Supermicro X11SPM-TF operation manual

X11SPM-F

X11SPM-TF

X11SPM-TPF

USER'S MANUAL

Revision 1.0

The information in this user’s manual has been carefully reviewed and is believed to be accurate. The manufacturer
assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment
to update or to keep current the information in this manual, or to notify any person or organization of the updates.

Please Note: For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.

IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: Handling of lead solder materials used in this product may expose you to lead, a
chemical known to the State of California to cause birth defects and other reproductive harm.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical

systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic

property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision 1.0

Release Date: July 12, 2017

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this

document. Information in this document is subject to change without notice. Other products and companies referred

to herein are trademarks or registered trademarks of their respective companies or mark holders.

Copyright © 2017 by Super Micro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

Preface

About This Manual

This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the X11SPM-F/-TF/-TPF motherboard.

About This Motherboard

The Supermicro X11SPM-F/-TF/-TPF supports an Intel® Xeon 81xx/61xx/51xx/41xx/31xx
series (Socket P0-LGA 3647) processor. Built with the Intel PCH C621 (X11SPM-F) and
C622 (X11SPM-TF/-TPF) chipset, this motherboard offers such features as SATA 3.0 ports,
dual 1G Base-T / 10G Base-T / 10G SFP+ ports, SuperDOM connectors, a Trusted Platform
Module (TPM) header, and support for 6-channel, 6-DIMM DDR4 ECC RDIMM/LRDIMM
memory with speeds of up to 2666MHz. This motherboard provides great performance and
is ideal for embedded, cloud, data center, storage, and high perfomance computing. Please
note that this motherboard is intended to be installed and serviced by professional technicians
only. For processor/memory updates, please refer to our website at http://www.supermicro.
com/products/.

Conventions Used in the Manual

Special attention should be given to the following symbols for proper installation and to prevent

damage done to the components or injury to yourself:

Warning! Indicates important information given to prevent equipment/property damage

or personal injury.

Warning! Indicates high voltage may be encountered while performing a procedure.

Important: Important information given to ensure proper system installation or to

relay safety precautions.

Note: Additional Information given to differentiate various models or provides infor­mation for proper system setup.

3

X11SPM-F/-TF/-TPF User's Manual

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Website: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

[e-mail] (Customer Support)

Website: www.supermicro.nl

Asia-Pacic

Address: Super Micro Computer, Inc.

3F, No. 150, Jian 1st Rd.

Zhonghe Dist., New Taipei City 235

Taiwan (R.O.C)

Tel: [phone]

Fax: [phone]

Email: [e-mail]

Website: www.supermicro.com.tw

4

Preface

Table of Contents

Chapter 1 Introduction

1.1 Checklist ...............................................................................................................................8

Quick Reference ...............................................................................................................13

Quick Reference Table ......................................................................................................14

Motherboard Features .......................................................................................................16

1.2 Processor and Chipset Overview .......................................................................................20

1.3 Special Features ................................................................................................................20

Recovery from AC Power Loss .........................................................................................20

1.4 System Health Monitoring ..................................................................................................21

Onboard Voltage Monitors ................................................................................................21

Fan Status Monitor with Firmware Control .......................................................................21

Environmental Temperature Control .................................................................................21

System Resource Alert......................................................................................................21

1.5 ACPI Features ....................................................................................................................21

1.6 Power Supply .....................................................................................................................22

1.7 Serial Port ...........................................................................................................................22

Chapter 2 Installation

2.1 Static-Sensitive Devices .....................................................................................................23

Precautions .......................................................................................................................23

Unpacking .........................................................................................................................23

2.2 Processor and Heatsink Installation ...................................................................................24

The Intel® Xeon 81xx/61xx/51xx/41xx/31xx Series Processor ........................................24

Overview of the Processor Socket Assembly ...................................................................25

Overview of the Processor Heatsink Module (PHM) ........................................................26

Attaching the Non-F Model Processor to the Processor Clip to Create the Processor

Carrier Assembly ...............................................................................................................27

Attaching the Non-F Model Processor Carrier Assembly to the Heatsink to Form the

Processor Heatsink Module (PHM) ...................................................................................28

Preparing the CPU Socket for Installation ........................................................................29

Removing the Dust Cover from the CPU Socket .............................................................29

Installing the Processor Heatsink Module (PHM) ............................................................30

Removing the Processor Heatsink Module (PHM) from the Motherboard .......................31

5

X11SPM-F/-TF/-TPF User's Manual

2.3 Motherboard Installation .....................................................................................................32

