCFG) Register

Configuration pins latched at reset are presented in the BOOTCFG register accessible through the system module. This is a read-only register. The bits show the true latched value of the corresponding input at RESET or POR deassertion. This is desirable since the most important use of this MMR is for the user to debug/view the actual value driven on the pins during device reset.

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Figure 3-1. BOOTCFG Register

31 24

Reserved

R-0

23 22 21 20 19 18 17 16

AECLKINSEL PC166 HPIWIDTH Reserved FASTBOOT Reserved DUHPIEN EMIFAWIDTH

R-L R-1 R-L R-1 R-L R-L

15 8

Reserved

7 4 3 0

Reserved BOOTMODE

R-0 R-L

LEGEND: R/W = Read/Write; R = Read only; L = latched; - n = value after reset

Table 3-2. BOOTCFG Register Field Descriptions

Bit Field Value Description

31:24 Reserved Reserved

23 AECLKINSEL Controls the clock input for EMIFA. Latched from AECLKINSEL at RESET or POR deassertion

1 EMIFA clocked from internal SYSCLK 0 EMIFA clocked from outside from AECLKIN

22 PCI66 Controls PCI speed. PCI. Latched from PCI66 at RESET or POR deassertion

0 33 MHz PCI 1 66 MHz

21 HPIWIDTH Controls HPI bus width. Latched from HPIWIDTH at RESET or POR deassertion

0 16 bit

1 32 bit 20 Reserved 1 Reserved 19 FASTBOOT Fast Boot. Latched from FASTBOOT at RESET or POR deassertion

0 No Fast Boot

1 Fast Boot 18 Reserved Reserved 17 DUHPIEN PCI Enable Default. Latched from UHPIEN at RESET or POR deassertion

0 UHPI disabled

1 UHPI enabled 16 EMIFAWIDTH EMIFA CS2 Bus Width Default. Latched from EMIFAWIDTH at RESET or POR deassertion

0 8-bit

1 16-bit

15:4 Reserved Reserved

3:0 BOOTMODE Boot Mode. Latched from BOOTMOD at RESET or POR deassertion

SPRS372 – MAY 2007

3.2.2 DSPBOOTADDR Register Description

The DSPBOOTADDR register contains the upper 22 bits of the C64x+ DSP reset vector. The register format is shown in Figure 3-2 and bit field descriptions are shown in Table 3-3 . DSPBOOTADDR is readable and writable by software after reset. DSPBOOTADDR Decode: This decode logic determines the default of the DSPBOOTADDR Register. It can default to either the base address of L2 ROM (0x00800000) or the base address of EMIFA CS2 (0xA0000000)

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Figure 3-2. DSPBOOTADDR Register

31 10 9 0

BOOTADDR Reserved

R/W-0100 0010 0010 0000 0000 00 R-0

LEGEND: R/W = Read/Write; R = Read only; - n = value after reset

Table 3-3. DSPBOOTADDR Register Field Descriptions

Bit Field Value Description

31:10 BOOTADDR Upper 22 bits of the C64x+ DSP bootmode address

9:0 Reserved Reserved

3.2.3 Boot Complete (BOOTCMPLT) register

The BOOTCMPLT register contains a BC (boot complete) field in bit 0, and a ERR (boot error) field in bits 19:16.

The BC field is written by the external host to indicates that it has completed boot. In the bootloader code, the CPU can poll for this bit. Once this bit = 1, the CPU can begin executing from DSPBOOTADDR.

The ERR field is written by the bootloader software if the software detects a boot error. Coming out of a boot, application software can read this field to determine if boot was accomplished. Actual error code is determined by software.

31 20 19 16 15 1 0

Reserved ERR Reserved B

R-0 R-0 R-0 R-

LEGEND: R/W = Read/Write; R = Read only; - n = value after reset

Bit Field Value Description

31:20 Reserved Reserved 19:16 ERR Boot error

15:1 Reserved Reserved

0 BC Boot Complete Flag from host. This is applicable only to host boots.

3.2.4 Priority Allocation (PRI_ALLOC)

Figure 3-3. BOOTCMPLT Register 3

Table 3-4. BOOTCMPLT Register Field Descriptions

0000 No error

0001 – 1111 Bootloader software detected boot error. For details on boot errors, see the Using the

TMS320DM647x Bootloader Application Note (literature number SPRAAAJ1 ).

0 Host has not completed booting this device. 1 Host has completed booting this device and the DSP can begin executing from

DSPBOOTADDR.

On the DM647/DM648 devices, each of the masters (excluding the C64x+ Megamodule) is assigned a priority via the Priority Allocation Register (PRI_ALLOC), see Figure 3-4 . The priority is enforced when several masters in the system are vying for the same endpoint. A value of 000b has the highest priority, while 111b has the lowest priority.

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Note that the configuration SCR port on the data SCR is considered a single endpoint meaning priority will be enforced when multiple masters try to access the configuration SCR. Priority is also enforced on the configuration SCR side when a master (through the data SCR) tries to access the same endpoint as the C64x+ Megamodule.

The Ethernet Subsystem and VLYNQ fields specify the priority of the EMAC and VLYNQ peripherals, respectively. Similarly, the HOST field applies to the priority of the HPI and PCI peripherals. Other master peripherals are not present in the PRI_ALLOC register as they have their own registers to program their priorities. For more information on the default priority values in these peripheral registers, see the device-compatible peripheral reference guides.

TI recommends that these priority registers be reprogrammed upon initial use.

Table 3-5. Default Master Priorities

Master Default Priority

EDMA3TC0 0 (EDMA CC QUEPRI Register) EDMA3TC1 0 (EDMA CC QUEPRI Register) EDMA3TC2 0 (EDMA CC QUEPRI Register) EDMA3TC3 0 (EDMA CC QUEPRI Register) 64x+_DMAP 7 (C64x+ MDMAARBE.PRI Register bit field) 64x+_CFGP 1 (C64x+ MDMAARBE.PRI Register bit field) Ethernet Subsystem 3 (PRI_ALLOC register) VLYNQ 4 (PRI_ALLOC register) UHPI 4 (PRI_ALLOC register) PCI 4 (PRI_ALLOC register) VICP 5 (PRI_ALLOC register)

SPRS372 – MAY 2007

Figure 3-4. Priority Allocation Register (PRI_ALLOC)

31 16

Reserved

R-0000000111001111

15 12 11 9 8 6 5 3 2 0

Reserved VICP VLYNQ HOST Ethernet Subsystem

R-0111 R/W-101 R/W-100 R/W-100 R/W-011

LEGEND: R/W = Read/Write; R = Read only; - n = value after reset

3.2.5 KEY_REG

KEY_REG protects against accidental writes to certain system configuration registers. The complete set of registers protected by the KEY_REG is:

• PINMUX

• BOOTCFG

• PRI_ALLOC

• CFGPLL

• CFGRX0

• CFGTX0

• CFGRX1

• CFGTX1

• MAC_ADDR_RW0

• MAC_ADDR_RW1

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Writes to these registers are locked/blocked by default. To enable writes to these registers, write 0xADDDECAF to the KEY_REG. After enabling writes to protected registers by doing the above, the register writes should occur within 10000 CPU/6 cycles, after which the key will be reset.

Figure 3-5. KEY_REG

31 0

KEY_REG

W-0x00000000

LEGEND: R/W = Read/Write; R = Read only; - n = value after reset

3.2.6 PINMUX Register

All pin multiplexing options are controlled by software via PINMUX register (except the ones mentioned in

Table 3-7 , whose default is selected by configuration pins). This PINMUX register reside within the system

module portion of the CFG bus memory map. The format of the registers and a description of the pins they control are in the following sections.

The PINMux Register controls all the software-controlled pin muxing. The register format is shown in

Figure 3-6 . A brief description of each field is shown in Table 3-6 .

31 22 21 20 19 18 17 16

15 14 13 12 11 10 9 8 7 6 5 4 3 1 0

VP34_EN SPI_UART_EN Reserved MCASP_EN Reserved VLYNQ_EN Reserved TIMER

R/W-00 R/W-00 R-00 R/W-00 R-00 R/W-00 R-000 R/W-0

LEGEND: R/W = Read/Write; R = Read only; - n = value after reset

Bit Field Value Description

31:22 Reserved Reserved 21:20 GPIO_EN Controls the pin muxing between Video Port 0 and the GPIO[12:15]

00 3-state 3-state 3-state 01 3-state 3-state 3-state 10 Enable Enable VP0D12-15

19:18 Reserved Reserved

(1) The complete list of pins: U20, U21, U22, R18. (2) The complete list of pins: Y23, V23, Y22, V22, U23, W20, V18, U18, V19, W21, T18, U19, V20. (3) The complete list of pins: V21, T19, T20, T21.

11 3-state Enable GP12-15

Figure 3-6. PINMUX Register

Reserved GPIO_EN Reserved VPI_EN

R-0000 0000 00 R/W-00 R-00 R/W-00

Table 3-6. PINMUX Register Field Descriptions

UNMUXED

.VP0D16-19 VP0D02-09/CLK/CTL VP0D12-15 GP12-15

(1)

UNMUXED

(2)

SECONDARY MUXED

_EN

(3)

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Table 3-6. PINMUX Register Field Descriptions (continued)

Bit Field Value Description

17:16 VP1_EN Controls the pin muxing between Video Port 1 and GPIO[16:31]

. UNMUXED

(4)

MUXED

VP1CLK0- VP1 Data GP[16-31]

1/VP1CTL0-2 (V1D02-09/12-19) 00 3-state 3-state 01 3-state 3-state 10 3-state GP16-31 11 Enable VP1D02-09 and VP1D12-19

15:14 VP34_EN Controls the pin muxing between Video Port 3-4 and EMIFA

. UNMUXED

(7)

(6)

MUXED

VP4D05/VP4CLK1 VP3/VP4 EMIFA 00 3-state 3-state 01 3-state 3-state 10 Disable EMIFA 11 Enable VP3/VP4

13:12 SPI_UART_EN Controls the pin muxing between SPI and UART

UNMUXED

(9)

MUXED

SPICLK SPI or UART 00 3-state 3-state 01 Enable SPI 10 Disable UART 11 Enable SPIDI

UART_TX UART_RX

11:10 Reserved Reserved

(4) The complete list of pins: P23, N23, R23, P22, N22 (5) The complete list of pins: R19, P19, P18, R22, R21, R20, N21, N20, N19, P21, P20, M20, M18, N18, M21, M19 (6) The value of VP34_EN depends on the BOOTMODE[3:0] pin value at reset. If the BOOTMODE[3:0] is 0100 the VP3/4 and the EMIFA

mux will default to EMIFA enable (the value is 10b). (7) The complete list of pins: K1, M6. (8) The complete list of pins: T1, P1, T2, R1, P2, T6, T5, T4, T3, R6, R5, R4, R3, R2, P6, P5, P4, P3, N4, N6, N5, L1, J2, J1, K2, L2, M4,

M5, L3, L4, L5, K3, K4, L6, K5, J3, J4, J5, J6, K6. (9) The complete list of pin:F22 (10) The complete list of pins: D23, F23, G23, F21

(5)

(8)

(10)

SPIDO

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Table 3-6. PINMUX Register Field Descriptions (continued)

Bit Field Value Description

9:8 MCASP_EN Controls the pin muxing between McASP and VIC

00 3-state 01 McASP (all McASP Pins) 10 (McASP without AXR8, AXR9)

11 Reserved 7:6 Reserved Reserved 5:4 VLYNQ_EN Controls the pin muxing between Video Port 2 and VLYNQ

00 3-state 3-state

01 3-state 3-state

10 Enable VP2D12-19, VP2CLK1, VP2CTL2

11 Enable VRXD0-3 and VTXD0-3, VCLK, VSCRUN 3:1 Reserved Reserved

0 TIMER_EN Controls the pin muxing between TIMER and GPIO[8:11]

(11) The complete list of pins: AC4, AC3, AC6, AC7, W6, AA7, AB6, Y6, AA6, AB4, Y5, V7, AA4, V6, Y7, AA5, AB3, U7 (12) For the first half of the Video Port 2, the complete list of pins with function: AB1(VP2CLK0), AA1 (VP2CTL0), AB2 (VP2CTL1) and W5,

AA2, Y3, U6, Y2, W3, V5, W4 (VP2D02, VP2D03, VP2D04, VP2D05, VP2D06, VP2D07, VP2D08, VP2D09)

(13) For the second half of the Video Port 2, the complete list of pins with function: W1 (VP2CLK1/VCLK), Y1(VP2CTL2/ VSCRUN), W2, V3,

V4, U1, U3, U2, U5, U4 (VP2D12/VRXD0, VP2D13/VRXD1, VP2D14/VRXD2, VP2D15/VRXD3, VP2D16/VTXD0, VP2D17/VTXD1, VP2D18/VTXD2, VP2D19/VTXD3)

(14) The complete list of pins:E20, D21, E21, C22

. UNMUXED MUXED

STCLK, VCTL, or McASP

ACLKR

AC:LKX

AHCLKR

AMUTEIN

AHCLKX

AMUTE

STCLK

. UNMUXED

. MUXED

0 GPIO[8:11] 1 Timer 0/1

(12)

VP2#1 VP2#2 VLYNQ

(E20, D21, E21, C22)

MUXED

(11)

AFSR AXR0 AXR1

AFSX AXR2 AXR3

AXR4 AXR5

AXR6 AXR7

VCTL

(13)

(14)

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Table 3-7. PCI/UHPI/GPIO Block: PCI MUXed With UHPI and GPIO[0:7]

TMS320DM647/TMS320DM648

Digital Media Processor

SPRS372 – MAY 2007

MUXED

PCI UHPI/GPIO[0:7]

UHPIEN (pin)

1 UHPI/GPIO[0:7] 0 PCI

(1) The complete list of pin:AA22, AB22, AC21, AA23, AC22, AB21, AA21, Y21, AB20, AA20, Y20, Y19, AB18, AA19, AC18, AA18, Y16,

AB15, AA15, Y15, W15, V15, AC14, AB14, W14, V14, AC13, AB13, AA13, Y13 , W13, V13, W19, Y18, Y17, W17, W18, AC20, AC17, W16, Y14, AC15, AA16, AB17, U13, U12, V12, AA12, AA17, AA14.

(1)

For information on the Ethernet Subsystem registers, see the TMS320DM647/DM648 DMP DSP Subsystem Reference Guide (literature number SPRUEU6 ).

Figure 3-7. SerDes Macro Configuration (SERDES_CFG_CNTL) Register

31 16

Reserved

15 10 9 8 7 5 4 1 0

Reserved LB Reserved MPY ENPLL

R-0 R/W-0 R-0 R/W-1001 R/W-1

LEGEND: R/W = Read/Write; R = Read only; - n = value after reset

3.2.7 ESS_LOCK

The ESS_LOCK register protects the Ethernet Subsystem MMR space (0x02D0 0000 - 0x02D0 4FFF) and the Ethernet Subsystem's LPSC (LPSC34) MDCTL register (0x0204 6088). The default value of ESS_LOCK is 0x0000 0000 and read/write is allowed to Ethernet Subsystem MMR space and MDCTL [34]. To lock the write access to both Ethernet Subsystem MMR space and MDCTL [34], software must write a value of 0x AAAA AAAA to the ESS_LOCK register. To make sure that the desired lock has been achieved, the software must read the ESS_LOCK register till it gets a value of 0x1. The software must make sure that there are no pending accesses to either the Ethernet Subsystem MMR space or MDCTL [34]. Read access to both Ethernet Subsystem MMR space and MDCTL [34] should be unaffected while write accesses are locked. To unlock the write access to Ethernet Subsystem MMR space and MDCTL [34], the software must write a value of 0xCCCC CCCC to ESS_LOCK. To make sure that the desired write lock has been removed, the software must read ESS_LOCK till it gets a value of 0x0.

Figure 3-8. ESS_LOCK Register

31 0

ESS_LOCK

R/W-0x00000000

LEGEND: R/W = Read/Write; R = Read only; - n = value after reset

3.2.8 MAC Address Registers

• MAC_ADDR_R0

• MAC_ADDR_R1

• MAC_ADDR_RW0

• MAC_ADDR_RW1

In DM647/DM648, two sets of registers provide default MAC addresses for the device. One set MAC_ADDR_R0 and MAC_ADDR_R1 - is read only and the other set - MAC_ADDR_RW0 and MAC_ADDR_RW1 - includes read and write registers.

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Figure 3-9. MAC_ADDR_R0 Register

31 0

MAC_ID

R-MAC ADDRESS[31:0]

LEGEND: R/W = Read/Write; R = Read only; - n = value after reset

Table 3-8. MAC_ADDR_R0 Register Field Descriptions

Bit Field Value Description

31:0 MAC_ID Mac Bit 0 of MAC_ID is bit 0 of MAC Address

31 24 23 16

15 0

LEGEND: R/W = Read/Write; R = Read only; - n = value after reset

Address[31:0] of

the device

Figure 3-10. MAC_ADDR_R1 Register

CRC Reserved

R-CRC for the MAC_ID R-00000000

MAC_ID

R-MAC ADDRESS[47:32]

Bit Field Value Description

31:24 CRC CRC of the MAC This field will hold the CRC of the MAC address of that particular device.

23:16 Reserved 0x00 Reserved

15:0 MAC_ID Mac Bit 0 of MAC_ID is Bit 32 of MAC Address

Address[47:32] of

31 0

LEGEND: R/W = Read/Write; R = Read only; - n = value after reset

Table 3-10. MAC_ADDR_RW0 Register Field Descriptions

Bit Field Value Description

31:0 MAC_ID Mac Bit 0 of MAC_ID is bit 0 of MAC Address

Address[31:0] of

Table 3-9. MAC_ADDR_R1 Register Field Descriptions

the device

Figure 3-11. MAC_ADDR_RW0 Register

MAC_ADDR_R0

R/W - MAC ID[31:0]

the device

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TMS320DM647/TMS320DM648

Digital Media Processor

SPRS372 – MAY 2007

Figure 3-12. MAC_ADDR_RW1 Register

31 24 23 16

CRC Reserved

R/W-CRC for the MAC_ID R/W-00000000

15 0

MAC_ID

R-MAC ADDRESS[47:32]

LEGEND: R/W = Read/Write; R = Read only; - n = value after reset

Table 3-11. MAC_ADDR_RW1 Register Field Descriptions

Bit Field Value Description

31:24 CRC CRC of the This field will hold the CRC of the MAC address of that particular device.

