Teac DW-224E-V, DW-224E-R93 Hardware Specificftion

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TEAC DW-224E-R93

CD-RW/DVD-ROM DRIVE

HARDWARE SPECIFICATION

Rev. A

7757a

34 sheets in Total

TABLE OF CONTENTS

Title Page

1. SCOPE ........................................................................................................................................ 1

2. OUTLINE ..................................................................................................................................... 1

3. CONSTRUCTION ........................................................................................................................ 2

3.1 External Construction ........................................................................................................... 2

3.2 Installation ............................................................................................................................. 4

4. DISC SPECIFICATION ................................................................................................................ 5

4.1 Applicable Disc Format ........................................................................................................ 5

4.2 Rotational Speed ................................................................................................................... 5

4.3 Data Capacity ........................................................................................................................ 6

4.4 Write methods ....................................................................................................................... 6

4.5 Readable disc ........................................................................................................................ 6

4.6 Recordable Disc (Recording Speed) ................................................................................... 6

5. PERFORMANCE ......................................................................................................................... 7

5.1 Operating Performance ........................................................................................................ 7

5.2 Audio ...................................................................................................................................... 7

5.3 Acoustic Noise ...................................................................................................................... 7

6. ENVIRONMENTAL CONDITIONS .............................................................................................. 8

7. RELIABILITY ............................................................................................................................... 9

8. SAFETY STANDARDS ............................................................................................................... 9

9. FRONT INDICATOR .................................................................................................................... 9

10. DRIVE CONFIGURATION ......................................................................................................... 9

11. INTERFACE CONNECTOR .................................................................................................... 10

12. AUDIO INTERFACE ................................................................................................................ 11

13. POWER INTERFACE .............................................................................................................. 11

14. IDE HARDWARE INTERFACE ............................................................................................... 12

14.1 Outline ................................................................................................................................ 12

14.2 Electrical Characteristics ................................................................................................. 12

14.3 Input/Output Signals ......................................................................................................... 13

14.4 Interface Timing ................................................................................................................ 14

14.5 COMMAND SET ................................................................................................................. 26

14.5.1 ATA COMMAND ........................................................................................................... 26

14.5.2 ATAPI COMMAND ....................................................................................................... 27

15. POWER MANAGEMENT SPECIFICATION ........................................................................... 29

15.1 Power Management Modes .............................................................................................. 29

15.1.1 Transition in power management mode ................................................................... 29

15.2 Active Mode ....................................................................................................................... 30

15.3 Idle Mode ............................................................................................................................ 30

15.4 Standby Mode .................................................................................................................... 31

15.5 Sleep Mode ........................................................................................................................ 31

15.5.1 Tray ejection/insertion in the sleep mode ................................................................. 31

16. OTHERS .................................................................................................................................. 31

16.1 Using the lens cleaner ...................................................................................................... 31

16.2 Safety of Laser Products .................................................................................................. 32

– i –

1. SCOPE

This is hardware specification of the TEAC DW-224E-R93 built-in type CD-RW/DVD-ROM drive (hereinafter referred to as drive). As for the software specification, refer to "DW-224E-C Software Specification".

2. OUTLINE

The outline of this drive is given in Table 2-1.

(Table 2-1) Outline of the specification

Model name DW-224E-R93 TEAC P/N 1977098-R93 Applicable safety standards UL, CSA, TÜV, CE Data transfer rate (burst) 33.3MBytes/sec max

Average access time 90msec (CD-ROM)/110msec (DVD-ROM), average by

TEAC standards

Disc speed (24X CAV speed mode)

5,090min Host interface IDE (ATAPI) Power source +5VDC Starting time 19sec max Readable discs CD/CD-ROM (12cm, 8cm)

CD-R (Recorded)

CD-RW (Recorded)

DVD-ROM

DVD-R (Recorded)

DVD-RW (Recorded)

DVD-RAM (Recorded)

DVD+R (Recorded)

DVD+RW (Recorded) Recordable disc CD-R/RW disc (Refer to item 4.6) Applicable format CD-DA

CD-ROM Mode 1, Mode 2

CD-ROM XA Mode 2 (Form 1, Form 2)

Photo CD (Single/Multi-session)

Enhanced CD

CD-TEXT

DVD-ROM

DVD-R (General. Authoring)

DVD-Video

DVD-RAM (4.7GB, 2.6GB)

DVD+R/RW (Single/Multi-session, Packet) Write methods Disc at once, Session at once, Packet write, Track at once Front bezel Black Eject button Black Access indicator Green Laser class Class 1 laser product

-1

(Approx)

– 1 –

3. CONSTRUCTION

3.1 External Construction

(1) Dimensions

(a) Height : 12.7mm (excluding the front bezel) (b) Width : 128mm (excluding the front bezel)

(c) Depth : 129.4mm (excluding the eject button) (2) Mass : 178g or less (3) Disc clamp system : Ball clamp (4) Loading : Manual loading using the tray (5) Ejection

(a) Manual eject using the eject button

(b) Automatically eject using the command

– 2 –

(Fig. 3.1-1) External view of the drive

– 3 –

( ± 0.4 )

(Unit : mm)

3.2 Installation

(1) Installation direction : Refer to Fig. 3.2-1 (2) Tilt : Refer to Fig. 3.2-1 below. (3) Installation method : The fixing holes in the side of the unit are used.

Separate discussions and arrangements are required when the installation holes are not used.