Tools Needed ....................................................................................................................32

Location of Mounting Holes ..............................................................................................32

Installing the Motherboard.................................................................................................33

2.4 Memory Support and Installation .......................................................................................34

Memory Support ................................................................................................................34

DIMM Module Population Sequence ................................................................................35

DIMM Installation ..............................................................................................................36

DIMM Removal .................................................................................................................36

2.5 Rear I/O Ports ....................................................................................................................37

2.6 Front Control Panel ............................................................................................................42

2.7 Connectors .........................................................................................................................47

Power Connections ...........................................................................................................47

Headers .............................................................................................................................49

2.8 Jumper Settings .................................................................................................................58

How Jumpers Work ...........................................................................................................58

2.9 LED Indicators ....................................................................................................................62

Chapter 3 Troubleshooting

3.1 Troubleshooting Procedures ..............................................................................................64

Before Power On ..............................................................................................................64

No Power ..........................................................................................................................64

No Video ...........................................................................................................................65

System Boot Failure .......................................................................................................65

Memory Errors ..................................................................................................................65

Losing the System's Setup Conguration .........................................................................66

When the System Becomes Unstable ..............................................................................66

3.2 Technical Support Procedures ...........................................................................................68

3.3 Frequently Asked Questions ..............................................................................................69

3.4 Battery Removal and Installation .......................................................................................70

Battery Removal ................................................................................................................70

Proper Battery Disposal ....................................................................................................70

Battery Installation .............................................................................................................70

3.5 Returning Merchandise for Service ....................................................................................71

6

Preface

Chapter 4 BIOS

4.1 Introduction .........................................................................................................................72

4.2 Main Setup .........................................................................................................................73

4.3 Advanced Setup Congurations .........................................................................................75

4.4 Event Logs .......................................................................................................................101

4.5 IPMI ..................................................................................................................................103

4.6 Security .............................................................................................................................106

4.7 Boot .................................................................................................................................110

4.8 Save & Exit .......................................................................................................................113

Appendix A BIOS Codes

Appendix B Software Installation

B.1 Installing Software Programs ...........................................................................................11 7

B.2 SuperDoctor® 5 .................................................................................................................118

Appendix C Standardized Warning Statements

Battery Handling ..............................................................................................................119

Product Disposal .............................................................................................................121

Appendix D UEFI BIOS Recovery

7

X11SPM-F/-TF/-TPF User's Manual

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an industry leader.
Supermicro motherboards are designed to provide you with the highest standards in quality
and performance.

In additon to the motherboard, several important parts that are included in the retail box are
listed below. If anything listed is damaged or missing, please contact your retailer.

1.1 Checklist

Main Parts List

Description Part Number Quantity

Supermicro Motherboard X11SPM-F/-TF/-TPF 1

I/O Shield MCP-260-00042-0N 1

SATA Cables CBL-0044L 6

Quick Reference Guide MNL-1939-QRG 1

Important Links

For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.

• Supermicro product manuals: http://www.supermicro.com/support/manuals/

• Product drivers and utilities: ftp://ftp.supermicro.com

• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

• If you have any questions, please contact our support team at: [e-mail]

This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.

8

Figure 1-1. X11SPM-F Motherboard Image

Chapter 1: Introduction

Note: All graphics shown in this manual were based upon the latest PCB revision
available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.

9

X11SPM-F/-TF/-TPF User's Manual

Figure 1-2. X11SPM-TF Motherboard Image

10

Figure 1-3. X11SPM-TPF Motherboard Image

Chapter 1: Introduction

11

X11SPM-F/-TF/-TPF User's Manual

JIPMB1

JNVI2C1

JWD1

JPG1

JD1

JPME1

USB2/3

USB4/5

FANB

BMC_HB_LED1

CPU1 SLOT4 PCI-E 3.0 X16

I-SATA0-3

I-SATA4-7

USB10(3.0)

S-SATA2

S-SGPIO1

Figure 1-4. X11SPM-F/-TF/-TPF Motherboard Layout

(not drawn to scale)

PCB EDGE

Inphi

(-TPF)

PRESS FIT

LEDT3

LEDT1

LAN1/2

(-F/-TPF)

JRK1

CPU

USB6/7

(3.0)

LEDT2

LEDT4

ASpeed

AST2500

SRW4

CPU1 SLOT6 PCI-E 3.0 X16

SRW3

JMD1

JBT1

Intel

UID_LED1

JUIDB1

CPU1 SLOT7 PCI-E 3.0 X8

JTPM1

BT1

DIMMF1

DIMME1

DIMMD1

JSD1

S-SATA1

VGA

Intel

X557

(-TF)