23:16 Reserved 0x00 Reserved

15:0 MAC_ID Mac Bit 0 of MAC_ID is Bit 32 of MAC Address

MAC ID

Address[47:32]

of the device

3.3 Debugging Considerations

3.4 Pullup/Pulldown Resistors

Proper board design should specify that input pins to the device always be at a valid logic level and not floating. This may be achieved via pullup/pulldown resistors. The DM64x features internal pullup (IPU) and internal pulldown (IPD) resistors on most pins to eliminate the need, unless otherwise noted, for external pullup/pulldown resistors.

An external pullup/pulldown resistor must be used in the following situations:

• Boot and Configuration Pins: If the pin is both routed out and in high-impedance mode, an external pullup/pulldown resistor must be used, even if the IPU/IPD matches the desired value/state.

• Other Input Pins: If the IPU/IPD does not match the desired value/state, use an external pullup/pulldown resistor to pull the signal to the opposite rail.

If the boot and configuration pins are both routed out and in high-impedance mode, it is recommended that an external pullup/pulldown resistor be used. Although internal pullup/pulldown resistors exist on these pins and they may match the desired configuration value, providing external connectivity can help specify that valid logic levels are latched on these important boot configuration pins. In addition, applying external pullup/pulldown resistors on the boot and configuration pins adds convenience to the user in debugging and flexibility in switching operating modes.

Tips for choosing an external pullup/pulldown resistor:

• Select a resistor with the largest possible resistance

• Calculate the worst-case leakage current that flows through this external resistor. Worst-case leakage

current can be calculated by adding up all the leakage current at the pin—e.g., the input current (II) from DM64x, and leakage current from the other device(s) to which this pin is connected.

• Specify that the voltage at the pin stays well within the low-/high-level input voltages (V worst-case leakage current is flowing through this external resistor.

– To oppose an IPU and pull the signal to a logic low, the voltage at the pin must stay well below VIL. – To oppose an IPD and pull the signal to a logic high, the voltage at the pin must stay well above

or V

) when

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For most systems, a 1-k Ω resistor can be used to oppose the IPU/IPD while meeting the above criteria. Users should confirm this resistor value is correct for their specific application.

For most systems, a 20-k Ω resistor can be used to complement the IPU/IPD on the boot and configuration pins while meeting the above criteria. Users should confirm this resistor value is correct for their specific application.

For more detailed information on input current (II), and the low-/high-level input voltages (V the DM64x device, see Section 5.3 , Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Temperature.

For the internal pullup/pulldown resistors for all device pins, see the peripheral/system-specific terminal functions table.

and V

) for

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4 System Interconnect

On the DM647/DM648 devices, the C64x+ Megamodule, the EDMA3 transfer controllers, and the system peripherals are interconnected through two switch fabrics. The switch fabrics allow for low-latency, concurrent data transfers between master peripherals and slave peripherals. Through a switch fabric, the CPU can send data to the video ports without affecting a data transfer between the PCI and the DDR2 memory controller. The switch fabrics also allow for seamless arbitration between the system masters when accessing system slaves.

4.1 Internal Buses, Bridges, and Switch Fabrics

Two types of buses exist in the DM647/DM648 devices: data buses and configuration buses. Some DM647/DM648 peripherals have both a data bus and a configuration bus interface, while others only have one type of interface. Furthermore, the bus interface width and speed varies from peripheral to peripheral. Configuration buses are mainly used to access the register space of a peripheral and the data buses are used mainly for data transfers. However, in some cases, the configuration bus is also used to transfer data. For example, data is transferred to the UART or I2C via their configuration bus. Similarly, the data bus can also be used to access the register space of a peripheral. For example, the EMIFA and DDR2 memory controller registers are accessed through their data bus interface.

The C64x+ Megamodule, the EDMA3 traffic controllers, and the various system peripherals can be classified into two categories: masters and slaves. Masters are capable of initiating read and write transfers in the system and do not rely on the EDMA3 for their data transfers. Slaves, on the other hand, rely on the EDMA3 to perform transfers to and from them. Masters include the EDMA3 traffic controllers and PCI. Slaves include the McASP, video port, and I2C.

TMS320DM647/TMS320DM648

Digital Media Processor

SPRS372 – MAY 2007

The DM647/DM648 devices contain two switch fabrics through which masters and slaves communicate. The data switch fabric, known as the data switched central resource (SCR), is a high-throughput interconnect mainly used to move data across the system (for more information, see Section 4.2 ). The data SCR connects masters to slaves via 128-bit data buses running at a SYSCLK2 frequency (SYSCLK2 is generated from PLL1 controller). Peripherals that have a 128-bit data bus interface running at this speed can connect directly to the data SCR; other peripherals require a bridge.

The configuration switch fabric, also known as the configuration switch central resource (SCR) is mainly used by the C64x+ Megamodule to access peripheral registers (for more information, see Section 4.3 ). The configuration SCR connects C64x+ Megamodule to slaves via 32-bit configuration buses running at a SYSCLK2 frequency (SYSCLK2 is generated from PLL1 controller). As with the data SCR, some peripherals require the use of a bridge to interface to the configuration SCR. Note that the data SCR also connects to the configuration SCR. Bridges perform a variety of functions:

• Conversion between configuration bus and data bus.

• Width conversion between peripheral bus width and SCR bus width

• Frequency conversion between peripheral bus frequency and SCR bus frequency

For example, the EMIFA memory controller require a bridge to convert their 64-bit data bus interface into a 128-bit interface so that they can connect to the data SCR.

Note that some peripherals can be accessed through the data SCR and also through the configuration SCR.

4.2 Data Switch Fabric Connections

Figure 4-1 shows the connection between slaves and masters through the data switched central resource

(SCR). Masters are shown on the right and slaves on the left. The data SCR connects masters to slaves via 128-bit data buses running at a SYSCLK2 frequency. SYSCLK2 is supplied by the PLL1 controller and is fixed at a frequency equal to the CPU frequency divided by 3. Some peripherals, like PCI and the C64x+ Megamodule, have both slave and master ports. Note that each EDMA3 transfer controller has an independent connection to the data SCR.

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Megamodule

128SYSCLK2

EDMA3 Transfer

Controller

128SYSCLK2

S 0

S 3

S 2

S 1

128SYSCLK2

HPI M

PCI

VLYNQ

32SYSCLK3

Bridge

32SYSCLK3

128SYSCLK2

3-portGigabit

EthernetSwitch

32 TXBCLK

Bridge

128SYSCLK2

VideoPort3S

VideoPort4S

128SYSCLK2

SYSCLK2

Bridge

SYSCLK2

128SYSCLK2

PCIS

VLYNQS

SYSCLK3

Bridge

SYSCLK3

128SYSCLK2

ConfigSCRS

128

SYSCLK2

Bridge

SYSCLK2

MegamoduleS

128SYSCLK2

DDR2

Memory

Controller

128SYSCLK2

EMIFAS

128

SYSCLK2

Bridge

SYSCLK2

VideoPort0S

VideoPort1S

VideoPort2

SYSCLK2

Bridge

SYSCLK2

TMS320DM647/TMS320DM648 Digital Media Processor

SPRS372 – MAY 2007

Note that masters can access the configuration SCR through the data SCR. The configuration SCR is described in Section 4.3 .

Not all masters on the DM647/DM648 DSPs may connect to all slaves. Allowed connections are summarized in Table 4-1 .

Figure 4-1. Data SCR

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Table 4-1. Connectivity Matrix for Data SCR

TMS320DM647/TMS320DM648

Digital Media Processor

SPRS372 – MAY 2007

MEGAMODULE DDR2 EMIF EMIFA VIDEO VIDEO PCI VLYNQ Configuration

TC0 Y Y Y Y Y Y Y Y TC1 Y Y Y Y Y Y Y Y TC2 Y Y Y Y Y Y Y Y TC3 Y Y Y Y Y N N N Megamodule N Y Y N N Y Y N HPI Y Y Y N N Y Y Y PCI Y Y Y N N Y Y Y VLYNQ Y Y Y N N Y Y Y Ethernet Subsystem Y Y Y N N N N N

PORT 0-2 PORT 3-4 SCR

4.3 Configuration Switch Fabric

Figure 4-2 shows the connection between the C64x+ megamodule and the configuration SCR, which is

mainly used by the C64x+ Megamodule to access peripheral registers. The data SCR also has a connection to the configuration SCR that allows masters to access most peripheral registers. The only registers not accessible by the data SCR through the configuration SCR are the device configuration registers and the PLL1 and PLL2 controller registers; these can be accessed only by the C64x+ Megamodule. The configuration SCR uses 32-bit configuration buses running at SYSCLK2 frequency. SYSCLK2 is supplied by the PLL1 controller and is fixed at a frequency equal to the CPU frequency divided by 3.

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Ethernet

SubSystem

SYSCLK2

Bridge

TXBCLK

Bridge

SYSCLK2

128

SYSCLK2

VideoPort0S

VideoPort1S

VideoPort2

VideoPort3S

VideoPort4S

UART

I2CS

Timer0S

Timer1

Timer2S

Bridge

SYSCLK2

Timer3S

PSC

PLL ControllersS

PCI

McASPS

SPI

VICS

GPIOS

VICP CFGS

HPIS

EDMA3CC

EDMA3 TC0

EDMA3 TC1

EDMA3 TC2

EDMA3 TC3

SYSCLK2

Bridge

SYSCLK2

Megamodule

32SYSCLK2

DataSCR

32SYSCLK2

VICP M

32SYSCLK3

Bridge

32SYSCLK2

ConfigSCR

SYSCLK2

TMS320DM647/TMS320DM648 Digital Media Processor

SPRS372 – MAY 2007

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Figure 4-2. Configuration SCR

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5 Device Operating Conditions

TMS320DM647/TMS320DM648

Digital Media Processor

SPRS372 – MAY 2007

5.1 Absolute Maximum Ratings Over Operating Temperature Range (Unless Otherwise Noted)

Supply voltage ranges: Core (C

(1)

VDDT

I/O, 3.3V (D I/O, 1.8V (D

, C

VDD

(2)

)

VDD33 VDD18

, C

, A

, D

VDDESS

VDD1

VDDA

(2)

) , A

, A

VDLL1

, A

VDLL2

, 1.20-V operation –0.5 V to 1.5 V

VDDD

(2)

)

VDDR

–0.5 V to 4.2 V

–0.5 to 2.5 V

Input voltage ranges: VII/O, 3.3-V pins –0.5 V to 4.2 V

VII/O, 1.8 V –0.5 V to 2.5 V

Output voltage ranges: VOI/O, 3.3-V pins –0.5 V to 4.2 V

VOI/O, 1.8 V –0.5 V to 2.5 V

Operating Junction temperature ranges, Commercial 0 ° C to 90 ° C TJ:

Storage temperature range, T

stg

(default) –65 ° C to 150 ° C

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to V

SS.

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5.2 Recommended Operating Conditions

MIN NOM MAX UNIT

VDD

VDDESS

VDD1

VDDA

VDDD

VDDT

VDD33

VDD18

VDLL1

VDLL2

VDDR

REFSSTL

Supply voltage, Core

Supply voltage, Ethernet Subsystem Core

Supply voltage, DDR Core

Supply voltage, SerDes Analog

Supply voltage, SerDes Digital

Supply voltage, SerDes Analog

Supply voltage, I/O, 3.3 V 3.14 3.3 3.46 V

Supply voltage, DDR I/O, 1.8 V

Supply voltage, I/O, 1.8 V

Supply voltage, 1.8-V SerDes Analog Supply (Regulator)

Supply ground (V

DDR2 reference voltage

High-level input voltage, 3.3 V(except I2C pins) 2 V

High-level input voltage, I2C 0.7D

Low-level input voltage, 3.3 V(except I2C pins) 0.8 V

SYSCLK1

Low-level input voltage, I2C 0 0.3DV

Operating Junction temperature

DSP Operating Frequency (SYSCLK1)

(1) Future variants of TI SOC devices may operate at voltages ranging from 0.9 V to 1.4 V to provide a range of system power/performance

options. TI highly recommends that users design-in a supply that can handle multiple voltages within this range (i.e., 1.0 V, 1.05 V,

1.1 V, 1.14 V, 1.2, 1.26 V with ± 3% tolerances) by implementing simple board changes such as reference resistor values or input pin configuration modifications. Not incorporating a flexible supply may limit the system ability to easily adapt to future versions of TI SOC

devices. (2) V (3) In the absence of a heat sink, use the following formula to determine the device junction temperature: TJ= TC+ (Power x Psi

REFSSTL

is expected to equal 0.5DV

and TCcan be measured by the user.

(1)

(-720, -900 devices)

1.14 1.2 1.26 V

1.71 1.8 1.89 V

) 0 0 0 V

(2)

(3)

Commercial 0 90 ° C

0.49D

VDD18

VDD33

0.5D

VDD18

0.51D

(-900 devices) 33.3 900 MHz

(-720 devices) 33.3 720 MHz

of the transmitting device and to track variations in the D

DDR2

VDD18

DD33

). Power

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TMS320DM647/TMS320DM648

5.3 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating

Temperature (Unless Otherwise Noted)

PARAMETER TEST CONDITIONS

C C

High-level output voltage (3.3-V I/O except

I2C pins) Low-level output voltage (3.3-V I/O except

I2C pins)

Low-level output voltage (3.3-V I/O I2C pins)

Input current [dc]

Input current [dc] (I2C) VI= VSSto DV

High-level output current [dc]

Low-level output current [dc]

I/O Off-state output current

Core (CV

CDD

3.3-V I/O (DV

DDD

1.8-V I/O (DV PLLV

DDD

current Input capacitance pF

Output capacitance pF

, V

PRW18

(3)

) supply current

DDA_1P1V

) supply current

DD33

, DDR_VDDDLL, DV

DDR2

, MXV

DDA_1P8V

) supply

(3)

= MIN, IOH= MAX V

DD33

= MIN, IOL= MAX V

DD33

IO= 3 mA V VI= VSSto DV

VI= VSSto DV

(2)

VI= VSSto DV pulldown resistor

without internal resistor µ A

DD33

with internal pullup resistor

DD33

with opposing internal

DD33

(2)

DD33

DDR2 mA All other peripherals mA DDR2 mA All other peripherals mA VO= DV VO= DV CV

(3)

DD DD

or VSS; internal pull disabled µ A

DD33

or VSS; internal pull enabled µ A

DD33

= 1.2-V, DSP clock = 720 MHz mA = 1.2-V, DSP clock = 900 MHz mA = 3.3-V, DSP clock = 720 MHz mA = 3.3-V, DSP clock = 900 MHz mA = 1.8-V, DSP clock = 720 MHz mA

= 1.8-V, DSP clock = 900 MHz mA

(1)

MIN TYP MAX UNIT

Digital Media Processor

SPRS372 – MAY 2007

µ A

µ A µ A

(1) For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in the recommended operating conditions table. (2) Applies only to pins with an internal pullup (IPU) or pulldown (IPD) resistor. (3) Measured under the following conditions.

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Transmission Line

4.0 pF 1.85 pF

Z0 = 50 Ω (see Note)

Tester Pin Electronics

Data Sheet Timing Reference Point

Output Under Test

NOTE: The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects must

be taken into account. A transmission line with a delay of 2 ns can be used to produce the desired transmission line effect. The transmission line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns) from the data sheet timings.

Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin.

42 Ω 3.5 nH

Device Pin (see Note)

ref

= VIL MAX (or VOL MAX)

ref

= VIH MIN (or VOH MIN)

TMS320DM647/TMS320DM648 Digital Media Processor

SPRS372 – MAY 2007

6 Peripheral Information and Electrical Specifications

6.1 Parameter Information

Figure 6-1. Test Load Circuit for AC Timing Measurements

The load capacitance value stated is only for characterization and measurement of ac timing signals. This load capacitance value does not indicate the maximum load the device is capable of driving.

6.1.1 3.3-V Signal Transition Levels

All input and output timing parameters are referenced to V V

= 1.5 V. For 1.8-V I/O, V

ref

Figure 6-2. Input and Output Voltage Reference Levels for ac Timing Measurements

All rise and fall transition timing parameters are referenced to V V

MAX and V

MIN for output clocks.

Figure 6-3. Rise and Fall Transition Time Voltage Reference Levels

= 0.9 V.

ref

for both 0 and 1 logic levels. For 3.3-V I/O,

ref

MAX and V

MIN for input clocks,

6.1.2 3.3-V Signal Transition Rates

All timings are tested with an input edge rate of 4 volts per nanosecond (4 Vpns).

Peripheral Information and Electrical Specifications56 Submit Documentation Feedback

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6.1.3 Timing Parameters and Board Routing Analysis

AECLKOUT

(OutputfromDSP)

AECLKOUT

(InputtoExternalDevice)

ControlSignals

(A)

(OutputfromDSP)

ControlSignals

(InputtoExternalDevice)

DataSignals

(B)

(OutputfromExternalDevice)

DataSignals

(B)

(InputtoDSP)

The timing parameter values specified in this data sheet do not include delays by board routings. As a good board design practice, such delays must always be taken into account. Timing values may be adjusted by increasing/decreasing such delays. TI recommends utilizing the available I/O buffer information specification (IBIS) models to analyze the timing characteristics correctly. To properly use IBIS models to attain accurate timing analysis for a given system, see the Using IBIS Models for Timing Analysis Application Report (literature number SPRA839 ). If needed, external logic hardware such as buffers may be used to compensate for any timing differences.

For inputs, timing is most impacted by the round-trip propagation delay from the DSP to the external device and from the external device to the DSP. This round-trip delay tends to negatively impact the input setup time margin, but also tends to improve the input hold time margins (see Table 6-1 and Figure 6-4 ).

Figure 6-4 represents a general transfer between the DSP and an external device. The figure also

represents board route delays and how they are perceived by the DSP and the external device.

Table 6-1. Board-Level Timing Example

NO. DESCRIPTION

1 Clock route delay 2 Minimum DSP hold time 3 Minimum DSP setup time 4 External device hold time requirement 5 External device setup time requirement 6 Control signal route delay 7 External device hold time 8 External device access time

9 DSP hold time requirement 10 DSP setup time requirement 11 Data route delay

TMS320DM647/TMS320DM648

Digital Media Processor

SPRS372 – MAY 2007

(see Figure 6-4 )

Submit Documentation Feedback Peripheral Information and Electrical Specifications 57

A. Control signals include data for writes. B. Data signals are generated during Reads from an external device.

Figure 6-4. Board-Level Input/Output Timings

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TMS320DM647/TMS320DM648 Digital Media Processor

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6.2 Recommended Clock and Control Signal Transition Behavior

All clocks and control signals must transition between V manner.

6.3 Power Supplies

For more information regarding TI's power management products and suggested devices to power TI DSPs, visit www.ti.com/dsppower .

