The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:
For the most up-to-date version of this manual, please see our website at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.
IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate”.
WARNING: Handling of lead solder materials used in this product may expose you to lead, a
chemical known to the State of California to cause birth defects and other reproductive harm.
The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical
systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic
property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.
Manual Revision 1.0a
Release Date: May 6, 2016
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this
document. Information in this document is subject to change without notice. Other products and companies referred
to herein are trademarks or registered trademarks of their respective companies or mark holders.
This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the X11SSQ/-L motherboard.
About This Motherboard
The Supermicro X11SSQ/-L motherboard supports an Intel® 6th Generation Core i7/i5/
i3, Pentium, and Celeron processor in an LGA 1151 socket. These two motherboards offer
such features as PCI Express 2.0/3.0 interface, DDR4, SATA3.0, HDMI, DisplayPort, Quick
Synch Video, and a combination of USB 2.0 and 3.0 ports. While the X11SSQ-L utilizes
the Intel H110 chipset, the X11SSQ utilizes the Intel Q170 chipset and offers the following
additional features: RAID, AMT/vPRO M.2, GPIO, and eDP. They both also provides securityenhancing technologies such as Intel Software Guard Extensions (Intel SGX), Intel Trusted
Execution Technology (TXT), Intel OS Guard, and Intel Rapid Storage Technology (RST).
The X11SSQ/-L offers exceptional system performance for entry server, data storage, and
embedded appliance solutions.
Please note that this motherboard is intended to be installed and serviced by professional
technicians only. For processor/memory updates, please refer to our website at http://www.
supermicro.com/products/.
Conventions Used in the Manual
Special attention should be given to the following symbols for proper installation and to prevent
damage done to the components or injury to yourself:
Warning! Indicates important information given to prevent equipment/property damage
or personal injury.
Warning! Indicates high voltage may be encountered when performing a procedure.
Important: Important information given to ensure proper system installation or to
relay safety precautions.
Note: Additional Information given to differentiate various models or provides information for correct system setup.
Congratulations on purchasing your computer motherboard from an industry leader. Supermicro
boards are designed to provide you with the highest standards in quality and performance.
Please check that the following items have all been included with your motherboard. If
anything listed is damaged or missing, please contact your retailer.
1.1 Checklist
Retail Box Parts List
DescriptionPart NumberQuantity
X11SSQ or X11SSQ-L MotherboardMBD-X11SSQ/-L1
I/O Cables (57.5CM SATA FLAT S-SPBF)CBL-0044L6
I/O Shield (Standard I/O Shield for X11SSQ with EMI Gasket)MCP-260-00063-1N1
Quick Reference GuideMNL-1793-QRG1
Important Links
For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.
• If you have any questions, please contact our support team at: support@supermicro.com
This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.
8
Figure 1-1. X11SSQ Motherboard Image
Chapter 1: Introduction
Note: All graphics shown in this manual were based upon the latest PCB revision
available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.
9
X11SSQ/-L User's Manual
Figure 1-2. X11SSQ-L Motherboard Image
Note: All graphics shown in this manual were based upon the latest PCB revision
available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.
10
Chapter 1: Introduction
1
1
GP0
GP1
GP2
GP3
GP4
GP5
GP6
GP7
10
AUDIO FP
JPAC1
COM4
COM3
COM2
COM1
JP7
JPME2
JL1
I-SGPIO1
PCH SLOT6 PCI-E 3.0 X1
PCH SLOT4 PCI-E 3.0 X4
PCH SLOT5 PCI-E 3.0 X4
MAC CODE
BAR CODE
JBT1
Figure 1-3. X11SSQ/-L Motherboard Layout
(not drawn to scale)
4
1
HDMI/DP
JPL2
JI2C2
JI2C1
HD AUDIO
LAN2
USB2/3
CPU SLOT7 PCI-E 3.0 X16
JPL1
LAN1
USB8/9(3.0)
X11SSQ
REV: 1.01
DESIGNED IN USA
CPU
Tested to Comply
With FCC Standards
FOR HOME OR OFFICE USE
BIOS
LICENSE
J18
J23
M.2 PCI-E 3.0 X2
DVI-D
KB/MOUSE
USB0/1
FAN4
JPW2
JVR1
CATERR_LED
FAN1
CPU FAN
ALWAYS POPULATE BLUE SOCKET FIRST
I-SGPIO2
USB4/5
USB6/7
I-SATA0
I-SATA1
I-SATA2
JAT1
DIMMA1
DIMMA2
UNB NON-ECC DDR4 DIMM REQUIRED
DIMMB1
JTPM1
JSD1
FAN3
JF1
I-SATA3
LED1
JLED1
I-SATA4
I-SATA5
DIMMB2
JSTBY1
JWD1
USB10/11(3.0)
JPW1
LED3
FAN2
B3
SP1
JD1
JSMB1
Note 1: The following are not available on X11SSQ-L: LAN2, USB2/3 (2.0), J18 (eDP),
J23 (M.2), DIMMA2, DIMMB2, SLOT5 PCI-E 3.0 X4, I-SATA4, I-SATA5, COM3, COM4,
JP7 (GPIO), I-SGPIO1, and I-SGPIO2.