LAN1/2

(-TF)

FAN6

X11SPM-F/-TF/-TPF

REV: 1.01
DESIGNED IN USA

+

CS4227

PCH

S-SATA0

USB8/9(3.0)

S-SATA3

JL1

JPME2

1

JPUSB1

1

FANA

JSD2

FAN4

FAN3

IPMI_LAN

USB0/1

Marvell

88E1512

(-F)

J18

FAN2

FAN1

MAC CODE

JF1

PWR
ON
RST
X
OH/
FF
NIC2
NIC1
HDD
LED
PWR
LED
X
NMI

DIMMA1

BAR CODE

COM1

DIMMB1

COM2

JSTBY1

FAN5

DIMMC1

JPH1

LEDPWR

JPW1

JPI2C1

JF1

JPV1

Notes:

• The image above combines X11SPM-F, X11SPM-TF, and X11SPM-TPF models. See

pages 9-11 for a more accurate representation of each motherboard.

• X11SPM-F Only: Marvell 88E1512 for 1G BASE-T Ports

• X11SPM-TF Only: Intel X557 for 10G BASE-T Ports

• X11SPM-TPF Only: Inphi CS4227 for 10G SFP+ Ports

• Components not documented are for internal testing only.

12

Quick Reference

JIPMB1

SLOT6

JIPMB1

SRW4

JNVI2C1

SLOT7
SLOT4

SRW3

JWD1

JPG1

JBT1

JMD1

JD1

JPME1

USB2/3

JSD1

USB4/5

S-SATA1

I-SATA0~3

I-SATA4~7

USB10 (3.0)

S-SGPIO1

FANB

JNVI2C1

JWD1

JPG1

JD1

JPME1

USB2/3

USB4/5

USB10(3.0)

FANB

BMC_HB_LED1

I-SATA0-3

I-SATA4-7

S-SATA2

ASpeed

AST2500

SRW4

SRW3

JMD1

Intel
PCH

JPME2

JL1

1

CPU1 SLOT6 PCI-E 3.0 X16

JBT1

JPUSB1

1

FANA

CPU1 SLOT4 PCI-E 3.0 X16

S-SGPIO1

S-SATA3

UID LED1

JUIDB1

UID_LED1

CPU1 SLOT7 PCI-E 3.0 X8

DIMMF1

DIMME1

DIMMD1

JSD1

S-SATA1

S-SATA0

USB8/9(3.0)

JUIDB1

JSD2

JTPM1

FAN6

VGA

VGA

Intel

X557

(-TF)

BT1

X11SPM-F/-TF/-TPF

REV: 1.01
DESIGNED IN USA

+

FAN4

LAN1/2 (-TF)

JTPM1

LAN1/2

(-TF)

FAN6

Inphi

CS4227

(-TPF)

FAN3

LAN1/2 (-F/-TPF)

USB6/7 (3.0)

IPMI_LAN

USB0/1

PCB EDGE

PRESS FIT

USB6/7

(3.0)

IPMI_LAN

LEDT3

LEDT1

LAN1/2

(-F/-TPF)

JRK1

CPU

LEDT2

LEDT4

USB0/1

Marvell

88E1512

J18

FAN2

Chapter 1: Introduction

COM1

COM1

COM2

JSTBY1

DIMMB1

FAN5

DIMMC1

JPW1

JPI2C1

JPH1

JF1

JPV1

LEDPWR

(-F)

DIMMA1

MAC CODE

JF1

PWR
ON
RST
X
OH/
FF
NIC2
NIC1
HDD
LED
PWR
LED
X
NMI

FAN1

BAR CODE

COM2

JSTBY1
JRK1
JPI2C1

FAN5
J18
BT1

JPH1

JF1

DIMMA1

DIMMB1
DIMMC1

JPV1

LEDPWR

DIMMF1
DIMME1
DIMMD1

JPW1

S-SATA2

S-SATA3

JL1

JPME2

FANA

I-SATA0

USB8/9 (3.0)

JSD2

FAN4

FAN3

FAN2

FAN1

JPUSB1

Notes:

• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel connec-

tions. Jumpers/LED indicators not indicated are used for testing only.

• " " indicates the location of Pin 1.

• Use only the correct type of onboard CMOS battery as specied by the manufacturer. Do

not install the onboard battery upside down to avoid possible explosion.

