Supermicro X11SPW-TF operation manual

X11SPW-CTF

X11SPW-TF

USER'S MANUAL

Revision 1.0

The information in this user’s manual has been carefully reviewed and is believed to be accurate. The manufacturer
assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment
to update or to keep current the information in this manual, or to notify any person or organization of the updates.

Please Note: For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.

IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: Handling of lead solder materials used in this product may expose you to lead, a
chemical known to the State of California to cause birth defects and other reproductive harm.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical

systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic

property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision 1.0

Release Date: July 12, 2017

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this

document. Information in this document is subject to change without notice. Other products and companies referred

to herein are trademarks or registered trademarks of their respective companies or mark holders.

Copyright © 2017 by Super Micro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

Preface

About This Manual

This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the X11SPW-CTF/-TF motherboard.

About This Motherboard

The Supermicro X11SPW-CTF/-TF supports an Intel® Xeon 81xx/61xx/51xx/41xx/31xx
series (Socket P0-LGA 3647) processor with a thermal design power (TDP) of up to 205W.
Built with the Intel PCH C622 chipset, this motherboard offers such features as four SAS

3.0 ports (available on X11SPW-CTF), dual 10GbE ports, two SuperDOM connectors, the
Intel Node Manager, and the Trusted Platform Module (TPM) header. The X11SPW-CTF/-TF
supports 6-DIMM DDR4 ECC RDIMM/LRDIMM memory with speeds of up to 2666MHz. This
motherboard provides great performance and is ideal for cost-effective, general purpose
server platforms. Please note that this motherboard is intended to be installed and serviced
by professional technicians only. For processor/memory updates, please refer to our website
at http://www.supermicro.com/products/.

Conventions Used in the Manual

Special attention should be given to the following symbols for proper installation and to prevent

damage done to the components or injury to yourself:

Warning! Indicates important information given to prevent equipment/property damage

or personal injury.

Warning! Indicates high voltage may be encountered while performing a procedure.

Important: Important information given to ensure proper system installation or to

relay safety precautions.

Note: Additional Information given to differentiate various models or provides infor­mation for proper system setup.

3

X11SPW-CTF/-TF User's Manual

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Website: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

[e-mail] (Customer Support)

Website: www.supermicro.nl

Asia-Pacic

Address: Super Micro Computer, Inc.

3F, No. 150, Jian 1st Rd.

Zhonghe Dist., New Taipei City 235

Taiwan (R.O.C)

Tel: [phone]

Fax: [phone]

Email: [e-mail]

Website: www.supermicro.com.tw

4

Preface

Table of Contents

Chapter 1 Introduction

1.1 Checklist ...............................................................................................................................8

Quick Reference ...............................................................................................................12

Quick Reference Table ......................................................................................................13

Motherboard Features .......................................................................................................15

1.2 Processor and Chipset Overview .......................................................................................19

1.3 Special Features ................................................................................................................19

Recovery from AC Power Loss .........................................................................................19

1.4 System Health Monitoring ..................................................................................................20

Onboard Voltage Monitors ................................................................................................20

Fan Status Monitor with Firmware Control .......................................................................20

Environmental Temperature Control .................................................................................20

System Resource Alert......................................................................................................20

1.5 ACPI Features ....................................................................................................................20

1.6 Power Supply .....................................................................................................................21

1.7 Serial Port ...........................................................................................................................21

Chapter 2 Installation

2.1 Static-Sensitive Devices .....................................................................................................22

Precautions .......................................................................................................................22

Unpacking .........................................................................................................................22

2.2 Processor and Heatsink Installation ...................................................................................23

The Intel® Xeon 81xx/61xx/51xx/41xx/31xx Series Processor .......................................23

Overview of the Processor Socket Assembly ...................................................................24

Overview of the Processor Heatsink Module (PHM) ........................................................25

Attaching the Non-F Model Processor to the Processor Clip to Create the Processor

Carrier Assembly ...............................................................................................................26

Attaching the Non-F Model Processor Carrier Assembly to the Heatsink to Form the

Processor Heatsink Module (PHM) ...................................................................................27

Preparing the CPU Socket for Installation ........................................................................28

Removing the Dust Cover from the CPU Socket .............................................................28

Installing the Processor Heatsink Module (PHM) ............................................................29

Removing the Processor Heatsink Module (PHM) from the Motherboard .......................30

5

X11SPW-CTF/-TF User's Manual

2.3 Motherboard Installation .....................................................................................................31

Tools Needed ....................................................................................................................31

Location of Mounting Holes ..............................................................................................31

Installing the Motherboard.................................................................................................32

2.4 Memory Support and Installation .......................................................................................33