Note 2: Slot4 and Slot6 are PCI-E 3.0 on X11SSQ and PCI-E 2.0 on X11SSQ-L
Note: Components not documented are for internal testing only.
11
X11SSQ/-L User's Manual
Quick Reference
1
AUDIO FP
JPAC1
AUDIO FP
JPAC1
COM4
COM3
COM4
COM3
COM2
COM2
COM1
COM1
1
GP0
JP7
GP1
JP7
GP2
GP3
GP4
JPME2
JL1
GP5
GP6
GP7
10
JL1
I-SGPIO1
JBT1
JPME2
JBT1
I-SGPIO1
I-SGPIO2
I-SGPIO2
USB4/5
USB4/5
USB6/7
USB6/7
JSD1
JTPM1
JSD1
JTPM1
FNA3
FAN3
JF1
I-SATA0 I-SATA1 I-SATA2
I-SATA3 I-SATA4 I-SATA5
Notes:
JPL2
PCH SLOT6 PCI-E 3.0 X1
PCH SLOT4 PCI-E 3.0 X4
PCH SLOT5 PCI-E 3.0 X4
Tested to Comply
With FCC Standards
FOR HOME OR OFFICE USE
MAC CODE
BAR CODE
BIOS
LICENSE
JAT1
I-SATA2
I-SATA1
I-SATA0
I-SATA3
I-SATA5
I-SATA4
LED1
JLED1
JWD1
JLED1
LED1
JF1
JAT1
JWD1
JI2C1/
JI2C2
JPL2
JI2C2
JI2C1
DIMMA1
DIMMA2
DIMMB1
DIMMB2
JSTBY1
JSTBY1
USB10/11 (3.0)
HD AUDIO
LAN2
USB2/3
HD AUDIO
CPU SLOT7 PCI-E 3.0 X16
M.2 PCI-E 3.0 X2
USB10/11(3.0)
J23
LAN2
USB2/3
JPL1
LAN1
USB8/9 (3.0)
HDMI/DP
4
1
HDMI/DP
LAN1
USB8/9(3.0)
X11SSQ
REV: 1.01
J18
ALWAYS POPULATE BLUE SOCKET FIRST
UNB NON-ECC DDR4 DIMM REQUIRED
JPW1
DESIGNED IN USA
CATERR_LED
CPU
LED3
FAN2
JPW1
SP1
FAN2LED3
DVI-D
DVI-D
JVR1
SP1
KB/MOUSE
USB0/1
FAN4
JPW2
FAN1
CPU FAN
B3
JD1
JSMB1
JD1
KB/MOUSE
USB0/1
JPL1
FAN4
JPW2
JVR1
CATERR_
LED
J18
FAN1
CPU FAN
DIMMA1
DIMMA2
DIMMB1
DIMMB2
B3
JSMB1
• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel connec-
tions. Jumpers/LED indicators not indicated are used for testing only.
• Not all listed features are available on the X11SSQ-L model. Please refer to Page 11 for
more information.
• " " indicates the location of Pin 1.
• Use only the correct type of onboard CMOS battery as specied by the manufacturer. Do
not install the onboard battery upside down to avoid possible explosion.