13

X11SPM-F/-TF/-TPF User's Manual

Quick Reference Table

Jumper Description Default Setting

JBT1 CMOS Clear Open (Normal)

JPG1 VGA Enable/Disable Pins 1-2 (Enabled)

JPME1 ME Recovery Pins 1-2 (Normal)

JPME2 ME Manufacturing Mode Pins 1-2 (Normal)

JPUSB1 Power Source Select For USB Port 0/1/6/7 Pins 1-2 (Standby)

JWD1 Watch Dog Timer Pins 1-2 (Reset)

LED Description Status

BMC_HB_LED1 BMC Heartbeat LED Blinking Green: Device Working

LEDPWR Onboard Power LED Solid Green: Power On

UID_LED1 UID LED Solid Blue: Unit Identied

Connector Description

BT1 Onboard Battery

COM1, COM2 COM Port, COM Header

FAN1 ~ FAN6, FANA/FANB CPU/System Fan Headers

IPMI_LAN Dedicated IPMI LAN Port

I-SATA0~7, S-SATA0~3 Intel PCH SATA 3.0 Ports (with RAID 0, 1, 5, 10)

J18 External RTC Battery Header

JD1 4-pin Speaker Header

JF1 Front Control Panel Header

JIPMB1 4-pin BMC External I2C Header (for an IPMI Card)

JL1 Chassis Intrusion Header

JMD1 M.2 PCI-E 3.0 x4 Slot (Supports M-Key 2280 and 2242)

JNVI2C1 NVMe I2C Header

JPH1 4-pin 12V Power Connector for GPU Card (Requires an extra 12V power at up to 75W)

JPI2C1 Power System Management Bus (SMB) I2C Header

JPV1 8-pin 12V CPU Power Connector

JPW1 24-pin ATX Power Connector

JRK1 Intel RAID Key Header

JSD1, JSD2 SATA DOM Power Connectors

JSTBY1 Standby Power Header

JTPM1 Trusted Platform Module/Port 80 Connector

JUIDB1 Unit Identier (UID) Switch

1G BASE-T Ports (for X11SPM-F)

LAN1, LAN2

10G BASE-T Ports (for X11SPM-TF)

10G SFP+ Ports (for X11SPM-TPF)

Note: Table is continued on the next page.

14

Connector Description

SLOT4 CPU PCI-E 3.0 x16 Slot

SLOT6 CPU PCI-E 3.0 x16 Slot

SLOT7 CPU PCI-E 3.0 x8 Slot

SRW3, SRW4 M.2 Mounting Holes

S-SGPIO1 Serial Link General Purpose I/O Header

USB0/1 Back Panel Universal Serial Bus (USB) 2.0 Ports

USB2/3, USB4/5 Front Accessible USB 2.0 Headers

USB6/7 Back Panel USB 3.0 Ports

USB8/9 Front Accessible USB 3.0 Header

USB10 USB 3.0 Type-A Header

VGA VGA Port

Chapter 1: Introduction

15

X11SPM-F/-TF/-TPF User's Manual

Motherboard Features

Motherboard Features

CPU

• Supports an Intel® Xeon 81xx/61xx/51xx/41xx/31xx series (Socket P0-LGA3647) processor with up to 28 cores and a

thermal design power (TDP) of 165W

Note: The X11SPM-F/-TF/-TPF motherboard does not support FPGA or Fabric processors.

Memory

• Up to 192GB of RDIMM, 384GB of LRDIMM, or 768GB of 3DS LRDIMM DDR4 (288-pin) ECC memory with speeds of

up to 2666MHz in six memory slots

Note: Memory speed support depends on the processors used in the system.

DIMM Size

• Up to 128GB at 1.2V

Note: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/

motherboard.

Chipset

• Intel PCH C621 (X11SPM-F)

• Intel PCH C622 (X11SPM-TF/-TPF)

Expansion Slots

• One (1) PCI-Express 3.0 x8 Slot (CPU SLOT7)

• Two (2) PCI-Express 3.0 x16 Slots (CPU SLOT4, CPU SLOT6)

Network

• X11SPM-F: Marvell 88E1512 for 1G BASE-T Ports

• X11SPM-TF: Intel X557 for 10G BASE-T Ports

• X11SPM-TPF: Inphi CS4227 for 10G SFP+ Ports

• One (1) Dedicated IPMI LAN located on the rear I/O panel

Baseboard Management Controller (BMC)

• ASpeed AST2500 BMC

Graphics

• Graphics controller via ASpeed2500 BMC

Note: The table above is continued on the next page.