(a)

(b)

(c)

30° or less 30° or less 30° or less 30° or less

0° or less 30° or less

30° or less 30° or less

30° or less 0° or less

30° or less 30° or less

(Fig. 3.2-1) Tilt of the drive

– 4 –

4. DISC SPECIFICATION

4.1 Applicable Disc Format

• CD-DA

• CD-ROM Mode 1

• CD-ROM XA Mode 2 (Form 1, Form 2)

• Multi-session Photo CD

• CD-I

• Video CD

• Enhanced CD

• CD-TEXT

• DVD-ROM

• DVD-R (General, Authoring)

• DVD-Video

• DVD-RW

• DVD-RAM (4.7GB, 2.6GB)

• DVD+R/RW (Single/Multi-session, Packet)

4.2 Rotational Speed

Refer to Table 4.2-1 for the rotational speed.

(Table 4.2-1) Rotational speed (read mode)

Operation/Disc format Read speed/Disc speed Idle mode (DVD) 4x CAV 2,297rpm Idle mode (CD) 10x CAV 2,140rpm Read (DVD-ROM) 8x CAV 4,594rpm Read (DVD-Video) 4x CAV 2,297rpm Read (CD-ROM Model) 24x CAV 5,137rpm Read (CD-ROM Mode2form2) 20x CAV 4,280rpm Read (CD-DA) 20x CAV 4,280rpm Play Audio 4x CLV 856 - 1,984rpm Mixed (CD-ROM Model and Mode2form2 or CD-DA) 20x CAV 4,280rpm Mixed (DVD-ROM and DVD-Video) 8x CAV 4,594rpm CD-RW (Read only operation) 24x CAV 5,137rpm DVD-R/DVD-RW, DVD+R/DVD+RW 8x CAV 4,594rpm DVD-RAM (4.7GB) 5x CAV 3,246rpm DVD-RAM (2.6GB) 2.5x CAV 1,626rpm

– 5 –

(Table 4.2-2) Rotational speed (Write mode)

Disc Read speed/ Disc speed

24x CAV 5,137rpm

CD-R

CD-RW

Multi speed 4x CLV 856 - 1,984rpm

High speed

Ultra speed 24x CAV 5,137rpm

16x CAV 3,425rpm 10x CLV 2,140 - 4,954rpm 4x CLV 856 - 1,984rpm

10x CLV 2,140 - 4,954rpm 10x CAV 2,140rpm 4x CLV 856 - 1,984rpm

4.3 Data Capacity

• 650MB/700MB : CD-ROM Mode 1 : CD-ROM XA Mode 2 Form 1

• 738MB/795MB : CD-ROM XA Mode 2 Form 2

• 74min/79min : CD-DA

• 4.7GB/side : DVD-ROM, DVD-Video, DVD-R, DVD-RW, DVD-RAM,

DVD+R, DVD+RW

• 8.5GB/side : DVD-ROM, DVD-Video (Dual layer)

• 2.6GB/side : DVD-RAM

4.4 Write methods

Disc at once, Track at once, Session at once, and Packet write

4.5 Readable disc

Press CD, Recorded CD-R/RW, Press DVD, Recorded DVD-R, Recorded DVD-RW, Recorded DVD-RAM, Recorded DVD+R, Recorded DVD+RW

4.6 Recordable Disc (Recording Speed)

Recommended as the recordable disc to be used in this drive is a 79-minute disc for 8x speed manufactured by Taiyo Yuden Co., Ltd. (TEAC Part No.: T0006613, CD-R80-BULK). The use of other recordable discs is conditional on mutual understanding between TEAC and specific users. With the recommended type of discs, the following speeds of recording are available:

4x speed, 10x speed, 16x speed and 24x speed

– 6 –

5. PERFORMANCE

5.1 Operating Performance

(1) Average random access time : 90msec average (CD-ROM, 24x), 110msec average (DVD-ROM, 8x) (2) Disc speed : Refer to 4.2 (3) Data transfer rate

(a) Read sustained : 1,545 to 3,600kB/sec (CD-ROM model)

4,469 to 10,816kB/sec (DVD-ROM) (b) Programmed I/O : 16.7MB/sec max (Mode 0 to 4) (c) Multi-word DMA : 16.7MB/sec max (Mode 0 to 2) (d) Ultra DMA : 33.3MB/sec max

(4) Starting time

(a) When power is switched on/when disc is loaded

: 19sec max (excluding the multi-session CD)

(b) Return time from the standby mode

: 4sec or less

(5) Data buffer capacity : 2MB

5.2 Audio

(1) Line output

The following specifications apply during audio play. (a) Number of channels : 2 channels (stereo) (b) Frequency response : 20 to 20kHz (±3dB) (c) Dynamic range : 83dB or more (IHF A, 1kHz, LPF 20kHz) (d) S/N : 85dB or more (IHF A, 1kHz, LPF 20kHz) (e) Distortion factor : 0.05% or less (1kHz, 20kHz LPF) (f) Channel separation : 70dB or more (1kHz, 20kHz LPF) (g) Output level : 0.8Vrms ±3dB (load = 47kΩ ATT = 0dB) (h) Muting : each channel independent (using the ATAPI command) (i) Volume : Software volume using the ATAPI command;

255 steps from volume level 0 to −∞ (infinity) dB; variable for each channel independently.

5.3 Acoustic Noise

(1) Operating : 45dBA or less (during seek/read/write/Active/Idle, distance 0.5m) (2) Ejecting : 65dBA or less (distance 0.5m)

– 7 –

6. ENVIRONMENTAL CONDITIONS

The environmental conditions as specified here do not include the environmental conditions of the disc. The environmental conditions of the disc should follow the specifications of the applicable disc.

