Supermicro X11SSN-H operation manual

X11SSN-H/-E/-L

X11SSN-H/-E/-L-WOHS

X11SSN-H/-E/-L-VDC

USER’S MANUAL

Revision 1.0

The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:

For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.

IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: Handling of lead solder materials used in this product may expose you to lead, a
chemical known to the State of California to cause birth defects and other reproductive harm.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical

systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic

property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision 1.0

Release Date: January 17, 2018

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this

document. Information in this document is subject to change without notice. Other products and companies referred

to herein are trademarks or registered trademarks of their respective companies or mark holders.

Copyright © 2018 by Super Micro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

Preface

About This Manual

This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the X11SSN-H/-E/-L motherboard.

About This Motherboard

X11SSN is a 3.5” Single Board Computer (size: 146mm x 102mm) that is powered by the 7th
generation of Intel® Core™ U series processor, which operates on low power and features a
TDP of 15W to provide high performance computing and multimedia capabilities.

Based on numerous demands from embedded applications, Supermicro developed an
optimized thermal solution for X11SSN, producing a fanless design on a high performance
platform.

X11SSN adopts the latest 64-bit, dual-core processors built on 14nm process technology for

improvements in CPU processing, graphics, security and I/O exibility.

Moreover, X11SSN is equipped with the latest generation graphics core (Intel® HD Graphics

620) with DirectX 12, OpenGL 4.4, and 4K encoding/decoding, which increases more
possibilities for multimedia application development. X11SSN-H/E with Intel Core i7 and Core
i5 supports Intel® vPro™ Technology and Intel® Active Management Technology (AMT).

X11SSN supports not only triple independent displays including HDMI 2.0, DP++ and 48-bit
LVDS interfaces, but also low power dual, channel 2133MHz DDR4 of up to 32GB and TPM

2.0, and trendy technology built in with USB3.1 Gen2 type-C.

Please note that this motherboard is intended to be installed and serviced by professional
technicians only. For processor/memory updates, please refer to our website at http://www.

supermicro.com/products/.

3

Preface

Conventions Used in the Manual

Special attention should be given to the following symbols for proper installation and to prevent

damage done to the components or injury to yourself:

Warning! Indicates important information given to prevent equipment/property damage

or personal injury.

Warning! Indicates high voltage may be encountered when performing a procedure.

Important: Important information given to ensure proper system installation or to

relay safety precautions.

Note: Additional information given to differentiate various models or provides infor­mation for correct system setup.

4

X11SSN-H/-E/-L User's Manual

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Website: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

[e-mail] (Customer Support)

Website: www.supermicro.nl

Asia-Pacic

Address: Super Micro Computer, Inc.

3F, No. 150, Jian 1st Rd.

Zhonghe Dist., New Taipei City 235

Taiwan (R.O.C)

Tel: [phone]

Fax: [phone]

Email: [e-mail]

Website: www.supermicro.com.tw

5

Preface

Table of Contents

Chapter 1 Introduction

1.1 Checklist ...............................................................................................................................8

Quick Reference ...............................................................................................................15

Quick Reference Table ......................................................................................................16

Motherboard Features .......................................................................................................17

1.2 Processor Overview ...........................................................................................................20

1.3 Special Features ................................................................................................................20

Recovery from AC Power Loss .........................................................................................21

1.4 ACPI Features ....................................................................................................................21

1.5 Power Supply .....................................................................................................................21

1.6 Super I/O ............................................................................................................................22

Chapter 2 Installation

2.1 Static-Sensitive Devices .....................................................................................................23

Precautions .......................................................................................................................23

Unpacking .........................................................................................................................23

2.2 Motherboard Installation .....................................................................................................24

Tools Needed ....................................................................................................................24

Location of Mounting Holes ..............................................................................................24

Installing the Motherboard.................................................................................................25

2.3 Memory Support and Installation .......................................................................................26

Memory Support ................................................................................................................26

SO-DIMM Installation ........................................................................................................27

SO-DIMM Removal ...........................................................................................................27

2.4 Rear I/O Ports ....................................................................................................................28

2.5 Front Control Panel ............................................................................................................32

2.6 Connectors .........................................................................................................................35

Power Connections ...........................................................................................................35

Headers .............................................................................................................................37

2.7 Jumper Settings .................................................................................................................45

How Jumpers Work ...........................................................................................................45

