Supermicro X11SSV-LVDS operation manual

X11SSV-LVDS

USER’S MANUAL

Revision 1.0

The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:

For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.

IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: Handling of lead solder materials used in this product may expose you to lead, a
chemical known to the State of California to cause birth defects and other reproductive harm.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical

systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic

property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision 1.0

Release Date: November 02, 2016

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this

document. Information in this document is subject to change without notice. Other products and companies referred

to herein are trademarks or registered trademarks of their respective companies or mark holders.

Copyright © 2016 by Super Micro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

Preface

About This Manual

This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the X11SSV-LVDS motherboard.

About This Motherboard

Built upon the functionality and capability of the Intel® Q170 chipset and the
Intel 6th Generation Core i3/i5/i7 processor, the X11SSV-LVDS motherboard provides
superior graphics capability and system performance while consuming little power. The
Intel Q170 chipset supports vPro, Virtualization for Directed I/O, Rapid Storage Standard
Manageability, Smart Response, and Trusted Execution technologies. This motherboard also

supports mSATA, M.2 with M Key 2242/2280, ve SATA 3.0 ports, and three independent

displays: DisplayPort, HDMI, and LVDS. Please note that this motherboard is intended to
be installed and serviced by professional technicians only. For processor/memory updates,
please refer to our website at http://www.supermicro.com/products/.

Conventions Used in the Manual

Special attention should be given to the following symbols for proper installation and to prevent

damage done to the components or injury to yourself:

Warning! Indicates important information given to prevent equipment/property damage

or personal injury.

Warning! Indicates high voltage may be encountered when performing a procedure.

Important: Important information given to ensure proper system installation or to

relay safety precautions.

Note: Additional Information given to differentiate various models or provides infor­mation for correct system setup.

3

X11SSV-LVDS User's Manual

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Website: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

[e-mail] (Customer Support)

Website: www.supermicro.nl

Asia-Pacic

Address: Super Micro Computer, Inc.

3F, No. 150, Jian 1st Rd.

Zhonghe Dist., New Taipei City 235

Taiwan (R.O.C)

Tel: [phone]

Fax: [phone]

Email: [e-mail]

Website: www.supermicro.com.tw

4

Preface

Table of Contents

Chapter 1 Introduction

1.1 Checklist ...............................................................................................................................8

Quick Reference ...............................................................................................................11

Quick Reference Table ......................................................................................................12

Motherboard Features .......................................................................................................14

1.2 Processor and Chipset Overview .......................................................................................17

1.3 Special Features ................................................................................................................17

Recovery from AC Power Loss .........................................................................................17

1.4 System Health Monitoring ..................................................................................................18

Onboard Voltage Monitors ................................................................................................18

Fan Status Monitor with Firmware Control .......................................................................18

Environmental Temperature Control .................................................................................18

System Resource Alert......................................................................................................18

1.5 ACPI Features ....................................................................................................................19

1.6 Power Supply .....................................................................................................................19

1.7 Super I/O ............................................................................................................................20

Chapter 2 Installation

2.1 Static-Sensitive Devices .....................................................................................................21

Precautions .......................................................................................................................21

Unpacking .........................................................................................................................21

2.2 Motherboard Installation .....................................................................................................22

Tools Needed ....................................................................................................................22

Location of Mounting Holes ..............................................................................................22

Installing the Motherboard.................................................................................................23

2.3 Processor and Heatsink Installation ...................................................................................24

Installing the LGA1151 Processor .....................................................................................24

Installing an Active CPU Heatsink with Fan .....................................................................27

Removing the Heatsink .....................................................................................................29

2.4 Memory Support and Installation .......................................................................................30

Memory Support ................................................................................................................30

SO-DIMM Module Population Sequence ..........................................................................30

SO-DIMM Installation ........................................................................................................31

5

X11SSV-LVDS User's Manual

SO-DIMM Removal ...........................................................................................................31

2.5 Rear I/O Ports ....................................................................................................................32

2.6 Front Control Panel ............................................................................................................36

2.7 Connectors .........................................................................................................................40

Power Connections ...........................................................................................................40

Headers .............................................................................................................................42

2.8 Jumper Settings .................................................................................................................51

How Jumpers Work ...........................................................................................................51

2.9 LED Indicators ....................................................................................................................55

