Texas Instruments Hercules RM48, Hercules TMS570LS31x User Manual

RM48 Hercules Development Kit (HDK)
User's Guide
Literature Number: SPNU508C
September 2011–Revised November 2018
Contents
Preface ........................................................................................................................................ 4
1 Introduction......................................................................................................................... 5
1.1 Scope of Document ......................................................................................................... 5
1.2 RM48 HERCULES Development Kit (HDK) Features .................................................................. 5
1.3 HDK Board Block Diagram................................................................................................. 6
1.4 RM48 HDK Contents ....................................................................................................... 6
1.5 HDK Specifications .......................................................................................................... 7
1.6 Basic Operation .............................................................................................................. 7
1.7 Memory Map ................................................................................................................. 7
1.8 Power Supply................................................................................................................. 7
2 Physical Description............................................................................................................. 9
2.1 Board Layout ................................................................................................................. 9
2.2 Connectors.................................................................................................................. 10
2.2.1 20-Pin ARM JTAG Header....................................................................................... 11
2.2.2 Ethernet Interface ................................................................................................. 11
2.2.3 CAN Interface...................................................................................................... 12
2.2.4 J19, MIPI ETM Connector........................................................................................ 12
2.2.5 J7, XDS100V2 USB JTAG Interface............................................................................ 13
2.2.6 P1, +5 V to +12 V Input .......................................................................................... 14
2.2.7 J18, USB Host Connector........................................................................................ 14
2.2.8 J16, USB Device Connector..................................................................................... 14
2.2.9 SCI Interface....................................................................................................... 14
2.2.10 Daughter Card Interface......................................................................................... 14
2.3 LEDs ......................................................................................................................... 17
2.4 S2 DIP Switch .............................................................................................................. 18
2.5 Jumpers ..................................................................................................................... 19
2.6 S4, Power On Reset Switch .............................................................................................. 19
2.7 S3, System Reset Switch ................................................................................................. 19
A Operation Notices............................................................................................................... 20
A.1 Operation Notices .......................................................................................................... 20
Revision History.......................................................................................................................... 21
2
Copyright © 2011–2018, Texas Instruments Incorporated
SPNU508C–September 2011–Revised November 2018
Submit Documentation Feedback
www.ti.com
1-1. RM48 HDK Board Block Diagram ......................................................................................... 6
2-1. RM48 HDK Board, Interfaces Top Side .................................................................................. 9
2-2. Connectors on RM48 HDK................................................................................................ 10
2-3. J2, J3 CAN Bus Interface (Screw Terminal)............................................................................ 12
2-4. J19, 60 Pin MIPI ETM Header............................................................................................ 12
2-5. +12 V Input Jack ........................................................................................................... 14
2-6. J9, J10, and J11 on HDK ................................................................................................. 15
2-7. DIP Switch Settings ........................................................................................................ 18
1-1. RM48 Memory Map ......................................................................................................... 7
1-2. Power Test Points ........................................................................................................... 8
2-1. Connectors on HDK Board................................................................................................ 11
2-2. 20-Pin ARM JTAG Header................................................................................................ 11
2-3. J1, Ethernet Interface...................................................................................................... 12
2-4. J19, MIPI Connector Signal Mapping.................................................................................... 13
2-5. J7, XDS100V2 USB JTAG Interface..................................................................................... 13
2-6. Expansion Connector P1 (J9, Left, BottomView) ...................................................................... 15
2-7. Expansion Connector P2 (J10, Right, BottomView)................................................................... 16
2-8. Expansion Connector P3 (J11, Bottom One, TopView)............................................................... 17
2-9. Demo LEDs ................................................................................................................. 18
2-10. Other LEDs as Indicator................................................................................................... 18
2-11. S2 DIP Switch Functions.................................................................................................. 19
2-12. Jumpers ..................................................................................................................... 19
List of Figures
List of Tables
SPNU508C–September 2011–Revised November 2018
Submit Documentation Feedback
Copyright © 2011–2018, Texas Instruments Incorporated
List of Figures
3
(1)(2)(3)
About This Manual
This document describes the board level operations of the RM48 Hercules™ Development Kit (HDK). The HDK is based on the Texas Instruments RM48L952 Microcontroller. The RM48 HDK is a table top card that allows engineers and software developers to evaluate certain characteristics of the RM48L952 microcontroller to determine if the microcontroller meets the designer’s application requirements as well as begin early application development. Evaluators can create software to execute on board or expand the system in a variety of ways.
Notational Conventions
This document uses the following conventions. The RM48 HDK will sometimes be referred to as the HDK. Program listings, program examples, and interactive displays are shown in a special italic typeface. Here
is a sample program listing:
equations
!rd = !strobe&rw