2.8 LED Indicators ....................................................................................................................48

6

X11SSN-H/-E/-L User's Manual

Chapter 3 Troubleshooting

3.1 Troubleshooting Procedures ..............................................................................................49

Before Power On ..............................................................................................................49

No Power ..........................................................................................................................49

No Video ...........................................................................................................................50

System Boot Failure ..........................................................................................................50

Memory Errors ..................................................................................................................50

Losing the System's Setup Conguration .........................................................................51

When the System Becomes Unstable ..............................................................................51

3.2 Technical Support Procedures ...........................................................................................53

3.3 Frequently Asked Questions ..............................................................................................54

3.4 Battery Removal and Installation .......................................................................................55

Battery Removal ................................................................................................................55

Proper Battery Disposal ....................................................................................................55

Battery Installation .............................................................................................................55

3.5 Returning Merchandise for Service ....................................................................................56

Chapter 4 BIOS

4.1 Introduction .........................................................................................................................57

Starting the Setup Utility ...................................................................................................57

4.2 Main Setup .........................................................................................................................58

4.3 Advanced ............................................................................................................................59

4.4 Security ...............................................................................................................................81

4.5 Boot ....................................................................................................................................86

4.6 Save & Exit .........................................................................................................................89

Appendix A BIOS Codes

Appendix B Software Installation

B.1 Installing Software Programs .............................................................................................93

B.2 SuperDoctor® 5 ...................................................................................................................94

Appendix C Standardized Warning Statements

Battery Handling ................................................................................................................95

Product Disposal ...............................................................................................................97

Appendix D UEFI BIOS Recovery

7

X11SSN-H/-E/-L User's Manual

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an industry leader. Supermicro
boards are designed to provide you with the highest standards in quality and performance.

In additon to the motherboard, several important parts that are included with the system are
listed below. If anything listed is damaged or missing, please contact your retailer.

1.1 Checklist

Main Parts List (Retail Single Package)

Description Part Number Quantity

Supermicro Motherboard with passive heatsink X11SSN-H/-E/-L 1

Audio cable (20cm) CBL-OTHR-0986 1

SATA power cable (25cm) CBL-PWEX-0982 1

USB 2.0 cable (20cm) CBL-CUSB-0983 1

COM cable (20cm) CBL-CUSB-0984 1

SATA data cables (29cm) CBL-SAST-0538 1

Quick Reference Guide MNL-1995-QRG 1

Main Parts List (Bulk Package)

Description Part Number Quantity

Supermicro Motherboard with a passive heatsink
(X11SSN-H/-E/-L-WOHS does not include a heatsink)

SATA power cable (25cm) CBL-PWEX-0982 1

SATA data cable (29cm) CBL-SAST-0538 1

X11SSN-H/-E/-L
X11SSN-H/-E/-L-VDC
X11SSN-H/-E/-L-WOHS

1

Optional Parts List

Description Part Number Quantity

Spare part with copper standoff for M.2 and mounting holes MCP-110-00098-0N 1

Mini PCIe extended bracket MCP-110-00097-0N 1

USB3.0 OTG cable for connecting to host device, 15cm CBL-CUSB-0827 1

USB3.0 OTG cable for connecting to client device, 15cm CBL-CUSB-0826 1

Copper standoff (1) and M.2 screw (1) for 2242/3042 M.2 card MCP-110-00100-0N 1

8

Chapter 1: Introduction

Important Links

For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.

• Supermicro product manuals: http://www.supermicro.com/support/manuals/

• Product drivers and utilities: ftp://ftp.supermicro.com/CDR_Images/CDR-X11-UP/

• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

• If you have any questions, please contact our support team at: [e-mail]

This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.

9

X11SSN-H/-E/-L User's Manual

Figure 1-1. X11SSN-H/-E/-L Motherboard Image

Note: All graphics shown in this manual were based upon the latest PCB revision

available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.