(1) Ambient temperature

(a) During operation : 5 to 45°C (Surface temperature on the top cover; 5 to 50°C) (b) During non-operation : –20 to 60°C (c) During transportation (packaged)

: –40 to 65°C

(2) Temperature gradient

(a) During operation : 11°C/hour or less (noncondensing) (b) During non-operation/transportation

: 20°C/hour or less (noncondensing)

(3) Relative humidity

(a) During operation : 8 to 80% (noncondensing)

provided that the maximum wet-bulb temperature is 29.4°C or less.

(b) During non-operation/transportation

: 5 to 95% (noncondensing)

provided that the maximum wet-bulb temperature is 29.4°C or less.

: 5 to 95% (noncondensing)

provided that the maximum wet-bulb temperature is 29.4°C or less.

(4) Vibrations

(a) During operation:

When installed horizontally: 2.9m/s When installed vertically : 1.96m/s

provided that the sweep frequency is 5 to 500Hz and sweep rate, 1oct/min. excepting recording mode.

(b) Transportation (packaged) : 19.6m/s

(2G) or less provided that the sweep frequency is 5 to 500Hz

and sweep rate, 1oct/min.

(5) Shock

(a) During operation (free from malfunction)

When installed horizontally: 68.6m/s

When installed vertically : 49m/s

excepting recording mode and CD-DA play mode.

(b) During operation (while the CD-DA is playing)

:19.6m/s

(2G) or less (half-sine shock pulse; 11msec., intervals; 10sec)

: 588m/s

1,960m/s

(60G) or less (half-sine shock pulse; 11msec)

(200G) or less (half-sine shock pulse; 2msec)

However, tray ejection is allowed. (6) Dust : office environment (7) Cooling : natural air cooling

(0.3G) or less

(0.2G) or less

(7G) or less (half-sine shock

pulse; 11msec, intervals; 10sec)

(5G) or less (half-sine shock pulse;

11msec, intervals; 10sec)

– 8 –

7. RELIABILITY

(1) Mean time between failures (MTBF)

: 60,000POH or more (the frequency of use should be 10% at normal

temperature and humidity) (2) Mean time to repair (MTTR) : 30minutes (3) Loading/ejecting life : 10,000times or more (4) Power ON/OFF life : 60,000 times or more (5) Laser diode life : MTTF 9,000 hours (Duty 50% pulse 83mW, 60°C)

(6) Seeking life : 2 × 10 (7) Error rate

(a) Read error rate

DVD : Once per 10 CD : MODE 1 and MODE 2 (FORM 1): Once per 10

(b) Seek error rate : Once per 10 (c) Seek error rate : Once per 10

(8) Self-diagnosis

(a) When power is switched ON: Various controllers, ROM, RAM, buffer, ECC circuit, etc. (b) When disc is inserted : Servo circuit, signal processors, etc.

times or more (random access, 25°C, duty; 20% or less)

bits or less

MODE 2 (FORM 2) and CDDA : Once per 10

seeks or less

bits or less

8. SAFETY STANDARDS

The drive complies with the following safety standards:

(1) UL standard (2) CSA standard (3) TÜV standard (4) CE standard

9. FRONT INDICATOR

(1) Location : Refer to Fig. 3.1-1. (2) Color : Green (3) Lighting conditions

(a) Continuous on

• During seek

• Transfer of the read data to the host is under way.

(b) Flashing with a period of 3 second (Duty 50%)

• During write

• While audio is being played

• From POR or tray loading to the end of TOC read (when the disc is present)

• From POR or tray loading to the end of detecting the disc (when the disc is not present). If an error which is considered to arise from the disc occurs, flashing continues until the disc is ejected. If an error which seems to rest with the drive’s hardware, flashing continues until the power is switched OFF.

10. DRIVE CONFIGURATION

The setting to master or slave is determined by the −CSEL signal (interface connector 47 pin). If the −CSEL signal is at low level, the drive is set to the slave, and if it is open or at high level, it is set to the master.

– 9 –

11. INTERFACE CONNECTOR

(1) Connector on the drive : JAE KX15-50KLDLE or equivalent (2) Applicable connector on the host : JAE KX14-50K5D1 or equivalent (3) Pin assignment : Refer to Table 11-1, Fig. 11-1.

(Table 11-1) Interface connector pin assignment

No. SIGNAL No. SIGNAL

1LOUT2ROUT 3 AGND 4 N.C 5 –RESET 6 DD8 7DD78DD9

9DD610DD10 11 DD5 12 DD11 13 DD4 14 DD12 15 DD3 16 DD13 17 DD2 18 DD14 19 DD1 20 DD15 21 DD0 22 DMARQ 23 GROUND 24 –DIOR (–HDMARDY/HSTROBE) 25 –DIOW (STOP) 26 GROUND 27 IORDY (–DDMARDY/DSTROBE) 28 –DMACK 29 INTRQ 30 –IOCS16 31 DA1 32 –PDIAG (–CBLID) 33DA034DA2 35 –CS0 36 –CS1 37 –DASP 38 +5V 39 +5V 40 +5V 41 +5V 42 +5V 43 GROUND 44 GROUND 45 GROUND 46 GROUND 47 –CSEL 48 GROUND 49 RESERVED 50 RESERVED

Pin No. 50

(Fig. 11-1) Interface connector assignment

– 10 –

Pin No. 1

12. AUDIO INTERFACE

(1) LOUT : Line output of the left channel (unbalanced) (2) ROUT : Line output of the right channel (unbalanced) (3) AGND : Ground of audio line output.

