®
TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER
Table 1: Main Product Characteristics
I
F(AV)
V
RRM
I
(max)
R
T
j
(typ)
V
F
(typ)
t
rr
FEATURES AND BENEFITS
■ Ultrafast switching
■ Low reverse recovery current
■ Low thermal resistance
■ Reduces switching and conduction losses
DESCRIPTION
The STTH8L06, which is using ST Turbo2 600V
technology, is specially suited as boost diode in
discontinuous or critical mode power factor
corrections.
The device is also intended for use as a free
wheeling diode in power supplies and other power
switching applications.
8 A
600 V
200 µA
175°C
0.85 V
75 ns
STTH8L06
K
A
K
TO-220AC
STTH8L06D
A
K
TO-220AC Insulated
STTH8L06DI
Table 2: Order Codes
Part Number Marking
STTH8L06D STTH8L06D
STTH8L06FP STTH8L06FP
STTH8L06DI STTH8L06DI
STTH8L06DIRG STTH8L06DI
STTH8L06G STTH8L06G
STTH8L06G-TR STTH8L06G
TO-220FPAC
STTH8L06FP
K
D
STTH8L06G
2
PA K
A
K
A
NC
Table 3: Absolute Ratings (limiting values)
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
Repetitive peak reverse voltage 600 V
RMS forward voltage TO-220AC / TO-220FPAC 30 A
TO-220AC Ins. 24
I
F(AV)
Average forward current
δ = 0.5
TO-220AC Tc = 150°C 8 A
TO-220FPAC Tc = 125°C
TO-220AC Ins. Tc = 135°C
I
FSM
T
T
June 2005 REV. 4
Surge non repetitive forward current tp = 10ms sinusoidal 120 A
Storage temperature range -65 to + 175 °C
stg
Maximum operating junction temperature - 40 to 175 °C
j
1/8
STTH8L06
Table 4: Thermal Resistance
Symbol Parameter Value (max). Unit
R
th(j-c)
Junction to case
TO-220AC / D
2
PAK
TO-220FPAC 5
TO-220AC Ins. 4
Table 5: Static Electrical Characteristics
Symbol Parameter Test conditions Min. Typ Max. Unit
I
Reverse leakage current Tj = 25°C VR = V
R
= 150°C 16 200
T
j
V
Forward voltage drop Tj = 25°C IF = 8A 1.3 V
F
= 150°C 0.85 1.05
T
j
RRM
2.5 °C/W
8µ A
To evaluate the conduction losses use the following equation: P = 0.89 x I
F(AV)
+ 0.022 I
F2(RMS)
Table 6: Dynamic Characteristics
Symbol Parameter Test conditions Min. Typ Max. Unit
t
Reverse recovery
rr
Tj = 25°C IF = 1A dIF/dt = 50 A/µs VR =30V 75 105 ns
time
t
V
Forward recovery
fr
time
Forward recovery
FP
Tj = 25°C IF = 8A dIF/dt = 100 A/µs
= 1.1 x V
V
FR
Fmax
IF = 8A dIF/dt = 100 A/µs 6 V
150 ns
voltage
Figure 1: Conduction losses versus average
current
P(W)
11
10
9
8
7
6
5
4
3
2
1
0
024681 0
δ = 0.05
δ = 0.1
I (A)
F(AV)
δ = 0.2
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Figure 2: Forward voltage drop versus forward
current
I (A)
FM
100.0
10.0
1.0
0.1
T =150°C
j
(maximum values)
T =25°C
j
V (V)
FM
(maximum values)
T =150°C
j
(typical values)
0.0 0.5 1.0 1.5 2.0 2.5 3.0
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STTH8L06
Figure 3: Relative variation of thermal
impedance junction to case versus pulse
duration (TO-220FPAC)
Z/ R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
t (s)
p
δ
=tp/T
T
tp
Figure 5: Peak reverse recovery current versus
/dt (typical values)
dI
F
I (A)
RM
14
V =400V
R
T =125°C
13
j
12
11
10
9
8
7
6
5
4
3
2
1
0
0 20 40 60 80 100 120 140 160 180 200
I =0.25 x I
F F(AV)
I =0.5 x I
F F(AV)
dI /dt(A/µs)
F
I=I
FF(AV)
I =2 x I
F F(AV)
Figure 4: Relative variation of thermal
impedance junction to case versus pulse
2
δ
=tp/T
PAK)
T
tp
/dt
F
duration (TO-220AC, TO-220AC Ins., D
Z/ R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
Single pulse
0.2
0.1
0.0
1.E-03 1.E-02 1.E-01 1.E+00
t (s)
p
Figure 6: Reverse recovery time versus dI
(typical values)
t (ns)
rr
1000
900
800
700
600
500
400
300
200
100
0
0 20 40 60 80 100 120 140 160 180 200
I =2 x I
FF ( A V )
I=I
FF(AV)
I =0.5 x I
FF ( A V )
dI /dt(A/µs)
F
V =400V
R
T =125°C
j
Figure 7: Reverse recovery charges versus dI
(typical values)
Q (nC)
rr
1000
V =400V
R
T =125°C
900
j
800
700
600
500
400
300
200
100
0
0 20 40 60 80 100 120 140 160 180 200
I =2 x I
FF ( A V )
I=I
FF(AV)
I =0.5 x I
FF ( A V )
dI /dt(A/µs)
F
/dt
F
Figure 8: Softness factor versus dIF/dt (typical
values)
S factor
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0 25 50 75 100 125 150 175 200
dI /dt(A/µs)
F
I2 x I
≤
F F(AV)
V =400V
R
T =125°C
j
3/8
STTH8L06
Figure 9: Relative variations of dynamic
parameters versus junction temperature
1.25
1.00
0.75
0.50
0.25
0.00
25 50 75 100 125
Figure 11: Forward recovery time versus dI
I
RM
Q
RR
T (°C)
j
S factor
I2 x I
≤
F F(AV)
V =400V
R
Reference:T =125°C
j
/dt
F
(typical values)
t (ns)
fr
300
250
200
I=I
F F(AV)
V =1.1 x V max.