Chapter 3 Troubleshooting

3.1 Troubleshooting Procedures ..............................................................................................57

Before Power On ..............................................................................................................57

No Power ..........................................................................................................................57

No Video ...........................................................................................................................58

System Boot Failure .......................................................................................................58

Memory Errors ..................................................................................................................58

Losing the System's Setup Conguration .........................................................................59

When the System Becomes Unstable ..............................................................................59

3.2 Technical Support Procedures ...........................................................................................61

3.3 Frequently Asked Questions ..............................................................................................62

3.4 Battery Removal and Installation .......................................................................................63

Battery Removal ................................................................................................................63

Proper Battery Disposal ....................................................................................................63

Battery Installation .............................................................................................................63

3.5 Returning Merchandise for Service ....................................................................................64

Chapter 4 BIOS

4.1 Introduction .........................................................................................................................65

Starting the Setup Utility ...................................................................................................65

4.2 Main Setup .........................................................................................................................66

4.3 Advanced Setup Congurations .........................................................................................68

4.4 Security ...............................................................................................................................90

4.5 Boot ....................................................................................................................................93

4.6 Save & Exit .........................................................................................................................95

6

Preface

Appendix A BIOS Codes

Appendix B Software Installation

B.1 Installing Software Programs .............................................................................................99

B.2 SuperDoctor® 5 .................................................................................................................100

Appendix C Standardized Warning Statements

Battery Handling ..............................................................................................................101

Product Disposal .............................................................................................................103

Appendix D UEFI BIOS Recovery

7

X11SSV-LVDS User's Manual

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an industry leader. Supermicro
boards are designed to provide you with the highest standards in quality and performance.

In additon to the motherboard, several important parts that are included with the system are
listed below. If anything listed is damaged or missing, please contact your retailer.

1.1 Checklist

Main Parts List

Description Part Number Quantity

Supermicro Motherboard X11SSV-LVDS 1

SATA Cables 4

I/O Shield MCP-260-00070-1N 1

Important Links

For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.

• Supermicro product manuals: http://www.supermicro.com/support/manuals/

• Product drivers and utilities: ftp://ftp.supermicro.com

• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

• If you have any questions, please contact our support team at: [e-mail]

This manual may be periodically updated without notice. Please check the Supermicro website

for possible updates to the manual revision level.

8

Figure 1-1. X11SSV-LVDS Motherboard Image

Chapter 1: Introduction

Note: All graphics shown in this manual were based upon the latest PCB revision
available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.

9

X11SSV-LVDS User's Manual

Figure 1-2. X11SSV-LVDS Motherboard Layout

JI2C1

JI2C2

JSMB1

JWD1

JPAC1

JPME2

JPUSB1

JL1

JD1

FAN4

HD
AUDIO

J3

SRW5

JSMB1:SMBus1

2-3:DISABLE

1-2:ENABLE

SRW2

JI2C1/2:

JPCIE1

CPU SLOT1 PCI-E 3.0 X16

SRW6

JD1:
1-4:SPEAKER

JPUSB1:

USB WAKE UP
1-2:ENABLE
2-3:DISABLE

JPAC1:AUDIO
1-2:ENABLE
2-3:DISABLE

BIOS

JMD1

SUPERDOM

PCIE 3.0X4/

JSD1

JSD1/2:SATA

SATA DOM+POWER

JSD2

JGP1

LED1

A

C

I-SGPIO1

I-SATA0

JTPM1

DOM POWER

JLVDS_CGF4

M.2

I-SATA5

I-SATA1

PWR HDD
LED LED

COM1

SRW1

NIC1NIC

JLVDS_CGF3

USB11/12

USB7/8

JBT1

I-SATA4

I-SATA3

I-SATA2

OH/FF2X RST

JLCDPWR1

JLVDS_CGF2

JLVDS_CGF1

Intel
Q170

PWR
ON

BT1

USB9

TYPE A

1

USB5/6 (3.0)

JF1

X11SSV-LVDS

DESIGNED IN USA

LVDS1

JMP1

m-PCIE(F/H)

REV: 1.00

MAC CODE

BAR CODE

LAN2
USB3/4 (3.0)

LAN1
USB1/2 (3.0)