16

Motherboard Features

I/O Devices

• Serial (COM) Port

• SATA 3.0 (6Gb/s)

• Video (VGA) Port • One (1) VGA connection on the rear I/O panel

Peripheral Devices

• Two (2) USB 2.0 ports on the rear I/O panel (USB0/1)

• Two (2) USB 3.0 ports on the rear I/O panel (USB6/7)

• Two (2) front accessible USB 2.0 headers with two (2) USB connections (USB2/3, USB4/5)

• One (1) front accessible USB 3.0 header with two (2) USB connections (USB8/9)

• One (1) USB 3.0 Type-A header (USB10)

• One (1) serial port on the rear I/O panel (COM1)

• One (1) front accessible serial port header (COM2)

Twelve (12) SATA 3.0 ports:

• Eight (8) SATA 3.0 ports via AHCI controller with RAID 0, 1, 5, 10 (I-SATA0~7)

• Four (4) SATA 3.0 ports via sSATA controller with RAID 0, 1, 5, 10 (S-SATA0~3)

• RAID array and volume(s) cannot span across the two (AHCI and sSATA)

controllers

Chapter 1: Introduction

BIOS

• 256Mb SPI AMI BIOS

®

SPI Flash UEFI BIOS

• ACPI 6.0, SMBIOS 3.0 or later, BIOS rescue hot-key, Plug-and-Play (PnP), SPI dual/quad speed support, riser card auto

detection support, real time clock (RTC) wakeup

Power Management

• ACPI Power Mangement

• Power button override mechanism

• Power-on mode for AC power recovery

• Wake-on-LAN

• Power supply monitoring

System Health Monitoring

• Onboard voltage monitoring for +3.3V, +5V, +12V +3.3V standby, +5V standby, VBAT, memory, PCH temperature, system

temperature, memory temperature

• 5+1 CPU switch phase voltage regulator

• CPU thermal trip support

• Platform Environment Control Interface (PECI)

Fan Control

• Fan status monitoring via IPMI connections

• Single cooling zone

• Low-noise fan speed control

• Eight (8) 4-pin fan headers

Note: The table above is continued on the next page.

17

X11SPM-F/-TF/-TPF User's Manual

System Management

• Trusted Platform Module (TPM) support

• SuperDoctor® 5

• Chassis intrusion header and detection

• Server Platform Service

LED Indicators

• CPU/system overheat LED

• Power/suspend-state indicator LED

• Fan failed LED

• UID/remote UID

• HDD activity LED

• LAN activity LED

Dimensions

Motherboard Features

• 9.6" (W) x 9.6" (L) (243.84 mm x 243.84 mm)

Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and

heatsink cooling restrictions. For proper thermal management, please check the chas-

sis and heatsink specications for proper CPU TDP sizing.

Note 2: For IPMI conguration instructions, please refer to the Embedded IPMI Con­guration User's Guide available at http://www.supermicro.com/support/manuals/.

Note 3: It is strongly recommended that you change BMC log-in information upon ini­tial system power-on. The manufacture default username is ADMIN and the password

is ADMIN. For proper BMC conguration, please refer to http://www.supermicro.com/

products/info/les/IPMI/Best_Practices_BMC_Security.pdf

18

DIMME1

DIMMF1

DIMMD1

Figure 1-5.

System Block Diagram

VCCP0 12v

VR13

5+1 PHASE

165W

CPU#1

DIMMA1

DIMMB1

Chapter 1: Introduction

DIMMC1

RJ45

DDR4

BMC Boot Flash

VGA CONN

JPCIE4

JPCIE6

JPCIE7

LAN3

RTL8211F

SPI

Temp Sensor

NCT7718W

DDR4

2133/2666

PCI-E X16

PCI-E X16

PCI-E X8

RMII/NCSI

RGRMII

NCSI
master

BMC

AST2500

COM1
Connector
COM2
Header

SPI

PCI-E X1

USB 2.0

ESPI

SW

BIOS

DMI3

3B3A2a1

DMI3

UPLINK PCI-E X8

PCH

NCSI

X11SPM-F C621

-TF/TPF C622

SATA 3

PCIe Gen3

USB 2.0 x 6

USB 3.0 x 5

P0/1

X722

SPI

TPM HEADER

Debug Card

P2/3

DDR4

2133/2666

#1

#0

SW

M.2 PCIex4

SATA-DOM

USB

#3

#2

I-SATA

Intel
X557 AT2

Inphi
CS4227

Marvell
88E1512

#JS1

#JS2

i-Pass

10GBASE-T x2

SFP+ x2

1GBASE-T x2

Note: This is a general block diagram and may not exactly represent the features on

your motherboard. See the previous pages for the actual specications of your moth­erboard.

