Features
■ Ultrafast recovery
■ Low reverse recovery current
■ Reduces losses in diode and switching
transistor
■ Low thermal resistance
■ Higher frequency operation
■ Insulated TO-220FPAC version
– Insulation voltage = 1500 V rms
– Package capacitance = 12 pF
STTH8S06
Turbo 2 ultrafast high voltage rectifier
K
K
A
K
TO-220AC
STTH8S06D
A
A
K
TO-220FPAC
STTH8S06FP
Description
ST's STTH8S06 is a state of the art ultrafast
recovery diode. By the use of 600 V Pt doping
planar technology, this diode will out-perform the
power factor corrections circuits operating in
hardswitching conditions. The extremely low
reverse recovery current of the STTH8S06,
reduces significantly the switching power losses
of the MOSFET and thus increases the efficiency
of the application. This leads designers to reduce
the size of their heatsinks.
This device is also intended for applications in
power supplies and power conversions systems,
motor drive, and other power switching
applications.
Table 1. Device summary
I
F(AV)
V
RRM
(typ.) 4.4 A
I
RM
(max) 175 °C
T
j
V
(typ) 1.5 V
F
(typ) 12 ns
t
rr
8 A
600 V
December 2007 Rev 1 1/8
www.st.com
8
Characteristics STTH8S06
1 Characteristics
Table 2. Absolute ratings (limiting values)
Symbol Parameter Value Unit
V
RRM
I
F(AV)
I
FSM
T
Table 3. Thermal parameter
Repetitive peak reverse voltage 600 V
Average forward current 8 A
Surge non repetitive forward current tp = 10 ms 60 A
Storage temperature range -65 to + 175 °C
stg
T
Maximum operating junction temperature 175 °C
j
Symbol Parameter Maximum Unit
TO-220AC 3.0
R
th(j-c)
Table 4. Static electrical characteristics
Junction to case
TO220FPAC 5.5
°C/W
Symbol Parameter Test conditions Min. Typ Max. Unit
T
= 25 °C
I
Reverse leakage current
R
j
Tj= 125 °C 25 200
= 600 V
V
R
Tj = 25 °C
V
Forward voltage drop
F
= 125 °C 1.5 1.9
IF = 8 A
T
j
20
3.4
To evaluate the maximum conduction losses use the following equation:
P = 1.20 x I
Table 5. Dynamic electrical characteristics
Symbol Parameter
F(AV)
+ 0.087 I
F2(RMS)
Test conditions
Min. Typ Max. Unit
µA
V
t
Reverse recovery time IF = 1 A, dIF/dt = - 200 A/µs, VR = 30 V 12 18 ns
rr
Reverse current
I
S
S
RM
T
Softness factor 1 -
factor
Reverse recovery charges 17 nC
Q
rr
Reverse current
I
RM
Softness factor 0.3 -
factor
Reverse recovery charges 90 nC
Q
rr
= 25 °C
j
T
= 125 °C
j
I
F
V
I
F
VR = 200 V
2/8
= 8 A, dIF/dt = - 200 A/µs,
= 200 V
R
= 8 A, dIF/dt = - 200 A/µs,
1.6 2.2 A
4.4 6.0 A
STTH8S06 Characteristics
Figure 1. Forward voltage drop versus
forward current
Figure 2. Relative variation of thermal
impedance junction to case versus
pulse duration (TO-220AC)
I (A)
FM
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
012345 67
(maximum values)
T =150°C
j
(typical values)
T =150°C
j
V (V)
FM
T =25°C
j
(maximum values)
Figure 3. Relative variation of thermal
impedance junction to case versus
Z/R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-03 1.E-02 1.E-01 1.E+00
t (s)
p
δ
T
=tp/T
Figure 4. Peak reverse recovery current
versus dI
/dt (typical values)
F
tp
pulse duration(TO-220FPAC)
I (A)
Z/R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
δ=0.5
0.6
0.5
0.4
δ=0.2
0.3
δ=0.1
0.2
0.1
Single pulse
0.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
t (s)
p
δ
=tp/T
T
tp
RM
16
15
V =200V
R
T =125°C
j
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0 200 400 600 800 1000
I =0.5 x I
F F(AV)
dI /dt(A/µs)
F
I=I
F F(AV)
I =2 x I
F F(AV)
3/8
Characteristics STTH8S06
Figure 5. Reverse recovery time versus dIF/dt
(typical values)
t (ns)
rr
70
60
50
40
30
20
10
0
0 200 400 600 800 1000
I =2 x I
F F(AV)
I=I
F F(AV)
dI /dt(A/µs)
F
I =0.5 x I
F F(AV)
V =200V
R
T =125°C
j
Figure 6. Reverse recovery charges versus
dI
/dt (typical values)
F
Q (nC)
rr
240
220
V =200V
R
T =125°C
j
200
180
160
140
120
100
80
60
40
20
0
0 200 400 600 800 1000
dI /dt(A/µs)
F
I =2 x I
F F(AV)
I=I
F F(AV)
I =0.5 x I
F F(AV)
Figure 7. Junction capacitance versus reverse voltage applied (typical values)
C(pF)
100
10
F=1MHz
V =30mV
OSC RMS
T =25°C
j
V (V)
1
1 10 100 1000
R
4/8
STTH8S06 Package information
2 Package information
● Epoxy meets UL94, V0
● Cooling method: by conduction (C)
● Recommended torque value: 0.4 to 0.6 N·m
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK® packages are Lead-free. The category of second level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Table 6. TO-220AC dimensions
Dimensions
L2
F1
Ref.
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
H2
Ø I
L5
A
C
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
L7
F 0.61 0.88 0.024 0.034
L6
F1 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
L9
D
H2 10.00 10.40 0.393 0.409
L2 16.40 typ. 0.645 typ.
L4
F
M
E
G
L4 13.00 14.00 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam.
3.75 3.85 0.147 0.151
I
5/8
Package information STTH8S06
Table 7. TO-220FPAC dimensions
Dimensions
Ref.
Millimeters Inches
Min. Max. Min. Max.
A 4.4 4.6 0.173 0.181
A
H
B
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.70 0.018 0.027
Dia
F 0.75 1 0.030 0.039
L6
L2
L3
L5
F1
L4
D
F1 1.15 1.70 0.045 0.067
L7
G 4.95 5.20 0.195 0.205
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 Typ. 0.63 Typ.
L3 28.6 30.6 1.126 1.205
F
G1
G
E
L4 9.8 10.6 0.386 0.417
L5 2.9 3.6 0.114 0.142
L6 15.9 16.4 0.626 0.646
L7 9.00 9.30 0.354 0.366
Dia. 3.00 3.20 0.118 0.126
6/8
STTH8S06 Ordering information
3 Ordering information
Table 8. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STTH8S06D STTH8S06D TO-220AC 1.9 g 50 Tube
STTH8S06FP STTH8S06FP TO-220FPAC 1.64 g 50 Tube
4 Revision history
Table 9. Document revision history
Date Revision Description of changes
18-Dec-2007 1 First issue.
7/8
STTH8S06
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2007 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
8/8
Loading...