FR F
T =125°C
j
Figure 10: Transient peak forward voltage
versus dI
V (V)
FP
7
I=I
F F(AV)
T =125°C
6
5
4
3
2
1
0
0 20 40 60 80 100 120 140 160 180 200
/dt
F
j
dI /dt(A/µs)
F
Figure 12: Junction capacitance versus
reverse voltage applied (typical values)
C(pF)
1000
100
F=1MHz
V =30mV
OSC RMS
T =25°C
j
150
100
50
dI /dt(A/µs)
0
0 20 40 60 80 100 120 140 160 180 200
F
Figure 13: Thermal resistance junction to
ambient versus copper surface under tab
(epoxy FR4, e
R (°C/W)
th(j-a)
70
60
50
40
30
20
10
0
0 5 10 15 20 25 30 35 40
=35µm) (D2PAK)
CU
S(Cu)(cm²)
10
V (V)
1
1 10 100 1000
R
4/8
Figure 14: D2PAK Package Mechanical Data
A
L2
E
L
L3
B2
B
G
C2
D
A1
C
M
* FLAT ZONE NO LESSTHAN 2mm
R
A2
*
V2
STTH8L06
DIMENSIONS
REF.
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
M 2.40 3.20 0.094 0.126
R 0.40 typ. 0.016 typ.
V2 0° 8° 0° 8°
Millimeters Inches
Min. Max. Min. Max.
Figure 15: D
(in millimeters)
10.30
2
PAK Foot Print Dimensions
16.90
1.30
8.90
3.70
5.08
5/8
STTH8L06
Figure 16: TO-220FPAC Package Mechanical Data
H
L6
L2
L3
L5
L4
G1
F1
F
G
A
B
Dia
L7
D
E
DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.70 0.017 0.027
F 0.75 1 0.030 0.039
F1 1.15 1.70 0.045 0.067
F2 1.15 1.70 0.045 0.067
G 4.95 5.20 0.195 0.204
G1 2.40 2.70 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 Typ. 0.63 Typ.
L3 28.6 30.6 1.126 1.204
L4 9.8 10.6 0.385 0.417
L6 15.9 16.4 0.626 0.645
L7 9.00 9.30 0.354 0.366
Dia. 3 3.20 0.118 0.126
Figure 17: TO-220AC Insulated Package Mechanical Data
REF.
H2
L5
Ø I
L6
L2
A
C
L7
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
L9
F1
L4
D
H2 10.00 10.40 0.393 0.409
L2 16.40 typ. 0.645 typ.
L4 13.00 14.00 0.511 0.551
F
G
M
E
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam. I 3.75 3.85 0.147 0.151
DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
6/8
Figure 18: TO-220AC Package Mechanical Data
H2
L5
Ø I
L6
L2
L9
F1
L4
F
G
A
C
L7
D
M
E
STTH8L06
DIMENSIONS
REF.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
H2 10.00 10.40 0.393 0.409
L2 16.40 typ. 0.645 typ.
L4 13.00 14.00 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam. I 3.75 3.85 0.147 0.151
Millimeters Inches
Min. Max. Min. Max.
Table 7: Ordering Information
Ordering type Marking Package Weight Base qty Delivery mode
STTH8L06D STTH8L06D TO-220AC 1.90 g 50 Tube
STTH8L06FP STTH8L06FP TO-220FPAC 1.70 g 50 Tube
STTH8L06DI STTH8L06DI TO-220AC Ins. 1.86 g 250 Box
STTH8L06DIRG STTH8L06DI TO-220AC Ins 1.86 g 50 Tube
STTH8L06G STTH8L06G
STTH8L06G-TR STTH8L06G
■ Epoxy meets UL94, V0
■ Cooling method: by conduction (C)
■ Recommended torque value: 0.8 m.N. (TO-220FPAC) / 0.55 m.N. (TO-220AC)
■ Maximum torque value: 1.0 m.N. (TO-220FPAC) / 0.70 m.N. (TO-220AC)
D
D
2
PAK
2
PAK
1.48 g 50 Tube
1.48 g 1000 Tape & reel
Table 8: Revision History
Date Revision Description of Changes
Nov-2002 2A Last issue
18-Oct-2004 3
13-Jun-2005 4
TO-220AC Insulated and D
T
changed from value 175 to range -40 to 175 °C - Page1
j
2
PAK packages added
7/8
STTH8L06
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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