10

Chapter 1: Introduction

Figure 1-2. X11SSN-H/-E/-L Motherboard Mechanical Drawings

Motherboard Top Side

Motherboard Bottom Side

11

X11SSN-H/-E/-L User's Manual

Figure 1-3. X11SSN-H/-E/-L Back Panel I/O Mechanical Drawings

Back Panel I/O with Heatsink (X11SSN-H/E)

Back Panel I/O with Heatsink (X11SSN-H/E-VDC)

Back Panel I/O with Heatsink (X11SSN-L)

Continued on the next page

12

Chapter 1: Introduction

X11SSN-H/-E/-L Back Panel I/O Mechanical Drawings

Back Panel I/O with Heatsink (X11SSN-L-VDC)

Back Panel I/O without Heatsink (X11SSN-H/E/L-WOHS)

13

X11SSN-H/-E/-L User's Manual

JPF1

FAN1

JPW2

JLCDPWR1

LVDS1

JPT1

Figure 1-4. Motherboard Layout

(not drawn to scale)

Top Layout

B2

B11

A12

A1

JHDMI1

COM1

JCOM1:

COM2

DP

USB6(3.0)

SRW1

SRW3

COM3

JCOM2:

COM4

A5

A4

B5

USB4/5(3.0)

SRW4

A1

B1

B9

A9

SRW2

JPH1

JD1:

SPEAKER

JD1

JPME2

B1

B2

B11

LAN2

A9

A10

JF1

A14

LAN1

PWR ON

RST

JF1

JGP1

LEDHDD
LEDPWR

J2
USB0/1

J3

USB2/3

USB7

AUDIO FP

I-SATA1

J4

BT1

Bottom Layout

3

DESIGNED IN USA

1

2

JMD1

JPW1

1

2

4

JSMBUS1

4

X11SSN

1

2

JMP1

REV:1.01

DIMMA1

2

DIMMB1

2

Note: Components not documented are for internal testing only.

14

Quick Reference

Top Layout

Chapter 1: Introduction

JPW2

JPF1

JLCDPWR1

CPU

LVDS1

FAN1

JPW2

JPF1

JPT1

FAN1

JLCDPWR1

LVDS1

JCOM1

JPT1

JHDMI1

JHDMI1

JCOM1:

COM1

COM2

DP++

DP

SRW1

SRW1

SRW3

SRW3

USB4/5 (3.0)

USB6 (3.1)

B2

B11

A12

A1

USB6(3.0)

JCOM2:

COM4

COM3

JCOM2

A4
A5

B5

USB4/5(3.0)

SRW4

SRW2

A1

A9

B1

B9

SRW2

SRW4

JPH1

B1

B11

JPH1

LAN2

B2

LAN2

I-SATA1

I-SATA1

LAN1

LAN1

PWR ON

RST

JF1

LEDHDD
LEDPWR

AUDIO FP

J4

AUDIO FP

JPME2

JPME2

A9

A10

JF1

A14

JGP1

J2

USB0/1

J3

USB2/3

USB7

JD1:

SPEAKER

JD1

JD1

JF1

JGP1

USB0/1

USB2/3

USB7

BT1

BT1

Bottom Layout

JPW1

DIMMA1

DIMMB1

JMD1

JSMBUS1

JMP1

3

JPW1

1

2

4

1

4

JMD1

JSMBUS1

DESIGNED IN USA

2

X11SSN

1

2

JMP1

REV:1.01

DIMMA1

2

DIMMB1

2

Notes:

• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel connec-

tions. Jumpers and LED indicators not indicated are used for testing only.

• " " indicates the location of Pin 1.

15

X11SSN-H/-E/-L User's Manual

Quick Reference Table

Jumper Description Jumper Setting (Default *)

Pin 1-3* (3.3V)

JLCDPWR1 LVDS Panel VCC power source selection

JPF1 FORCE POWER ON

JPME2 Manufacturing Mode

JPT1

TPM Enable/Disable Header

(X11SSN-L does not support TPM)

Connector Description

AUDIO FP Front Panel Audio Header (Mic-In/Headphone-Out)

Battery Connector

BT1

DP++ DisplayPort

FAN1 System Fan Header

I-SATA1 SATA 3.0 Port

JCOM1: COM1/COM2

JCOM2: COM3/COM4

JD1 Speaker Header (Pins 1-4)

JF1 Front Control Panel Header (Power/HDD LED, Reset, Power button)

JGP1 8-bit General Purpose I/O Header

JHDMI1 Back Panel HDMI 2.0 Port

JMD1

JMP1 Full Size Mini PCI-E Slot with mSATA (one PCIe x1 Gen3, one USB 2.0, one SATA 3.0)

JPH1 SATA Power Connector (for one HDD system)

JPW1 4-pin 12V R/A Type Power Connector (for X11SSN-H/E/L and X11SSN-H/E/L-WOHS)

(To Clear CMOS, remove the battery, short pins 1-2 for more than 10 seconds and

install the battery.)