CPU LGA1151

BIOS LICENSE

UNB NON-ECC DDR4 DIMM REQUIRED

JPW1

JPV1

DIMMA1

DIMMB1

HDMI

DP

FAN1

FAN1/CPU

JVR1

JPH1

FAN2

FAN3

10

Quick Reference

Chapter 1: Introduction

SRW5

JI2C1

SRW2

JI2C2

JSMB1

SRW1

JWD1

SRW6

JBT1

SLOT1

JPAC1

JPME2

JPUSB1

JMD1

JL1

JD1

JSD1
JSD2
JGP1

FAN4
LED1

I-SGPIO1

J3

HD AUDIO

JI2C1

JI2C2

JSMB1

JWD1

JPAC1

JPME2

JPUSB1

JL1

JD1

JGP1

FAN4

COM1

HD
AUDIO

J3

SRW5

JSMB1:SMBus1

2-3:DISABLE

1-2:ENABLE

SRW2

JI2C1/2:

JPCIE1

CPU SLOT1 PCI-E 3.0 X16

SRW6

JD1:
1-4:SPEAKER

JPUSB1:

USB WAKE UP
1-2:ENABLE
2-3:DISABLE

JPAC1:AUDIO
1-2:ENABLE
2-3:DISABLE

BIOS

JMD1

SUPERDOM

PCIE 3.0X4/

JSD1

JSD2

LED1

C

I-SGPIO1

JSD1/2:SATA

A

DOM POWER

SATA DOM+POWER

I-SATA0

JTPM1

JLVDS_CGF4

M.2
I-SATA5

I-SATA1

PWR HDD
LED LED

COM1

SRW1

NIC1NIC

JLVDS_CGF3

USB11/12

USB7/8

JBT1

I-SATA4

I-SATA3

I-SATA2

OH/FF2X RST

JLCDPWR1

JLCDPWR1

JLVDS_CGF2

JLVDS_CGF1

Intel
Q170

1

PWR
ON

USB9

BT1

USB9

TYPE A

USB5/6 (3.0)

JF1

BT1

LVDS1

X11SSV-LVDS

DESIGNED IN USA

LVDS1

JMP1

m-PCIE(F/H)

REV: 1.00

MAC CODE

BAR CODE

LAN2

USB3/4

LAN1

USB1/2

BIOS LICENSE

LAN1
USB1/2 (3.0)

LAN2
USB3/4 (3.0)

CPU LGA1151

UNB NON-ECC DDR4 DIMM REQUIRED

JPW1

JPV1

HDMI/DP

HDMI

DIMMA1

DIMMB1

DP

USB11/12

FAN1

FAN1/CPU

FAN1

USB7/8

JVR1

JVR1

JMP1

CPU

JPH1

JPH1

FAN2

FAN3

DIMMA1

FAN2

DIMMB1

FAN3

I-SATA0

I-SATA1

I-SATA2

I-SATA3

JTPM1

JF1

USB5/6 (3.0)

JPW1

JPV1

I-SATA4

Notes:

• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel connec-

tions.

• " " indicates the location of Pin 1.

• Jumpers/LED indicators not indicated are used for testing only.

• Use only the correct type of onboard CMOS battery as specied by the manufacturer. Do

not install the onboard battery upside down to avoid possible explosion.

11

X11SSV-LVDS User's Manual

Quick Reference Table

Jumper Description Default Setting

JBT1 CMOS Clear Open (Normal)

JI2C1, JI2C2 SMB to PCI-E Slots Enable/Disable Pins 2-3 (Disabled)

JLCDPWR1 LVDS Panel VCC Power 3.3V/5V Pins 1-2 (3.3V)

JPAC1 Audio Enable Pins 1-2 (Enabled)

JPME2 ME Manufacturing Mode Pins 1-2 (Normal)

JPUSB1 USB Wake Up Enable/Disable Pins 2-3 (Disabled)

JWD1 Watch Dog Pins 1-2 (Reset)

LED Description Status

LED1 Power LED Solid Green: Power On

Connector Description

BT1 Onboard Battery

COM1 COM Port

FAN1 ~ FAN4 System/CPU Fan Headers (FAN1: CPU Fan)

HD Audio Mic In and Line Out Ports

HDMI/DP High Denition Multimedia Interface/DisplayPort

I-SATA0 ~ I-SATA4 Intel® PCH SATA 3.0 Ports (I-SATA0 Mux with mini-PCIE mSATA)