Preface

SPNU508C–September 2011–Revised November 2018
Read This First
Information About Cautions
This book may contain cautions.
This is an example of a caution statement.
A caution statement describes a situation that could potentially damage your software, or hardware, or other equipment. The information in a caution is provided for your protection. Please read each caution carefully.
Related Documentation From Texas Instruments
Information regarding this device can be found at the following Texas Instruments website:
http://www.ti.com/rm4
(1)
Hercules, Code Composer Studio are trademarks of Texas Instruments.
(2)
ARM is a registered trademark of ARM Limited.
(3)
All other trademarks are the property of their respective owners.
4
Read This First
Copyright © 2011–2018, Texas Instruments Incorporated
SPNU508C–September 2011–Revised November 2018
Submit Documentation Feedback
SPNU508C–September 2011–Revised November 2018
This development kit provides a product-ready hardware and software platform for evaluating the functionality of the Texas Instruments RM48 microcontroller family. Schematics, list of materials, and PCB layout are available to ease hardware development and reduce time to market.

1.1 Scope of Document

This user's guide lists the contents of the development kit, points out the features of the major components, and provides the instructions necessary to verify your development kit is in working order. Any additional usage instructions or details fall outside the scope of this document. Additional resources will be listed at the end of this user's guide.

1.2 RM48 HERCULES Development Kit (HDK) Features

The HDK comes with a full complement of on board devices that suit a wide variety of application environments. Key features include:
A Hercules RM48L952 337-pin BGA microcontroller
Integrated USB JTAG Emulator (XDS100v2)
External JTAG Headers (ARM®20 pin and TI Compact 20-pin CTI)
10/100 Mbps Ethernet interface
One USB host connector and one USB device connector
Two CAN transceivers (SN65HVDA541Q1) and screw terminal blocks
One ambient light sensor
One ambient temperature sensor
Microcontroller’s serial communication interface (SCI) universal asynchronous receiver/transmitter (UART) accessible through a USB virtual COM port
One 8MB SDRAM
Eight user programmable white LEDs around the MCU silicon
One user programmable pushbutton
Three expansion connectors for hardware prototyping
Reset pushbuttons (nPORRST and nRST)
One SD card slot (SPI mode)
Embedded trace macrocell (ETM) debug interface via MIPI connector
Configurable pin mux options
5 V and 3.3 V analog-to-digital converter (ADC) option jumper
Current measurement capability for 3.3 V IO, 1.2 V core, 1.2 V core, 1.2 V PLL, 3.3 V or 5 V ADC, and
3.3 V V
Accepts an external power supply between +5V and +12V
CCP
Chapter 1

Introduction

SPNU508C–September 2011–Revised November 2018
Submit Documentation Feedback
Copyright © 2011–2018, Texas Instruments Incorporated
Introduction
5
SDRAM
CAN1
ETM
SPI/ADC
JTAG
POR
RST
PWR
USB EMU
EXP Conn1
SPI2
SD
Slot
XDS100V2
CPLD
FTDI 2332
Ext JTAG
EMIF/
ETM/
SPI2
ENET
RJ45
ENET
PHY
MII/ RMII
CAN PHY
EXP Conn2
EXP Conn3
Pinmux
DIP
PIN MUX
RM48L952
220 MHz
PIN MUX
CAN/
FRAY/LIN/
GIO/HET
Light
Sensor
Temp
Sensor
CAN2
CAN PHY
GIO
Button
3.3V/5V A/D 3.3V I/O
1.2V Core
USB PHY
USBH
USB PHY
USB-D
HDK Board Block Diagram