COM Headers

(JCOM1 supports two RS232/RS422/RS485, JCOM2 supports two RS232)

M.2 Slot B-KEY 2280/2242/3042 (PCIe x2 Gen3, one USB 2.0, one SATA 3.0)

(2242/3042 modules are supported by the optional copper standoff, P/N: MCP-110-

00098-0N)

Pin 3-5 (5V)

Pin 3-4 (12V)

Pin 1-2* (FORCE POWER ON)

Pin 2-3 (POWER BUTTON ON)

Pin 1-2* (Normal)

Pin 2-3 (Manufacturing)

Pin 1-2* (Enable)

Pin 2-3 (Disable)

JPW2 4-pin 12V Vertical Type Power Connector (for X11SSN-H/E/L-VDC)

JSMBUS1 System Management Bus Header

LAN1, LAN2 LAN (RJ45) Ports

LVDS1 Dual Channel 48-bit LVDS Connector

SRW1 - SRW4 M.2 and Mini PCI-E Mounting Holes

USB0/1 USB 2.0 x 2 Header

USB2/3 USB 2.0 x 2 Header

USB4/5 Back Panel USB 3.0 Ports

USB6 USB 3.1 Type C Port

USB7 USB 3.0 OTG Header (one USB 3.0, one USB 2.0)

16

Chapter 1: Introduction

Motherboard Features

Motherboard Features

CPU

• X11SSN-H supports 7th Generation Intel® Core™ i7-7600U Processor

• X11SSN-E supports 7th Generation Intel® Core™ i5-7300U Processor

• X11SSN-L supports 7th Generation Intel® Core™ i3-7100U Processor

• Single chip FCBGA1356 supported, CPU TDP support 15W

Memory

• Integrated memory controller supports up to 32GB of DDR4 Non-ECC 240-pin 2133MHz SO-DIMM

DIMM Size

• Dual channel non-ECC SO-DIMM, DDR4 2133MHz up to 32GB

Expansion Slots

• One (1) Full Size Mini-PCI Express slot with mSATA (one PCIe x1 Gen3, one USB 2.0, one SATA 3.0)

• One (1) M.2 B-Key 3042/2242/2280 (PCIe x2 Gen3, one USB 2.0, one SATA 3.0)

The 2242/3042 module is supported by a copper standoff for M.2 and mounting holes (Supermicro P/N: MCP-110-

00098-0N)

Network

• Intel® Ethernet Controller I210-IT

• Intel® Ethernet Connection I219LM

Graphics

• Features: OpenGL 5.0, DirectX 12, OpenCL 2.1

• Hardware Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG,

HEVC/H.265, VP8, VP9, MVC

• Intel GT2-520

• Hardware Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC

• Display: HDMI 2.0 (resolution up to 4096x2160 at 60Hz), Display Port++

(resolution up to 4096x2160 at 60Hz), LVDS (dual channel 48-bit, resolution up

to 1920x1200 at 60Hz)

I/O Devices

• COM Ports

• Four (4) front accessible ports

(JCOM1 supports two RS232/433/485, JCOM2 supports two RS232)

• SATA Ports • One (1) SATA 3.0 port (I-SATA1)

• Audio Header

• One (1) HD Audio header with Mic-In/Headphone-out (Realtek ALC888S)

(Audio only supports 0-60ºC)

• GPIO Header • One (1) 8-bit General Purpose Input/Output Header

• SMBus Header • One (1) SMBus box header

• Speaker • One (1) Speaker header

Note 1: The table above is continued on the next page.

Note 2: The CPU maximum thermal design power (TDP) is subject to chassis and

heatsink cooling restrictions. For proper thermal management, please check the chas-

sis and heatsink specications for proper CPU TDP sizing.