12
Chapter 1: Introduction
Quick Reference Table
JumperDescriptionDefault Setting
JAT1ATX/AT modePins 1-2 (ATX mode)
JBT1CMOS ClearOpen (Normal)
JI2C1/JI2C2SMB to PCI-E Slots Enable/DisablePins 2-3 (Disabled)
JPAC1Audio EnablePins 1-2 (Enabled)
JPL1/JPL2LAN1/2 Enable/Disable (JPL2 on X11SSQ only)Pins 1-2 (Enabled)
JPME2Manufacturing ModePins 1-2 (Normal)
JWD1Watch DogPins 1-2 (Reset)
LEDDescriptionStatus
CATERR_LEDCatastrophic Error LEDOrange: CAT Error
LED1Power LEDGreen: Power On
LED3Standby Power LEDGreen: Power On
ConnectorDescription
AUDIO FPAudio Front Panel Header
B3Onboard Battery
COM1 ~ COM4COM Headers (COM3/COM4 on X11SSQ only)
DVI-DDigital Video Interface Port (Back Panel)
FAN1 ~ FAN4System/CPU Fan Headers (FAN1: CPU Fan)
HD AudioHigh Denition Audio Connector (Back Panel)
USB0/1, 2/3, 8/9Back panel Universal Serial Bus (USB) Ports (Ports 8/9: USB 3.0) (USB2/3 on X11SSQ only)
USB4/5, 6/7, 10/11Front Accessible USB Headers (Headers 10/11: USB 3.0)
14
Chapter 1: Introduction
Motherboard Features
Motherboard Features
CPU
• 6th Generation Intel® Core i7/i5/i3, Pentium, and Celeron processor in an LGA1151 socket
Memory
• Supports up to 64GB of Unbuffered (UDIMM) DDR4 Non-ECC 2133 MHz (up to 32GB for X11SSQ-L)
DIMM Size
• 2GB, 4GB, 8GB, 16GB
Chipset
• Intel® Q170 Express Chipset for X11SSQ, Intel H110 Express Chipset for X11SSQ-L
Expansion Slots
• One (1) CPU PCI-Express 3.0 X16 slot
• One (1) PCH PCI-Express 3.0 X1 slot for X11SSQ, One (1) PCH PCI-Express 2.0 X1 slot for X11SSQ-L
• Two (2) PCH PCI-Express 3.0 X4 slots for X11SSQ, One (1) PCH PCI-Express 2.0 X4 slot for X11SSQ-L
Network
• Intel® i219LM and i210AT (i210AT on X11SSQ only)
Graphics
• Intel® HD Graphics
I/O Devices
• Serial (COM) Port• Four (4) COM Port Headers (Two (2) for X11SSQ-L)
• Six (6) SATA 3.0 Ports (I-SATA0 ~ I-SATA5) (I-SATA4/5 not available on
• SATA Ports
X11SSQ-L)
• One (1) SATA DOM Power Connector
Note: The table above is continued on the next page.
15
X11SSQ/-L User's Manual
Motherboard Features
Peripheral Devices
• Four (4) USB 2.0 ports on the rear I/O panel (USB0/1 and USB2/3) (USB2/3 not available on X11SSQ-L)
• Two (2) USB 3.0 port on the rear I/O panel (USB8/9)
• Two (2) USB 2.0 headers on the motherboard for front access (USB4/5 and USB6/7)
• One (1) USB 3.0 headers on the motherboard for front access (USB10/11)
BIOS
• 128Mb SPI AMI BIOS
• PCI 3.0, USB Keyboard/Mouse support, Hardware BIOS virus protect, RTC wake up, ACPI 5.0 support, SMBIOS 3.0,
UEFI 2.3.1
Power Management
• ACPI 5.0
• S3, S4, S5
• Power button override mechanism
• Power-on mode for AC power recovery
• Wake-on Ring, Wake-on LAN
• Keyboard wakeup from S5
• Force On mode by jumper setting
• Management Engine (ME)
®
SM Flash UEFI BIOS
System Health Monitoring
• Onboard voltage monitoring for +3.3V, 3.3V Standby, +5V, +12V, VBAT, Memory, PCH 1.0V, CPU Vcore
• 3+2+1+1 CPU switching phase voltage regulator
• CPU thermal trip support
Fan Control
• Fan speed control
System Management
• Trusted Platform Module (TPM) support
• PECI (Platform Environment Control Interface) 3.0 support
• System resource alert via SuperDoctor® 5
• SuperDoctor® 5, Watch Dog, NMI
• Chassis intrusion header and detection
Note: The table above is continued on the next page.
16
LED Indicators
• CPU/System overheating
• Power/Suspend state indicator
• Fan Failure
• HDD activity
• LAN activity
Dimensions
• uATX, 9.6" x 9.6", (24.4cm x 24.4 cm)
Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and
heatsink cooling restrictions. For proper thermal management, please check the chas-
sis and heatsink specications for proper CPU TDP sizing.
Chapter 1: Introduction
Motherboard Features
17
X11SSQ/-L User's Manual
Figure 1-4.
