Supermicro X11SSZ-F User Manual

X11SSZ-TLN4F

X11SSZ-QF

X11SSZ-F

USER’S MANUAL

Revision 1.0

The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:

For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual at any time and without notice. This product, including software and documentation, is the property of Supermicro and/ or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except as expressly permitted by the terms of said license.

IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual, may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: Handling of lead solder materials used in this product may expose you to lead, a chemical known to the State of California to cause birth defects and other reproductive harm.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment, nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical

systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic

property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision 1.0

Release Date: November 09, 2015

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this

document. Information in this document is subject to change without notice. Other products and companies referred

to herein are trademarks or registered trademarks of their respective companies or mark holders.

Printed in the United States of America

Preface

About This Manual

This manual is written for system integrators, IT technicians and knowledgeable end users. It provides information for the installation and use of the X11SSZ-TLN4F/QF/F motherboard.

About This Motherboard

The X11SSZ series comes in different model variations with different CPU support. The X11SSZ-TLN4F/F supports Intel® Xeon E3-1200 v5 series, 6th Generation Core i7/i5/i3, Pentium, and Celeron processors in an LGA1151 socket, while the X11SSZ-QF supports Intel 6th Generation Core i7/i5/i3, Pentium, and Celeron processors in an LGA1151 socket. The X11SSZ-TLN4F/F features the C236 chipset and support for ECC and Non-ECC DDR4 UDIMM memory, while the X11SSZ-QF features the Q170 chipset and support for Non-ECC only. The X11SSZ series motherboards include the PCI Express 3.0 interface, four SATA 3.0 ports, IPMI 2.0, 12V DC power source, GPU add-on card power connector, dual 10GbE LAN option, HD Graphic outputs, and a combination of USB 2.0 and 3.0 ports. The motherboards also provide security-enhancing technologies such as Intel Software Guard Extensions (Intel SGX), Intel vPro, and Intel Trusted Execution Technology (TXT). The X11SSZ-TLN4F/ QF/F offers exceptional system performance for entry server, data storage, network security, embedded applications, and cloud computing platforms.

Please note that this motherboard is intended to be installed and serviced by professional technicians only. For processor/memory updates, please refer to our website at http://www. supermicro.com/products/.

Conventions Used in the Manual

Special attention should be given to the following symbols for proper installation and to prevent

damage done to the components or injury to yourself:

Warning! Indicates important information given to prevent equipment/property damage

or personal injury.

Warning! Indicates high voltage may be encountered when performing a procedure.

Important: Important information given to ensure proper system installation or to

relay safety precautions.

Note: Additional Information given to differentiate various models or provides information for correct system setup.

X11SSZ-TLN4F/QF/F User's Manual

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: +1 (408) 503-8000

Fax: +1 (408) 503-8008

Email: marketing@supermicro.com (General Information)

support@supermicro.com (Technical Support)

Website: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

Tel: +31 (0) 73-6400390

Fax: +31 (0) 73-6416525

Email: sales@supermicro.nl (General Information)

support@supermicro.nl (Technical Support)

rma@supermicro.nl (Customer Support)

Website: www.supermicro.nl

Asia-Pacic

Address: Super Micro Computer, Inc.

3F, No. 150, Jian 1st Rd.

Zhonghe Dist., New Taipei City 235

Taiwan (R.O.C)

Tel: +886-(2) 8226-3990

Fax: +886-(2) 8226-3992

Email: support@supermicro.com.tw

Website: www.supermicro.com.tw

Preface

Table of Contents

Chapter 1 Introduction

1.1 Checklist ...............................................................................................................................8

Quick Reference ...............................................................................................................11

Quick Reference Table ......................................................................................................12

Motherboard Features .......................................................................................................14

1.2 Processor and Chipset Overview .......................................................................................18

1.3 Special Features ................................................................................................................18

Recovery from AC Power Loss .........................................................................................19

1.4 System Health Monitoring ..................................................................................................19

Onboard Voltage Monitors ................................................................................................19

Fan Status Monitor with Firmware Control .......................................................................19

Environmental Temperature Control .................................................................................19

System Resource Alert......................................................................................................19

1.5 ACPI Features ....................................................................................................................20

1.6 Power Supply .....................................................................................................................20

Chapter 2 Installation

2.1 Static-Sensitive Devices .....................................................................................................21

Precautions .......................................................................................................................21

Unpacking .........................................................................................................................21

2.2 Motherboard Installation .....................................................................................................22

Tools Needed ....................................................................................................................22

Location of Mounting Holes ..............................................................................................22

Installing the Motherboard.................................................................................................23

2.3 Processor and Heatsink Installation ...................................................................................24

Installing the LGA1151 Processor .....................................................................................24

Installing an Active CPU Heatsink with Fan .....................................................................27

Removing the Heatsink .....................................................................................................29

2.4 Memory Support and Installation .......................................................................................30

