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Copyright 1999, Texas Instruments Incorporated
Related Documentation From Texas Instruments
J
THS7001 Programmable-Gain Amplifier
SLOS214) This is the data sheet for the THS7001 amplifier
integrated circuit used on the EVM.
J
PowerPAD Thermally Enhanced Package
SLMA002) This is the technical brief for the special PowerPAD
package in which the THS7001 amplifier IC is supplied.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It
generates, uses, and can radiate radio frequency energy and has not been
tested for compliance with the limits of computing devices pursuant to subpart
J of part 15 of FCC rules, which are designed to provide reasonable protection
against radio frequency interference. Operation of this equipment in other
environments may cause interference with radio communications, in which
case the user at his own expense will be required to take whatever measures
may be required to correct this interference.
Preface
(literature number
(literature number
Trademarks
TI is a trademark of Texas Instruments Incorporated.
PowerPAD is a trademark of Texas Instruments Incorporated.
This chapter details the Texas Instruments (TI) THS7001
programmable-gain amplifier evaluation module (EVM), SLOP250. It includes
a list of EVM features, a brief description of the module illustrated with a
pictorial and schematic diagrams, EVM specifications, details on configuring,
connecting, and using the EVM, and a discussion on high-speed amplifier and
PowerPAD package design considerations.
THS7001 programmable-gain amplifier EVM features include:
J
Multiple Input Configurations Set Via On Board Jumpers
J
DIP Switches Allow Quick and Easy Adjustment of Gain, Shut Down,
Reference Voltage, and Output Clamping
J
Standard BNC Connector Inputs and Outputs
J
±5-V to ±15-V Operation With 5-V Reference Input
J
Nominal 50-Ω Impedance Inputs and Outputs
J
Includes T est Points for Easy Digital Control of EVM Circuit Gain and
Operating Parameters
J
Good Example of PowerPAD Package and High-Speed Amplifier
Design and Layout
The TI THS7001 programmable-gain amplifier evaluation module (EVM) is a
complete low-noise receiver and a highly configurable programmable-gain
amplifier circuit. It consists of the TI THS7001 programmable-gain amplifier IC
and a number of passive parts, all mounted on a multilayer circuit board
(Figure 1–1).
Although the THS7001 IC was developed primarily for xDSL receiver
front-ends, a large number of different circuits can benefit from the many
features incorporated into the THS7001. This EVM illustrates a universal
design and can be used for numerous system configurations.
The EVM uses standard BNC connectors for inputs and outputs and also
includes test points for user connections and testing. It is completely
assembled, fully tested, and ready to use—just connect it to power, a signal
source, and a load (if desired).
1-2
General Information
Figure 1–1.THS7001 Evaluation Module
SLOP250THS7001 EVM Board
Description
J1
+V
CC
J2
C13
Pre-Amp A
Output
GND
J5
1999
R5
C6
JP1
R6
J6
Input
Texas Instruments
Input power is applied to the EVM through banana jacks J1, J2, J3, and J4. An
LC filter on each power bus isolates the EVM circuits from the external supply .
J4 provides a reference point for numerous circuit functions and draws
relatively little current. The schematic for the EVM amplifiers appears in Figure
1–2.
1
JP2
R7
C3
R1
R2
A
R9
J4J3
C15
+5 V–V
S1
PGA – A
Output
R44
VH
C21L2C5C4L1
GND
S/D
(4)
AVREF
(5)
VL
(6)
J9
+++
G2
(3)
G1
(2)
G0
R18
(1)
C7
R20
U1
R8
C8
C1
C12
R23
R25
R27
R29
R41
JP3
R31
C14
C17
R24
R26
R28
R30
R32
C18, C10
C19, C9
R42
CC
General Information
1-3
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