Memory Support ................................................................................................................33

DIMM Module Population Sequence ................................................................................34

DIMM Installation ..............................................................................................................35

DIMM Removal .................................................................................................................35

2.5 Rear I/O Ports ....................................................................................................................36

2.6 Front Control Panel ............................................................................................................41

2.7 Connectors .........................................................................................................................45

Power Connections ...........................................................................................................45

Headers .............................................................................................................................47

2.8 Jumper Settings .................................................................................................................56

How Jumpers Work ...........................................................................................................56

2.9 LED Indicators ....................................................................................................................61

Chapter 3 Troubleshooting

3.1 Troubleshooting Procedures ..............................................................................................65

Before Power On ..............................................................................................................65

No Power ..........................................................................................................................65

No Video ...........................................................................................................................66

System Boot Failure .......................................................................................................66

Memory Errors ..................................................................................................................66

Losing the System's Setup Conguration .........................................................................67

When the System Becomes Unstable ..............................................................................67

3.2 Technical Support Procedures ...........................................................................................69

3.3 Frequently Asked Questions ..............................................................................................70

3.4 Battery Removal and Installation .......................................................................................71

Battery Removal ................................................................................................................71

Proper Battery Disposal ....................................................................................................71

Battery Installation .............................................................................................................71

3.5 Returning Merchandise for Service ....................................................................................72

6

Preface

Chapter 4 BIOS

4.1 Introduction .........................................................................................................................73

4.2 Main Setup .........................................................................................................................74

4.3 Advanced Setup Congurations .........................................................................................76

4.4 Event Logs .......................................................................................................................101

4.5 IPMI ..................................................................................................................................103

4.6 Security .............................................................................................................................106

4.7 Boot ..................................................................................................................................110

4.8 Save & Exit .......................................................................................................................113

Appendix A BIOS Codes

Appendix B Software Installation

B.1 Installing Software Programs ...........................................................................................11 7

B.2 SuperDoctor® 5 .................................................................................................................118

Appendix C Standardized Warning Statements

Battery Handling ..............................................................................................................119

Product Disposal .............................................................................................................121

Appendix D UEFI BIOS Recovery

7

X11SPW-CTF/-TF User's Manual

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an industry leader.
Supermicro motherboards are designed to provide you with the highest standards in quality
and performance.

In additon to the motherboard, several important parts that are included in the retail box are
listed below. If anything listed is damaged or missing, please contact your retailer.

1.1 Checklist

Main Parts List

Description Part Number Quantity

Supermicro Motherboard X11SPW-CTF/-TF 1

SATA Cables CBL-0044L 6

Quick Reference Guide MNL-1916-QRG 1

Important Links

For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.

• Supermicro product manuals: http://www.supermicro.com/support/manuals/

• Product drivers and utilities: ftp://ftp.supermicro.com

• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

• If you have any questions, please contact our support team at: [e-mail]

This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.

8

Figure 1-1. X11SPW-CTF Motherboard Image

Chapter 1: Introduction

Note: All graphics shown in this manual were based upon the latest PCB revision
available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.

9

X11SPW-CTF/-TF User's Manual

Figure 1-2. X11SPW-TF Motherboard Image

10

Chapter 1: Introduction

SAN MAC

SXB1A

SAS CODE

SXB1B

IPMI CODE

MAC CODE

I-SATA2

I-SATA3

USB10/11(3.0)

S-SATA1

Figure 1-3. X11SPW-CTF/-TF Motherboard Layout

(not drawn to scale)

LE1

JUIDB1

I-SATA0

SXB1C

USB6

S-SATA0

SXB2

BT1

+

I-SATA 4-7

I-SATA1

X11SPW-CTF/-TF

REV: 1.02
DESIGNED IN USA

Intel

X557

JPME2

JPTG1

VGA

JWD1

Intel

C622

LAN2

LEDM1

JBT1

CPU

USB7/8(3.0)

LAN1

MH10

MH11

M.2 PCI-E 3.0 X4

IPMI_LAN

ASpeed

AST2500

LEDS1

LE3

USB0/1

BAR CODE

(-CTF only)

LSI3008

COM1

L-SAS0-3

JNVI2C1

JOH1

JIPMB1

JPSAS1

JPS1

PRESS FIT

USB4/5

JP1

JTPM1

JSTBY1

JPG1

COM2

JP4

USB9(3.0)

USB2/3

JP3

JF1

LE2

JPI2C1

JP2

JD1

ON

LEDLED12LEDFAIL

NMIXPWRHDDNICNICUIDPSRSTPWR

JSD2

JSD1

JL1

S-SGPIO1

I-SGPIO2

I-SGPIO1

FAN7

JRK1

JPWR3

FAN6

FAN5

FAN4

DIMMF1

DIMME1

DIMMD1

BIOS LICENSE

FAN3

DIMMA1

FAN2

SP1

DIMMB1

DIMMC1

JPWR1

JPWR2

FAN1

Notes:

• The image above combines both X11SPW-CTF and X11SPW-TF models. See pages 9-10

for a more accurate representation of each motherboard.