I-SGPIO1 Serial Link General Purpose I/O Header

J3 Front Panel Audio Header

JD1 Speaker Header (Pins 1-4: Speaker)

JF1 Front Control Panel Header

JGP1 General Purpose I/O Header

JL1 Chassis Intrusion Header

JMD1 M.2 PCI-E 3.0 X4/I-SATA5 Slot

JMP1 mini-PCI-E Full/Half Slot with mSATA (MUX with I-SATA0)

JPH1

JPV1

JPW1 24-pin ATX Power Connector

JSD1, JSD2 SATA DOM Power Connectors

JSMB1 System Management Bus Header

JTPM1 Trusted Platform Module/Port 80 Connector

JVR1 PWM SMB Programming (for debugging only)

LAN1 ~ LAN2 Gigabit LAN (RJ45) Ports

LVDS1 LVDS Connector

SLOT1 CPU PCI-E 3.0 X16 Slot

4-pin Power Connector for HDD (to provide power from the motherboard to externals

devices)

12V 8-pin Power Connector for CPU (Required) (or alternative single power for special

enclosure when the 24-pin ATX power is not in use)

12

Connector Description

SRW1, SRW2

SRW5, SRW6

USB1/2, USB3/4 Back panel Universal Serial Bus (USB) 3.0 Ports

USB5/6 Front Accessible USB 3.0 Header

USB7/8, USB11/12 Front Access USB 2.0 Headers

USB9 USB Type A Header

mini-PCIE Holding Screws

M.2 Holding Screws

Chapter 1: Introduction

13

X11SSV-LVDS User's Manual

Motherboard Features

Motherboard Features

CPU

• Single Intel 6th Generation Core i3/i5/i7, Pentium, and Celeron processor in an LGA1151 socket

Memory

• Up to 32GB of DDR4 Non-ECC SO-DIMM 2133 MT/s

DIMM Size

• Up to 16GB at 1.2V

Chipset

• Intel Q170

Expansion Slots

• One (1) PCI Express 3.0 X16 slot

Network

• Intel Ethernet Controller I210-AT and Intel Ethernet Connection I219-LM Phy with AMT

Graphics

• Intel HD Graphics

I/O Devices

• COM Port • One (1) COM Port Pin Header

• Five (5) SATA 3.0 ports (I-SATA0~4, I-SATA0 Mux with mini-PCIE mSATA,

• SATA Ports

Peripheral Devices

• Two (2) USB 3.0 ports on the rear I/O panel (USB1/2, USB3/4)

• One (1) internal USB 3.0 header on the motherboard for front access (US5/6)

• Two (1) internal USB 2.0 headers on the motherboard for front access (USB7/8, USB11/12)

• One (1) USB Type A connector for front access (USB9)

I-SATA0 port is disabled when mSATA is in use.)

• One (1) M.2/I-SATA5

Note: The table above is continued on the next page.

14

Chapter 1: Introduction

Motherboard Features

BIOS

• 128Mb SPI AMI BIOS

• ACPI 4.0, SMBIOS 2.7, Plug-and-Play (PnP), BIOS rescue hot-key, SPI dual/quad speed support, RTC (Real Time Clock)

wakeup

Power Management

• ACPI power management (S1, S3, S4, S5)

• Power button override mechanism

• Power-on mode for AC power recovery

• Wake-On-Ring

• Wake-On-LAN

• Management Engine (ME)

System Health Monitoring

• Onboard voltage monitoring for +3.3V, +3.3V Standby, +5V, +5V Standby, +12V, VBAT, Memory, PCH Temp., System

Temp., Memory Temp.

• CPU switching phase voltage regulator

• CPU Thermal Trip support

• CPU Thermal Design Power (TDP) support of up to 95W (See Note 1 on next page.)

®

SM Flash UEFI BIOS

Fan Control

• Single cooling zone

• Low-noise fan speed control

• Pulse Width Modulation (PWM) fan control

System Management

• Trusted Platform Module (TPM) support

• PECI (Platform Environment Control Interface) 2.0 support

• Intel Active Management Technology (AMT) version 11.0

• System resource alert via SuperDoctor® 5

• SuperDoctor® 5, Watch Dog, NMI

• Chassis intrusion header and detection

LED Indicators

• CPU/Overheating

• Fan Failure

• HDD activity

• LAN activity

Dimensions

• 6.7" (L) x 6.7" (W) (170.18 mm x 170.18 mm)

Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and

heatsink cooling restrictions. For proper thermal management, please check the chas-

sis and heatsink specications for proper CPU TDP sizing.

