Texas Instruments CY74FCT16823CTPVC, CY74FCT16823CTPACT, CY74FCT16823CTPAC, CY74FCT16823ATPACT, CY74FCT16823ATPAC Datasheet

18-Bit Registers

CY74FCT16823T

CY74FCT162823T

SCCS062 - August 1994 - Revised March 2000

Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.

Copyright © 2000, Texas Instruments Incorporated

Features

• FCT-E speed at 4.4 ns

• Power-off disable outputs permits live insertion

• Edge-rate control circuitry for significantly improved
noise characteristics

• Typical output skew < 250 ps

• ESD > 2000V

• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)
packages

• Industrial temperature range of −40˚C to +85˚C

•V

CC

= 5V ± 10%

CY74FCT16823T Features:

• 64 mA sink current, 32 mA source current

• Typical V

OLP

(ground bounce) <1.0V at VCC = 5V,

TA = 25˚C

CY74FCT162823T Features:

• Balanced 24 mA output drivers

• Reduced system switching noise

• Typical V

OLP

(ground bounce) <0.6V at VCC = 5V,

TA= 25˚C

Functional Description

The CY74FCT16823T and the CY74FCT162823T 18-bit bus
interface registers are designed for use in high-speed,
low-power systems needing wide registers and parity. 18-bit
operationisachievedbyconnectingthecontrollinesofthetwo
9-bit registers. Flow-through pinout and small shrink
packaging aids in simplifying board layout. The outputs are
designedwitha power-offdisablefeaturetoallowliveinsertion
of boards.

The CY74FCT16823T is ideally suited for driving
high-capacitance loads and low-impedance backplanes.

The CY74FCT162823T has 24-mA balanced output drivers
with current limiting resistors in the outputs. This reduces the
need for external terminating resistors and provides for
minimal undershoot and reduced ground bounce. The
CY74FCT162823T is ideal for driving transmission lines.

Logic Block Diagrams

C

Pin Configuration

D

R

1
2
3
4
5
6
7
8
9
10
11
12

33
32
31
30
29

36
35

1

CLR

34

SSOP/TSSOP

Top View

13

15
16
17

18
19
20
21
22
23
24

45
44
43
42
41

37

38

39

40

48
47
46

1

CLR

1D1

1

OE

1

OE

1Q1

1Q2

GND

V

CC

GND

FCT16823-1

1

CLK

1

CLKEN

1Q1

TO 8 OTHER CHANNELS

GND

1D1

1D2
1D3

1D4

1

CLK

GND

1D5

1D6

1D7

1D9

V

CC

GND

2D1
2D2

2D4

GND

2D5
2D6

2D7
2D8

V

CC

2

CLK

1

CLKEN

25
26
27
28

49

50

51

52

53

54

55

56

1D8

2D3

2D9
2

CLKEN

C
D

R

2

CLR

2D2

2

OE

2

CLK

2

CLKEN

2Q1

TO 8 OTHER CHANNELS

1Q3

1Q4
1Q5

1Q7
1Q8

1Q9

1Q6

14

2Q1
2Q2
2Q3

2Q4

2Q6

2Q7
2Q8

2Q5

2Q9

GND

V

CC

GND

2

OE

2

CLR

FCT16823-2

FCT16823-3

CY74FCT16823T

CY74FCT162823T

2

Maximum Ratings

[3, 4]

(Above which the useful life may be impaired. For user
guidelines, not tested.)

Storage Temperature .....................................−55°C to +125°C

Ambient Temperature with

Power Applied..................................................−55°C to +125°C

DC Input Voltage .................................................−0.5V to +7.0V

DC Output Voltage..............................................−0.5V to +7.0V

DC Output Current

(Maximum Sink Current/Pin)...........................−60 to +120 mA

Power Dissipation..........................................................1.0W

Static Discharge Voltage............................................>2001V

(per MIL-STD-883, Method 3015)

Notes:

1. H = HIGH Voltage Level.
L = LOW Voltage Level.
X = Don’t Care.
Z = HIGH Impedance.

=LOW-to-HIGH transition.