Memory Support ................................................................................................................30

DIMM Module Population Conguration ...........................................................................30

DIMM Module Population Sequence ................................................................................30

DIMM Installation ..............................................................................................................31

DIMM Removal .................................................................................................................31

X11SSZ-TLN4F/QF/F User's Manual

2.5 Rear I/O Ports ....................................................................................................................32

2.6 Front Control Panel ............................................................................................................36

2.7 Connectors .........................................................................................................................40

Power Connections ...........................................................................................................40

Headers .............................................................................................................................43

2.8 Jumper Settings .................................................................................................................52

How Jumpers Work ...........................................................................................................52

2.9 LED Indicators ....................................................................................................................56

Chapter 3 Troubleshooting

3.1 Troubleshooting Procedures ..............................................................................................59

Before Power On ..............................................................................................................59

No Power ..........................................................................................................................59

No Video ...........................................................................................................................60

System Boot Failure .......................................................................................................60

Memory Errors ..................................................................................................................60

Losing the System's Setup Conguration .........................................................................61

When the System Becomes Unstable ..............................................................................61

3.2 Technical Support Procedures ...........................................................................................63

3.3 Frequently Asked Questions ..............................................................................................64

3.4 Battery Removal and Installation .......................................................................................65

Battery Removal ................................................................................................................65

Proper Battery Disposal ....................................................................................................65

Battery Installation .............................................................................................................65

3.5 Returning Merchandise for Service ....................................................................................66

Chapter 4 BIOS

4.1 Introduction .........................................................................................................................67

Starting the Setup Utility ...................................................................................................67

4.2 Main Setup .........................................................................................................................68

4.3 Advanced Setup Congurations .........................................................................................70

4.4 Event Logs .........................................................................................................................95

4.5 IPMI ....................................................................................................................................97

4.6 Security .............................................................................................................................100

4.7 Boot ..................................................................................................................................103

4.8 Save & Exit .......................................................................................................................106

Preface

Appendix A BIOS Codes

Appendix B Software Installation

B.1 Installing Software Programs ...........................................................................................11 0

B.2 SuperDoctor® 5 .................................................................................................................111

Appendix C Standardized Warning Statements

Battery Handling ..............................................................................................................112

Product Disposal .............................................................................................................114

Appendix D UEFI BIOS Recovery

X11SSZ-TLN4F/QF/F User's Manual

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an acknowledged leader in the industry. Supermicro boards are designed with the utmost attention to detail to provide you with the highest standards in quality and performance.

Please check that the following items have all been included with your motherboard. If anything listed here is damaged or missing, contact your retailer. The following items are included in the retail box:

1.1 Checklist

Main Parts List (Included in Retail Box)

Description Part Number Quantity

Supermicro Motherboard X11SSZ-TLN4F/QF/F 1

57.5CM SATA FLAT S-S PBF CBL-0044L 4

Quick Reference Guide MNL-1744-QRG 1

I/O Shield MCP-260-00093-0N 1

Important Links

For your system to work properly, please follow the links below to download all necessary drivers/utilities and the user’s manual for your server.

• Supermicro product manuals: http://www.supermicro.com/support/manuals/

• Product drivers and utilities: ftp://ftp.supermicro.com

• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

• If you have any questions, please contact our support team at: support@supermicro.com

This manual may be periodically updated without notice. Please check the Supermicro website

for possible updates to the manual revision level.

Figure 1-1. X11SSZ-TLN4F Motherboard Image

Chapter 1: Introduction

Note 1: LAN ports 3/4 are only available on X11SSZ-TLN4F.

Note 2: All graphics shown in this manual were based upon the latest PCB revision

available at the time of publication of the manual. The motherboard you received may or may not look exactly the same as the graphics shown in this manual.

X11SSZ-TLN4F/QF/F User's Manual

COM1

COM2

AUDIO FP

JPAC1

USB8/9

USB6/7

JSPDIF_OUT1

PCH SLOT4 PCI-E 3.0 X4(IN X8)

JI2C2

JI2C1

JPB1

JD1

SP1

Figure 1-2. X11SSZ-TLN4F/QF/F Motherboard Layout

(not drawn to scale)

LED1

JUIDB1

JSMB1

JWD1

JBR1

BT1

JVRM2

JIPMB1

JVRM1

CPU SLOT6 PCI-E 3.0 X16

JVR1

LED3

PCH SLOT7 PCI-E 3.0 X4(IN X8)

JPG1

MAC CODE

LED2

MAC CODE

DP1/DP2

VGA/DVI

X11SSZ-F

REV: 1.10 DESIGNED IN USA

CPU Socket LGA1151

JPL3 JPL2 JPL1

LAN3/4

USB2/3(3.0)

LAN1/2

FAN4

IPMI_LAN USB0/1

JPW2

JPW1

JL1

I-SATA0

USB4/5

J18

I-SATA3

I-SATA2

I-SATA1

JBT1

JSD1

FANB

BAR CODE

Intel C236

JTPM1

JPWR1

I-SGPIO1

FANA

S/N CODE

USB10/11(3.0)

BIOS LICENSE

JGPIO1

LED4

JPI2C1

J15

DIMMB2

DIMMA1

DIMMA2

USB12

JPME2

JBR3

FAN3

JF1

JBR2

FAN2

DIMMB1

FAN1

Note 1: LAN ports 3/4 are only available on X11SSZ-TLN4F.