17

X11SSN-H/-E/-L User's Manual

Motherboard Features

Peripheral Devices

• Two (2) USB 3.0 ports on the rear I/O panel (USB4/5 are Type A)

• Four (4) USB 2.0 headers (USB0/1 and USB2/3 are pin headers)

• One (1) USB 3.1 port (USB6)

• One (1) USB 3.0 OTG header (USB7 is a pin header)

BIOS

• 256Mb SPI AMI BIOS

• ACPI 3.0 or later, SMBIOS 2.7, PCI F/W 3.0, BIOS rescue hotkey, RTC (Real Time Clock) wakeup

Power Management

• ACPI power management

• S3, S4, S5

• Power button override mechanism

• Power-on mode for AC power recovery

• Wake On LAN

• Management Engine

• Force Power On by Jumper

• RTC Battery (typical voltage: 3.0V, normal discharge capacity: 210mAh)

®

System Health Monitoring

• Onboard voltage monitoring for +12V, +5V, +3.3V, +3.3V standby, +1.2V, VCGI, VBAT, and system temperature

• CPU switching phase voltage regulator

• CPU thermal trip support

Fan Control

• One (1) 4-pin fan header

• Fan speed control

System Management

• Trusted Platform Module (TPM) 2.0 support (supported on X11SSN-H/-E, X11SSN-H/-E-VDC, X11SSN-H/-E-WOHS)

• SuperDoctor® 5, Watch Dog, NMI, RoHs

LED Indicators

• Power/Suspend-state indicator LED

Mechanical Specication

• Dimensions: 4" (L) x 5.75" (W) (102mm x 146mm) SBCs

• Total Height: X11SSN-H/-E 41.88mm, X11SSN-L 32.88mm, X11SSN-H/-E/-L-WOHS 28.9mm, X11SSN-H/E-VDC

41.23mm, X11SSN-L-VDC 32.23mm

Environment

• Operating Temperature Range: X11SSN-H/-E supports 0°C ~ 70°C (-32°F ~ 158°F), X11SSN-L supports 0°C ~ 60°C

(32°F ~ 140°F), X11SSN-H/-E-VDC/WOHS supports 0°C ~ 70°C (-32°F ~ 158°F), X11SSN-L-VDC/WOHS supports 0°C

~ 60°C (32°F ~ 140°F)

• Non-Operating Temperature Range: -40°C ~ 85°C (-40°F - 185°F)

• Operating Relative Humidity Range: 8% ~ 90% (non-condensing)

• Non-Operating Relative Humidity Range: 10% ~ 95% (non-condensing)

18

HDMI connector

X11SSN Series Spec Chart

DP connector

LVDS Connector

PS175

DP to HDMI2.0

PTN3460

DP to LVDSBridge

Figure 1-5.

System Block Diagram

DDI1

DDI2

eDP

Intel

DUAL CHANNEL
DDR4 2133 MHz

A

B

Chapter 1: Introduction

MAX. 16G SO-DIMM SUPPORTED per DIMM

Non-ECC-SODIMM

DIMMA

DIMMB

FLASH

SPI 256Mb

USB3.0 OTG connector (JUSB2)

Rear USB3.0 connector (USB 0)
Rear USB3.0 connector (USB 1)

Rear USB2.0 Header (USB 2)
Rear USB2.0 Header (USB 3)

Front USB2.0 Header (USB 4)
Front USB2.0 Header (USB 5)

I/O Panel Layout

USB 3.0
USB 3.0

LAN1 LAN2

USB 3.1

TYPE C

21

HDMI

SPI

5.0Gb/s

5.0Gb/s

5.0Gb/s

480Mb/s
480Mb/s

480Mb/s

480Mb/s

Port 80 / Debug header

DP

SPI

USB 2.0 [1]
USB 3.0 [1]

USB 2.0 [2]
USB 3.0 [2]

USB 2.0 [3]
USB 3.0 [3]

PCIE[12]/SATA[2]
PCIE[11]

USB 2.0 [5]
USB 2.0 [6]

USB 2.0 [7]

USB 2.0 [8]

PCIE[8]/SATA[1]

PCIE[7]/SATA[0]

PCIE[3/4]

USB2.0[9]

USB2.0[10]

LPC

NCT6106D

Audio

PCIE[5]
(GBE)

PCIE[6]

PCIE[9]

SIO

High Definition

PCIe Gen3 x 1

or

PCIe Gen2 x 2

8.0GT/s

PCIe Gen3 x 2

8.0GT/s

480Mb/s

GBE

2.5GT/s

PCIe Gen2 x 1

5.0GT/s

PCIe Gen2 x 1

5.0GT/s
SATA
6Gb/s

480Mb/s

SATA 6Gb/s

COM 1 / 2 (RS232/422/485)

COM 3 / 4 (RS232)

REALTEK

ALC888S-VD2-GR

ASM1142

PCIe Gen3 X1 to USB3.1

M.2 SLOT (B KEY)