• X11SPW-CTF Only: SAS 3.0 Connections (LSI3008)

• Components not documented are for internal testing only.

11

X11SPW-CTF/-TF User's Manual

Quick Reference

JPME2

JPTG1

BT1

SXB1B

JBT1

I-SATA4-7

I-SATA1
I-SATA0
I-SATA2

I-SATA3

SXB1C

USB10/11 (3.0)

USB6

S-SATA1
S-SATA0

JSD1
JSD2

DIMMD1
DIMME1

DIMMF1

JL1

JRK1

S-SGPIO1

I-SGPIO2

JPWR3

I-SGPIO1

SXB2

SXB1A

SAN MAC

SXB1A

SAS CODE

SXB1B

IPMI CODE

MAC CODE

I-SATA2

I-SATA3

USB10/11(3.0)

S-SATA1

JSD2

JSD1

JL1

S-SGPIO1

I-SGPIO2

JRK1

I-SGPIO1

JPWR3

FAN7

JUIDB1

JUIDB1

SXB2

I-SATA0

SXB1C

USB6

S-SATA0

FAN6

VGA

LE1

LE1

VGA

Intel
X557

JPME2

JPTG1

JWD1

BT1

+

I-SATA 4-7

I-SATA1

X11SPW-CTF/-TF

REV: 1.02
DESIGNED IN USA

DIMMF1

DIMME1

DIMMD1

FAN4

FAN5

JWD1

Intel

C622

LAN2

LAN2

CPU

USB7/8 (3.0)

LAN1

LAN1

MH10

MH11

LEDM1

JBT1

M.2 PCI-E 3.0 X4

IPMI_LAN

USB7/8(3.0)

ASpeed

AST2500

LEDS1

LE3

BIOS LICENSE

USB0/1

IPMI_LAN

USB0/1

BAR CODE

LSI3008

(-CTF only)

FAN3

COM1

COM1

L-SAS0-3

JNVI2C1

JOH1

DIMMA1

FAN2

JPSAS1

JPS1

JPG1

JIPMB1

JPSAS1

JPG1

JPS1

COM2

PRESS FIT

JP4

USB9(3.0)

USB2/3

USB4/5

JP3

JP1

JTPM1

JSTBY1

JF1

LE2

JPI2C1

JPWR1

SP1

JPWR2

DIMMB1

DIMMC1

FAN1

JP2

JD1

ON

LEDLED12LEDFAIL

NMIXPWRHDDNICNICUIDPSRSTPWR

JIMPB1

COM2
MH10

L-SAS0-3
MH11

LEDM1

LEDS1

USB9 (3.0)

USB2/3

USB4/5
M.2

LE3

JNVI2C1

JTPM1
JOH1

JSTBY1
JD1

JF1

LE2

JPI2C1

JPWR1

CPU

SP1

JPWR2

DIMMA1

DIMMB1

DIMMC1

FAN7

FAN5 FAN4

FAN6

FAN3

FAN2 FAN1

Notes:

• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel connec-

tions. Jumpers/LED indicators not indicated are used for testing only.

• " " indicates the location of Pin 1.

• Use only the correct type of onboard CMOS battery as specied by the manufacturer. Do

not install the onboard battery upside down to avoid possible explosion.

12

Chapter 1: Introduction

Quick Reference Table

Jumper Description Default Setting

JBT1 CMOS Clear Open (Normal)

JPG1 VGA Enable/Disable Pins 1-2 (Enabled)

JPME2 ME Manufacturing Mode Pins 1-2 (Normal)

JPS1 SAS 3.0 Enable/Disable Pins 1-2 (Enabled)

JPSAS1 SAS HDD Enable/Disable Pins 1-2 (Enabled)

JPTG1 LAN Enable/Disable Pins 1-2 (Enabled)

JWD1 Watch Dog Timer Pins 1-2 (Reset)

LED Description Status

LE1 Unit Identier (UID) LED Solid Blue: Unit Identied

LE2 Onboard Power LED Solid Green: Power On

LE3 M.2 LED Blinking Green: Device Working

LEDM1 BMC Heartbeat LED Blinking Green: BMC Normal

LEDS1 SAS Activity LED

Blinking Green: SAS Active

Solid Red: SAS Error

Connector Description

BT1 Onboard Battery

COM1, COM2 COM Port, COM Header

FAN1 ~ FAN7 System Fan Headers

IPMI_LAN Dedicated IPMI LAN Port

I-SATA0~7 Intel® PCH SATA 3.0 Ports (with RAID 0, 1, 5, 10)