Note 2: Components not documented are for internal testing only.

Quick Reference

Chapter 1: Introduction

AUDIO FP

JPAC1

COM1

SLOT4

COM2

JPB1

JWD1

JD1

SLOT6 SLOT7

USB8/9

SP1 BT1

USB6/7

USB4/5

JL1 J18

I-SATA3

JBT1

I-SATA2

I-SATA1

I-SATA0

JSPDIF_OUT

AUDIO FP

JSPDIF_OUT1

JPAC1

COM1

COM2

USB8/9

USB6/7

USB4/5

JL1

J18

I-SATA3

JBT1

I-SATA2

I-SATA1

JSD1

I-SATA0

JVRM1

JVRM2

JIPMB1

JSMB1

JI2C1

JI2C2

JD1

JI2C1

JPB1

Intel C236

JTPM1

JWD1

JSMB1

JBR1

BT1

JVRM2

JIPMB1

I-SGPIO1

PCH SLOT4 PCI-E 3.0 X4(IN X8)

SP1

FANB

LED3

JVRM1

CPU SLOT6 PCI-E 3.0 X16

JVR1

JPWR1

JPG1

JUIDB1

LED1

LED2

LED3

JPG1

MAC CODE

BAR CODE

S/N CODE

USB10/11(3.0)

FANA

LED1

DP1/DP2

JUIDB1

DP1/DP2

LED2

PCH SLOT7 PCI-E 3.0 X4(IN X8)

MAC CODE

BIOS LICENSE

JGPIO1

JF1

LED4

VGA/DVI

X11SSZ-F

REV: 1.10 DESIGNED IN USA

CPU Socket LGA1151

JBR3

FAN3

JPME2

JBR2

LAN3/4

JPL3 JPL2 JPL1

USB12

LAN3/4

DIMMA1

FAN2

LAN1/2

DIMMA2

USB2/3 (3.0)

IPMI_LAN

USB0/1 (2.0)

USB2/3(3.0)

IPMI_LAN USB0/1

JPW2

FAN4

JPW1

DIMMB2

DIMMB1

JPW2 JPL3

JPL2

JPL1

FAN4

JPW1

DIMMA1 DIMMA2 DIMMB1 DIMMB2

JPI2C1

J15

FAN1

JSD1

FANB

JTPM1

JPWR1

I-SGPIO1

LED4

JGPIO1

USB10/11 (3.0)

FANA

JF1

FAN3

JPME2

USB12

FAN2

Notes:

• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel connec-

tions.

• " " indicates the location of Pin 1.

• Jumpers/LED indicators not indicated are used for testing only.

• Use only the correct type of onboard CMOS battery as specied by the manufacturer. Do

not install the onboard battery upside down to avoid possible explosion.

X11SSZ-TLN4F/QF/F User's Manual

Quick Reference Table

Jumper Description Default Setting

JBT1 CMOS Clear Open (Normal)

JI2C1/JI2C2 SMB to PCI-E Slots Enable/Disable Pins 2-3 (Disabled)

JPAC1 Front Panel Audio Enable Pins 1-2 (Enabled)

JPB1 BMC Enabled Pins 1-2 (Enabled)

JPG1 VGA Enable/Disable Pins 1-2 (Enabled)

JPL1/JPL2 LAN1/2 Enable/Disable Pins 1-2 (Enabled)

JPL3 (TLN4F only) LAN3/4 Enable/Disable Pins 1-2 (Enabled)

JPME2 Manufacturing Mode Pins 1-2 (Normal)

JWD1 Watch Dog Pins 1-2 (Reset)

LED Description Status

LED1 Unit ID LED Blue Solid On: Unit Identied

LED2 Overheat/PWR Fail/Fan Fail LED

LED3 BMC Heartbeat LED Green Blinking: BMC Normal

LED4 Power On LED Green Solid On: System is On/Running

Red Solid On: Overheat

Red Blinking: PWR Fail or Fan Fail

Connector Description

AUDIO FP Audio Front panel Header

BT1 Onboard Battery

COM1/COM2 COM Headers

DP1/DP2 DisplayPorts (Version 1.3)

FAN1 ~ FAN4 System/CPU Fan Headers (FAN1: CPU Fan)

FANA, FANB I/O Fan Headers

IPMI_LAN Dedicated IPMI LAN Port

I-SATA0 ~ I-SATA3 Intel® PCH SATA 3.0 Ports

I-SGPIO1 Serial Link General Purpose I/O Header

J15 4-pin Connector for HDD (to provide power from the motherboard to onboard devices)

J18 Extended CMOS Battery Connector

JD1 Speaker/Buzzer Header (Pins 1-4: Speaker, Pins 3-4: Buzzer)

JF1 Front Panel Control Header

JGPIO1 General Purpose I/O Header

JIPMB1 4-pin BMC External I2C Header

JL1 Chassis Intrusion Header

JPI2C1 Power Supply SMBbus I2C Header

JPW1 24-pin ATX Power Connector

JPW2

8-pin 12V DC power for CPU (Required) or alternative power for special enclosure when the

24-pin ATX power is not in use

Note: Table is continued on the next page.