1.3 HDK Board Block Diagram

Figure 1-1 illustrates the HDK block diagram.
www.ti.com

1.4 RM48 HDK Contents

The kit contains everything needed to develop and run applications for RM48L952 microcontrollers including:
Board:
6
– RM48 Card
Cables and Accessories – Type A to mini B USB cable for using on board XDS100V2 JTAG emulator – Ethernet cable – Flashlight for light sensor demo
CCS DVD Containing: – Texas Instruments’ Code Composer Studio™ Integrated Development Environments (IDE)
Hercules DVD Containing: – Hercules Safety Demos – Hardware Abstraction Layer Code Generator (HALCoGen) – Training Videos – Device Documentation
Not included:
12-V power supply
Below are two options that electrically and mechanically will work with the HDK:
Introduction
Figure 1-1. RM48 HDK Board Block Diagram
Copyright © 2011–2018, Texas Instruments Incorporated
SPNU508C–September 2011–Revised November 2018
Submit Documentation Feedback
www.ti.com
QAWA-24-12-US01 – 12-V output, 2-A max output current – Positive center – Barrel plug (2.1-mm x 5.5-mm) – Output Protection: Short Circuit, Overvoltage, Overcurrent – Safety approvals: CB, CE, UL, FCC, PSE, LPS, BSMI, RCM, and CCC
SMI24-12-V-P5 – 12-V output, 2-A max output current – Positive center – Barrel plug (2.1-mm x 5.5-mm) – Output Protection: Short Circuit, Overvoltage, Overcurrent – Safety approvals: UL/cUL, CCC, RCM, and PSE

1.5 HDK Specifications

Board supply voltage: 5 V–12 V Vdc
Board supply current: 130 mA typ (fully active, CPU at 220 MHz)
Dimensions: 4.90” x 4.30” x 0.85” (LxWxH)

1.6 Basic Operation

The HDK is designed to work with TI’s Code Composer Studio and other third party ARM IDEs. The IDE communicates with the board through the embedded emulator or an external JTAG emulator. To start, follow the instructions in the Quick Start Guide to install Hercules-specific software. This process will install all of the necessary development tools, documentation and drivers.
HDK Specifications

1.7 Memory Map

The RM48 family of MCUs have a large byte addressable address space. Table 1-1 shows the address space of a RM48L952 microcontroller on the left with specific details of how each region is used by the HDK on the right. By default, the internal memory sits at the beginning of the address space.
The SDRAM is mapped into CS0 space on the EMIF. CS[4:2] are used for synchronous memory for example SRAM, NOR Flash, NAND Flash, and so forth.

1.8 Power Supply

The HDK board operates from a single +12 V external power supply connected to the main power input (P1), a 2.5 mm, barrel-type plug. Internally, the +12 V input is converted into +1.2 V, +3.3 V and +5.0 V using Texas Instruments swift voltage regulators and PTH power module. The +1.2 V supply is used for the MCU core while the +3.3 V supply is used for the MCU's I/O buffers and other module on the board. The +5.0 V supply is used for ADC power (second option) and USB VBUS.
Table 1-1. RM48 Memory Map
Start Address End Address HDK
0x0000 0000 0x002F FFFF Flash 0x0800 0000 0x0803 FFFF RAM 0x0840 0000 0x0843 FFFF RAM-ECC 0x6000 0000 0x63FF FFFF CS2 Async RAM 0x6400 0000 0x67FF FFFF CS3 Async RAM 0x6800 0000 0x7BFF FFFF CS4 Async RAM 0x8000 0000 0x87FF FFFF CS0 Sync SDRAM
SPNU508C–September 2011–Revised November 2018
Submit Documentation Feedback
Copyright © 2011–2018, Texas Instruments Incorporated
Introduction
7
Power Supply
There are multiple power test points on the HDK board. The three main test point pairs provide a convenient mechanism to check the HDK’s current for each supply. Table 1-2 shows the voltages for each test point and what the supply is used for.
Table 1-2. Power Test Points
Test Point Pair Voltage Voltage Use
TP14 and TP15 1.2 V MCU core TP16 and TP17 3.3 V MCU IO and logic TP18 and TP19 1.2 V MCU PLL TP20 and TP21 3.3 V MCU Flash pump TP22 and TP23 3.3 V or 5.0 V
(J8 to enable 5 V)
MCU MibADC, and ADREFHI
www.ti.com
8
Introduction
Copyright © 2011–2018, Texas Instruments Incorporated
SPNU508C–September 2011–Revised November 2018
Submit Documentation Feedback
Hercules RM48L952
This section describes the physical layout of the RM48 HDK board and its interfaces.