GLAN1
INTEL I219

GLAN2
INTEL I210

MUX

RJ45

RJ45

I-SATA0

FRONT AUDIO Header

TYPE C

Mini-PCIe Slot

X11SSN Series Specication Chart

Model CPU

X11SSN-H

X11SSN-E

X11SSN-L

X11SSN-H-VDC

X11SSN-E-VDC

X11SSN-L-VDC

X11SSN-H-WOHS

X11SSN-E-WOHS

X11SSN-L-WOHS

Base Freq

Corei7

7600U

Corei5

7300U

Corei3

7100U
Corei7

7600U
Corei5

7300U
Corei3

7100U
Corei7

7600U
Corei5

7300U

Corei3

7100U

Note: USB3.1 and Audio function support at Ta 0~60°C

Turbo Freq

(GHz)

GbE USB3.1 DP HDMI2.0 Audio

(GHz)

2.8 3.9 2 1 1 1 Yes Right angle TPM2.0 Yes 0~70°C

2.6 3.5 2 1 1

-

2.4

2 1 1

2.8 3.9 2 1 1

2.6 3.5 2 1 1

-

2.4

2 1 1

2.8 3.9 2 1 1

2.6 3.5 2 1 1

-

2.4

2 1 1

Note: This is a general block diagram and may not exactly represent the features on

your motherboard. See the previous pages for the actual specications of your moth­erboard.

Figure 1-6.

1

1

1

1

1

1

1

1

Yes Right angle TPM2.0 Yes 0~70°C

Yes Right angle N/A N/A 0~60°C

Yes Vertical type TPM2.0 Yes 0~70°C

Yes Vertical type TPM2.0 Yes 0~70°C

Yes Vertical type N/A N/A 0~60°C

Yes Right angle TPM2.0 Yes 0~70°C N/A

Yes Right angle TPM2.0 Yes 0~70°C N/A

Yes Right angle N/A N/A 0~60°C N/A

19

Power

Connector

TPM vPro Temp.

Heatsink

Passive

29mm height

Passive

29mm height

Passive

20mm height

Passive

29mm height

Passive

29mm height

Passive

20mm height

X11SSN-H/-E/-L User's Manual

1.2 Processor Overview

Built upon the functionality and capability of the Intel® Core ULT series processor, the

X11SSN-H/-E/-L motherboard offers maximum I/O expandability, energy efciency, and data

reliability in a 14-nm process architecture, and is optimized for embedded storage solutions,
networking applications, or cloud-computing platforms. The X11SSN-H/-E/-L drastically
increases system performance for a multitude of server applications.

The X11SSN-H/-E/-L supports the following features:

• Intel Virtualization Technology for Directed I/O (Intel VT-d)

• Enhanced Intel SpeedStep® Technology

• Video Connectors: Display Port++, HDMI 2.0, and LVDS

• Adaptive Thermal Management/Monitoring

• Mini-PCI-E slot with PCIe Gen3 x1 with transfer rates of up to 5Gb/s

• SATA port with SATA Gen3 with transfer rates of up to 6Gb/s

• System Management Bus (SMBus) Specication, Version 2.0

• M.2 slot with B-key 2280. 2242/3042 module is supported by a copper standoff for M.2

and mounting holes (SMC P/N: MCP-110-00098-0N)

• Integrated Sensor Hub (ISH)

• Intel® Identity Protection Technology

• Intel® vPro™ Technology and Intel® Active Management Technology (Intel® AMT).

(For X11SSN-H/E, -VDC, -WOHS)

1.3 Special Features

This section describes the health monitoring features of the X11SSN-H/-E/-L motherboard.
The motherboard has an onboard System Hardware Monitor chip that supports system health
monitoring.

20

Chapter 1: Introduction

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.

Note 1: Before setting the Recovery from AC Power Loss function in the BIOS, please

adjust force power on jumper JPF1 to pins 2-3 to disable the force power on function .

1.4 ACPI Features

ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power

management features throughout a computer system including its hardware, operating system
and application software. This enables the system to automatically turn on and off peripherals
such as network cards, hard disk drives and printers.

In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play and an operating system-independent

interface for conguration control. ACPI leverages the Plug and Play BIOS data structures

while providing a processor architecture-independent implementation that is compatible with
Windows® 10.

1.5 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates. In areas

where noisy power transmission is present, you may choose to install a line lter to shield

the computer from noise. It is recommended that you also install a power surge protector to
help avoid problems caused by power surges.