Connector Description

JPWR1

JSD1 SATA DOM Power Connector

JSMB1 PCH SMBus Header

JSPDIF_OUT1 Sony/Phillips Digital Interface Audio Output Header

JTPM1 Trusted Platform Module/Port 80 Connector

JUIDB1 UID Switch

LAN1/LAN2 Gigabit Ethernet (RJ45) Ports

LAN3/LAN4 (TLN4F only) 10 Gigabit Ethernet (RJ45) Ports

SLOT4 PCI-Express 3.0 X4 (IN X8) Slot supported by Intel PCH

SLOT6 PCI-Express 3.0 X16 Slot supported by the CPU

SLOT7 PCI-Express 3.0 X4 (IN X8) Slot supported by Intel PCH

SP1 Internal Speaker/Buzzer

USB0/1 Back panel Universal Serial Bus (USB) 2.0 Port

USB2/3 Back panel Universal Serial Bus (USB) 3.0 Port

USB4/5, 6/7, 8/9 USB 2.0 Headers

USB10/11 USB 3.0 Header

USB12 USB 2.0 Type A Port

VGA/DVI-I Back Panel VGA Port, DVI-I Port

4-pin 12V Power Connector, providing up to 75W for connected devices such as a GPU add-on

card when 24-pin ATC power is not in use

Chapter 1: Introduction

X11SSZ-TLN4F/QF/F User's Manual

Motherboard Features

CPU

• X11SSZ-TLN4F/F: Intel® Xeon E3 -1200 v5 series, 6th Generation Core i7/i5/i3, Pentium, and Celeron processors in

an LGA1151 socket

• X11SSZ-QF: Intel® 6th Generation Core i7/i5/i3 series, Pentium, and Celeron processors in an LGA1151 socket

Memory

• X11SSZ-TLN4F/F: Integrated memory controller supports up to 64GB Unbuffered ECC/Non-ECC UDIMM, DDR4-2133MHz,

in four DIMM slots (E3-1200 v5 with ECC only; Core i7/i5 with Non-ECC only; Core i3, Pentium, and Celeron with ECC

or Non-ECC option)

• X11SSZ-QF: Integrated memory controller supports up to 64GB Unbuffered Non-ECC UDIMM, DDR4-2133MHz, in four

DIMM slots

DIMM Size

• 2GB, 4GB, 8GB, 16GB

Note 1: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/

motherboard.

Chipset

• X11SSZ-TLN4F/F: Intel PCH C236

• X11SSZ-QF: Intel PCH Q170

Expansion Slots

• Two (2) PCI Express 3.0 X4 (IN X8) PCH slots (SLOT4, SLOT7)

• One (1) PCI Express 3.0 X16 CPU slot (SLOT6)

Network

• Intel I219LM Gigabit Ethernet PHY (LAN1): Intel AMT Management Port

• Intel I210-AT Gigabit Ethernet Controller (LAN2): IPMI Shared LAN Port

• Intel X550-BT2 Dual 10GbE Ethernet Controller (LAN3/4, TLN4F SKU Only)

BaseBoard Management Controller (BMC)

• ASpeed AST 2400 Baseboard Controller (BMC) supports IPMI 2.0

• One (1) IPMI_dedicated_LAN located on the rear IO backpanel

Graphics

• Intel HD Graphics (DVI-I, DisplayPort1/DisplayPort2 Version 1.3) with three independent displays

• Graphics controller via ASpeed 2400 BMC (VGA)

Note: The table above is continued on the next page.