15

X11SSV-LVDS User's Manual

Figure 1-3.

System Block Diagram

PCIe x16 SLOT

LVDS

DP to LVDS

HDMI

Display Port

M.2 M-KEY 2242/2280
SOCKET 1

8.5mm

5 X SATA-III

Note: I-SATA0/1=SuperDOM Connector
Note: I-SATA0 disabled when m-SATA on m-PCIE.

4 X USB 3.0 Rear

2 X USB 3.0 FRONT

4 X USB 2.0 FRONT

1 X USB Type A

2x audio jack

PCIe3.0_x16

8.0GT/s

PTN3460

Digital port C

Digital port B

PCIe3.0_x2

8GT/s

SATA-III

6Gb/s

SATA-III

6Gb/s

USB3.0
5Gbps

USB3.0
5Gbps

USB2.0
480Mbps

USB2.0
480Mbps

Realtek ALC888S-VD2

INTEL LGA1151

DDI A (1:0)

(Socket-H4)

DDI C

DDI B

x4 DMI
5GT/s

PCIE[12:9]

SATA[5]

SATA[0/1/2/3/4]

SATA[5]

Intel

PCH-H

USB[1/2/3/4]

USB[5/6]

USB[7/8/11/12]

USB[9]

AZALIA

FLASH
SPI 128Mb

SPI

PCIE[7]

USB[10]

SATA[0]

PCIE[5]

PCIE[6]

LPC

SVID

DDR4 (CHA)

2133MHz

DDR4 (CHB)

2133MHz

PCIe2.0_x1

5GT/s

SATA-III

6Gb/s

PCIe1.1_x1

2.5GT/s

PCIe1.1_x1

2.5GT/s

LPC

PCA9554

IMVP8

DIMMA1

SODIMM, Vertical type

DIMMB1

Mini PCI-E SLOT
With mSATA

9.0mm

SGPIO1

GLAN1
I219LM

GLAN2

I210-AT

TPM1.2 Header

NCT6776D

HWM

RJ45

RJ45

COM1 HEADER

GPIO
Expander

Note: This is a general block diagram and may not exactly represent the features on

your motherboard. See the previous pages for the actual specications of your moth­erboard.

16

Chapter 1: Introduction

1.2 Processor and Chipset Overview

Built upon the functionality and capability of the Intel 6th Generation Core i3/i5/i7, Pentium,
and Celeron series processor in an LGA1151 socket and the Intel Q170 chipset, the

X11SSV-LVDS motherboard offers maximum I/O expandability, energy efciency, and data

reliability in a 14-nm process architecture, and is optimized for embedded storage solutions,
networking applications, or cloud-computing platforms.

With support of the new Intel microarchitecture 14 nm process technology, the X11SSV-LVDS
drastically increases system performance for a multitude of server applications.

The Intel 6th Generation Core i3/i5/i7 and Q170 platform supports the following features:

• ACPI Power Management Logic Support Rev. 4.0

• Adaptive Thermal Management/Monitoring

• PCI-E 3.0, SATA 3.0 w/transfer rates of up to 6 Gb/s

• System Management Bus (SMBus) Specication Version 2.0

• Intel Smart Response Technology

• Intel Stable Image Platform Program (SIPP)

• Intel Standard Manageability

• Intel Trusted Execution Technology (Intel TXT)

• Intel Virtualization Technology for Directed I/O (Intel VT-d)

• Intel vPro Technology

1.3 Special Features

This section describes the health monitoring features of the X11SSV-LVDS motherboard. The
motherboard has an onboard System Hardware Monitor chip that supports system health
monitoring.

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.

17

X11SSV-LVDS User's Manual

1.4 System Health Monitoring

This section describes the health monitoring features of the X11SSV-LVDS motherboard. The
motherboard has an onboard SIO/HWM chip that supports system health monitoring. Once
a voltage becomes unstable, a warning is given or an error message is sent to the screen.

The user can adjust the voltage thresholds to dene the sensitivity of the voltage monitor.

