SUMMIT S93VP662S-2.7TE13, S93VP662S-2.7TE7, S93VP662S-ATE13, S93VP662S-ATE7, S93VP662S-BTE13 Datasheet

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SUMMIT

MICROELECTRONICS, Inc. S93VP662/S93VP663

4K Serial E2PROM with a Precision Low-VCC Lockout Circuit

FEATURES

Voltage Protection™

Precision Low-VCC Write Lockout

All Write Operations Inhibited When VCC Falls below VLOCK

One 3Volt and Two 5Volt System Versions

VLOCK = 2.6V+.1V/-.05V

VLOCK = 4.25V +.25V/-0.0V

VLOCK = 4.50 +.25V/-0.0V

100% Compatible with Industry Standard Microwire Devices

1,000,000 Program/Erase Cycles

100 Year Data Retention

Commercial Industrial Temperature Range

OVERVIEW

The S93VP662 and S93VP663 are 4K-bit serial E2PROM memories integrated with a precision VCC sense circuit. The sense circuit will disable write operations whenever VCC falls below the VLOCK voltage. They are fabricated using SUMMIT’s advanced CMOS E2PROM technology and is suitable for both 3 and 5 volt systems.

Both devices have 4k-bits of E2PROM memory that is accessible via the industry standard microwire bus. The S93VP662 is configured with an internal ORG pin tied low providing an 8-bit byte organization and the S93VP663 is configured with an internal ORG pin tied high providing a 16-bit word organization. Both the S93VP662 and S93VP663 have page write capability. The devices are designed for a minimum 1,000,000 program/erase cycles and have data retention in excess of 100 years.

BLOCK DIAGRAM

 

 

 

 

VCC

8

 

 

 

 

 

 

5KHz

RESET

 

 

 

PULSE

 

 

 

Oscillator

 

 

 

GENERATOR

 

 

 

 

 

 

+

 

VTRIP

 

 

 

 

RESET

 

 

-

 

CONTROL

 

 

 

 

GND

5

 

 

 

 

 

1.26V

 

 

CS

1

 

 

WRITE

SK

2

MODE

 

 

CONTROL

DECODE

 

 

 

 

ADDRESS

DI

3

 

 

DECODER

DO

4

DATA I/O

 

MEMORY

 

 

ARRAY

 

 

 

 

4K-Bit

 

 

 

 

E2PROM

 

 

 

 

2019 ILL2 1.0

SUMMIT MICROELECTRONICS, Inc. • 300 Orchard City Drive, Suite 131

• Campbell, CA 95008 • Telephone 408-378-6461 • Fax 408-378-6586 • www.summitmicro.com

© SUMMIT MICROELECTRONICS, Inc. 1998

Characteristics subject to change without notice

2019 1.1 5/15/98

1

S93VP662/S93VP663

PIN CONFIGURATION

 

DIP Package (P)

SOIC Package (S)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CS

1

8

VCC

CS

 

 

 

 

1

8

 

 

 

VCC

 

 

 

 

 

 

2

7

 

 

 

 

2

7

 

 

 

SK

NC

SK

 

 

 

 

 

 

 

NC

DI

3

6

NC

DI

 

 

 

 

3

6

 

 

 

NC

 

 

 

 

 

 

DO

4

5

GND

DO

 

 

 

4

5

 

 

 

GND

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2019 ILL1 1.0

 

 

 

PIN FUNCTIONS

Pin Name

Function

 

 

CS

Chip Select

 

 

SK

Clock Input

 

 

DI

Serial Data Input

 

 

DO

Serial Data Output

 

 

VCC

+2.7 to 6.0V Power Supply

 

 

GND

Ground

 

 

DEVICE OPERATION

APPLICATIONS

The S93VP662/VP663 was designed specifically for applications where the integrity of the stored data is paramount. In recent years, as the operating voltage range of serial E2PROMs has widened, most semiconductor manufacturers have arbitrarily eliminated their VCC sense circuits. The S93VP662/VP663 will protect your data by guaranteeing write lockout below the selected VCC Lockout voltage.

VCC Lockout

The S93VP662/VP663 has an on-board precision VCC sense circuit. Whenever VCC is below VLOCK, the S93VP662/VP663 will disable the internal write circuitry. The VCC lockout circuit will ensure a higher level of data integrity than can be expected from industry standard devices that have either a very loose specification or no VCC lockout specification.

During a power-on sequence all writes will be inhibited below the VLOCK level and will continue to be held in a write inhibit state for approximately 200ms after VCC reaches, then stays at or above VLOCK. The 200ms delay provides a buffer space for the microcontroller to complete its power-on initialization routines (reading is OK) while still protecting against inadvertent writes.

During a power-down sequence initiation of writes will be inhibited whenever VCC falls below VLOCK. This will guard against the system’s microcontroller performing an inadvertent write within the ‘danger zone’. (see AN003)

GENERAL OPERATION

The S93VP662/VP663 is a 4096-bit nonvolatile memory intended for use with industry standard microprocessors. The S93VP663 is organized as X16, seven 11-bit instructions control the reading, writing and erase operations of the device. The S93VP662 is organized as X8, seven 12-bit instructions control the reading, writing and erase operations of the device. The device operates on a single 3V or 5V supply and will generate on chip, the high voltage required during any write operation.

Instructions, addresses, and write data are clocked into the DI pin on the rising edge of the clock (SK). The DO pin is normally in a high impedance state except when reading data from the device, or when checking the ready/busy status after a write operation.