X11SSQ System Block Diagram
* 4+4
* 2+2
Front/Rear
Front/Rear
PCIe x16 SLOT #7
Embedded DisplayPort
PCIe 3.0 x1 SLOT #6
PCIe 3.0 x4 SLOT #5
PCIe 3.0 x4 SLOT #4
6 SATA- III
8 USB 2.0
4 USB 3.0 PORTS
M.2 MKE Y
ALC888S-VD2
Realtek
PORTS
PORTS
SSD
DisplayPort
HDMI
DVI-D
PCIe3.0_x16
8.0GT/s
Digital port 3
Digital port 2
Digital port 1
eDP
PCIe3.0_x1
8GT/s
PCIe3.0_x4
8GT/s
PCIe3.0_x4
8GT/s
SATA-III
6Gb/s
USB2.0
480Mb/s
USB3.0
5Gb/s
PCIe3.0_x2
8GT/s
AZALIA
MPS VRM
I219LM
I210-AT
TPM2.0
NCT
LPC
DIMMA1 (Black)
DIMMA2 (
IMMB1
D
DIMMB2 (
Header
6776
D
I/O
u
e
B
l
)
(Black)
u
e
B
l
)
RJ45
RJ45
8-bit GPIO HeaderPCA9554APW
HEALTH
INFO
P/S2
KB/MS
COM1/2
COM3/4NCT5104D
SMBus
SVID
DDR4 (CHA)
2133/1866MT/s
DDR4 (CHB)
2133/1866MT/s
PCIe1.0_x1
GLAN1
2.5GT/s
PCIe1.0_x1
GLAN2
2.5GT/s
LPC
INTEL LGA
(Socket-H4)
x4 DMI 3
8GT/s
IMVP8
1151
Audio
INTEL
PCH-H Q170
SPI
FLASH
SPI 128Mb
Note: This is a general block diagram and may not exactly represent the features on
your motherboard. See the previous pages for the actual specications of your motherboard.
18
Figure 1-5.
X11SSQ-L System Block Diagram
Chapter 1: Introduction
* 4+2
* 2+2
Front/Rear
Front/Rear
PCIe x16 SLOT #7
PCIe 2.0 x1 SLOT #6
PCIe 2.0 x4 SLOT #4
4 SATA-III
6 USB 2.0
4 USB 3.0 PORTS
ALC888S-VD2
Realtek
PORTS
PORTS
DisplayPort
HDMI
DVI-D
PCIe3.0_x16
8.0GT/s
Digital port 3
Digital port 2
Digital port 1
PCIe3.0_x1
8GT/s
PCIe2.0_x4
8GT/s
SATA-III
s
6Gb/
USB2.0
480Mb/s
USB3.0
5Gb/s
AZALIA
MPS VRM
I219LM
TPM2.0
NCT
LPC
Header
6776
I/O
DIMMA1
DIMMB1
D
u
e
(B
l
)
u
e
(B
l
)
RJ45
HEALTH
INFO
P/S2
COM1/2
KB/MS
SVID
DDR4 (CHA)
2133/1866MT/s
DDR4 (CHB)
2133/1866MT/s
PCIe1.0_x1
GLAN1
2.5GT/s
INTEL LGA
(Socket-H4)
x4 DMI 3
8GT/s
IMVP8
1151
Audio
INTEL
PCH-H H110
SPI
LPC
FLASH
SPI 128Mb
19
X11SSQ/-L User's Manual
1.2 Processor and Chipset Overview
Built upon the functionality and capability of the Intel 6th Generation Core i7/i5/i3, Pentium, and
Celeron processors (Socket LGA 1151) and the Intel Q170/H110 PCH Chipset, the X11SSQ/-L
motherboard offers maximum I/O expendability, energy efciency, and data reliability in a 14-
nm process architecture, and is optimized for embedded solutions, networking applications,
or cloud-computing platforms.
The Intel 6th Generation Core i7 and PCH Q170/H110 platform supports the following features:
• Intel AMT 11.0, TXT and vPro (X11SSQ only)
• PCI-E 2.0/3.0, SATA 3.0, USB 3.0
• Intel Hyper-Threading, Intel VT-D, VT-x
• TSX-NI, AES, SGX
• Intel Turbo Boost Technology
• Intel Rapid Storage Technology
• DDR4 Memory Support up to 2133MHz 64GB
• Three independent Graphics Displays with Audio Stream, VP8, VP9, HEVC, OpenGL
4.3/4.4, Intel Quick Sync Video Technology
1.3 Special Features
This section describes the health monitoring features of the X11SSQ motherboard. The
motherboard has an onboard System Hardware Monitor chip that supports system health
monitoring.