19

X11SPM-F/-TF/-TPF User's Manual

1.2 Processor and Chipset Overview

Built upon the functionality and capability of the Intel® Xeon 81xx/61xx/51xx/41xx/31xx series
(Socket P0-LGA3647) processor and the Intel PCH C621 (X11SPM-F) / C622 (X11SPM-TF/­TPF) chipset, the X11SPM-F/-TF/-TPF motherboard offers maximum I/O expandability, energy

efciency, and data reliability in a 14-nm process architecture, and is optimized for embedded

storage solutions, networking applications, or cloud-computing platforms.

The Intel PCH C621/C622 chipset supports the following features:

• ACPI Power Management Logic Support Rev. 6.0

• Intel Turbo Boost Technology 2.0 Power Monitoring/Power Control, Turbo Time Parameter

(TAU), and Platform Power Control

• Congurable TDP (cTDP) and Lower-Power Mode

• Adaptive Thermal Management/Monitoring

• PCI-E 3.0, SATA 3.0 w/transfer rates of up to 6 Gb/s, xHCI USB with SuperSpeed 3.0

• System Management Bus (SMBus) Specication, Version 2.0

• Integrated Sensor Hub (ISH)

• The BMC supports remote management, virtualization, and the security package for en-

terprise platforms

• Intel Trusted Execution Technology (Intel TXT)

• Intel Rapid Storage Technology

• Intel Virtualization Technology for Directed I/O (Intel VT-d)

1.3 Special Features

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.

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Chapter 1: Introduction

1.4 System Health Monitoring

Onboard Voltage Monitors

An onboard voltage monitor will scan the voltages of onboard chipset, memory, CPU, and
battery continuously. Once a voltage becomes unstable, a warning is given, or an error

message is sent to the screen. The user can adjust the voltage thresholds to dene the

sensitivity of the voltage monitor.

Fan Status Monitor with Firmware Control

The system health monitor embedded in the BMC chip can check the RPM status of the
cooling fans. The CPU and chassis fans are controlled via lPMI.

Environmental Temperature Control

System Health sensors monitor temperatures and voltage settings of onboard processors
and the system in real time via the IPMI interface. Whenever the temperature of the CPU or

the system exceeds a user-dened threshold, system/CPU cooling fans will be turned on to

prevent the CPU or the system from overheating

Note: To avoid possible system overheating, please be sure to provide adequate air-

ow to your system.

System Resource Alert

This feature is available when used with SuperDoctor 5® in the Windows OS or in the Linux
environment. SuperDoctor is used to notify the user of certain system events. For example,

you can congure SuperDoctor to provide you with warnings when the system temperature,
CPU temperatures, voltages and fan speeds go beyond a predened range.

1.5 ACPI Features

ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power

management features throughout a computer system, including its hardware, operating
system and application software. This enables the system to automatically turn on and off
peripherals such as CD-ROMs, network cards, hard disk drives and printers.

In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play, and an operating system-independent

interface for conguration control. ACPI leverages the Plug and Play BIOS data structures,

while providing a processor architecture-independent implementation that is compatible with
Windows 8, Windows 10, and Windows 2012 Operating Systems.

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X11SPM-F/-TF/-TPF User's Manual

1.6 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates.

The X11SPM-F/-TF/-TPF motherboard accommodates a 24-pin ATX power supply. Although

most power supplies generally meet the specications required by the CPU, some are

inadequate. In addition, one 12V 8-pin power connection is also required to ensure adequate
power supply to the system.

Warning: To avoid damaging the power supply or the motherboard, be sure to use a
power supply that contains a 24-pin and an 8-pin power connector. Be sure to con­nect the power supplies to the 24-pin power connector (JPW1), and the 8-pin power
connector (JPV1) on the motherboard. Failure in doing so may void the manufacturer
warranty on your power supply and motherboard.

It is strongly recommended that you use a high quality power supply that meets ATX power

supply Specication 2.02 or above. It must also be SSI compliant. (For more information,

please refer to the website at http://www.ssiforum.org/). Additionally, in areas where noisy

power transmission is present, you may choose to install a line lter to shield the computer

from noise. It is recommended that you also install a power surge protector to help avoid
problems caused by power surges.

1.7 Serial Port

The X11SPM-F/-TF/-TPF motherboard supports two serial communication connections. COM
Ports 1 and 2 can be used for input/output. The UART provides legacy speeds with a baud
rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or
1 Mb/s, which support high-speed serial communication devices.