Chapter 1: Introduction

Motherboard Features

I/O Devices

• Serial (COM) Port • Two (2) serial-port headers

• SATA 3.0 • Four (4) SATA 3.0 ports supported by Intel PCH (I-SATA 0-3)

• Audio Port • One (1) Audio Front Panel header via Realtek ALC888S

USB

• Two (2) USB 2.0 ports on the rear I/O panel (USB 0/1)

• Six (6) USB 2.0 ports with three (3) internal headers (USB 4/5, 6/7, 8/9)

• Two (2) USB 3.0 ports on the rear I/O panel (USB 2/3)

• Two (2) USB 3.0 ports with one (1) internal USB 3.0 header (USB 10/11)

• One (1) Type-A USB 2.0 connector (USB 12)

BIOS

• 128 Mb SPI AMI BIOS

• PnP Support, PCI 3.0, Keyboard/Mouse support, Hardware BIOS virus protect, RTC (Real Time Clock) wakeup, ACPI

5.0 support, SMBIOS 3.0, UEFI 2.3.1

SM Flash UEFI BIOS

Power Management

• ACPI power management

• Power button override mechanism

• Power-on mode for AC power recovery

• Wake-On-Ring

• Wake-On-LAN

• Management Engine (ME)

System Health Monitoring

• Onboard voltage monitoring for +3.3V, 3.3V standby, +5V, +5V standby, +12V, VBAT, CPU, GPU, Memory, PCH Temp.,

System Temp., Memory Temp.

• CPU/system overheat LED and control

• CPU Thermal Trip support

• CPU switching phase voltage regulator

• CPU Thermal Design Power (TDP) support of up to 95W (See Note 1 on next page.)

Fan Control

• Fan status monitoring via BMC

• Dual cooling zone

• Low-noise fan speed control

• Pulse Width Modulation (PWM) fan control

System Management

Note: The table above is continued on the next page.

X11SSZ-TLN4F/QF/F User's Manual

Motherboard Features

• Trusted Platform Module (TPM) support

• PECI (Platform Environment Control Interface) 3.1 support

• UID (Unit Identication)/Remote UID

• System resource alert via SuperDoctor® 5

• SuperDoctor® 5, Watch Dog, NMI

• Chassis intrusion header and detection

LED Indicators

• CPU/Overheating

• Fan Failure

• UID/remote UID.

• HDD activity. LAN activity.

Dimensions

• 9.6" (L) x 9.6" (W) (243.84 mm x 243.84 mm)

Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and

heatsink cooling restrictions. For proper thermal management, please check the chas-

sis and heatsink specications for proper CPU TDP sizing.

Note 2: For IPMI conguration instructions, please refer to the Embedded IPMI Conguration User's Guide available at http://www.supermicro.com/support/manuals/.

Note 3: It is strongly recommended that you change BMC log-in information upon initial system power-on. The manufacture default username is ADMIN and the password

is ADMIN. For proper BMC conguration, please refer to http://www.supermicro.com/

products/info/les/IPMI/Best_Practices_BMC_Security.pdf

Figure 1-3.

System Block Diagram

Chapter 1: Introduction

PCIe x16 SLOT

Display Port

PCIe x4 in x8 SLOT

4 X SATA-III

2 X USB 3.0 Rear

2 X USB 3.0 Front

2 X USB 2.0 Rear

6 X USB 2.0 Front

1 X USB Type A

Audio Pin Header

PCIe3.0_x16

DVI-I

Digital port B

Digital port C

Digital port D

PCIe3.0_x4

8.0GT/s

PCIe3.0_x4

8.0GT/s

SATA-III

6Gb/s USB3.0 5Gbps USB3.0

5Gbps USB2.0

480Mbps USB2.0

480Mbps

Realtek ALC888S-VD2

GPIO Pin Header

8.0GT/s

DDI B

DDI C

DDI D

PCIE[1~4]

PCIE[13~16]

SATAB[0/1]

SATAA[2/3]

USB3[1/2] USB3[11~12]

USB3[3/4] USB2[13~14]

USB2[1~2]

USB2[3~8]

USB2[9]

AZALIA

IMVP8

INTEL LGA1151

(Socket-H4)

x4 DMI 8GT/s

PCIE[9]

INTEL

PCH-H

PCIE[10]

C236/Q170

PCIE[5~8]

C236 for -TLN4F/F Q170 for -QF

PCIE[11]

SPI

FLASH

SPI 128Mb

SVID

DDR4 (CHA)

2133/1866/1600MHz

DDR4 (CHB)

2133/1866/1600MHz

PCIe3.0_x1

2.5GT/s

PCIe3.0_x1

2.5GT/s

PCIe3.0_x4

8GT/s

PCIe3.0_x1

5.0GT/s

LPC

IMVP8

AST2400

TPM1.2 Header

GLAN1

I219V

GLAN2

I210-AT

LAN3/4 10GbE

X550

DIMMA1

DIMMA2

DIMMB1

DIMMB2

RJ45

TLN4F only

RJ45

VGA

COM1/2 Header

SMBus Pin Header

Note: This is a general block diagram and may not exactly represent the features on

your motherboard. See the previous pages for the actual specications of your motherboard.