2.1 Board Layout

The RM48 HDK board is a 4.9 x 4.3 inch (125 x 109 mm) eight layer printed circuit board that is powered by an external +5 V to approximately +12 V only power supply. Figure 2-1 shows the layout of the RM48 HDK board.
Chapter 2
SPNU508C–September 2011–Revised November 2018

Physical Description

Figure 2-1. RM48 HDK Board, Interfaces Top Side
SPNU508C–September 2011–Revised November 2018
Submit Documentation Feedback
Copyright © 2011–2018, Texas Instruments Incorporated
Physical Description
9
J1
J2 J3
J4
J6
J7
J15
J12
J19
J10
J11
J9
J16
J17
J18
P1
RM48L952
Connectors

2.2 Connectors

The HDK board has 16 interfaces to various peripherals. These interfaces are described in the following sections.
www.ti.com
Figure 2-2. Connectors on RM48 HDK
10
Physical Description
Copyright © 2011–2018, Texas Instruments Incorporated
SPNU508C–September 2011–Revised November 2018
Submit Documentation Feedback
www.ti.com
Table 2-1. Connectors on HDK Board
Connector Size Function
J1 RJ45 Ethernet J2 3 terminal, 2.54mm DCAN1 J3 3 terminal, 2.54mm DCAN2 J4 10x2, 2.54mm ARM 20pin JTAG header J6 19x2, mictor RTP J7 4pin, Mini-B USB XDS100V2 USB
J9 33x2, 2mm Exp P1, SPI1, SPI5, ADC J10 33x2, 2mm EXP P2, SPI2, EMIF, ECLK J11 40x2, 2mm EXP P3, SPI3, GIO, NHET, DCAN, LIN J12 19x2, mictor DMM J15 SD card J16 4pin, Type B USB Device J17 4pin, Type A Not Populated J18 4pin, Type A USB Host J19 30x2, MIPI ETM MIPI Header
P1 2.5mm +12 V In

2.2.1 20-Pin ARM JTAG Header

In addition to on board XDS100V2 JTAG, one 20-pin ARM JTAG header is added for using external emulator. This is the standard interface used by JTAG emulators to interface to ARM microcontrollers. The pinout for the connector is shown in Table 2-2.
Connectors

2.2.2 Ethernet Interface

The RM48L952 integrates an MII/RMII Ethernet MAC on chip. This interface is routed to the on board PHY via CBT switches. The board uses a DP83640 PHY. The interface is isolated and brought out to a RJ-45 connector with integrated magnetics, J1. The pinmux control DIP S2 is used to control the CBT FET switch for RMII, MII or other functions.
The J1 connector is used to provide a 10/100 Mbps Ethernet interface. This is a standard RJ-45 connector. The cable end pinout for the J1 connector is shown in Table 2-3.
Table 2-2. 20-Pin ARM JTAG Header
Signal Name Pin Number Pin Number Signal Name
Vref 1 2 V
nTRST 3 4 GND
TDI 5 6 GND TMS 7 8 GND TCK 9 10 GND
RTCK 11 12 GND
TDO 13 14 GND
nRST 15 16 GND
NC 17 18 GND NC 19 20 GND
CC
SPNU508C–September 2011–Revised November 2018
Submit Documentation Feedback
Copyright © 2011–2018, Texas Instruments Incorporated
Physical Description
11
Pin 1
J2 J3
H L H L
Connectors
Two LEDs are embedded into the connector to report link status (green LED) and transmit and receive status of the PHY (yellow LED).

2.2.3 CAN Interface

The RM48L952 has up to three DCAN interfaces that provide a high-speed serial interface. Two 3-pin screw terminal blocks, J2, J3, are used to interface to the DCAN bus. The pinouts for this connector are shown in Figure 2-3. H means CAN High (CAN H), and L means CAN Low (CAN L).
www.ti.com
Table 2-3. J1, Ethernet Interface
Pin Number Signal Pin Number Signal
1 D0+ 2 D0­3 D1- 4 D2+ 5 D2- 6 D1­7 D3+ 8 D3-
Figure 2-3. J2, J3 CAN Bus Interface (Screw Terminal)