For the electrical specification of the line output, refer to 5.2.

13. POWER INTERFACE

The following specifications apply to the interface connector terminals of the drive. The power should be supplied from a power supply unit with reinforced insulation or double insulation.

(1) Allowable supply voltage range

: +5VDC ±5% (4.75 to 5.25V)

There should be no abnormal operations by DC +5V ±10%. (2) Allowable ripple voltage : 100mVp-p or less, 50 to 20MHz (including the spike noise) (3) Current consumption : Refer to Table 13-1.

(Table 13-1) Current consumption

Mode Average current max (A) Peak current max (A) Standby/Sleep 0.025 Write 24x 1.0 Active 0.9 Random access (Duty 100%) 1.2 1.5 During starting/seek 1.5 During eject 1.5

Remarks:

1. The supply voltage should be 5V+5%.

2. For each of the sleep, standby, and active modes, refer to "15. POWER MANAGEMENT

SPECIFICATION".

3. Does not include pulse-like current below 1msec.

– 11 –

14. IDE HARDWARE INTERFACE

14.1 Outline

(1) Applicable standard

ANSI standard : X3T13/1321D (ATA-5) SFFC : SFF-8020i Rev. 2.6 and SFF-8090v3

14.2 Electrical Characteristics

The following specifications apply to the interface connector terminal for the IDE signal of the drive. The input signals refer to the signals input to the drive whereas the output signals refer to the signals output from the drive.

(1) Tri-state input/output signals (DD0 to DD15, –PDIAG)

(a) Input signal level

• Low level : 0 to 0.8VDC

• High level : 2.0 to 5.25VDC

• Hysteresis : possessed

• Maximum input current : ±25µA

(b) Output signal level

• Low level : 0 to 0.4VDC (output sink current 12mA)

• High level : 2.7 to 3.3VDC (output source current 1mA)

• Maximum output current at high impedance : ±25µA

• Pull-up resistance : Not equipped

• Series resistance : 33Ω

(d) Termination (–PDIAG)

• Pull-up resistance : 10kΩ

• Series resistance : 0Ω

(2) Open drain input/output signals (–DASP)

(a) Input signal level

• Low level : 0 to 0.8VDC

• High level : 2.0 to 5.25VDC

• Hysteresis : possessed

• Maximum input current : ±25µA (excluding the pull-up resistance)

(b) Output signal level

• Low level : 0 to 0.4VDC (output sink current 12mA)

• Maximum output current at high impedance : ±25µA

• Pull-up resistance : 10kΩ

• Series resistance : 0Ω

(3) Tri-state output signals (DMARQ, INTRQ, IORDY)

• Low level : 0 to 0.4VDC (output sink current 12mA)

• High level : 2.7 to 3.3VDC (output source current 1mA)

• Maximum output current at high impedance : ±25µA

• Series resistance : 22Ω

– 12 –

(4) Open-drain output signals ( –IOCS16)

• Low level : 0 to 0.4VDC (output sink current 12mA)

• Maximum output current at high impedance : ±25µA

(5) Input signals (–RESET, –DIOW, –DIOR, –CSEL, –DMACK, DA0 to DA2, –CS0, –CS1)

(a) Input signal level

• Low level : 0 to 0.8VDC

• High level : 2.0 to 5.25VDC

• Hysteresis (excluding RESET, –CSEL) : possessed

• Maximum input current : ±25µA (excluding the pull-up resistance)

• Pull-up resistance

–RESET : 10kΩ –CSEL : 47kΩ

• Series resistance (–RESET, –DIOW, –DIOR, –DMACK, DA0 to DA2, –CS0, –CS1) :82Ω

14.3 Input/Output Signals

Refer to Table 14.3-1. Among the following signals, the input signal refers to the signal input to the CD-RW drive and the output signal refers to the signal output from the CD-RW drive and the input/output signal refers to the bidirectional signal.

(Table 14.3-1) IDE Interface signal summary (Sheet 1 of 2)

Signal Description Direction –CSEL Cable select IN –CS0 Chip select0 IN –CS1 Chip select1 IN DD0 Data bus bit 0 IN/OUT DD1 Data bus bit 1 IN/OUT DD2 Data bus bit 2 IN/OUT DD3 Data bus bit 3 IN/OUT DD4 Data bus bit 4 IN/OUT DD5 Data bus bit 5 IN/OUT DD6 Data bus bit 6 IN/OUT DD7 Data bus bit 7 IN/OUT DD8 Data bus bit 8 IN/OUT DD9 Data bus bit 9 IN/OUT DD10 Data bus bit 10 IN/OUT DD11 Data bus bit 11 IN/OUT DD12 Data bus bit 12 IN/OUT DD13 Data bus bit 13 IN/OUT DD14 Data bus bit 14 IN/OUT DD15 Data bus bit 15 IN/OUT –DASP Device active/Slave present IN/OUT

– 13 –

(Table 14.3-1) IDE Interface signal summary (Sheet 2 of 2)

Signal Description Direction DA0 Device address bit 0 IN DA1 Device address bit 1 IN DA2 Device address bit 2 IN –DMACK DMA acknowledge IN DMARQ DMA request OUT INTRQ Interupt request OUT –IOCS16 Drive 16 bit I/O OUT

–IOR –HDMARDY HSTROBE

IORDY –DDMARDY DSTROBE

–DIOW STOP

–PDIAG –CBLID

I/O read DMA ready during Ultra DMA data in bursts Data strobe during Ultra DMA data out bursts

I/O ready DMA ready during Ultra DMA data out bursts Data strobe during Ultra DMA data in bursts

I/O write Stop during Ultra DMA data bursts

Passed diagnostics Cable assembly type identifier

IN IN IN

OUT OUT OUT

IN IN

IN/OUT

–

–RESET Reset IN

14.4 Interface Timing

The following specifications all apply to the signal interface connector terminal of the CD-ROM drive. In timing description, H indicates high level (false) and L low level (true).