X11SSZ-TLN4F/QF/F User's Manual

1.2 Processor and Chipset Overview

The Intel PCH C236 chipset in conjunction with the new Intel Xeon E3-1200 v5 series processor, and the Intel Q170 chipset in conjunction with the new Intel 6th Gen. Core i7

series supports the following features:

• Intel Rapid Storage Technology/Rapid Storage Technoogy enterprise

• Intel Smart Response Technology

• Intel

AMT 11.0, TXT, vPro Technologies

• Intel Hyper-Threading, Intel VT-D, VT-x, SR-IOV

• TSX-NI, AES, SGX Technologies

• Intel

Turbo Boost Technology

• DDR4 Memory Support up to 64GB, 2133MHz

• Three independent Graphics Displays with Audio Stream, VP8, VP9, HEVC, OpenGL

4.3/4.4, Intel QuickSynch Video Technologies

1.3 Special Features

This section describes the health monitoring features of the X11SSZ-TLN4F/QF/F motherboard. The motherboard has an onboard System Hardware Monitor chip that supports system health monitoring.

Chapter 1: Introduction

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond when AC power is lost and then restored to the system. You can choose for the system to remain powered off (in which case you must press the power switch to turn it back on), or for it to automatically return to the power-on state. See the Advanced BIOS Setup section for this setting. The default setting is Last State.

1.4 System Health Monitoring

This section describes the health monitoring features of the X11SSZ-TLN4F/QF/F motherboard. The motherboard has an onboard Baseboard Management Controller (BMC) chip that supports system health monitoring. Once a voltage becomes unstable, a warning is

given or an error message is sent to the screen. The user can adjust the voltage thresholds to dene the sensitivity of the voltage monitor.

Onboard Voltage Monitors

The onboard voltage monitor will continuously scan crucial voltage levels. Once a voltage becomes unstable, it will give a warning or send an error message to the screen. Users can

adjust the voltage thresholds to dene the sensitivity of the voltage monitor. Real time readings

of these voltage levels are all displayed in BIOS.

Fan Status Monitor with Firmware Control

The system health monitor embedded in the BMC chip can check the RPM status of the cooling fans. The CPU and chassis fans are controlled via lPMI.

Environmental Temperature Control

System Health sensors in the BMC monitor the temperatures and voltage settings of onboard processors and the system in real time via the IPMI interface. Whenever the temperature of

the CPU or the system exceeds a user-dened threshold, system/CPU cooling fans will be

turned on to prevent the CPU or the system from overheating.

Note: To avoid possible system overheating, please be sure to provide adequate air-

ow to your system.

System Resource Alert

This feature is available when used with SuperDoctor 5®. SuperDoctor 5 is used to notify the

user of certain system events. For example, you can congure SuperDoctor 5 to provide you

with warnings when the system temperature, CPU temperatures, voltages and fan speeds

go beyond a predened range.

X11SSZ-TLN4F/QF/F User's Manual

1.5 ACPI Features

ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes a exible and abstract hardware interface that provides a standard way to integrate power

management features throughout a computer system including its hardware, operating system and application software. This enables the system to automatically turn on and off peripherals such as network cards, hard disk drives and printers.

In addition to enabling operating system-directed power management, ACPI also provides a generic system event mechanism for Plug and Play and an operating system-independent

interface for conguration control.

1.6 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable operation. It is even more important for processors that have high CPU clock rates. In areas

where noisy power transmission is present, you may choose to install a line lter to shield

the computer from noise. It is recommended that you also install a power surge protector to help avoid problems caused by power surges.

Note 1: The X11SSZ Series motherboard alternatively supports an 8-pin 12V DC input power supply at JPW2 for embedded applications. The 12V DC input is limited to 30A by design. It provides up to 360W power input to the motherboard. Please keep the onboard power usage within the power limits specied above. Overcurrent power usage may cause damage to the motherboard.

Note 2: Please connect both the 8-pin DC power at JPW2 and JPW1 to make sure the CPU receives enough power for normal operation when using the ATX power supply.

Chapter 2: Installation

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. To prevent damage to your motherboard, it is important to handle it very carefully. The following measures are generally

sufcient to protect your equipment from ESD.

Precautions

• Use a grounded wrist strap designed to prevent static discharge.

• Touch a grounded metal object before removing the board from the antistatic bag.

• Handle the board by its edges only; do not touch its components, peripheral chips, memory

modules or gold contacts.

• When handling chips or modules, avoid touching their pins.

• Put the motherboard and peripherals back into their antistatic bags when not in use.

• For grounding purposes, make sure that your chassis provides excellent conductivity be-

tween the power supply, the case, the mounting fasteners and the motherboard.

• Use only the correct type of CMOS onboard battery as specied by the manufacturer. Do

not install the CMOS battery upside down, which may result in a possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking the motherboard, make sure that the person handling it is static protected.

X11SSZ-TLN4F/QF/F User's Manual

2.2 Motherboard Installation

All motherboards have standard mounting holes to t different types of chassis. Make sure

that the locations of all the mounting holes for both the motherboard and the chassis match. Although a chassis may have both plastic and metal mounting fasteners, metal ones are highly recommended because they ground the motherboard to the chassis. Make sure that the metal standoffs click in or are screwed in tightly.