I-SGPIO1, I-SGPIO2, S-SGPIO1 Serial Link General Purpose I/O Headers

JD1 Speaker/Power LED Indicator (Pins 1-3: Power LED, Pins 4-7: Speaker)

JF1 Front Control Panel Header

JIPMB1 4-pin BMC External I2C Header (for an IPMI card)

JL1 Chassis Intrusion Header

JNVI2C1 NVMe I2C Header

JOH1 Overheat LED Header

JPI2C1 Power System Management Bus (SMB) I2C Header

JPWR1 8-pin 12V DC Power Connector for CPU (Required)

JPWR2 24-pin ATX Power Connector

JPWR3 4-pin 12V Power Connector for GPU Card (Requires an extra 12V power at up to 75W)

JRK1 Intel RAID Key Header

JSD1, JSD2 SATA DOM Power Connectors

JSTBY1 Standby Power Header

Note: Table is continued on the next page.

13

X11SPW-CTF/-TF User's Manual

Connector Description

JTPM1 Trusted Platform Module (TPM)/Port 80 Connector

JUIDB1 Unit Identier (UID) Switch

LAN1, LAN2 10GbE LAN Ports

L-SAS0~3 Four SAS 3.0 Ports (with RAID 0, 1, 10) (X11SPW-CTF only)

M.2 M.2 PCI-E 3.0 x4 or SATA 3.0 Slot

MH10, MH11 M.2 Mounting Holes

SP1 Internal Speaker/Buzzer

S-SATA0~1 SATA 3.0 Ports with SATA DOM Power

SXB1A, SXB1B, SXB1C Supermicro Proprietary WIO Left Add-on Card Slots

SXB2 Supermicro Proprietary WIO Right Add-on Card Slot

USB0/1 Back Panel Universal Serial Bus (USB) 2.0 Ports

USB2/3, USB4/5 Front Accessible USB 2.0 Headers

USB6 USB 2.0 Header (Not customized for the front panel)

USB7/8 Back Panel USB 3.0 Ports

USB9 USB 3.0 Type-A Header

USB10/11 Front Accessible USB 3.0 Header

VGA VGA Port

14

Chapter 1: Introduction

Motherboard Features

Motherboard Features

CPU

• Supports an Intel® Xeon 81xx/61xx/51xx/41xx/31xx series (Socket P0-LGA3647) processor with up to 28 cores and a

thermal design power (TDP) of up to 205W

Note: The X11SPW-CTF/-TF motherboard does not support FPGA or Fabric processors.

Memory

• Up to 192GB of RDIMM, 384GB of LRDIMM, and 768GB of 3DS LRDIMM DDR4 (288-pin) ECC memory with speeds of

up to 2666MHz in six memory slots

Note: Memory speed support depends on the processors used in the system.

DIMM Size

• Up to 128GB at 1.2V

Note: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/

motherboard.

Chipset

• Intel PCH C622

Expansion Slots

• One (1) PCI-Express 3.0 WIO Left x32 Slot

• One (1) PCI-Express 3.0 WIO Right x8 Slot

Network

• Intel X557 10G PHY

• Intel Ethernet Controller X722 for 10G BASE-T Ports

• One (1) Dedicated IPMI LAN located on the rear I/O panel

Baseboard Management Controller (BMC)

• ASpeed AST 2500 BMC

Graphics

• Graphics controller via ASpeed 2500 BMC

Note: The table above is continued on the next page.

15

X11SPW-CTF/-TF User's Manual

Motherboard Features

I/O Devices

• Serial (COM) Port

• SATA 3.0 • Ten (10) SATA 3.0 ports (I-SATA0~7, S-SATA0~1) supported by C622

• One (1) serial port on the rear I/O panel (COM1)

• One (1) front accessible serial port header (COM2)

• RAID (PCH) • RAID 0, 1, 5, 10

• SAS 3.0 (X11SPW-CTF only) • Four (4) SAS 3.0 connections via LSI3008 with one mini-SAS HD (SAS0-3)

• RAID (LSI3008) • RAID 0, 1, 10

Peripheral Devices

• Two (2) USB 2.0 ports on the rear I/O panel (USB0/1)

• Two (2) USB 3.0 ports on the rear I/O panel (USB7/8)

• Three (3) front accessible USB 2.0 headers with two (2) USB connections (USB2/3, USB4/5, USB6)

• One (1) front accessible USB 3.0 header with two (2) USB connections (USB10/11)