2.2.4 J19, MIPI ETM Connector

Figure 2-4 and Table 2-4 show the 60 pin MIPI header.
Figure 2-4. J19, 60 Pin MIPI ETM Header
12
Physical Description
Copyright © 2011–2018, Texas Instruments Incorporated
SPNU508C–September 2011–Revised November 2018
Submit Documentation Feedback
www.ti.com
Connectors
Table 2-4. J19, MIPI Connector Signal Mapping
MCU Signals
3.3V 1 2 TMS TCK 3 4 TDO TDI 5 6 System reset RTCK 7 8 nTRST NC 9 10 NC NC 11 12 3.3 V ETMTACECLKOUT 13 14 NC To GND thru 0 W 15 16 GND EMTTRACECTL 17 18 ETMDATA[19] ETMDATA[0] 19 20 ETMDATA[20] ETMDATA[1] 21 22 ETMDATA[21] ETMDATA[2] 23 24 ETMDATA[22] ETMDATA[3] 25 26 ETMDATA[23] ETMDATA[4] 27 28 ETMDATA[24] ETMDATA[5] 29 30 ETMDATA[25] ETMDATA[6] 31 32 ETMDATA[26] ETMDATA[7] 33 34 ETMDATA[27] ETMDATA[8] 35 36 ETMDATA[28] ETMDATA[9] 37 38 ETMDATA[29] ETMDATA[10] 39 40 ETMDATA[30] ETMDATA[11] 41 42 ETMDATA[31] ETMDATA[12] 43 44 NC ETMDATA[13] 45 46 NC ETMDATA[14] 47 48 NC ETMDATA[15] 49 50 NC ETMDATA[16] 51 52 NC ETMDATA[17] 53 54 NC ETMDATA[18] 55 56 NC GND 57 58 GND NC 59 60 NC
Pin
Number
Pin
Number
MCU Signals

2.2.5 J7, XDS100V2 USB JTAG Interface

The USB connector J7 is used to connect to the host development system that is running the software development IDE, Code Composer Studio. The signals on this connector are shown in Table 2-5.
Table 2-5. J7, XDS100V2 USB JTAG Interface
Pin Number Signal Name
1 USBVDD 2 D­3 D+ 4 NC 5 USBVSS
SPNU508C–September 2011–Revised November 2018
Submit Documentation Feedback
Copyright © 2011–2018, Texas Instruments Incorporated
Physical Description
13
+12V
GND
PC Board
P1
Connectors
Before the board is shipped, the XDS100V2 port1 is configured as JTAG, and port2 is configured as SCI. The CPLD on the board is also programmed to route the JTAG signals to the MCU.
There is a circuitry to detect the external JTAG emulator. If a device is plugged onto the header J4 and J19, the DS1 LED will be turned on, and XDS100V2 JTAG is disabled.

2.2.6 P1, +5 V to +12 V Input

Connector P1 is the input power connector. This connector brings in +5 V to +12 V to the HDK board. This is a 2.5 mm jack. Figure 2-5 shows this connector as viewed from the card edge.
www.ti.com
Figure 2-5. +12 V Input Jack

2.2.7 J18, USB Host Connector

Connector J18 is a type-A USB host connector. The RM48L952 device supports two OHCI ports. OHCI0 signals are pinmuxed with SPI, NHET, and GIO, and so forth. To use OHCI0, the channel 1 of dip switch S2 has to be set to “ON”. OHCI provides 5 V VBUS through power switch U12.
The second USB host connector is not populated. Its footprint is overlapped with J16.

2.2.8 J16, USB Device Connector

The RM48L952 device has one W2FC module for USB device. Connector J16 is a type-B USB device connector. To use W2FC, the channel 3 of dip switch S2 has to be set to “ON”. Two different connectors can be mounted at location J16. The default connector is USB host.

2.2.9 SCI Interface

The internal SCI on the RM48L952 device is connected to the second port of the XDS100V2. The XDS100V2 USB driver makes the FT2232H second channel appear as a virtual COM port (VCP). This allows the user to communicate with the USB interface via a standard PC serial emulation port.