21

X11SSN-H/-E/-L User's Manual

1.6 Super I/O

The Super I/O (NCT6106D chip) provides four high-speed, 16550 compatible serial
communication ports (UARTs), one of which supports serial infrared communication. Each
UART includes a 128 byte send/receive FIFO, a programmable baud rate generator, complete
modem control capability, and a processor interrupt system. UARTs provide legacy speed
with a baud rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250
K, 500 K, or 1 Mb/s, which support higher speed modems.

The Super I/O provides functions that comply with ACPI (Advanced Conguration and Power

Interface), which includes support of legacy and ACPI power management through a SMI
or SCI function pin. It also features auto power management to reduce power consumption.

The IRQs, DMAs and I/O space resources of the Super I/O can be exibly adjusted to meet

ISA PnP requirements, which support ACPI and APM (Advanced Power Management).

22

Chapter 2: Installation

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. To prevent damage to your
motherboard, it is important to handle it very carefully. The following measures are generally

sufcient to protect your equipment from ESD.

Precautions

• Use a grounded wrist strap designed to prevent static discharge.

• Touch a grounded metal object before removing the board from the antistatic bag.

• Handle the board by its edges only; do not touch its components, peripheral chips, memory

modules or gold contacts.

• When handling chips or modules, avoid touching their pins.

• Put the motherboard and peripherals back into their antistatic bags when not in use.

• For grounding purposes, make sure that your chassis provides excellent conductivity be-

tween the power supply, the case, the mounting fasteners and the motherboard.

• Use only the correct type of CMOS onboard battery as specied by the manufacturer.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.

23

X11SSN-H/-E/-L User's Manual

2.2 Motherboard Installation

All motherboards have standard mounting holes to t different types of chassis. Make sure

that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that
the metal standoffs click in or are screwed in tightly.

Phillips Screwdriver (1)

Tools Needed

JPT1

FAN1

JHDMI1

JPW2

JPF1

JLCDPWR1

LVDS1

Phillips Screws (4)

Standoffs (4)
Only if Needed

JD1:

JF1

JGP1

USB7

JD1

J2
USB0/1

J3

USB2/3

SPEAKER

B2

B11

A12

A1

A4

DP

USB6(3.0)

SRW1

A5

B5

USB4/5(3.0)

A1

A9

B1

B9

SRW2

B1

B2

B11

LAN2

LAN1

PWR ON

RST

JF1

JPME2

A9

A10

A14

LEDHDD
LEDPWR

SRW4

JPH1

I-SATA1

J4

AUDIO FP

BT1

COM1

JCOM1:

COM2

SRW3

COM3

JCOM2:

COM4

Location of Mounting Holes

Note: 1) To avoid damaging the motherboard and its components, please do not use

a force greater than 8 lbf/in on each mounting screw during motherboard installation.

2) Some components are very close to the mounting holes. Please take precaution­ary measures to avoid damaging these components when installing the motherboard
to the chassis.

24

Chapter 2: Installation

Installing the Motherboard

1. Locate the mounting holes on the motherboard. See the previous page for the location.

2. Locate the matching mounting holes on the chassis. Align the mounting holes on the
motherboard against the mounting holes on the chassis.

3. Install standoffs in the chassis as needed.

4. Install the motherboard into the chassis carefully to avoid damaging other motherboard
components.

5. Using the Phillips screwdriver, insert a Phillips head #6 screw into a mounting hole on
the motherboard and its matching mounting hole on the chassis.

6. Repeat Step 5 to insert #6 screws into all mounting holes.

7. Make sure that the motherboard is securely placed in the chassis.

Note: Images displayed are for illustration only. Your chassis or components might
look different from those shown in this manual.

25

X11SSN-H/-E/-L User's Manual

2.3 Memory Support and Installation

Note: Check the Supermicro website for recommended memory modules.

Important: Exercise extreme care when installing or removing DIMM modules to pre-

vent any possible damage.

Memory Support

The X11SSN-H/-E/-L supports up to 32GB of DDR4 2133MHz SO-DIMM in two memory slots
on the bottom side of the motherboard.