• One (1) USB 3.0 Type-A header (USB9)

BIOS

• 256 Mb SPI AMI BIOS

• ACPI 6.0, SMBIOS 3.0 or later, BIOS rescue hot-key, Plug-and-Play (PnP), SPI dual/quad speed support, riser card auto

detection support, real time clock (RTC) wakeup

®

SM Flash UEFI BIOS

Power Management

• ACPI Power Mangement

• Power button override mechanism

• Power-on mode for AC power recovery

• Wake-on-LAN

• Power supply monitoring

System Health Monitoring

• Onboard voltage monitoring for +1.05V, +1.2V, +1.8V, +3.3V, +3.3V standby, +5V, +5V standby, +12V, VBAT, memory,

PCH temperature, system temperature, memory temperature

• 5 CPU switch phase voltage regulator

• CPU thermal trip support

• PECI (Platform Environment Control Interface) 2.0 support

Fan Control

• Fan status monitoring via IPMI connections

• Single cooling zone

• Low-noise fan speed control

• Seven (7) 4-pin fan headers

Note: The table above is continued on the next page.

16

System Management

• Trusted Platform Module (TPM) support

• UID (Unit Identication)/Remote UID

• System resource alert via SuperDoctor® 5

• SuperDoctor® 5

• Chassis intrusion header and detection

LED Indicators

• CPU/System Overheating

• Power/M.2/SAS3008 (CTF)/BMC state Indicator

• UID/Remote UID

• HDD activity

• LAN activity

Dimensions

Chapter 1: Introduction

Motherboard Features

• 8" (W) x 13" (L) (203.2 mm x 330.2 mm)

Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and

heatsink cooling restrictions. For proper thermal management, please check the chas-

sis and heatsink specications for proper CPU TDP sizing.

Note 2: For IPMI conguration instructions, please refer to the Embedded IPMI Con­guration User's Guide available at http://www.supermicro.com/support/manuals/.

Note 3: It is strongly recommended that you change BMC login information upon initial
system power-on. The manufacture default username is ADMIN and the password is

ADMIN. For proper BMC conguration, please refer to http://www.supermicro.com/

products/info/les/IPMI/Best_Practices_BMC_Security.pdf

17

X11SPW-CTF/-TF User's Manual

#C-1

#B-1

#A-1

Figure 1-4.

System Block Diagram

VCCP0 12v
VR13

5+1 PHASE
205W

VCCP0

#D-1

#E-1

#F-1

SAS x1

RJ45

RTL8211E-VB-CG

DDR4

BMC Boot Flash

VGA CONN

Temp Sensor

EMC1402-1 *2 at diff SMBUS

SXB2

PCI-E X16

SXB1

LAN1
RJ45

LAN2
RJ45

LAN3

PCI-E X8

PCI-E X16

SPI

PCI-E X8 G3

PCI-E X16 G3

PCI-E X16 G3

LSI3008

M.2 SSD

Intel

X557 (10G)

RGRMII

BMC

AST2500

COM1
Connector

2133/2666

DDRIV

COM2
Header

PCI-E X4 G3

PCI-E X4 G3

RMII/NCSI

PCI-E X1 G2

SFI

USB 2.0

ESPI

ESPI

Header

SPI

SNB CORE
DDR-IV

#1A

SOCKET ID:0

#3 #1B

#2

#0~3

#8~11

SFI

C622 X8 UPLINK
NO QAT 2*10G+2*1G(~17W)

#5

#6 USB2.0

Switch

TPM HEADER

Debug Card

PECI:30

DMI3

PCI-E X8

DMI3

Uplink

PCH

C622

USB2.0 #2,3
USB2.0 #4,5

USB2.0 #0,1

SPI

SPI

BIOS

FRONT PANEL

2133/2666

DDRIV

#3

#2

#1

#0

6.0 Gb/S

#1

#0

6.0 Gb/S

Front USB2.0 x 4

USB 2.0

USB 2.0

Front USB3.0 x 2

USB 3.0

SYSTEM POWER

FAN SPEED

CTRL

#7

#6

#5

#4

SATA

SATA-DOM

sSATA

USB

Type A USB3.0

USB

USB

Rear USB2.0 x 2

USB

Rear USB3.0 x 2

USB

Note: This is a general block diagram and may not exactly represent the features on

your motherboard. See the previous pages for the actual specications of your moth­erboard.

18

Chapter 1: Introduction

1.2 Processor and Chipset Overview

Built upon the functionality and capability of the Intel® Xeon 81xx/61xx/51xx/41xx/31xx series
(Socket P0-LGA3647) processor and the Intel PCH C622 chipset, the X11SPW-CTF/-TF

motherboard offers maximum I/O expandability, energy efciency, and data reliability in a

14-nm process architecture, and is optimized for embedded storage solutions, data centers,
and high performance computing.