2.2.10 Daughter Card Interface

The HDK provides expansion connectors that can be used to accept plug-in daughter cards. The daughter card allows users to build on their EVM platform to extend its capabilities and provide customer and application specific I/O. The expansion connectors are for all major interfaces including asynchronous memory, peripherals, and A/D expansion.
There are three daughter card interfaces: J9, J10, J11. These connectors are described in Table 2-6.
14
Physical Description
SPNU508C–September 2011–Revised November 2018
Copyright © 2011–2018, Texas Instruments Incorporated
Submit Documentation Feedback
J9 J10
J11
www.ti.com
Connectors
Figure 2-6. J9, J10, and J11 on HDK
Table 2-6. Expansion Connector P1 (J9, Left, BottomView)
Signal Name Pin Number Number Pin Number Signal Name
EXP_12V 1 2 GND EXP_12V 3 4 GND MibSPI1ENA G19 5 6 F18 MibSPI1CLK MibSPI1CS[1] F3 7 8 R2 MibSPI1CS[0] MibSPI1CS[3] J3 9 10 G3 MibSPI1CS[2] MibSPI1SIMO F19 11 12 G18 MibSPI1SOMI GND 13 14 GND MibSPI5ENA H18 15 16 H19 MibSPI5CLK MibSPI5CS[1] B6 17 18 E19 MibSPI5CS[0] MibSPI5CS[3] T12 19 20 W6 MibSPI5CS[2] MibSPI5SIMO[0] J19 21 22 MibSPI5SOMI[0] MibSPI5SIMO[1] E16 23 24 E17 MibSPI5SOMI[1] MibSPI5SIMO[2] H17 25 26 H16 MibSPI5SOMI[2] MibSPI5SIMO[3] G17 27 28 G16 MibSPI5SOMI[3] GND 29 30 GND AD1IN[1] V17 31 32 W14 AD1IN[0] AD1IN[3] T17 33 34 V18 AD1IN[2] AD1IN[5] R17 35 36 U18 AD1IN[4] AD1IN[7] V14 37 38 T19 AD1IN[6] GND 39 40 GND AD2IN[1] U13 41 42 V13 AD2IN[0] AD2IN[3] U16 43 44 U14 AD2IN[2] AD2IN[5] T15 45 46 U15 AD2IN[4] AD2IN[7] R16 47 48 R19 AD2IN[6] AGND 49 50 GND
SPNU508C–September 2011–Revised November 2018
Submit Documentation Feedback
Copyright © 2011–2018, Texas Instruments Incorporated
Physical Description
15
Connectors
Signal Name Pin Number Number Pin Number Signal Name
AD1IN[9] W17 51 52 P18 AD1IN[8] AD1IN[11] U19 53 54 U17 AD1IN[10] AD1IN[13] T18 55 56 T16 AD1IN[12] AD1IN[15] P19 57 58 R18 AD1IN[14] GND 59 60 POR_RSTn ADREFHI V15 61 62 V16 ADREFLO AD1EVT N19 63 64 V10 AD2EVT EXP_12V 65 66 GND
Signal Name Pin Number Number Pin Number Signal Name