(1) Reset timing (master/slave) : Fig. 14.4-1 (2) Reset timing (slave) : Fig. 14.4-2 (3) PIO write cycle timing : Fig. 14.4-3 (4) PIO read cycle timing : Fig. 14.4-4 (5) DMA single word transfer timing : Fig. 14.4-5 (6) DMA multi word transfer timing : Fig. 14.4-6 (7) Ultra DMA transfer timing (Data in burst) : Fig. 14.4-7 (8) Ultra DMA transfer timing (Data out burst) : Fig. 14.4-8

– 14 –

–RESET

–DASP

H L

–PDIAG

H L

Symbol Item Min Typ Max Unit

t1 –HRST pulse width 25 µs

(Fig. 14.4-1) Reset timing (master)

–RESET

H L

–DASP

H L

–PDIAG

H L

Symbol Item Min Typ Max Unit

t2 –DASP assert time 70 400 ms t4 –PDIAG assert start 0.2 30 s

(Fig. 14.4-2) Reset timing (slave)

– 15 –

–CS0, CS1 DA0 ~ DA2

–DIOW

IORDY

DD0 ~ DD15

H L

t6 t7

H L

t10

t14

H L

t11

t12

H L

Symbol Item Min Max Unit

t5 Address setup time 25 ns t6 –IOW pulse width 70 ns t7 Address hold time 10 ns t8 –IOW interactive pulse width 25 ns

t9 IORDY delay time 35 ns t10 IORDY pulse width 1,250 ns t11 Write data setup time 20 ns t12 Write data hold time 10 ns t14 Write cycle time 120 ns

(Fig. 14.4-3) PIO write cycle timing

– 16 –

–CS0, CS1 DA0 ~ DA2

–DIOR

IORDY

H L

t15

t16 t17

t18

H L

t19

t20

t24

H L

t22

DD0 ~ DD15

H L

Symbol Item Min Max Unit

t15 Address setup time 25 ns t16 –DIOR pulse width 70 ns t17 Address hold time 10 ns t18 –DIOR interactive pulse width 25 ns t19 IORDY delay time 35 ns t20 IORDY pulse width 90 1,250 ns t22 Read data hold time 5 ns t24 Read cycle time 120 ns

(Fig. 14.4-4) PIO read cycle timing

– 17 –

DMARQ

–DMACK

–DIOW

DD0 ~ DD15

H L

t26 t34 H L

t27

t28

t36

H L

t31

t30 H L

–DIOR

DD0 ~ DD15

H L

t32

t33

H L

Symbol Item Min Max Unit

t26 From –DMACK assert to –DMAREQ negate 80 ns t27 From –DMACK assert to –DIOW low 0 ns t28 –DIOW, –DIOR pulse width 120 ns t30 Write data setup time 35 ns t31 Write data hold time 20 ns t32 Read data delay time 60 ns t33 Read data hold time 5 ns t34 From –DIOW, –DIOR high to –DMACK negate 0 ns t36 Cycle time 240 ns

(Fig. 14.4-5) DMA single word transfer timing

– 18 –

DMARQ

–DMACK

–DIOW

DD0 ~ DD15

H L

t45

H L

t38

t48

t39 t40

t46

H L

t42

t41 H L

–DIOR

DD0 ~ DD15

H L

t43

t44

t49 H L

Symbol Item Min Max Unit

t38 From –DMACK assert to –DIOW low 0 ns t39 –DIOW, –DIOR pulse width 70 ns t40 –DIOW, –DIOR interactive pulse width 25 ns t41 Write data setup time 20 ns t42 Write data hold time 10 ns t43 Read data delay time 50 ns t44 Read data hold time 5 ns t45 From –DIOW, –DIOR low to DMARQ negate 35 ns t46 From –DIOW, –DIOR high to –DMACK negate 5 ns t48 Write cycle time 120 ns t49 Read cycle time 120 ns

(Fig. 14.4-6) DMA multi word transfer timing

– 19 –

Initiating an Ultra DMA data in burst

– (

DMARQ (device)

–DMACK (host)

STOP (host)

−HDMARDY (host)

DSTROBE (device)

DD(15:0) (device)

DA0, DA1, DA2 (host)

−CS0, −CS1 (host)

H L

Sustained Ultra DMA data in burst

t50

t51

t54

t55

t52

t56

t53

t57

t58

t60

DSTROBE (device)

DD(15:0) (device)

t59

H L

t58 t57

t58 t58

H L

t59

t60

t57

Host pausing an Ultra DMA data in burst

DMARQ (device)

DMACK

host)

STOP (host)

−HDMARDY (host)

DSTROBE (device)

DD(15:0) (device)

H L

t61

H L

t62

H L

(Fig. 14.4-7) Ultra DMA transfer timing (Data in burst) (Fig. 1 of 3)

– 20 –

Device terminating an Ultra DMA data in burst

DMARQ (device)

–DMACK (host)

STOP (host)

−HDMARDY (host)

DSTROBE (device)

DD(15:0) (device)

DA0, DA1, DA2 (host)

−CS0, −CS1 (host)