The Intel® Xeon 81xx/61xx/51xx/41xx/31xx and Intel PCH C622 chipset supports the following
features:

• ACPI Power Management Logic Support Rev. 6.0

• Intel® Turbo Boost Technology 2.0, Power Monitoring/Power Control, Turbo Time Param-

eter (TAU), and Platform Power Control

• Congurable TDP (cTDP) and Lower-Power Mode

• Adaptive Thermal Management/Monitoring

• PCI-E 3.0, SATA 3.0 with transfer rates of up to 6 Gb/s, xHCI USB with SuperSpeed 3.0

• System Management Bus (SMBus) Specication, Version 2.0

• Integrated Sensor Hub (ISH)The BMC supports remote management, virtualization, and

the security package for enterprise platforms

• Intel Trusted Execution Technology (Intel TXT)

• Intel Rapid Storage Technology

• Intel Virtualization Technology for Directed I/O (Intel VT-d)

1.3 Special Features

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.

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X11SPW-CTF/-TF User's Manual

1.4 System Health Monitoring

Onboard Voltage Monitors

An onboard voltage monitor will scan the voltages of onboard chipset, memory, CPU, and
battery continuously. Once a voltage becomes unstable, a warning is given, or an error

message is sent to the screen. The user can adjust the voltage thresholds to dene the

sensitivity of the voltage monitor.

Fan Status Monitor with Firmware Control

The system health monitor embedded in the BMC chip can check the RPM status of the
cooling fans. The CPU and chassis fans are controlled via lPMI.

Environmental Temperature Control

System Health sensors monitor temperatures and voltage settings of onboard processors
and the system in real time via the IPMI interface. Whenever the temperature of the CPU or

the system exceeds a user-dened threshold, system/CPU cooling fans will be turned on to

prevent the CPU or the system from overheating.

Note: To avoid possible system overheating, please be sure to provide adequate air-

ow to your system.

System Resource Alert

This feature is available when used with SuperDoctor 5® in the Windows OS or in the Linux
environment. SuperDoctor is used to notify the user of certain system events. For example,

you can congure SuperDoctor to provide you with warnings when the system temperature,
CPU temperatures, voltages and fan speeds go beyond a predened range.

1.5 ACPI Features

ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power

management features throughout a computer system, including its hardware, operating
system and application software. This enables the system to automatically turn on and off
peripherals such as CD-ROMs, network cards, hard disk drives and printers.

In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play, and an operating system-independent

interface for conguration control. ACPI leverages the Plug and Play BIOS data structures,

while providing a processor architecture-independent implementation that is compatible with
Windows 2012/R2 and Windows Server 2016 operating systems.

20

Chapter 1: Introduction

1.6 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates.

The X11SPW-CTF/-TF motherboard accommodates a 24-pin ATX power supply. Although

most power supplies generally meet the specications required by the CPU, some are

inadequate. In addition, one 12V 8-pin power connection is also required to ensure adequate
power supply to the system.

Warning: To avoid damaging the power supply or the motherboard, be sure to use a
power supply that contains a 24-pin and an 8-pin power connector. Be sure to connect
the power supplies to the 24-pin power connector (JPWR2), and the 8-pin power con­nector (JPWR1) on the motherboard. Failure in doing so may void the manufacturer
warranty on your power supply and motherboard.

It is strongly recommended that you use a high quality power supply that meets ATX power

supply Specication 2.02 or above. It must also be SSI compliant. (For more information,

please refer to the website at http://www.ssiforum.org/). Additionally, in areas where noisy

power transmission is present, you may choose to install a line lter to shield the computer

from noise. It is recommended that you also install a power surge protector to help avoid
problems caused by power surges.

1.7 Serial Port

The X11SPW-CTF/-TF motherboard supports two serial communication connections. COM
Ports 1 and 2 can be used for input/output. The UART provides legacy speeds with a baud
rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or
1 Mb/s, which support high-speed serial communication devices.

21

X11SPW-CTF/-TF User's Manual

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. To prevent damage to your
motherboard, it is important to handle it very carefully. The following measures are generally

sufcient to protect your equipment from ESD.

Precautions

• Use a grounded wrist strap designed to prevent static discharge.

• Touch a grounded metal object before removing the board from the antistatic bag.

• Handle the board by its edges only; do not touch its components, peripheral chips, memory

modules or gold contacts.

• When handling chips or modules, avoid touching their pins.

• Put the motherboard and peripherals back into their antistatic bags when not in use.