EXP_12V 1 2 GND ECLK A12 3 4 B14 ERRORn RST 5 6 M17 EMIF_CS[4] EMIF_ADDR[21] C17 7 8 C16 EMIF_ADDR[20] EMIF_ADDR[19] C15 9 10 D15 EMIF_ADDR[18] EMIF_ADDR[17] C14 11 12 D14 EMIF_ADDR[16] EMIF_ADDR[15] C13 13 14 C12 EMIF_ADDR[14] EMIF_ADDR[13] C11 15 16 C10 EMIF_ADDR[12] EMIF_ADDR[11] C9 17 18 C8 EMIF_ADDR[10] EMIF_ADDR[9] C7 19 20 C6 EMIF_ADDR[8] EMIF_ADDR[7] C5 21 22 C4 EMIF_ADDR[6] EMIF_ADDR[5] D9 23 24 D8 EMIF_ADDR[4] EMIF_ADDR[3] D7 25 26 D6 EMIF_ADDR[2] EMIF_ADDR[1] D5 27 28 D4 EMIF_ADDR[0] GND 29 30 GND EMIF_Wen D17 31 32 K17 EMIF_CS[3] EMIF_Oen D12 33 34 L17 EMIF_CS[2] EMIF_BA[1] D16 35 36 D11 EMIF_DQMn[1] EMIF_BA[0] D13 37 38 D10 EMIF_DQMn[0] GND 39 40 GND EMIFDATA[1] L16 41 42 K16 EMIFDATA[0] EMIFDATA[3] N16 43 44 M16 EMIFDATA[2] EMIFDATA[5] F4 45 46 E4 EMIFDATA[4] EMIFDATA[7] K4 47 48 G4 EMIFDATA[6] EMIFDATA[9] M4 49 50 L4 EMIFDATA[8] EMIFDATA[11] P4 51 52 N4 EMIFDATA[10] EMIFDATA[13] T6 53 54 T5 EMIFDATA[12] EMIFDATA[15] T8 55 56 T7 EMIFDATA[14] GND 57 58 GND SPI2_SOMI D2 59 60 P3 EMIF_nWAIT SPI2_SIMO D1 61 62 D3 SPI2_CS1 SPI2_CS0 N3 63 64 E2 SPI2_CLK EXP_12V 65 66 GND
www.ti.com
Table 2-6. Expansion Connector P1 (J9, Left, BottomView) (continued)
Table 2-7. Expansion Connector P2 (J10, Right, BottomView)
16
Physical Description
SPNU508C–September 2011–Revised November 2018
Copyright © 2011–2018, Texas Instruments Incorporated
Submit Documentation Feedback
www.ti.com
LEDs
Table 2-8. Expansion Connector P3 (J11, Bottom One, TopView)
Signal Name Pin Number Number Pin Number Signal Name
EXP_12V 1 2 GND EXP_12V 3 4 GND LINRX A7 5 6 B7 LINTX CAN1RX B10 7 8 A10 CAN1TX CAN2RX H1 9 10 H2 CAN2TX CAN3RX M19 11 12 M18 CAN3TX Reserved A15 13 14 A8 Reserved Reserved B15 15 16 B8 Reserved Reserved B16 17 18 B9 Reserved GIOA[1] C2 19 20 A5 GIOA[0] GIOA[3] E1 21 22 C1 GIOA[2] GIOA[5] B5 23 24 A6 GIOA[4] GIOA[7] M1 25 26 H3 GIOA[6] GIOB[1] K2 27 28 M2 GIOB[0] GIOB[3] W10 29 30 F2 GIOB[2] GIOB[5] G2 31 32 G1 GIOB[4] GIOB[7] F1 33 34 J2 GIOB[6] GND 35 36 GND NHET1[1] V2 37 38 K18 NHET1[0] NHET1[3] U1 39 40 W5 NHET1[2] NHET1[5] V6 41 42 B12 NHET1[4] NHET1[7] T1 43 44 W3 NHET1[6] NHET1[9] V7 45 46 E18 NHET1[8] NHET1[11] E3 47 48 D19 NHET1[10] NHET1[13] N2 49 50 B4 NHET1[12] NHET1[15] N1 51 52 A11 NHET1[14] NHET1[17] A13 53 54 A4 NHET1[16] NHET1[19] B13 55 56 J1 NHET1[18] NHET1[21] H4 57 58 P2 NHET1[20] NHET1[23] J4 59 60 B3 NHET1[22] NHET1[25] M3 61 62 P1 NHET1[24] NHET1[27] A9 63 64 A14 NHET1[26] NHET1[29] A3 65 66 K19 NHET1[28] NHET1[31] J17 67 68 B11 NHET1[30] GND 69 70 GND MibSPI3CS[3] C3 71 72 B2 MibSPI3CS[2] MibSPI3SIMO W8 73 74 V8 MibSPI3SOMI MibSPI3CS[1] V5 75 76 V10 MibSPI3CS[0] MibSPI3ENA W9 77 78 V9 MibSPI3CLK EXP_12V 79 80 GND