H L

t64

H L

t64

H L

t66

H L

t67

t55

H L

Host terminating an Ultra DMA data in burst

t64

t63

t51

t65

t68 t69

CRC

t51

DMARQ (device)

–DMACK (host)

STOP (host)

−HDMARDY (host)

STROBE

(device)

DD(15:0) (device)

A0, DA1, DA2

(host)

−CS0, −CS1 (host)

H L

t64 t63

t67

t55

t51

H L

t51

H L

t62

t64

t63

t65

H L

t69

t68

H L

CRC

t51

(Fig.14.4-7) Ultra DMA transfer timing (Data in burst) (Fig. 2 of 3)

– 21 –

Symbol Item Min Max Unit

t50 Unlimited interlock time 0 ns t51 Setup time/Hold time (to –DMACK ↓ )20 ns t52 Envelope time (–DMACK ↓ to STOP/

20 70 ns

–HDMARDY ↓ )

t53 DSTROSE negate start time (STOP/–HDMARDY

0170ns

↓ to DSTROBE ↓ ) t54 DSTROBE drive delay time (to –DMACK ↓)0 ns t55 Output data, release delay time (to –DMACK ↓)10ns t56 Output data, drive start time (to STOP ↓/

0ns

–HDMARDY ↓) t57 Valid data, setup time (to DSTROBE edge) 30 ns t58 Valid data, hold time (to DSTROBE edge) 6 ns t59 DSTROBE cycle time Mode 2 54 ns

Mode 1 73 ns Mode 0 112 ns

t60 DSTROBE x 2-cycle time Mode 2 115 ns

Mode 1 154 ns Mode 0 230 ns

DSTROBE Average x 2-cycle time Mode 2 120 ns

Mode 1 160 ns Mode 0 240 ns

t61 DSTROBE stop shift time (DSTROBE

edge to –HDMARDY ↑)

Mode 2 20 ns Mode 1 30 ns Mode 0 50 ns

t62 Final DSTROBE stop time (to –HDMARDY ↑)60ns t63 DSTROBE ↑ to –DMACK ↑ delay time 20 ns t64 Limited interlock time 0 150 ns t65 DSTROBE release time (to –DMACK ↑)20ns t66 DSTROBE edge to HDMARQ ↓ delay time 50 ns t67 HDMARQ ↓ to CRC data output delay time 20 ns t68 Data setup time (to –DMACK ↑)30ns t69 Data hold time (to –DMACK ↑)6ns

(Fig.14.4-7) Ultra DMA transfer timing (Data in burst) (Fig. 3 of 3)

– 22 –

Initiating an Ultra DMA data out burst

DMARQ (device)

–DMACK (host)

STOP (host)

−DDMARDY (device)

HSTROBE (host)

DD(15:0) (host)

DA0, DA1, DA2 (host)

−CS0, −CS1 (host)

H L

Sustained Ultra DMA data out burst

t70

t71

t73

t72

t74

t70

t75

t76

t78

t77

t78

t75 t76

HSTROBE (host)

DD(15:0) (host)

t77

H L

t76

t75

t76

H L

Device pausing an Ultra DMA data out burst

MARQ

(device)

DMACK

host)

STOP (host)

−DDMARDY (device)

HSTROBE (host)

D(15:0)

host)

H L

t79

H L

t80

(Fig. 14.4-8) Ultra DMA transfer timing (Data out burst) (Fig. 1 of 3)

– 23 –

Host terminating an Ultra DMA data out burst

t74

DMARQ (device)

–DMACK (host)

STOP (host)

−DDMARDY (device)

STROBE

(host)

DD(15:0) (host)

DA0, DA1, DA2 (host)

−CS0, −CS1 (host)

H L

t83

t74

H L

Device terminating an Ultra DMA data

t74

t81

t75

CRC

t71

t82

t71

t76

t71

DMARQ (device)

–DMACK (host)

STOP (host)

DDMARDY

(device)

STROBE

host)

D(15:0)

(host)

A0, DA1, DA2

(host)

−CS0, −CS1 (host)

H L

t74

t81 t71

H L

t80

t82

t74

t81

t71

t76

t75

CRC

t71

H L

t71

(Fig.14.4-8) Ultra DMA transfer timing (Data out burst) (Fig. 2 of 3)

– 24 –

Symbol Item Min Max Unit

t70 Unlimited interlock time 0 ns t71 Setup time/Hold time (to –DMACK ↓ )20 ns t72 Envelope time(–DMACK ↓ to STOP ↓)2070ns t73 –DDMARDY drive delay time (to –DMACK ↓)0 ns t74 Limited interlock time 0 150 ns t75 Data setup time (to –HSTROBE edge/to

7ns

–DMACK ↑)

t76 Data hold time (to HSTORE edge/ to –DMACK ↑)5 ns t77 HSTORE cycle time Mode 2 54 ns

Mode 1 73 ns Mode 0 112 ns

t78 HSTROBE x 2-cycle time Mode 2 115 ns

Mode 1 154 ns Mode 0 230 ns

HSTROBE Average x 2-cycle time Mode 2 120 ns

Mode 1 160 ns Mode 0 240 ns

t79 Receipt stop shift time (HSTROBE edge

to –DDMARDY ↑)

Mode 2 20 ns Mode 1 30 ns Mode 0 50 ns

t80 –DDMARDY ↑ to DMARQ ↓ delay time 100 ns t81 HSTROBE ↑ to –DMACK ↑ delay time 20 ns t82 –DDMARDY release time (to –DMACK ↑)20ns t83 –HSTROBE edge to STOP ↑ delay time 50 ns

(Fig.14.4-8) Ultra DMA transfer timing (Data out burst) (Fig. 3 of 3)

– 25 –

14.5 COMMAND SET

14.5.1 ATA COMMAND

Refer to table 14.5.1-1.