• For grounding purposes, make sure that your chassis provides excellent conductivity be-

tween the power supply, the case, the mounting fasteners and the motherboard.

• Use only the correct type of CMOS onboard battery as specied by the manufacturer. Do

not install the CMOS battery upside down, which may result in a possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.

22

Chapter 2: Installation

2.2 Processor and Heatsink Installation

Warning: When handling the processor package, avoid placing direct pressure on the label

area of the CPU or CPU socket. Also, improper CPU installation or socket misalignment can
cause serious damage to the CPU or motherboard which may result in RMA repairs. Please
read and follow all instructions thoroughly before installing your CPU and heatsink.

Notes:

• Always connect the power cord last, and always remove it before adding, removing, or

changing any hardware components. Please note that the processor and heatsink should

be assembled together rst to form the Processor Heatsink Module (PHM), and then install

the entire PHM into the CPU socket.

• When you receive a motherboard without a processor pre-installed, make sure that the

plastic CPU socket cap is in place and that none of the socket pins are bent; otherwise,
contact your retailer immediately.

• Refer to the Supermicro website for updates on CPU support.

• Please follow the instructions given in the ESD Warning section on the rst page of this

chapter before handling, installing, or removing system components.

The Intel® Xeon 81xx/61xx/51xx/41xx/31xx Series Processor

SKX Processor

Note: All graphics, drawings, and pictures shown in this manual are for illustration only.

The components that came with your machine may or may not look exactly the same
as those shown in this manual.

23

X11SPW-CTF/-TF User's Manual

Overview of the Processor Socket Assembly

The processor socket assembly contains 1) the Intel SKX processor, 2) the processor clip,

3) the dust cover, and 4) the CPU socket.

1. SKX Processor

2. Processor Clip (the plastic processor package carrier used for the CPU)

3. Dust Cover

4. CPU Socket

Note: Be sure to cover the CPU socket with the dust cover when the CPU is not in-

stalled.

24

Chapter 2: Installation

Overview of the Processor Heatsink Module (PHM)

The Processor Heatsink Module (PHM) contains 1) a heatsink, 2) a processor clip, and 3)
the SKX processor.

1. Heatsink

2. Processor Clip

3. SKX Processor

Processor Heatsink Module (PHM)

(Bottom View for a non-F Model)

25

X11SPW-CTF/-TF User's Manual

A

Attaching the Non-F Model Processor to the Processor Clip to
Create the Processor Carrier Assembly

To properly install the CPU into the processor clip, please follow the steps below:

1. Locate pin 1 (notch A), which is the triangle located on the top of the processor clip.
Also locate notch B and notch C on the processor clip.

2. Locate pin 1 (notch A), which is the triangle on the substrate of the CPU. Also, locate
notch B and notch C on the CPU as shown below.

3. Align pin 1 (the triangle on the substrate) of the CPU with pin 1 (the triangle) of the
processor clip. Once they are aligned, carefully insert the CPU into the processor clip by

sliding notch B of the CPU into notch B of the processor clip, and sliding notch C of the
CPU into notch C of the processor clip.

4. Examine all corners of the CPU to ensure that it is properly seated on the processor
clip. Once the CPU is securely attached to the processor clip, the processor carrier
assembly is created.

Note: Please exercise extreme caution when handling the CPU. Do not touch the
CPU LGA-lands to avoid damaging the LGA-lands or the CPU. Be sure to wear ESD
gloves when handling components.

CPU (Upside Down)
w/CPU LGA Lands up

Align Notch B of the CPU
and Notch B of the Processor Clip

Align CPU Pin 1

C

Align Notch C of the CPU
and Notch C of the Processor Clip

B

Allow Notch C to
latch on to CPU

A

Pin 1

C

C

B

CPU/Heatsink Package
(Upside Down)

A

Allow Notch B to
latch on to CPU

B

Processor Carrier Assembly (with CPU

mounted on the Processor Clip)

26

Chapter 2: Installation

Attaching the Non-F Model Processor Carrier Assembly to the
Heatsink to Form the Processor Heatsink Module (PHM)

After you have made a processor carrier assembly by following the instructions on the
previous page, please follow the steps below to mount the processor carrier assembly onto
the heatsink to create the Processor Heatsink Module (PHM):

1. Locate "1" on the heatsink label and the triangular corner next to it on the heatsink.

With your index nger pressing against the screw at this triangular corner, carefully hold

and turn the heatsink upside down with the thermal-grease side facing up. Remove the

protective thermal lm if present, and apply the proper amount of the thermal grease

as needed. (Skip this step if you have a new heatsink because the necessary thermal
grease is pre-applied in the factory.)