Onboard Voltage Monitors

The onboard voltage monitor will continuously scan crucial voltage levels. Once a voltage
becomes unstable, it will give a warning or send an error message to the screen. Users can

adjust the voltage thresholds to dene the sensitivity of the voltage monitor. Real time readings

of these voltage levels are all displayed in BIOS.

Fan Status Monitor with Firmware Control

PC health monitoring in the BIOS can check the RPM status of the cooling fans. The onboard

CPU and chassis fans are controlled by Thermal Management.

Environmental Temperature Control

The thermal control sensor monitors the CPU temperature in real time and will turn on the

thermal control fan whenever the CPU temperature exceeds a user-dened threshold. The

overheat circuitry runs independently from the CPU. Once the thermal sensor detects that
the CPU temperature is too high, it will automatically turn on the thermal fans to prevent the
CPU from overheating. The onboard chassis thermal circuitry can monitor the overall system
temperature and alert the user when the chassis temperature is too high.

Note: To avoid possible system overheating, please be sure to provide adequate air-

ow to your system.

System Resource Alert

This feature is available when used with SuperDoctor 5®. SuperDoctor 5 is used to notify the

user of certain system events. For example, you can congure SuperDoctor 5 to provide you

with warnings when the system temperature, CPU temperatures, voltages and fan speeds

go beyond a predened range.

18

Chapter 1: Introduction

1.5 ACPI Features

ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power

management features throughout a computer system including its hardware, operating system
and application software. This enables the system to automatically turn on and off peripherals
such as network cards, hard disk drives and printers.

In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play and an operating system-independent

interface for conguration control. ACPI leverages the Plug and Play BIOS data structures

while providing a processor architecture-independent implementation that is compatible with
Windows 8/R2 and Windows 2012/R2 operating systems.

1.6 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates. In areas

where noisy power transmission is present, you may choose to install a line lter to shield

the computer from noise. It is recommended that you also install a power surge protector to
help avoid problems caused by power surges.

This motherboard accomodates 24-pin ATX power supplies. Although most power supplies

generally meet the specications required by the CPU, some are inadequate. In addition, the

12V 8-pin power connector located at JPV1 is always required to ensure adequate power
supply to the CPU.

Note 1: The X11SSV-LVDS motherboard alternatively supports an 8-pin 12V DC input
power supply at JPV1 for embedded applications. The 12V DC input is limited to 30A
(15A if only installed with a 4-pin power cable) by design. It provides up to 360W (180W
if only 4-pin connected) power input to the motherboard. Please keep the onboard

power usage within the power limits specied above. Overcurrent power usage may

cause damage to the motherboard.

Note 2: Please connect both the 8-pin DC power at JPV1 and JPW1 to make sure the
CPU receives enough power for normal operation when using the ATX power supply.

19

X11SSV-LVDS User's Manual

1.7 Super I/O

The Super I/O (Nuvoton NCT6776D chip) includes a data separator, write pre-compensation
circuitry, decode logic, data rate selection, a clock generator, drive interface control logic and
interrupt and DMA logic. The wide range of functions integrated onto the Super I/O greatly

reduces the number of components required for interfacing with oppy disk drives.

The Super I/O provides one high-speed, 16550 compatible serial communication port
(UART), which supports serial infrared communication. This UART includes a 16-byte send/
receive FIFO, a programmable baud rate generator, complete modem control capability and
a processor interrupt system. This UART provides legacy speed with baud rate of up to

115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which
support higher speed modems.

The Super I/O provides functions that comply with ACPI (Advanced Conguration and Power

Interface), which includes support of legacy and ACPI power management through a SMI
or SCI function pin. It also features auto power management to reduce power consumption.

The IRQs, DMAs and I/O space resources of the Super I/O can be exibly adjusted to meet

ISA PnP requirements, which support ACPI and APM (Advanced Power Management).

20

Chapter 2: Installation

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. To prevent damage to your
motherboard, it is important to handle it very carefully. The following measures are generally

sufcient to protect your equipment from ESD.

Precautions

• Use a grounded wrist strap designed to prevent static discharge.

• Touch a grounded metal object before removing the board from the antistatic bag.

• Handle the board by its edges only; do not touch its components, peripheral chips, memory

modules or gold contacts.

• When handling chips or modules, avoid touching their pins.