CODE COMMAND

(Table 14.5.1-1) ATA COMMAND

08 ATAPI SOFT RESET

E5 CHECK POWER MODE

90 EXECUTE DRIVE DIAGNOSTIC E3 IDLE E1 IDLE IMMEDIATE

00 NOP A0 ATAPI PKT. A1 ATAPI IDENTIFY DEVICE EF SET FEATURE E6 SLEEP E2 STANDBY E0 STANDBY IMMEDIATE A2 SERVICE

– 26 –

14.5.2 ATAPI COMMAND

Refer to table 14.5.2-1.

(Table 14.5.2-1) List of the ATAPI commands (Sheet 1 of 2)

CODE COMMAND

A1 BLANK 5B CLOSE TRACK/SESSION

04 FORMAT UNIT

4A GET EVENT STATUS NOTIFICATION

12 INQUIRY

BD MECHANISM STATUS

55 MODE SELECT 5A MODE SENSE 4B PAUSE/RESUME

45 PLAY AUDIO (10) A5 PLAY AUDIO (12)

47 PLAY AUDIO MSF

49 PLAY TRACK RELATIVE (10) A9 PLAY TRACK RELATIVE (12)

1E PREVENT/ALLOW MEDIUM REMOVAL

28 READ (10) A8 READ (12) 5C READ BUFFER CAPACITY

25 READ CD/DVD CAPACITY BE READ CD B9 READ CD MSF

51 READ DISC INFORMATION

44 READ HEADER

42 READ SUB-CHANNEL

43 READ TOC

52 READ TRACK/RZONE INFORMATION

03 REQUEST SENSE

53 RESERVE TRACK

01 REZERO UNIT BA SCAN 2B SEEK 5D SEND CUE SHEET

54 SEND OPC INFORMATION BB SET CD-ROM SPEED 1B START/STOP UNIT

4E STOP PLAY/SCAN

35 SYNCHRONIZE CACHE

– 27 –

(Table 14.5.2-1) List of the ATAPI commands (Sheet 2 of 2)

CODE COMMAND

00 TEST UNIT READY 2A WRITE (10)

AA WRITE (12) AD READ DVD STRUCTURE

23 READ FORMATTED CAPACITIES A4 REPORT KEY A3 SEND KEY A7 SET READ AHEAD

46 GET CONFIGURATION

AC GET PERFORMANCE

A2 SEND EVENT

– 28 –

15. POWER MANAGEMENT SPECIFICATION

This drive has a power management function to reduce power consumption.

15.1 Power Management Modes

The drive has the following four power management modes. The transition between these modes is performed by the timer within the drive or a command issued by the host.

• Active mode

• Idle mode

• Standby mode

• Sleep mode

15.1.1 Transition in power management mode

The transition in the power management mode is shown in Fig. 15.1.1-1.

POWER ON

(1)

SELF DIAGNOSTIC

(7)

(4)

DISK PRESENCE ?

YES(2)

ACTIVE

MODE

(5) (6)

IDLE

MODE

(5)

STANDBY

MODE

(8)

SLEEP MODE

(3)

(9)

(12)

TRAY EJECT

(10)

(11)

TRAY LOADING

DISK PRESENCE ?

(13)

(Fig. 15.1.1-1) Transition in power management mode

– 29 –

YES

(1) When the RESET signal is released, the disc detection is performed after self-diagnostics are completed. (2) If the disc is loaded, the mode will switch to the active mode and starting operation will begin. (3) If the disc is not loaded, the mode will switch to the standby mode. (4) Using the power management command (IDLE, IDLE IMMEDIATE, STANDBY, STANDBY

IMMEDIATE, SLEEP), the transition from the active mode to the idle, standby or sleep mode, from the idle mode to the standby or sleep mode, or from the standby mode to the idle or sleep mode is possible.

(5) The transition from the active mode to the idle mode or from the idle mode to the standby mode is also

performed by the timer the has. The timer will be initialized to the specified value when disc detection operation is under way or when a command which requires disc access is executed. The timer will not be initialized when a command which does not require disc access is executed in the active mode.

(6) The resumption from the idle or standby mode to the active mode is initiated when a command which

requires disc access is executed.

(7) The resumption after the sleep mode is possible only after the RESET signal, the SRST (bit 2 of the

DEVICE Control Register) or the ATAPI SOFT RESET command is detected. If resumption after the sleep mode is initiated using the RESET signal, an operation similar to when the power is switched ON occurs.

(8) If resumption after the sleep mode is initiated using the SRST or the ATAPI SOFT RESET command,

the drive enters the standby mode. (9) Tray ejection in each of the active, idle, standby and sleep modes is possible. (10) If the tray is ejected in the active, idle or standby mode, the drive enters the standby mode when the tray

is out or the sleep mode when the tray is ejected in the sleep mode. (11) If the tray is inserted when the tray is out, the disc detection operation is performed. (12) If no disc is loaded, the drive will resume a mode when the tray is out. (13) If the disc is loaded, the drive will resume the active mode. However, the drive resumes the sleep mode

following the TOC read only when the tray is ejected in the sleep mode.