2. Holding the processor carrier assembly at the center edge, turn it upside down. With
the thermal-grease side facing up, locate the hollow triangle located at the corner of the
processor carrier assembly ("a" in the graphic). Note a larger hole and plastic mounting
clicks located next to the hollow triangle. Also locate another set of mounting clicks and

a larger hole at the diagonal corner
of the same (reverse) side of the
processor carrier assembly ("b" in
the graphic).

3. With the back of the heatsink and
the reverse side of the processor
carrier assembly facing up, align the
triangular corner on the heatsink
("A" in the graphic) against the
mounting clips next to the hollow
triangle ("a") on the processor
carrier assembly.

4. Also align the triangular corner ("B")
at the diagonal side of the heatsink
with the corresponding clips on the
processor carrier assembly ("b").

5. Once the mounting clips on
the processor carrier assembly
are properly aligned with the
corresponding holes on the back
of the heatsink, securely attach the
heatsink to the processor carrier
assembly by snapping the mounting
clips at the proper places on the
heatsink to create the processor
heatsink module (PHM).

Triangle on the CPU

Triangle on the
Processor Clip

Non-Fabric CPU and Processor Clip

(Upside Down)

d

a

D

Heatsink

(Upside Down)

A

On Locations of (C, D), the notches

B

D

A

On Locations (A, B), the notches
snap onto the heatsink’s sides

b

c

B

C

snap onto the heat sink’s

mounting holes

C

Make sure Mounting

Notches snap into place

27

X11SPW-CTF/-TF User's Manual

Preparing the CPU Socket for Installation

This motherboard comes with the CPU socket pre-assembled in the factory. The CPU socket
contains 1) a dust cover, 2) a socket bracket, 3) the CPU (P0) socket, and 4) a back plate.
These components are pre-installed on the motherboard before shipping.

CPU Socket w/Dust Cover On

Removing the Dust Cover from the CPU Socket

Remove the dust cover from the CPU socket, exposing the SKX socket and socket pins as
shown on the illustration below.

Note: Do not touch the socket pins to avoid damaging them, causing the CPU to
malfunction.

Dusk Cover

Remove the dust cover from

the CPU socket. Do not

touch the socket pins!

Socket Pins

SKX CPU Socket

28

Chapter 2: Installation

Installing the Processor Heatsink Module (PHM)

Once you have assembled the processor heatsink module (PHM) by following the instructions
listed on page 26, you are ready to install the processor heatsink module (PHM) into the CPU
socket on the motherboard. To install the PHM into the CPU socket, follow the instructions
below:

1. Locate the triangle (pin 1) on the CPU socket, and locate the triangle (pin 1) at the

corner of the PHM that is closest to "1." (If you have difculty locating pin 1 of the PHM,

turn the PHM upside down. With the LGA-lands side facing up, you will note the hollow
triangle located next to a screw at the corner. Turn the PHM right side up, and you will
see a triangle marked on the processor clip at the same corner of hollow triangle.)

2. Carefully align pin 1 (the triangle) on the the PHM against pin 1 (the triangle) on the
CPU socket.

3. Once they are properly aligned, insert the two diagonal oval holes on the heatsink into
the guiding posts.

4. Using a T30 Torx-bit screwdriver, install four screws into the mounting holes on the
socket to securely attach the PHM onto the motherboard starting with the screw marked
"1" (in the sequence of 1, 2, 3, and 4).

Note: Do not use excessive force when tightening the screws to avoid damaging the
LGA-lands and the processor.

Oval C

Use a torque

Oval D

Large Guiding Post

T30 Torx Driver

of 12 lbf

#4

#1

#2

Small Guiding Post

Printed Triangle

Mounting the Processor Heatsink Module

into the CPU socket (on the motherboard)

#3

Tighten the screws in the

sequence of 1, 2, 3, 4 (top 3 quarter view)

29

X11SPW-CTF/-TF User's Manual

Removing the Processor Heatsink Module (PHM) from the
Motherboard

Before removing the processor heatsink module (PHM), unplug the power cord from the
power outlet.

1. Using a T30 Torx-bit screwdriver, turn the screws on the PHM counterclockwise to
loosen them from the socket, starting with the screw marked #4 (in the sequence of 4,
3, 2, 1).

2. After all four screws are removed, wiggle the PHM gently and pull it up to remove it
from the socket.

Note: To properly remove the processor heatsink module, be sure to loosen and re­move the screws on the PHM in the sequence of 4, 3, 2, 1 as shown below.

#1

Removing the screws in

the sequence of 4, 3, 2, 1

#4

#2

#3

Printed Triangle on Motherboard

CPU Socket

After removing the screws,

lift the Processor Heatsink
Module off the CPU socket.

30