6.3.1 Power-Supply Sequencing

The DM647/8 includes 1.2-V core supply (CVDD, CVDDESS, CVDD1, AVDDA, DVDDD, AVDDT), and two I/O supplies—3.3-V (DVDD33) and 1.8-V (DvDD18, AVDLL1, AVDLL2, AVDDR) To ensure proper device operation, a specific power-up sequence must be followed. Some TI power-supply devices include features that facilitate power sequencing—for example, Auto-Track and Slow-Start/Enable features. For more information on TI power supplies and their features, visit www.ti.com/dsppower .

Here is a summary of the power sequencing requirements:

• The power ramp order must be 3.3-V (DVDD33) before 1.8-V (DvDD18, AVDLL1, AVDLL2, AVDDR),

• From the time that power ramp begins, all power supplies (3.3 V, 1.8 V, 1.2 V) must be stable within

and V

and 1.8-V (DVDD18, AVDLL1, AVDLL2, AVDDR) before 1.2-V core supply (CVDD, CVDDESS, CVDD1, AVDDA, DVDDD, AVDDT) —meaning during power up, the voltage at the 1.8-V rail should never exceed the voltage at the 3.3-V rail. Similarly, the voltage at the 1.2-V rail should never exceed the voltage at the DVDDR2 rail.

200 ms. The term "stable" means reaching the recommended operating condition (see Section 5.2 , Recommended Operating Conditions).

(or between V

and VIH) in a monotonic

6.3.2 Power-Supply Design Considerations

Core and I/O supply voltage regulators should be located close to the DSP to minimize inductance and resistance in the power delivery path. Additionally, when designing for high-performance applications utilizing the DM647/8 device, the PC board should include separate power planes for core, I/O, and ground; all bypassed with high-quality low-ESL/ESR capacitors.

6.3.3 Power-Supply Decoupling

In order to properly decouple the supply planes from system noise, place as many capacitors (caps) as possible close to the DSP. These caps need to be close to the DSP, no more than 1.25 cm maximum distance to be effective. Physically smaller caps are better, such as 0402, but need to be evaluated from a yield/manufacturing point-of-view. Parasitic inductance limits the effectiveness of the decoupling capacitors; therefore physically smaller capacitors should be used while maintaining the largest available capacitance value. Larger caps for each supply can be placed further away for bulk decoupling. Large bulk caps (on the order of 100  F) should be furthest away, but still as close as possible. Large caps for each supply should be placed outside of the BGA footprint.

6.3.4 Power and Sleep Controller (PSC)

The power and sleep controller (PSC) controls power by turning off unused power domains or by gating off clocks to individual peripherals/modules. The DM647/DM648 devices use the clock-gating feature of the PSC only for power savings. The PSC consists of a global PSC (GPSC) and a set of local PSCs (LPSCs).

The GPSC contains memory mapped registers, PSC interrupt control, and a state machine for each peripheral/module. An LPSC is associated with each peripheral/module and provides clock and reset control. The LPSCs for DM647/DM648 are shown in Table 6-2 . The PSC register memory map is given in

Table 6-3 . For more details on the PSC, see the TMS320DM647/TMS320DM648 DMP DSP Subsystem

Reference Guide (Literature Number SPRUEU6 ).

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TMS320DM647/TMS320DM648

Digital Media Processor

Table 6-2. DM647/DM648 LPSC Assignments

LPSC NUMBER PERIPHERAL/ MODULE LPSC NUMBER PERIPHERAL/ MODULE

0 EDMA3CC 19 PCI 1 Reserved 20 VP0 2 Reserved 21 VP1 3 Reserved 22 VP2 4 Reserved 23 VP3 5 Reserved 24 VP4 6 Reserved 25 EMIFA 7 DDR2 Memory Controller 26 TIMER2 8 UHPI 27 TIMER3

9 VLYNQ 28 VIC 10 GPIO 29 McASP 11 TIMER0 30 UART 12 TIMER1 31 VICP 13 Reserved 32 Reserved 14 Reserved 33 C64x+ CPU 15 Reserved 34 Ethernet Subsystem 16 Reserved 17 SPI 18 I2C

SPRS372 – MAY 2007

Table 6-3. PSC Register Memory Map

HEX ADDRESS RANGE REGISTER ACRONYM DESCRIPTION

0x0204 6000 PID Peripheral Revision and Class Information Register 0x0204 6004- 0x0204 600F – Reserved 0x0204 6010 – Reserved 0x0204 6014 Reserved 0x0204 6018 INTEVAL Interrupt Evaluation Register 0x0204 601C- 0x0204 603F – Reserved 0x0204 6040 – Reserved 0x0204 6044 MERRPR1 Module Error Pending 1 (mod 32- 63) Register 0x0204 6048- 0x0204 604F – Reserved 0x0204 6050 – Reserved 0x0204 6054 MERRCR1 Module Error Clear 1 (mod 32 - 63) Register 0x0204 6058- 0x0204 605F – Reserved 0x0204 6060 – Reserved 0x0204 6064- 0x0204 6067 – Reserved 0x0204 6068 – Reserved 0x0204 606C- 0x0204 611F – Reserved 0x0204 6120 PTCMD Power Domain Transition Command Register 0x0204 6124- 0x0204 6127 – Reserved 0x0204 6128 PTSTAT Power Domain Transition Status Register 0x0204 612C- 0x0204 61FF – Reserved 0x0204 6200 PDSTAT0 Power Domain Status 0 Register (Always On) 0x0204 6204- 0x0204 62FF – Reserved 0x0204 6300 PDCTL0 Power Domain Control 0 Register (Always On) 0x0204 6304- 0x1C4 150F – Reserved

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TMS320DM647/TMS320DM648 Digital Media Processor

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HEX ADDRESS RANGE REGISTER ACRONYM DESCRIPTION

0x0204 6510 – Reserved 0x0204 6514 – Reserved 0x0204 6518- 0x0204 65FF – Reserved 0x0204 6600- 0x0204 67FF – Reserved 0x0204 6800 MDSTAT0 Module Status 0 Register (EDMACC) 0x0204 6804 – Reserved 0x0204 6808 – Reserved 0x0204 680C – Reserved 0x0204 6810 – Reserved 0x0204 6814 – Reserved 0x0204 6818 – Reserved 0x0204 681C MDSTAT7 Module Status 7 Register (DDR2) 0x0204 6820 MDSTAT8 Module Status 8 Register (HPI) 0x0204 6824 MDSTAT9 Module Status 9 Register (VLYNQ) 0x0204 6828 MDSTAT10 Module Status 10 Register (GPIO) 0x0204 682C MDSTAT11 Module Status 11 Register (TIMER 0) 0x0204 6830 MDSTAT12 Module Status 12 Register (TIMER 1) 0x0204 6834 – Reserved 0x0204 6838 – Reserved 0x0204 683C – Reserved 0x0204 6840 – Reserved 0x0204 6844 MDSTAT17 Module Status 17 Register (SPI) 0x0204 6848 MDSTAT18 Module Status 18 Register (I2C) 0x0204 684C MDSTAT19 Module Status 19 Register (PCI) 0x0204 6850 MDSTAT20 Module Status 20 Register (Video Port 0) 0x0204 6854 MDSTAT21 Module Status 21 Register (Video Port 1) 0x0204 6858 MDSTAT22 Module Status 22 Register (Video Port 2) 0x0204 685C MDSTAT23 Module Status 23 Register (Video Port 3) 0x0204 6860 MDSTAT24 Module Status 24 Register (Video Port 4) 0x0204 6864 MDSTAT25 Module Status 25 Register (EMIFA) 0x0204 6868 MDSTAT26 Module Status 26 Register (TIMER 2) 0x0204 686C MDSTAT27 Module Status 27 Register (TIMER 3) 0x0204 6870 MDSTAT28 Module Status 28 Register (VIC) 0x0204 6874 MDSTAT29 Module Status 29 Register (McASP) 0x0204 6878 MDSTAT30 Module Status 30 Register (UART) 0x0204 687C MDSTAT31 Module Status 31 Register (VICP) 0x0204 6880 – Reserved 0x0204 6884 MDSTAT33 Module Status 33 Register (C64x+ CPU) 0x0204 688C MDSTAT34 Module Status 34 Register (Ethernet Subsystem) 0x0204 688C-0x0204 69FF – Reserved 0x0204 6A00 MDCTL0 Module Control 0 Register (EDMACC) 0x0204 6A04 – Reserved 0x0204 6A08 – Reserved 0x0204 6A0C – Reserved 0x0204 6A10 – Reserved 0x0204 6A14 – Reserved 0x0204 6A18 – Reserved

Table 6-3. PSC Register Memory Map (continued)

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TMS320DM647/TMS320DM648

Digital Media Processor

Table 6-3. PSC Register Memory Map (continued)

HEX ADDRESS RANGE REGISTER ACRONYM DESCRIPTION

0x0204 6A1C MDCTL7 Module Control 7 Register (DDR2) 0x0204 6A20 MDCTL8 Module Control 8 Register (HPI) 0x0204 6A24 MDCTL9 Module Control 9 Register (VLYNQ) 0x0204 6A28 MDCTL10 Module Control 10 Register (GPIO) 0x0204 6A2C MDCTL11 Module Control 11 Register (TIMER 0) 0x0204 6A30 MDCTL12 Module Control 12 Register (TIMER 1) 0x0204 6A34 – Reserved 0x0204 6A38 – Reserved 0x0204 6A3C – Reserved 0x0204 6A40 – Reserved 0x0204 6A44 MDCTL17 Module Control 17 Register (SPI) 0x0204 6A48 MDCTL18 Module Control 18 Register (I2C) 0x0204 6A4C MDCTL19 Module Control 19 Register (PCI) 0x0204 6A50 MDCTL20 Module Control 20 Register (Video Port 0) 0x0204 6A54 MDCTL21 Module Control 21 Register (Video Port 1) 0x0204 6A58 MDCTL22 Module Control 22 Register (Video Port 2) 0x0204 6A5C MDCTL23 Module Control 23 Register (Video Port 3) 0x0204 6A60 MDCTL24 Module Control 24 Register (Video Port 4) 0x0204 6A64 MDCTL25 Module Control 25 Register (EMIFA) 0x0204 6A68 MDCTL26 Module Control 26 Register (TIMER 2) 0x0204 6A6C MDCTL27 Module Control 27 Register (TIMER 3) 0x0204 6A70 MDCTL28 Module Control 28 Register (VIC) 0x0204 6A74 MDCTL29 Module Control 29 Register (McASP) 0x0204 6A78 MDCTL30 Module Control 30 Register (UART) 0x0204 6A7C MDCTL31 Module Control 31 Register (VICP) 0x0204 6A80 – Reserved 0x0204 6A84 MDCTL33 Module Control 33 Register (C64x+ CPU) 0x0204 6A8C MDCTL34 Module Control 34 Register (Ethernet Subsystem) 0x0204 6A90- 0x0204 6FFF – Reserved

SPRS372 – MAY 2007

6.3.5 DM647/DM648 Power and Clock Domains

The DM647/DM648 includes two power domains: the System Domain and the Ethernet Subsystem Domain. Both of these power domains are always on when the chip is on. Both of these domains are powered by the C

The primary PLL controller generates the input clock to the C64x+ megamodule as well as most of the system peripherals such as the multichannel audio serial ports (McASPs) and the external memory interface (EMIFA). The secondary PLL controller generates interface clocks for the DDR2 memory controller. The Ethernet Subsystem is clocked through the SerDes module, which takes input from REFCLKP/N. The primary PLL controller (PLL1 controller) uses the device input clock CLKIN1 and the secondary PLL controller (PLL2 controller) uses the device input clock CLKIN2

Table 6-4 provides a listing of the DM647/DM648 clock domains.

POWER DOMAIN CLOCK DOMAIN PERIPHERAL/MODULE/USAGE

System Domain CLKDIV1 C64x+ CPU System Domain CLKDIV3 EDMA/SCR

Submit Documentation Feedback Peripheral Information and Electrical Specifications 61

pins of the DM647/DM648 device.

VDD

Table 6-4. DM647/DM648 Power and Clock Domains

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TMS320DM647/TMS320DM648 Digital Media Processor

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Table 6-4. DM647/DM648 Power and Clock Domains (continued)

POWER DOMAIN CLOCK DOMAIN PERIPHERAL/MODULE/USAGE

System Domain CLKDIV3 TSIP0 System Domain CLKDIV3 TSIP1 System Domain CLKDIV3 DDR Subsystem System Domain CLKDIV3 Video Port 0 System Domain CLKDIV3 Video Port 1 System Domain CLKDIV3 Video Port 2 System Domain CLKDIV3 Video Port 3 System Domain CLKDIV3 Video Port 4 System Domain CLKDIV3 EMIFA System Domain CLKDIV6 HPI System Domain CLKDIV6 PCI System Domain CLKDIV6 VLYNQ System Domain CLKDIV6 UART System Domain CLKDIV6 I2C System Domain CLKDIV6 TIMER 0 System Domain CLKDIV6 TIMER 1 System Domain CLKDIV6 TIMER 2 System Domain CLKDIV6 TIMER 3 System Domain CLKDIV6 SPI System Domain CLKDIV6 McASP System Domain CLKDIV6 VIC System Domain CLKDIV6 GPIO System Domain CLKDIV6 PLL Controller 1 System Domain CLKDIV6 PLL Controller 2 System Domain CLKDIV6 Config SCR System Domain CLKDIV4 0 Internal EMIFA Clock System Domain CLKDIV4 1 Emulation and Trace System Domain CLKDIV4 2 VICP cop_clk/2 System Domain CLKDIV2 VICP cop_clk Ethernet Subsystem Domain SerDes TXBCLK Ethernet Subsystem

The DM647/DM648 architecture is divided into the power and clock domains shown in Table 6-5 , which further shows the clock domains and their ratios.

SUBSYSTEM CLOCK DOMAIN DOMAIN CLOCK SOURCE FIXED RATIO VS SYSREFCLK

DSP Subsystem CLKDIV1 PLLC1.REFSYSCLK Peripherals (CLKDIV3 Domain) CLKDIV3 PLLC1.SYSCLK1 1:3 Emulation/Trace CLKDIV4 1 PLLC1.SYSCLK2 1:4 Peripherals (CLKDIV6 Domain) CLKDIV6 PLLC1.SYSCLK3 1:6 Internal EMIFA Clock CLKDIV4 0 PLLC1.SYSCLK4 1:4 VICP cop_clk/2 CLKDIV4 2 PLLC1.SYSCLK5 1:4 VICP cop_clk CLKDIV2 PLLC1.SYSCLK6 1:2

Peripheral Information and Electrical Specifications62 Submit Documentation Feedback

Table 6-5. DM647/DM648 Clock Domain Assignment

FREQUENCY

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6.3.6 Preserving Boundary-Scan Functionality on DDR2 Memory Pins

TMS320DM647/TMS320DM648

Digital Media Processor

SPRS372 – MAY 2007

Similarly, when the DDR2 Memory Controller is not used, the V connected directly to ground (V functioning on the DDR2 Memory Controller pins. To preserve boundary-scan functionality on the DDR2 Memory Controller pins, V

• V the D

• RSV19 - connect this pin to ground (V

• RSV20 - connect this pin to the 1.8-V I/O supply (D

6.4 PLL1 and PLL1 Controller

The primary PLL controller generates the input clock to the C64x+ megamodule (including the CPU) as well as most of the system peripherals such as the multichannel audio serial ports (McASPs) and the external memory interface (EMIFA).

) to save power. However, this will prevent boundary-scan from

REFSSTL

- connect to a voltage of DVDD18/2. The DVDD18/2 voltage can be generated directly from supply using two 1-k Ω resistors to form a resistor divider circuit.

VDD18

, RSV11, and RSV12 should be connected as follows:

) via a 200- Ω resistor.

VDD18

REFSSTL

) via a 200- Ω resistor

, RSV19, and RSV20 pins can be

Submit Documentation Feedback Peripheral Information and Electrical Specifications 63

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PRODUCT PREVIEW

DIVIDERD4

CLKIN1

PLLEN(PLLCTL.[0])

SYSCLK1

SYSCLK2

AECLKIN(ExternalEMIFClockInput)

EMIFA

DIVIDERPREDIV

DIVIDERD1

DIVIDERD2

AECLKOUT

PLLV1

EMIFilter

+1.8V

560pF 0.1 F

SYSCLK5

SYSREFCLK

(C64x+MegaModule)

DIVIDERD5

PLL1Controller

(EMIFInputClock)

DM647/DM648

/1,/2,/3

ENA

PREDEN(PREDIV.[15])

ENA

/2,/4,

...,/16

PLL1

PLLM

x1,x15,

x20,x25,

x30,x32

D4EN(PLLDIV4.[15])

SYSCLK4 (InternalEMIFClockInput)

SYSCLK4

PLLOUT

PLLREF

SYSCLK3

DIVIDERD3

SYSCLK6

DIVIDERD6

ENA

D2EN(PLLDIV2.[15])

/1,/2, ...,/8

(EmulationandTrace)

VICP cop_clk/2

VICP cop_clk

01

AECLKINSEL (AEA[17]pin)

10

VCLK

VLYNQ

CLKDIR (CTRL.[15])

/1,/2, ...,/8

CLKDIV

(CTRL.[18:16])

TMS320DM647/TMS320DM648 Digital Media Processor

SPRS372 – MAY 2007

As shown in Figure 6-5 , the PLL1 controller features a software-programmable PLL multiplier controller (PLLM) and five dividers (PREDIV, D1, D2, D3, D4, D5, D6). The PLL1 controller uses the device input clock CLKIN1 to generate a system reference clock (SYSREFCLK) and five system clocks (SYSCLK1, SYSCLK2, SYSCLK3, SYSCLK4, SYSCLK5 and SYSCLK6). PLL1 power is supplied externally via the PLL1 power-supply pin (PLLV1). An external EMI filter circuit must be added to PLLV1, as shown in Figure 8-11. The 1.8-V supply of the EMI filter must be from the same 1.8-V power plane supplying the I/O power-supply pin, D

Peripheral Information and Electrical Specifications64 Submit Documentation Feedback

Figure 6-5. PLL Input Clock

. TI requires EMI filter manufacturer Murata, part number NFM18CC222R1C3.

VDD18

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All PLL external components (C1, C2, and the EMI Filter) must be placed as close to the C64x+ DSP device as possible. For the best performance, TI recommends that all the PLL external components be on a single side of the board without jumpers, switches, or components other than the ones shown. For reduced PLL jitter, maximize the spacing between switching signals and the PLL external components (C1, C2, and the EMI Filter).The minimum CLKIN1 rise and fall times should also be observed. For the input clock timing requirements, see Section 6.4.4 .