The ready/busy status can be determined after the start of a write operation by selecting the device (CS high) and polling the DO pin; DO low indicates that the write operation is not completed, while DO high indicates that the device is ready for the next instruction. If necessary, the DO pin may be placed back into a high impedance

2019 1.1 5/15/98

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SUMMIT S93VP662S-2.7TE13, S93VP662S-2.7TE7, S93VP662S-ATE13, S93VP662S-ATE7, S93VP662S-BTE13 Datasheet

S93VP662/S93VP663

state during chip select by shifting a dummy “1” into the DI pin. The DO pin will enter the high impedance state on the falling edge of the clock (SK). Placing the DO pin into the high impedance state is recommended in applications where the DI pin and the DO pin are to be tied together to form a common DI/O pin.

The format for all instructions is: one start bit; two op code bits and either eight (x16) or nine (x8) address/ instruction bits.

Read

Upon receiving a READ command and an address (clocked into the DI pin), the DO pin of the S93VP662/ VP663 will come out of the high impedance state and, will first output an initial dummy zero bit, then begin shifting out the data addressed (MSB first). The output data bits will toggle on the rising edge of the SK clock and are stable after the specified time delay (tPD0 or tPD1).

Write

After receiving a WRITE command, address and the data, the CS (Chip Select) pin must be deselected for a minimum of 250ns (tCSMIN). The falling edge of CS will start automatic erase and write cycle to the memory location specified in the instruction. The ready/busy status of the S93VP662/VP663 can be determined by selecting the device and polling the DO pin.

Erase

Upon receiving an ERASE command and address, the CS (Chip Select) pin must be deslected for a minimum of 250ns (tCSMIN). The falling edge of CS will start the auto erase cycle of the selected memory location. The ready/busy status of the S93VP662/VP663 can be determined by selecting the device and polling the DO pin. Once cleared, the content of a cleared location returns to a logical “1” state.

 

tSKHI

t SKLOW

t CSH

 

 

SK

 

 

 

 

 

 

tDIS

 

tDIH

 

 

DI

VALID

 

VALID

 

 

 

tCSS

 

 

 

 

CS

 

 

 

 

 

 

 

t DIS

tPD0,t PD1

tCSMIN

 

DO

 

 

DATA VALID

 

 

 

Figure 1. Sychronous Data Timing

2019

ILL 3 1.0

 

 

 

SK

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCS

CS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

STANDBY

 

 

 

AN

AN–1

A0

 

 

 

DI

1

1

0

 

 

 

 

 

 

 

 

 

 

tPD0

 

 

tHZ

DO

 

 

HIGH-Z

 

 

 

HIGH-Z

 

 

 

 

0

 

 

 

 

 

 

 

 

DN

DN–1

D1

D0

 

 

 

 

 

 

 

 

2019 ILL4 1.0

 

 

 

 

Figure 2. Read Instruction Timing

 

 

 

 

 

 

 

3

 

 

2019 1.1 5/15/98

 

 

 

 

 

 

 

 

S93VP662/S93VP663

Erase/Write Enable and Disable

The S93VP662/VP663 powers up in the write disable state. Any writing after power-up or after an EWDS (write disable) instruction must first be preceded by the EWEN (write enable) instruction. Once the write instruction is enabled, it will remain enabled until power to the device is removed, or the EWDS instruction is sent. The EWDS instruction can be used to disable all S93VP662/VP663 write and clear instructions, and will prevent any accidental writing or clearing of the device. Data can be read normally from the device regardless of the write enable/disable status.

Erase All

Upon receiving an ERAL command, the CS (Chip Select) pin must be deselected for a minimum of 250ns (tCSMIN). The falling edge of CS will start the self clocking clear cycle of all memory locations in the device. The

clocking of the SK pin is not necessary after the device has entered the self clocking mode. The ready/busy status of the S93VP662/VP663 can be determined by selecting the device and polling the DO pin. Once cleared, the contents of all memory bits return to a logical “1” state.

Write All

Upon receiving a WRAL command and data, the CS (Chip Select) pin must be deselected for a minimum of 250ns (tCSMIN). The falling edge of CS will start the self clocking data write to all memory locations in the device. The clocking of the SK pin is not necessary after the device has entered the self clocking mode. The ready/ busy status of the S93VP662/VP663 can be determined by selecting the device and polling the DO pin. It is not necessary for all memory locations to be cleared before the WRAL command is executed.

SK

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCS

 

CS

 

 

 

 

 

 

STATUS

STANDBY

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VERIFY

 

 

 

 

AN

AN-1

A0 DN

D0

 

 

DI

1

0

1

 

 

 

 

 

 

 

 

 

HIGH-Z

 

tSV

BUSY

tHZ

DO

 

 

 

 

 

READY

 

 

 

 

 

 

 

HIGH-Z

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tEW

 

 

 

 

 

 

 

 

 

2019 ILL 5 1.0

 

 

 

 

Figure 3. Write Instruction Timing

 

 

SK

 

 

 

 

 

 

 

 

CS

 

 

 

 

 

 

STATUS VERIFY

STANDBY

 

 

 

AN

AN-1

A0

 

tCS

 

 

 

 

 

 

 

DI

1

1

1

 

 

 

 

 

tSV

 

 

 

 

 

 

 

 

 

 

 

tHZ

 

 

 

 

 

 

 

HIGH-Z

 

 

 

 

 

 

 

 

 

 

 

 

DO

BUSY READY

 

 

 

 

 

 

 

 

 

 

HIGH-Z tEW

2019 ILL6 1.0

Figure 4. Erase Instruction Timing

2019 1.1 5/15/98

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