Bottom Layout

3

JPW1

1

2

4

1

JMD1

JSMBUS1

4

DESIGNED IN USA

2

X11SSN

1

2

JMP1

REV:1.01

DIMMA1

2

DIMMB1

2

26

DIMMA1

DIMMB1

Chapter 2: Installation

SO-DIMM Installation

1. Position the SO-DIMM module's bottom key so it aligns with the receptive point on the
slot.

Align

2. Insert the SO-DIMM module vertically at about a 45 degree angle. Press down until the
module locks into place.

Insert this end rst Press down until the module

locks into place.

3. The side clips will automatically secure the SO-DIMM module, locking it into place.

Locking clip

SO-DIMM Removal

1. Push the side clips at the end of slot to release the SO-DIMM module. Pull the SO­DIMM module up to remove it from the slot.

27

X11SSN-H/-E/-L User's Manual

2.4 Rear I/O Ports

See Figure 2-1 below for the locations and descriptions of the various I/O ports on the rear
of the motherboard.

JD1:

JPME2

JF1

JGP1

J2

USB0/1

J3

USB2/3

USB7

SPEAKER

JD1

JPF1

FAN1

JPW2

JLCDPWR1

LVDS1

JPT1

JHDMI1

B2

B11

A12

A1

A4

DP

USB6(3.0)

SRW1

A5

B5

USB4/5(3.0)

A1

B1

B9

A9

SRW2

B1

B2

B11

LAN2

A9

A10

A14

LAN1

PWR ON

RST

JF1

LEDHDD
LEDPWR

SRW4

JPH1

I-SATA1

COM1

JCOM1:

COM2

SRW3

COM3

JCOM2:

COM4

Figure 2-1. I/O Port Locations and Denitions

3

1 4 765

2

Rear I/O Ports

J4

AUDIO FP

BT1

# Description # Description

1. LAN2 5 USB6 (3.1)

2. LAN1 6 DP++

3 USB5 (3.0) 7 HDMI 2.0 Port

4 USB4 (3.0)

28

Chapter 2: Installation

DP++

DisplayPort, developed by the VESA consortium, delivers digital display and fast refresh rate.
It can connect to virtually any display device using a DisplayPort adapter for devices such
as VGA, DVI or HDMI.

HDMI Port

The HDMI (High-Denition Multimedia Interface) port is used to display both high denition

video and digital sound through an HDMI-capable display, using the same cable.

JPF1

FAN1

JPW2

JLCDPWR1

LVDS1

JPT1

JHDMI1

COM1

JCOM1:

COM2

12

1. DP++

JD1:

JPME2

JF1

JGP1

J2
USB0/1

J3
USB2/3

USB7

SPEAKER

JD1

BT1

2. HDMI Port

B2

B11

A12

A1

A4

A5

B5

USB4/5(3.0)

SRW4

A1

B1

A9

B9

SRW2

JPH1

B1

B2

B11

LAN2

I-SATA1

A9

A10

A14

LAN1

PWR ON

RST

JF1

LEDHDD
LEDPWR

AUDIO FP

J4

SRW1

SRW3

USB6(3.0)

COM3

JCOM2:

COM4

DP

29

X11SSN-H/-E/-L User's Manual

LAN Ports

Two LAN ports (LAN1/LAN2) are located on the I/O back panel. These ports accept RJ45
type cables. Please refer to the LED Indicator section for LAN LED information. Refer to the

table below for pin dentions.

LAN Port

Pin Denition

Pin# Denition Pin# Denition

1 TD1+ 11 YEL-

2 TD1- 12 YEL+

3 TD2+ 13 GRN-/ORG+

4 TD2- 14 GRN+/ORG-

5 CT_VCC 15

6 CT_VCC 16

7 TD3+ 17

8 TD3- 18

9 TD4+ 19

10 TD4- 20

JPF1

FAN1

JPW2

JLCDPWR1

LVDS1

JPT1

JHDMI1

COM1

JCOM1:

COM2

12

1. LAN1

JD1:

JPME2

JF1

JGP1

J2
USB0/1

J3
USB2/3

USB7

SPEAKER

JD1

BT1

2. LAN2

B2

B11

A12

A1

A4

A5

B5

USB4/5(3.0)

SRW4

A1

B1

B9

A9

SRW2

JPH1

B1

B2

B11

LAN2

I-SATA1

A9

A10

A14

LAN1

PWR ON

RST

JF1

LEDHDD
LEDPWR

AUDIO FP

J4

SRW1

SRW3

USB6(3.0)

COM3

JCOM2:

COM4

DP

30