6.4.1 PLL1 Controller Device-Specific Information

As shown in Figure 6-5 , the PLL1 controller generates several internal clocks including the system reference clock (SYSREFCLK), and the system clocks (SYSCLK1/2/3/4/5/6). The high-frequency clock signal SYSREFCLK is directly used to clock the C64x+ megamodule (including the CPU) and also serves as a reference clock for the rest of the DSP system. Dividers D1, D2, D3, D4, D5 and D6 divide the high-frequency clock SYSREFCLK to generate SYSCLK1, SYSCLK2, SYSCLK3, SYSCLK4, SYSCLK5 and SYSCLK6, respectively.

The system clocks are used to clock different portions of the DSP as follows:

• SYSCLK1 is used for the following modules 3PDMA, the SCR and the bridges, DDR Subsystem internal logic, Video Port 0, Video Port 1, Video Port 2, Video Port 3, Video Port 4, EMIFA internal logic.

• SYSCLK2 is used for Emulation and Trace

• SYSCLK3 is used for most of the peripherals. These modules are clocked from SYSCLK3: HPI, PCI,

VLYNQ, UART, I2C, TIMER 0, TIMER 1, TIMER 2, TIMER 3, SPI, McASP, VIC, GPIO, PLL Controller 1, PLL Controller 2, Config SCR

• SYSCLK4 is used as the EMIFA AECLKOUT

• SYSCLK5 is used as the VICP internal clock

• SYSCLK6 is used as the VICP internal clock

TMS320DM647/TMS320DM648

Digital Media Processor

SPRS372 – MAY 2007

The PLL multiplier controller (PLLM) must be programmed after reset. There is no hardware CLKMODE selection on the DM647/DM648 device. Since the divider ratio bits for dividers D1, D3, D5, and D6 are fixed, the frequency of SYSCLK1, SYCLK3, SYSCLK5 and SYSCLK6 is tied to the frequency of SYSREFCLK. However, the frequency of SYSCLK2 and SYSCLK4 depends on the configuration of dividers D2 and D4. For example, with PLLM in the PLL1 multiply control register set to 10011b (x20 mode) and a 35 MHz CLKIN1 input, the PLL output PLLOUT is set to 700 MHz and SYSCLK1 and SYSCLK3 run at 233 MHz and 117 MHz, respectively. Divider D4 can be programmed through the PLLDIV4 register to divide SYSREFCLK by 10 such that SYSCLK4 runs at 70 MHz.

Note that there is a minimum and maximum operating frequency for PLLREF, PLLOUT, SYSCLK4, and SYSCLK5. The PLL1 Controller must not be configured to exceed any of these constraints (certain combinations of external clock input, internal dividers, and PLL multiply ratios might not be supported). For the PLL clocks input and output frequency ranges, see Table 6-6 .

Table 6-6. PLL1 Clock Frequency Ranges

CLOCK SIGNAL MIN MAX UNIT

CLKIN1 66.6 MHz

PLLREF (PLLEN = 1)

PLLOUT

(1) Only applies when the PLL1 Controller is set to PLL mode (PLLEN = 1 in the PLLCTL register) (2) Only for DM648 device

(1)

33.3 66.6 MHz 400 900

(2)

MHz

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CLKIN

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6.4.2 PLL1 Controller Operating Modes

The PLL1 controller has two modes of operation: bypass mode and PLL mode. The mode of operation is determined by the PLLEN bit of the PLL control register (PLLCTL). In PLL mode, SYSREFCLK is generated from the device input clock CLKIN1 using the divider PREDIV and the PLL multiplier PLLM. In bypass mode, CLKIN1 is fed directly to SYSREFCLK.

All hosts (HPI, PCI, etc.) must hold off accesses to the DSP while the frequency of its internal clocks is changing. A mechanism must be in place such that the DSP notifies the host when the PLL configuration has completed.

6.4.3 PLL1 Stabilization, Lock, and Reset Times

The PLL stabilization time is the amount of time that must be allotted for the internal PLL regulators to become stable after device power-up. The PLL should not be operated until this stabilization time has expired.

The PLL reset time is the amount of wait time needed when resetting the PLL (writing PLLRST = 1), in order for the PLL to properly reset, before bringing the PLL out of reset (writing PLLRST = 0). For the PLL1 reset time value, see Table 6-7 .

Table 6-7. PLL1 Stabilization, Lock, and Reset Times

PLL stabilization time 150 µ s

PLL lock time 2000*C

PLL reset time 128*C

(1) C = CLKIN1 cycle time in ns. For example, when CLKIN1 frequency is 50 MHz, use C = 20 ns.

6.4.4 PLL1 Controller Input and Output Clock Electrical Data/Timing

Table 6-8. Timing Requirements for CLKIN1

NO. UNIT

1 t

c(CLKIN1)

2 t

w(CLKIN1H)

3 t

w(CLKIN1L)

4 t

t(CLKIN1)

5 t

J(CLKIN1)

(1) The reference points for the rise and fall transitions are measured at 3.3-V VILMAX and VIHMIN. (2) C = CLKIN1 cycle time in ns. For example, when CLKIN1 frequency is 50 MHz, use C = 20 ns. (3) The PLL1 multiplier factors (x1 [BYPASS], x 15, x20, x25, x30, x32) further limit the MIN and MAX values for tc(CLKIN1). For more

detailed information on these limitations, see Section 6.3.5 , DM647/DM648 Power and Clock Domains.

Cycle time, CLKIN1 15 30.3 ns Pulse duration, CLKIN1 high 0.4C ns Pulse duration, CLKIN1 low 0.4C ns Transition time, CLKIN1 1.2 ns Period jitter, (peak-to-peak), CLKIN1 100 ps

MIN TYP MAX UNIT

(1)

(1) (2) (3)

(see Figure 6-6 )

-720

-900

PLL MODES

x1 (Bypass), x15, x20,

x25, x30, x32

MIN MAX

µ s µ s

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Figure 6-6. CLKIN1 Timing

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6.4.5 PLL1 Controller Register Description(s)

PLLV2

C162C161

EMIFilter

+1.8V

560pF 0.1 F

DM647/DM648

PLL2

CLKIN2

PLLM

x20

PLLOUTPLLREF

DDR2MemoryController

SYSCLK1(FromPLL Controller1)

A summary of the PLL1 controller registers is shown in Table 6-9 .

Table 6-9. PLL1 and Reset Controller Registers Memory Map

HEX ADDRESS RANGE REGISTER NAME DESCRIPTION

0x020E 0000 PID Peripheral Identification and Revision Information Register 0x020E 00E4 RSTYPE Reset Type Register 0x020E 0100 PLLCTL PLL Controller 1 Operations Control Register 0x020E 0110 PLLM PLL Controller 1 Multiplier Control Register 0x020E 0114 PREDIV PLL Pre-Divider Control Register 0x020E 011C PLLDIV2 PLL Controller 1 Control-Divider 2 Register (SYSCLK2) 0x020E 0138 PLLCMD PLL Controller 1 Command Register 0x020E 013C PLLSTAT PLL Controller 1 Status Register (Shows PLLC1 Status) 0x020E 0140 ALNCTL PLL Controller Clock Align Control Register 0x020E 0144 DCHANGE PLLDIV Ratio Change Status Register 0x020E 0150 SYSTAT PLL Controller 1 System Clock Status 1 Register (Indicates SYSCLK on/off

0x020E 0160 PLLDIV4 PLL Controller 1 Control-Divider 4 Register (SYSCLK4)

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Status)

6.5 PLL2 and PLL2 Controller

The secondary PLL controller generates interface clocks for the DDR2 memory controller. As shown in Figure 6-7 , the PLL2 controller features a PLL multiplier controller. The PLL multiplier is fixed

to a x20 multiplier rate. PLL2 power is supplied externally via the PLL2 power supply (PLLV2). An external PLL filter circuit must be added to PLLV2 as shown in Figure 6-7 . The 1.8-V supply for the EMI filter must be from the same 1.8-V power plane supplying the I/O power-supply pin, DVDD18. TI requires EMI filter manufacturer Murata, part number NFM18CC222R1C3.

Figure 6-7. PLL Controller

All PLL external components (C161, C162, and the EMI Filter) should be placed as close to the C64x+

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DSP device as possible. For the best performance, TI requires that all the PLL external components be on a single side of the board without jumpers, switches, or components other than the ones shown. For reduced PLL jitter, maximize the spacing between switching signals and the PLL external components (C161, C162, and the EMI Filter). The minimum CLKIN2 rise and fall times should also be observed. For the input clock timing requirements, see Section 6.5.3 , PLL2 Controller Input Clock Electrical Data/Timing.

6.5.1 PLL2 Controller Device-Specific Information

As shown in Figure 6-7 , the output of PLL2, PLLOUT, is directly fed to the DDR2 memory controller. This clock is used by the DDR2 memory controller to generate DDR2CLKOUT and DDR2CLKOUTz. Note that, internally, the data bus interface of the DDR2 memory controller is clocked by SYSCLK1 of the PLL1 controller.

Note that there is a minimum and maximum operating frequency for PLLREF, and PLLOUT. The clock generator must not be configured to exceed any of these constraints. For the PLL clocks input and output frequency ranges, see Table 6-10 .

CLOCK SIGNAL REQUIRED FREQUENCY UNIT

PLLREF (CLKIN2 ) 26.6 MHz

PLLOUT (DDR2 clock) 533 MHz

Table 6-10. PLL2 Clock Frequency Ranges

6.5.2 PLL2 Controller Operating Modes

Unlike the PLL1 controller that can operate in bypass and a PLL mode, the PLL2 controller only operates in PLL mode. PLL2 isunlocked only during the power-up sequence (see Section 6.7 ) and is locked by the time the RESETSTAT pin goes high. It does not lose lock during any of the other resets.

6.5.3 PLL2 Controller Input Clock Electrical Data/Timing

Table 6-11. Timing Requirements for CLKIN2

NO. UNIT

1 t

c(CLKIN2)

2 t

w(CLKIN2H)

3 t

w(CLKIN2L)

4 t

t(CLKIN2)

5 t

J(CLKIN2)

(1) The reference points for the rise and fall transitions are measured at 3.3-V VILMAX and VIHMIN. (2) C = CLKIN2 cycle time in ns. For example, when CLKIN2 frequency is 25 MHz, use C = 40 ns.

(1) (2)

(see Figure 6-8 )

-720

-900

PLL MODES x20

MIN MAX

Cycle time, CLKIN2 37.5 37.5 ns Pulse duration, CLKIN2 high 0.4C ns Pulse duration, CLKIN2 low 0.4C ns Transition time, CLKIN2 1.2 ns Period jitter, (peak-to-peak) CLKIN2 100 ps

Figure 6-8. CLKIN2 Timing

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6.5.4 PLL1 Controller Register Description(s)

A summary of the PLL2 controller registers is shown in Table 6-12 .

Table 6-12. PLL2 and Reset Controller Registers Memory Map

HEX ADDRESS RANGE REGISTER NAME DESCRIPTION

0x0212 0000 PID Peripheral Identification and Revision Information Register 0x0212 0100 PLLCTL PLL Controller 1 Operations Control Register 0x0212 0110 PLLM PLL Controller 1 Multiplier Control Register 0x0212 0138 PLLCMD PLL Controller 1 Command Register 0x0212 013C PLLSTAT PLL Controller 1 Status Register (Shows PLLC1 Status)

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6.6 Enhanced Direct Memory Access (EDMA3) Controller

The EDMA controller handles all data transfers between memories and the device slave peripherals on the DM648 device. These data transfers include cache servicing, non-cacheable memory accesses, user-programmed data transfers, and host accesses. These are summarized as follows:

• Transfer to/from on-chip memories – DSP L1D memory – DSP L2 memory

• Transfer to/from external storage – DDR2 SDRAM – Synchronous/Asynchronous EMIF (EMIFA)

• Transfer to/from peripherals/hosts – VLYNQ – HPI – McASP – UART – Video Port 0/1/2/3/4 – Timer 0/1/2/3 – SPI – I2C

6.6.1 EDMA3 Channel Synchronization Events

The EDMA supports up to 64 EDMA channels which service peripheral devices and external memory.

Table 6-13 lists the source of EDMA synchronization events associated with each of the programmable

EDMA channels. For the DM648 device, the association of an event to a channel is fixed; each of the EDMA channels has one specific event associated with it. These specific events are captured in the EDMA event registers (ER, ERH) even if the events are disabled by the EDMA event enable registers (EER, EERH). For more detailed information on the EDMA module and how EDMA events are enabled, captured, processed, linked, chained, and cleared, etc., see the TMS320DM647/DM648 DSP Enhanced DMA (EDMA) Controller User's Guide (literature number SPRUEL2 ).

TPCC DEFAULT BINARY DEFAULT EVENT TPCC DEFAULT BINARY DEFAULT EVENT

CHANN EVENT# CHANNEL EVENT #

0 0 000 0000 HPI/PCI : DSPINT 32 32 010 0000 VP2EVTYA 1 1 000 0001 TIMER0 : TINT0L 33 33 010 0001 VP2EVTUA 2 2 000 0010 TIMER0 : TINT0H 34 34 010 0010 VP2EVTVA 3 3 000 0011 TIMER2 : TINT2L 35 35 010 0011 VP2EVTYB 4 4 000 0100 TIMER2 : TINT2H 36 36 010 0100 VP2EVTUB 5 5 000 0101 TIMER3 : TINT3L 37 37 010 0101 VP2EVTVB 6 6 000 0110 TIMER3 : TINT3H 38 38 010 0110 VP3EVTYA 7 7 000 0111 IMCOP: IMXINT 39 39 010 0111 VP3EVTUA 8 8 000 1000 IMCOP: VLCDINT 40 40 010 1000 VP3EVTVA

9 9 000 1001 IMCOP: DSQINT 41 41 010 1001 VP3EVTYB 10 10 000 1010 McASP: AXEVTE 42 42 010 1010 VP3EVTUB 11 11 000 1011 McASP: AXEVTO 43 43 010 1011 VP3EVTVB 12 12 000 1100 McASP: AXEVT 44 44 010 1100 ICREVT 13 13 000 1101 McASP: AREVTE 45 45 010 1101 ICXEVT 14 14 000 1110 McASP: AREVTO 46 46 010 1110 SPI: SPIXEVT

Table 6-13. EDMA Channel Synchronization Events

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Table 6-13. EDMA Channel Synchronization Events (continued)

TPCC DEFAULT BINARY DEFAULT EVENT TPCC DEFAULT BINARY DEFAULT EVENT

CHANN EVENT# CHANNEL EVENT #

15 15 000 1111 McASP: AREVT 47 47 010 1111 SPI: SPIREVT 16 16 001 0000 TIMER1 : TINT1L 48 48 011 0000 VP4EVTYA 17 17 001 0001 TIMER1 : TINT1H 49 49 011 0001 VP4EVTUA 18 18 001 0010 UART: URXEVT 50 50 011 0010 VP4EVTVA 19 19 001 0011 UART: UTXEVT 51 51 011 0011 VP4EVTYB 20 20 001 0100 VP0EVTYA 52 52 011 0100 VP4EVTUB 21 21 001 0101 VP0EVTUA 53 53 011 0101 VP4EVTVB 22 22 001 0110 VP0EVTVA 54 54 011 0110 GPIO : GPINT6 23 23 001 0111 VP0EVTYB 55 55 011 0111 GPIO : GPINT7 24 24 001 1000 VP0EVTUB 56 56 011 1000 GPIO : GPINT8 25 25 001 1001 VP0EVTVB 57 57 011 1001 GPIO : GPINT9 26 26 001 1010 VP1EVTYA 58 58 011 1010 GPIO : GPINT10 27 27 001 1011 VP1EVTUA 59 59 011 1011 GPIO : GPINT11 28 28 001 1100 VP1EVTVA 60 60 011 1100 GPIO : GPINT12 29 29 001 1101 VP1EVTYB 61 61 011 1101 GPIO : GPINT13 30 30 001 1110 VP1EVTUB 62 62 011 1110 GPIO : GPINT14 31 31 001 1111 VP1EVTVB 63 63 011 1111 GPIO : GPINT15

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6.6.2 EDMA Peripheral Register Description(s)

Table 6-14 lists the EDMA registers, their corresponding acronyms, and DM648 device memory locations.