15.2 Active Mode

A state in which the drive is capable of responding in the shortest possible time to an access using a command, and all the electrical circuitry of the drive, the pickup, spindle motor and sled motor are operating. In the following cases, the drive will enter the active mode:

(1) While it is being booted after the power is switched ON and self diagnosis is under way. (2) While the booting operation or Reading of the TOC is under way when the tray is inserted and the disc

is loaded. (3) While the booting operation or Reading of the TOC is in progress with the power ON and the disc loaded. (4) While an command that requires disc access is being executed. (5) Until the drive switches over to other power management mode using the timer in the drive or the

command after either (2), (3) or (4) above is performed.

15.3 Idle Mode

The idle mode has the same operational functions as the active mode. However, the current consumption is reduced by lowering the rotational speed of the spindle motor in the idle mode. The transition to the idle mode comes in the following two ways:

(1) When using the timer in the drive:

After executing (2), (3) and (4) in 14.2, if the specified time elapses by the timer in the drive, the mode

will switch from the active mode to the idle mode.

The specified time of the timer is set to 8 seconds. (2) When using the power management command (IDLE, IDLE IMMEDIATE):

– 30 –

The transition from the active or standby mode is possible using the power management command

(IDLE, IDLE IMMEDIATE).

For details, refer to the Software Specification.

15.4 Standby Mode

Except for the functions required for the reception of a command, all other functions are in the power save condition. And although the command can be received, a time is required to restore the functions that are in the power save condition for the command that requires disc access. The transition to the standby mode comes in the following three ways:

(1) When using the timer in the drive:

After executing (2), (3) and (4) in 15.2, if the specified time elapses by the timer in the drive, the mode

will switch from the active to the standby mode via the idle mode.

Although the specified time of the timer can be preset using the STANDBY command or MODE

SELECT command, it is set to 32 seconds by default. The transition time to the idle mode is included in

the preset value of the timer.

For details, refer to the Software Specification. The timer will be initialized to the specified value after

executing (2), (3) and (4) in 15.2. The timer will not be initialized when a command which does not

require disc access is executed in the active mode. (2) When using the power management command (STANDBY, STANDBY IMMEDIATE) or START/

STOP UNIT command:

The transition from the active or idle mode is possible using the power management command

(STANDBY, STANDBY IMMEDIATE) or START/STOP UNIT command.

For details, refer to the Software Specification. (3) When the power is switched ON or a disc is not detected by the disc detection operation while the tray is

being retracted, the drive will enter the standby mode.

15.5 Sleep Mode

The drive enters a state in which all functions are stopped and no command can be received. The transition to the sleep mode is possible using the SLEEP command. For details, refer to the Software Specification. The resumption from the sleep mode is possible using the RESET signal, the SRST (bit 2 of the Device Control Register) or the ATAPI SOFT RESET command.

15.5.1 Tray ejection/insertion in the sleep mode

If the eject button is pressed in sleep mode, the tray will be ejected before sleep mode is entered. If the tray is inserted while in this state, disc detection is performed; If the disc is loaded on the tray, the start-up operation is performed before sleep mode is entered. If the disc is not loaded on the tray, sleep mode is entered.

16. OTHERS

16.1 Using the lens cleaner

Some commercially available wet-type lens cleaners may sometimes actually make the lens dirtier rather than cleaning it. In general, we recommend that you avoid using a wet-type lens cleaner. Use a dry-type lens cleaner.

– 31 –

16.2 Safety of Laser Products

When selling this unit or a system with this unit to an end user, print the following text in the instruction manual or enclose the separate sheet on which the following text is printed with the instruction manual.

This product has been designed and manufactured according to FDA regulations "title 21. CFR. chapter1, subchapter J. based on the radiation Control for Health and Safety Act of 1968", and is classified as a class 1 laser product. There is no hazardous invisible laser radiation during operation because invisible laser radiation emitted inside of this product is completely confined in the protective housings. The label required in this regulation is shown bellow.

CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

Optical pickup

Type : HOP-6201T Manufacturer : Hitachi Media Electronics Co., Ltd. Laser output : Less than 1.4mW (Play) and 75mW (Record) on the

objective lens

Wavelength : 777-787nm (CD)

645-664nm (DVD)

Standard : IEC60825-1 : 2001

(Fig. 16.2-1)

– 32 –

Teac DW-224E-V, DW-224E-R93 Hardware Specificftion

Specifications and Main Features

Frequently Asked Questions

User Manual

1. SCOPE

2. OUTLINE

3. CONSTRUCTION

3.1 External Construction

3.2 Installation

4. DISC SPECIFICATION

4.1 Applicable Disc Format

4.2 Rotational Speed

4.3 Data Capacity

4.4 Write methods

4.5 Readable disc

4.6 Recordable Disc (Recording Speed)

5. PERFORMANCE

5.1 Operating Performance

5.2 Audio

5.3 Acoustic Noise

6. ENVIRONMENTAL CONDITIONS

7. RELIABILITY

8. SAFETY STANDARDS

9. FRONT INDICATOR

10. DRIVE CONFIGURATION

11. INTERFACE CONNECTOR

12. AUDIO INTERFACE

13. POWER INTERFACE

14. IDE HARDWARE INTERFACE

14.1 Outline

14.2 Electrical Characteristics

14.3 Input/Output Signals

14.4 Interface Timing

14.5 COMMAND SET

14.5.1 ATA COMMAND

14.5.2 ATAPI COMMAND

15. POWER MANAGEMENT SPECIFICATION

15.1 Power Management Modes

15.1.1 Transition in power management mode

15.2 Active Mode

15.3 Idle Mode

15.4 Standby Mode

15.5 Sleep Mode

15.5.1 Tray ejection/insertion in the sleep mode

16. OTHERS

16.1 Using the lens cleaner

16.2 Safety of Laser Products