22

Chapter 2: Installation

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. To prevent damage to your
motherboard, it is important to handle it very carefully. The following measures are generally

sufcient to protect your equipment from ESD.

Precautions

• Use a grounded wrist strap designed to prevent static discharge.

• Touch a grounded metal object before removing the board from the antistatic bag.

• Handle the board by its edges only; do not touch its components, peripheral chips, memory

modules or gold contacts.

• When handling chips or modules, avoid touching their pins.

• Put the motherboard and peripherals back into their antistatic bags when not in use.

• For grounding purposes, make sure that your chassis provides excellent conductivity be-

tween the power supply, the case, the mounting fasteners and the motherboard.

• Use only the correct type of CMOS onboard battery as specied by the manufacturer. Do

not install the CMOS battery upside down, which may result in a possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.

23

X11SPM-F/-TF/-TPF User's Manual

2.2 Processor and Heatsink Installation

Warning: When handling the processor package, avoid placing direct pressure on the label

area of the CPU or CPU socket. Also, improper CPU installation or socket misalignment can
cause serious damage to the CPU or motherboard which may result in RMA repairs. Please
read and follow all instructions thoroughly before installing your CPU and heatsink.

Notes:

• Always connect the power cord last, and always remove it before adding, removing, or

changing any hardware components. Please note that the processor and heatsink should

be assembled together rst to form the Processor Heatsink Module (PHM), and then install

the entire PHM into the CPU socket.

• When you receive a motherboard without a processor pre-installed, make sure that the

plastic CPU socket cap is in place and that none of the socket pins are bent; otherwise,
contact your retailer immediately.

• Refer to the Supermicro website for updates on CPU support.

• Please follow the instructions given in the ESD Warning section on the rst page of this

chapter before handling, installing, or removing system components.

The Intel® Xeon 81xx/61xx/51xx/41xx/31xx Series Processor

SKX Processor

Note: All graphics, drawings, and pictures shown in this manual are for illustration only.

The components that came with your machine may or may not look exactly the same
as those shown in this manual.

24

Chapter 2: Installation

Overview of the Processor Socket Assembly

The processor socket assembly contains 1) the Intel SKX processor, 2) the processor clip,

3) the dust cover, and 4) the CPU socket.

1. SKX Processor

2. Processor Clip (the plastic processor package carrier used for the CPU)

3. Dust Cover

4. CPU Socket

Note: Be sure to cover the CPU socket with the dust cover when the CPU is not in-

stalled.

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X11SPM-F/-TF/-TPF User's Manual

Overview of the Processor Heatsink Module (PHM)

The Processor Heatsink Module (PHM) contains 1) a heatsink, 2) a processor clip, and 3)
the SKX processor.

1. Heatsink

2. Processor Clip

3. SKX Processor

Processor Heatsink Module (PHM)

(Bottom View for a non-F Model)

26

Chapter 2: Installation

A

Attaching the Non-F Model Processor to the Processor Clip to
Create the Processor Carrier Assembly

To properly install the CPU into the processor clip, please follow the steps below:

1. Locate pin 1 (notch A), which is the triangle located on the top of the processor clip.
Also locate notch B and notch C on the processor clip.

2. Locate pin 1 (notch A), which is the triangle on the substrate of the CPU. Also, locate
notch B and notch C on the CPU as shown below.

3. Align pin 1 (the triangle on the substrate) of the CPU with pin 1 (the triangle) of the
processor clip. Once they are aligned, carefully insert the CPU into the processor clip by

sliding notch B of the CPU into notch B of the processor clip, and sliding notch C of the
CPU into notch C of the processor clip.

4. Examine all corners of the CPU to ensure that it is properly seated on the processor
clip. Once the CPU is securely attached to the processor clip, the processor carrier
assembly is created.

Note: Please exercise extreme caution when handling the CPU. Do not touch the
CPU LGA-lands to avoid damaging the LGA-lands or the CPU. Be sure to wear ESD
gloves when handling components.