Table 6-14. DM647/DM648 EDMA Channel Controller Registers

HEX ADDRESS ACRONYM REGISTER NAME

0x02A0 0000 PID Peripheral ID Register 0x02A0 0004 CCCFG EDMA3CC Configuration Register

0x02A0 0008 - 0x02A0 00FC Reserved

0x02A0 0100 DCHMAP0 DMA Channel 0 Mapping Register 0x02A0 0104 DCHMAP1 DMA Channel 1 Mapping Register 0x02A0 0108 DCHMAP2 DMA Channel 2 Mapping Register 0x02A0 010C DCHMAP3 DMA Channel 3 Mapping Register 0x02A0 0110 DCHMAP4 DMA Channel 4 Mapping Register 0x02A0 0114 DCHMAP5 DMA Channel 5 Mapping Register 0x02A0 0118 DCHMAP6 DMA Channel 6 Mapping Register 0x02A0 011C DCHMAP7 DMA Channel 7 Mapping Register 0x02A0 0120 DCHMAP8 DMA Channel 8 Mapping Register 0x02A0 0124 DCHMAP9 DMA Channel 9 Mapping Register 0x02A0 0128 DCHMAP10 DMA Channel 10 Mapping Register 0x02A0 012C DCHMAP11 DMA Channel 11 Mapping Register 0x02A0 0130 DCHMAP12 DMA Channel 12 Mapping Register 0x02A0 0134 DCHMAP13 DMA Channel 13 Mapping Register 0x02A0 0138 DCHMAP14 DMA Channel 14 Mapping Register 0x02A0 013C DCHMAP15 DMA Channel 15 Mapping Register 0x02A0 0140 DCHMAP16 DMA Channel 16 Mapping Register 0x02A0 0144 DCHMAP17 DMA Channel 17 Mapping Register 0x02A0 0148 DCHMAP18 DMA Channel 18 Mapping Register

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Table 6-14. DM647/DM648 EDMA Channel Controller Registers (continued)

HEX ADDRESS ACRONYM REGISTER NAME

0x02A0 014C DCHMAP19 DMA Channel 19 Mapping Register 0x02A0 0150 DCHMAP20 DMA Channel 20 Mapping Register 0x02A0 0154 DCHMAP21 DMA Channel 21 Mapping Register 0x02A0 0158 DCHMAP22 DMA Channel 22 Mapping Register 0x02A0 015C DCHMAP23 DMA Channel 23 Mapping Register 0x02A0 0160 DCHMAP24 DMA Channel 24 Mapping Register 0x02A0 0164 DCHMAP25 DMA Channel 25 Mapping Register 0x02A0 0168 DCHMAP26 DMA Channel 26 Mapping Register 0x02A0 016C DCHMAP27 DMA Channel 27 Mapping Register 0x02A0 0170 DCHMAP28 DMA Channel 28 Mapping Register 0x02A0 0174 DCHMAP29 DMA Channel 29 Mapping Register 0x02A0 0178 DCHMAP30 DMA Channel 30 Mapping Register 0x02A0 017C DCHMAP31 DMA Channel 31 Mapping Register 0x02A0 0180 DCHMAP32 DMA Channel 32 Mapping Register 0x02A0 0184 DCHMAP33 DMA Channel 33 Mapping Register 0x02A0 0188 DCHMAP34 DMA Channel 34 Mapping Register 0x02A0 018C DCHMAP35 DMA Channel 35 Mapping Register 0x02A0 0190 DCHMAP36 DMA Channel 36 Mapping Register 0x02A0 0194 DCHMAP37 DMA Channel 37 Mapping Register 0x02A0 0198 DCHMAP38 DMA Channel 38 Mapping Register 0x02A0 019C DCHMAP39 DMA Channel 39 Mapping Register 0x02A0 01A0 DCHMAP40 DMA Channel 40 Mapping Register 0x02A0 01A4 DCHMAP41 DMA Channel 41 Mapping Register 0x02A0 01A8 DCHMAP42 DMA Channel 42 Mapping Register

0x02A0 01AC DCHMAP43 DMA Channel 43 Mapping Register

0x02A0 01B0 DCHMAP44 DMA Channel 44 Mapping Register 0x02A0 01B4 DCHMAP45 DMA Channel 45 Mapping Register 0x02A0 01B8 DCHMAP46 DMA Channel 46 Mapping Register

0x02A0 01BC DCHMAP47 DMA Channel 47 Mapping Register

0x02A0 01C0 DCHMAP48 DMA Channel 48 Mapping Register 0x02A0 01C4 DCHMAP49 DMA Channel 49 Mapping Register 0x02A0 01C8 DCHMAP50 DMA Channel 50 Mapping Register

0x02A0 01CC DCHMAP51 DMA Channel 51 Mapping Register

0x02A0 01D0 DCHMAP52 DMA Channel 52 Mapping Register 0x02A0 01D4 DCHMAP53 DMA Channel 53 Mapping Register 0x02A0 01D8 DCHMAP54 DMA Channel 54 Mapping Register

0x02A0 01DC DCHMAP55 DMA Channel 55 Mapping Register

0x02A0 01E0 DCHMAP56 DMA Channel 56 Mapping Register 0x02A0 01E4 DCHMAP57 DMA Channel 57 Mapping Register 0x02A0 01E8 DCHMAP58 DMA Channel 58 Mapping Register

0x02A0 01EC DCHMAP59 DMA Channel 59 Mapping Register

0x02A0 01F0 DCHMAP60 DMA Channel 60 Mapping Register 0x02A0 01F4 DCHMAP61 DMA Channel 61 Mapping Register 0x02A0 01F8 DCHMAP62 DMA Channel 62 Mapping Register

0x02A0 01FC DCHMAP63 DMA Channel 63 Mapping Register

0x02A0 0200 QCHMAP0 QDMA Channel 0 Mapping to PaRAM Register 0x02A0 0204 QCHMAP1 QDMA Channel 1 Mapping to PaRAM Register

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Table 6-14. DM647/DM648 EDMA Channel Controller Registers (continued)

HEX ADDRESS ACRONYM REGISTER NAME

0x02A0 0208 QCHMAP2 QDMA Channel 2 Mapping to PaRAM Register 0x02A0 020C QCHMAP3 QDMA Channel 3 Mapping to PaRAM Register 0x02A0 0210 QCHMAP4 QDMA Channel 4 Mapping to PaRAM Register 0x02A0 0214 QCHMAP5 QDMA Channel 5 Mapping to PaRAM Register 0x02A0 0218 QCHMAP6 QDMA Channel 6 Mapping to PaRAM Register

0x02A0 021C QCHMAP7 QDMA Channel 7 Mapping to PaRAM Register 0x02A0 0220 - 0x02A0 021C - Reserved 0x02A0 0220 - 0x02A0 023C - Reserved

0x02A0 0240 DMAQNUM0 DMA Queue Number Register 0 (Channels 00 to 07)

0x02A0 0244 DMAQNUM1 DMA Queue Number Register 1 (Channels 08 to 15)

0x02A0 0248 DMAQNUM2 DMA Queue Number Register 2 (Channels 16 to 23)

0x02A0 024C DMAQNUM3 DMA Queue Number Register 3 (Channels 24 to 31) 0x02A0 0250 - 0x02A0 025C - Reserved

0x02A0 0260 QDMAQNUM CC QDMA Queue Number 0x02A0 0264 - 0x02A0 0280 – Reserved

0x02A0 0284 QUEPRI Queue Priority Register 0x02A0 0288 - 0x02A0 02FC – Reserved

0x02A0 0300 EMR Event Missed Register

0x02A0 0304 EMRH Event Missed Register High

0x02A0 0308 EMCR Event Missed Clear Register

0x02A0 030C EMCRH Event Missed Clear Register High

0x02A0 0310 QEMR QDMA Event Missed Register

0x02A0 0314 QEMCR QDMA Event Missed Clear Register

0x02A0 0318 CCERR EDMA3CC Error Register

0x02A0 031C CCERRCLR EDMA3CC Error Clear Register

0x02A0 0320 EEVAL Error Evaluate Register 0x02A0 0324 - 0x02A0 033C - Reserved

0x02A0 0340 DRAE0 DMA Region Access Enable Register for Region 0

0x02A0 0344 DRAEH0 DMA Region Access Enable Register High for Region 0

0x02A0 0348 DRAE1 DMA Region Access Enable Register for Region 1

0x02A0 034C DRAEH1 DMA Region Access Enable Register High for Region 1

0x02A0 0350 DRAE2 DMA Region Access Enable Register for Region 2

0x02A0 0354 DRAEH2 DMA Region Access Enable Register High for Region 2

0x02A0 0358 DRAE3 DMA Region Access Enable Register for Region 3

0x02A0 035C DRAEH3 DMA Region Access Enable Register High for Region 3

0x02A0 0360 DRAE4 DMA Region Access Enable Register for Region 4

0x02A0 0364 DRAEH4 DMA Region Access Enable Register High for Region 4

0x02A0 0368 DRAE5 DMA Region Access Enable Register for Region 5

0x02A0 036C DRAEH5 DMA Region Access Enable Register High for Region 5

0x02A0 0370 DRAE6 DMA Region Access Enable Register for Region 6

0x02A0 0374 DRAEH6 DMA Region Access Enable Register High for Region 6

0x02A0 0378 DRAE7 DMA Region Access Enable Register for Region 7

0x02A0 037C DRAEH7 DMA Region Access Enable Register High for Region 7

0x02A0 0380 QRAE0 QDMA Region Access Enable Register for Region 0

0x02A0 0384 QRAE1 QDMA Region Access Enable Register for Region 1

0x02A0 0388 QRAE2 QDMA Region Access Enable Register for Region 2

0x02A0 038C QRAE3 QDMA Region Access Enable Register for Region 3

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Table 6-14. DM647/DM648 EDMA Channel Controller Registers (continued)

HEX ADDRESS ACRONYM REGISTER NAME

0x02A0 0390 - 0x02A0 039C – Reserved

0x02A0 0400 Q0E0 Event Queue 0 Entry Register 0

0x02A0 0404 Q0E1 Event Queue 0 Entry Register 1

0x02A0 0408 Q0E2 Event Queue 0 Entry Register 2

0x02A0 040C Q0E3 Event Queue 0 Entry Register 3

0x02A0 0410 Q0E4 Event Queue 0 Entry Register 4

0x02A0 0414 Q0E5 Event Queue 0 Entry Register 5

0x02A0 0418 Q0E6 Event Queue 0 Entry Register 6

0x02A0 041C Q0E7 Event Queue 0 Entry Register 7

0x02A0 0420 Q0E8 Event Queue 0 Entry Register 8

0x02A0 0424 Q0E9 Event Queue 0 Entry Register 9

0x02A0 0428 Q0E10 Event Queue 0 Entry Register 10

0x02A0 042C Q0E11 Event Queue 0 Entry Register 11

0x02A0 0430 Q0E12 Event Queue 0 Entry Register 12

0x02A0 0434 Q0E13 Event Queue 0 Entry Register 13

0x02A0 0438 Q0E14 Event Queue 0 Entry Register 14

0x02A0 043C Q0E15 Event Queue 0 Entry Register 15

0x02A0 0440 Q1E0 Event Queue 1 Entry Register 0

0x02A0 0444 Q1E1 Event Queue 1 Entry Register 1

0x02A0 0448 Q1E2 Event Queue 1 Entry Register 2

0x02A0 044C Q1E3 Event Queue 1 Entry Register 3

0x02A0 0450 Q1E4 Event Queue 1 Entry Register 4

0x02A0 0454 Q1E5 Event Queue 1 Entry Register 5

0x02A0 0458 Q1E6 Event Queue 1 Entry Register 6

0x02A0 045C Q1E7 Event Queue 1 Entry Register 7

0x02A0 0460 Q1E8 Event Queue 1 Entry Register 8

0x02A0 0464 Q1E9 Event Queue 1 Entry Register 9

0x02A0 0468 Q1E10 Event Queue 1 Entry Register 10

0x02A0 046C Q1E11 Event Queue 1 Entry Register 11

0x02A0 0470 Q1E12 Event Queue 1 Entry Register 12

0x02A0 0474 Q1E13 Event Queue 1 Entry Register 13

0x02A0 0478 Q1E14 Event Queue 1 Entry Register 14

0x02A0 047C Q1E15 Event Queue 1 Entry Register 15

0x02A0 0480 Q2E0 Event Queue 2 Entry Register 0

0x02A0 0484 Q2E1 Event Queue 2 Entry Register 1

0x02A0 0488 Q2E2 Event Queue 2 Entry Register 2

0x02A0 048C Q2E3 Event Queue 2 Entry Register 3

0x02A0 0490 Q2E4 Event Queue 2 Entry Register 4

0x02A0 0494 Q2E5 Event Queue 2 Entry Register 5

0x02A0 0498 Q2E6 Event Queue 2 Entry Register 6

0x02A0 049C Q2E7 Event Queue 2 Entry Register 7

0x02A0 04A0 Q2E8 Event Queue 2 Entry Register 8

0x02A0 04A4 Q2E9 Event Queue 2 Entry Register 9

0x02A0 04A8 Q2E10 Event Queue 2 Entry Register 10

0x02A0 04AC Q2E11 Event Queue 2 Entry Register 11

0x02A0 04B0 Q2E12 Event Queue 2 Entry Register 12

0x02A0 04B4 Q2E13 Event Queue 2 Entry Register 13

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Table 6-14. DM647/DM648 EDMA Channel Controller Registers (continued)

HEX ADDRESS ACRONYM REGISTER NAME

0x02A0 04B8 Q2E14 Event Queue 2 Entry Register 14

0x02A0 04BC Q2E15 Event Queue 2 Entry Register 15

0x02A0 04C0 Q3E0 Event Queue 3 Entry Register 0

0x02A0 04C4 Q3E1 Event Queue 3 Entry Register 1

0x02A0 04C8 Q3E2 Event Queue 3 Entry Register 2

0x02A0 04CC Q3E3 Event Queue 3 Entry Register 3

0x02A0 04D0 Q3E4 Event Queue 3 Entry Register 4

0x02A0 04D4 Q3E5 Event Queue 3 Entry Register 5

0x02A0 04D8 Q3E6 Event Queue 3 Entry Register 6

0x02A0 04DC Q3E7 Event Queue 3 Entry Register 7

0x02A0 04E0 Q3E8 Event Queue 3 Entry Register 8

0x02A0 04E4 Q3E9 Event Queue 3 Entry Register 9

0x02A0 04E8 Q3E10 Event Queue 3 Entry Register 10

0x02A0 04EC Q3E11 Event Queue 3 Entry Register 11

0x02A0 04F0 Q3E12 Event Queue 3 Entry Register 12

0x02A0 04F4 Q3E13 Event Queue 3 Entry Register 13

0x02A0 04F8 Q3E14 Event Queue 3 Entry Register 14

0x02A0 04FC Q3E15 Event Queue 3 Entry Register 15 0x02A0 0500 - 0x02A0 051C - Reserved 0x02A0 0520 - 0x02A0 05FC - Reserved

0x02A0 0600 QSTAT0 Queue 0 Status Register 0x02A0 0604 QSTAT1 Queue 1 Status Register 0x02A0 0608 QSTAT2 Queue Status Register 2 0x02A0 060C QSTAT3 Queue Status Register 3

0x02A0 0610 - 0x02A0 061C - Reserved

0x02A0 0620 QWMTHRA Queue Watermark Threshold A Register for Q[3:0] 0x02A0 0624 – Reserved

0x02A0 0640 CCSTAT EDMA3CC Status Register 0x02A0 0644 - 0x02A0 06FC - Reserved 0x02A0 0700 - 0x02A0 0FFC - Reserved

0x02A0 1000 ER Event Register

0x02A0 1004 ERH Event Register High

0x02A0 1008 ECR Event Clear Register

0x02A0 100C ECRH Event Clear Register High

0x02A0 1010 ESR Event Set Register

0x02A0 1014 ESRH Event Set Register High

0x02A0 1018 CER Chained Event Register

0x02A0 101C CERH Chained Event Register High

0x02A0 1020 EER Event Enable Register

0x02A0 1024 EERH Event Enable Register High

0x02A0 1028 EECR Event Enable Clear Register

0x02A0 102C EECRH Event Enable Clear Register High

0x02A0 1030 EESR Event Enable Set Register

0x02A0 1034 EESRH Event Enable Set Register High

0x02A0 1038 SER Secondary Event Register

0x02A0 103C SERH Secondary Event Register High

0x02A0 1040 SECR Secondary Event Clear Register

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Table 6-14. DM647/DM648 EDMA Channel Controller Registers (continued)

HEX ADDRESS ACRONYM REGISTER NAME

0x02A0 1044 SECRH Secondary Event Clear Register High 0x02A0 1048 - 0x02A0 104C Reserved

0x02A0 1050 IER Interrupt Enable Register

0x02A0 1054 IERH Interrupt Enable Register High

0x02A0 1058 IECR Interrupt Enable Clear Register

0x02A0 105C IECRH Interrupt Enable Clear Register High

0x02A0 1060 IESR Interrupt Enable Set Register

0x02A0 1064 IESRH Interrupt Enable Set Register High

0x02A0 1068 IPR Interrupt Pending Register

0x02A0 106C IPRH Interrupt Pending Register High

0x02A0 1070 ICR Interrupt Clear Register

0x02A0 1074 ICRH Interrupt Clear Register High

0x02A0 1078 IEVAL Interrupt Evaluate Register

0x02A0 107C - Reserved

0x02A0 1080 QER QDMA Event Register

0x02A0 1084 QEER QDMA Event Enable Register

0x02A0 1088 QEECR QDMA Event Enable Clear Register

0x02A0 108C QEESR QDMA Event Enable Set Register

0x02A0 1090 QSER QDMA Secondary Event Register

0x02A0 1094 QSECR QDMA Secondary Event Clear Register 0x02A0 1098 - 0x02A0 1FFF - Reserved

0x02A0 2000- 0x02A0 2097 - Shadow Region 0 Channel Registers 0x02A0 2098 - 0x02A0 21FF - Reserved 0x02A0 2200 - 0x02A0 2297 - Shadow Region 1 Channel Registers 0x02A0 2298 - 0x02A0 23FF - Reserved 0x02A0 2400 - 0x02A0 2497 - Shadow Region 2 Channel Registers 0x02A0 2498 - 0x02A0 25FF - Reserved 0x02A0 2600 - 0x02A0 2697 - Shadow Region 3 Channel Registers 0x02A0 2698 - 0x02A0 27FF - Reserved 0x02A0 2800 - 0x02A0 2897 - Shadow Region 4 Channel Registers 0x02A0 2898 - 0x02A0 29FF - Reserved 0x02A0 2A00 - 0x02A0 2A97 - Shadow Region 5 Channel Registers

0x02A0 2A98 - 0x02A0 2BFF - Reserved 0x02A0 2C00 - 0x02A0 2C97 - Shadow Region 6 Channel Registers 0x02A0 2C98 - 0x02A0 2DFF - Reserved

0x02A0 2E00 - 0x02A0 2E97 - Shadow Region 7 Channel Registers 0x02A0 2E98 - 0x02A0 2FFF - Reserved

Table 6-15 shows an abbreviation of the set of registers which make up the parameter set for each of 128

EDMA events. Each of the parameter register sets consist of eight 32-bit word entries. Table 6-16 shows the parameter set entry registers with relative memory address locations within each of the parameter sets.

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Table 6-15. EDMA Parameter Set RAM

HEX ADDRESS RANGE DESCRIPTION

0x02A0 4000 - 0x02A0 401F Parameters Set 0 (8 32-bit words) 0x02A0 4020 - 0x02A0 403F Parameters Set 1 (8 32-bit words) 0x02A0 4040 - 0x02A0 405F Parameters Set 2 (8 32-bit words) 0x02A0 4060 - 0x02A0 407F Parameters Set 3 (8 32-bit words) 0x02A0 4080 - 0x02A0 409F Parameters Set 4 (8 32-bit words)

0x02A0 40A0 - 0x02A0 40BF Parameters Set 5 (8 32-bit words)

... ...

0x02A0 4FC0 - 0x02A0 4FDF Parameters Set 126 (8 32-bit words)

0x02A0 4FE0 - 0x02A0 4FFF Parameters Set 127 (8 32-bit words)

... ...

0x02A0 5FC0 - 0x02A0 5FDF Parameters Set 254 (8 32-bit words)

0x02A0 5FE0 - 0x02A0 5FFF Parameters Set 255 (8 32-bit words)

... ...