2.3 LEDs

The RM48 HDK board has 19 LEDs. Eight of these LEDs (shown in Table 2-9) are under user control. Those LEDs are controlled and programmed by NHET signals.
LEDs DS2, DS3, DS4, and DS5 indicate the presence of the power (+1.2 V, +5 V, 3.3 V, and 12 V) s on the board. The LED functions are summarized in Table 2-9 and Table 2-10.
SPNU508C–September 2011–Revised November 2018
Submit Documentation Feedback
Copyright © 2011–2018, Texas Instruments Incorporated
Physical Description
17
1 2
3 4
1 2 3 4
S2 DIP Switch
LED Number Location Signals Color
D3 Left Top NHET1[17] White D4 Top NHET1[31] White D5 Right Top NHET1[0] White D6 Right Bottom NHET1[25] White D7 Bottom NHET1[18] White D8 Left bottom NHET1[29] White LED1 Left NHET1[27] White LED2 Right NHET1[05] White
www.ti.com
Table 2-9. Demo LEDs
Table 2-10. Other LEDs as Indicator
Number LED Color
D1 nERROR Red D10 XDS100V2 SCI RX Blue D11 XDS100V2 SCI TX Blue D12 XDS100V2 PWRENn Blue
D2 JTAG TDI Blue
D9 Ethernet Speed Blue DS1 ARM JTAG Plugin Blue DS2 VCC_1V2 Blue DS3 VCC_5V Blue DS4 VCC_3V3 Blue DS5 VCC_12V Blue

2.4 S2 DIP Switch

There is one 4-position DIP switches located on the left-bottom corner at reference designator S2. By default, all of the switches are set to the “OFF” position and should remain in that position when completing the steps in this user's guide.
Figure 2-7. DIP Switch Settings
18
Physical Description
SPNU508C–September 2011–Revised November 2018
Copyright © 2011–2018, Texas Instruments Incorporated
Submit Documentation Feedback
www.ti.com
The S2 DIP switch is reserved for user application general purpose. Table 2-11 describes the function of each channel on S2.
(1)
S2:1 indicates slide 1 on the S2 DIP switch, S2:2 indicates slide 2 on the S2 DIP switch, and so on.
(2)
S2:2 and S2:3 cannot be enabled at the same time since those two ports have pinmux.
(3)
To use Ethernet, S2:4 should be enabled and all other have to be disabled.

2.5 Jumpers

The HDK board has two jumpers that are used to enable and disable the on-board SDRAM and select 5 V or 3.3 V ADC.
Table 2-11. S2 DIP Switch Functions
Switch OFF Position ON Position
(1)
S2:1 S2:2 S2:3 S2:4
(2)
(2)
(3)
USB Host0 Disabled USB Host0 Enabled USB Host1 Disabled USB Host1 Enabled
USB Device Disabled USB Device Enabled
Ethernet Disabled Ethernet Enabled
Table 2-12. Jumpers
Jumper Number OFF ON
J8 5 V ADC 3.3 V ADC
J13 SDRAM on SDRAM Off
Jumpers

2.6 S4, Power On Reset Switch

RM48 MCU has two resets: warm reset (nRST) and power-on reset (nPORRST). Switch S4 is a momentary switch that asserts power on reset to the RM48L952 device. The nPORRST condition is intended to reset all logic on the device including the test and emulation circuitry.

2.7 S3, System Reset Switch

Switch S3 is used to assert a warm reset the RM48L952 device. Warm reset does not reset any test or emulation logic. The reset signal from window watchdog will also assert a warm reset to the MCU. The warm reset can be invoked by pushing nRST button, or by RESET signals from XDS100 CPLD, ARM JTAG SREST.
SPNU508C–September 2011–Revised November 2018
Submit Documentation Feedback
Copyright © 2011–2018, Texas Instruments Incorporated
Physical Description
19

A.1 Operation Notices

The user assumes all responsibility and liability for proper and safe handling of the boards. It is the user's responsibility to take any and all appropriate precautions with regard to electrostatic discharge.
For additional information regarding the embedded emulation, see the XDS100 USB wiki on the TI web site at the following URL: http://tiexpressdsp.com/index.php?title=XDS100
Code Composer Studio support is available via a forum at: http://community.ti.com/forums/138.aspx
Hercules MCU support is available via a forum at: http://www.ti.com/hercules-support
Appendix A
SPNU508C–September 2011–Revised November 2018
Operation Notices
20
Operation Notices
SPNU508C–September 2011–Revised November 2018
Copyright © 2011–2018, Texas Instruments Incorporated
Submit Documentation Feedback
www.ti.com

Revision History

Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from B Revision (September 2013) to C Revision .......................................................................................... Page
Updated RM48 HDK Contents power supply information............................................................................ 6
SPNU508C–September 2011–Revised November 2018
Submit Documentation Feedback
Copyright © 2011–2018, Texas Instruments Incorporated
Revision History
21
STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system.
2 Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM. User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10) business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period.
3 Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs (which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18328日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive): This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures.
4 EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free.
6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
Loading...