Recovery from AC Power Loss
The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.
Note: The motherboard offers a Force-On mode setting via jumper JAT1, putting it into
AT mode for special applications that require the system to always power on when AC
plugged in or when recovering from a power loss. Please refer to section 2.8 Jumper
Settings.
20
Chapter 1: Introduction
1.4 System Health Monitoring
This section describes the PC health monitoring features of the board. All have an onboard
System Hardware Monitoring chip that supports PC health monitoring.
Onboard Voltage Monitors
The onboard voltage monitor will continuously scan crucial voltage levels. Once a voltage
becomes unstable, it will give a warning or send an error message to the screen. Users can
adjust the voltage thresholds to dene the sensitivity of the voltage monitor.
Fan Status Monitor with Firmware Control
PC health monitoring in the BIOS can check the RPM status of the cooling fans. The onboard
CPU and chassis fans are controlled by Thermal Management.
Environmental Temperature Control
The thermal control sensor monitors the CPU temperature in real time and will turn on the
thermal control fan whenever the CPU temperature exceeds a user-dened threshold. The
overheat circuitry runs independently from the CPU. Once the thermal sensor detects that
the CPU temperature is too high, it will automatically turn on the thermal fans to prevent the
CPU from overheating. The onboard chassis thermal circuitry can monitor the overall system
temperature and alert the user when the chassis temperature is too high.
Note: To avoid possible system overheating, please be sure to provide adequate air-
ow to your system.
System Resource Alert
This feature is available when used with SuperDoctor 5®. SuperDoctor 5 is used to notify the
user of certain system events. For example, you can congure SuperDoctor 5 to provide you
with warnings when the system temperature, CPU temperatures, voltages and fan speeds
go beyond a predened range.
21
X11SSQ/-L User's Manual
1.5 ACPI Features
ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power
management features throughout a computer system including its hardware, operating system
and application software. This enables the system to automatically turn on and off peripherals
such as network cards, hard disk drives and printers.
In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play and an operating system-independent
interface for conguration control.
1.6 Power Supply
As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates.
This motherboard accommodates 24-pin ATX power supplies. Although most power supplies
generally meet the specications required by the CPU, some are inadequate. In addition, the
12-V 4-pin power connector located at JPW2 is always required to ensure adequate power
supply to the CPU.
Warning: 1) To prevent damage to the power supply or motherboard, please use a power
supply that contains a 24-pin and a 4-pin power connectors. Be sure to connect these
connectors to the 24-pin (JPW1) and the 4-pin (JPW2) power connectors on the motherboard.
Failure in doing so will void the manufacturer warranty on your power supply and motherboard.
2) To provide adequate power to SATA devices, please connect the SATA DOM PWR
connector (JSD1) to the power supply.
It is strongly recommended that you use a high quality power supply that meets ATX power
supply Specication 2.02 or above. It must also be SSI compliant (For more information,
please refer to the web site at http://www.ssiforum.org/). Additionally, in areas where noisy
power transmission is present, you may choose to install a line lter to shield the computer
from noise. It is recommended that you also install a power surge protector to help avoid
problems caused by power surges.
22
Chapter 1: Introduction
1.7 Super I/O
The Super I/O provides up to four high-speed, 16550 compatible serial communication ports
(UARTs), one of which supports serial infrared communication. Each UART includes a 16-byte
send/receive FIFO, a programmable baud rate generator, complete modem control capability
and a processor interrupt system. Both UARTs provide legacy speed with baud rate of up to
115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which
support higher speed modems.
The Super I/O provides functions that comply with ACPI (Advanced Conguration and Power
Interface), which includes support of legacy and ACPI power management through a SMI
or SCI function pin. It also features auto power management to reduce power consumption.
23
X11SSQ/-L User's Manual
Chapter 2
Installation
2.1 Static-Sensitive Devices
Electrostatic Discharge (ESD) can damage electronic com ponents. To prevent damage to your
motherboard, it is important to handle it very carefully. The following measures are generally
sufcient to protect your equipment from ESD.
Precautions
• Use a grounded wrist strap designed to prevent static discharge.
• Touch a grounded metal object before removing the board from the antistatic bag.
• Handle the board by its edges only; do not touch its components, peripheral chips, memory
modules or gold contacts.
• When handling chips or modules, avoid touching their pins.
• Put the motherboard and peripherals back into their antistatic bags when not in use.