0x02A0 7FC0 - 0x02A0 7FDF Parameters Set 510 (8 32-bit words)

0x02A0 7FE0 - 0x02A0 7FFF Parameters Set 511 (8 32-bit words)

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Table 6-16. Parameter Set Entries

HEX OFFSET ADDRESS

WITHIN THE PARAMETER SET

0x0000 OPT Option 0x0004 SRC Source Address 0x0008 A_B_CNT A Count, B Count

0x000C DST Destination Address

0x0010 SRC_DST_BIDX Source B Index, Destination B Index 0x0014 LINK_BCNTRLD Link Address, B Count Reload 0x0018 SRC_DST_CIDX Source C Index, Destination C Index

0x001C CCNT C Count

Table 6-17. EDMA3 Transfer Controller 0 Registers

HEX ADDRESS RANGE ACRONYM REGISTER NAME

02A2 0000 PID Peripheral Identification Register 02A2 0004 TCCFG EDMA3TC Configuration Register

02A2 0008 - 02A2 00FC - Reserved

02A2 0100 TCSTAT EDMA3TC Channel Status Register

02A2 0104 - 02A2 011C - Reserved

02A2 0120 ERRSTAT Error Register 02A2 0124 ERREN Error Enable Register 02A2 0128 ERRCLR Error Clear Register

02A2 012C ERRDET Error Details Register

02A2 0130 ERRCMD Error Interrupt Command Register

02A2 0134 - 02A2 013C - Reserved

02A2 0140 RDRATE Read Rate Register

02A2 0144 - 02A2 023C - Reserved

02A2 0240 SAOPT Source Active Options Register 02A2 0244 SASRC Source Active Source Address Register

ACRONYM PARAMETER ENTRY

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Table 6-17. EDMA3 Transfer Controller 0 Registers (continued)

HEX ADDRESS RANGE ACRONYM REGISTER NAME

02A2 0248 SACNT Source Active Count Register

02A2 024C SADST Source Active Destination Address Register

02A2 0250 SABIDX Source Active Source B-Index Register 02A2 0254 SAMPPRXY Source Active Memory Protection Proxy Register 02A2 0258 SACNTRLD Source Active Count Reload Register

02A2 025C SASRCBREF Source Active Source Address B-Reference Register

02A2 0260 SADSTBREF Source Active Destination Address B-Reference Register

02A2 0264 - 02A2 027C - Reserved

02A2 0280 DFCNTRLD Destination FIFO Set Count Reload 02A2 0284 DFSRCBREF Destination FIFO Set Destination Address B Reference Register 02A2 0288 DFDSTBREF Destination FIFO Set Destination Address B Reference Register

02A2 028C - 02A2 02FC - Reserved

02A2 0300 DFOPT0 Destination FIFO Options Register 0 02A2 0304 DFSRC0 Destination FIFO Source Address Register 0 02A2 0308 DFCNT0 Destination FIFO Count Register 0

02A2 030C DFDST0 Destination FIFO Destination Address Register 0

02A2 0310 DFBIDX0 Destination FIFO BIDX Register 0 02A2 0314 DFMPPRXY0 Destination FIFO Memory Protection Proxy Register 0

02A2 0318 - 02A2 033C - Reserved

02A2 0340 DFOPT1 Destination FIFO Options Register 1 02A2 0344 DFSRC1 Destination FIFO Source Address Register 1 02A2 0348 DFCNT1 Destination FIFO Count Register 1

02A2 034C DFDST1 Destination FIFO Destination Address Register 1

02A2 0350 DFBIDX1 Destination FIFO BIDX Register 1 02A2 0354 DFMPPRXY1 Destination FIFO Memory Protection Proxy Register 1

02A2 0358 - 02A2 037C - Reserved

02A2 0380 DFOPT2 Destination FIFO Options Register 2 02A2 0384 DFSRC2 Destination FIFO Source Address Register 2 02A2 0388 DFCNT2 Destination FIFO Count Register 2

02A2 038C DFDST2 Destination FIFO Destination Address Register 2

02A2 0390 DFBIDX2 Destination FIFO BIDX Register 2 02A2 0394 DFMPPRXY2 Destination FIFO Memory Protection Proxy Register 2

02A2 0398 - 02A2 03BC - Reserved

02A2 03C0 DFOPT3 Destination FIFO Options Register 3 02A2 03C4 DFSRC3 Destination FIFO Source Address Register 3 02A2 03C8 DFCNT3 Destination FIFO Count Register 3 02A2 03CC DFDST3 Destination FIFO Destination Address Register 3 02A2 03D0 DFBIDX3 Destination FIFO BIDX Register 3 02A2 03D4 DFMPPRXY3 Destination FIFO Memory Protection Proxy Register 3

02A2 03D8 - 02A2 7FFF - Reserved

Table 6-18. EDMA3 Transfer Controller 1 Registers

HEX ADDRESS RANGE ACRONYM REGISTER NAME

02A2 8000 PID Peripheral Identification Register 02A2 8004 TCCFG EDMA3TC Configuration Register

02A2 8008 - 02A2 80FC - Reserved

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Table 6-18. EDMA3 Transfer Controller 1 Registers (continued)

HEX ADDRESS RANGE ACRONYM REGISTER NAME

02A2 8100 TCSTAT EDMA3TC Channel Status Register

02A2 8104 - 02A2 811C - Reserved

02A2 8120 ERRSTAT Error Register 02A2 8124 ERREN Error Enable Register 02A2 8128 ERRCLR Error Clear Register

02A2 812C ERRDET Error Details Register

02A2 8130 ERRCMD Error Interrupt Command Register

02A2 8134 - 02A2 813C - Reserved

02A2 8140 RDRATE Read Rate Register

02A2 8144 - 02A2 823C - Reserved

02A2 8240 SAOPT Source Active Options Register 02A2 8244 SASRC Source Active Source Address Register 02A2 8248 SACNT Source Active Count Register

02A2 824C SADST Source Active Destination Address Register

02A2 8250 SABIDX Source Active Source B-Index Register 02A2 8254 SAMPPRXY Source Active Memory Protection Proxy Register 02A2 8258 SACNTRLD Source Active Count Reload Register

02A2 825C SASRCBREF Source Active Source Address B-Reference Register

02A2 8260 SADSTBREF Source Active Destination Address B-Reference Register

02A2 8264 - 02A2 827C - Reserved

02A2 8280 DFCNTRLD Destination FIFO Set Count Reload 02A2 8284 DFSRCBREF Destination FIFO Set Destination Address B Reference Register 02A2 8288 DFDSTBREF Destination FIFO Set Destination Address B Reference Register

02A2 828C - 02A2 82FC - Reserved

02A2 8300 DFOPT0 Destination FIFO Options Register 0 02A2 8304 DFSRC0 Destination FIFO Source Address Register 0 02A2 8308 DFCNT0 Destination FIFO Count Register 0

02A2 830C DFDST0 Destination FIFO Destination Address Register 0

02A2 8310 DFBIDX0 Destination FIFO BIDX Register 0 02A2 8314 DFMPPRXY0 Destination FIFO Memory Protection Proxy Register 0

02A2 8318 - 02A2 833C - Reserved

02A2 8340 DFOPT1 Destination FIFO Options Register 1 02A2 8344 DFSRC1 Destination FIFO Source Address Register 1 02A2 8348 DFCNT1 Destination FIFO Count Register 1

02A2 834C DFDST1 Destination FIFO Destination Address Register 1

02A2 8350 DFBIDX1 Destination FIFO BIDX Register 1 02A2 8354 DFMPPRXY1 Destination FIFO Memory Protection Proxy Register 1

02A2 8358 - 02A2 837C - Reserved

02A2 8380 DFOPT2 Destination FIFO Options Register 2 02A2 8384 DFSRC2 Destination FIFO Source Address Register 2 02A2 8388 DFCNT2 Destination FIFO Count Register 2

02A2 838C DFDST2 Destination FIFO Destination Address Register 2

02A2 8390 DFBIDX2 Destination FIFO BIDX Register 2 02A2 8394 DFMPPRXY2 Destination FIFO Memory Protection Proxy Register 2

02A2 8398 - 02A2 83BC - Reserved

02A2 83C0 DFOPT3 Destination FIFO Options Register 3 02A2 83C4 DFSRC3 Destination FIFO Source Address Register 3

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Table 6-18. EDMA3 Transfer Controller 1 Registers (continued)

HEX ADDRESS RANGE ACRONYM REGISTER NAME

02A2 83C8 DFCNT3 Destination FIFO Count Register 3 02A2 83CC DFDST3 Destination FIFO Destination Address Register 3 02A2 83D0 DFBIDX3 Destination FIFO BIDX Register 3 02A2 83D4 DFMPPRXY3 Destination FIFO Memory Protection Proxy Register 3

02A2 83D8 - 02A2 FFFF - Reserved

HEX ADDRESS RANGE ACRONYM REGISTER NAME

02A3 0000 PID Peripheral Identification Register 02A3 0004 TCCFG EDMA3TC Configuration Register

02A3 0008 - 02A3 00FC - Reserved

02A3 0100 TCSTAT EDMA3TC Channel Status Register

02A3 0104 - 02A3 011C - Reserved

02A3 0120 ERRSTAT Error Register 02A3 0124 ERREN Error Enable Register 02A3 0128 ERRCLR Error Clear Register

02A3 012C ERRDET Error Details Register

02A3 0130 ERRCMD Error Interrupt Command Register

02A3 0134 - 02A3 013C - Reserved

02A3 0140 RDRATE Read Rate Register

02A3 0144 - 02A3 023C - Reserved

02A3 0240 SAOPT Source Active Options Register 02A3 0244 SASRC Source Active Source Address Register 02A3 0248 SACNT Source Active Count Register

02A3 024C SADST Source Active Destination Address Register

02A3 0250 SABIDX Source Active Source B-Index Register 02A3 0254 SAMPPRXY Source Active Memory Protection Proxy Register 02A3 0258 SACNTRLD Source Active Count Reload Register

02A3 025C SASRCBREF Source Active Source Address B-Reference Register

02A3 0260 SADSTBREF Source Active Destination Address B-Reference Register

02A3 0264 - 02A3 027C - Reserved

02A3 0280 DFCNTRLD Destination FIFO Set Count Reload 02A3 0284 DFSRCBREF Destination FIFO Set Destination Address B Reference Register 02A3 0288 DFDSTBREF Destination FIFO Set Destination Address B Reference Register

02A3 028C - 02A3 02FC - Reserved

02A3 0300 DFOPT0 Destination FIFO Options Register 0 02A3 0304 DFSRC0 Destination FIFO Source Address Register 0 02A3 0308 DFCNT0 Destination FIFO Count Register 0

02A3 030C DFDST0 Destination FIFO Destination Address Register 0

02A3 0310 DFBIDX0 Destination FIFO BIDX Register 0 02A3 0314 DFMPPRXY0 Destination FIFO Memory Protection Proxy Register 0

02A3 0318 - 02A3 033C - Reserved

02A3 0340 DFOPT1 Destination FIFO Options Register 1 02A3 0344 DFSRC1 Destination FIFO Source Address Register 1 02A3 0348 DFCNT1 Destination FIFO Count Register 1

02A3 034C DFDST1 Destination FIFO Destination Address Register 1

Table 6-19. EDMA3 Transfer Controller 2 Registers

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Table 6-19. EDMA3 Transfer Controller 2 Registers (continued)

HEX ADDRESS RANGE ACRONYM REGISTER NAME

02A3 0350 DFBIDX1 Destination FIFO BIDX Register 1 02A3 0354 DFMPPRXY1 Destination FIFO Memory Protection Proxy Register 1

02A3 0358 - 02A3 037C - Reserved

02A3 0380 DFOPT2 Destination FIFO Options Register 2 02A3 0384 DFSRC2 Destination FIFO Source Address Register 2 02A3 0388 DFCNT2 Destination FIFO Count Register 2

02A3 038C DFDST2 Destination FIFO Destination Address Register 2

02A3 0390 DFBIDX2 Destination FIFO BIDX Register 2 02A3 0394 DFMPPRXY2 Destination FIFO Memory Protection Proxy Register 2

02A3 0398 - 02A3 03BC - Reserved

02A3 03C0 DFOPT3 Destination FIFO Options Register 3 02A3 03C4 DFSRC3 Destination FIFO Source Address Register 3 02A3 03C8 DFCNT3 Destination FIFO Count Register 3 02A3 03CC DFDST3 Destination FIFO Destination Address Register 3 02A3 03D0 DFBIDX3 Destination FIFO BIDX Register 3 02A3 03D4 DFMPPRXY3 Destination FIFO Memory Protection Proxy Register 3

02A3 03D8 - 02A3 7FFF - Reserved

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Table 6-20. EDMA3 Transfer Controller 3 Registers

HEX ADDRESS RANGE ACRONYM REGISTER NAME

02A3 8000 PID Peripheral Identification Register 02A3 8004 TCCFG EDMA3TC Configuration Register

02A3 8008 - 02A3 80FC - Reserved

02A3 8100 TCSTAT EDMA3TC Channel Status Register

02A3 8104 - 02A3 811C - Reserved

02A3 8120 ERRSTAT Error Register 02A3 8124 ERREN Error Enable Register 02A3 8128 ERRCLR Error Clear Register

02A3 812C ERRDET Error Details Register

02A3 8130 ERRCMD Error Interrupt Command Register

02A3 8134 - 02A3 813C - Reserved

02A3 8140 RDRATE Read Rate Register

02A3 8144 - 02A3 823C - Reserved

02A3 8240 SAOPT Source Active Options Register 02A3 8244 SASRC Source Active Source Address Register 02A3 8248 SACNT Source Active Count Register

02A3 824C SADST Source Active Destination Address Register

02A3 8250 SABIDX Source Active Source B-Index Register 02A3 8254 SAMPPRXY Source Active Memory Protection Proxy Register 02A3 8258 SACNTRLD Source Active Count Reload Register

02A3 825C SASRCBREF Source Active Source Address B-Reference Register

02A3 8260 SADSTBREF Source Active Destination Address B-Reference Register

02A3 8264 - 02A3 827C - Reserved

02A3 8280 DFCNTRLD Destination FIFO Set Count Reload 02A3 8284 DFSRCBREF Destination FIFO Set Destination Address B Reference Register 02A3 8288 DFDSTBREF Destination FIFO Set Destination Address B Reference Register

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Table 6-20. EDMA3 Transfer Controller 3 Registers (continued)

HEX ADDRESS RANGE ACRONYM REGISTER NAME

02A3 828C - 02A3 82FC - Reserved

02A3 8300 DFOPT0 Destination FIFO Options Register 0 02A3 8304 DFSRC0 Destination FIFO Source Address Register 0 02A3 8308 DFCNT0 Destination FIFO Count Register 0

02A3 830C DFDST0 Destination FIFO Destination Address Register 0

02A3 8310 DFBIDX0 Destination FIFO BIDX Register 0 02A3 8314 DFMPPRXY0 Destination FIFO Memory Protection Proxy Register 0

02A3 8318 - 02A3 833C - Reserved

02A3 8340 DFOPT1 Destination FIFO Options Register 1 02A3 8344 DFSRC1 Destination FIFO Source Address Register 1 02A3 8348 DFCNT1 Destination FIFO Count Register 1

02A3 834C DFDST1 Destination FIFO Destination Address Register 1

02A3 8350 DFBIDX1 Destination FIFO BIDX Register 1 02A3 8354 DFMPPRXY1 Destination FIFO Memory Protection Proxy Register 1

02A3 8358 - 02A3 837C - Reserved

02A3 8380 DFOPT2 Destination FIFO Options Register 2 02A3 8384 DFSRC2 Destination FIFO Source Address Register 2 02A3 8388 DFCNT2 Destination FIFO Count Register 2

02A3 838C DFDST2 Destination FIFO Destination Address Register 2

02A3 8390 DFBIDX2 Destination FIFO BIDX Register 2 02A3 8394 DFMPPRXY2 Destination FIFO Memory Protection Proxy Register 2

02A3 8398 - 02A3 83BC - Reserved

02A3 83C0 DFOPT3 Destination FIFO Options Register 3 02A3 83C4 DFSRC3 Destination FIFO Source Address Register 3 02A3 83C8 DFCNT3 Destination FIFO Count Register 3 02A3 83CC DFDST3 Destination FIFO Destination Address Register 3 02A3 83D0 DFBIDX3 Destination FIFO BIDX Register 3 02A3 83D4 DFMPPRXY3 Destination FIFO Memory Protection Proxy Register 3

02A3 83D8 - 02A3 FFFF - Reserved

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6.7 Reset Controller

The reset controller detects the different types of resets supported on the DM647/DM648 devices and manages the distribution of those resets throughout the device.

The device has several types of resets: power-on reset, warm reset, max reset and system reset.

Table 6-21 explains further the types of reset, the reset initiator, and the effects of each reset on the chip.

See Section 6.7.8 for more information on the effects of each reset on the PLL controllers and their clocks.

Table 6-21. Device-Level Reset Types

TYPE INITIATOR EFFECT(s)

Power-on Reset POR pin Resets the entire chip including the test and emulation logic. Warm Reset RESET pin Max Reset Emulator Same as a warm reset

System Reset Emulator/PCI via the PRST pin

In addition to device-level global resets, the PSC provides the capability to cause local resets to peripherals and/or the CPU.

Resets everything except for the test and emulation logic and the Ethernet Subsystem

A system reset maintains memory contents and does not reset the test and emulation circuit and the Ethernet Subsystem. The device configuration pins are also not re-latched and system reset does not affect the state of the peripherals (enable/disable).

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6.7.1 Power-on Reset ( POR Pin)

Power-on reset (POR) is initiated by the POR pin and is used to reset the entire chip, including the test and emulation logic. Power-on reset is also referred to as a cold reset since the device usually goes through a power-up cycle. During power-up, the POR pin must be asserted (driven low) until the power supplies have reached their normal operating conditions. Note that a device power-up cycle is not required to initiate a power-on reset.

The following sequence must be followed during a power-on reset:

1. Wait for all power supplies to reach normal operating conditions while keeping the POR pin asserted (driven low). While POR is asserted, all pins will be in high-impedance mode. After the POR pin is deasserted (driven high), all Z-group pins, low-group pins, and high-group pins are set to their reset state and will remain at their reset state until configured by their respective peripheral. The clock and reset of each peripheral is determined by the default settings of the power and sleep controller (PSC).