Philips Screwdriver (1)

Tools Needed

AUDIO FP

JSPDIF_OUT1

JPAC1

PCH SLOT4 PCI-E 3.0 X4(IN X8)

COM1

COM2

USB8/9

SP1

USB6/7

USB4/5

JL1

J18

I-SATA3

JI2C2

JD1

JI2C1

JPB1

Philips Screws (8)

LED1

JUIDB1

DP1/DP2

LED2

LED3

JVRM2

JVRM1

JIPMB1

JSMB1

JVR1

JWD1

JBR1

PCH SLOT7 PCI-E 3.0 X4(IN X8)

CPU SLOT6 PCI-E 3.0 X16

JPG1

MAC CODE

BT1

MAC CODE

VGA/DVI

X11SSZ-F

REV: 1.10 DESIGNED IN USA

CPU Socket LGA1151

JPL3 JPL2 JPL1

LAN3/4

Standoffs (8) Only if Needed

USB2/3(3.0)

FAN4

IPMI_LAN USB0/1

LAN1/2

JPW2

JPW1

BAR CODE

JSD1

FANB

Intel C236

JTPM1

JPWR1

I-SGPIO1

S/N CODE

BIOS LICENSE

DIMMB2

DIMMA2

DIMMB1

USB10/11(3.0)

FANA

JGPIO1

LED4

FAN3

JF1

JBR3

JPME2

JBR2

USB12

DIMMA1

FAN2

JPI2C1

J15

FAN1

I-SATA0

JBT1

I-SATA2

I-SATA1

Location of Mounting Holes

Note: 1) To avoid damaging the motherboard and its components, please do not use

a force greater than 8 lb/inch on each mounting screw during motherboard installation.

2) Some components are very close to the mounting holes. Please take precautionary measures to avoid damaging these components when installing the motherboard to the chassis.

Chapter 2: Installation

Installing the Motherboard

1. Install the I/O shield into the back of the chassis.

2. Locate the mounting holes on the motherboard. See the previous page for the location.

3. Locate the matching mounting holes on the chassis. Align the mounting holes on the motherboard against the mounting holes on the chassis.

4. Install standoffs in the chassis as needed.

5. Install the motherboard into the chassis carefully to avoid damaging other motherboard components.

6. Using the Phillips screwdriver, insert a Phillips head #6 screw into a mounting hole on the motherboard and its matching mounting hole on the chassis.

7. Repeat Step 5 to insert #6 screws into all mounting holes.

8. Make sure that the motherboard is securely placed in the chassis.

Note: Images displayed are for illustration only. Your chassis or components might look different from those shown in this manual.

X11SSZ-TLN4F/QF/F User's Manual

2.3 Processor and Heatsink Installation

Warning: When handling the processor package, avoid placing direct pressure on the label

area of the fan.

Important:

• Always connect the power cord last, and always remove it before adding, removing or

changing any hardware components. Make sure that you install the processor into the CPU socket before you install the CPU heatsink.

• If you buy a CPU separately, make sure that you use an Intel-certied multi-directional

heatsink only.

• Make sure to install the motherboard into the chassis before you install the CPU heatsink.

• When receiving a motherboard without a processor pre-installed, make sure that the plastic

CPU socket cap is in place and none of the socket pins are bent; otherwise, contact your retailer immediately.

• Refer to the Supermicro website for updates on CPU support.

Installing the LGA1151 Processor

1. Press the load lever to release the load plate, which covers the CPU socket, from its locking position.

Load Plate

Load Lever

Chapter 2: Installation

2. Gently lift the load lever to open the load plate. Remove the plastic cap.

3. Use your thumb and your index nger to hold the CPU at the north center edge and the South center edge of the CPU.

North Center Edge

South Center Edge

4. Align the CPU key that is the semi-circle cutouts against the socket keys. Once it is aligned, carefully lower the CPU straight down into the socket. Do not drop the CPU on the socket. Do not move the CPU horizontally or vertically.

X11SSZ-TLN4F/QF/F User's Manual

5. Do not rub the CPU against the surface or against any pins of the socket to avoid damaging the CPU or the socket.

6. With the CPU inside the socket, inspect the four corners of the CPU to make sure that the CPU is properly installed.

7. Use your thumb to gently push the load lever down to the lever lock.

CPU properly

installed

Load lever locked into

place

Note: You can only install the CPU inside the socket in one direction. Make sure that

it is properly inserted into the CPU socket before closing the load plate. If it doesn't close properly, do not force it as it may damage your CPU. Instead, open the load plate again and double-check that the CPU is aligned properly.

Installing an Active CPU Heatsink with Fan

Chapter 2: Installation

1. Locate the CPU fan power connector on the motherboard (FAN1: CPU Fan).

2. Position the heatsink so that the heatsink fan wires are closest to the CPU fan power connector and are not interfered with other components.