• Put the motherboard and peripherals back into their antistatic bags when not in use.

• For grounding purposes, make sure that your chassis provides excellent conductivity be-

tween the power supply, the case, the mounting fasteners and the motherboard.

• Use only the correct type of CMOS onboard battery as specied by the manufacturer. Do

not install the CMOS battery upside down, which may result in a possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.

21

X11SSV-LVDS User's Manual

2.2 Motherboard Installation

All motherboards have standard mounting holes to t different types of chassis. Make sure

that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that
the metal standoffs click in or are screwed in tightly.

Philips
Screwdriver
(1)

Tools Needed

HD
AUDIO

J3

JI2C1

SRW2

JI2C2

JSMB1

JPCIE1

JWD1

CPU SLOT1 PCI-E 3.0 X16

JPAC1

JPME2

JPUSB1

JL1

JD1

SUPERDOM

JSD1

JSD2

JGP1

FAN4

C

I-SGPIO1

JD1:
1-4:SPEAKER

JPUSB1:
1-2:ENABLE
2-3:DISABLE

JPAC1:AUDIO
1-2:ENABLE
2-3:DISABLE

JMD1

PCIE 3.0X4/

JSD1/2:SATA

LED1

A

SRW5

JSMB1:SMBus1

2-3:DISABLE

1-2:ENABLE

JI2C1/2:

SRW6

USB WAKE UP

BIOS

SATA DOM+POWER

I-SATA0

JTPM1

DOM POWER

JLVDS_CGF4

M.2

I-SATA5

I-SATA1

PWR HDD
LED LED

COM1

NIC1NIC

USB11/12

SRW1

JLVDS_CGF3

USB7/8

JBT1

I-SATA4

I-SATA3

I-SATA2

OH/FF2X RST

JLCDPWR1

JLVDS_CGF2

JLVDS_CGF1

Intel
Q170

PWR
ON

Philips Screws
(4)

REV: 1.00

MAC CODE

BAR CODE

BT1

USB9

TYPE A

1

USB5/6 (3.0)

JF1

X11SSV-LVDS

DESIGNED IN USA

LVDS1

JMP1

m-PCIE(F/H)

BIOS LICENSE

LAN1
USB1/2 (3.0)

LAN2
USB3/4 (3.0)

CPU LGA1151

UNB NON-ECC DDR4 DIMM REQUIRED

JPW1

Standoffs (4)
Only if Needed

HDMI

DP

FAN1

FAN1/CPU

JVR1

JPH1

FAN2

DIMMA1

FAN3

DIMMB1

JPV1

Location of Mounting Holes

Note: 1) To avoid damaging the motherboard and its components, please do not use

a force greater than 8 lb/inch on each mounting screw during motherboard installation.

2) Some components are very close to the mounting holes. Please take precautionary
measures to avoid damaging these components when installing the motherboard to
the chassis.

22

Chapter 2: Installation

Installing the Motherboard

1. Install the I/O shield into the back of the chassis.

2. Locate the mounting holes on the motherboard. See the previous page for the location.

3. Locate the matching mounting holes on the chassis. Align the mounting holes on the
motherboard against the mounting holes on the chassis.

4. Install standoffs in the chassis as needed.

5. Install the motherboard into the chassis carefully to avoid damaging other motherboard
components.

6. Using the Phillips screwdriver, insert a Phillips head #6 screw into a mounting hole on
the motherboard and its matching mounting hole on the chassis.

7. Repeat Step 5 to insert #6 screws into all mounting holes.

8. Make sure that the motherboard is securely placed in the chassis.

Note: Images displayed are for illustration only. Your chassis or components might
look different from those shown in this manual.

23

X11SSV-LVDS User's Manual

2.3 Processor and Heatsink Installation

Warning: When handling the processor package, avoid placing direct pressure on the label

area of the fan.

Important:

• Always connect the power cord last, and always remove it before adding, removing or

changing any hardware components. Make sure that you install the processor into the
CPU socket before you install the CPU heatsink.

• If you buy a CPU separately, make sure that you use an Intel-certied multi-directional

heatsink only.

• Make sure to install the motherboard into the chassis before you install the CPU heatsink.

• When receiving a motherboard without a processor pre-installed, make sure that the plastic

CPU socket cap is in place and none of the socket pins are bent; otherwise, contact your
retailer immediately.