2. Once all the power supplies are within valid operating conditions, the POR pin must remain asserted (low) for a minimum number of CLKIN2 cycles. The PLL1 controller input clock, CLKIN1, and the PCI input clock, PCLK, must also be valid during this time. PCLK is needed only if the PCI module is being used. If the DDR2 memory controller and the Ethernet Subsystem are not needed, CLKIN2 and REFCLKP/REFCLKN can be tied low. In this case, the POR pin must remain asserted (low) for a minimum of 256 CLKIN1 cycles after all power supplies have reached valid operating conditions. Within the low period of the POR pin, the following occurs:

a. The reset signals flow to the entire chip (including the test and emulation logic), resetting modules

that use reset asynchronously.

b. The PLL1 controller clocks are started at the frequency of the system reference clock. The clocks

are propagated throughout the chip to reset modules that use reset synchronously. By default, PLL1 is in reset and unlocked.

c. The PLL2 controller clocks are started at the frequency of the system reference clock. PLL2 is held

in reset. Since the PLL2 controller always operates in PLL mode, the system reference clock and all the system clocks are invalid at this point.

d. The RESETSTAT pin stays asserted (low), indicating the device is in reset.

3. The POR pin may now be deasserted (driven high). When the POR pin is deasserted, the configuration pin values are latched, and the PLL controllers change their system clocks to their default divide-down values. PLL2 is taken out of reset and automatically starts its locking sequence. Other

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device initialization is also started.

4. After device initialization is complete, the RESETSTAT pin is deasserted (driven high). By this time, PLL2 has already completed its locking sequence and is outputting a valid clock. The system clocks of both PLL controllers are allowed to finish their current cycles and then paused for 10 cycles of their respective system reference clocks. After the pause, the system clocks are restarted at their default divide-by settings.

The device is now out of reset; device execution begins as dictated by the selected boot mode.

6.7.2 Warm Reset ( RESET Pin)

A warm reset has the same effect as a power-on reset, except that in this case, the test and emulation logic are not reset.

The following sequence must be followed during a warm reset:

1. Hold the RESET pin low for a minimum of 24 CLKIN1 cycles. Within the low period of the RESET pin, the following occurs:

a. The Z-group pins, low-group pins, and the high-group pins are set to their reset state b. The reset signals flow to the entire chip (excluding the test and emulation logic), resetting modules

that use reset asynchronously

c. The PLL Controllers are reset. PLL1 switches back to PLL bypass mode, resetting all their

registers to default values. Both PLL1 and PLL2 are placed in reset and lose lock. The PLL1 controller clocks start running at the frequency of the system reference clock. The clocks are propagated throughout the chip to reset modules that use reset synchronously.

d. The RESETSTAT pin becomes active (low), indicating the device is in reset.

2. . The RESET pin may now be released (driven inactive high). When the RESET pin is released, the configuration pin values are latched and the PLL controllers immediately change their system clocks to their default divide-down values. Other device initialization is also started.

After device initialization is complete, the RESETSTAT pin goes inactive (high). All system clocks are allowed to finish their current cycles and then paused for 10 cycles of their respective system reference clocks. After the pause the system clocks are restarted at their default divide-by settings.

The clock and reset of each peripheral is determined by the default settings of the PSC. The device is now out of reset, device execution begins as dictated by the selected boot mode.

6.7.3 Maximum Reset

A maximum (max) reset is initiated by the emulator. The effects are the same as a warm reset, except the device boot and configuration pins are not re-latched. The emulator initiates a maximum reset via the ICEPICK module. This ICEPICK initiated reset is nonmaskable.

The max reset sequence is as follows:

1. Max reset is initiated by the emulator. During this time, the following happens: a. The reset signals flow to the entire chip, resetting all the modules on chip except the test and

emulation logic.

b. The PLL controllers are reset, PLL1 switches back to PLL bypass mode, resetting all their registers

to default values. Both PLL1 and PLL2 are placed in reset and lose lock.

c. The RESETSTAT pin becomes asserted (low), indicating the device is in reset.

2. After device initialization is complete, the PLL Controllers pause the system clocks for 10 cycles. At the end of these 10 cycles, the RESETSTAT pin is deasserted (driven high). At this point, the following occurs:

a. The I/O pins are controlled by the default peripherals (default peripherals are determined by

PINMUX register).

b. The clock and reset of each peripheral is determined by the default settings of the power and sleep

controller (PSC).

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6.7.4 System Reset

A system reset maintains memory contents and does not reset the clock logic or the test and emulation circuitry. The device configuration pins are also not re-latched and the state of the peripherals (enabled/disabled) is also not affected. A system reset is initiated by the emulator or by the PRST pin of PCI peripheral.

During a system reset, the following happens:

1. The RESETSTAT pin goes low to indicate an internal reset is being generated. The reset is allowed to

2. After the internal reset signal has propagated, the PLL controllers pause and restart their system

3. The boot sequence is started after the system clocks are restarted. Since the configuration pins

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c. The C64x+ begins executing from DSPBOOTADDR (determined by bootmode selection).

After the reset sequence, the boot sequence begins. Since the boot and configuration pins are not latched with a max reset, the previous values (as shown in the BOOTCFG register) are used to select the bootmode. For more details on the boot sequence, see the Using the TMS320DM647/DM648 Bootloader Application Report (literature number SPRAAJ1 ). After the boot sequence, follow the software initialization sequence.

propagate through the system. Internal system clocks are not affected.

clocks for about 10 cycles of their system reference clocks, but retain their configuration. The PLLs also remain locked.

(including the BOOTMODE[3:0] pins) are not latched with a system reset, the previous values, as shown in the BOOTCFG register, are used to select the boot mode.

6.7.5 Peripheral Local Reset

The user can configure the local reset and clock state of a peripheral through programming the PSC.

Table 6-2 identifies the LPSC numbers and the peripherals capable of being locally reset by the PSC. For

more detailed information on the programming of these peripherals by the PSC, see the TMS320DM647/TMS320DM648 DMP DSP Subsystem Reference Guide (literature number SPRUEU6 ).

6.7.6 Reset Priority

If any of the above reset sources occur simultaneously, the PLLCTRL processes only the highest priority reset request. The reset request priorities are as follows (high to low):

• Power-on Reset

• Maximum Reset

• Warm Reset

• System Reset

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6.7.7 Reset Controller Register

The reset type status (RSTYPE) register is the only register for the reset controller.

6.7.7.1 Reset Type Status Register Description

The reset type status (RSTYPE) register latches the cause of the last reset. If multiple reset sources occur simultaneously, this register latches the highest priority reset source. The reset type status register is shown in Figure 6-9 and described in Table 6-22 .

31 16

Reserved

R-0

15 4 3 2 1 0

Reserved SRST MRST WRST POR

R-0 R-0 R-0 R-0 R-0

LEGEND: R/W = Read/Write; R = Read only; - n = value after reset

Figure 6-9. Reset Type Status Register (RSTYPE)

Table 6-22. Reset Type Status Register (RSTYPE) Field Descriptions

Bit Field Value Description

31:4 Reserved Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.

3 SRST System reset

2 MRST Max reset

1 WRST Warm reset

0 POR Power-on reset

6.7.8 Reset Electrical Data/Timing

If a configuration pin must be routed out from the device, the internal pullup/pulldown (IPU/IPD) resistor should not be relied upon; TI recommends the use of an external pullup/pulldown resistor.

Table 6-23. Timing Requirements for Reset

0 System Reset was not the last reset to occur. 1 System Reset was the last reset to occur.

0 Max Reset was not the last reset to occur. 1 Max Reset was the last reset to occur.

0 Warm Reset was not the last reset to occur. 1 Warm Reset was the last reset to occur.

0 Power-on Reset was not the last reset to occur. 1 Power-on Reset was the last reset to occur.

NOTE

(1) (2)

(see Figure 6-10 and Figure 6-11 )

-720

NO. UNIT

5 t

w(POR)

6 t

w(RESET)

(1) C = 1/CLKIN1 clock frequency in ns. (2) D = 1/CLKIN2 clock frequency in ns. (3) If CLKIN2 is not used, t

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Pulse duration, POR low Pulse duration, RESET low ns

must be measured in terms of CLKIN1 cycles; otherwise, use CLKIN2 cycles.

w(POR)

-900

MIN MAX

(3)

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Table 6-23. Timing Requirements for Reset (see Figure 6-10 and Figure 6-11 ) (continued)

-720

NO. UNIT

7 t

su(boot)

8 t

h(boot)

(4) AEA[22:11], and UHPIEN are the boot configuration pins during device reset.

Setup time, boot mode and configuration pins valid before POR high or RESET high

Hold time, boot mode and configuration pins valid after POR high or RESET high

(4)

-900

MIN MAX

SPRS372 – MAY 2007

Table 6-24. Switching Characteristics Over Recommended Operating Conditions During Reset

(see Figure 6-11 )

-720

NO. PARAMETER UNIT

9 t

d(PORH-RSTATH)

Delay time, POR high AND RESET high to RESETSTAT high ns

-900

MIN MAX

For Figure 6-10 , note the following:

• Z group consists of: all I/O/Z and O/Z pins, except for Low and High group pins. Pins become high impedance as soon as their respective power supply has reached normal operating conditions. Pins remain in high impedance until configured otherwise by their respective peripherals.

• Low group consists of: Pins become low as soon as their respective power supply has reached normal operating conditions. Pins remain low until configured otherwise by their respective peripheral.

• High group consists of: . Pins become high as soon as their respective power supply has reached normal operating conditions. Pins remain high until configured otherwise by their respective peripheral.

• All peripherals must be enable through software following a power-on reset; for more details, see

Section 6.7.1 , Power-on Reset.

• For power-supply sequence requirements, see Section 6.3.1 .

(1) C = 1/CLKIN1 clock frequency in ns.

(1)

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CLKIN1

PCLK

RESET

RESETSTAT

SYSREFCLK(PLL1C)

ZGroup

POR

SYSCLK3

SYSCLK4

SYSCLK5

AECLKOUT (Internal)

BootandDevice

ConfigurationPins

LowGroup

HighGroup

CLKIN2

InternalResetPLL2C

SYSREFCLK(PLL2C)

SYSCLK1(PLL2C)

SYSCLK2

Undefined

Low

High-Z

Undefined

High

PLL2Unlocked

PLL2Locked

(A)

PLL2Unlocked

ClockValid

Undefined

ClockValid

(B)

PowerSuppliesRamping PowerSuppliesStable

TMS320DM647/TMS320DM648 Digital Media Processor

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A. SYSREFCLK of the PLL2 controller runs at CLKIN2 × 10. B. SYSCLK1 of PLL2 controller runs at SYSREFCLK/2 (default). C. Power supplies, CLKIN1, CLKIN2 (if used), and PCLK (if used) must be stable before the start of t

Figure 6-10. Power-Up Timing

w(POR)

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A. RESET should be used only after device has been powered up. For more details on the use of the RESET pin, see

Section 6.7 , Reset Controller.

B. A reset signal is generated internally during a Warm Reset. This internal reset signal has the same effect as the

RESET pin during a Warm Reset.

C. Boot and Device Configuration Inputs (during reset) include: AEA[22:11], and UHPIEN.

Figure 6-11. Warm Reset and Max Reset Timing

SPRS372 – MAY 2007

A. RESET should be used only after device has been powered up. For more details on the use of the RESET pin, see

Section 6.7 , Reset Controller.

B. Boot and Device Configuration Inputs (during reset) include: AEA[22:11], and UHPIEN.

Figure 6-12. System Reset Timing

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6.8 Interrupts

The C64x+ DSP interrupt controller combines device events into 12 prioritized interrupts. The source for each of the 12 CPU interrupts is user programmable. Also, the interrupt controller controls the generation of the CPU exception, NMI, and emulation interrupts and the generation of AEG events. Table 6-26 summarizes the C64x+ interrupt controller registers and memory locations. For more details on DSP interrupt control, see TMS320DM647/DM648 DMP DSP Subsystem Reference Guide (literature number

SPRUEU6 ).

DSP EVENT INTERRUPT SOURCE INTERRUPT NUMBER

0 EVT0 Output of event combiner 0, for events 1 – 31 1 EVT1 Output of event combiner 1, for events 32 – 63 2 EVT2 Output of event combiner 2, for events 64 – 95 3 EVT33 Output of event combiner 3, for events 96 – 127 4-8 Reserved 9 EMU_DTDMA ECM interrupt for:

10 Reserved Reserved 11 EMU_RTDXRX RTDX receive complete 12 EMU_RTDXTX RTDX transmit complete 13 IDMA0 EMC C64x+ EMC 0 14 IDMA1 EMC C64x+ EMC 1 15 HINT Host interrupt 16 I2CINT I2C interrupt 17 Reserved Reserved 18 AEASYNCERR EMIFA Error Interrupt 19 TINT2L Timer interrupt low 20 TINT2H Timer interrupt high 21 TINT3L Timer interrupt low 22 TINT3H Timer interrupt high 23 PSCINT PSC-ALLINT 24 TPCC_GINT EDMA3 channel global completion interrupt 25 SPIINT0 SPI Interrupt 26 SPIINT1 SPI Interrupt 27 DSQINT VICP – Sqr (DSP int) 28 IMXINT VICP – IMX 29 VLCDINT VICP - VLCD 30 -31 Reserved 32 RX_PULSE Ethernet Subsystem RX pulse interrupt 33 RX_THRESH_PULSE Ethernet Subsystem RX threshold interrupt 34 TX_PULSE Ethernet Subsystem TX pulse interrupt 35 MISC_PULSE Ethernet Subsystem MISC pulse interrupt 36 UART_INT UART Interrupt 37 VP0_INT VP0 Interrupt 38 VP1_INT VP1 Interrupt 39 VP2_INT VP2 Interrupt

Table 6-25. DM647/DM648 DSP Interrupts

• Host scan access

• DTDMA transfer complete

• AET interrupt

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Table 6-25. DM647/DM648 DSP Interrupts (continued)

DSP EVENT INTERRUPT SOURCE INTERRUPT NUMBER

40 VP3_INT VP3 Interrupt 41 VP4_INT VP4 Interrupt 42 GPIO_BNK1_INT (GPIO16:31) GPIO Bank 1 Interrupt. 43 AXINT TX Interrupt McASP 44 ARINT RX Interrupt McASP 45-49 Reserved 50 VINT VLYNQ Pulse Interrupt 51 GPINT0 GPIO Interrupt 52 GPINT1 GPIO Interrupt 53 GPINT2 GPIO Interrupt 54 GPINT3 GPIO Interrupt 55 GPINT4 GPIO Interrupt 56 GPINT5 GPIO Interrupt 57 GPINT6 GPIO Interrupt 58 GPINT7 GPIO Interrupt 59 GPINT8 GPIO Interrupt 60 GPINT9 GPIO Interrupt 61 GPINT10 GPIO Interrupt 62 GPINT11 GPIO Interrupt 63 GPINT12 GPIO Interrupt 64 GPINT13 GPIO Interrupt 65 GPINT14 GPIO Interrupt 66 GPINT15 GPIO Interrupt 67 TINT0L Timer interrupt low 68 TINT0H Timer interrupt high 69 TINT1L Timer interrupt low 70 TINT1H Timer interrupt high 71 EDMA3CC_INT0 EDMA3CC Completion Interrupt - Mask0 72 EDMA3CC_INT1 EDMA3CC Completion Interrupt – Mask1 73 EDMA3CC_INT2 EDMA3CC Completion Interrupt – Mask2 74 EDMA3CC_INT3 EDMA3CC Completion Interrupt – Mask3 75 EDMA3CC_INT4 EDMA3CC Completion Interrupt – Mask4 76 EDMA3CC_INT5 EDMA3CC Completion Interrupt – Mask5 77 EDMA3CC_INT6 EDMA3CC Completion Interrupt – Mask6 78 EDMA3CC_INT7 EDMA3CC Completion Interrupt – Mask7 79 EDMA3CC_ERRINT EDMA3CC Error Interrupt 80 EDMA3CC_MPINT EDMA3CC Memory Protection Interrupt 81 EDMA3TC0_ERRINT EDMA3TC0 Error Interrupt 82 EDMA3TC1_ERRINT EDMA3TC1 Error Interrupt 83 EDMA3TC2_ERRINT EDMA3TC2 Error Interrupt 84 EDMA3TC3_ERRINT EDMA3TC3 Error Interrupt 85 Reserved Reserved 86 Reserved Reserved 87 Reserved Reserved 88 Reserved Reserved 89 Reserved Reserved

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Table 6-25. DM647/DM648 DSP Interrupts (continued)

DSP EVENT INTERRUPT SOURCE INTERRUPT NUMBER

90 Reserved Reserved 91 Reserved Reserved 92 Reserved Reserved 93 Reserved Reserved 94 Reserved Reserved 95 Reserved Reserved 96 INTERR C64x+ Interrupt Controller Dropped CPU Interrupt Event 97 EMC_IDMAERR C64x+ EMC Invalid IDMA Parameters 98 Reserved Reserved 99 Reserved Reserved 100 EFIINTA EFI Interrupt from side A. 101 EFIINTB EFI Interrupt from side B 102 - 112 Reserved Reserved 113 L1P_ED L1P Single bit error detected during DMA read 114-115 Reserved Reserved 116 L2_ED1 L2 single bit error detected 117 L2_ED2 L2 two bit error detected 118 PDC_INT Power Down sleep interrupt 119 Reserved Reserved 120 L1P_CMPA L1P CPU memory protection fault 121 L1P_DMPA L1P DMA memory protection fault 122 L1D_CMPA L1D CPU memory protection fault 123 L1D_DMPA L1D DMA memory protection fault 124 L2_CMPA L2 CPU memory protection fault 125 L2_DMPA L2 DMA memory protection fault 126 IDMA_CMPA IDMA CPU memory protection fault 127 IDMA_BUSERR IDMA bus error interrupt

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Table 6-26. C64x+ Interrupt Controller Registers

HEX ADDRESS ACRONYM REGISTER DESCRIPTION

0x0180 0000 EVTFLAG0 Event flag register 0 0x0180 0004 EVTFLAG1 Event flag register 1 0x0180 0008 EVTFLAG2 Event flag register 2

0x0180 000C EVTFLAG3 Event flag register 3

0x0180 0020 EVTSET0 Event set register 0 0x0180 0024 EVTSET1 Event set register 1 0x0180 0028 EVTSET2 Event set register 2

0x0180 002C EVTSET3 Event set register 3

0x0180 0040 EVTCLR0 Event clear register 0 0x0180 0044 EVTCLR1 Event clear register 1 0x0180 0048 EVTCLR2 Event clear register 2

0x0180 004C EVTCLR3 Event clear register 3

0x0180 0080 EVTMASK0 Event mask register 0 0x0180 0084 EVTMASK1 Event mask register 1

0x0180 0088 EVTMASK2 Event mask register 2 0x0180 008C EVTMASK3 Event mask register 3 0x0180 00A0 MEVTFLAG0 Masked event flag register 0 0x0180 00A4 MEVTFLAG1 Masked event flag register 1 0x0180 00A8 MEVTFLAG2 Masked event flag register 2 0x0180 00AC MEVTFLAG3 Masked event flag register 3 0x0180 00C0 EXPMASK0 Exception mask register 0 0x0180 00C4 EXPMASK1 Exception mask register 1 0x0180 00C8 EXPMASK2 Exception mask register 2

0x0180 00CC EXPMASK3 Exception mask register 3

0x0180 00E0 MEXPFLAG0 Masked exception flag register 0 0x0180 00E4 MEXPFLAG1 Masked exception flag register 1 0x0180 00E8 MEXPFLAG2 Masked exception flag register 2 0x0180 00EC MEXPFLAG3 Masked exception flag register 3

0x0180 0104 INTMUX1 Interrupt mux register 1

0x0180 0108 INTMUX2 Interrupt mux register 2 0x0180 010C INTMUX3 Interrupt mux register 3

0x0180 0140 AEGMUX0 Advanced event generator mux register 0

0x0180 0144 AEGMUX1 Advanced event generator mux register 1

0x0180 0180 INTXSTAT Interrupt exception status

0x0180 0184 INTXCLR Interrupt exception clear

0x0180 0188 INTDMASK Dropped interrupt mask register 0x0180 01C0 EVTASRT Event assert register

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6.9 DDR2 Memory Controller

The 32-bit DDR2 memory controller bus of the DM647/DM648 is used to interface to JESD79D-2A standard-compliant DDR2 SDRAM devices. The DDR2 external bus interfaces only to DDR2 SDRAM devices; it does not share the bus with any other types of peripherals. The decoupling of DDR2 memories from other devices both simplifies board design and provides I/O concurrency from a second external memory interface, EMIFA.