2. Output level before indicated steady-state input conditions were established.

3. Operationbeyondthe limitssetforth mayimpairtheuseful lifeofthe device.Unless otherwisenoted, theselimits areover theoperating free-airtemperature range.

4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either V

CC

or ground.

Pin Description

Name Description

D Data Inputs
CLK Clock Inputs
CLKEN Clock Enable Inputs (Active LOW)
CLR Asynchronous Clear Inputs (Active LOW)
OE Output Enable Inputs (Active LOW)
Q Three-State Outputs

Function Table

[1]

Inputs Outputs

OE CLR CLKEN CLK D Q Function

H X X X X Z High Z

L L X X X L Clear
L H H X X Q

[2]

Hold
H H L L Z Load
H H L H Z

L H L L L
L H L H H

Operating Range

Range

Ambient

Temperature V

CC

Industrial −40°C to +85°C 5V ± 10%

CY74FCT16823T

CY74FCT162823T

3

Electrical Characteristics Over the Operating Range

Parameter Description Test Conditions Min. Typ.

[5]

Max. Unit

V

IH

Input HIGH Voltage 2.0 V

V

IL

Input LOW Voltage 0.8 V

V

H

Input Hysteresis

[6]

100 mV

V

IK

Input Clamp Diode Voltage VCC=Min., IIN=−18 mA −0.7 −1.2 V

I

IH

Input HIGH Current VCC=Max., VI=V

CC

±1 µA

I

IL

Input LOW Current VCC=Max., VI=GND ±1 µA

I

OZH

HighImpedanceOutputCurrent
(Three-State Output pins)

VCC=Max., V

OUT

=2.7V ±1 µA

I

OZL

HighImpedanceOutputCurrent
(Three-State Output pins)

VCC=Max., V

OUT

=0.5V ±1 µA

I

OS

Short Circuit Current

[7]

VCC=Max., V

OUT

=GND −80 −140 −200 mA

I

O

Output Drive Current

[7]

VCC=Max., V

OUT

=2.5V −50 −180 mA

I

OFF

Power-Off Disable VCC=0V, V

OUT

≤4.5V

[8]

1 µA

Output Drive Characteristics for CY74FCT16823T

Parameter Description Test Conditions Min. Typ.

[5]

Max. Unit

V

OH

Output HIGH Voltage VCC=Min., IOH=−3 mA 2.5 3.5 V

VCC=Min., IOH=−15 mA 2.4 3.5
VCC=Min., IOH=−32 mA 2.0 3.0

V

OL

Output LOW Voltage VCC=Min., IOL=64 mA 0.2 0.55 V

Output Drive Characteristics for CY74FCT162823T

Parameter Description Test Conditions Min. Typ.

[5]

Max. Unit

I

ODL

Output LOW Voltage

[7]

VCC=5V, VIN=VIH or VIL, V

OUT

=1.5V 60 115 150 mA

I

ODH

Output HIGH Voltage

[7]

VCC=5V, VIN=VIH or VIL, V

OUT

=1.5V −60 −115 −150 mA

V

OH

Output HIGH Voltage VCC=Min., IOH=−24 mA 2.4 3.3 V

V

OL

Output LOW Voltage VCC=Min., IOL=24 mA 0.3 0.55 V

Capacitance

[9]

(TA = +25˚C, f = 1.0 MHz)

Parameter Description Test Conditions Typ.

[5]

Max. Unit

C

IN

Input Capacitance VIN = 0V 4.5 6.0 pF

C

OUT

Output Capacitance V

OUT

= 0V 5.5 8.0 pF

Notes:

5. Typical values are at V

CC

= 5.0V, TA= +25˚C ambient.

6. This input is specified but not tested.

7. Not more than one outputshouldbe shorted at a time.Duration of short should not exceed one second.Theuse of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting
of ahigh output mayraise the chip temperaturewell above normalandthereby cause invalidreadings in otherparametric tests. In anysequence of parameter
tests, I

OS

tests should be performed last.

8. Tested at+25˚C.

9. This parameter is specified but not tested.