3. Inspect the CPU fan wires to make sure that the wires are routed through the bottom of the heatsink.

4. Remove the thin layer of the protective

lm from the heatsink.

Important: CPU overheating may oc-

cur if the protective lm is not removed

from the heatsink.

5. Apply the proper amount of thermal grease on the CPU.

Thermal Grease

Heatsink

Fins

Note: If your heatsink came with a ther-

mal pad, please ignore this step.

6. If necessary, rearrange the wires to make sure that the wires are not pinched between the heatsink and the CPU. Also make sure to keep clearance between the

fan wires and the ns of the heatsink.

X11SSZ-TLN4F/QF/F User's Manual

7. Align the four heatsink fasteners with the mounting holes on the motherboard. Gently push the pairs of diagonal fasteners (#1 & #2 and #3 & #4) into the mounting holes until you hear a click. Also, make sure to orient each fastener so that the narrow end of the groove is pointing outward.

8. Repeat step 7 to insert all four heatsink fasteners into the mounting holes.

9. Once all four fasteners are securely inserted into the mounting holes, and the heatsink is properly installed on the motherboard, connect the heatsink fan wires to the CPU fan connector.

Removing the Heatsink

Note: We do not recommend that

the CPU or the heatsink be removed. However, if you do need to remove the heatsink, please follow the instructions below to remove the heatsink and to prevent damage done to the CPU or other components.

Active Heatsink Removal

1. Unplug the power cord from the power supply.

Chapter 2: Installation

Unplug the

PWR cord

2. Disconnect the heatsink fan wires from the CPU fan header.

3. Use your nger tips to gently press on the fastener cap and turn it counterclockwise to make a 1/4 (900) turn, and pull the fastener upward to loosen it.

4. Repeat step 3 to loosen all fasteners from the mounting holes.

5. With all fasteners loosened, remove the heatsink from the CPU.

Pull Up

X11SSZ-TLN4F/QF/F User's Manual

USB10/11(3.0)

AUDIO FP

PCH SLOT4 PCI-E 3.0 X4(IN X8)

CPU SLOT6 PCI-E 3.0 X16

PCH SLOT7 PCI-E 3.0 X4(IN X8)

DP1/DP2

VGA/DVI

LAN3/4

LAN1/2

USB2/3(3.0)

IPMI_LAN

USB0/1

X11SSZ-F

REV: 1.10

MAC CODE

BAR CODE

DESIGNED IN USA

BIOS LICENSE

CPU Socket LGA1151

S/N CODE

Intel

C236

USB8/9

USB6/7

USB4/5

I-SGPIO1

JPW2

SP1

BT1

LED1

LED2

JD1

JBT1

JGPIO1

FAN4

FAN2

FANB

FANA

FAN3

JTPM1

JSPDIF_OUT1

JL1

J18

JI2C2 JI2C1

JPW1

JPME2

JBR2

JBR3

JPL3

JPL2

JPL1

JBR1

JWD1

JPB1

JPG1

JPAC1

COM2

COM1

LED3

JSD1

DIMMA1 DIMMA2

I-SATA1

I-SATA2

I-SATA3

JUIDB1

JIPMB1

JSMB1

JVR1

JVRM1

JVRM2

USB12

JPWR1

2.4 Memory Support and Installation

Note: Check the Supermicro website for recommended memory modules.

Important: Exercise extreme care when installing or removing DIMM modules to pre-

vent any possible damage.

Memory Support

The X11SSZ-TLN4F/F supports up to 64GB of Unbuffered (UDIMM) DDR4 ECC/Non-ECC 2133 MHz in four memory slots. The X11SSZ-QF supports up to 64GB of Unbuffered (UDIMM) DDR4 Non-ECC 2133 MHz in four memory slots. Populating these DIMM modules with a pair of memory modules of the same type and size will result in interleaved memory, which will improve memory performance.

For optimal memory performance, follow the table below when populating memory.

DIMM Module Population Conguration

DIMMA1 DIMMB1 DIMMA2 DIMMB2 Total System Memory

2GB 2GB 2GB 2GB 8GB

4GB 4GB 4GB 4GB 16GB

8GB 8GB 8GB 8GB 32GB

16GB 16GB 16GB 16GB 64GB

Recommended Population (Balanced)

2GB 2GB 4GB

4GB 4GB 8GB

8GB 8GB 16GB

16GB 16GB 32GB

DIMM Module Population Sequence

When installing memory modules, the DIMM slots must be populated in the following order:

DIMMB2, DIMMA2, then DIMMB1, DIMMA1. The blue slots must be populated rst.

DIMMA1

DIMMA2 (Blue Slot)

DIMMB1

DIMMB2 (Blue Slot)

Note: Be sure to use memory modules of the same type and speed on the motherboard.

Mixing of memory modules of different types and speeds is not allowed.

Towards the CPU

DIMMB1 DIMMB2

Towards the edge of the motherboard

+ 88 hidden pages

Supermicro X11SSZ-F User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual