The TEA2025B/D is a monolithic integrated circuit
in 12+2+2 Powerdip and 12+4+4 SO, intended for
use as dual or bridge power audio amplifier portable radio cassette players.
OUT 1BOOT 1GNDGNDFEEDIN 1+GND(Sub)
April 2010
SVR
IN 2+
THERMAL
PROTECT.
START
CIRCUIT
D94AU120
50Ω
-
+
2
+
50Ω
FEEDGNDGNDBOOT 2 OUT 2
10KΩ
DECOUPLING
10KΩ
11
5KΩ
2
50Ω
V
S+
BRIDGE
Rev. 3
1/11
TEA2025
Table 2. Absolute Maximum Ratings
SymbolParameterValueUnit
V
I
O
T
T
stg
Supply Voltage15V
S
Ouput Peak Current1.5A
Junction Temperature150°C
J
Storage Temperature150°C
Figure 3. PIN CONNECTION POWERDIP12+2+2
Figure 4. PIN CONNECTION SO12+4+4
FEEDBACK
Table 3. Thermal Data
SymbolDescription
R
th j-case
R
th j-amb
Note: 1. The R
Thermal Resistance Junction-caseMax1515°C/W
Thermal Resistance Junction-ambientMax6560°C/W
is measured with 4sq cm copper area heatsink
2. The R
th j-amb
is measured on devices bonded on a 10 x 5 x 0.15cm glass-epoxy substrate with a 35µm thick copper surface of 5 cm
Output Power (d = 10%)Stereo 8 (per channel)9V4Ω1.72.3W
9V8Ω1.3W
6V4Ω0.71W
6V8Ω0.6W
6V16Ω0.25W
6V32Ω0.13W
3V4Ω0.1W
3V32Ω0.02W
12V8Ω2.4W
Bridge9V8Ω4.7W
6V4Ω2.8W
6V8Ω1.5W
3V16Ω0.18W
3V32Ω0.06W
dDistortionVs = 9V; R
SVRSupply Voltage Rejectionf = 100Hz, V
E
N(IN)
Input Noise VoltageRG = 01.53mV
= 10 4Ω36mV
R
G
CTCross-Talkf = 1KHz, R
= 4ΩStereo
L
Bridge
= 0.5V, Rg = 04046dB
R
= 10KΩ4052dB
g
0.3
0.5
1.5%
Table 5.
Te r m . N° (PDIP)1 23456 7 8910111213141516
DC VOLT (V)0.044.58.9000.60.048.500.040.6008.94.59
3/11
TEA2025
Figure 5. Bridge Application (Powerdip)
Figure 6. Stereo Application (Powerdip)
Figure 8. Output Voltage vs. Supply Voltage
Figure 9. Output Power vs. Supply Voltage
(THD = 10%, f = 1KHz)
Figure 7. Supply Current vs. Supply Voltage
= 4Ω))
(R
L
4/11
Figure 10. THD versus Output Power (f = 1KHz,
V
= 6V)
S
TEA2025
3APPLICATION INFORMATION
3.1 Input Capacitor
Input capacitor is PNP type allowing source to be referenced to ground.
In this way no input coupling capacitor is required. However, a series capacitor (0.22 µF)to the input side
can be useful in case of noise due to variable resistor contact.
3.2 Bootstrap
The bootstrap connection allows to increase the output swing.
The suggested value for the bootstrap capacitors (100µF) avoids a reduction of the output signal also at
low frequencies and low supply voltages.
3.3 Voltage Gain Adjust
3.3.1 STEREO MODE
The voltage gain is determined by on-chip resistors R1 and R2 together with the external RfC1 series connected between pin 6 (11) and ground. The frequency response is given approximated
V
OUT
--------------
V
IN
---------------------------------------------=
Rf R2
R1
1
-----------------+÷
JWC1
With Rf=0, C1=100 µF, the gain results 46 dB with pole at f=32 Hz.
THE purpose of Rf is to reduce the gain. It is recommended to not reduce it under 36 dB.
3.3.2 BRIDGE MODE
Figure 11.
The bridge configuration is realized very easily thanks to an internal voltage divider which provides (at pin
1) the CH 1 output signal after reduction.
It is enough to connect pin 6 (inverting input of CH 2) with a capacitor to pin 1 and to connect to ground
the pin 7. The total gain of the bridge is given by:
V
OUT
--------------
V
IN
R1
---------------------------------------------
=
Rf R2
⎛⎞
R3
⎜⎟
------- -
1
+
⎜⎟
1
-----------------+÷
JWC1
R4
⎝⎠
R1
-----------------------------------------------
R2 R4
1
-----------------++
JWC1
and with the suggested values (C1 = C2 = 100 µF, Rf= 0) means: Gv = 52 dB with first pole at f = 32 Hz
5/11
TEA2025
Figure 12.
3.4 Output Capacitors.
The low cut off frequency due to output capacitor depending on the load is given by:
with C
470mF and RL = 4 ohm it means FL = 80 Hz.
OUT
F
L
-----------------------------------=
2ΠC
1
⋅
OUTRL
3.5 Pop Noise
Most amplifiers similar to TEA 2025B need external resistors between DC outputs and ground in order to
optimize the pop on/off performance and crossover distortion.
Figure 13.
The TEA 2025B solution allows to save components because of such resistors (800 ohm)are included into
the chip.
3.6 Stability
A good layout is recommended in order to avoid oscillations.
Generally the designer must pay attention on the following points:
– Short wires of components and short connections.
– No ground loops.
– Bypass of supply voltage with capacitors as nearest as possible to the supply I.C.pin. The low val-
ue(poliester)capacitors must have good temperature and frequency characteristics.
– No sockets.
the heatsink can have a smaller factor of safety compared with that of a conventional circuit. There
is no device damage in the case of excessive junction temperature: all that happens is that PO (and
6/11
TEA2025
therefore Ptot) and Id are reduced.
4APPLICATION SUGGESTION
The recommended values of the components are those shown on stereo application circuit of Fig. 6 different values can be used, the following table can help the designer.
Table 6.
COMPONENT
C1,C20.22µFINPUT DC DECOUPLING
C3100µFRIPPLE REJECTONDEGRADATION OF
C4,C5100µFBOOTSTRAP
C6,C7470µFOUTPUT DC
C8,C90.15µFFREQUENCY STABILITYDANGEROF
C10, C11100µFINVERTING INPUT DC
RECOMMENDED
VALUE
PURPOSELARGER THANSMALLER THAN
IN CASE OF SLIDER
CONTACT NOISE OF
VARIABLE RESISTOR
SVR, INCREASE OF AT
LOW FREQUENCY
AND LOW VOLTAGE
INCREASE OF LOW
DECOUPLING
DECOUPLING
FREQUENCY CUTOFF
OSCILLATIONS
INCREASE OFLOW
FREQUENCYCUTOFF
5PACKAGE MECHANICAL DATA
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK
®
is an ST trademark.
®
7/11
TEA2025
Figure 14. SO20 Mechanical Data & Package Dimensions
DIM.
A2.352.650.0930.104
A10.100.300.0040.012
B0.330.510.0130.200
C0.230.320.0090.013
(1)
12.6013.00 0.4960.512
D
E7.407.600.2910.299
e1.270.050
H10.010.65 0.3940.419
h0.250.750.0100.030
L0.401.270.0160.050
k0˚ (min.), 8˚ (max.)
ddd0.100.004
(1) “D” dimension does not include mold flash, protusions or gate
burrs. Mold flash, p rotusions or gate burrs shall not exceed
0.15mm per side.
mminch
MIN.TYP.MAX.MIN.TYP.MAX.
OUTLINE AND
MECHANICAL DATA
SO20
8/11
0016022 D
Figure 15. DIP16 Mechanical Data & Package Dimensions
TEA2025
DIM.
a10.510.020
B0.771.650.0300.065
b0.50.020
b10.250.010
D200.787
E8.50.335
e2.540.100
e317.780.700
F7.10.280
I5.10.201
L3.30.130
Z1.270.050
mminch
MIN.TYP. MAX.MIN.TYP.MAX.
OUTLINE AND
MECHANICAL DATA
DIP16
9/11
TEA2025
6REVISION HISTORY
Table 7. Revision History
DateRevisionDescription of Changes
September 20032Updates not recorded
30-Apr-20103Updated title and added environmental compliance statement for
package
10/11
TEA2025
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