• For grounding purposes, make sure that your chassis provides excellent conductivity be-
tween the power supply, the case, the mounting fasteners and the motherboard.
• Use only the correct type of CMOS onboard battery as specied by the manufacturer. Do
not install the CMOS battery upside down, which may result in a possible explosion.
Unpacking
The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.
24
Chapter 2: Installation
2.2 Processor and Heatsink Installation
Warning: When handling the processor package, avoid placing direct pressure on the label
area of the fan.
Important:
• Always connect the power cord last, and always remove it before adding, removing or
changing any hardware components. Make sure that you install the processor into the
CPU socket before you install the CPU heatsink.
• If you buy a CPU separately, make sure that you use an Intel-certied multi-directional
heatsink only.
• Make sure to install the motherboard into the chassis before you install the CPU heatsink.
• When receiving a motherboard without a processor pre-installed, make sure that the plastic
CPU socket cap is in place and none of the socket pins are bent; otherwise, contact your
retailer immediately.
• Refer to the Supermicro website for updates on CPU support.
Installing the LGA1151 Processor
1. Press the load lever to release the load plate, which covers the CPU socket, from its
locking position.
Load Plate
Load Lever
25
X11SSQ/-L User's Manual
2. Gently lift the load lever to open the load plate. Remove the plastic cap.
3. Use your thumb and your index nger to hold the CPU at the north center edge and the
South center edge of the CPU.
North Center Edge
South Center Edge
4. Align the CPU key that is the semi-circle cutouts against the socket keys. Once it is
aligned, carefully lower the CPU straight down into the socket. Do not drop the CPU on
the socket. Do not move the CPU horizontally or vertically.
26
Chapter 2: Installation
5. Do not rub the CPU against the surface or against any pins of the socket to avoid
damaging the CPU or the socket.
6. With the CPU inside the socket, inspect the four corners of the CPU to make sure that
the CPU is properly installed.
7. Use your thumb to gently push the load lever down to the lever lock.
CPU properly
installed
Load lever locked into
place
Note: You can only install the CPU inside the socket in one direction. Make sure that
it is properly inserted into the CPU socket before closing the load plate. If it doesn't
close properly, do not force it as it may damage your CPU. Instead, open the load
plate again and double-check that the CPU is aligned properly.
27
X11SSQ/-L User's Manual
Installing an Active CPU
Heatsink with Fan
1. Locate the CPU fan power connector on
the motherboard (FAN1: CPU Fan).
2. Position the heatsink so that the heatsink
fan wires are closest to the CPU fan
power connector and are not interfered
with other components.
3. Inspect the CPU fan wires to make sure
that the wires are routed through the
bottom of the heatsink.
4. Remove the thin layer of the protective
lm from the heatsink.
Important: CPU overheating may oc-
cur if the protective lm is not removed
from the heatsink.
5. Apply the proper amount of thermal
grease on the CPU.
Thermal Grease
Heatsink
Fins
Note: If your heatsink came with a ther-
mal pad, please ignore this step.
6. If necessary, rearrange the wires to
make sure that the wires are not pinched
between the heatsink and the CPU. Also
make sure to keep clearance between the
fan wires and the ns of the heatsink.
28
7. Align the four heatsink fasteners with
the mounting holes on the motherboard.
Gently push the pairs of diagonal
fasteners (#1 & #2, and #3 & #4) into
the mounting holes until you hear a click.
Also, make sure to orient each fastener
so that the narrow end of the groove is
pointing outward.
8. Repeat step 7 to insert all four heatsink
fasteners into the mounting holes.
9. Once all four fasteners are securely
inserted into the mounting holes, and
the heatsink is properly installed on the
motherboard, connect the heatsink fan
wires to the CPU fan connector.
Chapter 2: Installation
29
X11SSQ/-L User's Manual
Removing the Heatsink
Note: We do not recommend that
the CPU or the heatsink be removed.
However, if you do need to remove the
heatsink, please follow the instructions
below to remove the heatsink and to
prevent damage done to the CPU or
other components.
Active Heatsink Removal
1. Unplug the power cord from the power
supply.
Unplug the
PWR cord
2. Disconnect the heatsink fan wires from
the CPU fan header.
3. Use your nger tips to gently press on the
fastener cap and turn it counterclockwise
to make a 1/4 (900) turn, and pull the
fastener upward to loosen it.
4. Repeat step 3 to loosen all fasteners from
the mounting holes.
5. With all fasteners loosened, remove the
heatsink from the CPU.
Pull Up
30
Loading...
+ 121 hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.