The internal data bus clock frequency and DDR2 bus clock frequency directly affect the maximum throughput of the DDR2 bus. The data rate of the DDR2 bus is equal to the CLKIN2 frequency multiplied by 20. The internal data bus clock frequency of the DDR2 memory controller is fixed at a divide-by-three ratio of the CPU frequency. The maximum DDR2 throughput is determined by the smaller of the two bus frequencies. For example, if the internal data bus frequency is 300 MHz (CPU frequency is 900 MHz) and the DDR2 data rate is 533 MHz (266 MHz clock rate as CLKIN2 frequency is 26.6 MHz), the maximum data rate achievable by the DDR2 memory controller is 2.13 Gbytes/sec.

6.9.1 DDR2 Memory Controller Device-Specific Information

The approach to specifying interface timing for the DDR2 memory bus is different than on other interfaces such as EMIF and HPI. For these other interfaces the device timing was specified in terms of data manual specifications and I/O buffer information specification (IBIS) models.

For the DM647/DM648 DDR2 memory bus, the approach is to specify compatible DDR2 devices and provide the printed circuit board (PCB) solution and guidelines directly to the user. Texas Instruments (TI) has performed the simulation and system characterization to be sure all DDR2 interface timings in this solution are met. The complete DDR2 system solution is documented in the Implementing DDR2 PCB Layout on the TMS320DM647/DM648 DMSoC (literature number SPRAAK9) and TI supports only designs that follow the guidelines in this application report.

The DDR2 Memory Controller pins must be enabled by setting the DDR2_EN configuration pin (ABA0) high during device reset.

The ODT[1:0] pins of the memory controller must be left unconnected. The ODT pins on the DDR2 memory device(s) must be connected to ground.

The DDR2 memory controller on the DM647/DM648 devices supports the following memory topologies:

• A 32-bit wide configuration interfacing to two 16-bit wide DDR2 SDRAM devices.

• A 16-bit wide configuration interfacing to a single 16-bit wide DDR2 SDRAM device.

A race condition may exist when certain masters write data to the DDR2 memory controller. For example, if master A passes a software message via a buffer in external memory and does not wait for indication that the write completes, when master B attempts to read the software message, then the master B read may bypass the master A write and, thus, master B may read stale data and, therefore, receive an incorrect message.

Some master peripherals (e.g., EDMA3 transfer controllers) will always wait for the write to complete before signaling an interrupt to the system, thus avoiding this race condition. For masters that do not have hardware specification of write-read ordering, it may be necessary to specify data ordering via software.

If master A does not wait for indication that a write is complete, it must perform the following workaround:

1. Perform the required write.

2. Perform a dummy write to the DDR2 memory controller module ID and revision register.

3. Perform a dummy read to the DDR2 memory controller module ID and revision register.

4. Indicate to master B that the data is ready to be read after completion of the read in step 3. The completion of the read in step 3 ensures that the previous write was done.

The master peripherals that need to implement this workaround are HPI, PCI, and VLYNQ.

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6.9.2 DDR2 Memory Controller Peripheral Register Description(s)

Table 6-27. DDR2 Memory Controller Registers

HEX ADDRESS RANGE ACRONYM REGISTER NAME

0x7800 0000 MIDR DDR2 Memory Controller Module and Revision Register 0x7800 0004 DMCSTAT DDR2 Memory Controller Status Register 0x7800 0008 SDCFG DDR2 Memory Controller SDRAM Configuration Register 0x7800 000C SDRFC DDR2 Memory Controller SDRAM Refresh Control Register 0x7800 0010 SDTIM1 DDR2 Memory Controller SDRAM Timing 1 Register 0x7800 0014 SDTIM2 DDR2 Memory Controller SDRAM Timing 2 Register 0x7800 0018 - Reserved 0x7800 0020 BPRIO DDR2 Memory Controller Burst Priority Register

0x7800 0024 - 0x7800 004C - Reserved

0x7800 0050 - 0x7800 0078 - Reserved

0x7800 007C - 0x7800 00BC - Reserved

0x7800 00C0 - 0x7800 00E0 - Reserved

0x7800 00E4 DMCCTL DDR2 Memory Controller Control Register

0x7800 00E8 - 0x7800 00FC - Reserved

0x7800 0100 - 0x7FFF FFFF - Reserved

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Digital Media Processor

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6.9.3 DDR2 Memory Controller Electrical Data/Timing

The Implementing DDR2 PCB Layout on the TMS320DM647/DM648 DMSoC Application Report (literature number SPRAAK9 ) specifies a complete DDR2 interface solution for the DM647/DM648 as well as a list of compatible DDR2 devices. TI has performed the simulation and system characterization to be sure all DDR2 interface timings in this solution are met; therefore, no electrical data/timing information is supplied here for this interface.

TI supports only designs that follow the board design guidelines outlined in the application report, SPRAAA7, cited earlier.

NOTE

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6.10 External Memory Interface A (EMIFA)

The EMIFA can interface to a variety of external devices or ASICs, including:

• Pipelined and flow-through synchronous-burst SRAM (SBSRAM)

• ZBT (zero bus turnaround) SRAM and late write SRAM

• Synchronous FIFOs

• Asynchronous memory, including SRAM, ROM, and Flash

6.10.1 EMIFA Device-Specific Information

Timing analysis must be done to verify all ac timing requirements are met. TI recommends utilizing I/O buffer information specification (IBIS) to analyze all ac timing.

To properly use IBIS models to attain accurate timing analysis for a given system, see the Using IBIS Models for Timing Analysis Application Report (literature number SPRA839 ).

To maintain signal integrity, serial termination resistors should be inserted into all EMIFA output signal lines.

A race condition may exist when certain masters write data to the EMIFA. For example, if master A passes a software message via a buffer in external memory and does not wait for indication that the write completes, when master B attempts to read the software message, then the master B read may bypass the master A write and, thus, master B may read stale data and, therefore, receive an incorrect message.

If master A does not wait for indication that a write is complete, it must perform the following workaround:

1. Perform the required write.

2. Perform a dummy write to the EMIFA module ID and revision register.

3. Perform a dummy read to the EMIFA module ID and revision register.

4. Indicate to master B that the data is ready to be read after completion of the read in step 3. The completion of the read in step 3 ensures that the previous write was done.

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6.10.2 EMIFA Peripheral Register Description(s)

Table 6-28. EMIFA Registers

HEX ADDRESS RANGE ACRONYM REGISTER NAME

0x7000 0000 MIDR Module ID and Revision Register 0x7000 0004 STAT Status Register 0x7000 0008 - Reserved

0x7000 000C - 0x7000 001C - Reserved

0x7000 0020 BPRIO Burst Priority Register 0x7000 0024 - 0x7000 004C - Reserved 0x7000 0050 - 0x7000 007C - Reserved

0x7000 0080 CE2CFG EMIFA CE2 Configuration Register

0x7000 0084 CE3CFG EMIFA CE3 Configuration Register

0x7000 0088 - Reserved

0x7000 008C - Reserved 0x7000 0090 - 0x7000 009C - Reserved

0x7000 00A0 AWCC EMIFA Async Wait Cycle Configuration Register

0x7000 00A4 - 0x7000 00BC - Reserved

0x7000 00C0 INTRAW EMIFA Interrupt RAW Register

0x7000 00C4 INTMSK EMIFA Interrupt Masked Register

0x7000 00C8 INTMSKSET EMIFA Interrupt Mask Set Register

0x7000 00CC INTMSKCLR EMIFA Interrupt Mask Clear Register 0x7000 00D0 - 0x7000 00DC - Reserved 0x7000 00E0 - 0x77FF FFFF - Reserved

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AECLKIN

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6.10.3 EMIFA Electrical Data/Timing

Table 6-29. Timing Requirements for AECLKIN for EMIFA

NO. UNIT

1 t

c(EKI)

2 t

w(EKIH)

3 t

w(EKIL)

4 t

t(EKI)

5 t

J(EKI)

(1) The reference points for the rise and fall transitions are measured at VILMAX and V (2) E = the EMIF input clock (AECLKIN or SYSCLK4) period in ns for EMIFA. (3) Minimum AECLKIN cycle times must be met, even when AECLKIN is generated by an internal clock source. Minimum AECLKIN times

are based on internal logic speed; the maximum useable speed of the EMIF may be lower due to AC timing requirements.

(4) This timing applies only when AECLKIN is used for EMIFA.

Cycle time, AECLKIN 6 Pulse duration, AECLKIN high 2.7 ns Pulse duration, AECLKIN low 2.7 ns Transition time, AECLKIN 2 ns Period Jitter, AECLKIN 0.02E

(1) (2)

(see Figure 6-13 )

-720

-900

MIN MAX

(3)

MIN.

Figure 6-13. AECLKIN Timing for EMIFA

40 ns

(4)

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AECLKIN

AECLKOUT1

4 4

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Table 6-30. Switching Characteristics Over Recommended Operating Conditions for AECLKOUT for the

EMIFA Module

(1) (2) (3)

(see Figure 6-14 )

-720

NO. PARAMETER UNIT

-900

MIN MAX

1 t 2 t 3 t 4 t 5 t 6 t

c(EKO) w(EKOH) w(EKOL) t(EKO) d(EKIH-EKOH) d(EKIL-EKOL)

Cycle time, AECLKOUT E – 0.7 E + 0.7 ns Pulse duration, AECLKOUT high EH – 0.7 EH + 0.7 ns Pulse duration, AECLKOUT low EL – 0.7 EL + 0.7 ns Transition time, AECLKOUT 1 ns Delay time, AECLKIN high to AECLKOUT high 1 8 ns Delay time, AECLKIN low to AECLKOUT low 1 8 ns

A. E = the EMIF input clock (AECLKIN or SYSCLK4) period in ns for EMIFA. B. The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN. C. EH is the high period of E (EMIF input clock period) in ns and EL is the low period of E (EMIF input clock period) in ns

for EMIFA.

Figure 6-14. AECLKOUT Timing for the EMIFA Module

(1) E = the EMIF input clock (AECLKIN or SYSCLK4) period in ns for EMIFA. (2) The reference points for the rise and fall transitions are measured at V (3) EH is the high period of E (EMIF input clock period) in ns and EL is the low period of E (EMIF input clock period) in ns for EMIFA.

MAX and V

MIN.

6.10.3.1 Asynchronous Memory Timing

Table 6-31. Timing Requirements for Asynchronous Memory Cycles for EMIFA Module

(1) (2) (3)

(see Figure 6-15 and Figure 6-16 )

-720

NO. UNIT

3 t 4 t 5 t 6 t 7 t

8 t

9 t

su(EDV-AOEH) h(AOEH-EDV) su(ARDY-EKOH) h(EKOH-ARDY) w(ARDY)

d(ARDY-HOLD)

su(ARDY-HOLD)

Setup time, AEDx valid before AAOE high 6.5 ns Hold time, AEDx valid after AAOE high 3 ns Setup time, AARDY valid before AECLKOUT low 1 ns Hold time, AARDY valid after AECLKOUT low 2 ns Pulse width, AARDY assertion and deassertion 2E + 5 ns Delay time, from AARDY sampled deasserted on AECLKOUT falling to

beginning of programmed hold period Setup time, before end of programmed strobe period by which AARDY

should be asserted in order to insert extended strobe wait states.

(1) E = AECLKOUT period in ns for EMIFA (2) To specify data setup time, simply program the strobe width wide enough. (3) AARDY is internally synchronized. To use AARDY as an asynchronous input, the pulse width of the AARDY signal should be at least 2E

to specify setup and hold time is met.

-900

MIN MAX

4E ns

2E ns

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AECLKOUT

ACEx

ABE[7:0]

AEA[19:0]/

ABA[1:0]

AED[63:0]

AAOE/ASOE

(A)

AR/W

AAWE/ASWE

(A)

AARDY

(B)

ByteEnables

Address

ReadData

Hold=1

Strobe=4

Setup=1

DEASSERTED

TMS320DM647/TMS320DM648 Digital Media Processor

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Table 6-32. Switching Characteristics Over Recommended Operating Conditions for Asynchronous

Memory Cycles for EMIFA Module

NO. PARAMETER UNIT

1 t

2 t 10 t 11 t 12 t 13 t

osu(SELV-AOEL) oh(AOEH-SELIV) d(EKOH-AOEV) osu(SELV-AWEL) oh(AWEH-SELIV) d(EKOH-AWEV)

Output setup time, select signals valid to AAOE low RS * E – 1.5 ns Output hold time, AAOE high to select signals invalid RS * E – 1.9 ns Delay time, AECLKOUT high to AAOE valid 1 7 ns Output setup time, select signals valid to AAWE low WS * E – 1.7 ns Output hold time, AAWE high to select signals invalid WH * E – 1.8 ns Delay time, AECLKOUT high to AAWE valid 1.3 7.1 ns

(1) (2) (3)

(see Figure 6-15 and Figure 6-16 )

-720

-900 MIN MAX

A. AAOE / ASOE and AAWEASWE operate as AAOE (identified under select signals) and AAWE, respectively, during

asynchronous memory accesses.

B. Polarity of the AARDY signal is programmable through the AP field of the EMIFA Async Wait Cycle Configuration

Figure 6-15. Asynchronous Memory Read Timing for EMIFA

(1) E = AECLKOUT period in ns for EMIFA (2) RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters

are programmed via the EMIFA CE Configuration registers (CEnCFG).

(3) Select signals for EMIFA include: ACEx, ABE[7:0], AEA[19:0], ABA[1:0]; and for EMIFA writes, also include AR/ W, AED[63:0].

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Texas Instruments TMX 320 DM 648 INSTALLATION INSTRUCTIONS

Specifications and Main Features

Frequently Asked Questions

User Manual

1 TMS320DM647/TMS320DM648 Digital Media Processor

1.1 Features

1.1.1 Trademarks

1.2 Description

1.3 Functional Block Diagram

2 Device Overview

2.1 Device Characteristics

2.2 CPU (DSP Core) Description

2.3 C64x+ CPU

2.4 Memory Map Summary

2.5 Pin Assignments

2.5.1 Pin Map (Bottom View)

2.6 Terminal Functions

2.7 Device Support

2.7.1 Development Support

2.8 Device and Development-Support Tool Nomenclature

2.9 Documentation Support

2.9.1 Related Documentation From Texas Instruments

3 Device Configuration

3.1 System Module Registers

3.2 Bootmode Registers

3.2.1 Boot Configuration (BOOTCFG) Register

3.2.2 DSPBOOTADDR Register Description

3.2.3 Boot Complete (BOOTCMPLT) register

3.2.4 Priority Allocation (PRI_ALLOC)

3.2.5 KEY_REG

3.2.6 PINMUX Register

3.2.7 ESS_LOCK

3.2.8 MAC Address Registers

3.3 Debugging Considerations

3.4 Pullup/Pulldown Resistors

4 System Interconnect

4.1 Internal Buses, Bridges, and Switch Fabrics

4.2 Data Switch Fabric Connections

4.3 Configuration Switch Fabric

5 Device Operating Conditions

5.1 Absolute Maximum Ratings Over Operating Temperature Range (Unless Otherwise Noted)

5.2 Recommended Operating Conditions

6 Peripheral Information and Electrical Specifications

6.1 Parameter Information

6.1.1 3.3-V Signal Transition Levels

6.1.2 3.3-V Signal Transition Rates

6.1.3 Timing Parameters and Board Routing Analysis

6.2 Recommended Clock and Control Signal Transition Behavior

6.3 Power Supplies

6.3.1 Power-Supply Sequencing

6.3.2 Power-Supply Design Considerations

6.3.3 Power-Supply Decoupling

6.3.4 Power and Sleep Controller (PSC)

6.3.5 DM647/DM648 Power and Clock Domains

6.3.6 Preserving Boundary-Scan Functionality on DDR2 Memory Pins

6.4 PLL1 and PLL1 Controller

6.4.1 PLL1 Controller Device-Specific Information

6.4.2 PLL1 Controller Operating Modes

6.4.3 PLL1 Stabilization, Lock, and Reset Times

6.4.4 PLL1 Controller Input and Output Clock Electrical Data/Timing

6.4.5 PLL1 Controller Register Description(s)

6.5 PLL2 and PLL2 Controller

6.5.1 PLL2 Controller Device-Specific Information

6.5.2 PLL2 Controller Operating Modes

6.5.3 PLL2 Controller Input Clock Electrical Data/Timing

6.5.4 PLL1 Controller Register Description(s)

6.6 Enhanced Direct Memory Access (EDMA3) Controller

6.6.1 EDMA3 Channel Synchronization Events

6.6.2 EDMA Peripheral Register Description(s)

6.7 Reset Controller

6.7.1 Power-on Reset ( POR Pin)

6.7.2 Warm Reset ( RESET Pin)

6.7.3 Maximum Reset

6.7.4 System Reset

6.7.5 Peripheral Local Reset

6.7.6 Reset Priority

6.7.7 Reset Controller Register

6.7.8 Reset Electrical Data/Timing

6.8 Interrupts

6.9 DDR2 Memory Controller