• Refer to the Supermicro website for updates on CPU support.

Installing the LGA1151 Processor

1. Press the load lever to release the load plate, which covers the CPU socket, from its
locking position.

Load Plate

Load Lever

24

Chapter 2: Installation

2. Gently lift the load lever to open the load plate. Remove the plastic cap.

3. Use your thumb and your index nger to hold the CPU at the north center edge and the
South center edge of the CPU.

North Center Edge

South Center Edge

4. Align the CPU key that is the semi-circle cutouts against the socket keys. Once it is
aligned, carefully lower the CPU straight down into the socket. (Do not drop the CPU on
the socket. Do not move the CPU horizontally or vertically.

25

X11SSV-LVDS User's Manual

5. Do not rub the CPU against the surface or against any pins of the socket to avoid
damaging the CPU or the socket.

6. With the CPU inside the socket, inspect the four corners of the CPU to make sure that
the CPU is properly installed.

7. Use your thumb to gently push the load lever down to the lever lock.

CPU properly

installed

Load lever locked into

place

Note: You can only install the CPU inside the socket in one direction. Make sure that

it is properly inserted into the CPU socket before closing the load plate. If it doesn't
close properly, do not force it as it may damage your CPU. Instead, open the load
plate again and double-check that the CPU is aligned properly.

26

Installing an Active CPU
Heatsink with Fan

1. Locate the CPU fan power connector on
the motherboard. (Refer to the layout on
the right for the CPU Fan location.)

2. Position the heatsink so that the heatsink
fan wires are closest to the CPU fan
power connector and are not interfered
with other components.

Chapter 2: Installation

Thermal Grease

3. Inspect the CPU fan wires to make sure
that the wires are routed through the
bottom of the heatsink.

4. Remove the thin layer of the protective

lm from the heatsink.

Important: CPU overheating may oc-

cur if the protective lm is not removed

from the heatsink.

5. Apply the proper amount of thermal
grease on the CPU.

Note: If your heatsink came with a ther­mal pad, please ignore this step.

6. If necessary, rearrange the wires to
make sure that the wires are not pinched
between the heatsink and the CPU. Also
make sure to keep clearance between the

fan wires and the ns of the heatsink.

Heatsink

Fins

27

X11SSV-LVDS User's Manual

7. Align the four heatsink fasteners with
the mounting holes on the motherboard.
Gently push the pairs of diagonal
fasteners (#1 & #2, and #3 & #4) into
the mounting holes until you hear a click.
Also, make sure to orient each fastener
so that the narrow end of the groove is
pointing outward.

8. Repeat step 7 to insert all four heatsink
fasteners into the mounting holes.

9. Once all four fasteners are securely
inserted into the mounting holes, and
the heatsink is properly installed on the
motherboard, connect the heatsink fan
wires to the CPU fan connector.

28

Removing the Heatsink

Note: We do not recommend that the

heatsink be removed. However, if you
do need to remove the heatsink, please
follow the instructions below to remove
the heatsink and to prevent damage
done to the CPU or other components.

Active Heatsink Removal

1. Unplug the power cord from the power
supply.

2. Disconnect the heatsink fan wire from the
CPU fan header.

Chapter 2: Installation

Unplug the

PWR cord

3. Gently press on the fastener cap and
turn it counterclockwise to make a 1/4
(900) turn, and pull the fastener upward to
loosen it.

4. With all fasteners loosened, remove the
heatsink from the CPU.

Pull Up

29

X11SSV-LVDS User's Manual

2.4 Memory Support and Installation

Note: Check the Supermicro website for recommended memory modules.

Important: Exercise extreme care when installing or removing DIMM modules to pre-

vent any possible damage.

Memory Support

The X11SSV-LVDS supports up to 32GB of DDR4 Non-ECC SO-DIMM 2133 MT/s. Populating
these DIMM slots with a pair of memory modules of the same type and size will result in
interleaved memory, which will improve memory performance.

SO-DIMM Module Population Sequence

When installing memory modules, the DIMM slots must be populated in the following order:
DIMMA1 and then DIMMB1.

Towards the CPU

DIMMA1

DIMMB1

Towards the edge of the motherboard

Note: Be sure to use memory modules of the same type and speed. Mixing of memory
modules of different types and speeds is not allowed.

30