CPU (Upside Down)
w/CPU LGA Lands up

Align Notch B of the CPU
and Notch B of the Processor Clip

Align CPU Pin 1

C

Align Notch C of the CPU
and Notch C of the Processor Clip

B

Allow Notch C to
latch on to CPU

A

Pin 1

C

C

B

CPU/Heatsink Package
(Upside Down)

A

Allow Notch B to
latch on to CPU

B

Processor Carrier Assembly (with CPU

mounted on the Processor Clip)

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X11SPM-F/-TF/-TPF User's Manual

Attaching the Non-F Model Processor Carrier Assembly to the
Heatsink to Form the Processor Heatsink Module (PHM)

After you have made a processor carrier assembly by following the instructions on the
previous page, please follow the steps below to mount the processor carrier assembly onto
the heatsink to create the Processor Heatsink Module (PHM):

1. Locate "1" on the heatsink label and the triangular corner next to it on the heatsink.

With your index nger pressing against the screw at this triangular corner, carefully hold

and turn the heatsink upside down with the thermal-grease side facing up. Remove the

protective thermal lm if present, and apply the proper amount of the thermal grease

as needed. (Skip this step if you have a new heatsink because the necessary thermal
grease is pre-applied in the factory.)

2. Holding the processor carrier assembly at the center edge, turn it upside down. With
the thermal-grease side facing up, locate the hollow triangle located at the corner of the
processor carrier assembly ("a" in the graphic). Note a larger hole and plastic mounting
clicks located next to the hollow triangle. Also locate another set of mounting clicks and

a larger hole at the diagonal corner
of the same (reverse) side of the
processor carrier assembly ("b" in
the graphic).

3. With the back of the heatsink and
the reverse side of the processor
carrier assembly facing up, align the
triangular corner on the heatsink
("A" in the graphic) against the
mounting clips next to the hollow
triangle ("a") on the processor
carrier assembly.

4. Also align the triangular corner ("B")
at the diagonal side of the heatsink
with the corresponding clips on the
processor carrier assembly ("b").

Triangle on the CPU

Triangle on the
Processor Clip

Non-Fabric CPU and Processor Clip

(Upside Down)

b

d

B

a

D

Heatsink

(Upside Down)

A

On Locations of (C, D), the notches

snap onto the heat sink’s

B

c

C

mounting holes

5. Once the mounting clips on
the processor carrier assembly
are properly aligned with the
corresponding holes on the back
of the heatsink, securely attach the
heatsink to the processor carrier
assembly by snapping the mounting
clips at the proper places on the
heatsink to create the processor
heatsink module (PHM).

28

D

A

On Locations (A, B), the notches
snap onto the heatsink’s sides

C

Make sure Mounting

Notches snap into place

Chapter 2: Installation

Preparing the CPU Socket for Installation

This motherboard comes with the CPU socket pre-assembled in the factory. The CPU socket
contains 1) a dust cover, 2) a socket bracket, 3) the CPU (P0) socket, and 4) a back plate.
These components are pre-installed on the motherboard before shipping.

CPU Socket w/Dust Cover On

Removing the Dust Cover from the CPU Socket

Remove the dust cover from the CPU socket, exposing the SKX socket and socket pins as
shown on the illustration below.

Note: Do not touch the socket pins to avoid damaging them, causing the CPU to
malfunction.

Dusk Cover

Remove the dust cover from

the CPU socket. Do not

touch the socket pins!

Socket Pins

SKX CPU Socket

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X11SPM-F/-TF/-TPF User's Manual

Installing the Processor Heatsink Module (PHM)

Once you have assembled the processor heatsink module (PHM) by following the instructions
listed on page 26, you are ready to install the processor heatsink module (PHM) into the CPU
socket on the motherboard. To install the PHM into the CPU socket, follow the instructions
below:

1. Locate the triangle (pin 1) on the CPU socket, and locate the triangle (pin 1) at the

corner of the PHM that is closest to "1." (If you have difculty locating pin 1 of the PHM,

turn the PHM upside down. With the LGA-lands side facing up, you will note the hollow
triangle located next to a screw at the corner. Turn the PHM right side up, and you will
see a triangle marked on the processor clip at the same corner of hollow triangle.)

2. Carefully align pin 1 (the triangle) on the the PHM against pin 1 (the triangle) on the
CPU socket.

3. Once they are properly aligned, insert the two diagonal oval holes on the heatsink into
the guiding posts.

4. Using a T30 Torx-bit screwdriver, install four screws into the mounting holes on the
socket to securely attach the PHM onto the motherboard starting with the screw marked
"1" (in the sequence of 1, 2, 3, and 4).

Note: Do not use excessive force when tightening the screws to avoid damaging the
LGA-lands and the processor.

Oval C

Use a torque

Oval D

Large Guiding Post

T30 Torx Driver

of 12 lbf

#4

#1

#2

Small Guiding Post

Printed Triangle

Mounting the Processor Heatsink Module

into the CPU socket (on the motherboard)

#3

Tighten the screws in the

sequence of 1, 2, 3, 4 (top 3 quarter view)

30